Pneumatically cooled enclosed finned heat sinks

Inactive Publication Date: 2008-08-14
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]As a result of the summarized invention, technically we have achieved a solution wherein pressurized air is directed through a plurality of vented pipes in an enclosed heat sink st

Problems solved by technology

Moreover, fans and air circulation devices generate noise which may be annoying or distracting in many system applications.
Meeting the increased heat transfer needs of more powerful processors adds to the challenge of cooling new processor technology.

Method used

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  • Pneumatically cooled enclosed finned heat sinks
  • Pneumatically cooled enclosed finned heat sinks
  • Pneumatically cooled enclosed finned heat sinks

Examples

Experimental program
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Embodiment Construction

[0016]FIG. 1 is a perspective view of a first example of a pneumatically cooled enclosed finned heat sink using vented pipes. An enclosure includes a first side 115, a second side 111, a third side 113, a fourth side 114, a top 112, and a bottom (not shown). An air inlet 116 formed by a vented inlet pipe 119 capable of accepting pressurized air enters the enclosure on first side 115. An air outlet 117 formed by a vented outlet pipe 118 exits the enclosure on first side 115. Air outlet 117 directs pressurized air from the enclosure to the ambient environment or to another enclosure (not shown).

[0017]FIG. 2 is an isometric view of the pneumatically cooled enclosed heat sink of FIG. 1 with enclosure sides 111, 113, 114, 115, top 112, and bottom removed. The enclosed heat sink includes a plurality of thermally conductive fins 301, 302, 303, 304, 305. Pressurized air entering air inlet 116 exits one or more vent holes in vented inlet pipe 119, circulates in proximity to fins 301 and 302,...

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Abstract

A heat sink including one or more vented pipes for directing air through a plurality of enclosed chambers formed by a plurality of fins in an enclosed structure having at least a first side and a second side. An air inlet in the first side of the enclosed structure allows pressurized air to enter the plurality of enclosed chambers through the one or more vented pipes. An air outlet in the first side of the enclosed structure allows pressurized air to exit the plurality of enclosed chambers through the one or more vented pipes.

Description

TRADEMARKS[0001]IBM® is a registered trademark of International Business Machines Corporation, Armonk, N.Y., U.S.A. Other names used herein may be registered trademarks, trademarks or product names of International Business Machines Corporation or other companies.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to heat sinks for electronic devices, and more particularly, to improved heat sink arrangements in enclosed housings.[0004]2. Description of Background[0005]The use of heat sinks for electronic devices is well known. Typically, a heat sink is arranged proximate to a heat generating electronic component such as a processor within a server. Heat generated by processor is transferred to the heat sink and then dissipated from the heat sink to the surrounding air. One type of heat sink includes a metallic base plate. Heat dissipating fins extend from the base plate to increase the surface area of the heat sink. Heat transferred from the...

Claims

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Application Information

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IPC IPC(8): F28D7/16
CPCH01L23/467F28F2265/28H01L2924/0002H01L2924/00
InventorGILLARD, EDWARD C.GILLILAND, DON A.HUETTNER, CARY M.MCPHEE, THOMAS J.
OwnerIBM CORP