Cooling device and projection ray machine

Abstract

The utility model relates to a cooling device and a projection ray machine, the cooling device comprises a heat conduction piece and a heat dissipation piece in contact with the heat conduction piece, and the heat dissipation piece is provided with an airflow channel. Part of the outer surface of the heat conduction part is in contact with the heat dissipation part and used for being in contact with a heat source so as to conduct heat of the heat source to the heat dissipation part. The heat conduction part is provided with a heat dissipation flow channel, the heat dissipation flow channel penetrates through the heat conduction part, an air inlet and an air outlet which are arranged at intervals are formed in the outer surface of the heat conduction part, the air inlet communicates with the airflow channel, and the air outlet is used for facing a heat source, so that airflow flowing in through the airflow channel enters the heat dissipation flow channel from the air inlet and is blown to the heat source through the air outlet. According to the cooling device, the convective heat transfer coefficient of a heat source and air is increased, and heat dissipation is enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of projection displays, and in particular to a cooling device and a projection optical machine. Background Art

[0002] In the laser projection display system, the key component DMD (digital micro-mirror device) chip is the core component of DLP (Digital Light Processing) projection display technology. It has the characteristics of small size and high heat power density. Its working principle is to use the high-speed flipping of the aluminum micro-mirror array inside the chip to reflect the incident light beam at different angles, which is specifically manifested as the corresponding digital image pixels have different brightness levels to complete the spatial modulation of the light beam. Therefore, in addition to the heat power consumption generated by its own operation, the DMD chip is also loaded with heat generated by the conversion of light energy, and the heat can only be transferred to the radiator through the back of the DMD chip. The high heat power consumption and limited heat dissipation area make the heat dissipation design of the DMD chip more difficult, and the heating problem of the DMD chip needs to be solved urgently. Utility Model Content

[0003] The embodiments of the present application provide a cooling device and a projection optical machine.

[0004] In a first aspect, an embodiment of the present application provides a cooling device, the cooling device comprising a heat conductor and a heat sink in contact with the heat conductor, the heat sink being provided with an air flow channel. Part of the outer surface of the heat conductor contacts the heat sink, and part of the outer surface of the heat conductor is used to contact a heat source to conduct the heat of the heat source to the heat sink. The heat conductor is provided with a heat dissipation channel, the heat dissipation channel runs through the heat conductor, and forms an air inlet and an air outlet spaced apart on the outer surface of the heat conductor, the air inlet is connected to the air flow channel, and the air outlet is used to face the heat source, so that the airflow flowing in through the air flow channel enters the heat dissipation channel from the air inlet, and blows toward the heat source through the air outlet.

[0005] In some optional embodiments, the heat conductive element is connected to one side of the heat dissipation element and protrudes relative to the heat dissipation element, and a side of the heat conductive element facing away from the heat dissipation element is used to contact a heat source.

[0006] In some optional embodiments, the volume of the air flow channel is less than or equal to 1 / 3 of the volume of the heat sink.

[0007] In some optional embodiments, the heat conducting member includes a boss heat conducting portion and a flow channel wall portion, the boss heat conducting portion has a first end and a second end opposite to each other, the first end contacts the heat sink, and the second end is used to contact the heat source, the flow channel wall portion is arranged around the outside of the boss heat conducting portion and is spaced apart from the boss heat conducting portion, and the spacing space between the flow channel wall portion and the boss heat conducting portion forms a heat dissipation flow channel.

[0008] In some optional embodiments, the heat conducting member has an intersecting thickness direction and width direction, the first end and the second end are arranged along the thickness direction, and the airflow direction defined by the heat dissipation channel is set along the thickness direction; the size of the heat dissipation channel along the width direction is less than or equal to 1 / 12 of the size of the boss heat conducting portion along the width direction.

[0009] In some optional embodiments, a spoiler column is provided in the heat dissipation channel, one end of the spoiler column is in contact with the heat dissipation element, and the other end is used to contact the heat source; or, a plurality of partitions are provided in the heat dissipation channel, and the partitions are extended along the airflow direction defined by the heat dissipation channel to divide the heat dissipation channel into a plurality of microchannels.

