Microchannel plate heat exchanger performance test system

Abstract

The utility model provides a micro-channel plate heat exchanger performance test system which comprises an upper cover plate, a heat source chip support, a heat source chip, an inlet channel connecting piece, an outlet channel connecting piece and a lower cover plate, and a single heat exchange plate, the heat source chip and the heat source chip support are installed between the upper cover plate and the lower cover plate. The heat source chip is arranged below the heat exchange area of the single heat exchange plate and is positioned in the mounting groove of the heat source chip support; the left and right ends of the upper cover plate and the lower cover plate are respectively and hermetically provided with an inlet channel connecting piece and an outlet channel connecting piece; a pressure sensor and a threaded thermal resistor are arranged near a liquid inlet / outlet of the single heat exchange plate and are used for measuring inlet / outlet pressure and inlet / outlet temperature; the inlet channel connecting piece is connected with a fluid supply pipeline and is provided with a flow sensor. The test system is used for carrying out heat exchange performance measurement on a single plate to ensure that the performance of the single heat exchange plate is improved, so that the whole heat exchanger is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of microchannel plate heat exchangers, in particular to a microchannel plate heat exchanger performance testing system. Background Art

[0002] The plate heat exchanger is made of many corrugated sheets at a certain interval, sealed by gaskets on all sides, and overlapped and compressed with frames and clamping bolts. The four corner holes of the plates and gaskets form the distribution pipes and collecting pipes of the fluid, while reasonably separating the cold and hot fluids so that they flow in the flow channels on both sides of each plate respectively, and heat exchange is carried out through the plates.

[0003] The main purpose of the plate heat exchanger heat transfer performance test is to obtain the convective heat transfer correlation between the fluid on one side of the heat exchanger surface and the heat transfer surface, so that users can perform selection calculations based on the convective heat transfer correlation of the plate heat exchanger. Therefore, the plate heat exchanger heat transfer performance test is a test that plate heat exchanger manufacturers must complete before the plate heat exchanger leaves the factory.

[0004] For compact heat exchangers such as plate heat exchangers, it is difficult to arrange temperature measuring points on the plate wall due to space limitations, and it is difficult to accurately measure the wall temperature. Therefore, the wall temperature measurement method is difficult to apply to the heat transfer performance test of plate heat exchangers.

[0005] At present, the plate heat exchanger test device combines multiple plates for testing and evaluates the performance of the combined heat exchanger, which is costly and time-consuming. It takes a long time to make multiple plates for assembly, and the sealing requirements are high during the assembly of multiple plates. At the same time, the heat exchange between the hot fluid and the cold fluid is carried out through heat conduction, which consumes a lot of energy.

[0006] The present invention proposes a microchannel plate heat exchanger performance testing system from the perspective of performing performance testing on a single heat exchange plate to optimize the performance of the heat exchanger. Utility Model Content

[0007] The utility model aims to overcome the shortcomings of the prior art and provide a microchannel plate heat exchanger performance testing system.

[0008] In order to achieve the above objectives, the technical solution of the utility model is:

[0009] A microchannel plate heat exchanger performance test system, the test system comprising an upper cover plate 12, a heat source chip support 11, a heat source chip 8, an inlet channel connector 26, an outlet channel connector 24 and a lower cover plate 16, wherein a single heat exchange plate 10, a heat source chip 8 and a heat source chip support 11 are installed between the upper cover plate 12 and the lower cover plate 16;

[0010] The size of the heat source chip 8 is consistent with the size of the heat exchange area on the single heat exchange plate. The heat source chip is placed below the heat exchange area of ​​the single heat exchange plate and is located in the mounting groove supported by the heat source chip.

[0011] The upper cover plate 12 and the lower cover plate 16 are respectively sealed with an inlet channel connector 26 and an outlet channel connector 24 at the left and right ends; the fluid channels of the inlet channel connector 26 and the outlet channel connector 24 are directly opposite to the liquid inlet and outlet of the single heat exchange plate;

[0012] Pressure sensors and threaded thermal resistors are installed near the liquid inlet and outlet of the single heat exchange plate to measure the inlet and outlet pressures and temperatures.

[0013] The inlet channel connector is connected to the fluid supply pipeline and is provided with a flow sensor.

