Wafer transferring apparatus and transferring method thereof

A technology for transferring devices and wafers, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., and can solve the problems of long time required for transferring wafers

Inactive Publication Date: 2007-01-24
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in this prior art, since the wafers are taken out from the cassette and moved to the reactor after entering and exiting the positioner, there is a problem that it takes a long time to transfer the wafer due to the time of entering and exiting the positioner.

Method used

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  • Wafer transferring apparatus and transferring method thereof
  • Wafer transferring apparatus and transferring method thereof
  • Wafer transferring apparatus and transferring method thereof

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Embodiment Construction

[0023] Hereinafter, a wafer transfer apparatus as an embodiment of the present invention will be described in detail with reference to the drawings.

[0024] The wafer transfer device 10 provided according to the present invention is as figure 1 As shown, the wafer 21 taken out from the wafer cassette 20 accommodating a plurality of wafers 21 is transferred to the reactor 30 where a predetermined process is performed. The wafer transfer device 10 includes: a wafer transfer unit 40 having an arm 41 for supporting a wafer accommodated in the wafer cassette 20 and transferring it to the reactor 30; The lateral direction of the transfer direction is arranged at intervals of more than three sensors 50; the control unit (not shown), the control unit is based on the arm 41 transfer speed of the arm 41 and the detected position information of the arm 41 detected by the sensor 50. After calculating the target position of the wafer 21 with respect to the arm 41 and calculating the dete...

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Abstract

The present invention relates to a transferring apparatus for transferring wafers from a wafer case which accommodating a plurality of wafers to a reactor of predetermined technics. The apparatus is characterized by: a wafer transferring part with arms for supporting said wafers in a wafer case and transferring them to the reactor; more than three sensors are set with an interval separately in a lateral direction according to the transferring direction at the outlet side of the wafer case; a control part for correcting an object position of a wafer to a detecting position when a object position computed according to the transferring speed of the wafer arm and detection signals detected by said sensors, and controlling said wafer transferring part for transferring wafers to said reactor. As a result, a transferring apparatus and a transferring method which need shorter time are provided.

Description

technical field [0001] The invention relates to a wafer transfer device and a transfer method thereof, in particular to a wafer transfer device and a transfer method thereof which require less time for centering a wafer. Background technique [0002] Wafers are used to produce semiconductor chips through various processes. When a wafer passes through processes such as etching and evaporation, it includes a wafer cassette for accommodating multiple wafers, a reactor for receiving the transferred wafers and performing a predetermined process, and a wafer for transferring the wafers taken out of the wafer cassette to the The transfer drive unit such as a robot to the predetermined position of the reactor. The transfer driving unit generally performs a centering process for the wafer being transferred in order to take out the wafer that is not correctly accommodated at the same position and place it correctly at a predetermined position of the reacto...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67259H01L21/67766
Inventor朴英敏朴鲁正朴休林金东哲南宫同训
OwnerSAMSUNG ELECTRONICS CO LTD