A VCSEL sensor packaging structure and packaging method thereof

Abstract

The present invention discloses a VCSEL sensor packaging structure and a packaging method thereof. The structure integrates substrates of multiple packaging structures on a bottom plate, and also integrates side walls of multiple packaging structures on a side plate. The packaging method can form multiple packaging structures at one time, and the formed packaging structures have the same size, so that multiple packaging structures can be formed at the same time. While the efficiency is high, the size of the packaging structures is consistent, the yield is high, and the cost is reduced.

Description

[Technical field]

[0001] The invention belongs to the field of semiconductor lasers and relates to a VCSEL sensor packaging structure and a packaging method thereof. [Background technology]

[0002] VCSEL (Vertical Cavity Surface Emitting Laser) is developed based on gallium arsenide semiconductor materials. It is different from other light sources such as LED (light emitting diode) and LD (Laser Diode). It has the advantages of small size, circular output spot, single longitudinal mode output, small threshold current, low price, and easy integration into large-area arrays. It is widely used in optical communications, optical interconnection, optical storage and other fields.

[0003] For the packaging of VCSEL chips, it is usually necessary to set a dam on the substrate to form a cavity with the substrate, and encapsulate the VCSEL chip in the cavity. There are currently two commonly used methods for forming dams: one is to form a dam around the VCSEL chip by scribing; the other is to form a dam plastic part in advance by injection molding, and then bond the plastic dam to the substrate.

[0004] Currently, both solutions have problems during the operation process, such as unstable quality, inconsistent sizes of produced substrates, and low production efficiency, resulting in high production costs. [Summary of the invention]

[0005] The purpose of the present invention is to overcome the disadvantages of the prior art and provide a VCSEL sensor packaging structure and a packaging method thereof. The packaging structure simplifies the packaging steps of the VCSEL sensor and improves the packaging quality by integrally forming all side panels into a whole side panel.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A VCSEL sensor packaging structure comprises a bottom plate and a side plate, wherein M×N substrate blocks are arranged on the bottom plate, and M×N side wall blocks are arranged on the side plate, wherein one substrate block is fixedly connected to the lower end of one side wall block, and a cover plate is fixedly connected to the upper ends of all the side wall blocks; one substrate block, one side wall block and the cover plate together constitute a packaging structure, a VCSEL chip is fixedly arranged on each substrate block in the packaging structure, and the VCSEL chip is electrically connected to the substrate block; and M and N are both natural numbers ≥1.

[0008] A further improvement of the present invention is:

[0009] Preferably, the bottom plate includes a bottom plate blank area and M substrate areas, and the bottom plate blank area is between adjacent substrate areas; each substrate area is provided with N substrate blocks.

[0010] Preferably, the substrate areas are arranged in rows and columns on the bottom plate; and the substrate blocks are arranged in rows and columns on the substrate areas.

[0011] Preferably, a metal circuit of a VCSEL sensor is laid on each substrate block; and the bottom plate is made of ceramic or resin.

[0012] Preferably, the side panel includes a side panel blank area and M side wall areas, and adjacent side wall areas are fixedly connected through the side panel blank area; each side wall area is composed of N side wall blocks; each side wall block is composed of four side walls; the four side walls are perpendicular to the substrate block, and are fixedly connected to the four sides of a substrate block.

[0013] Preferably, the side panels are made of copper or resin.

[0014] Preferably, the VCSEL chip and the substrate block are electrically connected via metal bonding wires.

[0015] Preferably, the cover plate is made of light-transmitting glass.

[0016] A packaging method for the above-mentioned VCSEL sensor packaging structure comprises the following steps:

[0017] Step 1, press the bottom plate and the side plate together, and fix the bottom plate and the side plate together by glue, and each base plate block is fixedly connected to a side wall block, forming a total of M×N semi-encapsulated structures;

[0018] Step 2, placing M×N VCSEL chips in M×N semi-package structures by using a core loading device, with one VCSEL chip placed in one semi-package structure, and each VCSEL chip is fixedly connected to the substrate block by glue;

[0019] Step 3, bonding each VCSEL chip to the corresponding substrate block through metal wire bonding;

[0020] Step 4, fixing the cover plate together at the upper ends of all the side wall blocks by glue, and at the same time each VCSEL chip is enclosed in a cavity of a packaging structure, forming a total of M×N interconnected packaging structures;

[0021] Step 5: cutting the interconnected M×N package structures into M×N separate package structures.

[0022] Preferably, in step 1, solder paste or silicone adhesive is used as glue for fixing the bottom plate and the side plate; in step 2, conductive DAF or epoxy resin glue is used as glue for fixing the VCSEL chip and the substrate block; in step 4, silicone or epoxy resin glue is used as glue for fixing the side wall block and the cover plate.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The present invention discloses a VCSEL sensor packaging structure, which integrates substrates of multiple packaging structures on a bottom plate, and also integrates side walls of multiple packaging structures on a side plate, so that multiple packaging structures are formed at the same time, with high efficiency, consistent size of packaging structures, high yield rate and low cost.

