Electronic components

Abstract

The present invention is applicable to the field of semiconductor technology, and provides an electronic component, including a substrate, a chip arranged on the substrate, a pin electrically connected to the chip, a conductive sheet with one end attached to the top surface of the chip, and a glue seat solidified and formed on the substrate to support the pin and the conductive sheet, the glue seat is provided with a corresponding window exposing the other end of the conductive sheet, one end of the pin is fixed in the glue seat and electrically connected to the chip, and the other end extends out of the glue seat. The substrate, chip, pin and conductive sheet can be glued and fixed respectively by the glue seat, the conductive sheet is arranged in the window opened in the glue seat, one end of the conductive sheet is attached to the top surface of the chip, and the other end is exposed from the window, the two opposite sides of the chip are attached to the conductive sheet and the substrate respectively, part of the heat of the chip can be transferred to the substrate and diffused, and the other part of the heat can be transferred to the conductive sheet and diffused, so the heat of the chip can be diffused from both sides thereof, so that the heat dissipation effect of the chip is good and the service life of the electronic component is long.

Description

Technical Field

[0001] The present invention is applicable to the field of semiconductor technology, and more specifically, relates to an electronic component. Background Art

[0002] Semiconductor devices refer to objects whose electrical conductivity at room temperature is between that of conductors and insulators. Since their conductivity can be controlled, ranging from insulators to conductors, they are widely used in the field of electronic equipment technology.

[0003] Existing semiconductor devices mainly transfer heat to the PCB (Printed Circuit Board) attached to it through the metal sheet of the chip itself, and then transfer the heat to the surrounding components to achieve heat dissipation. Since semiconductor devices can only achieve one-sided heat dissipation, the heat dissipation effect of semiconductor devices is poor, which will affect the working performance and efficiency of semiconductor devices. Excessive temperature may even burn the chip, seriously affecting the service life of semiconductor devices. Summary of the invention

[0004] The object of the present invention is to provide an electronic component to solve the problem of poor heat dissipation effect of semiconductor devices in the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide an electronic component, including a substrate, a chip arranged on the substrate, a pin electrically connected to the chip, a conductive sheet with one end attached to the top surface of the chip, and a glue seat cured and formed on the substrate to seal and fix the pin and the conductive sheet, wherein the glue seat is provided with a corresponding window to expose the other end of the conductive sheet, one end of the pin is sealed and fixed in the glue seat, and one end of the pin is electrically connected to the chip, and the other end of the pin extends out of the glue seat.

[0006] Furthermore, the conductive sheet includes a first section exposing the window, a second section bent at one end of the first section toward the chip, and a third section parallel to the first section and bent toward away from the first section at a free end of the second section, the second section is perpendicular to the first section, the second section is perpendicular to the third section, and the third section is attached to the top surface of the chip.

[0007] Furthermore, the electronic component also includes a heat-conducting heat sink attached to the top surface of the first section, and the window wraps around the periphery of the heat-conducting heat sink.

[0008] Furthermore, the third section and a corresponding end of the heat-conducting heat sink are spaced apart.

[0009] Furthermore, the substrate comprises a base plate and connecting plates respectively arranged at two ends of the base plate, and the chip is arranged on the base plate.

[0010] Furthermore, each of the connecting plates includes a first section bent at the corresponding end of the substrate toward the chip, a second section bent at the free end of the first section toward a direction away from the chip, and a third section bent at the free end of the second section toward the substrate, the first section is perpendicular to the substrate, the second section is perpendicular to the first section, and the third section is perpendicular to the second section.

[0011] Furthermore, the substrate further comprises connecting strips respectively arranged at two ends of the base plate, one end of each connecting strip is arranged on the base plate, and the other end of each connecting strip extends out of the adhesive seat.

[0012] Furthermore, the pin includes a first connection pin having one end electrically connected to the chip, and the other end of the first connection pin extends out of the adhesive seat.

[0013] Furthermore, the pin also includes a second connection pin having one end electrically connected to the chip, one end of the second connection pin extends out of the adhesive seat, and the first connection pin and the second connection pin are arranged at intervals.

[0014] Furthermore, the length of the second connecting pin is greater than the length of the first connecting pin.

