Substrate processing equipment

Abstract

The substrate processing apparatus comprises a first conveying mechanism, a second conveying mechanism, an intermediate conveying mechanism, a first intermediate portion, a second intermediate portion and a control portion. The intermediate conveying mechanism is arranged between the first conveying mechanism and the second conveying mechanism. The first intermediate portion is arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey the substrate. A substrate is placed in the first intermediate portion. The second intermediate portion is arranged in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey the substrate. A substrate is placed in the second intermediate portion. The intermediate conveying mechanism repeatedly performs a cyclic action according to the control of the control portion. The cyclic action of the intermediate conveying mechanism consists only of a first in-and-out action to the first intermediate portion and a second in-and-out action to the second intermediate portion.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate, such as a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, and a substrate for a solar cell. Background Art

[0002] Japanese Patent Publication No. 2009-010291 discloses a substrate processing device. In the following, the symbols recorded in Japanese Patent Publication No. 2009-010291 are indicated by brackets. The substrate processing device (1) includes a transport mechanism (TID), a transport mechanism (T1), a transport mechanism (T2) and a transport mechanism (TIFA). The transport mechanisms (TID, T1, T2, TIFA) transport substrates respectively.

[0003] The substrate processing device (1) includes a loading section (PASS1), a loading section (PASS2) and a loading section (PASS5). The loading sections (PASS1, PASS2, PASS5) are used to load substrates respectively. The transport mechanism (TID) and the transport mechanism (T1) transfer the substrate via the loading section (PASS1). The transport mechanism (T1) and the transport mechanism (T2) transfer the substrate via the loading section (PASS2). The transport mechanism (T2) and the transport mechanism (TIFA) transfer the substrate via the loading section (PASS5).

[0004] The substrate processing device (1) includes a processing unit for processing a substrate. Specifically, the substrate processing device (1) includes a coating processing unit (31), a heat treatment unit (41), an edge exposure unit (EEW), a developing processing unit (DEV), and a heat treatment unit (42). The transport mechanism (T1) transports the substrate to the coating processing unit (31) and the heat treatment unit (41). The transport mechanism (T2) transports the substrate to the edge exposure unit (EEW), the developing processing unit (DEV), and the heat treatment unit (42).

[0005] The conveying mechanism (T1) repeatedly performs a series of actions (hereinafter referred to as "circulation actions"). The circulation action of the conveying mechanism (T1) includes at least the following four in-and-out actions.

[0006] ·1st in-and-out movement: In-and-out to the loading section (PASS1)

[0007] · Second in-and-out movement: In and out to the placement section (PASS2)

[0008] · The third in-and-out action: in and out to the coating processing unit (31)

[0009] · The fourth in-and-out movement: in and out of the heat treatment unit (41)

[0010] The conveying mechanism (T2) repeatedly performs a series of actions (hereinafter referred to as "circulation actions"). The circulation actions of the conveying mechanism (T2) include at least the following five in-and-out actions.

[0011] · Fifth in-and-out movement: In and out to the loading section (PASS2)

[0012] · The sixth in-and-out movement: in and out to the loading section (PASS5)

[0013] ·The 7th in and out action: In and out to the edge exposure unit (EEW)

[0014] · The 8th in and out action: in and out to the development processing unit (DEV)

[0015] · The 9th in-and-out movement: in and out of the heat treatment unit (42) Summary of the invention

[0016] [Problems to be solved by the invention]

[0017] There is a demand for further improvement in the throughput (the number of substrates that can be processed per unit time) of substrate processing apparatuses. However, with the structure of the substrate processing apparatus (1) disclosed in Japanese Patent Application Laid-Open No. 2009-010291, it is difficult to further improve the throughput.

[0018] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a substrate processing apparatus capable of improving the throughput of the substrate processing apparatus.

[0019] [Technical means to solve the problem]

[0020] The present invention adopts the following structure to achieve the above-mentioned purpose. That is, the present invention is a substrate processing device, which comprises: a first conveying mechanism for conveying a substrate; a second conveying mechanism for conveying a substrate; an intermediate conveying mechanism disposed between the first conveying mechanism and the second conveying mechanism and conveying a substrate; a first intermediate portion disposed in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey a substrate and for placing a substrate; a second intermediate portion disposed in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey a substrate and for placing a substrate; and a control portion for controlling the first conveying mechanism, the second conveying mechanism and the intermediate conveying mechanism; and according to the control of the control portion, the intermediate conveying mechanism repeatedly performs a cyclic action, and the cyclic action of the intermediate conveying mechanism is composed only of a first in-out action to the first intermediate portion and a second in-out action to the second intermediate portion.

[0021] The cyclic action of the intermediate transport mechanism is composed of only the first in-and-out action and the second in-and-out action. That is, the number of in-and-out actions included in the cyclic action of the intermediate transport mechanism is 2. Like this, the number of in-and-out actions included in the cyclic action of the intermediate transport mechanism is relatively small. Therefore, the time required for the cyclic action of the intermediate transport mechanism is relatively short. In other words, the number of cyclic actions of the intermediate transport mechanism that can be performed per unit time is relatively large. Therefore, the efficiency of the intermediate transport mechanism in transporting substrates (hereinafter appropriately referred to as "the transport efficiency of the intermediate transport mechanism") is relatively high. As a result, the output of the substrate processing device can be appropriately improved.

[0022] The first intermediate portion is arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey the substrate. The first overlapping region is a region where the first region where the first conveying mechanism can convey the substrate overlaps with the intermediate region where the intermediate conveying mechanism can convey the substrate. Therefore, the first conveying mechanism can move in and out of the first intermediate portion appropriately. The intermediate conveying mechanism can move in and out of the first intermediate portion appropriately.

[0023] The substrate is placed on the first intermediate portion. Therefore, the substrate can be appropriately transferred between the first transfer mechanism and the intermediate transfer mechanism via the first intermediate portion.

[0024] The second intermediate portion is arranged in a second overlapping region where the intermediate transport mechanism and the second transport mechanism can transport the substrate. The second overlapping region is a region where the intermediate region where the intermediate transport mechanism can transport the substrate overlaps with the second region where the second transport mechanism can transport the substrate. Therefore, the intermediate transport mechanism can move in and out of the second intermediate portion appropriately. The second transport mechanism can move in and out of the second intermediate portion appropriately.

[0025] The substrate is placed on the second intermediate portion. Therefore, the substrate can be appropriately transferred between the intermediate transfer mechanism and the second transfer mechanism via the second intermediate portion.

[0026] In the first in-and-out motion included in the cyclic motion of the intermediate conveying mechanism, the intermediate conveying mechanism moves in and out to the first middle portion. In the second in-and-out motion included in the cyclic motion of the intermediate conveying mechanism, the intermediate conveying mechanism moves in and out to the second middle portion. Therefore, the intermediate conveying mechanism repeatedly performs the cyclic motion, and the intermediate conveying mechanism alternately moves in and out to the first middle portion and the second middle portion. As described above, the cyclic motion of the intermediate conveying mechanism consists only of the first in-and-out motion and the second in-and-out motion. Thus, the intermediate conveying mechanism can efficiently move in and out to the first middle portion and the second middle portion. Therefore, the intermediate conveying mechanism can efficiently transfer the substrate between the first middle portion and the second middle portion.