[0014] Furthermore, the heat source chip support 11 is in the shape of a rectangular plate as a whole, and a groove 112 for installing the heat source chip is provided in the center of the rectangular plate, and the groove 112 is formed by being concave inside the center of the rectangular plate, and a number of side holes 111 for placing the surface mount thermal resistors 6 are symmetrically provided on the heat source chip support 11 on both sides of the groove 112, and the surface mount thermal resistors on the side holes are used to collect the wall temperature of the heat exchange plate 10; an edge through hole 114 for routing the heat source chip is provided on one side of the groove 112, and a temperature measuring through groove 113 for measuring the temperature of the heat source chip is also provided inside the groove 112;

[0015] The heat exchange plate is provided with bolt holes for connecting with the upper and lower cover plates at both side edges along the length direction, the inner side of the bolt holes on both sides is the heat exchange area, the bottom surface of the heat exchange area is smaller than the height of the two side edges, microchannels and / or fins are provided in the heat exchange area, and the highest height of the fins or channels is not greater than the height of the two side edges; the length and width of the heat exchange plate are the same as the length and width of the upper and lower cover plates.

[0016] Furthermore, the interior of the heat exchange plate is a heat exchange area, and the height of both sides is higher than the heat exchange area; the length of the upper and lower cover plates is the same as the length of the heat exchange plate, and the width is greater than the width of the heat exchange plate;

[0017] The heat source chip support 11 is in the shape of a rectangular plate as a whole, and a depression for accommodating a single heat exchange plate is provided on the rectangular plate, and a groove 112 for installing the heat source chip is provided in the depression, and the length of the depression is the same as the length of the single heat exchange plate, and the width and depth are the same as the width and thickness of the heat exchange plate; the groove 112 is located in the heat exchange area of ​​the heat exchange plate, and the heat source chip is installed therein; a number of side holes 111 for placing the chip-type thermal resistors 6 are symmetrically opened on the heat source chip support 11 on both sides of the groove, and the chip-type thermal resistors on the side holes are used to collect the wall temperature of the heat exchange plate 10; an edge through hole 114 for routing the heat source chip is provided on one side inside the groove 112, and a temperature measuring through groove 113 for measuring the temperature of the heat source chip is also opened inside the groove 112.

[0018] Furthermore, a rectangular through slot 161 is also provided at the center of the lower cover plate 16, and the rectangular through slot can expose the leads of the heat source chip and the temperature measurement through slot 113, and a patch type thermal resistor for measuring the temperature of the heat source chip is fixed by the thermal resistor support 19;

[0019] A sealing rubber film 21 is provided at the connection position between the inlet channel connector 26 and the outlet channel connector 24 and the upper and lower cover plates, and the T-shaped fastener 18, the inlet channel connector, the outlet channel connector, the top fastener, and the bottom support 20 are connected together through the upper flange support 22 and the lower flange support 22.

[0020] Further, bottom support members 20 are respectively installed on the left and right sides of the lower cover plate 16, and upper flange support members 22 and lower flange support members 22 are respectively provided on the outer sides of the inlet and outlet channel connectors;

[0021] A top fastener 17, a sensor connector 25 and a T-shaped fastener 18 are installed on both sides of the upper left and right parts of the upper cover plate 12. The sensor connector 25 is installed on one side of the upper part of the top fastener 17, and the T-shaped fastener 18 is installed on the other side. Long bolt holes are provided on the top fastener 17 and the sensor connector 25. The long bolts pass through the long bolt holes of the top fastener 17 and the sensor connector 25, the long bolt holes on the upper cover plate, the heat exchange plate 10, the heat source chip support 11, the long bolt holes on the lower cover plate and are fixed together with the bottom support 20 in sequence; the T-shaped fastener 18 is used to connect the top fastener 17 with the inlet channel connector 26 and the outlet channel connector 24; flange connecting parts are provided on both sides of the top fastener 17 and the bottom fastener 20, and the flange connecting parts cooperate with the upper flange support 22 and the lower flange support 22 to realize the connection between the structure clamped by the upper and lower cover plates and the inlet and outlet channel connectors.

[0022] Furthermore, the inlet channel connector, outlet channel connector, top fastener, bottom support, flange connector, sensor connector and T-type fastener are all made by 3D printing; the heat source chip support is a 3D printed slot plate made of nylon glass fiber material.

[0023] Furthermore, the system also includes a data acquisition device 7, a magnetic drive pump 2 and a switch control box 9;

[0024] A threaded thermal resistor and a pressure sensor 5 are installed on each sensor connector 25, and both are connected to the sensor connector through threads. The detection end of the pressure sensor 5 passes through the top fastener 17 and contacts the upper liquid surface of the fluid exposed after the upper cover plate is opened. The top fastener and the detection end of the pressure sensor 5 are sealed.

[0025] The inlet of the magnetic drive pump 2 is connected to the cold water tank 1 through a pipeline, and the outlet of the magnetic drive pump 2 is connected to the inlet channel connector 26 through a pipeline. A ball valve 3 and a flow sensor 4 are arranged on the pipeline connecting the two. The outlet channel connector 24 is connected to the hot water tank 13 through a pipeline to collect the water after heat exchange.

