Heat dissipation test system and test station

Abstract

The utility model discloses a heat dissipation test system and a test station, and belongs to the technical field of heat dissipation equipment. The heat dissipation test system is applied to a plurality of to-be-tested devices and comprises a cooling device, the cooling device is connected with a plurality of branches, the branches are arranged in parallel, and cooling media in the branches are used for cooling the to-be-tested devices; wherein at least part of the branches comprise a heat exchanger, the heat exchanger is provided with a first heat exchange channel and a second heat exchange channel, the first heat exchange channel is communicated with the cooling device, the second heat exchange channel is connected with a connector used for being communicated with a cooling loop of the to-be-tested device, and a cooling medium in the first heat exchange channel is used for exchanging heat with cooling liquid in the second heat exchange channel. According to the heat dissipation test system provided by the invention, the energy consumption generated during the test can be reduced, the number of equipment and pipelines for heat dissipation and cooling of a plurality of pieces of equipment to be tested can be reduced, meanwhile, the noise generated in the heat exchange process can be reduced, and the influence on the work of workshops or adjacent office staff can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of heat dissipation equipment, and in particular, relates to a heat dissipation test system and a test station. Background Art

[0002] At present, liquid-cooled power electronic equipment needs to complete relevant performance tests of liquid cooling load during the project development process and before batch delivery. During the test process, an independent cooling system is usually used to perform heat dissipation tests on the power electronic equipment to obtain the flow rate of coolant required for each power electronic equipment during operation. However, this method consumes a lot of energy during testing, and in enterprises with more project requirements or larger shipments, there are a large number of power electronic equipment and corresponding cooling systems, and the cooling system requires a large space, which results in some workshops being unable to provide sufficient space to install or maintain the cooling system, and a large number of cooling systems are prone to chaotic layout, affecting the unified planning and improvement of the workshop environment. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat dissipation test system and a test site to reduce the energy consumption generated during the test, and at the same time reduce the number of equipment and pipelines for heat dissipation and cooling of multiple devices to be tested, reduce the space occupied by the heat dissipation test system, facilitate the installation or maintenance of the heat dissipation test system in the workshop, and improve the regularity of the arrangement of the heat dissipation test system.

[0004] In a first aspect, the present application provides a heat dissipation test system, which is applied to a plurality of devices to be tested, including:

[0005] A cooling device, wherein the cooling device is connected to a plurality of branches, the plurality of branches are arranged in parallel, and the cooling medium in the branches is used to cool the device to be tested;

[0006] Wherein, at least part of the branches include a heat exchanger, the heat exchanger having a first heat exchange channel and a second heat exchange channel, the first heat exchange channel is connected to the cooling device, the second heat exchange channel is connected to a joint for connecting to the cooling circuit of the device to be tested, and the cooling medium in the first heat exchange channel is used to exchange heat with the coolant in the second heat exchange channel.

[0007] According to the heat dissipation test system provided in the embodiment of the present application, by connecting multiple parallel branches on the cooling device, one cooling device can be used to dissipate heat and cool down multiple devices to be tested, so as to reduce the energy consumption generated during the test. At the same time, the number of devices and pipelines for dissipating heat and cooling down the multiple devices to be tested can be reduced, and the space occupied by the heat dissipation test system can be reduced, which is convenient for installing or maintaining the heat dissipation test system in the workshop and improves the regularity of the layout of the heat dissipation test system.

[0008] Through the setting of the above-mentioned heat exchanger, the temperature of the coolant can be lowered in the heat exchanger through heat exchange between the cooling medium and the coolant, without the need to set up a fan, thereby reducing the noise generated during the heat exchange process and reducing the impact on the work of the workshop or nearby office personnel. At the same time, the first heat exchange channel and the second heat exchange channel of the heat exchanger are respectively located in two unconnected loops. Therefore, the cooling medium in the loop where the first heat exchange channel is located can be set to industrial grey water or tap water, thereby reducing the probability of the cooling medium polluting the environment due to leakage of the loop pipeline.

[0009] According to one embodiment of the present application, it also includes:

[0010] a temperature sensor, the temperature sensor being adapted to be disposed between the second heat exchange channel and the joint, and being used to collect the temperature of the coolant flowing out of the second heat exchange channel;

[0011] a first switch valve, the first switch valve being arranged between the second heat exchange channel and the joint;

[0012] A controller is electrically connected to the first switch valve, and the controller is electrically connected to the first switch valve and the temperature sensor, and is used to control the opening of the first switch valve based on the temperature collected by the temperature sensor.

[0013] According to one embodiment of the present application, it also includes:

[0014] A second switch valve is provided in the branch, and the controller is electrically connected to the second switch valve, and is used to control the opening of the second switch valve based on the temperature collected by the temperature sensor.

