Water-cooled heat dissipation device

Abstract

A water-cooled heat dissipation device comprises a substrate module in contact with a high-heat electronic unit and a water-cooled heat dissipation module. The water-cooling heat dissipation module is used for conducting heat dissipation on the substrate module and the high-heat electronic unit and comprises a pipeline unit, a boss unit arranged on one inner wall face of the pipeline unit and a groove unit. The boss unit is provided with at least one boss which is arranged in the pipeline unit, a seat body of the boss gradually shrinks and extends inwards from the inner wall surface of the pipeline unit, and a convex block of the boss gradually expands and extends from the seat body in the direction far away from the seat body, so that the necking part is defined. Therefore, the liquid flowing into the pipeline unit can be blocked and divided by the convex block with the special shape, the convex block disturbs the fluid in the pipeline unit, the heat convection coefficient is increased, the heat convection efficiency in the pipeline unit is improved, and the necking part can reduce the resistance of the fluid flowing through the convex block.

Description

Technical Field

[0001] The utility model relates to a radiator, in particular to a water-cooled radiator. Background Art

[0002] In recent years, with the rapid development of technology, the demand for heat dissipation of electronic products has continued to increase. It is now common to install water-cooled radiators on electronic components that generate high temperatures during operation (such as high-heat electronic components such as CPUs or GPUs) in electronic devices such as computers and servers. Cold water flows into the water-cooled radiator from the cold water pipe and dissipates the high-temperature electronic components. After the cold water flows through the water-cooled radiator, it is heated up to hot water and flows out of the water-cooled radiator to the heat sink to cool down to cold water. The cold water then flows back to the water-cooled radiator in a continuous circulation manner to perform water-cooled heat dissipation operations.

[0003] The heat dissipation efficiency of a water-cooled radiator depends on the layout of the internal pipes of the water-cooling plate and the efficiency of the heat convection in the pipes. Common water-cooled radiators currently available include, for example, compressed-tube water-cooling plates. The water-cooling tubes in the water-cooling plates are mostly hollow pipes with circular cross-sections. The heat energy absorbed by the surface of the water-cooling plate in contact with the high-temperature electronic chip will be transferred from the outside of the water-cooling tube to the inside of the water-cooling tube through heat conduction, and then heat will be exchanged with the fluid through heat convection inside the tube to achieve the heat dissipation effect. However, this heat dissipation method often affects the heat convection efficiency and causes poor heat dissipation efficiency due to the limited area of ​​the inner wall of the water-cooling tube in contact with the fluid. It is indeed worthy of careful study and discussion by practitioners for improvement. Summary of the invention

[0004] Therefore, the purpose of the present invention is to provide a water-cooled heat dissipation device with good heat dissipation efficiency.

[0005] Therefore, the utility model water-cooled heat dissipation device comprises a substrate module contacting a high-heat electronic unit, a water-cooled heat dissipation module, and a heat sink module connected to the water-cooled heat dissipation module. The water-cooled heat dissipation module is used to dissipate heat from the substrate module and the high-heat electronic unit, and includes a pipeline unit arranged on the substrate module, a boss unit arranged on an inner wall surface of the pipeline unit, and a groove unit arranged on the inner wall surface of the pipeline unit. The groove unit has a plurality of grooves formed on the inner wall surface of the pipeline unit. The boss unit has at least one boss arranged on the inner wall surface of the pipeline unit and extending inward from the inner wall surface. The boss has a seat body arranged on the inner wall surface, and a protrusion extending from the seat body in a direction away from the seat body. The seat body is gradually extended inward from the inner wall surface of the pipeline unit, and the protrusion of the boss is gradually extended from the seat body in a direction away from the seat body. The protrusion cooperates with the seat body to define a necking portion of the boss. The cold water flowing into the pipe unit will flow through the groove unit and the boss unit and make the pipe unit dissipate heat from the substrate module and the high-temperature electronic unit, and the cold water will be heated up into hot water after flowing through the pipe unit and flow out from the pipe unit. The heat sink module includes a heat sink unit connected to the pipe unit of the water-cooled heat sink module. The hot water generated by flowing through the pipe unit will flow into the heat sink unit of the heat sink module to cool down into cold water and then flow into the pipe unit.

[0006] In particular, the protrusion of the boss of the boss unit of the water-cooling heat dissipation module has a first tip close to the center of the pipe unit and a second tip away from the center of the pipe unit. The protrusion gradually extends from the base body from the necking portion toward a direction away from the base body and connects the first tip and the second tip.