[0027] In the substrate processing apparatus, it is preferred that the first conveying mechanism places the substrate on the first middle portion, the second conveying mechanism obtains the substrate from the second middle portion, the first in-and-out movement of the intermediate conveying mechanism includes an action of obtaining the substrate from the first middle portion, the second in-and-out movement of the intermediate conveying mechanism includes an action of placing the substrate on the second middle portion, the intermediate conveying mechanism performs the circulation movement of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism receives the substrate from the first conveying mechanism via the first middle portion, and conveys the substrate from the first middle portion to the second middle portion, and delivers the substrate to the second conveying mechanism via the second middle portion. The first in-and-out movement of the intermediate conveying mechanism includes an action of obtaining the substrate from the first middle portion. Thus, the intermediate conveying mechanism can efficiently obtain the substrate from the first middle portion. The second in-and-out movement of the intermediate conveying mechanism includes an action of placing the substrate on the second middle portion. Thus, the intermediate conveying mechanism can efficiently place the substrate on the second middle portion. Therefore, the intermediate conveying mechanism performs a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently convey the substrate from the first intermediate portion to the second intermediate portion. The first conveying mechanism places the substrate on the first intermediate portion. Thus, the intermediate conveying mechanism performs a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently receive the substrate from the first conveying mechanism via the first intermediate portion. The second conveying mechanism obtains the substrate from the second intermediate portion. Thus, the intermediate conveying mechanism performs a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently deliver the substrate to the second conveying mechanism via the second intermediate portion.

[0028] In the substrate processing device, it is preferred that the first in-and-out movement of the intermediate conveying mechanism includes an action of placing a substrate on the first middle portion, the second in-and-out movement of the intermediate conveying mechanism includes an action of obtaining a substrate from the second middle portion, and the intermediate conveying mechanism performs the circulation movement of the intermediate conveying mechanism through the intermediate conveying mechanism, and the intermediate conveying mechanism conveys the substrate from the second middle portion to the first middle portion. The first in-and-out movement of the intermediate conveying mechanism includes an action of placing a substrate on the first middle portion. Thus, the intermediate conveying mechanism can efficiently place the substrate on the first middle portion. The second in-and-out movement of the intermediate conveying mechanism includes an action of obtaining a substrate from the second middle portion. Thus, the intermediate conveying mechanism can efficiently obtain a substrate from the second middle portion. Therefore, the circulation movement of the intermediate conveying mechanism is performed through the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently convey the substrate from the second middle portion to the first middle portion.

[0029] In the substrate processing apparatus, it is preferred that the first conveying mechanism obtains the substrate from the first intermediate portion, the second conveying mechanism places the substrate on the second intermediate portion, the intermediate conveying mechanism performs the circulation action of the intermediate conveying mechanism, the intermediate conveying mechanism receives the substrate from the second conveying mechanism via the second intermediate portion, and delivers the substrate to the first conveying mechanism via the first intermediate portion. The first conveying mechanism obtains the substrate from the first intermediate portion. Thus, the intermediate conveying mechanism performs the circulation action of the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently deliver the substrate to the first conveying mechanism via the first intermediate portion. The second conveying mechanism places the substrate on the second intermediate portion. Thus, the intermediate conveying mechanism performs the circulation action of the intermediate conveying mechanism, and the intermediate conveying mechanism can efficiently receive the substrate from the second conveying mechanism via the second intermediate portion.

[0030] In the substrate processing device, it is preferred that the first in-and-out movement of the intermediate conveying mechanism does not include the movement of placing the substrate on the first middle portion, the second in-and-out movement of the intermediate conveying mechanism does not include the movement of obtaining the substrate from the second middle portion, and the intermediate conveying mechanism does not convey the substrate from the second middle portion to the first middle portion. The first in-and-out movement of the intermediate conveying mechanism does not include the movement of placing the substrate on the first middle portion. Thus, the time required for the first in-and-out movement of the intermediate conveying mechanism is shorter. The second in-and-out movement of the intermediate conveying mechanism does not include the movement of obtaining the substrate from the second middle portion. Thus, the time required for the second in-and-out movement of the intermediate conveying mechanism is shorter. Therefore, the time required for the circulation movement of the intermediate conveying mechanism is shorter. Therefore, the conveying efficiency of the intermediate conveying mechanism is higher. Thus, the output of the substrate processing device can be further improved.

[0031] In the substrate processing apparatus, it is preferred that the first intermediate portion includes a plurality of first transfer units for placing one substrate, the second intermediate portion includes a plurality of second transfer units for placing one substrate, the first in-and-out movement of the intermediate transfer mechanism includes an action of acquiring a substrate from the first transfer unit, and does not include an action of placing a substrate on the first transfer unit, and the second in-and-out movement of the intermediate transfer mechanism includes an action of placing a substrate on the second transfer unit, and does not include an action of acquiring a substrate from the second transfer unit. The first in-and-out movement of the intermediate transfer mechanism includes an action of acquiring a substrate from the first transfer unit. Thus, the intermediate transfer mechanism can efficiently acquire a substrate from the first transfer unit. The first in-and-out movement of the intermediate transfer mechanism does not include an action of placing a substrate on the first transfer unit. Thus, the action of the intermediate transfer mechanism for the first transfer unit can be simplified. Thus, the control of the intermediate transfer mechanism by the control unit can be simplified. The second in-and-out movement of the intermediate transfer mechanism includes an action of placing a substrate on the second transfer unit. Thus, the intermediate transport mechanism can efficiently place the substrate on the second transport unit. The second in-and-out movement of the intermediate transport mechanism does not include the movement of taking the substrate from the second transport unit. Thus, the movement of the intermediate transport mechanism for the second transport unit can be simplified. Thus, the control of the intermediate transport mechanism by the control unit can be simplified.

[0032] In the substrate processing apparatus, the first transfer units are preferably arranged in a row in the vertical direction, and the second transfer units are preferably arranged in a row in the vertical direction. Since the first transfer units are arranged in a row in the vertical direction, the intermediate transfer mechanism can easily enter and exit each first transfer unit. Since the second transfer units are arranged in a row in the vertical direction, the intermediate transfer mechanism can easily enter and exit each second transfer unit.

[0033] In the substrate processing apparatus, it is preferred that the first intermediate portion includes a plurality of first transfer units for placing one substrate, the second intermediate portion includes a plurality of second transfer units for placing one substrate, the first in-and-out movement of the intermediate transport mechanism includes an action of placing a substrate on the first transfer unit, and does not include an action of acquiring a substrate from the first transfer unit, and the second in-and-out movement of the intermediate transport mechanism includes an action of acquiring a substrate from the second transfer unit, and does not include an action of placing a substrate on the second transfer unit. The first in-and-out movement of the intermediate transport mechanism includes an action of placing a substrate on the first transfer unit. Thus, the intermediate transport mechanism can efficiently place a substrate on the first transfer unit. The first in-and-out movement of the intermediate transport mechanism does not include an action of acquiring a substrate from the first transfer unit. Thus, the action of the intermediate transport mechanism for the first transfer unit can be simplified. Thus, the control of the intermediate transport mechanism by the control unit can be simplified. The second in-and-out movement of the intermediate transport mechanism includes an action of acquiring a substrate from the second transfer unit. Thus, the intermediate transport mechanism can efficiently obtain the substrate from the second transfer unit. The second in-and-out movement of the intermediate transport mechanism does not include the movement of placing the substrate on the second transfer unit. Thus, the movement of the intermediate transport mechanism for the second transfer unit can be simplified. Thus, the control of the intermediate transport mechanism by the control unit can be simplified.

