Wafer adsorption and mask bearing device

Abstract

The utility model discloses a wafer adsorption and mask bearing device, which is characterized in that an air groove sucker 1 surrounds a middle fan-shaped region 103 outside a central region 101 when being in contact with a wafer, and the middle fan-shaped region 103 generates adsorption force which is sequentially increased from inside to outside to a structure between the center and the outer edge of the wafer from the center of the wafer as the inside; through the synergistic effect of the central area, the middle fan-shaped areas and the surrounding central area, the initial stability and the position accuracy of the wafer in the adsorption process can be ensured, the adsorption force can be gradually increased from the center of the wafer to the outer edge to adapt to the possible warping of the wafer, and the wafer can be further fixed in a synergistic manner; and displacement in the follow-up treatment process is prevented. The inflatable gasket can protrude out of the adsorption surface after being inflated to form soft contact with the mask plate, so that sliding or deviation possibly occurring in the adsorption process of the mask plate is reduced, and physical stress borne by the mask plate is also reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer adsorption, in particular to a wafer adsorption and mask plate carrying device. Background Art

[0002] In the production process of the mask, quartz glass is usually used as a substrate (of course, there are other substrate materials), and a layer of metal chromium and photosensitive glue is plated on it to form a photosensitive material, the so-called blank mask. Then the designed circuit pattern will be exposed on the photosensitive glue through an electronic laser device, and the exposed area will be developed, and then the circuit pattern will be formed on the metal chromium. Finally, the mask product can be obtained by washing away the unnecessary metal layer and glue layer.

[0003] When processing wafers, masks are used in the photolithography process, which is a core step in the manufacture of semiconductor devices. The fine circuit image on the mask will be printed on the wafer. The quality and accuracy of the mask directly affects the quality of the photolithography. Therefore, it is also one of the key factors that determine the accuracy and quality of downstream products.

[0004] However, in traditional technology, ultra-thin wafers have relatively low mechanical strength due to their extremely small thickness, which means they are more susceptible to deformation due to external forces, including various mechanical operations and heat treatment steps during the manufacturing process. Wafer warping can also cause the wafer surface to be uneven, which in turn affects the uniformity and stability of the contact between it and the mask.

[0005] To this end, a wafer adsorption and mask plate carrying device is proposed. Utility Model Content

[0006] In view of this, the embodiment of the utility model hopes to provide a wafer adsorption and mask plate carrying device to solve or alleviate the technical problems existing in the prior art, that is, how to optimize the adsorption of a warped wafer and the carrying of a mask plate, and at least provide a beneficial option for this;

[0007] The technical solution of the embodiment of the utility model is implemented as follows: a wafer adsorption and mask plate carrying device, including a frame 4 in the traditional technical form and an air slot suction cup 1 arranged thereon for adsorbing and carrying the wafer. Different from the traditional technology, the improvement of the technical solution is that when the air slot suction cup 1 contacts the wafer, the adsorption surface of the air slot suction cup 1 is

[0008] A central area 101, wherein the central area 101 generates a centering adsorption force on the center of the wafer;

[0009] An intermediate sector area 103 surrounding the central area 101, wherein the intermediate sector area 103 is oriented from the center of the wafer to the inner side, and generates an adsorption force that increases from the inner side to the outer side of the structure between the center and the outer edge of the wafer;

[0010] An outer annular area 102 surrounding the middle sector area 103, wherein the outer annular area 102 generates an adsorption force on the outer edge of the wafer;

[0011] The gas-filled buffer zone 2 surrounding the outer annular zone 102 performs a bearing function on the mask.

[0012] When the optimized wafer adsorption and mask carrying device is implemented, the center of the wafer is firstly adsorbed by the central area 101 to ensure the initial stability and position accuracy of the wafer during the adsorption process.

