Mold for Manufacturing LED Mounting Substrate

a technology of led mounting and molding plate, which is applied in the field of molding plate for manufacturing led mounting plate, can solve the problems of insufficient structure strength of the formed reflective plate and easy cracking, and achieve the effect of good structure strength

Inactive Publication Date: 2016-03-24
LEXTAR ELECTRONICS CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The mold design ensures uniform material flow and distribution, resulting in an LED mounting substrate with enhanced structure strength and reduced likelihood of cracking.

Problems solved by technology

Because the shape of the reflective cup is complex, it is difficult for the thermosetting material to make the uniform flow and adjoin simultaneously, and the formed reflective cup may be of inadequate structure strength and easily crackable.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mold for Manufacturing LED Mounting Substrate
  • Mold for Manufacturing LED Mounting Substrate
  • Mold for Manufacturing LED Mounting Substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027]Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0028]FIG. 1 is a perspective view of an LED mounting substrate 10 in accordance with one embodiment of the present disclosure. As shown in this figure, the LED mounting substrate 10 includes a lead frame 100, a base 200 and a residue of injection molding material 400. The base 200 is disposed on the lead frame 100. The base 200 has a cavity 300. A bottom of the cavity 300 has an opening 302 for exposing a portion of the lead frame 100. A cross-sectional area of the cavity 300 increases along a direction from the lead frame 100 to a top surface 210 of the base 200. The residue of injection molding material 400 is disposed on one of outer walls 220 of the base 200 surrounding the cavity 300. A cross-sectional ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.

Description

RELATED APPLICATIONS[0001]The present application is a divisional application of U.S. application Ser. No. 14 / 156,583 filed on Jan. 16, 2014, which is based on, and claims priority from, Taiwanese Patent Application Serial Number 102101775, filed Jan. 17, 2013, the disclosure of which is hereby incorporated by reference herein in its entirely.BACKGROUND[0002]1. Technical Field[0003]Embodiments of the present disclosure relate to a lighting apparatus. More particularly, embodiments of the present disclosure relate to a mold for manufacturing an LED mounting substrate.[0004]2. Description of Related Art[0005]Because a light emitting diodes (LED) has advantages such as low power-consumption and high illumination efficiency, it has become a popular lighting device and been widely applied in illumination and backlight module.[0006]An LED package includes a lead frame, a reflective cup and an LED chip. The LED chip is disposed on the lead frame, The reflective cup is disposed on the lead ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): B29C45/02B29C45/14H01L33/00
CPCB29C45/02B29C45/14655H01L33/00H01L2933/0058B29L2031/3406H01L2933/0033B29K2101/10H01L33/483H01L33/486H01L33/60H01L33/62H01L2224/48091H01L2224/48247
InventorCHEN, SHING-KUOKO, BO-YULIN, HSIU-HSIANG
OwnerLEXTAR ELECTRONICS CORP