[0025] Furthermore, there are blank areas between the substrate areas, and the substrate areas and substrate blocks are arranged in rows and columns, which is convenient for arranging the position of the packaging structure, so that the sizes of the substrate areas and substrate blocks are consistent, thereby ensuring the consistency of the sizes of all sensors; at the same time, it is convenient for the final cutting.

[0026] The present invention also discloses a packaging method for a VCSEL sensor packaging structure. The packaging method can form multiple packaging structures at one time, and the formed packaging structures have consistent sizes and good quality yield. Compared with the prior art, the method has high production efficiency, simple process and low cost.

Brief Description of the Drawings

[0027] Figure 1 It is a schematic diagram of the bottom plate structure of the present invention;

[0028] Figure 2 A top view of the side plate structure of the present invention;

[0029] Figure 3 It is a cross-sectional view of the side plate structure of the present invention along the AA plane;

[0030] Figure 4 It is a schematic diagram of a separate packaging structure of the present invention;

[0031] Among them: 1-bottom plate; 2-side plate; 3-VCSEL chip; 4-metal bonding wire; 5-cover plate; 6-side wall; 7-blank area of ​​bottom plate; 8-blank area of ​​side plate; 9-substrate area; 10-substrate block; 11-side wall area; 12-side wall block. [Specific implementation method]

[0032] The present invention is further described in detail below with reference to the accompanying drawings and specific steps:

[0033] See also Figure 1 The present invention discloses a VCSEL sensor packaging structure and a packaging method thereof, wherein the sensor comprises a bottom plate 1, a side plate 2, a VCSEL chip 3, a metal bonding wire 4 and a cover plate 5. The bottom plate 1 comprises a bottom plate blank area 7 and a substrate area 9, wherein the substrate area 9 comprises a substrate block 10; the side plate 2 comprises a side plate blank area 8 and a side wall area 11, wherein the side wall area 11 comprises a side wall block 12, and the side wall block 12 comprises a side wall 6.

[0034] The base plate 1 is a carrier plate of the packaging structure, which is made of ceramic or resin. The base plate 1 includes a substrate area 9 and a base plate blank area 7. The base plate 1 includes M substrate areas 9, and the blank areas 7 are between adjacent substrate areas 9. The substrate areas 9 and the blank areas 7 on the base plate 1 are integrally formed; each substrate area 9 includes N substrate blocks 10; each substrate block 10 is a substrate of a VCSEL sensor, so there are M×N substrate blocks 10 on one base plate 1; each substrate block 10 is provided with a metal circuit of a sensor, so there are N metal circuits on one substrate area 9, and all the metal circuits form a metal circuit layer.

[0035] The side panel 2 serves as the side wall of the packaging structure and is made of copper or resin. The side panel 2 includes a side wall area 11 and a side panel blank area 8. The side panel 2 includes M side wall areas 11. The adjacent side wall areas 11 are each separated by a side panel blank area 8. The side wall area 11 and the side panel blank area 8 are integrally formed. Each side wall area 11 is composed of N side wall blocks 12. Therefore, one side panel 2 includes M×N side wall blocks 12. Each side wall block 12 includes four side walls 6. The four side walls 6 are fixed to form a square side wall block 12. Adjacent side wall blocks 12 share one side wall 6, that is, each side wall 6 belongs to two packaging structures, and each side wall 6 is perpendicular to the bottom panel 1. The height of each side wall 6 is determined by the required cavity height of the packaging structure.

[0036] Combined with the above analysis, it can be known that the present invention is to fix the substrates of multiple packaging structures on a bottom plate 1 as a whole, that is, a bottom plate 1 is divided into multiple substrate blocks 10; the side walls 6 of multiple packaging structures are fixed and formed on a side plate 2 as a whole, and the substrate area 9 on the bottom plate 1 corresponds to the side wall area 11, one substrate block 10 corresponds to one side wall block 12, and the blank area 7 of the bottom plate corresponds to the blank area 8 of the side plate, and the correspondence is that both the position and the quantity correspond; and the substrate areas 9 are arranged in rows and columns on the bottom plate 1, and the substrate blocks 10 are arranged in rows and columns on the substrate area 9, and the corresponding side walls 6 are fixed and formed on the side plate 2. The wall area (11) is arranged in rows and columns on the side plate 2, and the side wall blocks 12 are arranged in rows and columns; when finally encapsulated, the side plate 2 is uniformly fixed on the bottom plate 1, and a cover plate 5 is encapsulated on the top of the side plate 2, that is, M×N encapsulation structures can be formed on one bottom plate 1 at a time, and each encapsulation structure includes a substrate block 10 and a side wall block 12, that is, one substrate block 10 corresponds to four side walls 6; so that the sizes of multiple encapsulation structures are uniform, the process is simple, and the number of encapsulation structures formed can be adjusted according to actual conditions, and M and N can be set according to actual conditions. The cover plate 5 in this embodiment is selected from light-transmitting glass.

[0037] Both M and N are natural numbers ≥1.

[0038] Each packaging structure is also provided with a metal bonding wire 4 . The metal bonding wire 4 is made of metal material and is used to electrically connect each VCSEL chip 3 and the substrate block 10 .