[0010] In some optional embodiments, the air flow channel forms an inlet and an outlet on the surface of the heat sink, and the outlet is connected to the air inlet to communicate with the heat dissipation channel; the cooling device also includes a fan, which is arranged on one side of the heat sink, and the air outlet side of the fan is opposite to the inlet of the air flow channel.

[0011] In some optional embodiments, the heat sink is a heat conducting plate, and in the direction from the inlet to the outlet, the cross-sectional area of ​​the air flow channel gradually decreases or the diameter of the outlet is smaller than the diameter of the inlet.

[0012] In some optional embodiments, the cooling device further includes a heat sink, the heat sink is in contact with the heat sink, and the heat sink includes at least one of the following structures: heat sink fins, a thermoelectric cooler, a heat pipe, and a liquid cooling plate.

[0013] In some optional embodiments, the heat sink is a heat conducting plate having a heat conducting direction, which is arranged along the thickness direction of the heat conducting plate. The heat sink and the heat conducting element are respectively arranged on both sides of the heat conducting plate. The air flow channel is arranged in the heat conducting plate, and the air flow direction defined by the air flow channel intersects with the heat conducting direction. A spoiler baffle is provided in the air flow channel, and the spoiler baffle is extended along the heat conducting direction.

[0014] In a second aspect, an embodiment of the present application further provides a projection optical engine, comprising any one of the above cooling devices and a display chip. The display chip is in contact with the heat conducting member.

[0015] In some optional embodiments, the projection light engine also includes a socket, the display chip includes a chip body and a plurality of pins, the plurality of pins are arranged in an array on the chip body, the pins are spaced relative to the air outlet, the socket and the display chip are stacked so that the pins are inserted into the socket, and a heat dissipation channel is formed between the pins and the socket, and the heat dissipation channel is connected to the air outlet.

[0016] In some optional embodiments, the projection light engine further includes a circuit board, the socket is arranged between the circuit board and the display chip, a ventilation gap is formed between the socket and the circuit board, and the ventilation gap is connected to the air outlet.

[0017] Compared with the prior art, when the cooling device provided in the embodiment of the present application is used, the heat of the heat source is transferred to the heat sink through the heat conductive member, and the heat sink draws out the heat to achieve the purpose of dissipating heat for the display chip. At the same time, the external airflow flows from the air flow channel into the heat dissipation channel, and then flows to the heat source through the air outlet, thereby increasing the convection heat transfer coefficient between the partial structure of the heat source and the air, and enhancing the heat dissipation. The cooling device not only conducts heat dissipation on the heat source through the heat conductive member and the heat sink, but also conducts convection heat transfer on the heat source through the air flow channel and the heat dissipation channel, thereby achieving efficient heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a partial structural schematic diagram of a projection optical machine provided in one embodiment of the present application.

[0020] Figure 2 yes Figure 1 The projection light machine shown is a schematic cross-sectional structure diagram for embodying a cooling device.

[0021] Figure 3 yes Figure 2 A schematic structural diagram of a heat sink of the cooling device shown.

[0022] Figure 4 yes Figure 2 Schematic diagram of air flow direction of the cooling device shown.

[0023] Figure 5 yes Figure 2 A schematic structural diagram of a heat-conducting component of a cooling device is shown.

[0024] Figure 6 yes Figure 1 Schematic diagram of the exploded structure of part of the projection optical machine shown.

[0025] Figure 7 yes Figure 2 A magnified schematic diagram of area A in the middle.

[0026] Marking instructions: 100, cooling device; 10, heat conduction member; 11, heat dissipation channel; 112, spoiler column; 114, partition; 116, microchannel; 12, air inlet; 13, air outlet; 14, boss heat conduction part; 141, first end; 143, second end; 15, channel wall; 16, drainage part; 161, drainage surface; 30, heat dissipation member; 31, air flow channel; 312, spoiler partition; 32, inlet; 33, outlet; 34, main body; 35, heat conduction plate; 36, conduction part; 50, fan; 70, radiator; 200, projection optical machine; 203, display chip; 2032, chip body; 2034, pin; 204, heat dissipation channel; 205, socket; 2052, slot; 206, ventilation gap; 207, circuit board. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0028] If certain words are used in the specification and claims to refer to specific components, those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use differences in names as a way to distinguish components, but use differences in components' functions as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0029] See also Figure 1 An embodiment of the present application provides a cooling device 100, which is applied to a projection optical machine 200 and is used to dissipate heat from heat sources such as a light source, a display chip, and other structures in the projection optical machine 200.

