Skin breaking and cooling device

Abstract

The utility model relates to medical instrument technical field especially is a kind of cooling device for skin crushing, including the casing with containing cavity, the heat insulating part being set in containing cavity, semiconductor refrigeration device and air supply device;The containing cavity is separated into upper cavity and lower cavity by heat insulating part, and heat insulating part has the communicating hole of the intercommunication of upper cavity and lower cavity;The refrigeration end cover of semiconductor refrigeration device set in lower cavity seals communicating hole, and the heat dissipation end of semiconductor refrigeration device is exposed in lower cavity, and the air outlet of air supply device can send air to lower cavity, realize the air cooling of heat dissipation end, the casing has the exhaust hole being communicated with lower cavity, realize the external discharge of hot air after absorbing the heat of heat dissipation end, and the upper end of casing has the accommodating hole being opposite to communicating hole, after crushing cup is set in accommodating hole and communicating hole, its lower end is in abutment with refrigeration end, realizes the contact cooling of crushing cup, so that the skin in crushing cup can be crushed under low temperature.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, and in particular to a cooling device for broken skin. Background Technology

[0002] Microparticle skin grafting is a repair technique for large-area skin defects. It mainly uses the patient's own skin to make tiny skin particles, which are evenly sprinkled on the wound. Through the proliferation and expansion of epidermal cells at the edges of the skin particles, the wound is gradually covered, promoting healing.

[0003] The current process for preparing microparticle skin grafts involves mechanical disruption. The specific procedure is as follows: a disruption cup is used in conjunction with a handheld disruption device. This device includes a handheld unit, a stirring rod connected to the handheld unit, and disruption blades connected to the stirring rod. The handheld unit integrates a micromotor to drive the stirring rod. During skin disruption, the autologous skin graft is first placed in the disruption cup. Then, the end of the stirring rod with the disruption blades is inserted into the disruption cup. The micromotor drives the stirring rod, causing the disruption blades to rotate at high speed, thus disrupting the skin. The shear heat generated by the rotating disruption blades raises the skin temperature inside the disruption cup, leading to denaturation of some cell membrane proteins and damage to mitochondrial function, reducing the epidermal regeneration efficiency after skin grafting. Utility Model Content

[0004] The technical problem to be solved by this invention is that, currently, when skin is broken into skin particles, the skin temperature rises, which reduces the epidermal regeneration efficiency after skin particle transplantation.

[0005] To address the aforementioned technical problems, this utility model provides a cooling device for skin rupture, used to cool the rupture cup. The cooling device for skin rupture includes a shell, a heat insulation component, a semiconductor refrigeration device, and an air supply device.

[0006] The housing has a receiving cavity;

[0007] The heat insulation component is disposed in the receiving cavity, and the heat insulation component divides the receiving cavity into an upper cavity and a lower cavity. The heat insulation component has a communicating hole that connects the upper cavity and the lower cavity.

[0008] The semiconductor cooling device is disposed in the lower cavity, and the semiconductor cooling device has a cooling end and a heat dissipation end, with the cooling end covering the connecting hole;

[0009] The air supply device is connected to the housing, the air outlet of the air supply device is connected to the lower cavity, and the housing has an exhaust hole connected to the lower cavity;

[0010] The upper end of the housing has a receiving hole that is vertically opposite to the communicating hole, and the receiving hole connects the upper cavity to the outside.

[0011] The receiving hole and the communicating hole are configured to accommodate at least a portion of the crushing cup, and the lower end of the crushing cup abuts against the cooling end.

[0012] As a preferred embodiment, the cooling device for skin rupture further includes a heat-conducting element, the upper end of which is attached to the heat dissipation end, and the lower end of which has multiple heat dissipation protrusions.

[0013] As a preferred embodiment, each of the heat dissipation protrusions is a heat dissipation strip, and the heat dissipation strips are arranged in parallel intervals. An extended air guide channel is formed between two adjacent heat dissipation strips, and the exhaust hole is opposite to and perpendicular to the air guide channel.

[0014] As a preferred embodiment, the housing is provided with exhaust vents on both sides.

[0015] As a preferred embodiment, the cooling device for skin breakage further includes an air guide duct, which is disposed in the lower cavity, and the upper end of the air guide duct abuts against the lower end of at least a portion of the heat dissipation strip;

[0016] The air duct has a vertically arranged cavity, and the air supply device is disposed in the cavity with the air outlet of the air supply device facing upward.

