Heat dissipation device and display device

Abstract

The utility model provides a heat dissipation device and a display device.The display device comprises the heat dissipation device, the heat dissipation device is used for conducting heat dissipation on a semiconductor element, the heat dissipation device comprises a heat conduction base, heat dissipation fins and an air blower, and the semiconductor element and the heat dissipation fins are connected to the two opposite sides of the heat conduction base respectively; the heat conduction base is used for conducting heat generated by the semiconductor element to the heat conduction base and the cooling fins, the heat conduction base and all the cooling fins enclose to form an installation groove for placing the air blower, a ventilation gap is formed between every two adjacent cooling fins, the air blower is provided with an air outlet in the circumferential direction, and the air outlets face the ends of part of the cooling fins. The air blower is used for enhancing air flow in the ventilation gaps of the cooling fins. The cooling efficiency of the heat dissipation device on the semiconductor element is high, and stable operation of the semiconductor element can be guaranteed.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a heat dissipation device and a display device. Background Art

[0002] Integrated circuit components are installed in the display device. Integrated circuit components generate heat when working. Among them, semiconductor components are the parts that generate heat more obviously. Temperature changes have a great impact on the conductivity, limiting voltage, limiting current and other performance of semiconductor components. If the operating temperature of semiconductor components exceeds the normal operating temperature range, it is easy to cause the performance of semiconductor components to degrade, fail or even be damaged.

[0003] The existing integrated circuit assembly is provided with a mainboard, on which the semiconductor element and the heat sink are installed. The heat sink is bonded to the surface of the semiconductor element facing away from the mainboard. The heat generated by the semiconductor element is transferred to the heat sink by heat conduction, and the heat sink exchanges heat with the air around the heat sink, thereby cooling the semiconductor element.

[0004] Since the internal space of the display device is relatively compact, the volume of the heat sink is limited, resulting in a small area in which the heat sink contacts the surrounding air. After absorbing the heat from the semiconductor element, the heat sink cannot transfer the heat to the surrounding air in time. When the heat sink is applied to a semiconductor element that generates more heat, the heat sink will quickly heat up to a temperature close to that of the semiconductor element, causing the heat sink to be unable to continue to cool the semiconductor element. Therefore, there is a problem that the heat sink is inefficient in cooling the semiconductor element and it is difficult to ensure the stable operation of the semiconductor element. Utility Model Content

[0005] One of the purposes of the embodiments of the present application is to provide a heat dissipation device and a display device to solve the technical problems in the prior art that the heat dissipation block has low efficiency in cooling semiconductor elements and it is difficult to ensure stable operation of the semiconductor elements.

[0006] To solve the above technical problems, in the first aspect, an embodiment of the present application provides a heat dissipation device for dissipating heat from a semiconductor element, the heat dissipation device comprising a heat-conducting base, a heat sink and a blower; the semiconductor element and the heat sink are respectively connected on opposite sides of the heat-conducting base, so as to conduct the heat generated by the semiconductor element to the heat-conducting base and the heat sink; there are multiple heat sinks, and the heat-conducting base and all the heat sinks are surrounded by a mounting groove for the blower to be placed, and a ventilation gap is formed between adjacent heat sinks; the blower is provided with an air outlet along the circumferential direction, and the air outlet is toward the end of a part of the heat sink, and the blower is used to enhance the air flow in the ventilation gap of the part of the heat sink.

[0007] The heat dissipation device provided in the present application has the beneficial effect that: by arranging the heat-conductive base and the heat sink to cooperate with each other, the heat generated by the semiconductor element can be transferred to the heat-conductive base and the heat sink by heat conduction, so that the temperature of the semiconductor element decreases and the temperature of the heat-conductive base and the heat sink increases, and the heat-conductive base and the heat sink then respectively exchange heat with the surrounding air in contact and the temperature decreases, and the heat-conductive base and the heat sink continuously absorb and transfer the heat generated by the semiconductor element, thereby achieving cooling of the semiconductor element.

[0008] Compared to the heat sink in the prior art, the present application provides a plurality of heat sinks and forms ventilation gaps between adjacent heat sinks. Under the condition of the same volume, the heat sinks as a whole have a larger heat dissipation area than the thermally conductive base, thereby saving materials for the heat sink and improving the heat exchange efficiency between the heat sink and the surrounding air.