[0030] The projection light engine 200 is one of the important components of the projection display device. In this embodiment, the projection light engine 200 may include a display chip 203 and the above-mentioned cooling device 100. The cooling device 100 is in contact with the back plate of the display chip 203. When the projection light engine 200 is running, the display chip 203 generates heat, and the cooling device 100 is used to dissipate heat from the display chip 203, thereby improving the operating stability of the projection light engine 200.

[0031] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, or it can be only surface contact. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] See also Figure 2 In this embodiment, the cooling device 100 may include a heat conducting member 10 and a heat sink 30 in contact with the heat conducting member 10. The heat sink 30 is provided with an air flow channel 31. Part of the outer surface of the heat conducting member 10 is used to contact the display chip 203, and part of the outer surface of the heat conducting member 10 contacts the heat sink 30. The heat of the display chip 203 is transported to the heat sink 30 through the heat conducting member 10 for heat dissipation. The heat conducting member 10 is provided with a heat dissipation channel 11, which runs through the heat conducting member 10 and forms an air inlet 12 and an air outlet 13 arranged at intervals on the outer surface of the heat conducting member 10. The air inlet 12 is connected to the air flow channel 31, and the air outlet 13 faces the display chip 203, so that the airflow flowing in through the air flow channel 31 enters the heat dissipation channel 11 from the air inlet 12 and blows toward the display chip 203 through the air outlet 13.

[0033] When the projection optical machine 200 is running, the display chip 203 generates heat, and the heat of the display chip 203 is transferred to the heat sink 30 through the heat conductive member 10, and the heat sink 30 draws out the heat, thereby achieving the purpose of dissipating heat from the display chip 203. At the same time, the external airflow flows from the air flow channel 31 into the heat dissipation channel 11, and then flows to the display chip 203 through the air outlet 13, thereby improving the convection heat transfer coefficient between the partial structure of the display chip 203 and the air, and enhancing the heat dissipation. The cooling device 100 not only conducts heat dissipation on the display chip 203 through the heat conductive member 10 and the heat sink 30, but also conducts convection heat transfer on the display chip 203 through the air flow channel 31 and the heat dissipation channel 11, thereby achieving efficient heat dissipation of the display chip 203.

[0034] Please also see Figure 2 and Figure 3In this embodiment, one side of the heat sink 30 contacts the heat conductor 10, and the airflow channel 31 in the heat sink 30 is connected to the heat dissipation channel 11 in the heat conductor 10. The heat sink 30 is used for heat conduction and heat dissipation on the one hand, and for transmitting airflow to the heat conductor 10 on the other hand. The airflow channel 31 forms an inlet 32 ​​and an outlet 33 on the surface of the heat sink 30, wherein the outlet 33 is arranged on the side of the heat sink 30 in contact with the heat conductor 10, and the outlet 33 is connected to the air inlet 12 to communicate with the heat dissipation channel 11. In this embodiment, the cooling device 100 may further include a fan 50, which is arranged on the side of the heat sink 30 where the inlet 32 ​​is provided, and the air outlet side of the fan 50 is opposite to the inlet 32.

[0035] When in use, the fan 50 blows air from the inlet 32 ​​of the heat sink 30, and the air flows along the air flow channel 31 and enters the heat dissipation channel 11 of the heat conductive member 10 through the outlet 33, and then flows out from the air outlet 13 of the heat dissipation channel 11, blowing toward the partial structure of the display chip 203 opposite to the air outlet 13, thereby improving the convective heat transfer coefficient between the display chip 203 and the air and enhancing the heat dissipation.