[0015] According to one embodiment of the present application, it also includes:

[0016] a first flow meter, the first flow meter being arranged in the branch and used for collecting the flow rate of the cooling medium flowing into the first heat exchange channel;

[0017] and / or,

[0018] A second flow meter is provided between the second heat exchange channel and the joint, and is used for monitoring the flow rate of the coolant flowing out of the second heat exchange channel.

[0019] According to one embodiment of the present application, at least part of the branches include:

[0020] The multi-stage heat exchanger, the first heat exchange channel of the first stage heat exchanger is connected to the cooling device, the first heat exchange channel of the next stage heat exchanger is connected to the second heat exchange channel of the previous stage heat exchanger, and the second heat exchange channel of the last stage heat exchanger is connected to the joint.

[0021] According to one embodiment of the present application, it also includes:

[0022] A main line, one end of which is connected to the cooling device, the multiple branches are all connected to the main line, and the branch away from the cooling device is connected to the other end of the main line.

[0023] According to an embodiment of the present application, the main pipeline includes a main inlet pipeline and a main return pipeline, the main inlet pipeline and the main return pipeline are both connected to the branch pipeline, and further includes:

[0024] A bypass pipeline, the bypass pipeline is connected between the main inlet pipeline and the main return pipeline;

[0025] A flow regulating valve, wherein the flow regulating valve is arranged in the bypass pipeline;

[0026] A controller is electrically connected to the flow regulating valve and is used to control the opening of the flow regulating valve based on an input instruction.

[0027] According to one embodiment of the present application, it also includes:

[0028] A drain valve, the drain valve being arranged on the main pipe;

[0029] and / or,

[0030] An exhaust valve is arranged on the main pipeline.

[0031] According to an embodiment of the present application, the liquid discharge valve is arranged at a low point of the main pipeline, and the air exhaust valve is arranged at a high point of the main pipeline.

[0032] In a second aspect, the present application provides a test site, the test site comprising:

[0033] Multiple devices to be tested;

[0034] As described in any of the above heat dissipation testing systems, the heat dissipation testing system is connected to the multiple devices to be tested and is used to dissipate heat for the multiple devices to be tested.

[0035] According to the test site provided in the embodiment of the present application, by adopting the heat dissipation test system of any of the above-mentioned embodiments, the energy consumption generated during the test can be reduced, and at the same time, the number of equipment and pipelines for heat dissipation and cooling of multiple devices to be tested can be reduced, and the space occupied by the heat dissipation test system can be reduced, which is convenient for installing or maintaining the heat dissipation test system in the workshop and improving the regularity of the layout of the heat dissipation test system.

[0036] According to one embodiment of the present application, it also includes:

[0037] A workshop, in the case where the heat dissipation test system includes a heat exchanger, the plurality of devices to be tested and the heat exchanger are installed in the workshop, and the cooling device of the heat dissipation test system is installed outside the workshop.

[0038] According to an embodiment of the present application, when the heat dissipation test system includes a heat exchanger, the heat exchanger is installed inside the device to be tested.

[0039] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0041] Figure 1 This is one of the structural schematic diagrams of the test site provided in the embodiment of the present application;

[0042] Figure 2 is a schematic structural diagram of a heat exchanger provided in an embodiment of the present application;

[0043] Figure 3 This is the second structural diagram of the test site provided in the embodiment of the present application;

[0044] Figure 4 This is the third structural diagram of the test site provided in the embodiment of the present application.

[0045] Reference numerals:

[0046] Cooling device 100, main pipeline 110, main inlet pipeline 111, main return pipeline 112, driving pump 113, third switch valve 114, drain valve 115, exhaust valve 116, bypass pipeline 120, flow regulating valve 121, branch 130, first branch pipeline 131, second branch pipeline 132, second switch valve 133, first flow meter 134;

[0047] Heat exchanger 200, first heat exchange channel 210, second heat exchange channel 220;

[0048] Equipment to be tested 300, cooling circuit 310;

[0049] The enclosure 400 , the second flow meter 510 , the temperature sensor 520 , and the first switch valve 530 . DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0051] Reference below Figure 1-Figure 4 A heat dissipation test system and a test site according to an embodiment of the present application are described.

[0052] The present application embodiment provides a heat dissipation test system, which is applied to multiple devices to be tested 300, such as Figure 1 As shown, the heat dissipation testing system includes a cooling device 100 .

[0053] The device to be tested 300 may be a power electronic device, a high and low temperature cycle box, or other device to be tested 300 that generates heat during operation, such as Figure 1 As shown, the device to be tested 300 provided in the embodiment of the present application is a power electronic device.