[0034] In the substrate processing apparatus, the first transfer units are preferably arranged in a row in the vertical direction, and the second transfer units are preferably arranged in a row in the vertical direction. Since the first transfer units are arranged in a row in the vertical direction, the intermediate transport mechanism can easily enter and exit each first transfer unit. Since the second transfer units are arranged in a row in the vertical direction, the intermediate transport mechanism can easily enter and exit each second transfer unit.

[0035] In the substrate processing apparatus, the first return unit is preferably arranged at a position overlapping with the first transfer unit in a plan view, and the second return unit is preferably arranged at a position overlapping with the second transfer unit in a plan view. The intermediate transfer mechanism can easily enter and exit both the first transfer unit and the first return unit. The intermediate transfer mechanism can easily enter and exit both the second transfer unit and the second return unit.

[0036] In the substrate processing device, it is preferred that at least one of the first transfer units is one of a heat treatment unit that performs heat treatment on a substrate and a carrier unit that does not perform treatment on the substrate but only carries the substrate, and at least one of the first return units is the other of the heat treatment unit and the carrier unit, and the carrier unit is arranged at a position overlapping with the heat treatment unit in a plan view, and the heat treatment unit and the carrier unit are arranged in an alternating manner one by one. The size of the heat treatment unit is relatively small. For example, the size of the heat treatment unit is smaller than that of the liquid treatment unit. Here, the liquid treatment unit is a treatment unit that treats the substrate by supplying a treatment liquid to the substrate. The size of the carrier unit is relatively small. As a result, the first intermediate portion can be equipped with a relatively large number of heat treatment units and a relatively large number of carrier units. Therefore, it is possible to appropriately prevent the transfer delay of the substrate in the first intermediate portion. In other words, it is possible to appropriately prevent the transfer delay of the substrate between the first transfer mechanism and the intermediate transfer mechanism. The carrier unit is arranged at a position overlapping with the heat treatment unit in a plan view. Thus, the intermediate transport mechanism can easily enter and exit both the heat treatment unit and the loading unit. The heat treatment unit and the loading unit are arranged in an alternating manner one by one. Thus, the intermediate transport mechanism can easily enter and exit both the heat treatment unit and the loading unit.

[0037] In the substrate processing device, it is preferred that the substrate processing device has a plurality of racks, which are arranged in an up-down direction and support the heat treatment unit and the carrier unit, and the number of the heat treatment unit arranged between two of the racks adjacent to each other in the up-down direction is 1, and the number of the carrier unit arranged between two of the racks adjacent to each other in the up-down direction is 1. Since the racks are arranged in an up-down direction, the heat treatment unit and the carrier unit can be appropriately arranged on the racks. The number of the heat treatment unit arranged between two of the racks adjacent to each other in the up-down direction is 1, and the number of the carrier unit arranged between two of the racks adjacent to each other in the up-down direction is 1. In other words, one heat treatment unit and one carrier unit are arranged between two of the racks adjacent to each other in the up-down direction. Therefore, it is easy to arrange the heat treatment unit and the carrier unit in an alternating manner one by one in the up-down direction.

[0038] In the substrate processing device, the heat treatment unit preferably includes: a first flat plate for carrying a substrate; a second flat plate arranged on the side of the first flat plate for carrying a substrate; and a cover portion arranged above the second flat plate; and the carrying unit includes a carrying plate, which is arranged above the first flat plate and on the side of the cover portion, for carrying a substrate, and the first in-and-out movement of the intermediate conveying mechanism is an in-and-out movement toward the first flat plate and the carrying plate. The second flat plate is arranged on the side of the first flat plate. The cover portion is arranged above the second flat plate. The carrying plate is arranged above the first flat plate and on the side of the cover portion. Therefore, the installation space of the heat treatment unit and the carrying unit can be reduced. As a result, the first intermediate portion can be equipped with a relatively large number of heat treatment units and a relatively large number of carrying units.

[0039] In the substrate processing device, it is preferred that at least one of the first intermediate portion and the second intermediate portion further processes the substrate being placed. When the first intermediate portion processes the substrate placed on the first intermediate portion, the substrate can be efficiently transferred to the first intermediate portion, and the substrate can be efficiently processed in the first intermediate portion. Therefore, the yield of the substrate processing device can be effectively improved. When the second intermediate portion processes the substrate placed on the second intermediate portion, the substrate can be efficiently transferred to the second intermediate portion, and the substrate can be efficiently processed in the second intermediate portion. Therefore, the yield of the substrate processing device can be effectively improved.

[0040] In the substrate processing device, it is preferred that the processing is a non-liquid processing performed without supplying a processing liquid to the substrate. The space used for the non-liquid processing is relatively small. For example, the space used for the non-liquid processing is smaller than the space used for the liquid processing. Therefore, when the first intermediate portion processes the substrate, the first intermediate portion can efficiently perform the non-liquid processing on the substrate. Thus, it is possible to appropriately prevent the delay in the transportation of the substrate in the first intermediate portion. Similarly, when the second intermediate portion processes the substrate, the second intermediate portion can efficiently perform the non-liquid processing on the substrate. Thus, it is possible to appropriately prevent the delay in the transportation of the substrate in the second intermediate portion.

[0041] In the substrate processing device, it is preferred that the processing is a heat treatment performed without supplying a processing liquid to the substrate. The space for the heat treatment is relatively small. For example, the space for the heat treatment is smaller than the space for the liquid treatment. Therefore, when the first intermediate portion processes the substrate, the first intermediate portion can efficiently perform the heat treatment on the substrate. Thus, it is possible to appropriately prevent a delay in the transport of the substrate in the first intermediate portion. Similarly, when the second intermediate portion processes the substrate, the second intermediate portion can efficiently perform the heat treatment on the substrate. Thus, it is possible to appropriately prevent a delay in the transport of the substrate in the second intermediate portion.

[0042] In the substrate processing device, it is preferred that at least one of the first intermediate portion and the second intermediate portion further inspects the substrate being placed. When the first intermediate portion inspects the substrate placed on the first intermediate portion, the substrate can be efficiently transferred to the first intermediate portion, and the substrate can be efficiently inspected in the first intermediate portion. Therefore, the yield of the substrate processing device can be effectively improved. Similarly, when the second intermediate portion inspects the substrate placed on the second intermediate portion, the substrate can be efficiently transferred to the second intermediate portion, and the substrate can be efficiently inspected in the second intermediate portion. Therefore, the yield of the substrate processing device can be effectively improved.

[0043] In the substrate processing apparatus, it is preferred that the first intermediate portion is arranged outside the second region where the second conveying mechanism can convey substrates, and the second intermediate portion is arranged outside the first region where the first conveying mechanism can convey substrates. The first intermediate portion is arranged outside the region where the second conveying mechanism can convey substrates. Therefore, the first conveying mechanism and the intermediate conveying mechanism can enter and exit the first intermediate portion without interfering with the second conveying mechanism. Similarly, the second intermediate portion is arranged outside the region where the first conveying mechanism can convey substrates. Therefore, the intermediate conveying mechanism and the second conveying mechanism can enter and exit the second intermediate portion without interfering with the first conveying mechanism.