[0013] Subsequently, the middle sector area 103 starts working. This area is designed as a sector and surrounds the central area 101. Its function is to gradually increase the adsorption force from the center of the wafer to the outer edge. Such a design can adapt to the possible warping of the wafer and better fit the wafer surface through gradually increasing adsorption force. Next, the outer annular area 102 adsorbs the outer edge of the wafer to reduce the edge warping of the wafer, and further fixes the wafer to prevent it from shifting during subsequent processing. Finally, the inflatable buffer 2 surrounds the outer annular area 102 and performs a bearing function on the mask to ensure that the mask will not be damaged by external impact or vibration during the processing.

[0014] In one embodiment, the middle sector area 103 is not a continuous area, but is composed of multiple independent adsorption units. These adsorption units are arranged in an array with the center point of the central area 101 as the axis. Each adsorption unit has an independent adsorption capacity and can independently control the size of its adsorption force according to actual needs. Such a design enables the middle sector area 103 to adapt to the warping of the wafer more flexibly, and different adsorption forces are applied by adsorption units in different positions, so as to better fit the wafer surface.

[0015] In one embodiment, each adsorption unit includes three different gas grooves: an inner gas groove 1031, a middle gas groove 1032, and an outer gas groove 1033. These gas grooves are designed to fix the wafer by vacuum adsorption. The inner gas groove 1031 is closest to the central area 101, and is mainly responsible for adsorbing the part of the wafer close to the center; the outer gas groove 1033 is located at the outermost side of the adsorption unit, and is responsible for adsorbing the outer edge of the wafer; and the middle gas groove 1032 is located between the inner gas groove and the outer gas groove, and plays a role of transition and auxiliary adsorption. In each adsorption unit, there is one inner gas groove 1031 and one outer gas groove 1033, and two middle gas grooves 1032.

[0016] In one embodiment, the air slots in the adsorption units of the middle sector area 103 are designed to have a specific size relationship.

[0017] The diameters of the middle gas groove 1032 and the outer gas groove 1033 are equal, which means that they can provide the same contact surface when adsorbing the wafer. The diameter of the inner gas groove 1031 is larger than that of the middle gas groove 1032, which means that the inner gas groove has a larger contact area to adsorb the wafer.

[0018] In one embodiment, the inflatable buffer 2 is specially designed with a V-shaped ring 201 made of rubber material. The V-shaped ring starts from the surface of the air groove suction cup 1 and gradually expands toward the mask to form a hollow cone structure. When the mask is placed on the air groove suction cup, the V-shaped ring 201 will press against the surface of the mask. Due to the elasticity and softness of the rubber material, the V-shaped ring can fit tightly on the surface of the mask, thereby forming a stable support and buffer structure.

[0019] In one embodiment, in addition to the V-shaped ring 201, an inner pressure ring 202, an inflatable gasket 204 and an outer pressure ring 203 are also provided. These three parts are all annular, and the diameters are arranged in order from small to large. The inflatable gasket 204 is made of rubber material and has good elasticity and durability.

[0020] The inner pressure ring 202 and the outer pressure ring 203 are respectively connected to the inner and outer sides of the inflatable gasket 204, and their existence realizes the elastic force storage of the inflatable gasket 204. This means that when the inflatable gasket 204 is in a non-inflated state, the inner and outer pressure rings will exert a certain pressure on it to keep it in a tightly fitted state.

[0021] In one embodiment, it also includes a sealing component 3 installed at the bottom of the air groove suction cup 1 and used to prevent gas leakage and impurities from entering.

[0022] The sealing assembly 3 includes a sealing plate 302 installed on the bottom surface of the air groove suction cup 1 . The sealing plate 302 and the bottom surface of the air groove suction cup 1 are sealed and connected via a sealing ring 301 .

[0023] The sealing plate 302 is located at the bottom of the device to prevent gas leakage and external impurities from entering. The sealing ring 301 is located at the key connection part of the device to effectively prevent gas leakage and ensure that the adsorption performance of the device is stable and reliable.

[0024] The sealing plate 302 is installed on the bottom surface of the gas tank suction cup 1. As a physical barrier, its main function is to prevent gas from leaking out from the bottom of the device, and also to prevent external impurities, such as dust, water vapor, etc., from entering the device. In this way, the sealing plate 302 plays a role in protecting and maintaining the stability of the internal environment of the device.