[0015] The beneficial effect of the electronic components provided by the present invention is that: compared with the prior art, the present invention can respectively glue and fix the substrate, chip, pin and conductive sheet through the glue seat, the conductive sheet is arranged in the window opened by the glue seat, one end of the conductive sheet is in contact with the top surface of the chip, and the other end is exposed from the window, and the two opposite sides of the chip are respectively in contact with the conductive sheet and the substrate, part of the heat of the chip can be transferred to the substrate and diffused, and the other part of the heat can be transferred to the conductive sheet and diffused, so the heat of the chip can be diffused from both sides thereof, so that the heat dissipation effect of the chip is good and the service life of the electronic components is long. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the front structure of an electronic component provided in Embodiment 1 of the present invention;

[0018] Figure 2 A schematic diagram of the back structure of an electronic component provided in Embodiment 1 of the present invention;

[0019] Figure 3 A front view of an electronic component provided in Embodiment 1 of the present invention;

[0020] Figure 4 An exploded schematic diagram of an electronic component provided in Embodiment 1 of the present invention;

[0021] Figure 5 for Figure 3 Sectional view in the AA direction;

[0022] Figure 6 A schematic diagram of the structure of a conductive sheet provided in Embodiment 1 of the present invention;

[0023] Figure 7 A schematic diagram of the structure of the connection between the chip and the substrate of the adhesive base provided in the first embodiment of the present invention;

[0024] Figure 8 A schematic diagram of the structure of a first connection pin provided in Embodiment 1 of the present invention;

[0025] Fig. 9 A schematic diagram of the structure of a second connection pin provided in Embodiment 1 of the present invention;

[0026] Fig.10 Schematic diagram of the structure of the adhesive base provided in the first embodiment of the present invention Figure 1 ;

[0027] Fig.11 Schematic diagram of the structure of the adhesive base provided in the first embodiment of the present invention Figure 2 ;

[0028] Fig.12 A schematic diagram of the front structure of an electronic component provided in Embodiment 2 of the present invention;

[0029] Fig.13 This is a schematic diagram of the back structure of the electronic component provided in the second embodiment of the present invention.

[0030] Among them, the main marks of the drawings in the figure are:

[0031] 1- Chip;

[0032] 2-substrate; 21-base plate; 211-slot; 22-connecting plate; 221-first section; 222-second section; 223-third section; 23-connecting strip;

[0033] 3-pin; 31-first connection pin; 311-first section; 312-second section; 313-third section; 314-extended end; 32-second connection pin; 321-first piece; 322-second piece; 323-third piece; 324-extended end;

[0034] 4-rubber seat; 40-opening window; 41-first groove; 42-second groove; 43-opening hole; 44-positioning hole; 45-accommodating groove; 46-notch; 47-support block;

[0035] 51-heat-conducting heat sink; 52-conductive sheet; 521-first section; 522-second section; 523-third section;

[0036] 6- Conductor. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Embodiment 1:

[0043] Please also read Figures 1 to 11 , the electronic component provided by the first embodiment of the present invention is now described. The electronic component comprises a substrate 2, a chip 1 arranged on the substrate 2, a pin 3 electrically connected to the chip 1, a conductive sheet 52 with one end attached to the top surface of the chip 1, and a glue seat 4 solidified and formed on the substrate 2 to support the pin 3 and the conductive sheet 52, and the glue seat 4 is provided with a window 40 for exposing the other end of the conductive sheet 52, and the window 40 can wrap and fix the periphery of the conductive sheet 52; one end of the pin 3 is fixed in the glue seat 4, and the end is electrically connected to the chip 1, and the other end of the pin 3 extends out of the glue seat 4 so as to be electrically connected to an external device.

[0044] The chip 1 is located between the conductive sheet 52 and the substrate 2, and the top surface of the chip 1 is attached to the bottom surface of the conductive sheet 52, the bottom surface of the chip 1 is attached to the top surface of the substrate 2, the top surface of the conductive sheet 52 is exposed from the window 40 of the adhesive seat 4, and the bottom surface of the substrate 2 can be set on the PCB board. In this way, the heat of the chip 1 can be transferred to the conductive sheet 52 and the substrate 2 respectively and diffused, so that the electronic component can dissipate heat from the chip 1 from both sides of the adhesive seat 4, thereby improving the heat dissipation efficiency of the chip 1, improving the performance of the electronic component and extending the service life.