[0009] Furthermore, by providing the blower, the air flow in the ventilation gap can be enhanced to increase the frequency of heat exchange between the heat sink and the surrounding air, further improving the cooling effect of the heat sink on the semiconductor element, and ensuring the stable operation of the semiconductor element.

[0010] In a feasible technical solution, the heat dissipation device is further provided with a cover plate, which is located on the side of the blower having the air outlet along the circumferential direction, and the cover plate is connected to the side of the heat sink facing the air outlet away from the heat conductive base.

[0011] In a feasible technical solution, along the height direction of the heat-conducting base, the height of the blower is not higher than the height of the heat sink.

[0012] In a feasible technical solution, the number of the installation slots and the number of the blowers are both multiple, and the multiple installation slots correspond one-to-one to the multiple blowers.

[0013] In a feasible technical solution, an installation gap is formed between the thermally conductive base and the adjacent surface of the semiconductor element, a first silicone pad is provided in the installation gap, and opposite sides of the first silicone pad are respectively attached to the adjacent surfaces of the semiconductor element and the thermally conductive base.

[0014] In a feasible technical solution, the blower includes a base shell, a front shell and a fan assembly, the interior of the base shell is formed with a accommodating chamber for installing the fan assembly, the air outlet is opened on the side wall of the base shell, the front shell is provided with an air inlet, and the front shell and the heat-conducting base are both connected to the side wall of the base shell.

[0015] In a feasible technical solution, the side wall of the bottom shell is provided with a first connecting part and a second connecting part away from the outer periphery of the accommodating chamber, the surface shell is provided with a third connecting part clamped with the first connecting part, and the second connecting part is bolted to the heat-conducting base.

[0016] In a feasible technical solution, the heat dissipation device is further provided with a shielding cover and a heat conducting block, the shielding cover is a hollow structure, and the opposite sides of the heat conducting block are respectively connected to the inner peripheral wall of the shielding cover and part of the heat sink.

[0017] In a feasible technical solution, there are multiple heat-conducting blocks, and the multiple heat-conducting blocks correspond one-to-one to different parts of all the heat sinks.

[0018] In a second aspect, an embodiment of the present application further provides a display device, comprising the above-mentioned heat dissipation device.

[0019] The display device provided in the present application has the beneficial effect that: by providing the above-mentioned heat dissipation device, the heat dissipation device has a high efficiency in cooling the semiconductor element and can ensure the stable operation of the semiconductor element. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;

[0022] Figure 2 In the embodiment of this application Figure 1 A disassembled diagram of the heat dissipation device;

[0023] Figure 3 In the embodiment of this application Figure 1 A front view of an assembly of a heat sink and a semiconductor element;

[0024] Figure 4 In the embodiment of this application Figure 1 Exploded diagram of the blower;

[0025] Figure 5 A schematic diagram of an assembly structure of another heat dissipation device and a semiconductor element provided in an embodiment of the present application;

[0026] Figure 6 In the embodiment of this application Figure 5A disassembled diagram of the heat dissipation device;

[0027] Figure 7 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0028] Figure 8 In the embodiment of this application Figure 7 A disassembled diagram of a display device;

[0029] Fig. 9 A schematic diagram of an assembly structure of a heat dissipation device and a mainboard provided in an embodiment of the present application;

[0030] Fig.10 This is a schematic diagram of the assembly structure of another heat dissipation device and a mainboard provided in an embodiment of the present application.