[0025] Compared with the prior art, the beneficial effects of the utility model are:

[0026] 1. Flexibility and adaptability: The utility model uses the array adsorption unit in the middle sector area to enable the adsorption system to flexibly adjust the adsorption force according to the specific warping conditions of different wafers. The synergistic effect of the central area, the middle sector area and the surrounding central area can not only ensure the initial stability and position accuracy of the wafer during the adsorption process, but also gradually increase the adsorption force from the center of the wafer to the outer edge to adapt to the possible warping of the wafer, and can also further support and adapt the mask to prevent it from displacement during subsequent processing.

[0027] 2. Adsorption stability: The utility model significantly improves the connection stability of the mask through the design of the inflatable buffer zone, especially the V-shaped ring and the inflatable gasket. The inflatable gasket can protrude from the adsorption surface after inflation and form a soft contact with the mask, which not only reduces the possible sliding or deviation of the mask during the adsorption process, but also reduces the physical stress on the mask. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is a schematic diagram of the main viewing angle of the present utility model;

[0030] Figure 2 This is a schematic diagram of the viewing angle of the utility model, wherein the upper part shows Figure 1 The lower part shows the schematic diagram of the half-section state; the lower part shows the schematic diagram of the half-section state;

[0031] Figure 3 For the utility model Figure 2 Schematic diagram of the enlarged perspective of area A;

[0032] Figure 4 It is a three-dimensional schematic diagram from one perspective of the utility model;

[0033] Figure 5It is a schematic diagram of the rear view of the present utility model;

[0034] Figure 6 It is a three-dimensional schematic diagram from another viewing angle of the present invention.

[0035] Figure numerals: 1. air groove suction cup; 101. central area; 102. outer annular area; 103. middle fan-shaped area; 1031. inner air groove; 1032. middle air groove; 1033. outer air groove; 2. inflation buffer zone; 201. V-shaped ring; 202. inner pressure ring; 203. outer pressure ring; 204. inflation gasket; 3. sealing assembly; 301. sealing ring; 302. sealing plate; 4. frame. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model. Therefore, the utility model is not limited to the specific embodiments disclosed below;

[0037] Example:

[0038] See also Figure 1-6 This specific embodiment discloses a wafer adsorption and mask carrying device, including a frame 4 in the traditional technical form and an air slot suction cup 1 arranged thereon for adsorbing and carrying the wafer. Different from the traditional technology, the improvement of this technical solution is that when the air slot suction cup 1 contacts the wafer, the air slot suction cup 1 adsorbs the surface of the wafer.

[0039] The central area 101 generates a centering adsorption force on the center of the wafer;

[0040] The middle sector area 103 surrounding the central area 101, the middle sector area 103 is from the center of the wafer to the inner side, and generates an adsorption force that increases from the inner side to the outer side of the structure between the center and the outer edge of the wafer;

[0041] An outer annular area 102 surrounding the middle sector area 103, the outer annular area 102 generates an adsorption force on the outer edge of the wafer;

[0042] The air-filled buffer zone 2 surrounding the outer annular zone 102 performs a bearing and buffering operation on the mask.

[0043] In summary, the functional part of the overall device is in the shape of a ring. If the center point of the wafer is taken as the basis, the above-mentioned "central area 101", the middle sector area 103, the "outer annular area 102" and the "inflatable buffer area 2" are arranged in sequence. When adsorbing the wafer, adsorption starts from the central area 101 first to generate a certain adsorption force, and then the middle sector area 103 is adsorbed in sequence, so that the adsorption force increases from the inside to the outside, followed by the "outer annular area 102" adsorption, and finally the outer edge of the wafer is firmly fixed to prevent the wafer from moving or falling off during the manufacturing process. The overall adsorption method will cause the adsorption force to slowly transition from the middle to the outermost side. This adsorption method has a good adsorption effect for ultra-thin wafers with warping, which solves the difficulty of adsorbing warped wafers.