[0036] The present specification does not limit the specific structure of the heat sink 30. For example, the heat sink 30 may include at least one of the following structures: a heat conducting plate, an air-cooled heat sink, or a liquid-cooled heat sink. As an example, the heat sink 30 is a heat conducting plate (for example, a plate made of a material with high thermal conductivity such as metal), which can not only achieve the purpose of increasing heat dissipation, but also save the internal space of the projection optical machine 200. If there is spare space in the internal space of the projection optical machine 200, the heat sink 30 can also be designed as an air-cooled or liquid-cooled heat sink to make full use of the space in the projection optical machine 200 and increase the heat dissipation efficiency of the display chip 203. In the present embodiment, the heat sink 30 is designed as a heat conducting plate. The present specification does not limit the specific material of the heat conducting plate. The heat conducting plate can be made of a material with high thermal conductivity. For example, the heat conducting plate can be made of metals such as copper, aluminum, and silver.

[0037] In order to reduce the impact of the installation of the fan 50 on other structures in the projection light machine 200 (such as the heat conducting member 10), the inlet 32 ​​is arranged close to the edge of the heat dissipation member 30. In this embodiment, the inlet 32 ​​is arranged on the side of the heat dissipation member 30 facing the heat conducting member 10 and is spaced from the outlet 33. In the direction from the inlet 32 ​​to the outlet 33, the cross-sectional area of ​​the airflow channel 31 gradually decreases. Figure 3 The airflow channel 31 shrinks from the inlet 32 ​​to the outlet 33, forming a nozzle shape, and the diameter of the outlet 33 is smaller than the diameter of the inlet 32, which increases the airflow rate and improves the heat exchange effect on the one hand, and reduces the influence of the airflow channel 31 on the thermal conductivity of the heat sink 30 on the other hand. In order to ensure that there is a sufficient heat conduction path between the heat sink 30 and the heat conducting element 10, the volume of the airflow channel 31 is less than or equal to 1 / 3 of the volume of the heat sink 30.

[0038] In order to improve the heat conduction efficiency between the heat sink 30 and the heat conductor 10, in this embodiment, the outlet 33 is set as an annular outlet. Specifically in this embodiment, the heat sink 30 may include a body portion 34 and a conduction portion 36 for contacting the heat conductor 10 for heat conduction. The airflow channel 31 is opened in the body portion 34, the conduction portion 36 is connected to the body portion 34, the airflow channel 31 surrounds the conduction portion 36, and the outlet 33 also surrounds the conduction portion 36. The conduction portion 36 contacts the heat conductor 10, and the outlet 33 is connected to the heat dissipation channel 11 of the heat conductor 10.

[0039] In order to further improve the heat conduction efficiency between the conduction part 36 and the heat conductor 10, in some embodiments, a thermal conductive paste may be provided between the conduction part 36 and the heat conductor 10, and the thermal conductive paste is filled between the conduction part 36 and the heat conductor 10. The thermal conductive paste is a thermal interface material, and its main function is to remove air or gaps at the interface to maximize the heat conduction. The thermal conductive paste reduces the thermal resistance between the conduction part 36 and the heat conductor 10, and improves the heat conduction efficiency between the two.

[0040] Please refer again Figure 1 In this embodiment, the cooling device 100 may further include a heat sink 70, which is in contact with the heat sink 30 to cool the heat sink 30. This specification does not limit the specific type of the heat sink 70, and the heat sink 70 may include at least one of the following structures: a heat sink fin, a thermoelectric cooler, a heat pipe, and a liquid cooling plate. As an example, the heat sink 70 includes a heat sink fin, and the heat sink 30 is a heat conducting plate. The heat sink fin may be processed or welded with the heat conducting plate as a whole.

[0041] As another example, the radiator 70 includes a liquid cooling plate, which is attached to the heat sink 30. The liquid cooling plate has a water inlet and a water outlet, and has multiple water channels inside. The water channels are filled with water or cooling medium such as antifreeze, ethanol, etc. The power generated by the pump drives the closed liquid circulation to quickly remove heat. The radiator 70 can also be a temperature absorbing plate that uses a phase change of the cooling medium to absorb heat.