[0054] like Figure 1 As shown, the cooling device 100 may be an open water tower, a closed water tower, an air-to-water radiator, a water-to-water radiator, or other types of cooling devices 100, which are not specifically limited herein.

[0055] like Figure 1 As shown, the cooling device 100 is connected to a plurality of branches 130, and the plurality of branches 130 are arranged in parallel. An end of each branch 130 away from the cooling device 100 is provided with a connector for connecting with a cooling circuit 310 of a device to be tested 300. The cooling medium in the branch 130 is used to cool the device to be tested 300. The number of branches 130 may be equal to the number of devices to be tested 300, or may be greater than the number of devices to be tested 300.

[0056] like Figure 1 As shown, the branch 130 may include a first branch pipeline 131 and a second branch pipeline 132. The first branch pipeline 131, the device to be tested 300, the second branch pipeline 132 and the cooling device 100 are connected end to end to form a loop. A driving pump 113 may be provided on the loop to provide power to the cooling medium in the cooling device 100 through the driving pump 113, so as to realize the circulation of the cooling medium in the loop.

[0057] like Figure 1 As shown, each branch 130 corresponds to a device under test 300 , that is, each device under test 300 corresponds to a circuit for circulating cooling medium, and the corresponding circuits of multiple devices under test 300 are connected to one cooling device 100 .

[0058] In the actual implementation process, Figure 1 As shown, when it is necessary to perform a liquid-cooled load test on the device to be tested 300, the device to be tested 300 is started to be in a working state, and the driving pump 113 is started. The driving pump 113 drives the cooling medium in the cooling device 100 to circulate in each loop at the same time. Multiple devices to be tested 300 generate heat during operation. When the cooling medium flows through the corresponding device to be tested 300 in the loop, the cooling medium exchanges heat with the electronic components inside the device to be tested 300, absorbs the heat generated by the device to be tested 300, and the heated cooling medium flows back to the cooling device 100 to cool down, and flows through the device to be tested 300 again to absorb heat, thereby achieving cooling of the device to be tested 300. During the test, whether the flow rate of the cooling medium is appropriate is judged according to the cooling effect of the device to be tested 300, and is appropriately adjusted.

[0059] According to the heat dissipation test system provided in the embodiment of the present application, by connecting multiple parallel branches 130 to the cooling device 100, one cooling device 100 can be used to dissipate heat and cool down multiple devices to be tested 300, so as to reduce the energy consumption generated during the test. At the same time, the number of devices and pipelines for dissipating heat and cooling the multiple devices to be tested 300 can be reduced, the space occupied by the heat dissipation test system can be reduced, the installation or maintenance of the heat dissipation test system in the workshop can be facilitated, and the regularity of the layout of the heat dissipation test system can be improved.

[0060] In some embodiments, Figure 1 and Figure 2 As shown, at least part of the branch 130 includes a heat exchanger 200, which has a first heat exchange channel 210 and a second heat exchange channel 220. The first heat exchange channel 210 is connected to the cooling device 100, and the second heat exchange channel 220 is connected to a joint. The cooling medium in the first heat exchange channel 210 is used to exchange heat with the coolant in the second heat exchange channel 220.

[0061] The heat exchanger 200 may be a plate heat exchanger, a tube heat exchanger or other types of heat exchangers, such as Figure 1 and Figure 2 As shown, the heat exchanger 200 is a plate heat exchanger.

[0062] like Figure 1 and Figure 2 As shown, each branch 130 includes a heat exchanger 200 .

[0063] like Figure 1 and Figure 2As shown, the first heat exchange channel 210 of the heat exchanger 200 is connected with the cooling device 100, the first branch pipe 131 and the second branch pipe 132 to form a loop, and the cooling medium in the cooling device 100 can circulate in the loop; the second heat exchange channel 220 of the heat exchanger 200 is connected with the cooling circuit 310 of the corresponding device to be tested 300 through a joint, that is, the second heat exchange channel 220 can be used as a part of the cooling circuit 310 of the corresponding device to be tested 300, and the coolant of the device to be tested 300 can circulate in the cooling circuit 310.

[0064] In the actual implementation process, Figure 1 and Figure 2 As shown, when it is necessary to perform a liquid-cooled load test on the device to be tested 300, the device to be tested 300 is started to be in a working state, and the driving pump 113 is started. The driving pump 113 drives the cooling medium in the cooling device 100 to circulate in the loop formed by the cooling device 100, the first branch pipeline 131, the second branch pipeline 132 and the first heat exchange channel 210. At the same time, the coolant of the device to be tested 300 circulates in the cooling loop 310. The device to be tested 300 generates heat during operation. The coolant absorbs the heat generated by the device to be tested 300 in the cooling loop 310 and flows into the heat exchanger 200. When the cooling medium and the coolant flow through the heat exchanger 200, the low-temperature cooling medium exchanges heat with the high-temperature coolant to cool the coolant. Therefore, when the coolant flows through the device to be tested 300 again, it can absorb the heat generated by the device to be tested 300 again, thereby achieving cooling of the device to be tested 300.