[0044] Specifically: The working principle of the device is based on the difference and control of the adsorption force in different areas to adapt to and stably adsorb ultra-thin wafers with warping. The central area 101 first fixes the center of the wafer through a strong adsorption force to ensure the accuracy of the wafer position. The middle fan-shaped area 103 uses a gradually increasing adsorption force to adapt to the warping of the wafer so that the wafer can fit more evenly on the suction cup. The outer annular area 102 focuses on fixing the outer edge of the wafer, which is the area where the wafer is most likely to shift, so special adsorption force is required to maintain stability. The inflation buffer 2 protects the mask from external impacts and reduces the impact of external factors on the stability of the wafer through the buffering effect generated by inflation.

[0045] It can be understood that in the above technical solution: this device is mainly optimized for the adsorption and carrying problems of ultra-thin wafers with warping. The adsorption method controlled by partitioning not only improves the stability of the wafer in the manufacturing process, but also effectively solves the problem that the warped wafer is difficult to stably adsorb. The centering effect of the central area 101, the gradual adsorption force of the middle fan-shaped area 103, the outer edge fixation of the outer annular area 102, and the bearing and buffering function of the air-filled buffer area 2 together constitute an efficient and stable wafer adsorption and carrying system. This system has significant advantages and practicality in the semiconductor manufacturing process, especially when dealing with ultra-thin and easily warped wafers.

[0046] The wafer may have different degrees of warpage, so the adsorption units at different positions need to apply different adsorption forces to ensure that the wafer can be stably adsorbed; for this reason, in the technical solution provided in this embodiment, please refer to Figure 1 , 4 The middle sector area 103 is composed of a plurality of adsorption units with the center point of the central area 101 as the axis.

[0047] Specifically: The principle of this design is to use multiple independent adsorption units to simulate a continuous adsorption surface. By accurately controlling the adsorption force of each adsorption unit, accurate bonding to the wafer surface can be achieved. Since the wafer may have different degrees of warping, the adsorption units at different positions need to apply different adsorption forces to ensure that the wafer can be stably adsorbed. By arranging the adsorption units in an array, the distribution of adsorption force can be more accurately controlled, thereby better adapting to the shape and warping of the wafer.

[0048] It is understandable that in the above technical solution: through multiple independently controlled adsorption units, the shape of the wafer can be more accurately fitted, reducing the problem of unstable adsorption caused by wafer warping. At the same time, this design can also adjust the adsorption force at different positions according to actual needs to cope with wafers of different shapes and degrees of warping. This flexibility allows the device to perform well when processing wafers of various shapes and qualities, thereby improving the yield and efficiency of semiconductor manufacturing.

[0049] In the technical solution provided in this embodiment, please refer to Figure 1 , 4 In each adsorption unit, the middle sector area 103 generates an adsorption force on the outer edge of the wafer by opening an air slot unit; the air slot unit includes a vacuum adsorption unit,

[0050] The inner air groove 1031 closest to the central area 101;

[0051] The outer air groove 1033 farthest from the central area 101;

[0052] A middle gas groove 1032 between the inner gas groove 1031 and the outer gas groove 1033;

[0053] Preferably, the number of the inner air groove 1031 and the outer air groove 1033 is 1, and the number of the middle air groove 1032 is 2.

[0054] The principle of this design is to generate vacuum adsorption forces of different strengths through air grooves at different positions to adapt to the warping of different positions of the wafer. The inner air groove 1031 can have a relatively small adsorption force because it is close to the center to adapt to the smaller warping of the center part of the wafer; while the outer air groove 1033 needs to generate a larger adsorption force to firmly fix the outer edge of the wafer to prevent it from moving or falling off; the middle air groove 1032 plays a transition role to ensure a smooth transition of adsorption force from the inside to the outside to avoid stress or deformation of the wafer due to sudden changes in adsorption force.