[0026] The switch control box 9 is electrically connected to the magnetic drive pump 2 and the heat source chip 8 respectively, and is used to control the operation of the magnetic drive pump 2 and the heat source chip 8;

[0027] The threaded thermal resistor, the pressure sensor 5 , the flow sensor 4 and the chip thermal resistor are all connected to the data acquisition device 7 .

[0028] Furthermore, the upper cover plate 12 is made of a transparent material, and a high-speed camera 14 is placed on the upper portion of the upper cover plate, and the high-speed camera is connected to a computer 15;

[0029] The heat exchange area of ​​the heat exchange plate 10 is provided with a notch on the outside for placing a sealing strip;

[0030] The upper cover plate 12 is tightly connected to the lower cover plate 16 , and the fluid can only flow in the flow channel inside the heat exchange plate 10 .

[0031] Furthermore, the sensor connector 25 is a rectangular structure as a whole, with a circular hole 251 in the center, and an internal thread built into the circular hole for connecting with the pressure sensor 5. Two circular through holes 252 symmetrically distributed with the circular hole are provided on one side of the circular hole, and an internal thread is built into the circular through hole for connecting with a threaded thermal resistor. The threaded thermal resistor passes through the corresponding circular through holes and the upper cover plate to contact the inlet and outlet fluids, and is used to measure the inlet and outlet fluid temperatures; a plurality of long bolt holes are provided on both sides of the edge of the sensor connector for fixing with the upper and lower cover plates.

[0032] Furthermore, the inlet and outlet channel connectors have the same shape and structure, the inlet channel connector is an overall conical structure, the inlet channel connector is rectangular on the side facing the heat exchange plate 10, a threaded hole for connection is provided at the edge of the rectangle, a rectangular groove 262 for placing an O-ring is provided inside the rectangle, a fluid channel 261 is provided in the center surrounded by the rectangular groove, and the O-ring realizes the sealing of the fluid channel.

[0033] Compared with the prior art, the beneficial effects of the utility model are:

[0034] The test system of the utility model is used to measure the heat exchange performance of a single plate, thereby ensuring the improvement of the performance of the single heat exchange plate and further optimizing the entire heat exchanger.

[0035] The cover plate of the utility model adopts a transparent acrylic structure, and the heat exchanger's original hot fluid entry channel is changed to a heat source chip to provide heat. At the same time, insulation measures are taken to achieve equal heat flux density heat transfer and control the wall temperature. At the same time, six temperature measuring points are arranged on the wall to ensure the accuracy of the temperature.

[0036] The utility model transfers the performance test of multiple plates to a single plate, and the assembly process is simpler. The cost of optimizing the heat exchanger is lower, and the sealing difficulty is relatively low. At the same time, the heat source chip is used as the heat source to provide heat, which reduces the energy consumed in heating the hot fluid. Good insulation ensures equal heat flux density heating. The traditional wall temperature measurement method can be used to measure the performance of the heat exchanger, which reduces errors and the difficulty of processing data. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the connection of the utility model system.

[0038] Figure 2 It is an exploded diagram of the overall structure of the microchannel plate heat exchanger performance testing system of the utility model.

[0039] Figure 3 It is a schematic diagram of the overall structure of the microchannel plate heat exchanger performance testing system of the utility model.

[0040] Figure 4 This is a bottom-up view of the overall structure of the utility model.

[0041] Figure 5 The top view of the sensor connector.

[0042] Figure 6 This is the left side view of the sensor connector.

[0043] Figure 7 The inlet and outlet channel connectors face the side of the heat exchanger.

[0044] Figure 8 It is a top view of the import and export channel connector.

[0045] Fig. 9 It is a T-type fastener.

[0046] Fig.10 The top view of the top fastener.

[0047] Fig.11 This is the front view of the top fastener.

[0048] Fig.12 This is the front view of the lower flange support.

[0049] Fig.13 This is the left side view of the lower flange support.

[0050] Fig.14 This is the front view of the upper flange support.

[0051] Fig.15 For the lower cover.

[0052] Fig.16 It is a thermal resistor support.

[0053] Fig.17 Schematic diagram of the top view structure of the heat source chip support.

[0054] Fig.18 Schematic diagram of the half-section structure of the heat source chip support.

[0055] Fig.19 It is a side view structural schematic diagram of the relative positions of the upper and lower cover plates, the heat source chip support and the heat exchange plate in an embodiment.

[0056] In the figure, a cold water tank 1, a magnetic drive pump 2, a ball valve 3, a flow sensor 4, a pressure sensor 5, a surface-mount thermal resistor 6, a data acquisition instrument 7, a heat source chip 8, a switch control box 9, a heat exchange plate 10, a heat source chip support 11, an upper cover 12, a hot water tank 13, a high-speed camera 14, a computer 15, a lower cover 16, a top fastener 17, a T-type fastener 18, a thermal resistor support 19, a bottom support 20, a sealing film 21, an upper flange support 22, a lower flange support 23, an outlet channel connector 24, a sensor connector 25, and an inlet channel connector 26. DETAILED DESCRIPTION

[0057] The present invention is further explained below in conjunction with the embodiments and drawings, but this is not intended to limit the scope of protection of the present application.