[0044] In the substrate processing apparatus, it is preferred that the intermediate region where the intermediate transfer mechanism can transfer the substrate is substantially circular in plan view. The intermediate transfer mechanism can easily enter and exit both the first intermediate portion and the second intermediate portion.

[0045] In the substrate processing apparatus, the intermediate transport mechanism preferably includes: a rotating portion that can rotate around a rotating axis parallel to the vertical direction; and a holding portion that is supported by the rotating portion and holds the substrate; and the rotating portion is configured to be unable to move in the horizontal direction. The rotating portion is configured to be unable to move in the horizontal direction. Therefore, the intermediate transport mechanism can more easily enter and exit both the first intermediate portion and the second intermediate portion.

[0046] Furthermore, the present invention is a substrate processing device, comprising: more than three conveying mechanisms arranged in the front-to-back direction; more than two intermediate parts, arranged between two adjacent conveying mechanisms in the front-to-back direction, for carrying substrates; and a control part, which controls the conveying mechanisms; and the conveying mechanism arranged at the frontmost side is set as the front-end conveying mechanism, the conveying mechanism arranged at the rearmost side is set as the rear-end conveying mechanism, the conveying mechanisms other than the front-end conveying mechanism and the rear-end conveying mechanism are set as intermediate conveying mechanisms, the intermediate part adjacent to the rear of the front-end conveying mechanism is set as the front-end intermediate part, and the intermediate part adjacent to the front of the rear-end conveying mechanism is set as the rear-end intermediate part, according to the control of the control part, the intermediate conveying mechanism repeatedly performs a cyclic action, and the cyclic action of the intermediate conveying mechanism is composed only of a first in-and-out action of entering and exiting the intermediate part adjacent to the front of the intermediate conveying mechanism and a second in-and-out action of entering and exiting the intermediate part adjacent to the rear of the intermediate conveying mechanism.

[0047] The cyclic action of the intermediate conveying mechanism is composed of only the first in-and-out action and the second in-and-out action. That is, the number of in-and-out actions included in the cyclic action of the intermediate conveying mechanism is 2. As such, the number of in-and-out actions included in the cyclic action of the intermediate conveying mechanism is relatively small. Therefore, the conveying efficiency of the intermediate conveying mechanism is relatively high. As a result, the output of the substrate processing device can be appropriately improved.

[0048] The intermediate portion is disposed between two conveying mechanisms adjacent to each other in the front-to-back direction. For example, when the number of conveying mechanisms arranged in the front-to-back direction is 3, the number of intermediate portions is 2. When the number of conveying mechanisms arranged in the front-to-back direction is N (N is an integer greater than 3), the number of intermediate portions is (N-1).

[0049] The substrate is placed in the middle portion. Two conveying mechanisms adjacent in the front-rear direction place the substrate in the middle portion, and the middle portion is arranged between the two conveying mechanisms adjacent in the front-rear direction. Therefore, the substrate can be appropriately conveyed between the conveying mechanisms adjacent in the front-rear direction via the middle portion.

[0050] The intermediate conveying mechanism is a conveying mechanism other than the front conveying mechanism and the rear conveying mechanism. For example, when the number of conveying mechanisms arranged in the front-to-back direction is 3, the number of the intermediate conveying mechanism is 1. When the number of conveying mechanisms arranged in the front-to-back direction is N (N is an integer greater than 3), the number of the intermediate conveying mechanisms is (N-2).

[0051] In the first in-and-out movement of the intermediate conveying mechanism, the intermediate conveying mechanism moves in and out to the middle part adjacent to the front of the intermediate conveying mechanism. In the second in-and-out movement of the intermediate conveying mechanism, the intermediate conveying mechanism moves in and out to the middle part adjacent to the rear of the intermediate conveying mechanism. Therefore, by repeatedly performing the cyclic movement by the intermediate conveying mechanism, the intermediate conveying mechanism alternately moves in and out to the middle part adjacent to the front of the intermediate conveying mechanism and the middle part adjacent to the rear of the intermediate conveying mechanism. As described above, the cyclic movement of the intermediate conveying mechanism is composed of only the first in-and-out movement and the second in-and-out movement. Thus, the intermediate conveying mechanism can efficiently move in and out to the middle part adjacent to the front of the intermediate conveying mechanism and the middle part adjacent to the rear of the intermediate conveying mechanism. Therefore, the intermediate conveying mechanism can efficiently transport the substrate between the front end middle part and the rear end middle part.

[0052] In addition, the so-called "adjacent to the middle part of the conveying mechanism" means the middle part arranged in the area where the conveying mechanism can convey the substrate. For example, the so-called "adjacent to the middle part in front of the intermediate conveying mechanism" means the middle part arranged in front of the intermediate conveying mechanism and arranged in the middle part of the area where the intermediate conveying mechanism can convey the substrate.

[0053] In the substrate processing device, it is preferred that the front end conveying mechanism places the substrate on the front end middle portion, the rear end conveying mechanism obtains the substrate from the rear end middle portion, the first in-and-out movement of the intermediate conveying mechanism includes an action of obtaining the substrate from the middle portion adjacent to the front of the intermediate conveying mechanism, the second in-and-out movement of the intermediate conveying mechanism includes an action of placing the substrate on the middle portion adjacent to the rear of the intermediate conveying mechanism, the intermediate conveying mechanism performs the circulation movement of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism receives the substrate from the front end conveying mechanism via the front end middle portion, and conveys the substrate from the front end middle portion to the rear end middle portion, and delivers the substrate to the rear end conveying mechanism via the rear end middle portion. The first in-and-out movement of the intermediate conveying mechanism includes an action of obtaining the substrate from the middle portion adjacent to the front of the intermediate conveying mechanism. Thus, the intermediate conveying mechanism can efficiently obtain the substrate from the middle portion adjacent to the front of the intermediate conveying mechanism. The second in-and-out action of the intermediate conveying mechanism includes an action of placing the substrate on the middle part adjacent to the rear of the intermediate conveying mechanism. Thus, the intermediate conveying mechanism can efficiently place the substrate on the middle part adjacent to the rear of the intermediate conveying mechanism. Therefore, by performing the circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently convey the substrate from the front middle part to the rear middle part. The front conveying mechanism places the substrate on the front middle part. Thus, by performing the circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently receive the substrate from the front conveying mechanism via the front middle part. The rear conveying mechanism obtains the substrate from the rear middle part. Thus, by performing the circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently deliver the substrate to the rear conveying mechanism via the rear middle part.

