Semiconductor laser packaging structure

Abstract

The utility model discloses a semiconductor laser packaging structure, which is characterized in that a cooling mechanism comprises a bottom plate fixedly connected to the top of a base, the top of the bottom plate is provided with a circulating pipeline, one end of one side of the bottom plate is fixedly communicated with a water inlet pipe, the water inlet pipe is fixedly connected with one end of the circulating pipeline, and the other end of one side of the bottom plate is fixedly communicated with a water outlet pipe; according to the semiconductor laser cooling device, when the semiconductor laser is used, the water inlet pipe and the water outlet pipe are respectively connected with a water pipe, water flow is injected into the circulating pipeline, so that the semiconductor laser is cooled, and when the cover plate is closed, the semiconductor laser can be cooled, so that the semiconductor laser can be cooled, and the service life of the semiconductor laser can be prolonged. And the first sealing gasket and the second sealing gasket which are arranged on the periphery and the through holes can also prevent internal water from seeping out, so that the semiconductor laser can be cooled in use, and the service life of the semiconductor laser in the use process is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lasers, in particular to a semiconductor laser packaging structure. Background Art

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as working media. Semiconductor lasers are small in size, long in life, and can be pumped by a simple current injection method. Their operating voltage and current are compatible with integrated circuits, so they can be integrated with them on a single chip. They can also be directly modulated with current at frequencies up to GHz to obtain high-speed modulated laser output. Due to these advantages, semiconductor lasers are widely used in laser communications, optical storage, optical gyroscopes, laser printing, ranging, and radar.

[0003] During the use of semiconductor lasers, as the output power of semiconductor lasers gradually increases, the operating current of semiconductor lasers needs to be increased. As the current increases, the temperature of the semiconductor laser machine will rise during operation. The temperature increase will cause damage to the electronic components inside the semiconductor laser, thereby reducing the service life of the semiconductor during use. Utility Model Content

[0004] In order to solve the above problems, the purpose of the utility model is to provide a semiconductor laser packaging structure to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model proposes a semiconductor laser packaging structure, including a semiconductor laser, wherein the semiconductor laser includes a base, a laser body is arranged inside the base, a cooling mechanism is arranged on the top of the base, and a fine-tuning mechanism is arranged on one side of the laser body;

[0006] The cooling mechanism includes a bottom plate fixedly connected to the top of the base, a circulation pipe is opened on the top of the bottom plate, one end of one side of the bottom plate is fixedly connected to a water inlet pipe, and the water inlet pipe is fixedly connected to one end of the circulation pipe, the other end of one side of the bottom plate is fixedly connected to a water outlet pipe, and the water outlet pipe is fixedly connected to the other end of the circulation pipe, and a first sealing gasket is fixedly connected around the top of the bottom plate.

[0007] In one example, a cover plate is hinged on one side of the top of the base plate, two through holes are opened at one end of one side of the cover plate, and the through holes are opposite to the two ends of the circulation pipe, and the inner walls of the two through holes are fixedly connected with a second sealing gasket, and a plurality of buckles are hinged at equal distances on one side of the base plate.

[0008] In one example, the fine-tuning mechanism includes a groove opened on one side of the base, one side of the inner wall of the groove is rotatably connected to a lead screw, the outer wall of the lead screw is threadedly connected to a movable seat, and the movable seat is fixedly connected to one side of the laser body.

[0009] In one example, a motor is fixedly connected to one side of the base, and one end of the screw rod passes through the inner wall of the groove and is fixedly connected to the output end of the motor.

[0010] In one example, a switch panel is provided on one side of the base, a motor switch is provided on the surface of the switch panel, and the motor is electrically connected to an external power supply through the motor switch.

[0011] The semiconductor laser packaging structure proposed by the utility model can bring the following beneficial effects:

[0012] 1. A semiconductor laser packaging structure is provided with a bottom plate, a circulation pipe, a water inlet pipe, a water outlet pipe, a first sealing gasket, a cover plate, a through hole, a second sealing gasket, and a buckle on the top of the base. When the semiconductor laser is in use, the water inlet pipe and the water outlet pipe are respectively connected to the water pipe, and water is injected into the inside of the circulation pipe to cool the semiconductor laser. When the cover plate is closed, the first sealing gasket and the second sealing gasket arranged around it and on the through hole can also prevent the internal water from seeping out. When in use, the semiconductor laser can be cooled, thereby increasing the service life of the semiconductor laser during use.

[0013] 2. This semiconductor laser packaging structure, by setting a groove, a screw rod and a movable seat on one side of the base, can be used. Since the movable seat is connected to one side of the semiconductor laser, the semiconductor laser can be fine-tuned by the drive of a motor when in use, making it convenient to focus the emitted laser and improving the practicality during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the cooling mechanism structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the structure of the fine-tuning mechanism of the utility model.

[0018] In the figure: 1. base; 2. bottom plate; 3. circulation pipe; 4. water inlet pipe; 5. water outlet pipe; 6. first sealing gasket; 7. cover plate; 8. through hole; 9. second sealing gasket; 10. buckle; 11. groove; 12. screw; 13. laser body; 14. movable seat; 15. motor. DETAILED DESCRIPTION

[0019] In order to more clearly illustrate the overall concept of the utility model, a detailed description is given below in the form of examples in conjunction with the accompanying drawings.