[0058] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0059] Example 1

[0060] This embodiment is a microchannel plate heat exchanger performance test system (see Figure 2 and Figure 3 ), including an upper cover plate 12, a heat source chip support 11, a heat source chip 8 and a lower cover plate 16, the heat source chip 8 is installed in the corresponding groove of the heat source chip support, the single heat exchange plate 10 is placed on the heat source chip support 11, and the heat exchange plate 10, the heat source chip 8, and the heat source chip support 11 are installed in sequence between the upper cover plate 12 and the lower cover plate 16; the upper cover plate 12 and the lower cover plate 16 are connected to the heat exchange plate 10 and the heat source chip support 11 as a whole by long bolts.

[0061] Bolt holes are provided on both side edges of the heat exchange plate 10. The size of the heat source chip support and the upper and lower cover plates are the same as that of the heat exchange plate. The upper and lower cover plates, the heat source chip support and the heat exchange plate are fixed together through the bolt holes.

[0062] Bottom support members 20 are installed on the left and right sides of the lower cover plate 16, and inlet channel connectors 26 and outlet channel connectors 24 are installed on the left and right ends of the upper cover plate 12 and the lower cover plate 16, respectively; upper flange support members 22 and lower flange support members 22 are respectively provided on the outer sides of the inlet and outlet channel connectors;

[0063] A top fastener 17, a sensor connector 25 and a T-shaped fastener 18 are installed on both sides of the upper left and right parts of the upper cover plate 12. The sensor connector 25 is installed on one side of the upper part of the top fastener 17, and the T-shaped fastener 18 is installed on the other side. Long bolt holes are provided on the top fastener 17 and the sensor connector 25. The long bolts pass through the long bolt holes of the top fastener 17 and the sensor connector 25, the long bolt holes on the upper cover plate, the heat exchange plate 10, the heat source chip support 11, the long bolt holes on the lower cover plate and are fixed together with the bottom support 20 in sequence; the T-shaped fastener 18 is used to connect the top fastener 17 with the inlet channel connector 26 and the outlet channel connector 24; flange connecting parts are provided on both sides of the top fastener 17 and the bottom fastener 20, and the flange connecting parts cooperate with the upper flange support 22 and the lower flange support 22 to realize the connection between the structure clamped by the upper and lower cover plates and the inlet and outlet channel connectors.

[0064] The heat source chip support 11 (see Fig.17 and Fig.18) is a rectangular plate as a whole, and a groove 112 for installing a heat source chip is provided in the center of the rectangular plate. The groove 112 is formed by being depressed 4mm inside the center of the rectangular plate. The groove 12 is a non-through groove. Six side holes 111 for placing a patch type thermal resistor 6 are symmetrically provided on the heat source chip support 11 on both sides of the groove 112. The side hole depth is 3.6mm. The patch type thermal resistor is used to collect the wall temperature of the heat exchange plate 10. An edge through hole 114 for routing the heat source chip is provided on one side of the groove 112, and a temperature measuring through groove 113 for measuring the temperature of the heat source chip is provided in the center of the groove 112.

[0065] The center of the lower cover plate 16 is also provided with a rectangular through slot 161, which can expose the edge through hole and the temperature measuring through slot 113. The thermal resistor support member 19 is used to support the SMD thermal resistor in the temperature measuring through slot 113 for measuring the temperature of the heat source chip.

[0066] A sealing rubber film 21 is provided at the connection position between the inlet channel connector 26 and the outlet channel connector 24 and the upper and lower cover plates, and the T-shaped fastener 18, the inlet channel connector, the outlet channel connector, the top fastener, and the bottom support 20 are connected together through the upper flange support 22 and the lower flange support 22.

[0067] A threaded thermal resistor and a pressure sensor 5 are installed on each sensor connector 25, both of which are connected to the sensor connector through threads. The pressure sensor 5 installed on the inlet and outlet is used to measure the inlet and outlet pressures.

[0068] Example 2

[0069] The microchannel plate heat exchanger performance testing system of this embodiment further includes a threaded thermal resistor, a pressure sensor 5 , a flow sensor 4 , a data acquisition instrument 7 , a magnetic drive pump 2 and a switch control box 9 .