[0054] In the substrate processing device, it is preferred that the front end conveying mechanism obtains the substrate from the front end middle portion, the rear end conveying mechanism places the substrate on the rear end middle portion, the first in-and-out movement of the intermediate conveying mechanism includes the movement of placing the substrate on the middle portion adjacent to the front of the intermediate conveying mechanism, the second in-and-out movement of the intermediate conveying mechanism includes the movement of obtaining the substrate from the middle portion adjacent to the rear of the intermediate conveying mechanism, the intermediate conveying mechanism performs the circulation movement of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism receives the substrate from the rear end conveying mechanism via the rear end middle portion, and conveys the substrate from the rear end middle portion to the front end middle portion, and delivers the substrate to the front end conveying mechanism via the front end middle portion. The first in-and-out movement of the intermediate conveying mechanism includes the movement of placing the substrate on the middle portion adjacent to the front of the intermediate conveying mechanism. Thus, the intermediate conveying mechanism can efficiently place the substrate on the middle portion adjacent to the front of the intermediate conveying mechanism. The second in-and-out action of the intermediate conveying mechanism includes an action of obtaining a substrate from an intermediate portion adjacent to the rear of the intermediate conveying mechanism. Thus, the intermediate conveying mechanism can efficiently obtain a substrate from an intermediate portion adjacent to the rear of the intermediate conveying mechanism. Therefore, by performing a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently convey the substrate from the rear middle portion to the front middle portion. The front end conveying mechanism obtains the substrate from the front middle portion. Thus, by performing a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently deliver the substrate to the front end conveying mechanism via the front middle portion. The rear end conveying mechanism places the substrate on the rear middle portion. Thus, by performing a circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism can efficiently receive the substrate from the rear end conveying mechanism via the rear middle portion.

[0055] In the substrate processing device, it is preferred that at least one of the intermediate parts further processes the placed substrate. The substrate can be efficiently transported to the intermediate part, and the substrate can be efficiently processed in at least one of the intermediate parts. Therefore, the output of the substrate processing device can be effectively improved.

[0056] In the substrate processing device, the front middle section preferably further processes the placed substrate. The substrate can be efficiently transported to the front middle section and processed efficiently in the front middle section. Therefore, the output of the substrate processing device can be effectively improved.

[0057] In the substrate processing device, it is preferred that the substrate processing device has a carrier loading portion, which is arranged in front of the front-end conveying mechanism for loading a carrier for accommodating a substrate. According to the control of the control unit, the front-end conveying mechanism repeatedly performs a cyclic action, and the cyclic action of the front-end conveying mechanism is composed of only the third in-and-out action of the carrier loaded on the carrier loading portion and the fourth in-and-out action of the carrier loaded on the front-end middle portion. The cyclic action of the front-end conveying mechanism is composed of only the third in-and-out action and the fourth in-and-out action. In other words, the number of in-and-out actions included in the cyclic action of the front-end conveying mechanism is 2. As such, the number of in-and-out actions included in the cyclic action of the front-end conveying mechanism is relatively small. Therefore, the conveying efficiency of the front-end conveying mechanism is relatively high. As a result, the output of the substrate processing device can be appropriately improved.

[0058] In the third in-and-out movement of the front-end conveying mechanism, the front-end conveying mechanism moves in and out toward the carrier placed on the carrier mounting portion. In the fourth in-and-out movement of the front-end conveying mechanism, the front-end conveying mechanism moves in and out toward the front-end middle portion. Therefore, by repeatedly performing the cyclic movement by the front-end conveying mechanism, the front-end conveying mechanism alternately moves in and out toward the carrier and the front-end middle portion. As described above, the cyclic movement of the front-end conveying mechanism consists only of the third in-and-out movement and the fourth in-and-out movement. Thus, the front-end conveying mechanism can efficiently move in and out toward the carrier and the front-end middle portion. Therefore, the front-end conveying mechanism can efficiently transfer the substrate between the carrier and the front-end middle portion.

[0059] In the substrate processing device, it is preferred that the substrate processing device has a back-end processing unit, which is arranged at least at any one of the side position of the back-end conveying mechanism or the rear position of the back-end conveying mechanism, and processes the substrate. According to the control of the control unit, the back-end conveying mechanism repeatedly performs a circulation action, and the circulation action of the back-end conveying mechanism is composed of only the third in-and-out action to the middle part of the back end and the fourth in-and-out action to the back-end processing unit. The circulation action of the back-end conveying mechanism is composed of only the third in-and-out action and the fourth in-and-out action. In other words, the number of in-and-out actions included in the circulation action of the back-end conveying mechanism is 2. In this way, the number of in-and-out actions included in the circulation action of the back-end conveying mechanism is relatively small. Therefore, the conveying efficiency of the back-end conveying mechanism is relatively high. As a result, the output of the substrate processing device can be appropriately improved.

[0060] In the third in-and-out movement of the rear-end transport mechanism, the rear-end transport mechanism moves in and out toward the rear-end middle portion. In the fourth in-and-out movement of the rear-end transport mechanism, the rear-end transport mechanism moves in and out toward the rear-end processing portion. Therefore, by repeatedly performing the cyclic movement by the rear-end transport mechanism, the rear-end transport mechanism alternately moves in and out toward the rear-end middle portion and the rear-end processing portion. As described above, the cyclic movement of the rear-end transport mechanism consists only of the third in-and-out movement and the fourth in-and-out movement. Thus, the rear-end transport mechanism can efficiently move in and out toward the rear-end middle portion and the rear-end processing portion. Therefore, the rear-end transport mechanism can efficiently transport the substrate between the rear-end middle portion and the rear-end processing portion.

[0061] The back-end processing unit processes the substrate. Thus, the substrate can be efficiently transported to the back-end processing unit and the substrate can be efficiently processed in the back-end processing unit. Therefore, the throughput of the substrate processing device can be effectively improved.

[0062] In addition, this specification also discloses the following invention related to a substrate processing apparatus.

[0063] In the substrate processing device, it is preferred that at least one of the first transfer unit and the second transfer unit is a processing unit that further processes the placed substrate. When at least one of the first transfer units is a processing unit, the intermediate transfer mechanism can efficiently obtain the substrate from the processing unit. Thus, the substrate can be efficiently transferred to the first transfer unit, and the substrate can be efficiently processed in at least one of the first transfer units. Therefore, the output of the substrate processing device can be effectively improved. When at least one of the second transfer units is a processing unit, the intermediate transfer mechanism can efficiently place the substrate on the processing unit. Thus, the substrate can be efficiently transferred to the second transfer unit, and the substrate can be efficiently processed in at least one of the second transfer units. Therefore, the output of the substrate processing device can be effectively improved.

[0064] In the substrate processing device, it is preferred that the processing unit is a non-liquid processing unit that processes the substrate without supplying a processing liquid to the substrate. The size of the non-liquid processing unit is relatively small. For example, the size of the non-liquid processing unit is smaller than that of the liquid processing unit. Thus, in the case where the first transfer unit is a non-liquid processing unit, the first intermediate portion can have a relatively large number of non-liquid processing units as the first transfer unit. Therefore, it is possible to appropriately prevent a delay in the transfer of the substrate between the first conveying mechanism and the intermediate conveying mechanism. In the case where the second transfer unit is a non-liquid processing unit, the second intermediate portion can have a relatively large number of non-liquid processing units as the second transfer unit. Therefore, it is possible to appropriately prevent a delay in the transfer of the substrate between the intermediate conveying mechanism and the second conveying mechanism.

