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Composite plate structure and manufacturing method thereof

a technology of composite materials and manufacturing methods, applied in the direction of casings/cabinets/drawers, casings/cabinets/drawers details, electrical appliances, etc., can solve the problems of inconvenient carrying of portable electronic devices, structural strength of composite materials, etc., and achieve the effect of strengthening the structural strength of the composite plate structur

Inactive Publication Date: 2015-12-17
COMPAL ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a composite plate where the core layer is exposed at the first region, allowing the melted resin to flow through and combine with the core layer, first fiber layer, and second fiber layer. This strengthens the binding forces and increases the structural strength of the composite plate.

Problems solved by technology

It will be inconvenient to carry the portable electronic devices if they do not have sufficient structural strength against shake or pressure.
Thus, how to increase the structural strength of composite materials is an important issue in designing the housing for portable electronic devices

Method used

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  • Composite plate structure and manufacturing method thereof
  • Composite plate structure and manufacturing method thereof
  • Composite plate structure and manufacturing method thereof

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Embodiment Construction

[0050]FIG. 1 is a schematic diagram illustrating a composite plate structure according to an embodiment of the invention. Referring to FIG. 1, the composite plate structure 100 of the present embodiment includes a composite plate 110 and a resin component 120. The composite plate 110 includes a first fiber layer 112, a second fiber layer 114 and a core layer 116. The core layer 116 is disposed between the first fiber layer 112 and the second fiber layer 114. The second fiber layer 114 has a first region 110b, and a portion of the second fiber layer 114 on the first region 110b is removed so that an area of the second fiber layer 114 is smaller than an area of the first fiber layer 112, and thus the second fiber layer 114 exposes the core layer 116 at the first region 110b. The resin component 120 is connected to the composite plate 110 and is combined with the core layer 116 at the first region 110b, wherein the resin component 120 is, for example, configured to be fixed at other co...

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Abstract

A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefits of U.S. provisional application Ser. No. 62 / 010,463, filed on Jun. 11, 2014, and U.S. provisional application Ser. No. 62 / 089,813, filed on Dec. 9, 2014. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention generally relates to a composite plate structure and a manufacturing method thereof, and more particularly, to a composite plate structure having fiber layers and a manufacturing method thereof.[0004]2. Description of Related Art[0005]In recent years, portable electronic devices have been developed to provide more functions and have smaller sizes. Wireless communication and wireless network make it convenient for people to acquire information from the Internet via portable electronic devices, and as a result, portable electr...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K5/02B29C45/14
CPCH05K5/0217Y10T428/24752B29K2105/08B29C45/14311B29L2031/3481B29C45/14786
Inventor WU, JUNG-CHINLIN, PO-ANLEE, SHENG-HUNGHUANG, HAN-CHINGLING, KUO-NAN
Owner COMPAL ELECTRONICS INC