Atomizer assembly, atomizer and electronic atomizer device

Abstract

The present invention relates to an atomization assembly, an atomizer and an electronic atomization device. The atomization assembly includes: a substrate having an atomization surface for atomizing liquid to form smoke; an electrode film attached to the atomization surface of the substrate and used to be connected to a power source; and a heating film attached to the atomization surface of the substrate and electrically connected to the electrode film, the heating film being used to heat the liquid in the substrate for atomization. In the process of attaching the electrode film and the heating film to the atomization surface, it is convenient to attach them through automated equipment and avoid manual participation; at the same time, the entire atomization assembly is made compact, eliminating the interference of the atomization assembly with other parts during assembly, and is also convenient for assembly line assembly through automated equipment. Therefore, the efficiency and accuracy of the manufacturing and assembly of the atomization assembly are improved, and the large-scale production of the atomization assembly is realized, thereby reducing its manufacturing cost.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization, and in particular to an atomization component, an atomizer and an electronic atomization device. Background Art

[0002] Electronic atomizers have a similar appearance and taste to ordinary cigarettes, but usually do not contain other harmful ingredients such as tar and suspended particles in cigarettes. Therefore, electronic atomizers are widely used as substitutes for cigarettes. For traditional electronic atomizers, the power supply supplies power to the atomizer assembly through the pins on the atomizer assembly to achieve heating and atomization of the liquid. However, during the manufacturing and installation of the atomizer assembly, manual operations such as winding or guiding the pins are required, which affects work efficiency. Summary of the invention

[0003] A technical problem solved by the present invention is how to improve the manufacturing and assembly efficiency of the atomization assembly.

[0004] An atomizing assembly, comprising:

[0005] A base body having an atomizing surface for atomizing the liquid to form mist;

[0006] an electrode film attached to the atomized surface of the substrate and used to connect to a power source; and

[0007] A heating film is attached to the atomization surface of the substrate and is electrically connected to the electrode film. The heating film is used to heat the liquid in the substrate to atomize it.

[0008] In one of the embodiments, both the heating film and the electrode film are attached to the atomization surface by a spraying process or an electroplating process.

[0009] In one embodiment, the electrode film includes a first electrode film connected to the positive electrode of the power supply and a second electrode film connected to the negative electrode of the power supply, and the heating film is located between the first electrode film and the second electrode film.

[0010] In one embodiment, the heating film is in contact with the first electrode film and the second electrode film at the same time.

[0011] In one embodiment, both the heating film and the electrode film are arranged around the substrate.

[0012] In one embodiment, the atomizing surface includes an installation area and an exposed area, the exposed area is located at the end of the atomizing surface, the installation area is located in the middle of the atomizing surface and sandwiched between the exposed areas, and both the heating film and the electrode film are attached to the installation area.

[0013] In one of the embodiments, the surfaces of both the heating film and the electrode film are flush with the atomization surface of the exposed area.

[0014] In one of the embodiments, the base body further has two end surfaces respectively connected to the two ends of the atomizing surface, and a liquid guide hole penetrating through the two end surfaces and used for liquid to pass through is opened in the base body.

[0015] In one embodiment, the central axis of the liquid guiding hole coincides with or is parallel to the central axis of the base.

[0016] In one embodiment, the cross-sectional size of the liquid guiding hole is 0.5 mm to 1.5 mm.

[0017] In one embodiment, the substrate is cylindrical or prismatic.

[0018] In one embodiment, the heating film includes a stainless steel heating film, a titanium heating film or a titanium alloy heating film.

[0019] An atomizer is provided with a liquid storage chamber and an atomizing chamber, the atomizer comprises any of the above-mentioned atomizing components, the atomizing component is located between the liquid storage chamber and the atomizing chamber

[0020] In one of the embodiments, a push pin is further included, and the push pin abuts against the electrode film.

[0021] An electronic atomization device comprises a power source and any one of the atomizers described above, wherein the power source provides electrical energy for the atomizer.