[0065] In the substrate processing device, it is preferred that the processing unit is a heat treatment unit that performs heat treatment on the substrate. The size of the heat treatment unit is relatively small. For example, the size of the heat treatment unit is smaller than that of the liquid treatment unit. Thus, in the case where the first transfer unit is a heat treatment unit, the first intermediate portion can have a relatively large number of heat treatment units as the first transfer unit. Therefore, it is possible to appropriately prevent a delay in the transfer of the substrate in the first transfer unit. In the case where the second transfer unit is a heat treatment unit, the second intermediate portion can have a relatively large number of heat treatment units as the second transfer unit. Therefore, it is possible to appropriately prevent a delay in the transfer of the substrate in the second transfer unit.

[0066] In the substrate processing device, it is preferred that at least one of the first transfer unit and the second transfer unit includes an inspection unit for inspecting the substrate. In the case where at least one of the first transfer units is an inspection unit, the intermediate transfer mechanism can efficiently place the substrate on the inspection unit. Thus, the substrate can be efficiently transferred to the first transfer unit, and the substrate can be efficiently inspected in at least one of the first transfer units. Therefore, the output of the substrate processing device can be effectively improved. In the case where at least one of the second transfer units is an inspection unit, the intermediate transfer mechanism can efficiently obtain the substrate from the inspection unit. Thus, the substrate can be efficiently transferred to the second transfer unit, and the substrate can be efficiently inspected in at least one of the second transfer units. Therefore, the output of the substrate processing device can be effectively improved.

[0067] In the substrate processing device, the front middle section preferably includes a processing unit for further processing a substrate placed thereon, and the front transport mechanism performs at least one of placing a substrate on the processing unit and obtaining a substrate from the processing unit. The substrate can be efficiently transported to the front middle section, and the substrate can be efficiently processed at the front middle section. Therefore, the throughput of the substrate processing device can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Although several aspects currently considered to be preferred are shown in the drawings for the purpose of explaining the invention, it should be understood that the invention is not limited to the structures and measures shown in the drawings.

[0069] Figure 1 This is a conceptual diagram of the substrate processing apparatus according to the first embodiment.

[0070] Figure 2 It is a diagram schematically showing the circulation operation of the intermediate transport mechanism.

[0071] Figure 3A , 3B It is a diagram schematically showing a substrate transport path.

[0072] Figure 4It is a top view of the substrate processing apparatus according to the first embodiment.

[0073] Figure 5 This is the front view of the loading block.

[0074] Figure 6 It is a left side view showing the left structure of the substrate processing apparatus.

[0075] Figure 7 This is a left side view of the central portion of the substrate processing apparatus in the width direction.

[0076] Figure 8 It is a right side view showing the right structure of the substrate processing apparatus.

[0077] Fig. 9 This is a front view showing the internal structure of the loading block.

[0078] Fig.10 This is a front view of the first transport block.

[0079] Fig.11 This is a front view of the second transport block.

[0080] Fig.12 This is a front view of the first heat treatment block.

[0081] Fig.13 It is a front view of the heat treatment unit and the mounting unit.

[0082] Fig.14A is a top view of the lower part of the heat treatment unit, Fig. 14B It is a top view of the upper part of the heat treatment unit and the mounting unit.

[0083] Fig.15 It is a side view of the heat treatment unit, the placement unit and the transport mechanism.

[0084] Fig.16 It is a top view of the inspection unit.

[0085] Fig.17 This is a side view of the inspection unit and the transport mechanism.

[0086] Fig.18 This is a front view of the second heat treatment block.

[0087] Fig.19 It is a diagram schematically showing a substrate transport path.

[0088] Fig. 20 This is a conceptual diagram of a substrate processing apparatus according to a second embodiment.

[0089] Fig.21 It is a diagram schematically showing the circulation operation of the intermediate transport mechanism.

[0090] Fig. 22 It is a top view of the substrate processing apparatus according to the second embodiment.

[0091] Fig.23 This is a front view of the first heat treatment block.

[0092] Fig.24 It is a diagram schematically showing a substrate transport path. DETAILED DESCRIPTION

[0093] Hereinafter, a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

[0094] [First embodiment]

[0095] <Overview of substrate processing apparatus>

[0096] Figure 1 1 is a conceptual diagram of a substrate processing apparatus according to the first embodiment. The substrate processing apparatus 10 according to the first embodiment performs a series of processes on a substrate (e.g., a semiconductor wafer) W. The substrate W is shown below. Figure 4 Waiting.

[0097] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, and a substrate for a solar cell. The substrate W has a relatively thin flat plate shape. The substrate W has a generally circular shape when viewed from above.

[0098] The substrate processing apparatus 10 includes a first transfer mechanism 1 for transferring a substrate W, a second transfer mechanism 2 for transferring a substrate W, and an intermediate transfer mechanism 3 for transferring a substrate W. The intermediate transfer mechanism 3 is disposed between the first transfer mechanism 1 and the second transfer mechanism 2 .

[0099] Figure 1The first area B1, the second area B2, and the intermediate area B3 are schematically shown. The first area B1 is an area where the first conveying mechanism 1 can convey the substrate W. In other words, the first area B1 is an area where the first conveying mechanism 1 can enter and exit. The first conveying mechanism 1 cannot convey the substrate W outside the first area B1. The substrate W moves in the first area B1 by the first conveying mechanism 1. The second area B2 is an area where the second conveying mechanism 2 can convey the substrate W. In other words, the second area B2 is an area where the second conveying mechanism 2 can enter and exit. The intermediate area B3 is an area where the intermediate conveying mechanism 3 can convey the substrate W. In other words, the intermediate area B3 is an area where the intermediate conveying mechanism 3 can enter and exit. The first area B1 partially overlaps with the intermediate area B3. The second area B2 partially overlaps with the intermediate area B3. The first area B1 and the second area B2 do not overlap.

[0100] Figure 1 The first overlapping area BO1 and the second overlapping area BO2 are schematically shown. The first overlapping area BO1 is an area where the first area B1 overlaps with the intermediate area B3. That is, the first overlapping area BO1 is an area where the first conveying mechanism 1 and the intermediate conveying mechanism 3 can convey the substrate W. The second overlapping area BO2 is an area where the second area B2 overlaps with the intermediate area B3. That is, the second overlapping area BO2 is an area where the second conveying mechanism 2 and the intermediate conveying mechanism 3 can convey the substrate W.

[0101] The substrate processing apparatus 10 includes a first intermediate portion 4 and a second intermediate portion 5. The substrate W is placed in the first intermediate portion 4. The substrate W is placed in the second intermediate portion 5. The first intermediate portion 4 is arranged in the first overlapping region BO1. The first intermediate portion 4 is arranged outside the second region B2. The second intermediate portion 5 is arranged in the second overlapping region BO2. The second intermediate portion 5 is arranged outside the first region B1.

[0102] The first intermediate portion 4 may further process the substrate W placed in the first intermediate portion 4. The process in the first intermediate portion 4 may also be a non-liquid process. The non-liquid process is a process performed without supplying a process liquid to the substrate W. The process in the first intermediate portion 41 may also be a heat treatment. Heat treatment is a type of non-liquid process. Similarly, the second intermediate portion 5 may further process the substrate W placed in the second intermediate portion 5. The process in the second intermediate portion 5 may also be a non-liquid process. The process in the second intermediate portion 5 may also be a heat treatment.

