Conductive film
By uniformly distributing 0.5-5 μm particles and 1-200 nm nanoparticles in the hard coating layer of the conductive film, the uneven distribution problem caused by the large diameter of the hard coating particle in the prior art is solved, and a low haze value is achieved and a higher transmittance.
Patent Information
- Application Number
- CN201611180261.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2016-12-19
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2036-12-19
AI Technical Summary
The hard coat particles of existing conductive films have large diameters, resulting in uneven distribution, increasing haze and reducing transmittance.
A hard coating layer containing 0.5-5 μm particles and 1-200 nm nanoparticles was used to uniformly distribute the particles of two different sizes to construct a hard coating layer containing two different sizes.
The haze value of the film is reduced and the transmittance is improved.
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Figure CN106739336B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of touch technology, and in particular to a conductive film used for a capacitive touch panel or the like. Background Art
[0002] The conductive film includes a substrate, hard coating layers formed on both surfaces of the substrate, a transparent conductive layer, and a metal layer formed on each transparent conductive layer.
[0003] The hard coating layer of the conductive film contains a binder resin layer and a plurality of particles, and the diameter of the existing hard coating particles is mostly in the micrometer level. Since the particle diameter is large, that is, the diameter of the particle is larger than the thickness of the flat area of the binder resin layer, and the particle is unevenly distributed in the hard coating layer, light scattering is formed, and the haze of the conductive film substrate is increased to a certain extent, resulting in a decrease in the transmittance of the conductive film. Summary of the invention
[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a conductive film comprising particles of two sizes.
[0005] The purpose of the present invention and the technical problem to be solved are achieved by adopting the following technical solutions:
[0006] The present invention provides a conductive film, which includes: a substrate having a first surface and a second surface relative to each other; a first hard coating layer and a first transparent conductor layer formed on the first surface of the substrate; and a second hard coating layer and a second transparent conductor layer formed on the second surface of the substrate; wherein the first hard coating layer contains a binder resin and a plurality of uniformly distributed particles with a particle size of 0.5-5 μm and a particle size of 1-200 nm, and the second hard coating layer contains a binder resin and a plurality of uniformly distributed particles with a particle size of 0.5-5 μm and a particle size of 1-200 nm.
[0007] In one embodiment, the conductive film further includes a first optical adjustment layer, a second optical adjustment layer, a first metal layer, and a second metal layer. The first optical adjustment layer is arranged between the first hard coating layer and the first transparent conductor layer, the second optical adjustment layer is arranged between the second hard coating layer and the second transparent conductor layer, the first metal layer is arranged on the surface of the first transparent conductor layer, and the second metal layer is arranged on the surface of the second transparent conductor layer.
[0008] In one embodiment, the first hard coating layer, the first optical adjustment layer, the first transparent conductor layer, and the first metal layer are sequentially stacked on the first surface of the substrate, and the second hard coating layer, the second optical adjustment layer, the second transparent conductor layer, and the second metal layer are sequentially stacked on the second surface of the substrate.
[0009] In one embodiment, the content of particles and nanoparticles in the first hard coating layer is 0.05 wt %-5 wt % of the weight of the first hard coating layer, and the content of particles and nanoparticles in the second hard coating layer is 0.05 wt %-5 wt % of the weight of the second hard coating layer.
[0010] In one embodiment, the particle size of the particles contained in the first hard coating layer is larger than the thickness of the flat area of the binder resin layer contained in the first hard coating layer, and the particle size of the particles contained in the second hard coating layer is larger than the thickness of the flat area of the binder resin layer contained in the second hard coating layer.
[0011] In one embodiment, the thickness of the first metal layer is 50-800 nm, and the thickness of the second metal layer is 50-800 nm.
[0012] In one embodiment, the surface of the first metal layer has a plurality of large protrusions and small protrusions, and the large protrusions and small protrusions are respectively caused by the plurality of particles and nanoparticles contained in the first hard coating layer, and the surface of the second metal layer has a plurality of large protrusions and small protrusions, and the large protrusions and small protrusions are respectively caused by the plurality of particles and nanoparticles contained in the second hard coating layer.
[0013] In one embodiment, the density of large protrusions distributed on the surface of the first metal layer is 20-100 / mm 2 , the density of small convex parts is 1000-40000 / mm 2 The density of large protrusions distributed on the surface of the second metal layer is 20-100 / mm 2 , the density of small convex parts is 1000-40000 / mm 2 .
