Thermocompression bonding equipment

Abstract

The utility model relates to the technical field of chip bonding, and provides a thermocompression bonding device, which comprises a turning mechanism, the thermocompression bonding pressure head assembly comprises a rotation adjusting mechanism, a pickup mechanism and a first chamber, the rotation adjusting mechanism is connected with the pickup mechanism and is used for adjusting the rotation angle of the pickup mechanism, the first chamber is arranged on the pickup mechanism, and the end part of the pickup mechanism is arranged in the first chamber; the thermocompression bonding platform or the first substrate on the thermocompression bonding platform is matched with the first cavity to form a vacuum cavity; the preheating platform is arranged on the side of the thermocompression bonding platform, the first visual identification mechanism is arranged between the turnover mechanism and the thermocompression bonding platform, and the first visual identification mechanism is electrically connected with the rotation adjusting mechanism and used for identifying and adjusting the angle of the pickup mechanism. The preheating platform is used for leveling, and a nitrogen protection device is arranged to prevent oxidation and conduct cooling.

Description

Technical Field

[0001] The utility model relates to the technical field of chip bonding, in particular to a thermal compression bonding device. Background Art

[0002] The process of attaching semiconductor chips to circuit boards generally needs to be performed very accurately. The substrate has multiple mounting areas for fixing semiconductor chips. On the other hand, the semiconductor chip needs to be accurately electrically connected to the mounting area of ​​the circuit board. In order to reduce the defective rate, the semiconductor chip needs to be installed in the correct position (pattern) of the mounting area.

[0003] The semiconductor chip mounting process can be called a bonding process. Based on the process characteristics that require precise operations, the overall position of the circuit board and the position of the fixing part (mounting area) of the semiconductor chip on the circuit board are checked, and then the semiconductor chip is mounted on the circuit board.

[0004] Thermocompression bonding equipment is an equipment that separates individual semiconductor chips from a wafer, picks up the chips with a bonding picker with the bottom of the chips (bump-formed surface) facing downward, and bonds the chips to a target substrate.

[0005] The bonding equipment in the prior art does not have a dedicated leveling platform and is easily oxidized during the leveling process. Summary of the invention

[0006] The utility model provides a hot pressing bonding device, which is used to solve the problem of easy oxidation in the leveling process in the prior art.

[0007] A thermocompression bonding device comprises a flipping mechanism, a thermocompression bonding head assembly, a preheating platform, a thermocompression bonding platform and a first visual recognition mechanism; the flipping mechanism holds a chip facing in the correct direction; the thermocompression bonding head assembly comprises a rotation adjustment mechanism, a pickup mechanism and a first chamber, the rotation adjustment mechanism is connected to the pickup mechanism and is used to adjust the rotation angle of the pickup mechanism, the first chamber is arranged on the pickup mechanism, and the end of the pickup mechanism is arranged in the first chamber; the thermocompression bonding platform or the first substrate on the thermocompression bonding platform cooperates with the first chamber to form a vacuum chamber; the preheating platform is arranged on the side of the thermocompression bonding platform, the first visual recognition mechanism is arranged between the flipping mechanism and the thermocompression bonding platform, and the first visual recognition mechanism is electrically connected to the rotation adjustment mechanism and is used to identify and adjust the angle of the pickup mechanism.

[0008] According to the thermal compression bonding equipment of the utility model, a nitrogen protection device is arranged in the preheating platform.

[0009] According to the thermal compression bonding equipment of the utility model, a leveling device is arranged in the preheating platform.

[0010] According to the thermocompression bonding device of the utility model, the thermocompression bonding head assembly further comprises a first temperature control mechanism, and the first temperature control mechanism transfers heat with the pickup mechanism to control the temperature of the pickup mechanism.

[0011] According to the thermocompression bonding device of the utility model, the thermocompression bonding head assembly further includes a vacuum pumping mechanism, and the vacuum pumping mechanism is connected to the first chamber and is used for vacuuming the first chamber.