[0017] As a preferred embodiment, the cooling device for skin rupture includes a base, the lower end of the housing has a port communicating with the lower cavity, the lower end of the air duct is connected to the base, and the base covers the port.

[0018] As a preferred embodiment, the lower end of the air supply device has an air inlet, and the lower end of the base has an air inlet hole, with the air inlet and the air inlet being vertically opposite each other.

[0019] As a preferred embodiment, the outer periphery of the air guide duct is provided with a plurality of reinforcing ribs at intervals, and each reinforcing rib connects the air guide duct and the base.

[0020] As a preferred embodiment, at least some of the reinforcing ribs are provided with wire-holding grooves.

[0021] As a preferred embodiment, at least part of the lower end of the heat dissipation strip is connected to the upper end of the air guide duct.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] This utility model relates to a cooling device for skin rupture, comprising a shell, a heat insulation component, a semiconductor refrigeration device, and an air supply device. The shell has a receiving cavity. The heat insulation component is disposed in the receiving cavity, dividing the receiving cavity into an upper cavity and a lower cavity. The heat insulation component has a connecting hole connecting the upper cavity and the lower cavity. The semiconductor refrigeration device is disposed in the lower cavity, having a cooling end and a heat dissipation end. The cooling end is covered by the connecting hole, thus exposing the cooling end to the connecting hole and preventing hot air from the lower cavity from entering the upper cavity through the connecting hole. The heat dissipation end of the semiconductor refrigeration device is exposed in the lower cavity. The air supply device is connected to the shell, and the air outlet of the air supply device is connected to the lower cavity and faces the heat dissipation end. The hot end is arranged with an air supply device that can supply air to the heat dissipation end to achieve air cooling and ensure the normal operation of the semiconductor refrigeration device. The shell has an exhaust hole that communicates with the lower cavity. The hot air that has absorbed heat from the heat dissipation end can be discharged to the outside of the lower cavity through the exhaust hole. The upper end of the shell has a receiving hole that is opposite to the connecting hole. The receiving hole connects the upper cavity to the outside. After the crushing cup is placed into the receiving hole and the connecting hole, the lower end of the crushing cup abuts against the cooling end, so that the cooling end can contact and cool the crushing cup. This allows the skin inside the crushing cup to be crushed at a low temperature, reducing the temperature rise of the skin during the crushing process into skin particles and improving the epidermal regeneration efficiency after skin particle transplantation. Attached Figure Description

[0024] Figure 1 This is a first isometric view of the skin-breaking cooling device of this utility model;

[0025] Figure 2 This is a second isometric view of the skin-breaking cooling device of this utility model;

[0026] Figure 3 This is a front view of the cooling device for skin rupture according to this utility model;

[0027] Figure 4 This is a left view of the cooling device for skin rupture according to this utility model;

[0028] Figure 5 This is a right view of the cooling device for skin rupture according to this utility model;

[0029] Figure 6 This is a top view of the cooling device for skin rupture according to the present invention;

[0030] Figure 7 for Figure 6 Sectional view along axis AA;

[0031] Figure 8 This is a first exploded view of the skin rupture cooling device of this utility model;

[0032] Figure 9This is a second exploded view of the skin-breaking cooling device of this utility model;

[0033] Figure 10 This is a schematic diagram of the assembly structure of the air duct, air supply device, and base;

[0034] Figure 11 This is a schematic diagram of a handheld crushing device;

[0035] In the diagram, X represents the first direction, Y represents the second direction, 100 is the crushing cup, 200 is the handheld crushing device, 201 is the stirring rod, 202 is the crushing blade, 203 is the protective cover, 204 is the protective cavity, 1 is the shell, 11 is the receiving cavity, 111 is the upper cavity, 112 is the lower cavity, 12 is the exhaust hole, 13 is the receiving hole, 2 is the heat insulation component, 21 is the connecting hole, 3 is the semiconductor refrigeration device, 31 is the refrigeration end, 32 is the heat dissipation end, 4 is the air supply device, 5 is the heat conduction component, 51 is the heat dissipation strip, 52 is the air guide channel, 6 is the air guide tube, 61 is the tube cavity, 62 is the reinforcing rib, 621 is the wire clamping groove, 7 is the base, and 71 is the air inlet. Detailed Implementation

[0036] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0037] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "top," and "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be understood that the terms "first," "second," etc., are used in this utility model to describe various information, but this information should not be limited to these terms; these terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be called "second" information, and similarly, "second" information can also be called "first" information.

