PVD (Physical Vapor Deposition) coating vacuum system

Abstract

The utility model relates to the technical field of PVD (Physical Vapor Deposition) coating, in particular to a PVD coating vacuum system, which comprises a feeding table, a sheet inlet / outlet chamber, a first buffer chamber, a process chamber, a second buffer chamber and an isolating valve, and the sheet inlet / outlet chamber, the first buffer chamber, the process chamber and the second buffer chamber are sequentially arranged behind the feeding table. Isolation valves are arranged between the feeding table and the sheet inlet and outlet chamber, between the sheet inlet and outlet chamber and the first buffer chamber, between the first buffer chamber and the process chamber, and between the process chamber and the second buffer chamber; and when the isolation valves are closed, all the chambers form closed chambers. According to the PVD coating vacuum system disclosed by the utility model, the isolating valves are arranged among the vacuum chambers, so that the vacuum degree of each vacuum chamber can be well controlled; the vacuum coating system is simple in structure, high in reliability, low in cost and capable of being used for research and development of PVD coating products, continuous production can be achieved, cost is saved to a great extent, and working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PVD coating, in particular to a PVD coating vacuum system. Background Art

[0002] In the preparation of heterojunction solar cells, the current common technology is to first deposit an amorphous silicon film in a PECVD device, and then enter the PVD device to coat the transparent conductive film (TCO) through the corresponding PVD equipment. However, because heterojunction cells require a double-sided process, the existing mass-produced PVD coating equipment usually achieves double-sided deposition of the TCO film layer by setting up multiple connected vacuum process chambers.

[0003] However, the existing mass-produced PVD equipment is complex. When conducting PVD process research and development, a complete set of PVD equipment must be purchased, which is not only costly but also takes a long time to install, delaying the project progress and increasing project costs. Utility Model Content

[0004] In view of the shortcomings of the existing background technology, the purpose of the utility model is to provide a PVD coating vacuum system with a simple structure and easy use. In the PVD coating vacuum system of the utility model, isolation valves are provided between each vacuum chamber, which can well control the vacuum degree of each vacuum chamber; the vacuum coating system has a simple structure, strong reliability, and low cost, and can be used for the research and development of PVD coating products, and can achieve continuous production to greatly save costs and improve work efficiency.

[0005] To achieve the above, the technical solution of the utility model is: a PVD coating vacuum system, including a loading platform, a sheet entry and exit chamber, a first buffer chamber, a process chamber, a second buffer chamber and an isolation valve. The sheet entry and exit chamber, the first buffer chamber, the process chamber and the second buffer chamber are arranged in sequence behind the loading platform. Isolation valves are provided between the loading platform and the sheet entry and exit chamber, between the sheet entry and exit chamber and the first buffer chamber, between the first buffer chamber and the process chamber, and between the process chamber and the second buffer chamber. When the isolation valve is closed, each chamber forms a closed chamber.

[0006] Furthermore, the PVD coating vacuum system also includes a plurality of vacuum pumps, which are connected to each chamber and control the vacuum degree of each chamber when the vacuum pumps work.

[0007] Furthermore, when the PVD coating vacuum system performs a normal coating process, the carrier carrying the battery silicon wafers to be coated is sent into the wafer inlet and outlet chamber by the loading platform, the vacuum pump works to change the wafer inlet and outlet chamber from the atmospheric state to the vacuum state, the isolation valve between the wafer inlet and outlet chamber and the first buffer chamber is opened, and the carrier enters the first buffer chamber from the wafer inlet and outlet chamber.

[0008] Furthermore, when the vacuum degree of the first buffer chamber reaches the process requirement under the action of the vacuum pump, the isolation valve between the first buffer chamber and the process chamber is opened, and the carrier enters the process chamber from the first buffer chamber.

[0009] Furthermore, a heater and a cold trap are provided in the process chamber. The heater preheats the cell silicon wafers on the carrier, and the low temperature of the cold trap directly condenses the water vapor attached to the carrier at the cold trap.

[0010] Furthermore, four coating sputtering cathode chambers are provided in the process chamber, heaters are provided on both sides of each coating sputtering cathode chamber, a cold trap runs through the entire process chamber and is located at the upper part of the process chamber, a sputtering cathode is installed in the coating sputtering cathode chamber, a TCO target is installed on the sputtering cathode, and the TCO target is sputtered upward or downward.

