A ground temperature measurement system based on I2C and single bus technology

Abstract

A kind of I 2 C and single bus technology geothermal measurement system, including distributed geothermal measurement module, amplifier module, data acquisition card module, single chip computer module, information processing module. The distributed geothermal measurement module includes multiple temperature sensors and multiple 1-wire main controllers, each temperature sensor is connected to a corresponding 1-wire main controller, forming a single group of geothermal measurement modules. The amplifier module includes multiple amplifier units, each amplifier unit is connected to a 1-wire main controller of a geothermal measurement module. The data acquisition card module includes multiple data acquisition card units, each data acquisition card unit is connected to an amplifier unit. The data acquisition card module is connected to the single chip computer module, and the single chip computer module is connected to the information processing module. The multiple 1-wire main controllers are connected to the single chip computer module, and the single chip computer module and the multiple 1-wire main controllers are connected to the single chip computer module. 2 The invention can extend the measurement depth to about 100m, greatly improve the working range of ground temperature measurement, and has certain reference value for ground temperature field research.

Description

Technical Field

[0001] The present invention relates to the field of ground temperature measurement technology, specifically a method based on I 2 C and single bus technology ground temperature measurement system. Background Art

[0002] The geothermal field is a type of geophysical field that reflects the distribution of underground temperature and can be directly measured by a borehole temperature sensor. The geothermal field measurement is widely used, not only in the investigation of geothermal fields, but also in locating the location of underground minerals and groundwater through the temperature distribution of the geophysical field, so as to solve engineering problems such as hydrogeology, mineral mining, groundwater and oil excavation.

[0003] The traditional geothermal measurement system uses analog temperature sensors plus signal processing circuits for measurement, and transmits the signal to a laptop computer through A / D conversion, registers, and transmission lines for numerical analysis of the temperature field. This measurement system has obvious disadvantages: the signal transmission process is easily interfered, the collected signal has a lot of noise and the measurement distance is limited. The microprocessor and the sensor can only be separated by a few meters, and it is impossible to measure the deep geothermal field. The obtained measurement data is not effective for estimating the distribution of underground minerals, hydrogeology, and groundwater, and cannot achieve the expected purpose. Subsequently, scholars proposed a large number of improved methods for geothermal measurement, among which the geothermal measurement system based on a single bus has a better effect. Compared with the traditional method, the system structure of this method is simple and the measurement depth can be expanded to about 50 meters, which greatly increases the measurement depth of the system. However, its depth still cannot meet the needs of the project and cannot well invert the deep geothermal field. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, that is, the ground temperature measurement depth of the instrument cannot meet the ideal requirements, the present invention provides a method based on I 2 The geothermal measurement system based on C and single bus technology can extend the measurement depth to about 100m, which greatly improves the working range of geothermal measurement and has certain reference value for geothermal field research.

[0005] The technical solution adopted by the present invention is:

[0006] A kind of I 2 The ground temperature measurement system based on C and single bus technology includes a distributed ground temperature measurement module, an amplifier module, a data acquisition card module, a single chip computer module and an information processing module.

[0007] The distributed ground temperature measurement module includes multiple temperature sensors and multiple 1-wire main controllers, each temperature sensor is connected to a corresponding 1-wire main controller to form a single group of ground temperature measurement modules, and the multiple temperature sensors and multiple 1-wire main controllers are connected one by one to form multiple groups of ground temperature measurement modules;

[0008] The amplifier module includes a plurality of amplifier units, each of which is connected to a 1-wire main controller of a ground temperature measurement module; the plurality of amplifier units are connected to a plurality of groups of ground temperature measurement modules in a one-to-one correspondence;

[0009] The data acquisition card module includes a plurality of data acquisition card units, each of which is connected to an amplifier unit, and the plurality of data acquisition card units are connected to the plurality of amplifier units in a one-to-one correspondence;

[0010] The data acquisition card module is connected to the single-chip computer module, and the single-chip computer module is connected to the information processing module;

[0011] The multiple 1-wire master controllers are connected to the single-chip microcomputer module, and the single-chip microcomputer module and the multiple 1-wire master controllers are connected to the single-chip microcomputer module. 2 C protocol for communication.

[0012] The temperature sensor adopts the ultra-precision temperature sensor MAX31725, and the temperature signal is converted into I 2 C method to the 1-wire master controller.

[0013] The 1-wire master controller adopts maxim company product DS28E17I 2 C to 1-wire bridge device.

[0014] The data acquisition card module adopts TI's 24-bit multi-channel AD converter MAX11410.

[0015] The amplifier module adopts the MAX4450 chip, and ground capacitors are added to the input and output ends of the amplifier module.

[0016] The information processing module includes an ili9486 liquid crystal display screen and a data storage SD card.

[0017] The single-chip microcomputer module adopts an STM32 single-chip microcomputer.

[0018] The present invention provides a method based on I 2 C and single bus controlled ground temperature measurement system, the technical effects are as follows:

[0019] 1. Use a single bus for communication. The single bus technology has the advantages of simple lines, low hardware overhead, low cost, and easy bus expansion and maintenance.