[0070] The inlet of the magnetically driven pump 2 is connected to the cold water tank 1 through a pipeline, and the outlet of the magnetically driven pump 2 is connected to the inlet channel connector 26 through a pipeline. A ball valve 3 and a flow sensor 4 are arranged on the pipeline connecting the two. The outlet channel connector 24 is connected to the hot water tank 13 through a pipeline to collect the water after heat exchange.

[0071] The switch control box 9 is electrically connected to the magnetic drive pump 2 and the heat source chip 8 respectively, and is used to control the operation of the magnetic drive pump 2 and the heat source chip 8.

[0072] The upper cover plate 12 is made of transparent material, and a high-speed camera 14 is placed on the upper part of the upper cover plate. The high-speed camera is connected to a computer 15 to form a visualization module. The high-speed camera collects image data of the fluid conditions inside the device and the computer 15 processes the data.

[0073] The threaded thermal resistor, the pressure sensor 5 , the flow sensor 4 and the chip thermal resistor 6 are all connected to the data acquisition device 7 .

[0074] The heat exchange plate 10 is provided with a slot for placing a sealing strip. The upper cover plate 12 is tightly connected to the lower cover plate 16 , which not only ensures the sealing of the heat exchanger test device, but also ensures that the fluid can only flow in the flow channel inside the heat exchange plate 10 .

[0075] The sealing film 21 is grooved to place an O-ring on the side facing the upper cover plate 12. The inlet channel connector 26 and the outlet channel connector 24 are grooved to place an O-ring on one side facing the sealing film 21.

[0076] Example 3

[0077] The structure shape of the sensor connector 25 in the microchannel plate heat exchanger performance test system of this embodiment is as follows: Figure 5 and Figure 6 As shown, the overall structure is a rectangular structure with a circular hole 251 in the center, and the circular hole is internally threaded for connecting with the pressure sensor 5. Two circular ring through holes 252 symmetrically distributed with the circular hole are arranged on one side of the circular hole. The circular ring through holes are internally threaded for connecting with the threaded thermal resistor. The threaded thermal resistor passes through the corresponding circular ring through holes and the upper cover plate to contact the inlet and outlet fluids, and is used to measure the inlet and outlet fluid temperatures. A plurality of long bolt holes are arranged on both sides of the edge of the sensor connector for fixing with the upper and lower cover plates. The circular ring through hole 252 is higher than the circular hole 251 by a certain height. When measuring, the average of the two threaded thermal resistors is taken as the inlet and outlet temperature.

[0078] An opening is provided on the upper cover at a position corresponding to the pressure sensor. The detection end of the pressure sensor can enter the opening position of the upper cover through the circular hole on the sensor connector 25 and the circular hole on the top fastener, and contact the upper liquid surface of the fluid, and the top fastener and the pressure sensor are sealed and connected.

[0079] A sealing ring is arranged at the connection position between the top fastener and the two threaded thermal resistors.

[0080] The shape and structure of the inlet and outlet channel connectors are the same. The inlet channel connector is used as an example for explanation. The overall structure is conical, such as Figure 7 and Figure 8 As shown, the inlet channel connector is rectangular on the side facing the heat exchange plate 10, a threaded hole for connection is provided at the edge of the rectangle, a rectangular groove 262 for placing an O-ring is provided inside the rectangle, a fluid channel 261 is provided in the center surrounded by the rectangular groove, and the O-ring realizes the sealing of the fluid channel.

[0081] The lower cover plate is as follows Fig.15As shown, a rectangular through slot 161 is opened in the middle to ensure the passage of the heat source chip connection line.

[0082] Example 4

[0083] In the microchannel plate heat exchanger performance test system of this embodiment, the upper cover plate and the lower cover plate are both made of transparent acrylic material, and the transparent material of the upper cover plate is used to assist in flow visualization, while the lower cover plate increases the thermal insulation performance of the device.

[0084] The inlet channel connector, outlet channel connector, top fastener, bottom support, flange connector, sensor connector and T-type fastener are all made by 3D printing.

[0085] The heat source chip support is a 3D printed slot plate made of nylon glass fiber material, and six side holes are opened on the side for placing surface mount thermal resistors to collect the wall temperature of the heat exchange plate.

[0086] The heat source chip has a size of 134mm*35mm*4mm, a rated power of 150W, and a rated voltage of 220V.

[0087] The inlet channel connector is connected to a magnetic drive pump, the model of the magnetic drive pump is MP-15R, the maximum flow rate is 16L / min, the head is 2.4m, the power is 10W, and the voltage is 220V.

[0088] The switch control box has two self-locking button switches, which respectively control the magnetic drive pump and the heat source chip.

[0089] The thermal resistor is a temperature sensor. In this embodiment, four threaded thermal resistors are used to measure the inlet and outlet fluid temperatures, six patch thermal resistors are used to measure the plate wall temperature, and one patch thermal resistor is used to monitor the temperature of the heat source chip. The accuracy is Class A. Both the threaded thermal resistor and the patch thermal resistor can be made of PT100 platinum thermal resistor, which has high stability and high accuracy.