[0055] It should be pointed out that in the above technical solution: since the wafer may warp to varying degrees during the manufacturing process, vacuum adsorption forces of different strengths can be generated by setting air grooves at different positions. Since the inner air groove 1031 is close to the center of the wafer, the wafer warping here is usually small, so it is sufficient to set an air groove and apply a relatively small adsorption force. The outer air groove 1033 is located at the outer edge of the wafer, where the warping may be more serious and requires a stronger adsorption force to fix it, so an air groove is also set but the adsorption force generated is larger. Such a layout helps to better adapt to the warping of the wafer.

[0056] Preferably, considering that if the adsorption force from the center to the outer edge of the wafer is kept in a uniform and smoothly changing posture, the stress concentration or deformation of the wafer caused by the sudden change of the adsorption force can be effectively avoided, two middle air grooves 1032 are provided, which are located between the inner air groove and the outer air groove, and play a role in smoothly transitioning the adsorption force. Because the design of the two middle air grooves makes the transition of the adsorption force smoother, it helps to maintain the flatness and stability of the wafer.

[0057] It is understandable that in the above technical solution: through the precisely designed gas slot structure and the control of the vacuum adsorption force, it is possible to achieve precise adsorption of different positions of the wafer and effectively deal with the problem of wafer warping. At the same time, this design can also ensure that the wafer maintains stability and flatness during processing, thereby improving the accuracy and efficiency of semiconductor manufacturing. In addition, the design also has a certain degree of flexibility and adjustability, and can be adjusted and optimized according to the shape and degree of warping of different wafers.

[0058] In the above technical solution, the inner gas groove 1031 is close to the center of the wafer, so it can be further optimized to achieve a relatively uniform adsorption force to stabilize the central part of the wafer; for this purpose, in the technical solution provided in this embodiment, please refer to Figure 1 , 4 : The diameters of the middle gas groove 1032 and the outer gas groove 1033 are equal, and the diameter of the inner gas groove 1031 is larger than that of the middle gas groove 1032.

[0059] Specifically: The design principle of the gas groove diameter is mainly based on the characteristics of wafer warpage and the need for adsorption stability. Since the warpage of the center of the wafer is usually smaller, the larger diameter of the inner gas groove 1031 can provide a more stable adsorption force to ensure that the center of the wafer is firmly fixed. The design of equal diameters of the middle gas groove 1032 and the outer gas groove 1033 is to maintain the uniformity of adsorption force, especially at the outer edge of the wafer, which can effectively prevent the wafer from moving or falling off during processing.

[0060] It should be pointed out that in the above technical solution: considering that the diameters of the middle gas groove 1032 and the outer gas groove 1033 are equal, and the diameter of the inner gas groove 1031 is larger than that of the middle gas groove 1032, combined with the technical solution mentioned above that the number of the inner gas groove 1031 and the outer gas groove 1033 is 1 each, and the number of the middle gas groove 1032 is 2, the following technical effects are further brought about:

[0061] 1) Optimize the adsorption force distribution: The inner gas groove 1031 has a larger diameter, which means that it covers a wider adsorption area, but because there is only one and it is close to the center of the wafer, a relatively uniform adsorption force can be applied to stabilize the center of the wafer. The middle gas groove 1032 and the outer gas groove 1033 have the same diameter, but there are more middle gas grooves. They work together to form more dense adsorption points on the periphery of the wafer, thereby enhancing the fixation effect on the edge of the wafer. This layout optimizes the distribution of adsorption force, so that the wafer can be stably supported from the center to the edge.

[0062] 2) Improve edge fixation effect: Since the middle air groove 1032 and the outer air groove 1033 have the same diameter and are closely arranged, this design is particularly conducive to enhancing the adsorption force of the wafer edge. The edge part is the area where the wafer is most likely to warp and break, so by increasing the number of adsorption points in the edge area, the wafer can be more effectively fixed and the risk of movement or damage during processing can be reduced.

[0063] 3) Reduce stress concentration: For wafers of different specifications or process parameters, technicians can design different diameters and numbers of air slots to more finely control the adsorption force of different areas of the wafer, thereby reducing stress concentration caused by uneven adsorption force. This design helps maintain the integrity of the wafer and avoid cracks or breakage during processing.