[0065] In the related art, the heat dissipation test system usually uses a fan to cool the coolant after absorbing the heat of the device to be tested 300. This method is prone to generate a lot of noise, thereby affecting the work of the workshop or nearby office staff, and it is difficult to meet the relevant safety environment requirements.

[0066] Therefore, through the setting of the above-mentioned heat exchanger 200, the temperature of the coolant can be lowered in the heat exchanger 200 through heat exchange between the cooling medium and the coolant, without the need to set up a fan, thereby reducing the noise generated during the heat exchange process and reducing the impact on the work of the workshop or nearby office personnel. At the same time, the first heat exchange channel 210 and the second heat exchange channel 220 of the heat exchanger 200 are respectively located in two unconnected loops. Therefore, the cooling medium in the loop where the first heat exchange channel 210 is located can be set to industrial grey water or tap water, thereby reducing the probability of the cooling medium polluting the environment due to leakage of the loop pipeline.

[0067] In some embodiments, Figure 1 As shown, the heat dissipation test system further includes a temperature sensor 520, a first switch valve 530 and a controller.

[0068] Among them, Figure 1 As shown, the temperature sensor 520 is arranged between the second heat exchange channel 220 and the joint, and is used to collect the temperature of the coolant flowing out of the second heat exchange channel 220. The temperature sensor 520 is arranged on the pipeline connecting the second heat exchange channel 220 and the cooling circuit 310, and is located on the outlet side of the second heat exchange channel 220. A joint is provided at one end of the pipeline connected to the cooling circuit 310.

[0069] The temperature sensor 520 collects the temperature of the coolant flowing out of the second heat exchange channel 220. If the temperature collected by the temperature sensor 520 is greater than the target temperature, it means that the flow rate of the cooling medium in the circuit currently connected to the first heat exchange channel 210 is difficult to cool the coolant to the target temperature; if the temperature collected by the temperature sensor 520 is lower than the target temperature, it means that the flow rate of the cooling medium in the circuit currently connected to the first heat exchange channel 210 is sufficient to cool the coolant to the target temperature.

[0070] like Figure 1 As shown, the first switch valve 530 is disposed between the second heat exchange channel 220 and the joint, and the first switch valve 530 is also disposed on the pipeline for connecting the second heat exchange channel 220 and the cooling circuit 310 .

[0071] The controller is electrically connected to the first switch valve 530 , and is electrically connected to both the first switch valve 530 and the temperature sensor 520 , and is used to control the opening of the first switch valve 530 based on the temperature collected by the temperature sensor 520 .

[0072] In the actual implementation process, Figure 1 As shown, when the temperature sensor 520 detects that the temperature of the coolant flowing out of the second heat exchange channel 220 is greater than the target temperature, a signal is sent to the controller, and the controller controls the opening of the first switch valve 530 to increase, thereby increasing the flow rate of the coolant flowing in the cooling circuit 310, and using more coolant to absorb the heat generated by the equipment to be tested 300, so that the overall temperature of the coolant after absorbing the heat is reduced, so that the temperature of the coolant can be reduced to the target temperature when the coolant exchanges heat with the cooling medium of the same flow rate.

[0073] like Figure 1 As shown, when the temperature sensor 520 detects that the temperature of the coolant flowing out of the second heat exchange channel 220 is lower than the target temperature, a signal is sent to the controller, and the controller controls the opening of the first switch valve 530 to remain unchanged or decrease.

[0074] In other embodiments, the heat dissipation test system may further include a display, and the temperature sensor 520 is electrically connected to the display. The temperature sensor 520 sends the collected temperature information to the display, and the display displays the temperature to the staff. The staff determines whether it is necessary to adjust the opening of the first switch valve 530 based on the temperature. If necessary, the staff can manually input instructions to the controller, and the controller controls the first switch valve 530 according to the input instructions.

[0075] By configuring the temperature sensor 520, the first switch valve 530 and the controller, the opening of the first switch valve 530 can be controlled according to the heat dissipation effect of the coolant on the device to be tested 300, so that there is enough coolant in the cooling circuit 310 to absorb the heat of the device to be tested 300, thereby improving the heat dissipation effect of the coolant on the device to be tested 300 and reducing the overall temperature of the coolant after absorbing heat.

[0076] In some embodiments, Figure 1 As shown, the heat dissipation test system also includes a second switch valve 133, which is arranged in the branch 130. The controller is electrically connected to the second switch valve 133 and is used to control the opening of the second switch valve 133 based on the temperature collected by the temperature sensor 520.