[0011] Furthermore, after the carrier plate has been coated in the process chamber, the isolation valve between the process chamber and the second buffer chamber is opened, and the carrier plate enters the second buffer chamber.

[0012] Furthermore, a blind plate is provided at the tail of the second buffer chamber, and a position sensor for monitoring the position of the carrier plate is provided in the second buffer chamber.

[0013] Furthermore, after the carrier reaches the designated position sensor in the second buffer chamber, the servo motor controlling the movement of the carrier starts to reverse, and the carrier loaded with the battery silicon wafer enters the process chamber, the first buffer chamber and the wafer in and out chamber in sequence from the second buffer chamber. When the carrier enters the wafer in and out chamber, the wafer in and out chamber needs to be broken through, and the wafer in and out chamber changes from a vacuum state to an atmospheric state. The isolation valve between the loading platform and the wafer in and out chamber opens, and the carrier is transferred from the wafer in and out chamber to the loading platform to complete the entire coating process.

[0014] The advantages of adopting the technical solution of the utility model are:

[0015] In the PVD coating vacuum system of the utility model, isolation valves are provided between each vacuum chamber, which can well control the vacuum degree of each vacuum chamber; the vacuum coating system has a simple structure, strong reliability and low cost, can be used for the research and development of PVD coating products, and can achieve continuous production to greatly save costs and improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of the PVD coating vacuum system of the utility model.

[0018] The markings in the above figure are: 1. loading table; 2. film inlet and outlet chamber; 3. first buffer chamber; 4. process chamber; 5. second buffer chamber; 6. isolation valve; 8. carrier plate; 9. heater; 10. cold trap; 11. coating sputtering cathode chamber; 12. TCO target; 13. blind plate; 14. position sensor. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0020] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0021] like Figure 1 As shown, a PVD coating vacuum system includes a loading platform 1, a sheet entry and exit chamber 2, a process chamber 4, and also includes a first buffer chamber 3, a second buffer chamber 5 and an isolation valve 6. The sheet entry and exit chamber 2, the first buffer chamber 3, the process chamber 4, and the second buffer chamber 5 are arranged in sequence behind the loading platform 1. Isolation valves 6 are arranged between the loading platform 1 and the sheet entry and exit chamber 2, between the sheet entry and exit chamber 2 and the first buffer chamber 3, between the first buffer chamber 3 and the process chamber 4, and between the process chamber 4 and the second buffer chamber 5. When the isolation valve 6 is closed, each chamber forms a closed chamber. The loading platform 1 is an automated loading platform. Isolation valves are arranged between each vacuum chamber in the PVD coating vacuum system of the utility model, which can well control the vacuum degree of each vacuum chamber; the vacuum coating system has a simple structure, strong reliability, and low cost, and can be used for the research and development of PVD coating products, and can achieve continuous production to greatly save costs and improve work efficiency.

[0022] The PVD coating vacuum system also includes a plurality of vacuum pumps, which are connected to each chamber and control the vacuum degree of each chamber.

[0023] When the PVD coating vacuum system is in normal coating process, the carrier plate 8 carrying the silicon wafer to be coated is sent into the wafer inlet and outlet chamber by the loading platform 1, the vacuum pump works to change the wafer inlet and outlet chamber 2 from the atmospheric state to the vacuum state, the isolation valve 6 between the wafer inlet and outlet chamber 2 and the first buffer chamber 3 is opened, and the carrier plate 8 enters the first buffer chamber 3 from the wafer inlet and outlet chamber 2. Under the action of the vacuum pump, when the vacuum degree of the first buffer chamber 3 reaches the process requirement, the isolation valve 6 between the first buffer chamber 3 and the process chamber 4 is opened, and the carrier plate 8 enters the process chamber 4 from the first buffer chamber 3.

[0024] A heater 9 and a cold trap are provided in the process chamber 4. The heater preheats the battery silicon wafer on the carrier, and the low temperature of the cold trap directly condenses the water vapor attached to the carrier at the cold trap. Four coating sputtering cathode chambers 11 are also provided in the process chamber 4. Heaters 9 are provided on both sides of each coating sputtering cathode chamber 11. The cold trap 10 runs through the entire process chamber 4 and is located in the upper part of the process chamber 4. A sputtering cathode is installed in the coating sputtering cathode chamber 11, and a TCO target 12 is installed on the sputtering cathode. The TCO target 12 sputters upward or downward.