[0007] In particular, the projection of the boss of the boss unit further has an arc concave surface connecting the first tip and the second tip.

[0008] In particular, the boss unit has three bosses that are spaced apart on the inner wall surface of the pipeline unit and extend inward from the inner wall surface. The bosses cooperate to define a first space located at the central position inside the pipeline unit, and multiple second spaces, and the second spaces are respectively located between the necking portions of two adjacent bosses.

[0009] Particularly, the first space inside the pipeline unit is larger than each second space.

[0010] In particular, the substrate module includes a main heat source area in contact with the high-temperature electron unit, and a conduction area surrounding the main heat source area. The pipeline unit of the water-cooling heat dissipation module can be distinguished into a water inlet pipe arranged on the substrate module and extending into the main heat source area through the conduction area, a first bent flow guide pipe located in the main heat source area and connected to the water inlet pipe, a second bent flow guide pipe located in the conduction area and connected to the first bent flow guide pipe, and a second bent flow guide pipe arranged on the substrate module and connected to the first bent flow guide pipe. The water outlet pipe is located in the conduction area and connected to the second bent flow guide pipe. The heat sink unit of the heat sink module is connected to the water inlet pipe and the water outlet pipe of the pipeline unit of the water-cooled heat sink module. Cold water flows in from the water inlet pipe of the pipeline unit and flows through the first bent flow guide pipe, the second bent flow guide pipe and the water outlet pipe in sequence, so that the cold water is heated to become hot water, and flows out from the water outlet pipe to the heat sink unit of the heat sink module to be cooled to become cold water and then flows into the water inlet pipe of the pipeline unit.

[0011] In particular, the heat sink module also includes a cold water pipe connecting the heat sink unit and the pipeline unit of the water-cooled heat sink module, and a hot water pipe connecting the heat sink unit and the pipeline unit, the cold water pipe is connected to the water inlet pipe of the pipeline unit, and the hot water pipe is connected to the water outlet pipe of the pipeline unit.

[0012] Particularly, the pipe unit of the water-cooling heat dissipation module is embedded and combined on the base plate module and contacts the high-temperature electron unit.

[0013] Particularly, the pipe unit and the boss unit of the water-cooling heat dissipation module are made of metal.

[0014] Particularly, the high thermal electronic unit is an electronic processing chip.

[0015] Compared with the prior art, the water-cooled heat sink of the utility model defines the necking portion by virtue of the boss of the boss unit being arranged in the pipe unit and the seat of the boss gradually extending inward from the inner wall of the pipe unit and the bump gradually extending from the seat away from the seat, so that the liquid flowing into the pipe unit will be blocked and divided by the bump of the special shape and the bump disturbs the fluid in the pipe unit, thereby increasing the heat convection coefficient and improving the heat convection efficiency in the pipe unit, and the necking portion can reduce the resistance of the fluid flowing through the bump. In addition, the groove of the groove unit is arranged on the inner wall of the pipe unit, so that the inner wall of the pipe unit is increased with the ingenuity of adding the small groove, so as to achieve the purpose of increasing the heat dissipation surface area of ​​the inner wall of the pipe unit, thereby greatly increasing the heat energy taken away from the substrate module and the high-heat electron unit by the water-cooled heat dissipation module, and effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0017] Figure 1 is a side view schematic diagram illustrating an embodiment of the water-cooled heat dissipation device of the utility model;

[0018] Figure 2 is a top view schematically illustrating the connection relationship between a water-cooling heat dissipation module, a base plate module and a heat sink module in this embodiment;

[0019] Figure 3 is a partial cross-sectional schematic diagram illustrating the structural relationship between a pipe unit of the water-cooling heat dissipation module and a boss unit and a groove unit located in the pipe unit in the embodiment; and

[0020] Figure 4 This is a partial cross-sectional diagram to assist in explaining Figure 3 In the embodiment, the plurality of bosses of the boss unit cooperate to divide the internal space of the pipeline unit into a first space A and a plurality of second spaces B. DETAILED DESCRIPTION

[0021] Before the present invention is described in detail, it should be noted that similar elements are represented by the same reference numerals in the following description.

[0022] See also Figure 1 , Figure 2 and Figure 3 The water-cooled heat dissipation device of the present invention comprises a substrate module 1 contacting a high-heat electronic unit 90 , a water-cooled heat dissipation module 2 , and a heat sink module 3 connected to the water-cooled heat dissipation module 2 .