[0014] In one embodiment, the surface arithmetic average roughness Ra of the first metal layer is 0.01-0.1 μm, and the surface arithmetic average roughness Ra of the second metal layer is 0.01-0.1 μm.
[0015] In one embodiment, the maximum surface height Rz of the first metal layer is 0.5-3.5 μm, and the maximum surface height Rz of the second metal layer is 0.5-3.5 μm.
[0016] The conductive film provided by the present invention uses a plurality of particles with a particle size of 0.5-5 μm and nanoparticles with a particle size of 1-200 nm to be evenly distributed in the hard coating layer, constructs a hard coating layer containing two particles of different sizes, and forms an optical film together with the substrate, the optical adjustment layer, and the transparent conductor layer. The conductive film provided by the present invention has a lower haze value and a higher transmittance. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic cross-sectional view of a conductive film according to one embodiment of the present invention;
[0018] Figure 2 It is a schematic cross-sectional view of a conductive film according to another embodiment of the present invention.
[0019] Wherein, the accompanying drawings are described as follows:
[0020] 10, 20: Conductive film
[0021] 11, 21: Matrix
[0022] 12, 22: Hard coating
[0023] 14, 24: Optical adjustment layer
[0024] 16, 26: Transparent conductor layer
[0025] 18, 28: Metal layer
[0026] 121, 221: First hard coating
[0027] 122, 222: Second hard coating
[0028] 141, 241: first optical adjustment layer
[0029] 142, 242: second optical adjustment layer
[0030] 161, 261: first transparent conductor layer
[0031] 162, 262: second transparent conductor layer
[0032] 181, 281: First metal layer
[0033] 182, 282: Second metal layer
[0034] 1212, 2212, 2222: Binder resin layer
[0035] 1214, 2214, 2224: Particles
[0036] 1216, 2216, 2226: Nanoparticles
[0037] 2812, 2822: Large convex part
[0038] 2814, 2824: Small convex part DETAILED DESCRIPTION
[0039] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the specific implementation method, structure, characteristics and effects of a conductive film proposed according to the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.
[0040] See also Figure 1 , a conductive film 10 according to a preferred embodiment of the present invention is shown. The conductive film 10 comprises a substrate 11, a hard coating layer 12, an optical adjustment layer 14, a transparent conductor layer 16 and a metal layer 18. The hard coating layer 12 comprises a first hard coating layer 121 and a second hard coating layer 122. The optical adjustment layer 14 comprises a first optical adjustment layer 141 and a second optical adjustment layer 142. The transparent conductor layer 16 comprises a first transparent conductor layer 161 and a second transparent conductor layer 162. The metal layer 18 comprises a first metal layer 181 and a second metal layer 182.
[0041] The substrate 11 has a first surface and a second surface opposite to each other. A first hard coating layer 121, a first optical adjustment layer 141, a first transparent conductor layer 161 and a first metal layer 181 are sequentially formed on the first surface of the substrate 11, and a second hard coating layer 122, a second optical adjustment layer 142, a second transparent conductor layer 162 and a second metal layer 182 are sequentially formed on the second surface of the substrate 11.
[0042] The substrate 11 is formed by a polymer film. Specifically in the present embodiment, the polymer film is made of a material of polycycloolefin, polycarbonate or polyimide. The special multi-layer functional coating on the surface of the polymer film enables the polymer film to have excellent optical properties. Specifically in the present embodiment, the total reflectivity of the substrate is preferably 10-18, and the single-sided reflectivity is preferably 5-9. Since the polymer film has good light transmittance, the light transmittance of the substrate is high and the haze value of the substrate is low. Specifically in the present embodiment, the haze value of the substrate 11 is preferably 0.3-5.
[0043] Furthermore, since the first hard coating layer 121 and the second hard coating layer 122 cover the surface of the substrate 11 , the surface of the substrate 11 can be prevented from being damaged.
[0044] The first hard coating layer 121 is formed on the first surface of the substrate 11. The first hard coating layer 121 includes a binder resin layer 1212 and a plurality of particles 1214 with a particle size of 0.5-5 μm and nanoparticles 1216 with a particle size of 1-200 nm. The plurality of particles 1214 and the nanoparticles 1216 are uniformly distributed in the binder resin layer 1212. The second hard coating layer 122 is formed on the second surface of the substrate 11, and the second hard coating layer 122 includes a binder resin layer. The surface shape of the second hard coating layer 122 is different from the surface shape of the first hard coating layer 121, and the surface of the second hard coating layer 122 is flat. The second optical adjustment layer 142, the second transparent conductor layer 162, and the second metal layer 182 are stacked along the surface of the second hard coating layer 122. Therefore, the surface shape of the second metal layer 182 reflects the surface shape of the second hard coating layer 122 and is also flat.