[0045] The adhesive seat 4 may be made of epoxy resin material cured and molded, or may be made of other insulating materials, which is not limited here.

[0046] The conductive sheet 52 may be a metal sheet or metal wire made of a highly conductive metal material for heat and electricity conduction, such as aluminum, copper, gold, silver, nickel, etc. In other embodiments, it may be replaced by a wire to achieve the conductive function, which is not limited here.

[0047] The model of the above electronic component is TDP0405-4, where TDP (Thermal Design Power) refers to the package name; 0405 refers to the package size, specifically 4 in width and 5 in length, and the unit value can be adjusted according to actual production, such as mm, cm, dm, etc.; -4 refers to the number of pins 3, specifically, the number of pins 3 of this electronic component is 4. In other embodiments, the size of the electronic component and the number of pins 3 can be adjusted according to actual production, and are not limited here.

[0048] The assembly process of the above electronic components is:

[0049] 1. Place the substrate 2 in the cavity, and place the chip 1 in the cavity;

[0050] 2. Set pin 3 at the corresponding position of the cavity and electrically connect pin 3 to chip 1;

[0051] 3. Place the conductive sheet 52 at the corresponding position of the cavity and fit it with the chip 1;

[0052] 4. Inject glue into the cavity to seal and solidify to form a glue seat 4, and seal and fix the substrate 2, chip 1, pin 3 and conductive sheet 52.

[0053] The serial numbers of the steps in the above-mentioned electronic component assembly process do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and can be adjusted according to actual production, and should not constitute any limitation on the implementation process of Example 1 of the present invention.

[0054] Since the electronic component can dissipate heat from both sides, the electronic component can be used on both sides, and this is not limited here.

[0055] Compared with the prior art, the electronic component provided by the present invention can respectively glue and fix the substrate 2, the chip 1, the pin 3 and the conductive sheet 52 through the glue seat 4. The conductive sheet 52 is arranged in the window 40 opened by the glue seat 4. One end of the conductive sheet 52 is in contact with the top surface of the chip 1, and the other end is exposed from the window 40. The two opposite side surfaces of the chip 1 are respectively in contact with the conductive sheet 52 and the substrate 2. Part of the heat of the chip 1 can be transferred to the substrate 2 and diffused, and the other part of the heat can be transferred to the conductive sheet 52 and diffused. Therefore, the heat of the chip 1 can be diffused from both sides thereof, so that the heat dissipation effect of the chip 1 is good and the service life of the electronic component is long.

[0056] The present invention reduces electrical internal resistance, increases passing current, improves electrical energy efficiency and power, and reduces the temperature of components and products.

[0057] Compared with traditional device packaging, the electronic components of the present invention have the advantages of reducing production materials, simplifying production processes, thereby reducing device costs, and improving production efficiency.

[0058] Compared with traditional device packaging, the electronic components of the present invention do not require cumbersome manual processes when producing PCBA (Printed Circuit Board Assembly), and 100% of the work is done by machines, thereby improving production efficiency and reducing production costs.

[0059] Please also refer to Figure 5 and Figure 6 As a specific implementation of the electronic component provided in Example 1 of the present invention, the conductive sheet 52 includes a first section 521 exposing the window 40, a second section 522 bent at one end of the first section 521 toward the direction close to the chip 1, and a third section 523 parallel to the first section 521 and bent toward the direction away from the first section 521 at the free end of the second section 522. The second section 522 is perpendicular to the first section 521, the second section 522 is perpendicular to the third section 523, and the third section 523 is attached to the top surface of the chip 1.

[0060] Specifically, the conductive sheet 52 is in a "Z"-shaped structure, the third section 523 is parallel to the top surface of the chip 1, the projection of the third section 523 on the chip 1 all falls on the chip 1, and the third section 523 has the same length as the chip 1. This structure, by bending the conductive sheet 52 into the first section 521, the second section 522 and the third section 523, can effectively increase the heat conduction distance of heat, effectively improve the heat dissipation efficiency, and thus improve the heat conduction efficiency of the chip 1.