[0077] Among them, Figure 1 As shown, one second switch valve 133 can be set on each branch 130, or multiple second switch valves 133 can be set. For example, two second switch valves 133 are set on each branch 130, and the two second switch valves 133 are respectively set on the same first branch pipeline 131 and the second branch pipeline 132.

[0078] In the actual implementation process, Figure 1 As shown, before the test starts, the initial opening of the second switch valve 133 can be set according to the power size of each device 300 to be tested. After the test starts, the temperature sensor 520 collects the temperature of the coolant flowing out of the second heat exchange channel 220 in real time.

[0079] like Figure 1 As shown, when the temperature sensor 520 detects that the temperature of the coolant flowing out of the second heat exchange channel 220 is greater than the target temperature, a signal is sent to the controller, and the controller controls the opening of the second switch valve 133 to increase, thereby increasing the flow rate of the cooling medium flowing through the first heat exchange channel 210, and improving the ability of the cooling medium to absorb the heat of the coolant, so that the coolant can be cooled to the target temperature after heat exchange.

[0080] like Figure 1As shown, when the temperature sensor 520 detects that the temperature of the coolant flowing out of the second heat exchange channel 220 is lower than the target temperature, a signal is sent to the controller, and the controller controls the opening of the second switch valve 133 to remain unchanged or decrease.

[0081] In other embodiments, the opening degree of the first switch valve 530 can also be controlled by manual input of instructions by a staff member, and the controller is controlled according to the instructions.

[0082] By setting the above-mentioned second switch valve 133, the flow rate of the cooling medium can be adjusted according to the actual heat dissipation situation of the device to be tested 300, so as to further improve the heat dissipation efficiency of the device to be tested 300. At the same time, the first switch valve 530 and the second switch valve 133 can be used to cooperate to control the flow rate of the cooling medium entering different devices to be tested 300, so as to realize quantitative flow input of the device to be tested 300.

[0083] By arranging the second switch valve 133 on both the first branch pipe 131 and the second branch pipe 132, the flow rate of the cooling medium can be easily adjusted. At the same time, when the cooling device 100 needs to be maintained, the second switch valve 133 can be closed. At this time, the first branch pipe 131 and the second branch pipe 132 are both disconnected to facilitate the maintenance of the cooling device 100 and reduce the injection time of the cooling medium after the cooling device 100 is installed.

[0084] In some embodiments, Figure 1 As shown, the heat dissipation test system also includes a first flow meter 134 and a second flow meter 510. The first flow meter 134 is arranged in the branch 130, and is used to collect the flow rate of the cooling medium flowing into the first heat exchange channel 210; the second flow meter 510 is arranged between the second heat exchange channel 220 and the joint, and is used to collect the flow rate of the coolant flowing out of the second heat exchange channel 220.

[0085] Among them, Figure 1 As shown, the first flow meter 134 is arranged on the first branch pipe 131, and is used to collect the flow rate of the cooling medium flowing into the first heat exchange channel 210; the second flow meter 510 is arranged on the pipeline connecting the second heat exchange channel 220 and the cooling circuit 310, and is located on the outlet side of the second heat exchange channel 220, and is used to collect the flow rate of the cooling liquid flowing out of the second heat exchange channel 220.

[0086] like Figure 1 As shown, the cooling medium flow information and the coolant flow information collected by the first flow meter 134 and the second flow meter 510 can be sent to the display screen for the staff to record, or can be directly sent to a computer or other device for data storage.

[0087] By setting the first flow meter 134 and the second flow meter 510, the staff can know the specific values ​​of the cooling medium and the coolant flow rate, so as to set the amount of cooling medium and coolant required by the tested equipment 300 in actual application.

[0088] In some embodiments, Figure 3 As shown, at least part of the branch 130 includes a multi-stage heat exchanger 200, the first heat exchange channel 210 of the first-stage heat exchanger 200 is connected to the cooling device 100, the first heat exchange channel 210 of the second-stage heat exchanger 200 is connected to the second heat exchange channel 220 of the previous-stage heat exchanger 200, and the second heat exchange channel 220 of the last-stage heat exchanger 200 is connected to the joint.

[0089] Among them, Figure 3 As shown, the branch 130 may include a two-stage heat exchanger 200, the first heat exchange channel 210 of the first-stage heat exchanger 200 is connected to the first branch pipeline 131 and the second branch pipeline 132, and is connected to the cooling device 100 through the first branch pipeline 131 and the second branch pipeline 132, the first heat exchange channel 210 of the second-stage heat exchanger 200 is connected to the second heat exchange channel 220 of the first-stage heat exchanger 200, the second heat exchange channel 220 of the second-stage heat exchanger 200 is connected to the joint, and is connected to the cooling circuit 310 of the device to be tested 300 through the joint.