[0012] According to the thermocompression bonding device of the utility model, the thermocompression bonding head assembly further comprises a gas charging mechanism, and the gas charging mechanism is connected to the first chamber and is used for charging protective gas and / or reducing gas into the first chamber.

[0013] According to the thermocompression bonding device of the utility model, the thermocompression bonding platform includes a second temperature control mechanism, and the second temperature control mechanism is used for heat transfer of the first substrate or the second substrate of the preheating platform.

[0014] According to the thermocompression bonding device of the utility model, it also includes a first linear moving mechanism, and the thermocompression bonding platform and the preheating platform are slidably installed on the first linear moving mechanism, and the first linear moving mechanism enables the thermocompression bonding platform to linearly approach and move away from the thermocompression bonding head assembly.

[0015] According to the utility model, the thermocompression bonding device further comprises a second linear moving mechanism and a material picking platform, the thermocompression bonding head assembly is slidably mounted on the second linear moving mechanism, and the second linear moving mechanism is extended and arranged along the direction in which the material picking platform, the first visual recognition mechanism and the thermocompression bonding platform are sequentially arranged;

[0016] Wherein, the extension directions of the second linear motion mechanism and the first linear motion mechanism are perpendicular to each other.

[0017] According to the thermocompression bonding device of the utility model, the first visual recognition mechanism is electrically connected to the first linear motion mechanism and the second linear motion mechanism, and is used to adjust the positions of the thermocompression bonding platform and the thermocompression bonding head assembly.

[0018] The preheating platform of the utility model is used for leveling, and a nitrogen protection device is arranged to prevent oxidation and cool down, thereby improving the bonding quality. The hot pressing bonding platform is provided with a nitrogen protection device, and a liftable infrared heating tube is arranged on the upper part of the hot pressing bonding platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the front view structure of the thermal compression bonding equipment;

[0021] Figure 2 It is a schematic diagram of the three-dimensional structure of the thermal compression bonding equipment;

[0022] Figure 3 It is a structural schematic diagram of an enlarged view of local A;

[0023] Attached figure numbers: 100, hot-press bonding head; 101, rotation adjustment mechanism; 102, grabbing mechanism; 103, first chamber; 104, lifting mechanism; 110, second linear moving mechanism; 210, preheating platform; 220, hot-press bonding platform; 300, first visual recognition mechanism; 400, flipping mechanism; 500, glue dipping mechanism; 600, operating platform; 610, material taking mechanism; 620, material feeding platform; 630, second visual recognition mechanism. DETAILED DESCRIPTION

[0024] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0025] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0027] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0028] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or at least one embodiment or example. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0029] Combine the following Figure 1-3A thermocompression bonding device of an embodiment of the utility model is described, including a flipping mechanism 400, a thermocompression bonding head assembly 100, a preheating platform 210, a thermocompression bonding platform 220 and a first visual identification mechanism 300; a chip with the correct orientation is placed on the flipping mechanism 400; the thermocompression bonding head assembly 100 includes a rotation adjustment mechanism 101, a picking mechanism 102 and a first chamber 103, the rotation adjustment mechanism 101 is connected to the picking mechanism 102, and is used to adjust the rotation angle of the picking mechanism 102, the first chamber 103 is arranged on the picking mechanism 102, and the end of the picking mechanism 102 is arranged in the first chamber 103; the thermocompression bonding platform 220 or the first substrate on the thermocompression bonding platform or the second substrate of the preheating platform 210 cooperates with the first chamber 103 to form a vacuum chamber; the preheating platform 210 is arranged on the side of the thermocompression bonding platform 220, preferably in the front. The first visual recognition mechanism 300 is disposed between the flip mechanism 400 and the thermocompression bonding platform 220. The first visual recognition mechanism 300 is electrically connected to the rotation adjustment mechanism 101 and is used to identify and adjust the angle of the pickup mechanism 102. The preheating platform 210 is placed on the side of the thermocompression bonding platform 220. The preheating platform 220 is a non-vacuum cavity or a vacuum cavity. Leveling is leveling after heating.