[0022] A technical effect of an embodiment of the present invention is: by attaching the electrode film and the heating film to the atomizing surface, the electrode film is electrically connected to the heating film, and the electrode film can transmit electrical energy to the heating film so that the heating film generates heat to atomize the liquid. In the process of attaching the electrode film and the heating film to the atomizing surface, it is convenient to process by automated equipment and avoid manual intervention; at the same time, the electrode film and the heating film occupy less space, making the entire atomizing component compact in structure, eliminating the interference of the atomizing component during the assembly process with other parts, and also convenient for assembly line assembly by automated equipment. Therefore, in the manufacturing and assembly process of the atomizing component, manual intervention can be eliminated, thereby improving the automation level of the manufacturing and assembly of the atomizing component, and ultimately improving the efficiency and accuracy of the manufacturing and assembly of the atomizing component, realizing the large-scale production of the atomizing component and reducing its manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the three-dimensional structure of an atomization assembly provided in an embodiment;

[0024] Figure 2 for Figure 1 A schematic diagram of the front view structure of

[0025] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the middle matrix;

[0026] Figure 4 for Figure 1 A schematic diagram of a first example of a partial cross-sectional structure of the atomizing assembly shown;

[0027] Figure 5 for Figure 1 A second example partial cross-sectional structural schematic diagram of the atomizing assembly shown;

[0028] Figure 6 A schematic diagram of a first exemplary cross-sectional structure of a heating film in an atomization assembly provided in an embodiment;

[0029] Figure 7 A schematic diagram of a second exemplary cross-sectional structure of a heating film in an atomization assembly provided in an embodiment;

[0030] Figure 8 A schematic diagram of the three-dimensional structure of an atomizer provided in an embodiment;

[0031] Fig. 9 for Figure 8 Schematic diagram of the cross-sectional structure. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "inside", "outside", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0034] See also Figure 1 An embodiment of the present invention provides an atomization assembly 10, which is used to atomize a liquid represented by an aerosol-generating matrix to form smoke for a user to inhale. The atomization assembly 10 includes a substrate 100, an electrode film 200 and a heating film 300.

[0035] In some embodiments, the substrate 100 includes a porous ceramic substrate, that is, the substrate 100 can be made of a porous ceramic material. For example, a mixed raw material of porous ceramic alumina, zirconium oxide and silicon carbide is first provided, and then a certain ratio of adhesive, stabilizer and paraffin are added to the mixed raw material as needed, and mixed and extruded to form a blank, and then the extruded blank is degreased and sintered, and finally the blank is combined under high temperature to form a finished porous ceramic substrate. The porous ceramic matrix has good chemical stability and a melting point above 1000°C, that is, it can withstand high temperatures and will not react chemically with the liquid in a high temperature environment, thereby avoiding additional loss of the liquid during the chemical reaction process, ensuring that all the liquid is used for atomization, thereby improving the utilization rate of the liquid.

[0036] The matrix 100 made of porous ceramic material contains a large number of micropores and has a certain porosity. The porosity is defined as the percentage of the volume of the pores in the object to the total volume of the material in the natural state. The porosity of the matrix 100 can be 50% to 60%, for example, the porosity can be 50%, 55%, 58% or 60%. The cross-sectional size of the micropore is 1μm to 100μm, for example, the cross-sectional size of the micropore can be 1μm, 10μm, 50μm or 100μm, and when the micropore is a circular hole, the cross-sectional size of the micropore is the diameter of the micropore. Since the substrate 100 has a certain porosity, the substrate 100 can form a capillary effect. The substrate 100 has an atomizing surface 110. Under the capillary effect, the liquid in contact with the substrate 100 can be continuously transmitted to the atomizing surface 110 through the inside of the substrate 100. When the heating film 300 is working, the heat generated by the heating film 300 can atomize the liquid on the atomizing surface 110 to form smoke.