[0042] As another example, the heat sink 70 may also include an air-cooled heat sink, for example, the heat sink 70 may include a mounting bracket and a fan disposed on the mounting bracket, the mounting bracket may be used for heat conduction, the air inlet side and the air outlet side of the fan are opposite to each other, and the air outlet side faces the heat sink 30. The fan accelerates the flow of air, converting natural convection into forced convection, so as to dissipate the heat of the heat sink 30.

[0043] Please refer again Figure 2 and Figure 3In this embodiment, the heat sink 30 is a heat conducting plate 35, and the heat conducting plate 35 has a heat conducting direction, which is arranged along the thickness direction of the heat conducting plate 35. The heat sink 70 and the heat conducting member 10 are respectively arranged on both sides of the heat conducting plate 35. The air flow channel 31 is arranged in the heat conducting plate 35, please refer to Figure 4 , the airflow direction defined by the airflow channel 31 intersects with the heat conduction direction, wherein the airflow direction defined by the airflow channel 31 is roughly the direction from the inlet 32 ​​to the outlet 33, which is roughly the same as the length direction or width direction of the heat conducting plate 35 (the direction in which the plate-shaped plane of the heat conducting plate 35 extends). In this embodiment, a spoiler baffle 312 may be provided in the airflow channel 31, and the spoiler baffle 312 extends along the heat conduction direction. Specifically, the spoiler baffle 312 is connected to the conduction part 36 and is located in the outlet 33. The spoiler baffle 312 increases the connection area between the conduction part 36 and the main body 34, which reduces the volume of the airflow channel 31 on the one hand, increases the heat conduction area between the heat conducting plate 35 and the heat conducting member 10, and increases the convection heat exchange area of ​​the heat conducting plate 35 on the other hand, thereby increasing the total heat dissipation.

[0044] The present specification does not limit the specific number of spoiler baffles 312. For example, the number of spoiler baffles 312 can be multiple, and multiple spoiler baffles 312 are arranged in the outlet 33 along the circumferential direction of the conduction portion 36, dividing the outlet 33 into multiple adjacent small outlets. In other embodiments, multiple spoiler baffles 312 can also be arranged in the air flow channel 31 defined by the body portion 34 (not located in the outlet 33). Multiple spoiler baffles 312 further increase the total heat dissipation of the heat sink 30.

[0045] Please also see Figure 2 and Figure 5 In order to improve the heat dissipation efficiency, the surface area of ​​the heat sink 30 facing the heat conductor 10 is larger than the surface area of ​​the heat conductor 10 facing the heat sink 30. In this embodiment, the heat conductor 10 is connected to one side of the heat sink 30 and protrudes relative to the heat sink 30, and the side of the heat conductor 10 facing away from the heat sink 30 is used to contact the display chip 203. The heat conductor 10 includes a boss heat conducting portion 14 and a flow channel wall portion 15. The boss heat conducting portion 14 is connected between the display chip 203 and the heat sink 30, and is roughly in the shape of a rectangular block. The boss heat conducting portion 14 has a first end 141 and a second end 143 opposite to each other, wherein the first end 141 contacts the heat sink 30, and the second end 143 contacts the display chip 203.

[0046] The flow channel wall portion 15 is disposed around the outside of the boss heat conducting portion 14 and is spaced apart from the boss heat conducting portion 14. The space between the flow channel wall portion 15 and the boss heat conducting portion 14 forms a heat dissipation flow channel 11. The heat dissipation flow channel 11 is disposed outside the boss heat conducting portion 14, which reduces the influence of the heat dissipation flow channel 11 on the heat conduction capacity of the heat conducting member 10. The cooling device 100 mainly dissipates heat by heat conduction and supplemented by convection heat exchange, which work together to achieve efficient heat dissipation of the display chip 203.

[0047] The heat conducting member 10 has a thickness direction Z and a width direction X that intersect each other, the first end 141 and the second end 143 are arranged along the thickness direction Z, and the airflow direction defined by the heat dissipation channel 11 is set along the thickness direction Z. In order to ensure that there is a sufficient heat conduction path between the display chip 203 and the heat conducting member 10, the size of the heat dissipation channel 11 along the width direction X is less than or equal to 1 / 12 of the size of the boss heat conducting part 14 along the width direction X. The size of the heat dissipation channel 11 along the width direction X is mainly determined by the size of the display chip 203, and the size of the heat dissipation channel 11 along the width direction X is greater than or equal to 0.1 mm and less than or equal to 1 mm. In other embodiments, if it does not conflict with other structures in the projection optical machine 200, the volume of the boss heat conducting part 14 can be increased to expand the heat dissipation channel 11 outward.