[0030] In some embodiments, a cooling platform is further disposed on the side of the thermocompression bonding platform 220 for intermediate cooling.

[0031] The second visual recognition mechanism 630 is disposed between the flipping mechanism 400 and the material supply platform 620. During operation, the material taking mechanism 610 grabs the chip from the material supply platform 620, and the second visual recognition mechanism 630 identifies the front and back of the chip and the rotation angle of the chip, and then places the chip on the flipping mechanism 400. For example, if the second visual recognition mechanism 630 identifies the chip as the back side, the chip is placed on the second table of the flipping mechanism 400, and after the rotation of the rotating shaft,

[0032] Place it on the first table, and then pick it up by the chip thermal compression bonding device 100. That is, the material picking mechanism 610, the material feeding platform 620, the second visual recognition mechanism 630, the flip mechanism 400, the first visual recognition mechanism 300, and the thermal compression bonding platform 220 are arranged in sequence.

[0033] In some embodiments, a nitrogen protection device is provided in the preheating platform 210. The nitrogen protection device includes a nitrogen pipe or a nitrogen protection device for reducing cavity shock.

[0034] In some embodiments, a leveling device is provided in the preheating platform 210. The leveling device includes a leveling device of a sensor.

[0035] In some embodiments, the thermocompression bonding head assembly 100 further includes a first temperature control mechanism, which is heat-conducting with the pickup mechanism 102 to control the temperature of the pickup mechanism 102 .

[0036] In some embodiments, the thermal compression bonding head assembly 100 further includes a vacuum pumping mechanism, which is connected to the first chamber 103 and is used to vacuum the first chamber 103 .

[0037] In some embodiments, the thermal compression bonding head assembly 100 further includes a gas filling mechanism, which is connected to the first chamber and is used to fill the first chamber 103 with protective gas and / or reducing gas. The protective gas is preferably nitrogen.

[0038] In some embodiments, the thermocompression bonding platform 220 includes a second temperature control mechanism, and the second temperature control mechanism is used for heat transfer of the first substrate or the second substrate.

[0039] In some embodiments, the thermocompression bonding head assembly 100 is further provided with a lifting mechanism 104, a pressure sensor and a displacement sensor. The lifting mechanism 104 of the thermocompression bonding head assembly 100 enables the pick-up mechanism 102 to drive the first chamber 103 to move closer to and away from the thermocompression bonding platform 220 in the vertical direction. The first chamber 103 is retractable relative to the pick-up mechanism 102. In the initial state, the bottom of the pick-up mechanism 102 is lower than the bottom of the first chamber 103. After the first chamber 103 forms a vacuum chamber with the preheating platform 210 or the thermocompression bonding platform 220, the bottom of the pick-up mechanism 102 is placed in the first chamber 103. The displacement sensor is used to identify the distance between the thermocompression bonding head assembly 100 and the preheating platform 210 or the thermocompression bonding platform 220, the second visual recognition mechanism 630 and the flipping mechanism 400, and the pressure sensor is used to detect the extrusion pressure between the pick-up mechanism 102 and the thermocompression bonding platform 220. Similarly, the material taking mechanism 610 includes a lifting mechanism 104, a rotation adjustment mechanism 101 and a picking mechanism 102, so as to grab the chip on the material supply platform 620 and adjust the rotation angle of the chip.

[0040] In some embodiments, a first linear moving mechanism is further included, and the thermocompression bonding platform 220 and the preheating platform 210 are slidably mounted on the first linear moving mechanism, and the first linear moving mechanism enables the thermocompression bonding platform 220 to linearly approach and move away from the thermocompression bonding head assembly 100 .

[0041] In some embodiments, a second linear moving mechanism 110 is further included, and the thermocompression bonding head assembly 100 is slidably mounted on the second linear moving mechanism 110, and the second linear moving mechanism 110 is extended and arranged in a direction in which the material picking platform 610, the first visual recognition mechanism 300 and the thermocompression bonding platform 220 are sequentially arranged;

[0042] The second linear motion mechanism 110 and the first linear motion mechanism extend in directions perpendicular to each other. The second linear motion mechanism 110 , the flip mechanism 400 , and the first visual recognition mechanism 300 are all disposed on the operating platform 600 .