[0038] like Figures 1 to 10As shown, a preferred embodiment of the skin-breaking cooling device of this utility model includes a housing 1, a heat insulation component 2, a semiconductor refrigeration device 3, and an air supply device 4. The housing 1 has a receiving cavity 11. The heat insulation component 2 is disposed in the receiving cavity 11, dividing the receiving cavity 11 into an upper cavity 111 and a lower cavity 112. The heat insulation component 2 has a connecting hole 21 connecting the upper cavity 111 and the lower cavity 112. The semiconductor refrigeration device 3 is disposed in the lower cavity 112. The semiconductor refrigeration device 3 has a cooling end 31 and a heat dissipation end 32. The cooling end 31 covers the connecting hole 21, thereby exposing the cooling end 31 to the connecting hole 21 and preventing hot air in the lower cavity 112 from entering the upper cavity 111 through the connecting hole 21. The air supply device 4 is connected to the housing 1. The air outlet of the air supply device 4 is connected to the lower cavity 112 and arranged towards the heat dissipation end 32. The air supply device 4 can supply air to the heat dissipation end 32 to achieve cooling. The air cooling of the heat dissipation end 32 ensures the normal operation of the semiconductor cooling device 3. The housing 1 has an exhaust hole 12 that communicates with the lower cavity 112. The hot air after absorbing the heat from the heat dissipation end 32 can be discharged to the outside of the lower cavity 112 through the exhaust hole 12. The upper end of the housing 1 has a receiving hole 13 that is vertically opposite to the connecting hole 21. The receiving hole 13 communicates with the upper cavity 111 and the outside. The receiving hole 13 and the connecting hole 21 are configured to accommodate at least part of the crushing cup 100, and the lower end of the crushing cup 100 abuts against the cooling end 31. After the crushing cup 100 is placed into the receiving hole 13 and the connecting hole 21, the lower end of the crushing cup 100 abuts against the cooling end 31, thereby enabling the cooling end 31 to cool the crushing cup 100. This allows the skin inside the crushing cup 100 to be crushed at a low temperature, reducing the temperature rise of the skin during the crushing process into skin particles and improving the epidermal regeneration efficiency after skin particle transplantation.

[0039] In this embodiment, the semiconductor cooling device 3 is a semiconductor cooling chip. When the semiconductor cooling chip is energized, the temperature of the cooling end 31 decreases, and the temperature of the heat dissipation end 32 increases. To achieve efficient heat dissipation of the heat dissipation end 32, in this embodiment, the cooling device for skin rupture also includes a heat-conducting element 5. The upper end of the heat-conducting element 5 is in contact with the heat dissipation end 32, and the lower end of the heat-conducting element 5 has multiple heat dissipation protrusions. The heat dissipation protrusions can improve the heat dissipation performance of the heat-conducting element 5 and ensure the heat dissipation effect of the semiconductor cooling device 3.

[0040] Specifically, each heat dissipation protrusion is a heat dissipation strip 51, which is arranged parallel to each other along the first direction X. A guide channel 52 extending along the second direction Y is formed between two adjacent heat dissipation strips 51. The exhaust port 12 is opposite to the guide channel 52 in the second direction Y, and the first direction X and the second direction Y are perpendicular. After the air supply device 4 blows air to the heat dissipation end 32, the air is blown into the guide channel 52 and flows along it. The exhaust port 12 is opposite to the guide channel 52 in the second direction Y, facilitating the flow of air from the guide channel 52 to the outside of the housing 1.

[0041] In this embodiment, the second direction Y is the left-right direction, and the first direction X is the front-back direction. The housing 1 has exhaust holes 12 on both sides in the second direction Y. The airflow device blows air to the middle of the heat dissipation end 32. The airflow is then blocked by the heat-conducting element 5 at the heat dissipation end 32 and splits into two streams, flowing left and right along the airflow channel 52 respectively. Exhaust holes 12 are provided on both the left and right sides of the housing 1, and the two streams of air are discharged from their respective exhaust holes 12, further improving the smoothness of the exhaust.