[0048] In order to increase the heat conduction efficiency, a spoiler column 112 (such as Figure 4 As shown in the figure, one end of the spoiler column 112 contacts the heat sink 30, and the other end contacts the display chip 203. The spoiler column 112 reduces the volume of the heat dissipation channel 11, increases the heat dissipation area of ​​the display chip 203, and thus improves the heat conduction efficiency of the display chip 203. In other embodiments, a plurality of partitions 114 arranged circumferentially along the boss heat conducting portion 14 may also be provided in the heat dissipation channel 11, and the partitions 114 extend along the airflow direction defined by the heat dissipation channel 11 to separate the heat dissipation channel 11 into a plurality of microchannels 116. Similarly, the partitions 114 also achieve the effect of reducing the volume of the heat dissipation channel 11, increasing the heat dissipation area of ​​the display chip 203, and improving the heat conduction efficiency of the display chip 203.

[0049] This specification does not limit the specific material of the heat conductor 10. For example, the material of the heat conductor 10 can be copper, aluminum and other metals and alloys. This specification does not limit the processing method and connection method of the heat conductor 10 and the heat sink 30. As an example, the heat conductor 10 and the heat sink 30 can be processed and formed by 3D printing or machining and welding, and then the two are welded into a whole. 3D printing, also known as additive manufacturing, is a technology based on digital model files, using powdered metal or plastic and other bondable materials to print layer by layer to construct objects.

[0050] Please also see Figure 6and Figure 7 In this embodiment, the display chip 203 may include a chip body 2032 and pins 2034. The chip body 2032 is roughly in the shape of a rectangular plate, and one side of the chip body 2032 is in contact with the first end 141 of the boss heat conducting portion 14. The pins 2034 are connected to the chip body 2032 and protrude relative to the chip body 2032. There are multiple pins 2034, and the multiple pins 2034 are spaced apart from each other and arranged in an array on the chip body 2032. The multiple pins 2034 surround the flow channel wall portion 15 and are spaced apart from the outer wall of the flow channel wall portion 15. The pins 2034 are used as an interface of the display chip 203.

[0051] Please also see Figure 2 and Figure 7 In this embodiment, the second end 143 of the boss heat-conducting portion 14 extends out through the flow channel wall portion 15, and the heat-conducting member 10 may further include a drainage portion 16, which is connected to the second end 143 and surrounds the outside of the boss heat-conducting portion 14. The drainage portion 16 protrudes relative to the peripheral wall of the boss heat-conducting portion 14 to be relatively spaced from the flow channel wall portion 15. A drainage surface 161 is provided on the side of the drainage portion 16 facing the flow channel wall portion 15, and the drainage surface 161 is inclined relative to the end surface of the second end 143. Specifically, one end of the drainage surface 161 away from the flow channel wall portion 15 is spaced from the side wall of the boss heat-conducting portion 14, and one end of the drainage surface 161 close to the flow channel wall portion 15 is connected to the side wall of the boss heat-conducting portion 14, so that the drainage surface 161 presents an outwardly extending inclined shape relative to the center of the boss heat-conducting portion 14, so as to guide the airflow flowing along the thickness direction to flow basically along the width direction. The guide surface 161 and one end of the channel wall 15 close to the second end 143 together form the air outlet 13, which is relatively spaced from the pin 2034. When the airflow of the heat dissipation channel 11 flows to the guide surface 161, the guide surface 161 changes the airflow direction in the heat dissipation channel 11 to make it blow toward the pin 2034.