[0023] The water-cooling heat dissipation module 2 is used to dissipate heat from the substrate module 1 and the high-temperature electronic unit 90, and includes a pipe unit 21 disposed on the substrate module 1, a boss unit 22 disposed on the inner wall surface 211 of the pipe unit 21, and a groove unit 23 disposed on the inner wall surface 211 of the pipe unit 21. The groove unit 23 has a plurality of grooves 231 formed on the inner wall surface 211 of the pipe unit 21.

[0024] The boss unit 22 has at least one boss 221 disposed on the inner wall surface 211 of the pipe unit 21 and extending inward from the inner wall surface 211. The boss 221 has a seat 222 disposed on the inner wall surface 211, and a protrusion 223 extending from the seat 222 in a direction away from the seat 222. The seat 222 is gradually extended inward from the inner wall surface 211 of the pipe unit 21, and the protrusion 223 of the boss 221 is gradually extended from the seat 222 in a direction away from the seat 222. The protrusion 223 cooperates with the seat 222 to define a necking portion 227 of the boss 221. Cold water flows into the pipe unit 21 and flows through the groove unit 23 and the boss unit 22 , so that the pipe unit 21 dissipates heat from the substrate module 1 and the high-temperature electron unit 90 . After flowing through the pipe unit 21 , the cold water is heated up to become hot water and flows out of the pipe unit 21 .

[0025] The heat sink module 3 includes a heat sink unit 31 connected to the pipe unit 21 of the water cooling heat sink module 2. Hot water flowing through the pipe unit 21 flows into the heat sink unit 31 of the heat sink module 3 to cool down into cold water and then flows into the pipe unit 21 of the water cooling heat sink module 2.

[0026] When in use, the substrate module 1 is designed to contact the high thermal electron unit 90, so the heat energy generated by the high thermal electron unit 90 is thermally transferred to the substrate module 1 and the water cooling heat dissipation module 2 absorbs the heat energy of the substrate module 1 and the high thermal electron unit 90 to perform water cooling. In detail, the water cooling heat dissipation module 2 is arranged in the pipeline unit 21 through the boss unit 22. Figure 3 As shown in the figure, the seat 222 of the boss 221 gradually extends inward from the inner wall surface 211 of the pipeline unit 21 and the protrusion 223 gradually extends from the seat 222 to the direction away from the seat 222 to define the design of the necking portion 227, and the contact surface between the seat 222 of the boss 221 and the inner wall surface 211 of the pipeline unit 21 is wide and has a large heat flux, and the heat conducted from the pipeline unit 21 to the boss unit 22 is increased, thereby improving the heat conduction efficiency, and through the necking portion 227 of the boss 221 is as follows Figure 3 As shown in FIG. 1 , the central recess of the boss 221 can reduce the fluid resistance of the fluid flowing through the boss 223 in the pipeline unit 21. Figure 3The groove 231 of the groove unit 23 shown is cleverly arranged to increase the inner wall surface 211 of the pipe unit 21 with the small groove 231, thereby increasing the heat dissipation surface area of ​​the inner wall surface 211 of the pipe unit 21, so that the fluid flowing into the pipe unit 21 can effectively take away the heat energy absorbed by the pipe unit 21, greatly improving the heat dissipation efficiency. In particular, in this embodiment, the pipe unit 21 of the water-cooled heat dissipation module 2 is embedded and combined on the substrate module 1 and contacts the high-temperature electron unit 90. In simple terms, the first side 112 of the substrate module 1 that contacts the high-temperature electron unit 90 has an installation groove unit (not shown), and the installation groove unit can be embedded and combined with the pipe unit 21 and the pipe unit 21 can also contact the high-temperature electron unit 90, but it is not limited to this. In other words, the pipe unit 21 of the water-cooling heat dissipation module 2 can not only perform water-cooling heat dissipation on the substrate module 1 from the high-temperature electron unit 90, but also assist in directly performing water-cooling heat dissipation on the high-temperature electron unit 90 through the design that the pipe unit 21 directly contacts the high-temperature electron unit 90, but the present invention is not limited thereto. That is to say, in this embodiment, the substrate module 1 directly contacts the high-temperature electron unit 90 for heat conduction, and the pipe unit 21 also directly contacts the high-temperature electron unit 90, so that the heat energy of the high-temperature electron unit 90 can also be directly heat-conducted to the pipe unit 21 to accelerate heat dissipation, thereby effectively improving the efficiency of heat dissipation of the high-temperature electron unit 90 as a whole.

