Die bonder with positionable die bonding head

Abstract

The utility model discloses a die bonder with a positionable die bonding head, which relates to the technical field of semiconductor die bonders and comprises a case, a dispensing assembly and a die bonding assembly, a lifting frame is mounted on the outer wall of the case, a material supporting table of the lifting frame is mounted with a material box, a tray is mounted in the material box in a sliding manner, and a material pushing frame is mounted on the side surface of the material box. According to the die bonder with the positionable die bonding head, the overview camera is adopted, the position of a picked wafer, the position of a wafer to be placed and the position of glue dispensing can be accurately positioned, the wafer can be accurately moved to the position under the wafer suction assembly according to information fed back by visual positioning during motion control, the linear motor is started to drive the suction nozzle body to move downwards to abut against the wafer, and therefore the wafer can be accurately positioned. And an electromagnetic valve at the die bonding assembly is connected with an external negative pressure element, so that after the wafer is sucked, the wafer sucked by negative pressure can be driven to move when the wafer suction assembly moves upwards, and a die bonding head of the die bonder can be ensured to have an accurate positioning effect through the wafer suction assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor crystal bonding machines, in particular to a crystal bonding machine with a positionable crystal bonding head. Background Art

[0002] The die bonder is a semiconductor packaging machine that fixes the crystal. It is mainly used for the lead frame pressing plate of various gold wire ultrasonic welding equipment, as well as various chip mounting equipment, spare parts, instruments, meters, etc. of automation equipment. When in use, the die bonder accurately places the components to be mounted on the component pads by moving the crystal suction assembly, and the semiconductor devices are fixed to the substrate with conductive silver paste or non-conductive glue through the die bonder.

[0003] When an existing die bonder removes a wafer through a die bonder head, a single die bonder head assembly is usually used to use the negative pressure adsorption effect to suck the wafer assembly and move it. However, the conventional wafer suction assembly lacks positioning of the die bonder head assembly, which causes the die bonder to lack accuracy when sucking the wafer assembly. Therefore, we propose a die bonder with a positionable die bonder head. Utility Model Content

[0004] The utility model aims to provide a die bonding machine with a positionable die bonding head, so as to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: a die bonding machine with a positionable die bonding head, comprising a chassis, a dispensing component and a die bonding component,

[0006] The outer wall of the chassis is installed with a lifting frame, the material support platform of the lifting frame is installed with the material box, the interior of the material box is slidably loaded with a tray, the side of the material box is installed with a pushing frame, the interior of the chassis is connected with a rear conveying platform and a front conveying platform through slide rails, a workbench is arranged on the inner side of the chassis, and transverse magnetic linear slide rails are symmetrically fixed on both sides of the top of the workbench, and parallel forward magnetic linear slide rails are arranged on the upper sides of the two groups of transverse magnetic linear slide rails;

[0007] The two groups of forward magnetic linear slides are connected to the sides close to each other with a dispensing assembly and a solid crystal assembly respectively, and the sides of the transverse magnetic linear slide and the forward magnetic linear slide are installed with positive and negative magnet block slides arranged in parallel, and the dispensing assembly and the solid crystal assembly are connected to the positive and negative magnet block slides on the sides of the forward magnetic linear slide through limit blocks, and the side walls of the dispensing assembly and the solid crystal assembly are welded with supports, and an overview camera is plugged into the middle of the supports. A positioning table is provided on the workbench surface of the chassis, and the positioning table is position-adjusted by a transverse sliding module and a forward sliding module. A plurality of wafer boxes are provided on one side of the positioning table, and a correction camera is installed on the side of the positioning table close to the wafer box.

[0008] Preferably, a crystal suction component is further provided on the side of the crystal fixing component close to the overview camera, and the crystal suction component includes a mounting module, a seat frame and a linear motor. The mounting module is arranged on one side of the support, three sets of seat frames are installed on the surface of the mounting module, and a linear motor is installed on the upper side of the seat frame.