[0052] Please also see Figure 6 and Figure 7, this specification does not limit the specific structure of the projection light machine 200. In some embodiments, the projection light machine 200 may further include a socket 205 and a circuit board 207. The circuit board 207 may be provided with a clearance opening for installing the cooling device 100, and the circuit board 207 is sleeved outside the flow channel wall 15 and spaced from the outer wall of the flow channel wall 15. The socket 205 is connected between the circuit board 207 and the display chip 203, and the circuit board 207 is connected to the display chip 203 through the socket 205. In this embodiment, the socket 205 is also provided with a clearance opening for accommodating the cooling device 100, and the socket 205 is sleeved outside the flow channel wall 15 and spaced from the outer wall of the flow channel wall 15. The socket 205 can be detachably connected to the circuit board 207 by fasteners such as screws, bolts, and knobs. Specifically in this embodiment, the socket 205 is connected to the circuit board 207 through a knob, and a ventilation gap 206 is formed between the socket 205 and the circuit board 207. The ventilation gap 206 is relatively spaced and connected to the air outlet 13 so that the airflow flowing out of the air outlet 13 can flow between the socket 205 and the circuit board 207.

[0053] The socket 205 is provided with a slot 2052 for plugging and matching with the pin 2034, and the slot 2052 penetrates the socket 205 along the thickness direction of the socket 205. There are multiple slots 2052, and the multiple slots 2052 are spaced apart from each other and arranged in an array on the socket 205. The multiple slots 2052 surround the flow channel wall 15 and are spaced apart from the outer wall of the flow channel wall 15. The multiple slots 2052 are arranged one by one corresponding to the multiple pins 2034, and the socket 205 and the display chip 203 are stacked so that the pins 2034 are inserted into the corresponding slots 2052. The pins 2034 and the inner walls of the corresponding slots 2052 are spaced apart, and the heat dissipation channel 204 is formed between the pins 2034 and the socket 205. The socket 205 and the pins 2034 are spaced apart from each other and are spaced apart from the air outlet 13, and the heat dissipation channel 204 is connected to the air outlet 13.

[0054] When in use, the fan 50 (such as Figure 3 The air flows out from the air flow channel 31 into the heat dissipation channel 11 and is blown out from the air outlet 13 to spread around. There is no close contact between the socket 205 and the circuit board 207, and between the socket 205 and the pin 2034. The cold air enters the gap between the socket 205 and the circuit board 207, and the heat dissipation channel 204 between the socket 205 and the pin 2034, and forced convection heat exchange occurs with the surface of the pin 2034, which effectively enhances the heat dissipation.

[0055] This specification does not limit the specific shape and structure of the above-mentioned heat dissipation channel 11 and air flow channel 31. For example, the air flow channel 31 is not limited to being designed inside the heat sink 30, and through holes, grooves, etc. can also be designed on the surface of the heat sink 30 and the surrounding structural parts to form a smooth air duct, thereby achieving forced convection heat exchange between the cold air and the pins 2034.

[0056] In some embodiments, the cooling device 100 can also be applied to lamps (such as taillights) and optical communication products (such as transmission chips) to dissipate heat from heat sources (light sources, chips) and other structures within the lamps and optical communication products.

[0057] When the projection optical machine 200 provided in the embodiment of the present application is in operation, the display chip 203 generates heat, and the heat of the display chip 203 is conducted to the heat sink 30 through the heat conductive member 10, and the heat sink 30 draws out the heat, thereby achieving the purpose of dissipating the heat of the display chip 203. At the same time, the fan 50 blows air, and the airflow flows from the air flow channel 31 into the heat dissipation channel 11 and blows out from the air outlet 13 to spread around. The cold air enters the gap between the socket 205 and the circuit board 207, and the heat dissipation channel 204 between the socket 205 and the pin 2034, and forced convection heat exchange occurs with the surface of the pin 2034, thereby efficiently enhancing the heat dissipation. The cooling device 100 not only conducts heat dissipation on the display chip 203 through the heat conductive member 10 and the heat sink 30, but also conducts convection heat exchange on the display chip 203 through the air flow channel 31 and the heat dissipation channel 11, thereby achieving efficient heat dissipation of the display chip 203.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that: It comprises a heat conducting member and a heat dissipating member in contact with the heat conducting member, wherein the heat dissipating member is provided with an air flow channel; A portion of the outer surface of the heat conducting member contacts the heat dissipating member, and a portion of the outer surface of the heat conducting member is used to contact a heat source to conduct heat from the heat source to the heat dissipating member; The heat conducting member is provided with a heat dissipation channel, which runs through the heat conducting member and forms an air inlet and an air outlet arranged at intervals on the outer surface of the heat conducting member, the air inlet is communicated with the air flow channel, and the air outlet is used to face the heat source, so that the airflow flowing in through the air flow channel enters the heat dissipation channel from the air inlet and blows toward the heat source through the air outlet.