[0090] By setting the above-mentioned multi-stage heat exchanger 200, the distance between the cooling device 100 and the device to be tested 300 can be increased. The more heat exchangers 200 there are, the farther the distance between the cooling device 100 and the device to be tested 300 is. At this time, the cooling device 100 can be placed on a platform away from the workshop, a basement, or a high-rise water supply platform in the workshop, so as to further reduce the impact of the noise generated by the heat dissipation test system on the staff.

[0091] In some embodiments, Figure 1 As shown, the heat dissipation test system also includes a main line 110, one end of which is connected to the cooling device 100, and multiple branches 130 are all connected to the main line 110, and the branches 130 away from the cooling device 100 are connected to the other end of the main line 110.

[0092] Among them, Figure 1 As shown, one end of the main line 110 is connected to the cooling device 100, and the other end of the main line 110 is extended along the arrangement direction of the multiple devices 300 to be tested, and multiple branches 130 are vertically connected to the main line 110, and the branch 130 farthest from the cooling device 100 is connected to the other end of the main line 110.

[0093] By setting the above-mentioned main line 110, the neatness of the pipeline arrangement of the heat dissipation test system can be improved. When the number of devices 300 to be tested needs to be increased or decreased, the length of the main line 110 can be increased or decreased along the arrangement direction of the multiple devices 300 to be tested to connect or disconnect the devices 300 to be tested and the cooling device 100. The operation is convenient and the length and number of pipelines can be reduced.

[0094] In some embodiments, Figure 1 As shown, the main pipeline 110 includes a main inlet pipeline 111 and a main return pipeline 112, both of which are connected to the branch 130, and the heat dissipation test system also includes a bypass pipeline 120, a flow regulating valve 121 and a controller.

[0095] Among them, Figure 1 As shown, the main return pipeline 112 and the main inlet pipeline 111 are both extended along the arrangement direction of the multiple devices 300 to be tested, and the main inlet pipeline 111 and the main return pipeline 112 are arranged in series through the cooling device 100, the first branch pipeline 131 is connected to the main inlet pipeline 111, and the second branch pipeline 132 is connected to the main return pipeline 112, thereby forming multiple parallel loops.

[0096] like Figure 1 As shown, the bypass pipeline 120 is connected between the main inlet pipeline 111 and the main return pipeline 112 , that is, both ends of the bypass pipeline 120 are connected to the main inlet pipeline 111 and the main return pipeline 112 respectively.

[0097] like Figure 1 As shown, the flow regulating valve 121 is disposed on the bypass pipeline 120 for regulating the flow of the cooling medium flowing through the bypass pipeline 120 , and the controller is electrically connected to the flow regulating valve 121 for controlling the opening of the flow regulating valve 121 based on an input instruction.

[0098] In the actual implementation process, Figure 1 As shown, before the test starts, the staff can adjust the approximate opening of the flow regulating valve 121 according to the total power of the multiple devices to be tested 300. After the drive pump 113 is started, the cooling medium in the cooling device 100 flows into the main inlet pipeline 111, and under the action of the flow regulating valve 121, part of the cooling medium flows to the main return pipeline 112 through the bypass pipeline 120, and flows back to the cooling device 100 through the main return pipeline 112. At this time, the coolant flow rate remaining in the main inlet pipeline 111 is a preliminary estimate of the total flow rate of the cooling medium required by the multiple devices to be tested 300, and then the second switch valve 133 is used to accurately adjust the cooling medium flow rate flowing into each branch 130.

[0099] By setting the flow regulating valve 121, the flow of the cooling medium in the main inlet pipeline 111 can be preliminarily adjusted to reduce the waste of the cooling medium and improve the heat dissipation efficiency of the cooling device 100 for the cooling medium.

[0100] In some embodiments, Figure 1 As shown, the heat dissipation test system further includes a third switch valve 114 , and the third switch valve 114 is disposed in the main line 110 .

[0101] Among them, Figure 1 As shown, there are two third switch valves 114 , which are respectively arranged on the main inlet pipeline 111 and the main return pipeline 112 , and the third switch valve 114 is located between the cooling device 100 and the branch 130 closest to the cooling device 100 .

[0102] In the actual implementation process, Figure 1 As shown, when the cooling device 100 needs to be maintained, the third switch valve 114 can be closed. At this time, the cooling device 100 and the main line 110 are disconnected, and the staff can perform maintenance on the cooling device 100 separately; when the maintenance of the cooling device 100 is completed, the third switch valve 114 is opened to restore the connection between the cooling device 100 and the main line 110.