[0090] The heat source chip support is made of high temperature resistant material as a whole.

[0091] The flow sensor is a smart turbine flowmeter from Willtech with a measuring range of 0.1 to 0.6 m3 / h, powered by 24V, and an output signal of 1 to 5V voltage. The pressure sensor is a diffused silicon pressure transmitter with a measuring range of 0 to 60 kPa, powered by 24V, and an output signal of 4 to 20 mA current.

[0092] The data acquisition instrument is Jinke JK360, which can support 96 two-wire or 48 three- or four-wire signal measurements, and the measurement range covers voltage, thermal resistance, thermocouple and current. It is equipped with a 10-inch TFTLCD touch screen, which can monitor data in real time and support operations such as unit modification and formula editing.

[0093] The model of the high-speed camera is X190 produced by Qianyanlang. At the maximum resolution (1280×1024, the frame rate is 9300fps. By adjusting the resolution and reducing the shooting area, the frame rate can be increased to 700000fps. The lens is a fixed-focus macro lens, model Sigma, MACRO150mmf / 2.8EXDG. The lighting source used is a 300W LED lamp, model EL300, which can provide sufficient light intensity in a very short exposure time. The high-speed camera and LED lamp are supported and fixed by their own tripods. The tripod of the camera is equipped with a pan / tilt to adjust the position and angle of the camera. The high-speed camera is connected to the computer via a gigabit network cable and operated with the supporting control software. The software can control the high-speed acquisition process, including modifying the trigger mode, exposure time, adjusting the frame rate, exporting videos and pictures, etc.

[0094] The test process of the test system of the utility model is: set the fluid flow rate, turn on the heat source chip switch on the switch control box, wait for the heat source chip temperature (monitored by the patch type thermal resistor in the center of the groove) to rise to a certain target temperature (such as 90-100°C), turn on the magnetic drive pump switch on the switch control box, open the inlet channel ball valve, let the cold fluid enter the heat exchange area of ​​the heat exchange plate, observe the digital display, and start recording data when the flow value is stable. The collected data includes flow rate (collected by flow sensor), inlet and outlet pressure (measured by two pressure sensors), inlet and outlet temperature (threaded thermal resistor), and heat exchange plate wall temperature. Record for 5-8 minutes. At this time, the inlet and outlet temperature remains stable with small fluctuations. In this embodiment, the inlet and outlet temperature is controlled to fluctuate within the range of 0.05°C, which can be considered stable. Stop recording, process the data, and calculate the friction coefficient, Nusselt number Nu, and Reynolds number Re for comprehensive evaluation of the performance of the heat exchange plate. The specific calculation method of each coefficient is as follows:

[0095] The liquid pressure change is measured by measuring the inlet and outlet pressure sensors, where the inlet pressure is recorded as P in , outlet pressure is recorded as P out , the pressure change is ΔP=P in -P out .

[0096] The friction coefficient f is a function of pressure drop, and this test device uses the Fanning friction coefficient.

[0097]

[0098] Where P in ——Inlet pressure, Pa;

[0099] P out ——Outlet pressure, pa;

[0100] D h ——equivalent diameter, mm, is the characteristic length in non-circular pipe flow;

[0101] L e ——Heat exchange section length of heat exchange plate, mm;

[0102] ρ——density of water, kg / m 3 ;

[0103] v in ——Inlet velocity, m / s, determined by the flow sensor.

[0104] This test is a constant heat flux heating, using the heat source chip as an electric heating chip to provide heat and heat evenly. At the same time, the upper and lower surfaces of the device are added with insulation layers (upper and lower covers, both transparent acrylic plates), so the heat flux density is equal everywhere. For the convenience of calculation, it is assumed that the heat transferred by the heat source chip during the test is equal to the heat absorbed by the water.

[0105]

[0106]

[0107]

[0108] Where Q is the power of the heat source chip, W;

[0109] A——heat exchange area, m2;

[0110] q——heat flux, W / m2;

[0111] h——convective heat transfer coefficient, W / (m2·℃);

[0112] ΔT b ——Logarithmic mean temperature difference, °C;

[0113] T in ——inlet temperature, °C;

[0114] T out ——Outlet temperature, °C;

[0115] Tw——heat exchange tube wall temperature, ℃.

[0116] The Nusselt number Nu is expressed as:

[0117]

[0118] Where λ is the thermal conductivity of water, W / (m·K).

[0119] The Reynolds number Re is expressed as:

[0120]

[0121] Where μ is the dynamic viscosity of water, Pa·s.