[0027] The design of the necking portion 227 is defined by the boss 221 of the boss unit 22 being arranged in the pipe unit 21 and the seat 222 of the boss 221 gradually extending inward from the inner wall surface 211 of the pipe unit 21 and the protrusion 223 gradually extending from the seat 222 in a direction away from the seat 222. Therefore, the liquid flowing into the pipe unit 21 will be blocked and divided by the protrusion 223 of the special shape and the protrusion 223 will disturb the fluid in the pipe unit 21, thereby increasing the heat convection coefficient and improving the heat convection efficiency in the pipe unit 21. The necking portion 227 can reduce the resistance of the fluid flowing through the protrusion 223. In conjunction with the ingenious idea that the groove 231 of the groove unit 23 is set on the inner wall surface 211 of the pipe unit 21, the inner wall surface 211 of the pipe unit 21 is increased with the small groove 231, thereby increasing the heat dissipation surface area of ​​the inner wall surface 211 of the pipe unit 21, thereby greatly increasing the heat energy of the substrate module 1 and the high-heat electronic unit 90 taken away by the water-cooled heat dissipation module 2, and effectively improving the heat dissipation efficiency.

[0028] Further, in this embodiment, the protrusion 223 of the boss 221 of the boss unit 22 of the water-cooling heat dissipation module 2 has a first tip 224 close to the center of the pipe unit 21 and a second tip 225 away from the center of the pipe unit 21. The protrusion 223 is gradually extended from the base 222 from the necking portion 227 in the direction away from the base 222 and connects the first tip 224 and the second tip 225. In other words, the first tip 224 of the protrusion 223 of the boss 221 of the boss unit 22 in the pipe unit 21 is located near the center of the pipe unit 21 and the second tip 225 is located away from the center of the pipe unit 21, presenting a Figure 3 As shown in the asymmetric design structure with one high and one low, the fluid in the pipe unit 21 will destroy the boundary layer when flowing through the convex block 223 of the boss 221, causing the fluid to be disturbed, increasing the heat convection coefficient, and improving the heat dissipation efficiency. The convex block 223 of the boss 221 is as shown in Figure 3 As shown, the base 222 gradually extends toward the center of the pipe unit 21 and through the first tip 224 closer to the center of the pipe unit 21, the heat energy absorbed and conducted by the pipe unit 21 can be further transferred to the center of the pipe unit 21 and heat exchange can be achieved with the liquid in the pipe unit 21 near the center and at a lower temperature, but the present invention is not limited thereto. In particular, in this embodiment, the protrusion 223 of the boss 221 of the boss unit 22 also has a circular arc concave surface 226 connecting the first tip 224 and the second tip 225. In simple terms, it is like Figure 3 The first tip 224, the second tip 225 and the arc concave surface 226 of the protrusion 223 of the protrusion 221 of the protrusion unit 22 shown in the figure present an asymmetric design structure and the arc concave surface 226 is designed as a curved surface extension to increase the total surface area of ​​the overall heat dissipation of the protrusion 223, but the present invention is not limited thereto.