[0031] Among them, the reference numerals in the figure are:

[0032] 10. Semiconductor components;

[0033] 20. Thermally conductive base; 21. Mounting slot; 22. Mounting gap; 23. First silicone pad; 24. Second silicone pad;

[0034] 30. Heat sink; 31. Ventilation gap;

[0035] 40. blower; 41. air outlet; 42. bottom shell; 421. first connection part; 422. second connection part; 43. top shell; 431. third connection part; 44. fan assembly; 441. impeller; 442. motor; 45. accommodation chamber; 46. air inlet;

[0036] 50. Cover plate;

[0037] 60. Shielding cover;

[0038] 70. Heat conducting block;

[0039] 80. Main board; 81. Front shell; 82. Back shell; 83. Support base. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] The following is a detailed description with reference to the accompanying drawings and embodiments:

[0045] Please also read Figures 1 to 4 The embodiment of the present application provides a heat dissipation device for dissipating heat from a semiconductor element 10. The heat dissipation device includes a heat conductive base 20, a heat sink 30 and a blower 40. The semiconductor element 10 and the heat sink 30 are connected to opposite sides of the heat conductive base 20 respectively, so as to conduct the heat generated by the semiconductor element 10 to the heat conductive base 20 and the heat sink 30. There are multiple heat sinks 30. The heat conductive base 20 and all the heat sinks 30 are surrounded by a mounting groove 21 for the blower 40 to be placed. A ventilation gap 31 is formed between adjacent heat sinks 30. The blower 40 is provided with an air outlet 41 along the circumferential direction. The air outlet 41 faces the end of a part of the heat sink 30. The blower 40 is used to enhance the air flow in the ventilation gap 31 of the part of the heat sink 30.

[0046] By arranging the thermally conductive base 20 and the heat sink 30 to cooperate with each other, the heat generated by the semiconductor element 10 can be transferred to the thermally conductive base 20 and the heat sink 30 by heat conduction, so that the temperature of the semiconductor element 10 decreases and the temperatures of the thermally conductive base 20 and the heat sink 30 increase. The thermally conductive base 20 and the heat sink 30 then exchange heat with the surrounding air respectively to reduce their temperatures. The thermally conductive base 20 and the heat sink 30 continuously absorb and transfer the heat generated by the semiconductor element 10, thereby achieving cooling of the semiconductor element 10.

[0047] By providing a plurality of heat sinks 30 and forming ventilation gaps 31 between adjacent heat sinks 30, under the condition of the same volume, all the heat sinks 30 as a whole have a larger heat dissipation area than the heat conductive base 20, thereby saving materials for the heat sink and improving the heat exchange efficiency between the heat sink and the surrounding air, thereby ensuring the stable operation of the semiconductor element.

[0048] By providing the blower 40 , the air flow in the ventilation gap 31 can be enhanced to increase the frequency of heat exchange between the heat sink 30 and the surrounding air, and further enhance the cooling effect of the heat sink on the semiconductor element 10 .

[0049] In application, the thermally conductive base 20 and the heat sink 30 are made of the same material and are integrated into one. The thermally conductive base 20 is made of aluminum or ceramic material. The thermally conductive base 20 is a polygonal or circular plate structure, and the heat sink 30 is a polygonal or semicircular sheet structure. The heat dissipation device has a simple shape and is easy to process, thereby reducing production costs and improving production efficiency.

[0050] In applications, the semiconductor element 10 is a chip or an integrated block containing semiconductor tubes, and the semiconductor element 10 generates heat when powered on.

[0051] In application, the number of semiconductor elements 10 may be at least two, and all semiconductor elements 10 are connected to the heat conductive base 20 to ensure that the heat dissipation device can dissipate heat for all semiconductor elements 10 to prevent some semiconductor elements 10 from being unable to continue working due to excessive temperature.

[0052] In application, the semiconductor element 10 and the portion of the heat sink 30 toward which the air outlet 41 of the blower 40 is directed are respectively connected to opposite sides of the same portion of the thermally conductive base 20. Since the portion of the thermally conductive base 20 connected to the semiconductor element 10 heats up faster than other portions, the portion of the heat sink 30 toward which the air outlet 41 of the blower 40 is directed has a higher heat dissipation efficiency than other portions of the heat sink 30. Therefore, such a design can make the thermal conductivity of the thermally conductive base 20 to the semiconductor element 10 more precise.

[0053] In one embodiment, please refer to Figures 1 to 4 The heat dissipation device is further provided with a cover plate 50 , which is located on a side of the blower 40 having the air outlet 41 along the circumferential direction, and the cover plate 50 is connected to a side of the heat sink 30 facing the air outlet 41 and away from the heat-conducting base 20 .