[0061] Please also refer to Figure 4 and Figure 5 As a specific implementation of the electronic component provided in the first embodiment of the present invention, the electronic component also includes a heat-conducting heat sink 51 attached to the top surface of the first section 521, and the window 40 wraps around the periphery of the heat-conducting heat sink 51.

[0062] Specifically, the electronic components are symmetrically distributed with respect to the central axis of the substrate 2, and there are two windows 40, each of which is provided with a conductive sheet 52 and a heat-conducting heat sink 51. Each window 40 is in an "L" shape, and the heat-conducting heat sink 51 has a configuration consistent with the cross-section of the window 40, which is convenient for supporting and fixing the heat-conducting heat sink 51. The conductive sheet 52 is arranged between the heat-conducting heat sink 51 and the chip 1, and the top surface of the heat-conducting heat sink 51 is flush with the top surface of the adhesive seat 4, which can make the configuration of the electronic components square, and the bottom surface of the heat-conducting heat sink 51 is in contact with the top surface of the first section 521 of the conductive sheet 52. Optionally, the heat-conducting heat sink 51 is made of copper material, so it has excellent heat conduction and electrical conductivity.

[0063] This structure, by attaching a heat-conducting heat sink 51 to the first section 521 of the conductive sheet 52, can, on the one hand, extend the heat conduction path of heat; on the other hand, by arranging the heat-conducting heat sink 51 to have the same configuration as the cross-section of the window 40, the heat conduction area of ​​the heat can be increased, thereby improving the heat conduction efficiency of the chip 1.

[0064] Please also refer to Figure 5 As a specific implementation of the electronic component provided in the first embodiment of the present invention, the third section 523 is spaced apart from the corresponding end of the heat-conducting heat sink 51. With this structure, during the process of injecting glue into the electronic component, the filled curing glue can flow into the space, and when the curing glue is cured to form the glue seat 4, a part of the glue seat 4 plays a supporting and fixing role for the heat-conducting heat sink 51 and the conductive sheet 52 in the space, so that the heat-conducting heat sink 51 and the conductive sheet 52 are firmly fixed.

[0065] Please also refer to Figure 7 As a specific implementation of the electronic component provided in the first embodiment of the present invention, the substrate 2 includes a base plate 21 and connecting plates 22 respectively arranged at both ends of the base plate 21, and the chip 1 is arranged on the base plate 21. In this structure, by respectively arranging connecting plates 22 at both ends of the base plate 21, after the heat of the chip 1 is transferred to the base plate 21, the base plate 21 can transfer the heat to each connecting plate 22 for diffusion, which can increase the heat transfer area, and further improve the heat dissipation effect of the chip 1.

[0066] Optionally, the connecting plate 22 may be a hollow structure. Of course, in other embodiments, the connecting plate 22 may be a solid structure, the connecting plate 22 may be flush with the top or bottom surface of the rubber seat 4, and the connecting plate 22 is not limited in length, width, thickness, shape, etc., and is not limited here.

[0067] Grooves 211 are provided on the substrate 21 and around the chip 1 to prevent moisture and air leakage, increase the contact area, and facilitate the sealing and fixing of electronic components.

[0068] Please also refer to Figure 7 As a specific implementation of the electronic component provided in Example 1 of the present invention, each connecting plate 22 includes a first section 221 bent at the corresponding end of the substrate 21 toward the chip 1, a second section 222 bent at the free end of the first section 221 toward the direction away from the chip 1, and a third section 223 bent at the free end of the second section 222 toward the substrate 21. The first section 221 is perpendicular to the substrate 21, the second section 222 is perpendicular to the first section 221, and the third section 223 is perpendicular to the second section 222.

[0069] Specifically, the cured and formed rubber seat 4 has a notch 46 for supporting each connecting plate 22, and each of the two ends of the notch 46 is provided with a support block 47 for supporting the second section 222 of the corresponding connecting plate 22. In this structure, the two support blocks 47 in each notch 46 can support the two ends of the second section 222 of the corresponding connecting plate 22, and the two support blocks 47 are respectively spaced apart from the inner side wall of the notch 46, so as to facilitate the first section 221 of each connecting plate 22 to pass through.

[0070] This structure, by bending the connecting plate 22 into the first section 221 , the second section 222 and the third section 223 , can facilitate the support and fixation of the substrate 2 on the one hand; on the other hand, it can extend the heat transfer path and improve the heat diffusion efficiency of the chip 1 .