[0020] 2. Use 1-wire master controller with I 2 C protocol is used to transmit data with the microcontroller module, which greatly increases the transmission distance of the signal, and the transmission distance can reach 100m.

[0021] 3. Use the high-precision 16-bit temperature resolution MAX3172 series temperature sensor for temperature measurement, which can measure in the range of -40℃ to 105℃ and ensure an accuracy of ±0.005℃.

[0022] 4. The post-information processing module performs signal processing and can simultaneously display temperature and draw temperature curves, with powerful functions.

[0023] 5. Compared with the traditional geothermal measurement, the geothermal measurement system of the present invention is based on I2C and single bus technology. The measurement range of this system is -40 to 100°C, the measurement accuracy can reach ±0.006°C, and the measurement depth can reach 100m. Through software programming, the collected signal can be curve fitted and the geothermal distribution curve can be displayed, which can well reflect the geothermal field. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0025] Figure 1 It is a schematic diagram of module connection of the present invention;

[0026] Figure 2 This is a circuit diagram of connecting the distributed ground temperature measurement module of the present invention with the I²C host (STM32);

[0027] Figure 3 It is a schematic diagram of the device arrangement during measurement of the present invention. DETAILED DESCRIPTION

[0028] like Figure 1-Figure 3 As shown, a method based on I 2 The ground temperature measurement system based on C and single bus technology includes a distributed ground temperature measurement module a001, an amplifier module a004, a data acquisition card module a005, a single chip computer module a006, and an information processing module a007.

[0029] The amplifier module a004 is connected to the distributed ground temperature measurement module a001, and transmits the signal of the distributed ground temperature measurement module a001 to the data acquisition card module a005 after filtering and amplifying.

[0030] The distributed ground temperature measurement module a001 includes multiple temperature sensors a002 and multiple 1-wire main controllers a003. Each temperature sensor a002 is connected to a corresponding 1-wire main controller to form a single group of ground temperature measurement modules. The multiple temperature sensors a002 and multiple 1-wire main controllers a003 are connected one by one to form multiple groups of ground temperature measurement modules.

[0031] The amplifier module a004 includes a plurality of amplifier units, each of which is connected to a 1-wire main controller a003 of a ground temperature measurement module; and the plurality of amplifier units are connected to a plurality of groups of ground temperature measurement modules in a one-to-one correspondence.

[0032] The data acquisition card module a005 includes a plurality of data acquisition card units, each of which is connected to a corresponding amplifier unit, and the plurality of data acquisition card units are connected to the plurality of amplifier units in a one-to-one correspondence.

[0033] The data acquisition card module a005 is connected to the single chip computer module a006, and the single chip computer module a006 is connected to the information processing module a007;

[0034] The multiple 1-wire master controllers a003 are connected to the single chip microcomputer module a006, and the single chip microcomputer module a006 and the multiple 1-wire master controllers a003 are connected to the single chip microcomputer module a006. 2 C protocol for communication.

[0035] The temperature sensor a002 adopts the ultra-precision temperature sensor MAX31725. The 16-bit temperature resolution of the sensor can measure the temperature within the range of -40℃ to 105℃ with a high accuracy of ±0.5℃, and the temperature signal is converted into I 2 C mode is transmitted to the 1-wire master controller a003.

[0036] The 1-wire master controller A003 adopts maxim company product DS28E17I 2 C to 1-wire bridge device, which works with the microcontroller module a006 (ie: I2C master) and can support 100kHz and 400kHz I 2 C communication rate, the communication distance can be extended to 100m at most, which greatly improves the measurement distance.

[0037] The data acquisition card module a005 adopts TI's 24-bit multi-channel AD converter MAX11410, which allows up to 10 channels of data acquisition and can simultaneously provide more than 90dB of 50Hz and 60Hz power supply noise suppression. It is a commonly used ADC for high-precision temperature sensor measurement.

[0038] The amplifier module a004 adopts the MAX4450 chip, and ground capacitors are added to the input and output ends of the amplifier module a004 to filter out noise interference.

[0039] The information processing module a007 includes an ili9486 LCD display screen and a data storage SD card. The information processing module a007 includes functions such as data display, temperature curve drawing and data storage.

[0040] The single-chip microcomputer module a006 adopts an STM32 single-chip microcomputer. The temperature measured by the distributed ground temperature measurement module a001 is subjected to curve fitting through the STM32 single-chip microcomputer processing and displayed on the liquid crystal screen.

[0041] Figure 2 It is a distributed ground temperature measurement module a001 and a single chip microcomputer module a006 (i.e.: I 2 C host) connection circuit diagram. The purpose of extending the measurement distance to 100m is achieved through the chip DS28E17 b005 (1-wire to I²C host bridge device) and DS2482-100 b002 (I²C to 1-wire bridge device). DS28E17 and temperature sensor MAX31725 b006 are connected to form a group of ground temperature measurement modules. Each group of ground temperature measurement modules is connected to DS2482-100 through 1-wire BUS b003. Since each DS28E17 has a unique 64-bit ROM address, its node address can be accessed through the I²C host b001 (stm32).