[0103] The first intermediate section 4 can also further inspect the substrate W placed on the first intermediate section 4 . Similarly, the second intermediate section 5 can also further inspect the substrate W placed on the second intermediate section 5 .

[0104] The first intermediate portion 4 includes a plurality of first transfer units 4S. One substrate W is placed on each of the first transfer units 4S. The first transfer unit 4S mainly places the substrate W transferred from the first transfer mechanism 1 to the intermediate transfer mechanism 3 .

[0105] The first intermediate section 4 includes a plurality of first return units 4R. One substrate is placed in each of the first return units 4R. The first return unit 4R mainly places the substrate W returned from the intermediate transfer mechanism 3 to the first transfer mechanism 1.

[0106] The second intermediate portion 5 includes a plurality of second transfer units 5S. One substrate W is placed on each of the second transfer units 5S. The second transfer unit 5S mainly places the substrate W transferred from the intermediate transfer mechanism 3 to the second transfer mechanism 2.

[0107] The second intermediate section 5 includes a plurality of second transfer units 5R. One substrate is placed in each second transfer unit 5R. The second transfer unit 5R mainly places the substrate W transferred from the second transfer mechanism 2 to the intermediate transfer mechanism 3.

[0108] Each first transfer unit 4S is, for example, any one of a loading unit, a processing unit, and an inspection unit. Each first return unit 4R is, for example, any one of a loading unit, a processing unit, and an inspection unit. Each second transfer unit 5S is, for example, any one of a loading unit, a processing unit, and an inspection unit. Each second return unit 5R is, for example, any one of a loading unit, a processing unit, and an inspection unit.

[0109] The placement unit does not process the substrate W. Only one substrate W is placed on the placement unit.

[0110] The processing unit further processes the mounted substrate W. The processing unit may also be a liquid processing unit. The liquid processing unit processes the substrate W by supplying a processing liquid to the substrate W. The liquid processing unit is, for example, a coating unit that forms a coating film on the substrate W, a developing unit that develops the substrate W, or a cleaning unit that cleans the substrate W. The processing unit may also be a non-liquid processing unit. The non-processing unit processes the substrate W without supplying a processing liquid to the substrate W. The non-liquid processing unit is, for example, a heat treatment unit that performs a heat treatment on the substrate W, or an edge exposure processing unit that exposes the peripheral portion of the substrate W.

[0111] The inspection unit further inspects the mounted single substrate W. The following is an example of the inspection contents performed by the inspection unit.

[0112] The shape, state or defects of the surface of substrate W

[0113] The shape, state, thickness or defects of the coating film formed on the surface of the substrate W

[0114] The shape, state or defects of the pattern formed on the surface of the substrate W

[0115] Here, at least one of the first transfer unit 4S and the second transfer unit 5S may also be a processing unit. At least one of the first return unit 4R and the second return unit 5R may also be a processing unit. At least one of the first transfer unit 4S and the first return unit 4R may also be a processing unit. At least one of the second transfer unit 5S and the second return unit 5R may also be a processing unit.

[0116] The processing unit as the first transfer unit 4S may be a non-liquid processing unit. The processing unit as the first transfer unit 4S may be a heat treatment unit. Similarly, the processing unit as the first return unit 4R, the second transfer unit 5S or the second return unit 5R may be a non-liquid processing unit. The processing unit as the first return unit 4R, the second transfer unit 5S or the second return unit 5R may be a heat treatment unit.

[0117] At least one of the first transfer unit 4R and the second transfer unit 5R may be an inspection unit.

[0118] The substrate processing apparatus 10 includes a control unit 6. The control unit 6 controls the first transport mechanism 1, the second transport mechanism 2, and the intermediate transport mechanism 3.

[0119] The control unit 6 is implemented by a central processing unit (CPU (Central Processing Unit)) that executes various processing, a RAM (Random-Access Memory) that serves as a work area for processing, and a storage medium such as a fixed disk. Various information such as a processing recipe (processing program) for processing the substrate W or information for identifying each substrate W is stored in the storage medium.

[0120] The first transport mechanism 1 operates as follows under the control of the control unit 6. The first transport mechanism 1 places the substrate W on the first intermediate portion 4. Specifically, the first transport mechanism 1 places the substrate W on the first transfer unit 4S. The first transport mechanism 1 obtains the substrate W from the first intermediate portion 4. Specifically, the first transport mechanism 1 obtains the substrate W from the first return unit 4R.

[0121] The second transport mechanism 2 operates as follows under the control of the control unit 6. The second transport mechanism 2 obtains the substrate from the second intermediate portion 5. Specifically, the second transport mechanism 2 obtains the substrate W from the second transfer unit 5S. The second transport mechanism 2 places the substrate on the second intermediate portion 5. Specifically, the second transport mechanism 2 places the substrate W on the second return unit 5R.

[0122] Figure 2The figure schematically shows the cyclic operation of the intermediate conveying mechanism 3. According to the control performed by the control unit 6, the intermediate conveying mechanism 3 repeatedly performs Figure 2 The cyclic operation shown in FIG. 1 is a cyclic operation of the intermediate conveying mechanism 3, which is composed of only the first in-and-out operation and the second in-and-out operation. The intermediate conveying mechanism 3 performs the first in-and-out operation and the second in-and-out operation alternately.

[0123] The first advancing and withdrawing operation of the intermediate conveying mechanism 3 is an operation in which the intermediate conveying mechanism 3 advances and withdraws toward the first intermediate portion 4 .

[0124] The first in-and-out movement of the intermediate transport mechanism 3 includes the movement of the intermediate transport mechanism 3 taking the substrate W from the first intermediate portion 4. Specifically, the first in-and-out movement of the intermediate transport mechanism 3 includes the movement of the intermediate transport mechanism 3 taking the substrate W from the first transfer unit 4S. However, the first in-and-out movement of the intermediate transport mechanism 3 does not include the movement of the intermediate transport mechanism 3 placing the substrate W on the first transfer unit 4S.

[0125] The first in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 placing the substrate W on the first intermediate portion 4. Specifically, the first in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 placing the substrate W on the first return unit 4R. However, the first in-and-out motion of the intermediate transport mechanism 3 does not include the motion of the intermediate transport mechanism 3 taking the substrate W from the first return unit 4R.

[0126] As described above, in the first in-and-out operation of the intermediate transport mechanism 3, the intermediate transport mechanism 3 does not perform both the operation of placing the substrate W and the operation of taking out the substrate W in the same unit (specifically, one of the first transfer unit 4S and the first return unit 4R).

[0127] The second advancing and withdrawing operation is an operation in which the intermediate transport mechanism 3 advances and withdraws toward the second intermediate portion 5 .

[0128] The second in-and-out motion of the intermediate transport mechanism 3 includes the motion of placing the substrate W on the second intermediate portion 5. Specifically, the second in-and-out motion of the intermediate transport mechanism 3 includes the motion of placing the substrate W on the second transfer unit 5S. However, the second in-and-out motion of the intermediate transport mechanism 3 does not include the motion of taking the substrate W from the second transfer unit 5S.

[0129] The second in-and-out movement of the intermediate transport mechanism 3 includes the movement of taking in the substrate W from the second intermediate portion 5. Specifically, the second in-and-out movement of the intermediate transport mechanism 3 includes the movement of taking in the substrate W from the second return unit 5R. However, the second in-and-out movement of the intermediate transport mechanism 3 does not include the movement of placing the substrate W on the second return unit 5R.