[0064] It is understandable that in the above technical solution: the larger diameter of the inner gas groove 1031 ensures stable adsorption of the center part of the wafer, while the equal diameter design of the middle gas groove 1032 and the outer gas groove 1033 ensures uniform adsorption of the outer edge of the wafer. Such a design not only adapts to the possible warping of the wafer, but also improves the reliability and efficiency of the entire adsorption process. In the semiconductor manufacturing process, this precise gas groove size design is crucial to ensure the accuracy and quality of wafer processing.

[0065] In the above technical solution, considering that the wafer may slide or deflect during the adsorption process, in the technical solution provided in this embodiment, please refer to Figures 1 to 3 The inflatable buffer zone 2 includes a V-shaped ring 201 made of rubber material. The V-shaped ring 201 is a hollow cone structure from small to large from one side of the air groove suction cup 1 to the opposite side of the mask plate. The V-shaped ring 201 presses against the wafer.

[0066] It can be understood that the main function of the V-ring 201 is to enhance the adsorption force of the air slot suction cup to prevent the mask from sliding or deflecting during the adsorption process, thereby making the operation of the mask more stable.

[0067] Specifically: The design principle of the V-ring 201 is to use the elasticity and softness of the rubber material to enhance the adsorption force of the air slot suction cup. When the mask plate is matched with the air slot suction cup, the corresponding V-ring 201 will be compressed and tightly fit on the surface of the mask plate. This tight fit not only increases the friction between the mask plate and the air slot suction cup 1, thereby preventing the mask plate from sliding or shifting during the adsorption process, but also provides an additional buffer layer to absorb external shocks and vibrations, further protecting the mask plate and wafer from damage;

[0068] Furthermore, the V-ring 201 is installed in the annular groove, and protrudes from the surface of the suction cup when not in operation. When the wafer is adsorbed, it will be pressed into the annular groove and below the surface of the suction cup;

[0069] It is understandable that in the above technical solution: the V-ring 201 prevents the mask from sliding or shifting during the adsorption process by increasing the friction force, thereby improving the stability of the adsorption of the mask and the wafer. Secondly, the V-ring 201 acts as a buffer layer, which can effectively absorb external shocks and vibrations and protect the mask from damage. In addition, the design of the V-ring 201 also makes the mask and the wafer more evenly stressed during the adsorption process, avoiding the problem of stress concentration.

[0070] In the technical solution provided in this embodiment, please refer to Figures 1 to 3 : The inflatable buffer zone 2 includes an inner pressure ring 202, an inflatable gasket 204 and an outer pressure ring 203 which are arranged outside the V-shaped ring 201, are all annular, and have diameters from small to large. The inflatable gasket 204 is made of rubber material;

[0071] The inner pressure ring 202 and the outer pressure ring 203 are respectively connected to the inner and outer sides of the inflatable gasket 204 and realize elastic force storage of the inflatable gasket 204;

[0072] When the inflatable gasket 204 is inflated, its size enables it to protrude from the adsorption surface of the air slot suction cup 1 , so that the mask plate and the air slot suction cup 1 are in soft contact.

[0073] The inner pressure ring 202 and the outer pressure ring 203 are located inside and outside the inflatable gasket 204. By applying pressure, the inflatable gasket 204 is tightly fitted on the air slot suction cup. When the mask needs to be carried, the inflatable gasket 204 will inflate and protrude from the adsorption surface of the air slot suction cup, allowing the mask to have soft contact with the adsorption cup, thereby protecting the working area of ​​the mask and reducing the wear of the mask.

[0074] Specifically, due to the effect of inflation, the size of the inflatable gasket 204 will become larger, so that it protrudes from the adsorption surface of the air slot suction cup 1. In this way, when the mask is placed on the air slot suction cup, it will first contact the inflatable gasket 204, achieving the above-mentioned soft contact effect.