[0009] Preferably, a voice coil motor is disposed in the middle of the seat frame, an air pipe adapter is disposed inside the voice coil motor, and a nozzle assembly is connected to the bottom of the air pipe adapter.

[0010] Preferably, a nozzle body is installed in the middle of the nozzle assembly.

[0011] Preferably, a rack rail and a translational slide rail are also installed on the workbench of the chassis, and the rear conveying platform and the front conveying platform are slidably connected to the translational slide rail through a sliding block at the bottom, and a servo motor is installed on the side of the rear conveying platform and the front conveying platform, and the output end of the servo motor is connected to a gear meshing with the rack rail.

[0012] Preferably, a conveyor casing is embedded and connected to the upper sides of the rear conveyor platform and the front conveyor platform, and conveyor toothed belts are arranged on both sides of the conveyor casing, and a driving motor is arranged in the middle of the outer side of the conveyor casing.

[0013] Preferably, the output gear roller of the driving motor is meshedly connected with the conveyor toothed belt, an auxiliary roller abutting against the conveyor toothed belt is arranged in the middle of the conveyor housing, and a vacuum suction cup is also fixed in the middle of the conveyor housing.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the crystal bonding machine with a positionable crystal bonding head adopts an overview camera to accurately locate the position of picking up the wafer and the position of the wafer to be placed and the position of dispensing glue, and during motion control, according to the information fed back by visual positioning, the wafer can be accurately moved to the bottom of the crystal suction component, and the linear motor is started to drive the suction nozzle body to move down to abut against the wafer, and then the solenoid valve at the crystal bonding component is connected to the external negative pressure element, so that after sucking the wafer, the wafer sucked by the negative pressure can be driven to move when the crystal suction component moves up, and the crystal suction component can ensure that the crystal bonding head of the crystal bonding machine has the effect of precise positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model after the viewing angle is changed;

[0017] Figure 3 It is a three-dimensional exploded structural diagram of the crystal bonding component of the utility model;

[0018] Figure 4It is a schematic diagram of the three-dimensional structure of the rear conveying platform and the front conveying platform combined in the utility model;

[0019] Figure 5 This is a schematic diagram of the main structure of the front conveyor platform of the utility model;

[0020] Figure 6 It is a schematic diagram of the three-dimensional structure of the front conveying platform of the utility model.

[0021] In the figure: 1. chassis; 2. lifting frame; 3. material box; 4. material pusher; 5. rear conveyor; 51. front conveyor; 501. servo motor; 502. gear; 503. rack; 504. conveyor belt; 505. drive motor; 506. auxiliary roller; 507. vacuum suction cup; 6. horizontal magnetic linear slide; 7. forward magnetic linear slide; 8. dispensing assembly; 81. crystal fixing assembly; 82. limit block; 9. crystal suction assembly; 901. installation module; 902. seat frame; 903. linear motor; 904. voice coil motor; 905. nozzle assembly; 906. nozzle body; 907. support; 908. overview camera; 10. positioning table; 11. wafer box; 12. tray; 13. calibration camera. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 3 The utility model provides a technical solution: a crystal bonding machine with a positionable crystal bonding head, comprising a chassis 1, a dispensing assembly 8 and a crystal bonding assembly 81, a lifting frame 2 is installed on the outer wall of the chassis 1, a material support platform of the lifting frame 2 is installed with a material box 3, a tray 12 is slidably loaded inside the material box 12, a material pusher 4 is installed on the side of the material box 3, a rear conveying platform 5 and a front conveying platform 51 are connected to the inside of the chassis 1 through a slide rail, a workbench is arranged on the inner side of the chassis 1, and transverse magnetic linear slide rails 6 are symmetrically fixed on both sides of the top of the workbench, and parallel forward magnetic linear slide rails 7 are arranged on the upper sides of the two groups of transverse magnetic linear slide rails 6;