2. The cooling device according to claim 1, characterized in that The heat conducting member is connected to one side of the heat dissipating member and protrudes relative to the heat dissipating member. The side of the heat conducting member facing away from the heat dissipating member is used for contacting a heat source.

3. The cooling device according to claim 1, characterized in that: The volume of the air flow channel is less than or equal to 1 / 3 of the volume of the heat sink.

4. The cooling device according to claim 1, characterized in that: The heat conducting component includes a boss heat conducting portion and a flow channel wall portion, the boss heat conducting portion has a first end and a second end opposite to each other, the first end is in contact with the heat dissipation component, and the second end is used to contact the heat source, the flow channel wall portion is arranged around the outside of the boss heat conducting portion and is spaced apart from the boss heat conducting portion, and the spacing space between the flow channel wall portion and the boss heat conducting portion forms the heat dissipation flow channel.

5. The cooling device according to claim 4, characterized in that The heat conducting component has an intersecting thickness direction and width direction, the first end and the second end are arranged along the thickness direction, and the airflow direction defined by the heat dissipation channel is set along the thickness direction; the size of the heat dissipation channel along the width direction is less than or equal to 1 / 12 of the size of the boss heat conducting part along the width direction.

6. The cooling device according to claim 1, characterized in that: A spoiler column is provided in the heat dissipation channel, one end of which is in contact with the heat sink and the other end is used to contact the heat source; or, a plurality of partitions are provided in the heat dissipation channel, and the partitions extend along the airflow direction defined by the heat dissipation channel to divide the heat dissipation channel into a plurality of microchannels.

7. The cooling device according to claim 1, characterized in that: The air flow channel forms an inlet and an outlet on the surface of the heat sink, and the outlet is connected to the air inlet to communicate with the heat dissipation channel; the cooling device also includes a fan, which is arranged on one side of the heat sink, and the air outlet side of the fan is opposite to the inlet of the air flow channel.

8. The cooling device according to claim 7, characterized in that The heat sink is a heat conducting plate, and in the direction from the inlet to the outlet, the cross-sectional area of ​​the airflow channel gradually decreases or the caliber of the outlet is smaller than the caliber of the inlet.

9. The cooling device according to any one of claims 1 to 8, characterized in that: The cooling device further includes a radiator, the heat sink is in contact with the radiator, and the radiator includes at least one of the following structures: a heat sink fin, a thermoelectric cooler, a heat pipe, and a liquid cooling plate.

10. The cooling device according to claim 9, characterized in that The heat sink is a heat conducting plate having a heat conducting direction, which is arranged along the thickness direction of the heat conducting plate. The heat sink and the heat conducting member are respectively arranged on both sides of the heat conducting plate. The air flow channel is arranged in the heat conducting plate, and the air flow direction defined by the air flow channel intersects with the heat conducting direction. A spoiler baffle is arranged in the air flow channel, and the spoiler baffle is extended along the heat conducting direction.

11. A projection optical machine, characterized in that: include: A cooling device as claimed in any one of claims 1 to 10; as well as A display chip is in contact with the heat conducting member.

12. The projection optical machine according to claim 11, wherein: The projection light engine also includes a socket, the display chip includes a chip body and a plurality of pins, a plurality of the pins are arrayed on the chip body, the pins are spaced relative to the air outlet, the socket and the display chip are stacked so that the pins are inserted into the socket, and a heat dissipation channel is formed between the pins and the socket, and the heat dissipation channel is connected to the air outlet.

13. The projection optical machine according to claim 12, wherein: The projection optical engine also includes a circuit board, the socket is arranged between the circuit board and the display chip, the socket and the circuit board are spaced apart to form a ventilation gap, and the ventilation gap is communicated with the air outlet.

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