[0075] It is understandable that in the above technical solution, the inner pressure ring 202, the outer pressure ring 203 and the inflatable gasket 204, when working together, can:

[0076] 1) Buffering and protection: After being inflated, the inflatable gasket 204 provides a soft supporting surface for the mask, effectively buffering the hard contact between the mask and the air slot suction cup, thereby protecting the working area of ​​the mask and reducing the wear caused by hard contact.

[0077] 2) Enhanced stability: The design of the inner and outer pressure rings enables the inflatable gasket 204 to fit tightly on the air slot suction cup even in a non-inflated state, thereby enhancing overall stability. At the same time, when the inflatable gasket 204 is inflated, it can better adapt to the shape of the mask, further improving stability.

[0078] 3) Flexibility and adjustability: By controlling the inflation amount of the inflatable gasket 204, its support strength and contact area on the mask can be flexibly adjusted to accommodate masks of different sizes and weights.

[0079] It can be understood that this design not only improves the stability and reliability of the mask during the processing, but also effectively extends the service life of the mask, which is of great significance for mask processing in the semiconductor manufacturing process.

[0080] In the technical solution provided in this embodiment, please refer to Figure 2 , 5 ~6: It also includes a sealing component 3 installed at the bottom of the air groove suction cup 1 and used to prevent gas leakage and impurities from entering.

[0081] The sealing assembly 3 includes a sealing plate 302 mounted on the bottom surface of the air groove suction cup 1 . The sealing plate 302 and the bottom surface of the air groove suction cup 1 are sealed and connected via a sealing ring 301 .

[0082] The sealing plate 302 is located at the bottom of the device to prevent gas leakage and external impurities from entering. The sealing ring 301 is located at the key connection part of the device to effectively prevent gas leakage and ensure that the adsorption performance of the device is stable and reliable.

[0083] The sealing plate 302 is installed on the bottom surface of the gas tank suction cup 1 as a physical barrier. Its main function is to prevent gas from leaking out from the bottom of the device, and also to prevent external impurities, such as dust, water vapor, etc., from entering the device. In this way, the sealing plate 302 plays a role in protecting and maintaining the stability of the internal environment of the device.

[0084] It is understandable that the sealing ring 301 is installed between the sealing plate 302 and the bottom surface of the air slot suction cup 1, and its function is to form a tight, airtight connection between the two. Due to the presence of the sealing ring 301, the gas cannot leak out through the gap between the sealing plate 302 and the air slot suction cup 1, thereby ensuring that the adsorption performance of the device can be stably and reliably exerted.

[0085] It should be pointed out that in the above technical solution: the addition of the sealing component 3 greatly improves the sealing and stability of the device. First, the sealing plate 302 acts as a physical barrier to effectively prevent the leakage of gas and the entry of external impurities, thereby protecting the internal environment of the device. Secondly, the sealing ring 301 further enhances the sealing of the device. It prevents gas leakage by filling the gap between the sealing plate 302 and the gas tank suction cup 1, thereby ensuring that the device can work stably and reliably.

[0086] In the technical solution of this embodiment, the process parameters of all the "rubber materials" mentioned above are as follows:

[0087] 1) The material is static dissipative silicone rubber, and the surface resistivity of the material is 10^5-10^9·ohm / sq;

[0088] 2) Material hardness (HS): 50±5.

[0089] In summary, in view of the related problems in the traditional technology, this specific implementation method is based on the wafer adsorption and mask plate carrying device provided above, and adopts the following technical means or features to achieve the solution:

[0090] 1) Design of array adsorption unit in the middle sector 103:

[0091] By designing the middle sector 103 to be composed of multiple independent adsorption units, each adsorption unit can independently control the adsorption force. This design allows the adsorption surface to adapt to the warping of the wafer more flexibly. When the wafer is warped, the adsorption units at different positions can apply different adsorption forces based on manual control by the staff, so as to better fit the wafer surface, solving the problem of unstable adsorption in traditional technology.