[0037] When the porosity and the cross-sectional dimensions of the micropores are increased, the resistance along the movement of the liquid inside the substrate 100 can be reduced, and then the liquid conduction speed of the substrate 100 to the liquid is increased, so that the liquid infiltrated in the substrate 100 can be transmitted to the atomizing surface 110 in a shorter time, thereby avoiding the explosion and burning of droplets caused by insufficient liquid on the atomizing surface 110. When the porosity and the cross-sectional dimensions of the micropores are reduced, the substrate 100 can have a relatively stronger liquid locking function for the liquid infiltrated therein, preventing the liquid stored inside the substrate 100 from leaking from the atomizing surface 110, and ensuring that the substrate 100 has a good liquid storage effect. Therefore, in order to balance the liquid conduction speed and liquid locking function of the substrate 100, the values ​​of the porosity and the cross-sectional dimensions of the micropores can be respectively located within the above range. Of course, the extension direction of the micropores can be perpendicular to the atomizing surface 110, so that the liquid can reach the atomizing surface 110 through the shortest distance, further improving the liquid conduction speed of the substrate 100 to the liquid.

[0038] See also Figures 1 to 5The substrate 100 may be cylindrical or prismatic, and the side surface of the substrate 100 forms an atomizing surface 110. The substrate 100 has two end surfaces 120 connected to the atomizing surface 110. The two end surfaces 120 of the substrate 100 may be used to contact with the liquid to absorb the liquid. A liquid guide hole 130 for liquid to pass through may also be provided inside the substrate 100. The liquid guide hole 130 may penetrate the two end surfaces 120 of the substrate 100 to form a through hole. The cross-sectional size of the liquid guide hole 130 is 0.5 mm to 1.5 mm. For example, the cross-sectional size of the liquid guide hole 130 may be 0.5 mm, 0.6 mm, 0.8 mm or 1.5 mm, etc. When the liquid guide hole 130 is a circular hole, the cross-sectional size of the liquid guide hole 130 is the diameter of the circular hole. By providing the liquid guide hole 130, since the cross-sectional size of the liquid guide hole 130 is significantly larger than the cross-sectional size of the micropore, the liquid can first enter the inside of the substrate 100 through the liquid guide hole 130 at a faster speed, and the liquid in the liquid guide hole 130 then reaches the atomization surface 110 through the micropore, which further improves the liquid guide speed of the substrate 100. The number of the liquid guide hole 130 can be one, and the central axis of the liquid guide hole 130 coincides with the central axis of the substrate 100, so that the conduction distance from the liquid in the liquid guide hole 130 to the atomization surface 110 is approximately equal, ensuring that the liquid is evenly distributed on the atomization surface 110. The number of the liquid-conducting holes 130 may be more than one, for example, the central axis of one of the liquid-conducting holes 130 coincides with the central axis of the substrate 100, and the central axes of the remaining liquid-conducting holes 130 are parallel to the central axis of the substrate 100; for another example, when some of the liquid-conducting holes 130 are annular holes, the central axes of all the liquid-conducting holes 130 may coincide with the central axis of the substrate 100. In other embodiments, according to actual needs, the substrate 100 may also be in a truncated cone or a prism shape.

[0039] In some embodiments, the heating film 300 includes a stainless steel heating film, a titanium heating film or a titanium alloy heating film, that is, the heating film 300 can be made of stainless steel material, titanium metal material or titanium alloy material, for example, the stainless steel material can be selected from S316L stainless steel, etc. The heating film 300 made of the above materials has good temperature control characteristics, for example, the heating temperature of the heating film 300 can be accurately controlled and adjusted. When the heating temperature increases, more liquid is atomized per unit time to form a higher smoke concentration. At the same time, there is enough energy to destroy the interaction between liquid molecules, so that the particle size of the smoke is smaller. On the contrary, when the heating temperature decreases, the smoke concentration decreases and the particle size increases. Therefore, the size of the liquid atomized particles and the atomization concentration can be accurately controlled by adjusting the heating temperature of the heating film 300, so as to adjust the taste of the smoke to meet the needs of different users; at the same time, the temperature of the heating film 300 can be prevented from being too high, and harmful substances can be avoided at high temperatures. For example, the heating area of ​​the heating film 300 can be precisely controlled and adjusted, so that a certain part of the heating film 300 (corresponding to the heating area) can generate heat to produce an atomization temperature for atomizing the liquid, while other parts of the heating film 300 cannot atomize the liquid because they do not generate heat; when the heating area of ​​the heating film 300 is larger, a larger amount of liquid can be atomized in the same time, thereby forming smoke with a higher concentration; conversely, when the heating area of ​​the heating film 300 is smaller, a smaller amount of liquid can be atomized in the same time, thereby forming smoke with a lower concentration; therefore, the actual heating area of ​​the heating film 300 can be adjusted to flexibly adjust the atomization amount of the liquid, thereby achieving the effect of adjusting the smoke concentration.