[0071] Please also refer to Figure 7 As a specific implementation of the electronic component provided in Example 1 of the present invention, the substrate 2 also includes connecting strips 23 respectively arranged at both ends of the substrate 21, one end of each connecting strip 23 is arranged on the substrate 21, and the other end of each connecting strip 23 extends out of the glue seat 4.

[0072] Specifically, the connecting strips 23 are preferably made of copper material, and the cured plastic seat 4 has openings 43 corresponding to each connecting strip 23 and through which the corresponding connecting strips 23 pass. In this structure, on the one hand, each connecting strip 23 is arranged through the corresponding opening 43, which can effectively support the substrate 2 and the chip 1; on the other hand, the heat on the substrate 2 can also be transferred to the connecting strips 23 and diffused, thereby improving the heat dissipation effect.

[0073] Please also refer to Figure 4 and Figure 8 As a specific implementation of the electronic component provided in the first embodiment of the present invention, the pin 3 includes a first connection pin 31 whose one end is electrically connected to the chip 1 , and the other end of the first connection pin 31 extends out of the glue seat 4 .

[0074] Specifically, the first connection pin 31 includes a first section 311 fixed on the rubber seat 4, a second section 312 bent at one end of the first section 311 toward the chip 1, and a third section 313 bent at the free end of the second section 312 toward a direction away from the first section 311. The first section 311 is perpendicular to the second section 312, the second section 312 is perpendicular to the third section 313, and the third section 313 is arranged parallel to the first section 311. The first section 311 is electrically connected to the chip 1 through the conductor 6, and an extension end 314 extends from one end of the first section 311 to facilitate the support and fixation of the first connection pin 31; the third section 313 extends from the corresponding end of the rubber sleeve 4 to be connected to an external device.

[0075] There are two first connection pins 31, which are located on both sides of the substrate 2, respectively, to facilitate connection with external devices in different directions; the first connection pins 31 are conductors made of copper material, so they have excellent heat and electrical conductivity.

[0076] The conductor 6 can be a metal sheet with conductive properties such as a wire, a conductive sheet, etc. In the first embodiment, the conductor 6 is made of copper material.

[0077] Please also refer to Figure 4 and Fig. 9 As a specific implementation of the electronic component provided in Example 1 of the present invention, the pin 3 also includes a second connection pin 32 whose one end is electrically connected to the chip 1, one end of the second connection pin 32 extends out of the glue seat 4, and the first connection pin 31 and the second connection pin 32 are arranged at intervals.

[0078] Specifically, the second connecting pin 32 includes a first piece 321 that is bonded to the first section 521 of the conductive sheet 52, a second piece 322 that is bent at one end of the first piece 321 toward the substrate 2, and a third piece 323 that is bent at the free end of the second piece 322 toward away from the first piece 321. The first piece 321 is perpendicular to the second piece 322, the second piece 322 is perpendicular to the third piece 323, the first piece 321 is parallel to the third piece 323, and an extension end 324 extends from one end of the first piece 321 to facilitate the support and fixation of the second connecting pin 32.

[0079] There are two second connecting pins 32, which are respectively located on both sides of the substrate 2. Each second connecting pin 32 is spaced apart from the corresponding first connecting pin 31. Each connecting strip 23 is arranged between the corresponding second connecting pin 32 and the corresponding first connecting pin 31. The first connecting pin 31 and the second connecting pin 32 are on the same plane, and the height of each connecting strip 23 is higher than the first connecting pin 31 or the second connecting pin 32.

[0080] The second connection pin 32 is electrically connected to the chip 1 through the conductive sheet 52, and not only has electrical conductivity, but also can achieve effective heat conduction, thereby improving the heat dissipation of the chip 1. The second connection pin 32 is a conductor made of copper material, and thus has excellent heat conduction and electrical conductivity.

[0081] Please also refer to Figure 4 As a specific implementation of the electronic component provided in the first embodiment of the present invention, the length of the second connection pin 32 is greater than the length of the first connection pin 31. With this structure, the second connection pin 32 has better heat conduction and electrical conductivity than the first connection pin 31. The first connection pin 31 and the second connection pin 32 are bent multiple times to effectively extend the heat transfer path, thereby improving the heat transfer effect.