[0122] Example 5

[0123] In the microchannel plate heat exchanger performance test system of this embodiment, the heat exchange plate to be tested is not processed in any way. At this time, the interior of the heat exchange plate is a heat exchange area, and the heights of both sides are higher than the heat exchange area; the lengths of the upper and lower cover plates are the same as the length of the heat exchange plate, and the widths are greater than the width of the heat exchange plate;

[0124] The heat source chip support 11 is in the shape of a rectangular plate as a whole, and a depression for accommodating a single heat exchange plate is provided on the rectangular plate, and a groove 112 for installing the heat source chip is provided in the depression, and the length of the depression is the same as the length of the single heat exchange plate, and the width and depth are the same as the width and thickness of the heat exchange plate; the groove 112 is located in the heat exchange area of ​​the heat exchange plate, and the heat source chip is installed therein; a number of side holes 111 for placing the chip-type thermal resistors 6 are symmetrically opened on the heat source chip support 11 on both sides of the groove, and the chip-type thermal resistors on the side holes are used to collect the wall temperature of the heat exchange plate 10; an edge through hole 114 for routing the heat source chip is provided on one side inside the groove 112, and a temperature measuring through groove 113 for measuring the temperature of the heat source chip is also opened inside the groove 112.

[0125] The upper end surface of the heat exchange plate is flush with the upper surface of the heat source chip support 11, and the depth of the depression is the thickness of the heat exchange plate (based on the thickest position of the heat exchange plate). The rectangular area covered by the microchannel on the heat exchange plate is the heat exchange area. The heat source chip is located under the heat exchange area to heat the heat exchange area.

[0126] The above describes in detail the preferred specific embodiments of the utility model. It should be understood that ordinary technicians in this field can make many modifications and changes based on the concept of the utility model without creative work. Therefore, all technical solutions that can be obtained by technicians in this technical field based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the existing technology should be within the scope of protection determined by the claims.

[0127] Any matters not described in the present invention are applicable to the prior art.

Claims

1. A microchannel plate heat exchanger performance test system, characterized in that: The test system comprises an upper cover plate, a heat source chip support, a heat source chip, an inlet channel connector, an outlet channel connector and a lower cover plate, and a single heat exchange plate, a heat source chip and a heat source chip support are installed between the upper cover plate and the lower cover plate; The size of the heat source chip is consistent with the size of the heat exchange area on the single heat exchange plate. The heat source chip is placed below the heat exchange area of ​​the single heat exchange plate and is located in the installation groove supported by the heat source chip. The left and right ends of the upper cover plate and the lower cover plate are respectively sealed and installed with an inlet channel connector and an outlet channel connector; the fluid channels of the inlet channel connector and the outlet channel connector are directly opposite to the liquid inlet and outlet of the single heat exchange plate; Pressure sensors and threaded thermal resistors are installed near the liquid inlet and outlet of the single heat exchange plate to measure the inlet and outlet pressures and temperatures. The inlet channel connector is connected to the fluid supply pipeline and is provided with a flow sensor.

2. The test system according to claim 1, characterized in that: The heat source chip support is in the shape of a rectangular plate as a whole, and a groove for installing the heat source chip is arranged in the center of the rectangular plate, and the groove is formed by being concave inside the center of the rectangular plate, and a number of side holes for placing SMD thermal resistors are symmetrically opened on the heat source chip support on both sides of the groove, and the SMD thermal resistors on the side holes are used to collect the wall temperature of the heat exchange plate; an edge through hole for routing the heat source chip is arranged on one side inside the groove, and a temperature measuring through groove for measuring the temperature of the heat source chip is also opened inside the groove; The heat exchange plate is provided with bolt holes for connecting with the upper and lower cover plates at both side edges along the length direction, the inner side of the bolt holes on both sides is the heat exchange area, the bottom surface of the heat exchange area is smaller than the height of the two side edges, microchannels and / or fins are provided in the heat exchange area, and the highest height of the fins or channels is not greater than the height of the two side edges; the length and width of the heat exchange plate are the same as the length and width of the upper and lower cover plates.

3. The test system according to claim 1, characterized in that: The interior of the heat exchange plate is a heat exchange area, and the height of both sides is higher than the heat exchange area; the length of the upper and lower cover plates is the same as the length of the heat exchange plate, and the width is greater than the width of the heat exchange plate; The heat source chip support is in the shape of a rectangular plate as a whole, and a depression for accommodating a single heat exchange plate is arranged on the rectangular plate, and a groove for installing the heat source chip is arranged in the depression, and the length of the depression is the same as the length of the single heat exchange plate, and the width and depth are the same as the width and thickness of the heat exchange plate; the groove is located in the heat exchange area of ​​the heat exchange plate, and the heat source chip is installed therein; a number of side holes for placing surface mount thermal resistors are symmetrically opened on the heat source chip support on both sides of the groove, and the surface mount thermal resistors on the side holes are used to collect the wall temperature of the heat exchange plate; an edge through hole for routing the heat source chip is arranged on one side inside the groove, and a temperature measuring through groove for measuring the temperature of the heat source chip is also opened inside the groove.