[0020] Embodiment 1, the utility model provides as follows Figure 1 - Figure 3 A semiconductor laser packaging structure shown includes a semiconductor laser, which includes a base 1. A laser body 13 is arranged inside the base 1, so a cooling mechanism is arranged on the top of the base 1, and a fine-tuning mechanism is arranged on one side of the laser body 13. The cooling mechanism includes a bottom plate 2 fixedly connected to the top of the base 1, a circulation pipe 3 is opened on the top of the bottom plate 2, one end of one side of the bottom plate 2 is fixedly connected to a water inlet pipe 4, and the water inlet pipe 4 is fixedly connected to one end of the circulation pipe 3, the other end of one side of the bottom plate 2 is fixedly connected to a water outlet pipe 5, and the water outlet pipe 5 is fixedly connected to the other end of the circulation pipe 3, a first sealing gasket 6 is fixedly connected around the top of the bottom plate 2, a cover plate 7 is hinged on one side of the top of the bottom plate 2, and one end of one side of the cover plate 7 is opened with two through holes 8, and the through holes 8 are connected to the circulation pipe 3. The two ends of the channel 3 are relatively located, the inner walls of the two through holes 8 are fixedly connected with the second sealing gasket 9, and one side of the bottom plate 2 is hinged with multiple buckles 10 at equal distances. By arranging the bottom plate 2, the circulation pipeline 3, the water inlet pipe 4, the water outlet pipe 5, the first sealing gasket 6, the cover plate 7, the through hole 8, the second sealing gasket 9, and the buckle 10 on the top of the base 1, when the semiconductor laser is in use, the water inlet pipe 4 and the water outlet pipe 5 are respectively connected to the water pipe, and water is injected into the inside of the circulation pipeline 3 to cool the semiconductor laser. When the cover plate 7 is closed, the first sealing gasket 6 and the second sealing gasket 9 arranged around it and on the through hole 8 will also prevent the internal water from seeping out. When in use, the semiconductor laser can be cooled, thereby improving the service life of the semiconductor laser during use.

[0021] Embodiment 2, the utility model provides as follows Figure 3A semiconductor laser packaging structure shown in the figure includes a fine-tuning mechanism comprising a groove 11 opened on one side of a base 1, a screw rod 12 is rotatably connected to one side of the inner wall of the groove 11, a movable seat 14 is threadedly connected to the outer wall of the screw rod 12, and the movable seat 14 is fixedly connected to one side of a laser body 13, a motor 15 is fixedly connected to one side of the base 1, one end of the screw rod 12 passes through the inner wall of the groove 11 and is fixedly connected to the output end of the motor 15, through the groove 11, the screw rod 12 and the movable seat 14 arranged on one side of the base 1, when in use, since the movable seat 14 is connected to one side of the semiconductor laser, when in use, the semiconductor laser can be fine-tuned by the drive of the motor 15, so that it is convenient to focus the emitted laser, thereby improving the practicality during use.

[0022] Working principle: The utility model discloses a semiconductor laser packaging structure. When in use, by arranging a bottom plate 2, a circulation pipe 3, a water inlet pipe 4, a water outlet pipe 5, a first sealing gasket 6, a cover plate 7, a through hole 8, a second sealing gasket 9, and a buckle 10 on the top of a base 1, when the semiconductor laser is in use, the water inlet pipe 4 and the water outlet pipe 5 are respectively connected to the water pipe, and water flow is injected into the inside of the circulation pipe 3, so as to cool the semiconductor laser. When the cover plate 7 is closed, the first sealing gasket 6 and the second sealing gasket 9 arranged on the four sides and the through hole 8 can also prevent the internal water from seeping out. When in use, the semiconductor laser can be cooled, and the service life of the semiconductor laser during use is improved. At the same time, by arranging a groove 11, a screw rod 12, and a movable seat 14 on one side of the base 1, when in use, because the movable seat 14 is connected to one side of the semiconductor laser, when in use, the semiconductor laser can be fine-tuned under the drive of a motor 15, so that it is convenient to focus the emitted laser, and the practicality during use is improved.

[0023] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0024] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A semiconductor laser packaging structure, comprising a semiconductor laser, the semiconductor laser comprising a base (1), a laser body (13) being arranged inside the base (1), a cooling mechanism being arranged on the top of the base (1), and a fine-tuning mechanism being arranged on one side of the laser body (13); Features: The cooling mechanism comprises a bottom plate (2) fixedly connected to the top of the base (1); a circulation pipe (3) is provided on the top of the bottom plate (2); one end of one side of the bottom plate (2) is fixedly connected to a water inlet pipe (4), and the water inlet pipe (4) is fixedly connected to one end of the circulation pipe (3); the other end of one side of the bottom plate (2) is fixedly connected to a water outlet pipe (5), and the water outlet pipe (5) is fixedly connected to the other end of the circulation pipe (3); and a first sealing gasket (6) is fixedly connected around the top of the bottom plate (2).

2. A semiconductor laser packaging structure according to claim 1, characterized in that: A cover plate (7) is hingedly connected to one side of the top of the bottom plate (2); two through holes (8) are provided at one end of one side of the cover plate (7); the through holes (8) are located opposite to the two ends of the circulation pipe (3); the inner walls of the two through holes (8) are fixedly connected to a second sealing gasket (9); and a plurality of buckles (10) are hingedly connected to one side of the bottom plate (2) at equal distances.

3. The semiconductor laser packaging structure according to claim 1, characterized in that: The fine adjustment mechanism comprises a groove (11) formed on one side of a base (1); a screw rod (12) is rotatably connected to one side of an inner wall of the groove (11); a movable seat (14) is threadedly connected to an outer wall of the screw rod (12); and the movable seat (14) is fixedly connected to one side of a laser body (13).

4. A semiconductor laser packaging structure according to claim 3, characterized in that: A motor (15) is fixedly connected to one side of the base (1), and one end of the screw rod (12) passes through the inner wall of the groove (11) and is fixedly connected to the output end of the motor (15).

5. The semiconductor laser packaging structure according to claim 4, characterized in that: A switch panel is provided on one side of the base (1), a motor switch is provided on the surface of the switch panel, and the motor (15) is electrically connected to an external power source via the motor switch.

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