[0045] The conductive film 20 provided by the present invention is as follows Figure 2 As shown, the conductive film 20 includes a substrate 21, a hard coating layer 22, an optical adjustment layer 24, a transparent conductor layer 26, and a metal layer 28. The hard coating layer 22 includes a first hard coating layer 221 and a second hard coating layer 222. The optical adjustment layer 24 includes a first optical adjustment layer 241 and a second optical adjustment layer 242. The transparent conductor layer 26 includes a first transparent conductor layer 261 and a second transparent conductor layer 262. The metal layer 28 includes a first metal layer 281 and a second metal layer 282.
[0046] The substrate 21 has a first surface and a second surface opposite to each other. A first hard coating layer 221, a first optical adjustment layer 241, a first transparent conductor layer 261 and a first metal layer 281 are sequentially formed on the first surface of the substrate 21, and a second hard coating layer 222, a second optical adjustment layer 242, a second transparent conductor layer 262 and a second metal layer 282 are sequentially formed on the second surface of the substrate 21.
[0047] The substrate 21 is formed by a polymer film. Specifically in this embodiment, the polymer film is made of a material of polycycloolefin, polycarbonate or polyimide. The special multi-layer functional coating on the surface of the polymer film enables the polymer film to have excellent optical properties. Specifically in this embodiment, the total reflectivity of the substrate is preferably 10-18, and the single-sided reflectivity is preferably 5-9. Since the polymer film has good light transmittance, the light transmittance of the substrate is high and the haze value of the substrate is low.
[0048] The first hard coating layer 221 is formed on the first surface of the substrate 21. The first hard coating layer 221 includes an adhesive resin layer 2212 and a plurality of particles 2214 with a particle size of 0.5-5 μm and nanoparticles 2216 with a particle size of 1-200 nm. The plurality of particles 2214 and nanoparticles 2216 are uniformly distributed in the adhesive resin layer 2212. The second hard coating layer 222 is formed on the second surface of the substrate 21, and the second hard coating layer 222 has the same material and structure as the first hard coating layer 221. Therefore, the second hard coating layer 222 includes an adhesive resin layer 2222 and a plurality of particles 2224 with a particle size of 0.5-5 μm and nanoparticles 2226 with a particle size of 1-200 nm. The plurality of particles 2224 and nanoparticles 2226 are uniformly distributed in the adhesive resin layer 2222.
[0049] The plurality of particles 2214 and nanoparticles 2216 included in the first hard coating layer 221 and the plurality of particles 2224 and nanoparticles 2226 included in the second hard coating layer 222 are formed of silicon dioxide, silicone polymer, acrylic polymer or styrene polymer. The content of the plurality of particles 2214 and nanoparticles 2216 included in the first hard coating layer 221 is preferably 0.05 wt% to 5 wt% of the weight of the first hard coating layer 221 in order to prevent the effect of crimping (crimping means fixing under pressure, sometimes also referred to as adhesion). Similarly, the content of the plurality of particles 2224 and nanoparticles 2226 in the second hard coating layer 222 is preferably 0.05 wt% to 5 wt% of the weight of the second hard coating layer 222.
[0050] The binder resin layer 2212 in the first hard coating layer 221 is a curable resin composition based on ultraviolet rays and electron beams. The curable resin composition preferably includes a polymer obtained by adding a glycidyl acrylate polymer to acrylic acid. Alternatively, the curable resin composition preferably includes a multifunctional acrylate polymer (pentaerythritol, dipentaerythritol, etc.). The curable resin composition also includes a polymerization initiator. The thickness of the flat area (area without particles 2214 and nanoparticles 2216) of the first hard coating layer 221 with only the binder resin 2212 is preferably 50nm-0.8μm. Similarly, the thickness of the flat area (area without particles 2224 and nanoparticles 2226) of the binder resin layer 2222 in the second hard coating layer 222 is preferably 50nm-0.8μm.
[0051] The particle size of the plurality of particles 2214 in the first hard coating layer 221 is larger than the thickness of the flat region of the binder resin layer 2212 alone, and therefore, a plurality of protrusions resulting from the plurality of particles 2214 are formed on the surface of the first hard coating layer 221. The plurality of nanoparticles 2216 in the first hard coating layer 121 are uniformly distributed on the upper portion of the binder resin layer 2212, and therefore, a plurality of protrusions resulting from the plurality of nanoparticles 2216 are formed on the surface of the first hard coating layer 221. Similarly, a plurality of protrusions resulting from the plurality of particles 2224 and the nanoparticles 2226 are also formed on the surface of the second hard coating layer 222.