4. The test system according to claim 1, characterized in that: A rectangular through slot is also provided at the center of the lower cover plate, and the rectangular through slot can expose the leads of the heat source chip and the temperature measurement through slot, and a patch type thermal resistor for measuring the temperature of the heat source chip is fixed by a thermal resistor support member; Sealing films are provided at the connection positions of the inlet channel connector and the outlet channel connector and the upper and lower cover plates, and the T-shaped fasteners, the inlet channel connector, the outlet channel connector, the top fasteners and the bottom support are connected together through the upper flange support and the lower flange support.

5. The test system according to claim 2 or 3, characterized in that: Bottom support members are installed on the left and right sides of the lower cover plate, and upper flange support members and lower flange support members are respectively arranged on the outer sides of the inlet and outlet channel connectors; Top fasteners, sensor connectors and T-shaped fasteners are installed on both the left and right sides of the upper part of the upper cover plate. The sensor connector is installed on one side of the upper part of the top fastener, and the T-shaped fastener is installed on the other side. Long bolt holes are provided on the top fastener and the sensor connector. The long bolts pass through the long bolt holes of the top fastener and the sensor connector, the long bolt holes on the upper cover plate, the heat exchange plates, the heat source chip support, the long bolt holes on the lower cover plate and are fixed together with the bottom support; the T-shaped fastener is used to connect the top fastener with the inlet channel connector and the outlet channel connector; flange connecting parts are provided on both sides of the top fastener and the bottom fastener, and the flange connecting parts cooperate with the upper flange support and the lower flange support to realize the connection between the structure clamped by the upper and lower cover plates and the inlet and outlet channel connectors.

6. The test system according to claim 5, characterized in that: The inlet channel connector, outlet channel connector, top fastener, bottom support, flange connector, sensor connector and T-type fastener are all made by 3D printing; the heat source chip support is a 3D printed slot plate made of nylon glass fiber material.

7. The test system according to claim 5, characterized in that: The system also includes a data acquisition instrument, a magnetic drive pump and a switch control box; A threaded thermal resistor and a pressure sensor are installed on each sensor connector, both of which are connected to the sensor connector through threads, and the detection end of the pressure sensor passes through the top fastener and contacts the upper liquid surface of the fluid exposed after the upper cover plate is opened, and the top fastener and the detection end of the pressure sensor are sealed and connected; The inlet of the magnetic drive pump is connected to the cold water tank through a pipeline, and the outlet of the magnetic drive pump is connected to the inlet channel connector through a pipeline. A ball valve and a flow sensor are arranged on the pipeline connecting the two. The outlet channel connector is connected to the hot water tank through a pipeline to collect the water after heat exchange. The switch control box is electrically connected to the magnetic drive pump and the heat source chip respectively, and is used to control the operation of the magnetic drive pump and the heat source chip; The threaded thermal resistor, pressure sensor, flow sensor and patch thermal resistor are all connected to the data acquisition instrument.

8. The test system according to claim 5, characterized in that: The upper cover is made of transparent material, and a high-speed camera is placed on the upper part of the upper cover, and the high-speed camera is connected to a computer; The heat exchange area of ​​the heat exchange plate is provided with a slot on the outside for placing the sealing strip; The upper cover plate is tightly connected to the lower cover plate, and the fluid can only flow in the flow channel inside the heat exchange plate.

9. The test system according to claim 5, characterized in that: The sensor connector is a rectangular structure as a whole, with a circular hole in the center, and an internal thread built into the circular hole for connecting with the pressure sensor. Two circular through holes symmetrically distributed with the circular hole are arranged on one side of the circular hole, and an internal thread is built into the circular through hole for connecting with the threaded thermal resistor. The threaded thermal resistor passes through the corresponding circular through holes and the upper cover plate to contact the inlet and outlet fluids, and is used to measure the inlet and outlet fluid temperatures; a plurality of long bolt holes are arranged on both sides of the edge of the sensor connector for fixing with the upper and lower cover plates.

10. The test system according to claim 1, characterized in that: The inlet and outlet channel connectors have the same shape and structure. The inlet channel connector is an overall conical structure. The inlet channel connector is rectangular on the side facing the heat exchange plate. A threaded hole for connection is provided at the edge of the rectangle, and a rectangular groove for placing an O-ring is provided inside the rectangle. A fluid channel is provided in the center surrounded by the rectangular groove, and the O-ring seals the fluid channel.

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