[0024] The two sets of forward magnetic linear slides 7 are connected to the sides close to each other with a glue dispensing component 8 and a crystal fixing component 81 respectively. The sides of the transverse magnetic linear slide 6 and the forward magnetic linear slide 7 are installed with parallel arranged positive and negative magnet block slides. The glue dispensing component 8 and the crystal fixing component 81 are connected to the positive and negative magnet block slides on the sides of the forward magnetic linear slide 7 through the limit block 82. The side walls of the glue dispensing component 8 and the crystal fixing component 81 are welded with a support 907. The middle of the support 907 is plugged with an overview camera 908. The overview camera 908 uses a 2D camera or a 3D camera. D camera, 3D camera can detect the height of glue dispensing and crystal suction, a positioning table 10 is arranged on the workbench surface of the chassis 1, and the positioning table 10 is adjusted in position by a lateral sliding module and a forward sliding module to ensure that the positioning table 10 can drive the chip to adjust its position and ensure that the patch processing is more accurate. A plurality of wafer boxes 11 are arranged on one side of the positioning table 10, and a correction camera 13 is installed on the side of the positioning table 10 close to the wafer box 11. By arranging the correction camera 13 on the positioning table 10, the position of the positioning table 10 can be adjusted during the patch processing.

[0025] In specific implementation, the lifting frame 2 is started to drive the material box 3 to move up and down, so that the opening side of the material box 3 is aligned with the position of the front conveying platform 51, and then the pusher 4 pneumatically pushes the tray 12 in the material box 3 to the front conveying platform 51;

[0026] By starting the two sets of lateral magnetic linear slides 6 to move synchronously, the two sets of parallel forward magnetic linear slides 7 can be driven to move synchronously, thereby driving the dispensing assembly 8 and the solid crystal assembly 81 to reciprocate in the lateral direction, ensuring the synchronous dispensing and crystal suction operations, and by starting the forward magnetic linear slide 7, the dispensing assembly 8 and the solid crystal assembly 81 can be driven to reciprocate in the forward direction, and the forward magnetic linear slide 7, the dispensing assembly 8 and the solid crystal assembly 81 can be driven to move smoothly through the positive and negative magnet block slides;

[0027] By placing a circular crystal disk in the middle of the positioning table 10, the horizontal magnetic linear slide 6 and the forward magnetic linear slide 7 can drive the solid crystal component 81 to move in the horizontal and forward directions to approach the wafer box 11, and then the crystal suction component 9 at the bottom of the solid crystal component 81 absorbs the components in the wafer box 11 and sends them to the circular crystal disk for chip processing. At the same time, the horizontal magnetic linear slide 6 and the forward magnetic linear slide 7 can drive the glue dispensing component 8 to move in multiple directions, so that the components in the tray 12 can be glued.

[0028] See also Figure 2 and Figure 3A crystal suction component 9 is also provided on the side of the crystal fixing component 81 close to the overview camera 908. The crystal suction component 9 includes a mounting module 901, a seat frame 902 and a linear motor 903. The mounting module 901 is arranged on one side of the support 907. Three groups of seat frames 902 are installed on the surface of the mounting module 901. The linear motor 903 is installed on the upper side of the seat frame 902. A voice coil motor 904 is arranged in the middle of the seat frame 902. An air pipe adapter is arranged inside the voice coil motor 904, and a nozzle assembly 905 is connected to the bottom of the nozzle assembly 905. A nozzle body 906 is installed in the middle of the nozzle assembly 905.