[0039] The packaging process of the packaging structure of the present invention specifically includes the following steps:

[0040] Step 1: Press the bottom plate 1 and the side plate 2 together to form a cavity

[0041] Before lamination, glue is applied to the joints between the bottom plate 1 and the side plate 2, that is, glue is applied to the bottom plate 1 corresponding to each side wall 6, using a steel screen printing method. The glue material can be solder paste or silicone adhesive.

[0042] Step 2: Install the core

[0043] The M×N VCSEL chips 3 are die-bonded on the substrate after the bottom plate 1 and the side plate 2 are pressed together using a die-bonding device. The die-bonding glue can be conductive DAF or epoxy resin glue. The conductive DAF is an ultra-thin film adhesive.

[0044] Step 3, Bonding

[0045] The VCSEL chip 3 is bonded to the substrate block 10 in each packaging structure by bonding with metal wires as metal bonding wires 4 , thereby achieving electrical connection between the VCSEL chip 3 and the base plate 1 .

[0046] Step 4, fix the cover 5

[0047] The cover plate 5 is fixed to the upper end of the side plate 2 by a core loading device; at the same time, the VCSEL chip 3 is enclosed in the cavity of each packaging structure; the fixing glue for fixing the cover plate 5 and the VCSEL chip 3 is silicone or epoxy resin glue.

[0048] Step 5: Cut the packaged finished product into M×N single package structures.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging method for a VCSEL sensor packaging structure, characterized in that: The packaging structure of the VCSEL sensor comprises a bottom plate (1) and a side plate (2); M×N substrate blocks (10) are arranged on the bottom plate (1); M×N side wall blocks (12) are arranged on the side plate (2); one substrate block (10) is fixedly connected to the lower end of one corresponding side wall block (12); and the upper ends of all the side wall blocks (12) are fixedly connected to a cover plate (5); one substrate block (10), one side wall block (12) and the cover plate (5) together form a packaging structure; one VCSEL chip (3) is fixedly arranged on the substrate block (10) in each packaging structure; and the VCSEL chip (3) and the substrate block (10) are electrically connected; M and N are both natural numbers ≥1; The bottom plate (1) comprises a bottom plate blank area (7) and M substrate areas (9), and the bottom plate blank area (7) is between adjacent substrate areas (9); each substrate area (9) is provided with N substrate blocks (10); The side plate (2) comprises a side plate blank area (8) and M side wall areas (11), and adjacent side wall areas (11) are fixedly connected via the side plate blank area (8); each side wall area (11) is composed of N side wall blocks (12); each side wall block (12) is composed of four side walls (6); the four side walls (6) are perpendicular to the base plate block (10) and are fixedly connected to four sides of a base plate block (10); The following steps are involved: Step 1, pressing the bottom plate (1) and the side plate (2), and fixing the bottom plate (1) and the side plate (2) with glue, wherein each base plate block (10) is fixedly connected to a corresponding side wall block (12), so as to form a total of M×N semi-encapsulated structures; Step 2, placing M×N VCSEL chips (3) in M×N semi-package structures by using a core loading device, with one VCSEL chip (3) placed in one semi-package structure, and each VCSEL chip (3) and the substrate block (10) being fixedly connected by glue; Step 3, bonding each VCSEL chip (3) and the corresponding substrate block (10) by metal wire bonding; Step 4, fixing the cover plate (5) together at the upper ends of all the side wall blocks (12) by means of glue, and at the same time each VCSEL chip (3) is enclosed in a cavity of a packaging structure, so as to form a total of M×N interconnected packaging structures; Step 5: cutting the interconnected M×N package structures into M×N separate package structures.

2. The packaging method of the VCSEL sensor packaging structure according to claim 1, characterized in that: The substrate areas (9) are arranged in rows and columns on the bottom plate (1); and the substrate blocks (10) are arranged in rows and columns on the substrate areas (9).

3. The packaging method of the VCSEL sensor packaging structure according to claim 1, characterized in that: A metal circuit of a VCSEL sensor is laid on each substrate block (10); the bottom plate (1) is made of ceramic or resin.

4. The packaging method of the VCSEL sensor packaging structure according to claim 1, characterized in that: The side plate (2) is made of copper or resin.

5. The packaging method of the VCSEL sensor packaging structure according to claim 1, characterized in that: The VCSEL chip (3) and the substrate block (10) are electrically connected via a metal bonding wire (4).

6. The packaging method of the VCSEL sensor packaging structure according to any one of claims 1 to 5, characterized in that: The cover plate (5) is made of light-transmitting glass.

7. The packaging method of the VCSEL sensor packaging structure according to claim 1, characterized in that: In step 1, solder paste or silicone adhesive is used as glue for fixing and connecting the bottom plate (1) and the side plate (2); in step 2, conductive DAF or epoxy resin glue is used as glue for fixing and connecting the VCSEL chip (3) and the substrate block (10); and in step 4, silicone or epoxy resin glue is used as glue for fixing and connecting the side wall block (12) and the cover plate (5).

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