[0042] In this embodiment, the cooling device for skin rupture also includes an air guide duct 6, which is disposed in the lower cavity 112. The air guide duct 6 has a vertically arranged cylindrical cavity 61. The upper end of the air guide duct 6 abuts against the lower end of at least a portion of the heat dissipation strips 51. The upper end of the cylindrical cavity 61 communicates with the lower end of each air guide channel 52. An air supply device 4 is disposed in the cylindrical cavity 61, and the air outlet of the air supply device 4 is arranged upward. The arrangement of the air guide duct 6 ensures that the air delivered by the air supply device 4 can be blown to each air guide channel 52, further improving the heat dissipation effect on the semiconductor cooling device 3.

[0043] In this embodiment, the lower end of the air supply device 4 has an air inlet, and the lower end of the housing 1 is provided with an air inlet hole 71, with the air inlet and air inlet hole 71 facing each other vertically. The air inlet hole 71 and the air inlet facing each other ensure smooth air intake of the air supply device 4.

[0044] Specifically, the cooling device for skin rupture includes a base 7, and the lower end of the housing 1 has a port communicating with the lower cavity 112. The lower end of the air duct 6 is connected to the base 7, and the base 7 seals the port. The base 7 is connected to the lower end of the housing 1 by snap-fit ​​or fastening. While the base 7 is connected to the lower end of the housing 1, the air duct 6 and the air supply device 4 inside the air duct 6 are placed into the receiving cavity 11, which facilitates the assembly of the cooling device for skin rupture.

[0045] In this embodiment, a plurality of reinforcing ribs 62 are provided at intervals on the outer periphery of the air guide duct 6, and each reinforcing rib 62 connects the air guide duct 6 and the base 7. The reinforcing ribs 62 are arranged at intervals around the axial direction of the air guide duct 6, and the arrangement of the reinforcing ribs 62 ensures the connection strength between the air guide duct 6 and the base 7.

[0046] There is a gap between the outer wall of the air duct 6 and the inner wall of the housing 1. The semiconductor cooling device 3 needs to be connected with wires. In this embodiment, at least part of the reinforcing rib 62 is provided with wire-holding groove 621. The wires are held in the wire-holding groove 621 to facilitate the positioning of the wires, so that the internal wiring of the skin-breaking cooling device in this embodiment is neat.

[0047] In this embodiment, at least a portion of the lower end of the heat dissipation strip 51 is connected to the upper end of the air guide duct 6. Specifically, in this embodiment, the lower end of the heat dissipation strip 51 is bonded and fixed to the upper end of the air guide duct 6, the upper end of the heat-conducting component 5 abuts against the heat dissipation end 32, the heat-conducting component 5 and the air supply device 4 are both connected to the air guide duct 6, and the air guide duct 6 is connected to the base 7. When the base 7 is connected to the lower end of the housing 1, the heat-conducting component 5, the air supply device 4 and the air guide duct 6 are simultaneously placed into the receiving cavity 11. This facilitates the assembly of the cooling device for skin rupture.

[0048] In this embodiment, the heat insulation component 2 is a plate with a low thermal conductivity. The connecting hole 21 is located in the middle of the heat insulation component 2. The semiconductor cooling device 3 is connected to the heat insulation component 2, and the connecting hole 21 is vertically opposite to the cooling end 31. The semiconductor cooling device 3 can be connected to the heat insulation component 2 by bonding or fastening. The outer peripheral side of the heat insulation component 2 is bonded to the inner wall of the housing 1.

[0049] The assembly method of the skin-breaking cooling device in this embodiment is as follows:

[0050] First, the semiconductor cooling device 3 is connected to the heat insulation component 2. Then, the heat insulation component 2 with the semiconductor cooling device 3 is placed into the receiving cavity 11, and the outer periphery of the heat insulation component 2 is bonded to the inner wall of the housing 1. After that, the base 7, which is connected to the air duct 6, the air supply device 4 and the heat conduction component 5, is connected to the lower end of the housing 1. After the base 7 is connected to the housing 1, the upper end of the heat conduction component 5 abuts against the heat dissipation end 32.

[0051] The handheld skin-breaking device 200 used when breaking skin using the skin-breaking cooling device of this embodiment is as follows: Figure 11 As shown, in addition to the cutting blade, the stirring end is also equipped with a protective cover 203. The protective cover 203 has a protective cavity 204, and all the cutting blades are located in the protective cavity 204.