[0029] In specific implementation, when the dispensing assembly 8 and the die-bonding assembly 81 are in use, the overview camera 908 in the support 907 provides visual assistance for the operation of the dispensing assembly 8 and the die-bonding assembly 81, so that the dispensing operation and the die-bonding operation can be positioned. The overview camera 908 can accurately locate the position of the wafer to be picked up and the position of the wafer to be placed and the dispensing position. During motion control, according to the information of the visual positioning feedback, the wafer can be accurately moved to the bottom of the dispensing assembly 8 and the die-bonding assembly 81;

[0030] The three suction nozzle assemblies 905 are mounted on the surface of the mounting module 901, and the linear motor 903 is started to drive the screw in the middle to rotate, so that the suction nozzle assembly 905 can follow the movement along the seat frame 902, so that the suction nozzle assembly 905 and the suction nozzle body 906 move downward, so that the suction nozzle body 906 abuts against the wafer, and then the joint at the top of the linear motor 903 is connected to the external negative pressure element, and the air is sucked into the suction nozzle assembly 905 through the air pipe adapter in the voice coil motor 904, so that the suction nozzle body 906 sucks the wafer. After the wafer is sucked, the linear motor 903 is started to drive the suction nozzle assembly 905 to move upward, so that the suction nozzle body 906 can drive the wafer sucked by the negative pressure to move when moving upward, and the wafer suction component 9 is provided to ensure that the suction of the wafer has a precise positioning effect;

[0031] When the glue suction pump assembly on one side of the glue dispensing assembly 8 is started, the conductive glue can be applied to the components when the solenoid valve is opened.

[0032] See also Figure 4 , Figure 5 and Figure 6 A rack 503 and a translation rail are also installed on the workbench of the chassis 1. The rear conveying platform 5 and the front conveying platform 51 are slidably connected to the translation rail through the sliding block at the bottom. A servo motor 501 is installed on the side of the rear conveying platform 5 and the front conveying platform 51. The output end of the servo motor 501 is connected to a gear 502 meshing with the rack 503;

[0033] The upper sides of the rear conveyor platform 5 and the front conveyor platform 51 are both embedded and connected with a conveyor casing, and conveyor toothed belts 504 are arranged on both sides of the conveyor casing, a driving motor 505 is arranged in the middle of the outer side of the conveyor casing, and the output toothed roller of the driving motor 505 is meshed and connected with the conveyor toothed belt 504, an auxiliary roller 506 abutting against the conveyor toothed belt 504 is arranged in the middle of the conveyor casing, and a vacuum suction cup 507 is also fixed in the middle of the conveyor casing.

[0034] In specific implementation, when components are conveyed to the front conveyor platform 51 following the tray 12, both sides of the tray 12 will overlap on the top of the conveyor toothed belt 504. When the driving motor 505 of the front conveyor platform 51 is running, the tray 12 can be driven forward by the cooperation of the auxiliary roller 506 and the conveyor toothed belt 504. When the servo motor 501 is started to drive the gear 502 to mesh with the rack 503 for transmission, the front conveyor platform 51 can be moved toward the rear conveyor platform 5. When the two sets of conveyor toothed belts 504 are running at the same time, the tray 12 on the front conveyor platform 51 can be conveyed to the rear conveyor platform 5. By moving the front conveyor platform 51 and the rear conveyor platform 5 along the rack 503, it can be ensured that the front conveyor platform 51 and the rear conveyor platform 5 can reciprocate and adjust their positions. When the tray 12 is overlapped on the front conveyor platform 51 and the rear conveyor platform 5, the tray 12 can be adsorbed by starting the vacuum suction cup 507 to ensure the stability of the tray 12 so that it will not shake or shift.

[0035] To summarize, by starting the lifting frame 2 to drive the material box 3 to move up and down, and then using the pushing frame 4 to push the tray 12 in the material box 3 to the front conveying table 51, by starting the two sets of horizontal magnetic linear slides 6 to move synchronously, the two sets of parallel forward magnetic linear slides 7 can be driven to move synchronously, thereby driving the glue dispensing component 8 and the solid crystal component 81 to perform glue dispensing on the components in the tray 12, and the solid crystal component 81 absorbs the glued components and sends them to the circular crystal disk of the positioning table 10 to complete the patch processing. The contents not described in detail in this description belong to the existing technology known to professional and technical personnel in this field.