[0043] In some embodiments, the first visual recognition mechanism 300 is electrically connected to the first linear motion mechanism and the second linear motion mechanism 110 to adjust the positions of the thermocompression bonding platform 220 and the thermocompression bonding head assembly 100 .

[0044] In some embodiments, a dipping mechanism 500 is further included, in which solder flux is contained, and the dipping mechanism 500 is placed between the first visual recognition mechanism 300 and the substrate platform 200. The hot press bonding head assembly 100 dips the picked-up chip into a certain amount of solder flux to effectively remove the oxidized part of the chip, thereby achieving a better bonding effect.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that it can still be used to modify the technical solutions recorded in the aforementioned embodiments, or to perform equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A thermal compression bonding device, characterized in that: It includes a flipping mechanism, a thermocompression bonding head assembly, a preheating platform, a thermocompression bonding platform and a first visual recognition mechanism; the flipping mechanism holds a chip facing the correct direction; the thermocompression bonding head assembly includes a rotation adjustment mechanism, a picking mechanism and a first chamber, the rotation adjustment mechanism is connected to the picking mechanism and is used to adjust the rotation angle of the picking mechanism, the first chamber is arranged on the picking mechanism, and the end of the picking mechanism is arranged in the first chamber; the thermocompression bonding platform or the first substrate on the thermocompression bonding platform cooperates with the first chamber to form a vacuum chamber; the preheating platform is arranged on the side of the thermocompression bonding platform, the first visual recognition mechanism is arranged between the flipping mechanism and the thermocompression bonding platform, and the first visual recognition mechanism is electrically connected to the rotation adjustment mechanism and is used to identify and adjust the angle of the picking mechanism.

2. The thermal compression bonding device according to claim 1, characterized in that: A nitrogen protection device is arranged in the preheating platform.

3. The thermal compression bonding device according to claim 1, characterized in that: The thermal compression bonding head assembly further includes a first temperature control mechanism, which is heat-transferring with the pickup mechanism to control the temperature of the pickup mechanism.

4. The thermal compression bonding device according to claim 1, characterized in that: The thermal compression bonding head assembly further includes a vacuum pumping mechanism, which is connected to the first chamber and is used to vacuum the first chamber.

5. The thermocompression bonding device according to claim 4, characterized in that: The thermal compression bonding head assembly further includes a gas charging mechanism, which is connected to the first chamber and is used to charge the first chamber with a protective gas and / or a reducing gas.

6. The thermal compression bonding device according to claim 1, characterized in that: The thermocompression bonding platform includes a second temperature control mechanism, and the second temperature control mechanism is used for heat transfer of the first substrate or the second substrate of the preheating platform.

7. The thermocompression bonding device according to claim 1, characterized in that: It also includes a first linear moving mechanism, on which the thermocompression bonding platform and the preheating platform are slidably mounted, and the first linear moving mechanism enables the thermocompression bonding platform to linearly approach and move away from the thermocompression bonding head assembly.

8. The thermocompression bonding device according to claim 7, characterized in that: It also includes a second linear moving mechanism and a material picking platform, the thermal compression bonding head assembly is slidably mounted on the second linear moving mechanism, and the second linear moving mechanism is extended and arranged along the direction in which the material picking platform, the first visual recognition mechanism and the thermal compression bonding platform are sequentially arranged; Wherein, the extension directions of the second linear motion mechanism and the first linear motion mechanism are perpendicular to each other.

9. The thermocompression bonding device according to claim 8, characterized in that: The first visual recognition mechanism is electrically connected to the first linear motion mechanism and the second linear motion mechanism, and is used to adjust the positions of the thermal compression bonding platform and the thermal compression bonding head assembly.

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