[0029] Here, it is particularly noted that, in this embodiment, the boss unit 22 has three bosses 221 which are spaced apart on the inner wall surface 211 of the pipe unit 21 and extend inward from the inner wall surface 211. In simple terms, the inner wall surface 211 of the pipe unit 21 is as follows: Figure 3 The embodiment shown in the figure has three bosses 221, but the present invention is not limited thereto. The embodiment of the pipeline unit 21 having only one boss 221, two bosses 221 or more than four bosses 221 can be designed according to the actual pipe diameter of the pipeline unit 21 or the use requirements. Figure 3 , Figure 4The design structure of the three bosses 221 shown in the figure can make the bosses 221 cooperate with each other to define a first space A located at the center of the pipeline unit 21, and a plurality of second spaces B, wherein the second spaces B are respectively located between the necking portions 227 of the bosses 221 adjacent to each other. Figure 4 As shown, the interior of the pipe unit 21 is divided into a first space A located in the center and a second space B located at the periphery to form a plurality of divided space patterns, and the liquid in the pipe unit 21 is disturbed by the pressure difference formed by the first space A and the second space B, but the present invention is not limited thereto. In particular, in this embodiment, the first space A inside the pipe unit 21 is larger than each second space B, but the present invention is not limited thereto. In other words, since each second space B is Figure 4 As shown, the second space B is smaller than the first space A, so the pressure of the second space B will be greater than the first space A, and the fluid inside the pipe unit 21 will flow from the second space B to the first space A, thereby causing the fluid to rotate. Furthermore, since the second space B is closer to the inner wall surface 211 of the pipe unit 21 and the pipe unit 21 directly contacts and conducts the heat energy from the substrate module 1 and the high-temperature electron unit 90, the temperature of the liquid in the second space B in the pipe unit 21 will be higher than the liquid in the first space A located in the center. Therefore, when the fluid inside the pipe unit 21 generates the fluid rotation behavior of flowing from the second space B to the first space A, the liquid in the second space B located in the periphery (with a higher temperature) will be mixed with the liquid in the first space A located in the middle (with a lower temperature), which can not only increase the heat convection coefficient to enhance the overall heat transfer efficiency of the pipe unit 21, but also further make the overall temperature of the pipe unit 21 evenly distributed. Incidentally, in this embodiment, the pipe unit 21 and the boss unit 22 of the water cooling module 2 are made of metal, which has advantages such as fast heat transfer, but is not limited to this. In this embodiment, the high-temperature electronic unit 90 is an electronic processing chip, but is not limited to this.

[0030] In addition, it is further explained that in this embodiment, the substrate module 1 includes a main heat source area 11 contacting the high thermal electron unit 90, and a conduction area 12 surrounding the main heat source area 11. The pipe unit 21 of the water-cooling heat dissipation module 2 can be divided into a water inlet pipe 212 arranged on the substrate module 1 and extending into the main heat source area 11 through the conduction area 12, a first bent flow guide pipe 213 located in the main heat source area 11 and connected to the water inlet pipe 212 and in contact with the high thermal electron unit 90, a second bent flow guide pipe 214 located in the conduction area 12 and connected to the first bent flow guide pipe 213, and a water outlet pipe 215 arranged on the substrate module 1 and located in the conduction area 12 and connected to the second bent flow guide pipe 214. The heat dissipation unit 31 of the heat dissipation module 3 connects the water inlet pipe 212 and the water outlet pipe 215 of the pipe unit 21 of the water-cooling heat dissipation module 2. Cold water flows in from the water inlet pipe 212 of the pipe unit 21 and sequentially flows through the first curved guide pipe 213, the second curved guide pipe 214 and the water outlet pipe 215, so that the cold water is heated to become hot water, and flows out from the water outlet pipe 215 to the heat sink unit 31 of the heat sink module 3 to be cooled to become cold water and then flows into the water inlet pipe 212 of the pipe unit 21. In detail, since the main heat source area 11 near the center of the substrate module 1 or the pipe unit 21 (for example, the portion of the first bent flow guide pipe 213) disposed in the main heat source area 11 directly contacts the high thermal electron unit 90, the heat energy absorbed by the main heat source area 11 near the center of the substrate module 1 or the pipe unit 21 disposed in the main heat source area 11 will be significantly higher than that of the substrate module 1 or the pipe unit 21 in the conductive area 12 outside the main heat source area 11, that is, the fluid flowing into the pipe unit 21 from the water inlet pipe 212 is used to absorb the heat energy absorbed by the first bent flow guide pipe 213. The heat energy absorbed by the bent flow guide tube 213 in the main heat source area 11 is brought to the periphery of the main heat source area 11, that is, to the second bent flow guide tube 214 connected to the first bent flow guide tube 213 and mainly distributed at the periphery of the main heat source area 11. In other words, in the process of the heat energy absorbed by the fluid flowing through the first bent flow guide tube 213 and the fluid flowing through the second bent flow guide tube 214, part of the heat energy will be first transferred to the substrate module 1 by the second bent flow guide tube 214 to accelerate the heat dissipation. Therefore, the pipe unit 21 of the water-cooled heat dissipation module 2 in this embodiment is as follows Figure 2 The layout shown is arranged on the base module 1 and the water inlet of the water inlet pipe 212 of the pipe unit 21 and the water outlet of the water outlet pipe 215 are as follows Figure 2 As shown, the low-temperature cold water flowing from the water inlet pipe 212 in the pipe unit 21 will directly flow through the first curved guide pipe 213 in the pipe unit 21 located in the main heat source area 11, so that the low-temperature cold water is as follows Figure 2 As shown, the heat exchange operation of the pipe unit 21 located in the main heat source area 11 is first performed to heat the cold water, and the heated water will be as follows Figure 2 As shown, the second curved guide pipe 214 flows to the conduction area 12 located outside the main heat source area 11, and the heated hot water flows out from the outlet pipe 215 to the heat sink unit 31 of the heat sink module 3 for cooling, and the heat sink unit 31 flows the cooled cold water back to the water inlet pipe 212 of the pipe unit 21 to perform water cooling operation in a continuous circulation manner, but not limited to this. In simple terms, the water inlet of the water inlet pipe 212 of the pipe unit 21 of the water cooling heat sink module 2 and the water outlet of the water outlet pipe 215 are as follows Figure 2 As shown, the pipe unit 21 of the water cooling module 2 is located on the same side. Figure 2 The layout mode set on the substrate module 1 as shown in the figure (the low-temperature cold water flowing into the water inlet pipe 212 will directly flow to the substrate module 1 near the center, close to the position of the heat source of the high thermal electron unit 90 and effectively cover the heat source) and the heat distribution of the high thermal electron unit 90 to the substrate module 1 is concentrated on the heat energy of the main heat source area 11 in the center and diffused outward from the center to transfer heat (flowing through the first curved guide pipe 213, the second curved guide pipe 214 and the water outlet pipe 215 in sequence to heat the cold water into hot water and flow out from the water outlet pipe 215, and the hot water heated by the heat source is heated as shown in the figure. Figure 2 As shown, the low-temperature cold water flows around the substrate module 1 to the outlet pipe 215, and the section of the low-temperature cold water in the pipe unit 21 (the first bent guide pipe 213) overlaps with the hotter area (the main heat source area 11) in the substrate module 1, making the overall heat distribution of the substrate module 1 more uniform, maximizing the temperature difference between the substrate module 1 and the high-thermal electron unit 90, so that under the condition of the same area, the rate of heat energy transfer is faster, so that it can transfer more heat. It is worth mentioning that in this embodiment, in addition to utilizing the substrate module 1 to contact the high thermal electron unit 90 and transfer the thermal energy of the high thermal electron unit 90 to the pipe unit 21 for heat dissipation, the thermal energy of the high thermal electron unit 90 absorbed and the thermal energy of the main heat source area 11 in the center of the substrate module 1 can also be transferred to the conduction area 12 (an area with a lower temperature and farther away from the center of the heat source) outside the main heat source area 11 through the pipe unit 21, so that the substrate module 1 as a whole has a more uniform temperature, greatly improving the effective heat dissipation area of ​​the substrate module 1, and achieving the best heat dissipation efficiency.