[0040] The heating film 300 can be attached to the atomized surface 110 of the substrate 100 by a spraying process or an electroplating process. Both the spraying process and the electroplating process are easy to operate through automated equipment, which improves processing efficiency and precision. When the heating film 300 is working, the temperature at each location on the heating area is equal, so that the heat can be evenly distributed on its heating area, avoiding the phenomenon of excessively high local temperatures on the heating area, preventing the explosion of droplets caused by excessively high local temperatures, and reducing the loss of liquid caused by the explosion of droplets, further improving the utilization rate of the liquid, and ensuring that under the same conditions, enough liquid is atomized to form a higher smoke concentration.

[0041] In some embodiments, the electrode film 200 can also be attached to the atomized surface 110 of the substrate 100 by a spraying process or an electroplating process, so that the spraying process and the electroplating process can be realized by using automated equipment to improve the processing efficiency and precision. The electrode film 200 is electrically connected to the heating film 300, and the electrode film 200 is connected to the power supply through the ejector pin 400, that is, the ejector pin 400 is arranged between the power supply and the electrode film 200, for example, the lower end of the ejector pin 400 is fixedly connected to the power supply, and the upper end of the ejector pin 400 can be abutted or fixedly connected to the electrode film 200. The power supply can supply power to the heating film 300 through the ejector pin 400 and the electrode film 200, so that the heating film 300 generates an atomization temperature and atomizes the liquid.

[0042] Compared with the traditional atomizer assembly 10, since a long strip of pins is fixedly connected to the base 100, during the manufacturing process of the entire atomizer assembly 10, the pins need to be bent manually to form a reasonable bending angle; at the same time, during the assembly process of the atomizer assembly 10 and other parts, the pins also need to be manually corrected to prevent the pins from interfering with other parts and ensure that the pins are smoothly connected to the power supply. In the above embodiment, since the electrode film 200 is a film-like structure, it is convenient to directly attach the electrode film 200 to the base 100 through automated equipment, and the electrode film 200 with a film-like structure occupies less space, and the electrode film 200 does not protrude too much relative to the base 100 like the pins, so that the entire atomizer assembly 10 is compact in structure, eliminating interference during the assembly process, and is also convenient for assembly line assembly through automated equipment. Similarly, the attachment of the heating film 300 can also be completed by automated equipment, which itself occupies less space and will not cause interference during the assembly process. Therefore, during the manufacturing and assembly process of the atomizer component 10, the provision of the electrode membrane 200 and the heating film 300 can eliminate manual intervention, thereby improving the level of automation in the manufacturing and assembly of the atomizer component 10, and ultimately improving the efficiency and accuracy of the manufacturing and assembly of the atomizer component 10, thereby realizing the large-scale production of the atomizer component 10 and reducing its manufacturing cost.