[0103] By disposing the third switch valve 114, it is possible to facilitate the independent maintenance of the cooling device 100 and reduce the impact on other devices during the maintenance of the cooling device 100.

[0104] In some embodiments, Figure 1 As shown, the heat dissipation test system further includes a drain valve 115 , which is disposed on the main pipeline 110 ; and an exhaust valve 116 , which is disposed on the main pipeline 110 .

[0105] Among them, Figure 1 As shown, there may be one or more drain valves 115, for example, there are two drain valves 115, and the two drain valves 115 are respectively arranged on the main inlet pipeline 111 and the main return pipeline 112; there may be one or more exhaust valves 116, for example, there is one exhaust valve 116, and the exhaust valve 116 is arranged on the main return pipeline 112.

[0106] In the actual implementation process, Figure 1As shown, when the main line 110 and the cooling device 100 need to be adjusted or maintained, the second switch valve 133 is closed. At this time, the branch 130 is disconnected from the heat exchanger 200. The staff can open the drain valve 115 to discharge the cooling medium in the main line 110 and part of the branch 130 to facilitate maintenance or adjustment of the main line 110 or the cooling device 100. After the maintenance is completed, the drain valve 115 is closed and the cooling medium is injected into the main line 110 and part of the branch 130.

[0107] like Figure 1 As shown, when the cooling medium is injected into the main line 110 and the branch line 130, the exhaust valve 116 is opened so that the air originally in the pipeline can be discharged to the external environment under the action of the cooling medium; when the cooling medium injection is completed, the exhaust valve 116 can be closed.

[0108] By setting the drain valve 115, it is convenient to maintain or adjust the main line 110 or the cooling device 100, thereby reducing the impact on other devices; by setting the exhaust valve 116, the probability of the cooling medium being difficult to inject into the pipeline due to the inability to discharge the air in the pipeline can be reduced, thereby improving the efficiency of injecting the cooling medium.

[0109] In some embodiments, the drain valve 115 is disposed at a low point of the main line 110 , and the exhaust valve 116 is disposed at a high point of the main line.

[0110] The drain valve 115 is disposed at the low point of the main inlet pipeline 111 and the main return pipeline 112 , and the exhaust valve 116 is disposed at the high point of the main return pipeline 112 .

[0111] Since the cooling medium is liquid and heavy, the drain valve 115 is set at the low point of the main inlet pipeline 111 and the main return pipeline 112, which can facilitate the discharge of the cooling medium and reduce the amount of cooling medium remaining in the pipeline; at the same time, the weight of air is light, and the exhaust valve 116 is set at the high point of the main return pipeline 112, which can facilitate the discharge of air, reduce the resistance encountered when injecting the cooling medium, and improve the injection efficiency.

[0112] The present application also provides a test station, such as Figure 1 As shown, the system includes a heat dissipation test system as in any of the above embodiments and a plurality of devices to be tested 300 . The heat dissipation test system is connected to the plurality of devices to be tested 300 and is used to dissipate heat for the plurality of devices to be tested 300 .

[0113] According to the test site provided by the embodiment of the present application, by adopting the heat dissipation test system of any of the above-mentioned embodiments, the energy consumption generated during the test can be reduced. At the same time, the number of equipment and pipelines for heat dissipation and cooling of multiple devices 300 to be tested can be reduced, and the space occupied by the heat dissipation test system can be reduced, which is convenient for installing or maintaining the heat dissipation test system in the workshop and improving the regularity of the layout of the heat dissipation test system.

[0114] In some embodiments, Figure 1 As shown, the test site also includes a workshop. When the heat dissipation test system includes a heat exchanger 200, multiple devices to be tested 300 and multiple heat exchangers 200 of the heat dissipation test system are installed in the workshop, and the cooling device 100 of the heat dissipation test system is installed outside the workshop.

[0115] Among them, Figure 1 As shown, the workshop is provided with a wall 400 to surround the workshop site. At this time, the cooling equipment 100, the main inlet pipeline 111 and the main return pipeline 112 are arranged outside the workshop wall 400, the heat exchanger 200 and the equipment to be tested 300 are arranged inside the workshop wall 400, and the heat exchanger 200 and the main pipeline 110 are connected through a branch 130 passing through the wall 400.

[0116] By arranging the cooling equipment 100, the main inlet pipeline 111 and the main return pipeline 112 outside the workshop wall 400, the floor space outside the workshop can be reduced and the pipe laying is convenient; by arranging the heat exchanger 200 and the equipment to be tested 300 inside the workshop wall 400, the distance between the heat exchanger 200 and the equipment to be tested 300 can be shortened, thereby improving the heat exchange efficiency, and reducing the impact of climate change on the heat exchanger 200, thereby extending the service life of the heat exchanger 200.