[0031] Incidentally, in this embodiment, the heat sink module 3 further includes a cold water pipe 32 connecting the heat sink unit 31 and the pipe unit 21 of the water-cooled heat sink module 2, and a hot water pipe 33 connecting the heat sink unit 31 and the pipe unit 21. The cold water pipe 32 is connected to the water inlet pipe 212 of the pipe unit 21, and the hot water pipe 33 is connected to the water outlet pipe 215 of the pipe unit 21, but the present invention is not limited thereto.

[0032] In summary, the water-cooled heat dissipation device of the present invention defines the design of the necking portion 227 by virtue of the boss 221 of the boss unit 22 being arranged in the pipe unit 21 and the seat 222 of the boss 221 gradually extending inward from the inner wall surface 211 of the pipe unit 21 and the protrusion 223 gradually extending from the seat 222 in a direction away from the seat 222. Therefore, the liquid flowing into the pipe unit 21 will be blocked and divided by the protrusion 223 of the special shape and the protrusion 223 will disturb the fluid in the pipe unit 21, thereby increasing the heat convection coefficient and improving the heat convection efficiency in the pipe unit 21, and the necking portion 227 can reduce the resistance of the fluid flowing through the protrusion 223. In conjunction with the ingenious idea that the groove 231 of the groove unit 23 is set on the inner wall surface 211 of the pipe unit 21, the inner wall surface 211 of the pipe unit 21 is increased with the small groove 231, thereby increasing the heat dissipation surface area of ​​the inner wall surface 211 of the pipe unit 21, thereby greatly increasing the heat energy of the substrate module 1 and the high-heat electronic unit 90 taken away by the water-cooled heat dissipation module 2, and effectively improving the heat dissipation efficiency.