[0052] The first optical adjustment layer 241 is disposed between the first hard coating layer 221 and the first transparent conductor layer 261. The refractive index of the first optical adjustment layer 241 is preferably set to a value between the refractive index of the first hard coating layer 221 and the refractive index of the first transparent conductor layer 261. The material forming the first optical adjustment layer 241 is, for example, polyacrylate. The thickness of the first optical adjustment layer 241 is preferably 50-200 nm. Similarly, the thickness of the second optical adjustment layer 242 is also preferably 50-200 nm.
[0053] The first transparent conductor layer 261 is formed on the surface of the first optical adjustment layer 241. The first transparent conductor layer 261 is formed of any one of indium tin oxide, indium zinc oxide or indium oxide-zinc oxide composite oxide having high transmittance (above 80%) in the visible light region (380nm-780nm). The second transparent conductor layer 262 is formed on the surface of the second optical adjustment layer 242. The physical properties and materials of the second transparent conductor layer 262 are the same as those of the first transparent conductor layer 241. The thickness of the transparent conductor layer 24 directly affects its transmittance. In order to achieve a better transmittance, specifically in this embodiment, the thickness of the first transparent conductor layer 261 and the second transparent conductor layer 262 is preferably 10-100nm.
[0054] The first metal layer 281 is formed on the surface of the first transparent conductor layer 261. When the first metal layer 281 is used to prepare a touch panel, it is used to form electrode wiring outside the touch input area. The first metal layer 281 can be made of copper or silver with good conductivity, or it can be made of other metal materials with excellent conductivity other than copper and silver. The metal layer can be formed by printing or laser processes. The thickness of the first metal layer 281 is preferably 50-800nm. The second metal layer 281 is formed on the surface of the second transparent conductor layer 262, and the purpose, material, and thickness of the second metal layer 282 are exactly the same as those of the first metal layer 261.
[0055] The surface of the first metal layer 281 is similar in shape to the surface of the first hard coating layer 221, and has a plurality of uniformly distributed large protrusions 2812. The large protrusions 2812 are caused by the fact that the particle size of the plurality of particles 2214 in the first hard coating layer 221 is greater than the thickness of the flat area of the first hard coating layer 221 containing the binder resin layer 2212. Similarly, a plurality of nanoparticles 2216 uniformly distributed on the upper part of the binder resin layer 2212 in the first hard coating layer 221 form a plurality of small protrusions 2814 on the surface of the first metal layer 281. The shape and distribution density of the large protrusions 2812 and the small protrusions 2814 can be adjusted by changing the shape, size and content of the particles 2214 and the nanoparticles 2216. Specifically in this embodiment, the distribution density of the large protrusions 2812 is preferably 20-100 pieces / mm 2 The distribution density of the small protrusions 2814 is preferably 1000-40000 / mm 2 .
[0056] The uniform distribution of the plurality of particles 2214 and nanoparticles 2216 in the first hard coating layer 221 reduces the surface roughness of the first metal layer 281. Specifically in the present embodiment, the surface arithmetic mean roughness Ra of the first metal layer 281 is preferably 0.01-0.1 μm. The maximum surface height Rz of the first metal layer 281 is preferably 0.5-3.5 μm. The surface arithmetic mean roughness Ra and the maximum height Rz of the first metal layer 281 can be changed by adjusting the shape, size and content of the particles 2214 and the nanoparticles 2216. The surface shape of the second metal layer 282 is the same as that of the first metal layer 281, and it also has a plurality of uniformly distributed large protrusions 2822 and small protrusions 2824. The distribution density of the plurality of large protrusions 2822 and small protrusions 2824 on the surface of the second metal layer 282, the surface arithmetic mean roughness Ra, the maximum height Rz of the second metal layer 282 and the first metal layer 281 are exactly the same.
[0057] The surface of the first metal layer 281 has a plurality of evenly distributed large protrusions 2812 and small protrusions 2824, and the surface of the second metal layer 282 has a plurality of evenly distributed large protrusions 2822 and small protrusions 2824. When the conductive film 20 of the present invention is wound, the surface of the first metal layer 281 and the surface of the second metal layer 282 are in point contact, thereby preventing the first metal layer 281 and the second metal layer 282 from being pressed.