[0042] A ground temperature measurement method based on I²C and single bus technology includes the following steps:

[0043] Step 1: If Figure 3 As shown, the distributed ground temperature measurement module a001 is buried in a pre-drilled deep well at intervals of 5m, with a total of 20 modules, and the well depth is greater than 100m;

[0044] Step 2: Connect a single I²C to 1-wire bridge device and 20 1-wire to I²C host bridge devices via a single bus.

[0045] Step 3: Access each distributed ground temperature measurement module a001 through the single-chip microcomputer module a006. Since each DS28E17 has a unique ROMD address, it can be accessed individually and communication is established. Figure 1 The amplifier module a004 and the data acquisition card module a005 shown in the figure complete the ground temperature signal acquisition work;

[0046] Step 4: Use the program to display the geothermal data, and use the curve fitting algorithm to draw the distributed geothermal curve. Display the curve graph on the LCD screen, and save the collected data to the data storage SD card.

Claims

1. A method based on I 2 The ground temperature measurement system based on C and single bus technology includes a distributed ground temperature measurement module (a001), an amplifier module (a004), a data acquisition card module (a005), a single chip computer module (a006), and an information processing module (a007); the characteristics are: The distributed ground temperature measurement module (a001) includes multiple temperature sensors (a002) and multiple 1-wire main controllers (a003), each temperature sensor (a002) is connected to a corresponding 1-wire main controller to form a single group of ground temperature measurement modules, and the multiple temperature sensors (a002) and multiple 1-wire main controllers (a003) are connected one by one to form multiple groups of ground temperature measurement modules; The amplifier module (a004) includes a plurality of amplifier units, each amplifier unit correspondingly connected to a 1-wire main controller (a003) of a ground temperature measurement module; the plurality of amplifier units are connected to the plurality of groups of ground temperature measurement modules in a one-to-one correspondence; The data acquisition card module (a005) includes a plurality of data acquisition card units, each of which is connected to an amplifier unit, and the plurality of data acquisition card units are connected to the plurality of amplifier units in a one-to-one correspondence; The data acquisition card module (a005) is connected to the single chip computer module (a006), and the single chip computer module (a006) is connected to the information processing module (a007); The multiple 1-wire master controllers (a003) are connected to the single chip microcomputer module (a006), and the single chip microcomputer module (a006) and the multiple 1-wire master controllers (a003) are connected to the single chip microcomputer module (a006). 2 C protocol for communication; DS28E17 and temperature sensor (a002) are connected to form a set of ground temperature measurement modules. Each set of ground temperature measurement modules is connected to DS2482-100 via 1-wire BUSb003. The ground temperature measurement method based on the above ground temperature measurement system includes the following steps: Step 1: Bury the distributed ground temperature measurement modules (a001) into the pre-drilled deep well at intervals of 5 meters, for a total of 20 modules; Step 2: Connect a single I 2 C to 1-wire bridge devices and 20 1-wire to I 2 C host bridge device; Step 3: Access each distributed ground temperature measurement module (a001) through the single-chip microcomputer module (a006). Since each DS28E17 has a unique ROMD address, it can be accessed individually and communication is established. The ground temperature signal acquisition work is completed through the amplifier module (a004) and the data acquisition card module (a005); Step 4: Use the program to display the ground temperature data, and use the curve fitting algorithm to draw the distributed ground temperature curve. The curve graph is displayed on the LCD screen, and the collected data is saved in the data storage SD card.

2. According to claim 1, a method based on I 2 C and single bus technology ground temperature measurement system, characterized by: The temperature sensor (a002) adopts the ultra-precision temperature sensor MAX31725, and converts the temperature signal into I 2 C mode is transmitted to the 1-wire master controller (a003).

3. A method according to claim 1 based on I 2 C and single bus technology ground temperature measurement system, characterized by: The 1-wire master controller (a003) uses the maxim company product DS28E17I 2 C to 1-wire bridge device.

4. A method according to claim 1 based on I 2 C and single bus technology ground temperature measurement system, characterized by: The data acquisition card module (a005) adopts TI's 24-bit multi-channel AD converter MAX11410.

5. According to claim 1, a method based on I 2 C and single bus technology ground temperature measurement system, characterized by: The amplifier module (a004) adopts a MAX4450 chip, and ground capacitors are added to the input and output ends of the amplifier module (a004).

6. A method according to claim 1 based on I 2 C and single bus technology ground temperature measurement system, characterized by: The information processing module (a007) includes an ili9486 liquid crystal display screen and a data storage SD card.

7. According to claim 1, a method based on I 2 C and single bus technology ground temperature measurement system, characterized by: The single chip microcomputer module (a006) adopts an STM32 single chip microcomputer.

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