[0054] In application, by providing the cover plate 50 , the ventilation gap 31 can form a ventilation cavity, and the air pressure in the ventilation cavity is greater than the air pressure in the ventilation gap 31 , so as to further increase the flow rate of the air in the ventilation gap 31 .

[0055] In application, the cover plate 50 has a sheet-like structure, and the opposite sides of the cover plate 50 extend to the air outlet 41 and the edge of the connected part of the heat sink 30 respectively. Specifically, in one embodiment of the present application, the number of air outlets 41 of the blower 40 and the number of cover plates 50 are both one. It can be understood that in other embodiments of the present application, the number of air outlets 41 of the blower 40 is the same as the number of cover plates 50, which is at least two. Multiple cover plates 50 correspond one-to-one to multiple air outlets 41, so that it can be applied to different types of blowers 40 and has stronger versatility.

[0056] In one embodiment, please refer to Figures 1 to 4 , along the height direction of the heat-conducting base 20 , the height of the blower 40 is not higher than the height of the heat sink 30 .

[0057] In application, such a design can be adopted to prevent the blower 40 from protruding relative to the heat sink 30 along the height direction of the heat conductive base 20, so as to save the space occupied by the overall heat dissipation structure. The height of the air outlet 41 of the blower 40 can also be kept within the height range of the heat sink 30, so that the wind blown by the blower 40 can flow more through both sides of the heat sink 30 along the thickness direction, thereby reducing the wind loss of the blower 40 and improving the blowing efficiency of the blower 40.

[0058] Specifically, the heat sink 30 is vertically connected to the heat-conducting base 20 , and all the heat sinks 30 have the same height to facilitate the production and processing of the heat sink 30 .

[0059] In one embodiment, please refer to Figures 1 to 4 The number of the mounting slots 21 and the number of the blowers 40 are both multiple, and the multiple mounting slots 21 correspond one to one to the multiple blowers 40.

[0060] In application, by adopting such a design, different numbers of blowers 40 can be selected to cooperate with the heat sink 30 according to the heat dissipation requirements of different types of semiconductor components 10, so as to improve the versatility of the heat dissipation device.

[0061] In application, the surface of the heat conductive base 20 facing away from the semiconductor element 10 is divided into a first area and a second area separated from each other. All heat sinks 30 are installed in the first area. The first area surrounds part of the outer circumference of the second area, thereby forming a mounting groove 21 in the second area.

[0062] Specifically, in the first region, each heat sink 30 is arranged parallel to each other along the thickness direction. In one embodiment of the present application, the number of second regions is one, and the second region is located at the edge of the thermally conductive base 20. It can be understood that in other examples of the present application, the number of second regions is at least two, a part of the second region is located at the edge of the thermally conductive base 20, and another part of the second region is located in the middle of the thermally conductive base 20, and each second region forms a mounting groove 21.

[0063] In one embodiment, please refer to Figures 1 to 4 An installation gap 22 is formed between the heat conductive base 20 and the adjacent surface of the semiconductor element 10 , and a first silicone pad 23 is disposed in the installation gap 22 . The opposite sides of the first silicone pad 23 are respectively attached to the adjacent surfaces of the semiconductor element 10 and the heat conductive base 20 .

[0064] In application, since the heat dissipation structure has weight, the first silicone pad 23 can be provided to reduce the squeezing effect of the thermal conductive base 20 on the semiconductor element 10 when assembled on the semiconductor element 10, so as to make the assembly of the heat dissipation device safer.

[0065] In one embodiment, please refer to Figures 1 to 4 The blower 40 includes a bottom shell 42, a surface shell 43 and a fan assembly 44. The bottom shell 42 has an accommodating chamber 45 for installing the fan assembly 44. An air outlet 41 is opened on the side wall of the bottom shell 42. The surface shell 43 has an air inlet 46. The surface shell 43 and the heat-conducting base 20 are both connected to the side wall of the bottom shell 42.

[0066] In the application, please also refer to Figure 2 and Figure 4 After the surface shell 43 and the bottom shell 42 are covered, an air outlet 41 is formed between the end of the bottom shell 42 without the side wall and the surface shell 43.