[0117] In some embodiments, Figure 4 As shown, when the heat dissipation test system includes the heat exchanger 200 , the heat exchanger 200 is installed inside the device to be tested 300 .

[0118] Among them, Figure 4 As shown, the heat exchanger 200 can be integrated inside the device to be tested 300, and one end of the branch 130 can be directly connected to the inside of the device to be tested 300; in other embodiments, the heat exchanger 200 can also be integrated inside the device to be tested 300.

[0119] By installing the heat exchanger 200 inside the device to be tested 300 , the space occupied by the entire heat dissipation test system can be further reduced.

[0120] In other embodiments, the heat exchanger 200 may also be installed outside the device to be tested 300 .

[0121] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0122] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0123] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0124] In the description of the present application, “plurality” means two or more.

[0125] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0126] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0127] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0128] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation test system, applied to multiple devices to be tested, characterized in that: include: A cooling device, wherein the cooling device is connected to a plurality of branches, the plurality of branches are arranged in parallel, and the cooling medium in the branches is used to cool the device to be tested; Wherein, at least part of the branches include a heat exchanger, the heat exchanger having a first heat exchange channel and a second heat exchange channel, the first heat exchange channel is connected to the cooling device, the second heat exchange channel is connected to a joint for connecting to the cooling circuit of the device to be tested, and the cooling medium in the first heat exchange channel is used to exchange heat with the coolant in the second heat exchange channel.

2. The heat dissipation test system according to claim 1, characterized in that: Also includes: a temperature sensor, the temperature sensor being disposed between the second heat exchange channel and the joint and being used to collect the temperature of the coolant flowing out of the second heat exchange channel; a first switch valve, the first switch valve being arranged between the second heat exchange channel and the joint; A controller is electrically connected to the first switch valve, and the controller is electrically connected to the first switch valve and the temperature sensor, and is used to control the opening of the first switch valve based on the temperature collected by the temperature sensor.

3. The heat dissipation test system according to claim 2, characterized in that: Also includes: A second switch valve is provided in the branch, and the controller is electrically connected to the second switch valve, and is used to control the opening of the second switch valve based on the temperature collected by the temperature sensor.

4. The heat dissipation test system according to any one of claims 1 to 3, characterized in that: Also includes: a first flow meter, the first flow meter being arranged in the branch and used for collecting the flow rate of the cooling medium flowing into the first heat exchange channel; and / or, A second flow meter is provided between the second heat exchange channel and the joint, and is used for collecting the flow rate of the coolant flowing out of the second heat exchange channel.

5. The heat dissipation test system according to any one of claims 1 to 3, characterized in that: At least some of the branches include: The multi-stage heat exchanger, the first heat exchange channel of the first stage heat exchanger is connected to the cooling device, the first heat exchange channel of the next stage heat exchanger is connected to the second heat exchange channel of the previous stage heat exchanger, and the second heat exchange channel of the last stage heat exchanger is connected to the joint.

6. The heat dissipation test system according to any one of claims 1 to 3, characterized in that: Also includes: A main line, one end of which is connected to the cooling device, the multiple branches are all connected to the main line, and the branch away from the cooling device is connected to the other end of the main line.

7. The heat dissipation test system according to claim 6, characterized in that: The main pipeline includes a main inlet pipeline and a main return pipeline, both of which are connected to the branch pipeline, and further includes: A bypass pipeline, the bypass pipeline is connected between the main inlet pipeline and the main return pipeline; A flow regulating valve, wherein the flow regulating valve is arranged in the bypass pipeline; A controller is electrically connected to the flow regulating valve and is used to control the opening of the flow regulating valve based on an input instruction.

8. The heat dissipation test system according to claim 6, characterized in that: Also includes: A drain valve, the drain valve being arranged on the main pipe; and / or, An exhaust valve is arranged on the main pipeline.

9. The heat dissipation test system according to claim 8, characterized in that: It also includes a drain valve and an exhaust valve, wherein the drain valve is arranged at a low point of the main pipeline, and the exhaust valve is arranged at a high point of the main pipeline.

10. A test station, characterized in that: include: Multiple devices to be tested; The heat dissipation testing system according to any one of claims 1 to 9, wherein the heat dissipation testing system is connected to the plurality of devices to be tested and is used to dissipate heat for the plurality of devices to be tested.

11. The test station according to claim 10, characterized in that: Also includes: A workshop, in the case where the heat dissipation test system includes a heat exchanger, the plurality of devices to be tested and the heat exchanger are installed in the workshop, and the cooling device of the heat dissipation test system is installed outside the workshop.

12. The test station according to claim 11, characterized in that: When the heat dissipation test system includes a heat exchanger, the heat exchanger is installed inside the device to be tested.

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