[0025] After the carrier 8 is coated in the process chamber 4, the isolation valve 6 between the process chamber 4 and the second buffer chamber 5 is opened, and the carrier 8 enters the second buffer chamber 5. A blind plate 13 is provided at the tail of the second buffer chamber 5, the front end of the second buffer chamber 5 is connected to the isolation valve, and the rear end of the second buffer chamber 5 is connected to the blind plate 13 to form a closed chamber. A position sensor 14 for monitoring the position of the carrier is provided in the second buffer chamber 5.

[0026] After the carrier 8 reaches the designated position sensor 14 in the second buffer chamber 5, the servo motor controlling the carrier movement starts to reverse, and the carrier with the battery silicon wafer enters the process chamber 4, the first buffer chamber 3 and the in-and-out film chamber 2 in sequence from the second buffer chamber 5. When the carrier enters the in-and-out film chamber 2, the in-and-out film chamber 2 needs to be broken, and the in-and-out film chamber 2 changes from a vacuum state to an atmospheric state. The isolation valve 6 between the loading platform 1 and the in-and-out film chamber 2 is opened, and the carrier 8 is transferred from the in-and-out film chamber 2 to the loading platform 1, completing the entire coating process. In the utility model, multiple position sensors for monitoring the position of the carrier are provided in each chamber.

[0027] Specifically, the PVD coating vacuum system of the utility model comprises a loading platform, a wafer inlet and outlet chamber, a first buffer chamber, a process chamber, and a second buffer chamber; an isolation valve is provided between the loading platform and the wafer inlet and outlet chamber, an isolation valve is provided between the wafer inlet and outlet chamber and the first buffer chamber, an isolation valve is also provided between the first buffer chamber and the process chamber, and an isolation valve is also provided between the process chamber and the second buffer chamber; when the equipment performs a normal coating process, a carrier board carrying a cell silicon wafer to be coated is sent into the wafer inlet and outlet chamber by the automated loading platform; when the cell inlet and outlet chamber enters a vacuum state from an atmospheric state under the action of a vacuum pump, the isolation valve between the cell inlet and outlet chamber and the first buffer chamber is opened, and the carrier board enters the first buffer chamber from the cell inlet and outlet chamber; when the vacuum degree of the first buffer chamber reaches the process requirement, the isolation valve between the first buffer chamber and the process chamber is opened, and the carrier board enters the process chamber from the first buffer chamber; a heating module and a cold trap are provided in the process chamber, and the heating module can pre-heat the cell silicon wafer on the carrier board The low temperature of the heat and cold trap can directly condense the water vapor attached to the carrier at the cold trap, thereby greatly improving the working efficiency of the spiral vacuum pump. The process chamber is equipped with four coating sputtering cathode chambers, and the sputtering cathode chamber is equipped with a sputtering cathode. The sputtering cathode is used to load the TCO target material, and the TCO target material is sputtered upward or downward. After the carrier passes through the process chamber to complete the coating, the isolation valve between the process chamber and the second buffer chamber is opened, and enters the second buffer chamber. The second buffer chamber is equipped with a sensor for monitoring the position of the carrier. When the carrier reaches the specified position sensor, the servo motor that controls the movement of the carrier starts to reverse. The carrier equipped with the battery silicon wafer enters the process chamber, the first buffer chamber and the in-and-out chamber in turn from the second buffer chamber. When the carrier enters the in-and-out chamber, the in-and-out chamber needs to be broken, and the in-and-out chamber changes from a vacuum state to an atmospheric state. The isolation valve between the loading platform and the in-and-out chamber is opened, and the carrier is transferred from the in-and-out chamber to the loading platform to complete the entire coating process.

[0028] In the PVD coating vacuum system of the utility model, isolation valves are arranged between each vacuum chamber, which can well control the vacuum degree of each vacuum chamber; in addition, the vacuum system cancels the isolation chamber, and reduces the large difference in vacuum degree between the inlet and outlet chamber and the first buffer chamber by adding a molecular pump in the inlet and outlet chamber, so as to ensure that when the carrier enters the first isolation chamber from the inlet and outlet chamber, the battery silicon wafer on the carrier will not be offset or broken due to the large vacuum pressure difference; the utility model simplifies the PVD equipment, which not only reduces the R&D cost, but also speeds up the R&D speed.