[0092] 2) Design of air tank unit:

[0093] Each adsorption unit has an air slot unit inside, including an inner air slot 1031, a middle air slot 1032, and an outer air slot 1033. These air slots are designed to fix the wafer by vacuum adsorption. The inner air slot is close to the center area and is mainly responsible for adsorbing the part of the wafer close to the center; the outer air slot is responsible for adsorbing the outer edge of the wafer; the middle air slot plays a role of transition and auxiliary adsorption. This design allows the adsorption force to be more evenly distributed on the wafer, thereby better adapting to the warping of the wafer.

[0094] 3) Introduction of inflation buffer zone 2:

[0095] The inflatable buffer 2 includes components such as a V-ring 201, an inner pressure ring 202, an inflatable gasket 204, and an outer pressure ring 203. The design of these components not only enhances the adsorption force of the air slot suction cup, but also prevents the mask and wafer from sliding or shifting during the adsorption process. In particular, the inflatable gasket 204 can protrude from the adsorption surface of the air slot suction cup after being inflated, achieving soft contact with the mask, further protecting the mask and improving the stability of adsorption.

[0096] The above embodiments only express the implementation methods of the relevant practical applications of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer adsorption and mask carrying device, comprising a frame (4) and an air slot suction cup (1) arranged thereon for adsorbing and carrying the wafer, characterized in that: When the air slot suction cup (1) is in contact with the wafer, the suction surface of the air slot suction cup (1) A central area (101), the central area (101) generating a centering adsorption force on the center of the wafer; An intermediate sector area (103) surrounding the central area (101), the intermediate sector area (103) being located from the center of the wafer and generating an adsorption force on the wafer that increases from the inside to the outside; An outer annular area (102) surrounding the middle sector area (103), the outer annular area (102) generating an adsorption force on the outer edge of the wafer; An air-filled buffer zone (2) surrounding the outer annular zone (102) is configured to support the mask.

2. The carrying device according to claim 1, characterized in that: The middle sector area (103) is composed of a plurality of adsorption units with the center point of the central area (101) as the axis.

3. The carrying device according to claim 2, characterized in that: In each of the adsorption units, the middle sector area (103) generates adsorption force on the outer edge of the wafer by opening an air slot unit; the air slot unit comprises: An inner air groove (1031) closest to the central area (101); An outer air groove (1033) farthest from the central area (101); a middle air groove (1032) between the inner air groove (1031) and the outer air groove (1033); The number of the inner air grooves (1031) and the number of the outer air grooves (1033) are equal, and the number of the middle air grooves (1032) is at least twice that of the inner air grooves (1031).

4. The carrying device according to claim 3, characterized in that: The diameters of the middle air groove (1032) and the outer air groove (1033) are equal, and the diameter of the inner air groove (1031) is larger than that of the middle air groove (1032).

5. The carrying device according to claim 1, characterized in that: The inflatable buffer zone (2) comprises a V-shaped ring (201) made of rubber material, the V-shaped ring (201) presenting a hollow conical structure from small to large from one side of the air groove suction cup (1) to the opposite side of the mask, and the V-shaped ring (201) abuts against the mask.

6. The carrying device according to claim 1, 2 or 5, characterized in that: The inflatable buffer zone (2) comprises an inner pressure ring (202), an inflatable gasket (204) and an outer pressure ring (203), all of which are annular and arranged in ascending order of diameter and made of rubber material; The inner pressure ring (202) and the outer pressure ring (203) are respectively connected to the inner and outer sides of the inflatable gasket (204) and realize elastic force storage for the inflatable gasket (204); When the inflatable gasket (204) is inflated and bulged, its size enables it to protrude from the adsorption surface of the air slot suction cup (1), allowing the mask to be in soft contact with the air slot suction cup (1).

7. The carrying device according to claim 1, 2 or 5, characterized in that: It also includes a sealing component (3) installed at the bottom of the gas groove suction cup (1) and used to prevent gas leakage and impurities from entering.

8. The carrying device according to claim 7, characterized in that: The sealing assembly (3) comprises a sealing plate (302) mounted on the bottom surface of the air groove suction cup (1); the sealing plate (302) and the bottom surface of the air groove suction cup (1) are sealingly connected via a sealing ring (301).

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