[0067] In application, by providing the fan assembly 44 , the air around the blower 40 can be sucked into the accommodating chamber 45 from the air inlet 46 and blown out from the air outlet 41 , thereby increasing the flow rate of the air around the portion of the heat sink 30 toward which the air outlet 41 faces.

[0068] In application, the fan assembly 44 includes an impeller 441 and a motor 442 . The output end of the motor 442 is connected to the middle of the impeller 441 , and the impeller 441 can be driven to rotate by the motor 442 .

[0069] Specifically, the impeller 441 adopts a turbine fan, and the impeller 441 includes a mounting seat arranged in the middle and a plurality of arc-shaped fan blades arranged along the circumferential direction. The mounting seat is connected to the output end of the power supply machine 442. The width of the arc-shaped fan blade on the side adjacent to the mounting seat is greater than the width on the side away from the mounting seat, so that the arc-shaped fan blade can absorb more air and reduce air loss, and the wind force generated by the blower is stronger. The motor 442 adopts a brushless motor, and the fan assembly 44 is also provided with a mold cavity power supply machine 442 installation. The mold cavity is made of polybutylene terephthalate to ensure its high temperature resistance, corrosion resistance and insulation.

[0070] In one embodiment, please refer to Figures 1 to 4The side wall of the bottom shell 42 is away from the outer periphery of the accommodating chamber 45 and is provided with a first connecting portion 421 and a second connecting portion 422 . The surface shell 43 is provided with a third connecting portion 431 clamped with the first connecting portion 421 . The second connecting portion 422 is bolted to the heat conducting base 20 .

[0071] In application, such a design facilitates assembly between components and increases production efficiency of the heat dissipation device. Specifically, the first connection portion 421 and the third connection portion 431 are buckles and clamping rings for each other, the second connection portion 422 is a flange with a mounting through hole, and a threaded hole matching the mounting through hole is provided at a corresponding position of the heat conductive base 20.

[0072] In one embodiment, please refer to Figure 1 , Figure 5 and Figure 6 The heat dissipation device is further provided with a shielding cover 60 and a heat conducting block 70 . The shielding cover 60 is a hollow structure. The opposite sides of the heat conducting block 70 are respectively connected to the inner peripheral wall of the shielding cover 60 and a part of the heat sink 30 .

[0073] In application, by setting up a shielding cover 60 and a heat-conducting block 70, the shielding cover 60 is used to shield the radiation of electromagnetic waves, and the heat-conducting block 70 is used to transfer part of the heat of the semiconductor element 10 absorbed by the heat dissipation structure to the shielding cover 60. Since the shielding cover 60 has a certain surface area, the shielding cover 60 can be used to exchange heat with the air around it to further improve the heat dissipation efficiency of the heat dissipation device.

[0074] Specifically, the heat conductive block 70 may be made of aluminum, and the shielding cover 60 may be made of hot-dip galvanized steel. One side of the heat conductive block 70 is welded or bonded to the inner wall of the shielding cover 60 , and the other side abuts against at least part of all the heat sinks 30 .

[0075] In one embodiment, please refer to Figure 1 , Figure 5 and Figure 6 There are multiple heat-conducting blocks 70 , and the multiple heat-conducting blocks 70 correspond one-to-one to different parts of all the heat sinks 30 .

[0076] In application, by adopting such a design, a plurality of heat-conducting blocks 70 can be arranged in the empty space on the side of the shielding cover 60 facing the heat dissipation device to improve the space utilization rate of the shielding cover 60. A larger number of heat-conducting blocks 70 can increase the rate at which the shielding cover 60 absorbs heat, and the heat-conducting blocks 70 themselves can also exchange the absorbed heat with the air in contact with the surrounding area, thereby further improving the heat dissipation efficiency of the heat dissipation device.

[0077] Please also read Figure 1 , Figure 5 , Figures 7 to 10 The present application also provides a display device, comprising the above-mentioned heat dissipation device.

[0078] In application, by providing a heat dissipation device, the heat dissipation device has a high efficiency in cooling down the semiconductor element 10 and can ensure the stable operation of the semiconductor element 10 .

[0079] In applications, the display device may be an electronic device such as a monitor or a television.