[0082] Please also read Fig.10 and Fig.11 The cured and formed plastic seat 4 has a first groove 41 for supporting the first connecting pin 31 and a second groove 42 for supporting the second connecting pin 32, so that the first connecting pin 31 and the second connecting pin 32 are firmly fixed, and at the same time, the appearance structure design of the electronic component is square, and the overall appearance effect is good.

[0083] Please also read Fig.10 and Fig.11 The cured and formed plastic seat 4 has a positioning hole 44 for supporting the chip 1 and a receiving groove 45 for supporting the substrate 21. The positioning hole 44 is connected to the receiving groove 45. The chip 1 is arranged in the positioning hole 44, and the substrate 21 is arranged in the receiving groove 45, which is convenient for accurate disassembly, assembly and maintenance of the chip 1 and the substrate 21.

[0084] Embodiment 2:

[0085] Please also read Fig.12 and Fig.13 , the electronic components provided by the second embodiment of the present invention are now described. The difference between the second embodiment and the first embodiment is that: 1. The structural design of the heat-conducting heat sink 51 and the conductive sheet 52 is eliminated, which simplifies the production process and reduces the cost; 2. The side of the electronic component provided by the first embodiment with the substrate 21 is used as the front side of the electronic component provided by this embodiment, and the front side of the electronic component provided by the first embodiment is used as the back side of the electronic component provided by this embodiment; 3. The connecting bar 23 and each pin 3 are located on the same plane. The second embodiment dissipates heat through the substrate 21, the connecting bars 23 on both sides, the first connection pin 41 and the second connection pin 42.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Electronic components, characterized in that: The invention comprises a substrate, a chip arranged on the substrate, a pin electrically connected to the chip, a conductive sheet with one end attached to the top surface of the chip, and a glue seat cured and formed on the substrate to seal and fix the pin and the conductive sheet, wherein the glue seat is provided with a corresponding window to expose the other end of the conductive sheet, one end of the pin is sealed and fixed in the glue seat, and one end of the pin is electrically connected to the chip, and the other end of the pin extends out of the glue seat; the substrate comprises a base plate and connecting plates respectively arranged at both ends of the base plate, and the chip is arranged on the base plate; each connecting plate comprises a first section bent at the corresponding end of the base plate toward the chip, a second section bent at the free end of the first section toward the direction away from the chip, and a third section bent at the free end of the second section toward the base plate, the first section is perpendicular to the base plate, the second section is perpendicular to the first section, and the third section is perpendicular to the second section; the glue seat is provided with a notch for supporting each connecting plate, and both ends of each notch are provided with a support block for supporting the second section of the corresponding connecting plate, and the two support blocks are respectively arranged with a spacing from the inner side wall of the notch.

2. The electronic component according to claim 1, characterized in that: The conductive sheet includes a first section exposing the window, a second section bent at one end of the first section toward the chip, and a third section parallel to the first section and bent toward away from the first section at a free end of the second section, the second section is perpendicular to the first section, the second section is perpendicular to the third section, and the third section is attached to the top surface of the chip.

3. The electronic component according to claim 2, characterized in that: The electronic component also includes a heat-conducting heat sink attached to the top surface of the first section, and the window wraps around the periphery of the heat-conducting heat sink.

4. The electronic component according to claim 3, characterized in that: The third section and the corresponding end of the heat-conducting fin are spaced apart.

5. The electronic component according to claim 1, characterized in that: The substrate further comprises connecting strips respectively arranged at two ends of the base plate, one end of each connecting strip is arranged on the base plate, and the other end of each connecting strip extends out of the adhesive seat.

6. The electronic component according to claim 1, characterized in that: The pin includes a first connection pin whose one end is electrically connected to the chip, and the other end of the first connection pin extends out of the glue seat.

7. The electronic component according to claim 6, characterized in that: The pin further includes a second connection pin having one end electrically connected to the chip, one end of the second connection pin extending out of the adhesive seat, and the first connection pin and the second connection pin are arranged at intervals.

8. The electronic component according to claim 7, characterized in that: The length of the second connecting pin is greater than the length of the first connecting pin.

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