[0036] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A die bonding machine with a positionable die bonding head, comprising a chassis (1), a glue dispensing component (8) and a die bonding component (81), characterized in that: The outer wall of the chassis (1) is installed with a lifting frame (2), the material support platform of the lifting frame (2) is installed with a material box (3), the interior of the material box (3) is slidably loaded with a tray (12), the side of the material box (3) is installed with a pushing frame (4), the interior of the chassis (1) is connected with a rear conveying platform (5) and a front conveying platform (51) through slide rails, the inner side of the chassis (1) is provided with a workbench, and transverse magnetic linear slide rails (6) are symmetrically fixed on both sides of the top of the workbench, and parallel forward magnetic linear slide rails (7) are arranged on the upper sides of the two groups of transverse magnetic linear slide rails (6); The two groups of forward magnetic linear slide rails (7) are connected to a glue dispensing assembly (8) and a crystal fixing assembly (81) on the sides close to each other, and the sides of the transverse magnetic linear slide rail (6) and the forward magnetic linear slide rail (7) are both installed with positive and negative pole magnet block slideways arranged in parallel, and the glue dispensing assembly (8) and the crystal fixing assembly (81) are connected to the positive and negative pole magnet block slideways on the sides of the forward magnetic linear slide rail (7) through a limit block (82), and the glue dispensing assembly (8) and the crystal fixing assembly (81) are connected to the positive and negative pole magnet block slideways on the sides of the forward magnetic linear slide rail (7). The side walls of the component (81) are welded with a support (907), the middle of the support (907) is plugged with an overview camera (908), the workbench surface of the chassis (1) is provided with a positioning platform (10), the position of the positioning platform (10) is adjusted by a lateral sliding module and a forward sliding module, a plurality of wafer boxes (11) are provided on one side of the positioning platform (10), and a correction camera (13) is installed on the side of the positioning platform (10) close to the wafer box (11).

2. The die bonding machine with a positionable die bonding head according to claim 1, characterized in that: A crystal suction component (9) is also provided on the side of the crystal fixing component (81) close to the overview camera (908), and the crystal suction component (9) comprises a mounting module (901), a seat frame (902) and a linear motor (903). The mounting module (901) is provided on one side of a support (907), three groups of seat frames (902) are installed on the surface of the mounting module (901), and a linear motor (903) is installed on the upper side of the seat frame (902).

3. The die bonding machine with a positionable die bonding head according to claim 2, characterized in that: A voice coil motor (904) is arranged in the middle of the seat frame (902), an air pipe adapter is arranged inside the voice coil motor (904), and a nozzle assembly (905) is connected to the bottom of the air pipe adapter.

4. The die bonding machine with a positionable die bonding head according to claim 3, characterized in that: A nozzle body (906) is installed in the middle of the nozzle assembly (905).

5. The die bonding machine with a positionable die bonding head according to claim 1, characterized in that: A rack rail (503) and a translation rail are also installed on the working table of the chassis (1); the rear conveying platform (5) and the front conveying platform (51) are slidably connected to the translation rail via a sliding block at the bottom; servo motors (501) are installed on the sides of the rear conveying platform (5) and the front conveying platform (51); and the output end of the servo motor (501) is connected to a gear (502) meshing with the rack rail (503).

6. The die bonding machine with a positionable die bonding head according to claim 5, characterized in that: The upper sides of the rear conveying platform (5) and the front conveying platform (51) are both embedded and connected with a conveyor casing, and conveyor toothed belts (504) are arranged on both sides of the conveyor casing, and a driving motor (505) is arranged in the middle of the outer side of the conveyor casing.

7. The die bonding machine with a positionable die bonding head according to claim 6, characterized in that: The output gear roller of the driving motor (505) is meshedly connected with the conveying toothed belt (504), an auxiliary roller (506) abutting against the conveying toothed belt (504) is arranged in the middle of the conveyor housing, and a vacuum suction cup (507) is also fixed in the middle of the conveyor housing.

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