[0043] See also Figure 1 , Figures 4 to 7In some embodiments, both the heating film 300 and the electrode film 200 are annular, and the substrate 100 is inserted into the heating film 300 and the electrode film 200, so that the stability and reliability of the attachment of the heating film 300 and the electrode film 200 can be improved. When the substrate 100 is prismatic, the cross-sections of the heating film 300 and the electrode film 200 are both polygonal rings; when the substrate 100 is cylindrical, the cross-sections of the heating film 300 and the electrode film 200 are both circular rings. When the cross-section of the heating film 300 is a polygonal ring, one or more sides of the heating film 300 can be controlled to form a heating area, thereby adjusting the size of the heating area; when the cross-section of the heating film 300 is a circular ring, the arc value corresponding to the heating area on the heating film 300 can be controlled to adjust the size of the heating area. Obviously, when the heating area changes, the atomization amount and smoke concentration of the atomization component 10 change accordingly. Of course, when the volume of the base 100 is constant, the maximum atomization amount of the atomization assembly 10 can be determined by changing the total area of ​​the heating film 300 .

[0044] See also Figures 1 to 4 Due to installation condition restrictions or smoke density considerations, the heating film 300 and the electrode film 200 may not cover the entire atomization surface 110, that is, the total projected area of ​​the heating film 300 and the electrode film 200 on the atomization surface 110 is smaller than the area of ​​the atomization surface 110. For example, the atomization surface 110 includes an installation area 112 and an exposed area 111, and the exposed areas 111 are located at both ends of the atomization surface 110, that is, there are two exposed areas 111, and the installation area 112 is located in the middle of the atomization surface 110 and sandwiched between the two exposed areas 111. Both the heating film 300 and the electrode film 200 are attached to the installation area 112. Obviously, the atomization surface 110 in the exposed area 111 is not attached with any heating film 300 or electrode film 200 and is in a bare state. The atomized surface 110 of the installation area 112 can be recessed to a set depth toward the central axis of the substrate 100 relative to the atomized surface 110 of the exposed area 111 to form a groove 140, and the heating film 300 or the electrode film 200 is embedded in the groove 140. When the thickness of both is equal to the depth of the groove 140, the surface of the heating film 300 or the electrode film 200 can be flush with the atomized surface 110 of the exposed area 111. Of course, refer to Figure 5 The atomized surface 110 of the installation area 112 can be flush with the atomized surface 110 of the exposed area 111. When the heating film 300 and the electrode film 200 are attached to the installation area 112, the heating film 300 and the electrode film 200 protrude from the atomized surface 110 of the exposed area 111 by a set height.

[0045] The electrode film 200 includes a first electrode film 210 and a second electrode film 220. The first electrode film 210 is connected to the positive electrode of the power supply through a pin 400, and the second electrode film 220 is connected to the negative electrode of the power supply through another pin 400. The heating film 300 is located between the first electrode film 210 and the second electrode film 220. At this time, the electrode film 200 is arranged closer to the exposed area 111 relative to the heating film 300, so that the two ends of the heating film 300 can be respectively abutted against the first electrode film 210 and the second electrode film 220, thereby realizing the electrical connection between the heating film 300 and the electrode film 200, thereby omitting the arrangement of other connecting components, thereby simplifying the overall structure of the atomizer assembly 10 and reducing its manufacturing cost.

[0046] See also Figure 8 and Fig. 9 The present invention further provides an atomizer 20, which includes a ejector pin 400, a shell assembly 500, a base assembly 600, and the above-mentioned atomizer assembly 10. The base assembly 600 is arranged in the shell assembly 500, and the base assembly 600 and the shell assembly 500 together form a liquid storage chamber 520, in which liquid for atomization of the atomizer assembly 10 is stored, and the base 100 is arranged on the base assembly 600, and the end of the base 100 is located in the liquid storage chamber 520, so that the end surface 120 of the base 100 can continuously absorb liquid from the liquid storage chamber 520, and when a liquid guide hole 130 is opened in the base 100, the liquid in the liquid storage chamber 520 can directly enter the inside of the base 100 through the liquid guide hole 130. The shell assembly 500 is provided with an air intake channel 510 connected to the outside, and the base assembly 600 is provided with an atomizing chamber 610 connected to the air intake channel 510. The atomizing chamber 610 is isolated from the liquid storage chamber 520, and the heating film 300 can be just located in the atomizing chamber 610. When the heating film 300 is working, the liquid on the atomizing surface 110 is atomized to form smoke, and the smoke is sucked by the user through the atomizing chamber 610 and the air intake channel 510. Since the electrode film 200 and the heating film 300 are attached to the substrate 100, the atomizing assembly 10 has a compact structure, eliminating the interference caused by the atomizing assembly 10 in the entire assembly process of the atomizer 20, facilitating assembly of the assembly line through automated equipment, and improving the assembly efficiency and precision of the atomizer 20.