[0080] Specifically, the display device includes a front shell 81 and a rear shell 82 that are detachably connected, the rear shell 82 is connected to a supporting base 83, a mainboard 80 is installed on the side of the front shell 81 facing the rear shell 82, the semiconductor element 10 is electrically connected to the mainboard 80, the thermal conductive base 20 is bolted to the mainboard 80, and a second silicone pad 24 is further provided in the middle of the thermal conductive base 20, the opposite sides of the second silicone pad 24 are respectively attached to the adjacent surfaces of the mainboard 80 and the thermal conductive base 20, and the number of the second silicone pads 24 is multiple, and each second silicone pad 24 is arranged around the semiconductor element 10, which can avoid large warping of the thermal conductive base 20 relative to the mainboard 80, thereby ensuring the installation stability between the heat dissipation structure and the mainboard 80.

[0081] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation device for dissipating heat from a semiconductor element (10), characterized in that: The heat dissipation device comprises a heat-conducting base (20), a heat sink (30) and a blower (40); The semiconductor element (10) and the heat sink (30) are connected to opposite sides of the heat-conducting base (20) respectively, so as to transfer heat generated by the semiconductor element (10) to the heat-conducting base (20) and the heat sink (30); There are a plurality of heat sinks (30), the heat conductive base (20) and all the heat sinks (30) are enclosed to form a mounting groove (21) for placing the blower (40), and ventilation gaps (31) are formed between adjacent heat sinks (30); The blower (40) is provided with an air outlet (41) along the circumferential direction, and the air outlet (41) faces the end of a portion of the heat sink (30). The blower (40) is used to enhance the air flow in the ventilation gap (31) of the portion of the heat sink (30).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device is further provided with a cover plate (50), the cover plate (50) being located on a side of the blower (40) having the air outlet (41) along the circumferential direction, and the cover plate (50) being connected to a side of the portion of the heat sink (30) facing the air outlet (41) and away from the heat-conducting base (20).

3. The heat dissipation device according to claim 1, characterized in that: Along the height direction of the heat-conducting base (20), the height of the blower (40) is not higher than the height of the heat sink (30).

4. The heat dissipation device according to claim 1, characterized in that: The number of the installation slots (21) and the number of the blowers (40) are both multiple, and the multiple installation slots (21) correspond one-to-one to the multiple blowers (40).

5. The heat dissipation device according to claim 1, characterized in that: An installation gap (22) is formed between the heat-conducting base (20) and the adjacent surface of the semiconductor element (10), and a first silicone pad (23) is arranged in the installation gap (22), and opposite sides of the first silicone pad (23) are respectively attached to the adjacent surfaces of the semiconductor element (10) and the heat-conducting base (20).

6. The heat dissipation device according to claim 1, characterized in that: The blower (40) comprises a bottom shell (42), a front shell (43) and a fan assembly (44); a receiving chamber (45) for installing the fan assembly (44) is formed inside the bottom shell (42); the air outlet (41) is provided on the side wall of the bottom shell (42); the front shell (43) is provided with an air inlet (46); the front shell (43) and the heat-conducting base (20) are both connected to the side wall of the bottom shell (42).

7. The heat dissipation device according to claim 6, characterized in that: A first connecting portion (421) and a second connecting portion (422) are provided on the outer periphery of the side wall of the bottom shell (42) facing away from the accommodating chamber (45); the surface shell (43) is provided with a third connecting portion (431) that is snap-fitted with the first connecting portion (421); and the second connecting portion (422) is bolted to the heat-conducting base (20).

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The heat dissipation device is further provided with a shielding cover (60) and a heat conducting block (70); the shielding cover (60) is a hollow structure; opposite sides of the heat conducting block (70) are respectively connected to the inner peripheral wall of the shielding cover (60) and a portion of the heat sink (30).

9. The heat dissipation device according to claim 8, characterized in that: There are a plurality of the heat conducting blocks (70), and the plurality of the heat conducting blocks (70) correspond one-to-one to different parts of all the heat sinks (30).

10. A display device, characterized in that: The invention comprises a heat dissipation device as claimed in any one of claims 1 to 9.

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