[0029] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0030] Therefore, any omission, modification, equivalent substitution, improvement, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A PVD coating vacuum system, comprising a loading platform (1), a wafer loading and unloading chamber (2), and a process chamber (4), characterized in that: The invention also comprises a first buffer chamber (3), a second buffer chamber (5) and an isolation valve (6). The sheet inlet and outlet chamber (2), the first buffer chamber (3), the process chamber (4) and the second buffer chamber (5) are arranged in sequence behind the loading platform (1). Isolation valves (6) are arranged between the loading platform (1) and the sheet inlet and outlet chamber (2), between the sheet inlet and outlet chamber (2) and the first buffer chamber (3), between the first buffer chamber (3) and the process chamber (4), and between the process chamber (4) and the second buffer chamber (5). When the isolation valves (6) are closed, each chamber forms a closed chamber.

2. A PVD coating vacuum system according to claim 1, characterized in that: The PVD coating vacuum system also includes a plurality of vacuum pumps, which are connected to each chamber and control the vacuum degree of each chamber when the vacuum pumps work.

3. A PVD coating vacuum system as claimed in claim 2, characterized in that: When the PVD coating vacuum system is performing a normal coating process, a carrier plate (8) carrying a silicon wafer to be coated is sent from a loading platform (1) into the wafer inlet and outlet chamber, a vacuum pump operates to change the wafer inlet and outlet chamber (2) from an atmospheric state to a vacuum state, an isolation valve (6) between the wafer inlet and outlet chamber (2) and the first buffer chamber (3) is opened, and the carrier plate (8) enters the first buffer chamber (3) from the wafer inlet and outlet chamber (2).

4. A PVD coating vacuum system as claimed in claim 3, characterized in that: Under the action of the vacuum pump, when the vacuum degree of the first buffer chamber (3) reaches the process requirement, the isolation valve (6) between the first buffer chamber (3) and the process chamber (4) is opened, and the carrier plate (8) enters the process chamber (4) from the first buffer chamber (3).

5. A PVD coating vacuum system according to any one of claims 2 to 4, characterized in that: The process chamber (4) is provided with a heater (9) and a cold trap. The heater preheats the battery silicon wafer on the carrier. The low temperature of the cold trap directly condenses the water vapor attached to the carrier at the cold trap.

6. A PVD coating vacuum system as claimed in claim 5, characterized in that: The process chamber (4) is further provided with four coating sputtering cathode chambers (11), each coating sputtering cathode chamber (11) being provided with heaters (9) on both sides, a cold trap (10) running through the entire process chamber (4) and being located at the upper part of the process chamber (4), a sputtering cathode being installed in the coating sputtering cathode chamber (11), a TCO target (12) being installed on the sputtering cathode, and the TCO target (12) being sputtered upward or downward.

7. A PVD coating vacuum system as claimed in claim 6, characterized in that: After the carrier plate (8) has passed through the process chamber (4) and completed coating, the isolation valve (6) between the process chamber (4) and the second buffer chamber (5) is opened, and the carrier plate (8) enters the second buffer chamber (5).

8. A PVD coating vacuum system as claimed in claim 7, characterized in that: A blind plate (13) is provided at the rear of the second buffer chamber (5), and a position sensor (14) for monitoring the position of the carrier plate is provided in the second buffer chamber (5).

9. A PVD coating vacuum system as claimed in claim 8, characterized in that: After the carrier (8) reaches the designated position sensor (14) in the second buffer chamber (5), the servo motor controlling the movement of the carrier starts to reverse, and the carrier loaded with the battery silicon wafer enters the process chamber (4), the first buffer chamber (3) and the wafer inlet and outlet chamber (2) in sequence from the second buffer chamber (5). When the carrier enters the wafer inlet and outlet chamber (2), the wafer inlet and outlet chamber (2) needs to be broken through, and the wafer inlet and outlet chamber (2) changes from a vacuum state to an atmospheric state. The isolation valve (6) between the loading platform (1) and the wafer inlet and outlet chamber (2) is opened, and the carrier (8) is transferred from the wafer inlet and outlet chamber (2) to the loading platform (1), completing the entire coating process.

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