[0047] The present invention also provides an electronic atomization device, which includes a power supply and the above-mentioned atomizer 20. By providing the above-mentioned atomizer 20, the manufacturing and assembly efficiency and accuracy of the electronic atomization device are improved, and the atomization amount (concentration) and atomization particle size of the electronic atomization device can be adjusted by controlling the temperature and heating area of ​​the heating film 300, so as to suit the taste of different users.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An atomizing assembly, characterized in that: include: A base body having an atomizing surface for atomizing the liquid to form mist; An electrode film, attached to the atomized surface of the substrate and used to connect to a power source; and A heating film is attached to the atomization surface of the substrate and electrically connected to the electrode film, the heating film is used to heat the liquid in the substrate to atomize; the atomization surface includes an installation area and an exposed area, the atomization surface of the installation area is recessed toward the substrate relative to the atomization surface of the exposed area to form a groove, the heating film and the electrode film are embedded in the groove, the thickness of the heating film and the electrode film is equal to the depth of the groove, the surfaces of both the heating film and the electrode film are flush with the atomization surface of the exposed area, and the heating film is in a closed loop.

2. The atomizer assembly according to claim 1, characterized in that: The heating film and the electrode film are both attached to the atomization surface through a spraying process or an electroplating process.

3. The atomizer assembly according to claim 1, characterized in that: The electrode film includes a first electrode film connected to a positive electrode of a power source and a second electrode film connected to a negative electrode of a power source, and the heating film is located between the first electrode film and the second electrode film.

4. The atomizer assembly according to claim 3, characterized in that: The heating film is in contact with the first electrode film and the second electrode film at the same time.

5. The atomizer assembly according to claim 1, characterized in that: Both the heating film and the electrode film are arranged around the substrate.

6. The atomizer assembly according to claim 1, characterized in that: The exposed area is located at the end of the atomized surface, and the installation area is located in the middle of the atomized surface and sandwiched between the exposed areas.

7. The atomizer assembly according to claim 1, characterized in that: The substrate is made of porous ceramic material.

8. The atomizer assembly according to claim 1, characterized in that: The base body also has two end surfaces respectively connected to the two ends of the atomization surface, and a liquid guide hole penetrating through the two end surfaces and used for liquid to pass through is opened in the base body.

9. The atomizer assembly according to claim 8, characterized in that: The central axis of the liquid guide hole coincides with or is parallel to the central axis of the base.

10. The atomizer assembly according to claim 8, characterized in that: The cross-sectional size of the liquid guiding hole is 0.5 mm to 1.5 mm.

11. The atomizer assembly according to claim 1, characterized in that: The base body is cylindrical or prism-shaped.

12. The atomizer assembly according to claim 1, characterized in that: The heating film includes a stainless steel heating film, a titanium heating film or a titanium alloy heating film.

13. An atomizer, characterized in that: A liquid storage chamber and an atomizing chamber are provided, and the atomizer comprises an atomizing assembly according to any one of claims 1 to 12, and the atomizing assembly is located between the liquid storage chamber and the atomizing chamber.

14. The atomizer according to claim 13, characterized in that It also includes an ejector pin, which is in contact with the electrode film.

15. An electronic atomization device, characterized in that: The invention comprises a power source and the atomizer according to any one of claims 13 to 14, wherein the power source provides electrical energy to the atomizer.

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