Multi-phase clock division

Active Publication Date: 2019-06-20
MICRON TECH INC
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present disclosure relates to using a multi-phase clock in semiconductor devices, such as memory devices. However, when the starting phase of the clock is not known, it can be difficult to determine which phase to use for a data strobe. The patent describes various methods for addressing this issue and ensuring correct functioning of the device. The technical effects of the patent include improving the accuracy and reliability of semiconductor devices that use multi-phase clocks.

Problems solved by technology

Variable write preamble lengths may also cause incorrect bit counting in a phase of the multiple phases when write preamble lengths change from a default length.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-phase clock division
  • Multi-phase clock division
  • Multi-phase clock division

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018]One or more specific embodiments will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

[0019]At fast clock frequencies, such as those used for DDR5, an external clock frequency may be divided for internal use by the DRAM. For example, a number (e.g., 4) phases may b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Devices and methods include receiving write command at a command interface of the semiconductor device to write data to memory. An external data strobe is received at a data strobe pin of the semiconductor device. The received external data strobe is divided into multiple phases using phase division circuitry to divide the data strobe into multiple phases to be used in writing the data to the memory.

Description

BACKGROUNDField of the Present Disclosure[0001]Embodiments of the present disclosure relate generally to the field of semiconductor devices. More specifically, embodiments of the present disclosure relate to using a multi-phase clock when the starting phase is unknown.Description of Related Art[0002]Semiconductor devices (e.g., memory devices) often utilize clocks to perform functions. As frequency speeds increase, it may be helpful to divide a fast clock into multiple phases for internal use of a portion (e.g., dynamic random-access memory (DRAM). However, by dividing the clock into multiple phases, it may be unknown which starting phase first receives a first incoming clock for the clock. Variable write preamble lengths may also cause incorrect bit counting in a phase of the multiple phases when write preamble lengths change from a default length.[0003]Embodiments of the present disclosure may be directed to one or more of the problems set forth above.BRIEF DESCRIPTION OF DRAWINGS...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11C11/4076G11C11/4096
CPCG11C11/4096G11C7/1078G11C7/109G11C11/4076G11C7/222G11C7/1093G11C2207/105
InventorPENNEY, DANIEL B.
OwnerMICRON TECH INC