[0033] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A water-cooled heat dissipation device, characterized in that: Include: A substrate module contacting a high thermal electronic unit; A water-cooled heat dissipation module for dissipating heat for the substrate module and the high-heat electronic unit, comprising a pipeline unit arranged on the substrate module, a boss unit arranged on an inner wall surface of the pipeline unit, and a groove unit arranged on the inner wall surface of the pipeline unit, the groove unit having a plurality of grooves formed on the inner wall surface of the pipeline unit, the boss unit having at least one boss arranged on the inner wall surface of the pipeline unit and extending inward from the inner wall surface, the boss having a seat arranged on the inner wall surface , and a protrusion extending from the base body in a direction away from the base body, the base body is gradually extended from the inner wall surface of the pipe unit inwardly, the protrusion of the boss is gradually extended from the base body in a direction away from the base body, the protrusion cooperates with the base body to define a necking portion of the boss, cold water flows into the pipe unit and flows through the groove unit and the boss unit, and the pipe unit dissipates heat from the substrate module and the high-temperature electronic unit, and the cold water is heated to become hot water after flowing through the pipe unit and flows out of the pipe unit; and A heat sink module connected to the water-cooled heat dissipation module includes a heat sink unit connected to the pipeline unit of the water-cooled heat dissipation module. Hot water generated by flowing through the pipeline unit will flow into the heat sink unit of the heat sink module to be cooled into cold water and then flow into the pipeline unit.

2. The water-cooled heat sink according to claim 1, characterized in that: The protrusion of the boss of the boss unit of the water-cooling heat dissipation module has a first tip close to the center of the pipe unit and a second tip away from the center of the pipe unit. The protrusion gradually extends from the base body from the necking portion toward a direction away from the base body and connects the first tip and the second tip.

3. The water-cooled heat sink according to claim 2, characterized in that: The convex block of the boss of the boss unit also has an arc concave surface connecting the first tip and the second tip.

4. The water-cooled heat sink according to claim 3, characterized in that: The boss unit has three bosses spaced apart on the inner wall surface of the pipeline unit and extending inward from the inner wall surface. The bosses cooperate to define a first space located at the central position inside the pipeline unit, and multiple second spaces, wherein the second spaces are respectively located between the necking portions of two adjacent bosses.

5. The water-cooled heat sink according to claim 4, characterized in that: The first space inside the pipeline unit is larger than each second space.

6. The water-cooled heat sink according to claim 1, characterized in that: The substrate module includes a main heat source area contacting the high-temperature electron unit, and a conduction area surrounding the main heat source area. The pipeline unit of the water-cooling heat dissipation module can be distinguished into a water inlet pipe arranged on the substrate module and extending into the main heat source area through the conduction area, a first bent flow guide pipe located in the main heat source area and connected to the water inlet pipe, a second bent flow guide pipe located in the conduction area and connected to the first bent flow guide pipe, and a water outlet pipe arranged on the substrate module and located in the conduction area and connected to the second bent flow guide pipe. The heat dissipation unit of the heat dissipation module connects the water inlet pipe and the water outlet pipe of the pipeline unit of the water-cooling heat dissipation module. Cold water flows into the water inlet pipe of the pipeline unit and flows through the first bent flow guide pipe, the second bent flow guide pipe and the water outlet pipe in sequence, so that the cold water is heated to become hot water, and flows out from the water outlet pipe to the heat dissipation unit of the heat dissipation module to cool down to become cold water and then flows into the water inlet pipe of the pipeline unit.

7. The water-cooled heat sink according to claim 6, characterized in that: The heat sink module also includes a cold water pipe connecting the heat sink unit and the pipeline unit of the water-cooled heat sink module, and a hot water pipe connecting the heat sink unit and the pipeline unit. The cold water pipe is connected to the water inlet pipe of the pipeline unit, and the hot water pipe is connected to the water outlet pipe of the pipeline unit.

8. The water-cooled heat sink according to claim 1, characterized in that: The pipeline unit of the water-cooling heat dissipation module is embedded and combined on the base plate module and contacts the high-temperature electron unit.

9. The water-cooled heat sink according to claim 1, characterized in that: The pipeline unit and the boss unit of the water-cooling heat dissipation module are made of metal.

10. The water-cooled heat sink according to claim 3, characterized in that: The high thermal electronic unit is an electronic processing chip.

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