[0052] The method of using the skin-breaking cooling device in this embodiment is as follows:

[0053] First, place the skin-containing crushing cup 100 into the receiving hole 13 and the connecting hole 21, so that the lower end of the crushing cup 100 abuts against the cooling end 31; then turn on the cooling function of the skin crushing cooling device, and then insert the crushing end of the handheld crushing device 200 into the crushing cup 100, so that the lower end of the protective cover 203 abuts against the bottom wall of the crushing cup 100, and press down on the handheld crushing device 200, so that the protective cover 203 presses down on the bottom wall of the crushing cup 100, so that the crushing cup 100 is tightly attached to the cooling end 31, and the crushing cup 100 and the cooling end 31 are fixed under the action of downward pressure. Then turn on the handheld crushing device 200 to crush the skin.

[0054] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A cooling device for skin rupture, used to cool the rupture cup (100), characterized in that, It includes a housing (1), a heat insulation component (2), a semiconductor refrigeration device (3), and an air supply device (4); The housing (1) has a receiving cavity (11); The heat insulation member (2) is disposed in the receiving cavity (11), the heat insulation member (2) divides the receiving cavity (11) into an upper cavity (111) and a lower cavity (112), and the heat insulation member (2) has a connecting hole (21) connecting the upper cavity (111) and the lower cavity (112); The semiconductor cooling device (3) is disposed in the lower cavity (112). The semiconductor cooling device (3) has a cooling end (31) and a heat dissipation end (32). The cooling end (31) covers the connecting hole (21). The air supply device (4) is connected to the housing (1), the air outlet of the air supply device (4) is connected to the lower cavity (112), and the housing (1) has an exhaust hole (12) connected to the lower cavity (112). The upper end of the housing (1) has a receiving hole (13) that is vertically opposite to the communicating hole (21), and the receiving hole (13) connects the upper cavity (111) with the outside. The receiving hole (13) and the communicating hole (21) are configured to accommodate at least a portion of the crushing cup (100) and to abut the lower end of the crushing cup (100) against the cooling end (31).

2. The cooling device for skin rupture according to claim 1, characterized in that, The cooling device for skin breakage also includes a heat-conducting element (5), the upper end of which is attached to the heat dissipation end (32), and the lower end of which has multiple heat dissipation protrusions.

3. The cooling device for skin rupture according to claim 2, characterized in that, Each of the heat dissipation protrusions is a heat dissipation strip (51), and each of the heat dissipation strips (51) is arranged parallel to each other along the first direction (X). An air guide channel (52) extending along the second direction (Y) is formed between two adjacent heat dissipation strips (51). The exhaust hole (12) is opposite to the air guide channel (52) in the second direction (Y). The second direction (Y) is perpendicular to the first direction (X).

4. The cooling device for skin rupture according to claim 3, characterized in that, The housing (1) is provided with exhaust holes (12) on both sides in the second direction (Y).

5. The cooling device for skin rupture according to claim 3, characterized in that, The cooling device for skin breakage also includes an air guide tube (6), which is disposed in the lower cavity (112), and the upper end of the air guide tube (6) abuts against the lower end of at least a portion of the heat dissipation strip (51). The air guide duct (6) has a vertically arranged cavity (61), and the air supply device (4) is disposed in the cavity (61), with the air outlet of the air supply device (4) facing upward.

6. The cooling device for skin rupture according to claim 5, characterized in that, The cooling device for skin breakage includes a base (7), the lower end of the housing (1) has a port communicating with the lower cavity (112), the lower end of the air duct (6) is connected to the base (7), and the base (7) covers the port.

7. The cooling device for skin rupture according to claim 6, characterized in that, The lower end of the air supply device (4) has an air inlet, and the lower end of the base (7) is provided with an air inlet hole (71), with the air inlet and the air inlet hole (71) being vertically opposite each other.

8. The cooling device for skin rupture according to claim 6, characterized in that, The outer periphery of the air guide tube (6) is provided with a plurality of reinforcing ribs (62) spaced apart, and each reinforcing rib (62) connects the air guide tube (6) and the base (7).

9. The cooling device for skin rupture according to claim 8, characterized in that, At least part of the reinforcing rib (62) is provided with a wire-holding groove (621).

10. The cooling device for skin rupture according to claim 5, characterized in that, At least part of the lower end of the heat dissipation strip (51) is connected to the upper end of the air guide tube (6).

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