[0058] The conductive film provided by the present invention uses a plurality of particles with a particle size of 0.5-5 μm and nanoparticles with a particle size of 1-200 nm to be evenly distributed in the hard coating layer, constructs a hard coating layer containing two particles of different sizes, and forms an optical film together with the substrate, the optical adjustment layer, and the transparent conductor layer. The conductive film provided by the present invention has a lower haze value and a higher transmittance.
[0059] Those skilled in the art will appreciate that, although the embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims, any one of the claimed embodiments may be used in any combination.
[0060] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned implementation modes, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned implementation modes, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the implementation modes of the present invention, and they should all be included in the scope of the claims and specification of the present invention.
Claims
1. A conductive film comprising: A substrate having a first surface and a second surface opposite to each other; a first hard coating layer and a first transparent conductor layer formed on the first surface of the substrate; and a second hard coating layer and a second transparent conductor layer formed on the second surface of the substrate; The invention is characterized in that the first hard coating layer contains a binder resin and a plurality of uniformly distributed particles with a particle size of 0.5-5 μm and a particle size of 1-200 nm, and the second hard coating layer contains a binder resin and a plurality of uniformly distributed particles with a particle size of 0.5-5 μm and a particle size of 1-200 nm; the plurality of nanoparticles in the first hard coating layer are uniformly distributed on the upper part of the binder resin, and a plurality of protrusions caused by the plurality of nanoparticles are formed on the surface of the first hard coating layer; A plurality of protrusions resulting from a plurality of particles and nanoparticles are also formed on the surface of the second hard coating layer; The conductive film also includes a first metal layer, which is arranged on the surface of the first transparent conductor layer. The surface of the first metal layer has a plurality of uniformly distributed large and small protrusions, and the large and small protrusions are respectively caused by a plurality of particles and nanoparticles contained in the first hard coating layer. The surface arithmetic mean roughness Ra of the first metal layer is 0.01-0.1 μm.
2. The conductive film according to claim 1, characterized in that The conductive film also includes a first optical adjustment layer, a second optical adjustment layer, and a second metal layer. The first optical adjustment layer is arranged between the first hard coating layer and the first transparent conductor layer, the second optical adjustment layer is arranged between the second hard coating layer and the second transparent conductor layer, and the second metal layer is arranged on the surface of the second transparent conductor layer.
3. The conductive film according to claim 2, characterized in that The first hard coating layer, the first optical adjustment layer, the first transparent conductor layer, and the first metal layer are sequentially stacked on the first surface of the substrate, and the second hard coating layer, the second optical adjustment layer, the second transparent conductor layer, and the second metal layer are sequentially stacked on the second surface of the substrate.
4. The conductive film according to claim 1, characterized in that The content of the particles and nanoparticles contained in the first hard coating layer is 0.05 wt %-5 wt % of the weight of the first hard coating layer, and the content of the particles and nanoparticles contained in the second hard coating layer is 0.05 wt %-5 wt % of the weight of the second hard coating layer.
5. The conductive film according to claim 2, characterized in that: The particle size of the particles contained in the first hard coating layer is larger than the thickness of the flat area of the binder resin layer contained in the first hard coating layer, and the particle size of the particles contained in the second hard coating layer is larger than the thickness of the flat area of the binder resin layer contained in the second hard coating layer.
6. The conductive film according to claim 2, characterized in that The thickness of the first metal layer is 50-800 nm, and the thickness of the second metal layer is 50-800 nm.
7. The conductive film according to claim 5, characterized in that The second metal layer has a plurality of large protrusions and small protrusions on its surface, and the large protrusions and small protrusions are respectively derived from the plurality of particles and nanoparticles contained in the second hard coating layer.
8. The conductive film according to claim 7, characterized in that The density of large protrusions distributed on the surface of the first metal layer is 20-100 / mm 2 , the density of small convex parts is 1000-40000 / mm 2 The density of large protrusions distributed on the surface of the second metal layer is 20-100 / mm 2 , the density of small convex parts is 1000-40000 / mm 2 .
9. The conductive film according to claim 7, characterized in that: The second metal layer has a surface arithmetic average roughness Ra of 0.01-0.1 μm.
10. The conductive film according to claim 7, characterized in that The maximum surface height Rz of the first metal layer is 0.5-3.5 μm, and the maximum surface height Rz of the second metal layer is 0.5-3.5 μm.
Citation Information
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