[0130] As described above, in the second in-and-out operation of the intermediate transport mechanism 3, the intermediate transport mechanism 3 does not perform both the operation of placing the substrate W and the operation of taking out the substrate W in the same unit (specifically, one of the second transfer unit 5S and the second return unit 5R).

[0131] The intermediate transport mechanism 3 performs one cycle of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 transports the substrate W from the first intermediate portion 4 to the second intermediate portion 5, and transports the substrate W from the second intermediate portion 5 to the first intermediate portion 4. Specifically, the intermediate transport mechanism 3 performs one cycle of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 transports the substrate W from the first transfer unit 4S to the second transfer unit 5S, and transports the substrate W from the second return unit 5R to the first return unit 4R.

[0132] Reference Figure 2 , 3A , an operation example of the substrate processing apparatus 10 is described. Figure 3A 1 is a diagram schematically showing a transport path of the substrate W. Under control by the control unit 6 , the substrate W is transferred from the first transport mechanism 1 to the second transport mechanism 2 .

[0133] Specifically, the first transport mechanism 1 places a substrate W on the first transfer unit 4S. The intermediate transport mechanism 3 obtains the substrate W from the first transfer unit 4S (the first in-and-out operation of the intermediate transport mechanism 3). In this way, the intermediate transport mechanism 3 receives the substrate W from the first transport mechanism 1 via the first transfer unit 4S (the first intermediate portion 4).

[0134] When the first transfer unit 4S is a processing unit, the first transfer unit 4S processes the placed substrate W. When the first transfer unit 4S is an inspection unit, the first transfer unit 4S inspects the placed substrate W. Specifically, after the first transport mechanism 1 places the substrate W on the first transfer unit 4S and before the intermediate transport mechanism 3 takes the substrate W from the first transfer unit 4S, the first transfer unit 4S processes or inspects the substrate W placed on the first transfer unit 4S.

[0135] The intermediate transport mechanism 3 places the substrate W received from the first transfer unit 4S on the second transfer unit 5S (second in-and-out operation of the intermediate transport mechanism 3 ). In this manner, the intermediate transport mechanism 3 transports the substrate W from the first intermediate portion 4 to the second intermediate portion 5 .

[0136] When the second transfer unit 5S is a processing unit or an inspection unit, the second transfer unit 5S processes or inspects the substrate W placed thereon.

[0137] The second transport mechanism 2 receives the substrate W from the second transfer unit 5S. In this manner, the intermediate transport mechanism 3 delivers the substrate W to the second transport mechanism 2 via the second intermediate portion 5 .

[0138] Reference Figure 2 , 3B , an operation example of the substrate processing apparatus 10 is described. Figure 3B 2 is a diagram schematically showing a transport path of the substrate W. According to the control of the control unit 6 , the substrate W is moved back from the second transport mechanism 2 to the first transport mechanism 1 .

[0139] Specifically, the second transport mechanism 2 places one substrate W on the second return unit 5R.

[0140] When the second transfer unit 5R is a processing unit or an inspection unit, the second transfer unit 5R processes or inspects the mounted substrate W.

[0141] The intermediate transport mechanism 3 receives the substrate W from the second transfer unit 5R (second in-and-out operation of the intermediate transport mechanism 3 ). In this way, the intermediate transport mechanism 3 receives the substrate W from the second transport mechanism 2 via the second intermediate portion 5 .

[0142] The intermediate transport mechanism 3 places the substrate W received from the second return unit 5R on the first return unit 4R (first in-and-out operation of the intermediate transport mechanism 3 ). In this way, the intermediate transport mechanism 3 transports the substrate W from the second intermediate section 5 to the first intermediate section 4 .

[0143] When the first transfer unit 4R is a processing unit or an inspection unit, the first transfer unit 4R processes or inspects the mounted substrate W.

[0144] The first transport mechanism 1 takes in the substrate W from the first transfer-back unit 4R. In this way, the intermediate transport mechanism 3 delivers the first transport mechanism 1 to the substrate W via the first intermediate portion 4 .

[0145] In the above operation example, in one first in-and-out operation of the intermediate transport mechanism 3, the intermediate transport mechanism 3 performs the operation of taking in the substrate W from the first transfer unit 4S and the operation of placing the substrate W on the first return unit 4R once.

[0146] In the above operation example, in one second in-and-out operation of the intermediate transport mechanism 3, the intermediate transport mechanism 3 performs the operation of placing the substrate W on the second transfer unit 5S and the operation of taking the substrate W from the second return unit 5R once.

[0147] <Main Effects of First Embodiment>

[0148] According to the substrate processing apparatus 10, the following effects are achieved.

[0149] The cyclic action of the intermediate conveying mechanism 3 is composed of only the first in-and-out action and the second in-and-out action. That is, the number of in-and-out actions included in the cyclic action of the intermediate conveying mechanism 3 is 2. As such, the number of in-and-out actions included in the cyclic action of the intermediate conveying mechanism 3 is relatively small. Therefore, the time required for the cyclic action of the intermediate conveying mechanism 3 is relatively short. In other words, the number of cyclic actions of the intermediate conveying mechanism 3 that can be performed per unit time is relatively large. Therefore, the efficiency of the intermediate conveying mechanism 3 in conveying the substrate W (hereinafter, appropriately referred to as "the conveying efficiency of the intermediate conveying mechanism 3") is relatively high. As a result, the output of the substrate processing device 10 can be appropriately improved.

[0150] The first intermediate portion 4 is disposed in a first overlapping region BO1 where the first transport mechanism 1 and the intermediate transport mechanism 3 can transport the substrate W. Therefore, the first transport mechanism 1 and the intermediate transport mechanism 3 can move in and out of the first intermediate portion 4 appropriately.

[0151] The substrate W is placed on the first intermediate portion 4 . Therefore, the substrate W can be appropriately transferred between the first transfer mechanism 1 and the intermediate transfer mechanism 3 via the first intermediate portion 4 .

[0152] The second intermediate portion 5 is disposed in a second overlapping region BO2 where the intermediate transfer mechanism 3 and the second transfer mechanism 2 can transfer the substrate W. Therefore, the intermediate transfer mechanism 3 and the second transfer mechanism 2 can move in and out of the second intermediate portion 5 appropriately.

[0153] The substrate W is placed on the second intermediate portion 5 . Therefore, the substrate W can be appropriately transferred between the intermediate transfer mechanism 3 and the second transfer mechanism 2 via the second intermediate portion 5 .

[0154] In the first in-and-out motion included in the cyclic motion of the intermediate transport mechanism 3, the intermediate transport mechanism 3 moves in and out to the first intermediate portion 4. In the second in-and-out motion included in the cyclic motion of the intermediate transport mechanism 3, the intermediate transport mechanism 3 moves in and out to the second intermediate portion 5. Therefore, by repeatedly performing the cyclic motion of the intermediate transport mechanism 3, the intermediate transport mechanism 3 moves in and out to the first intermediate portion 4 and the second intermediate portion 5 alternately. As described above, the cyclic motion of the intermediate transport mechanism 3 is composed of only the first in-and-out motion and the second in-and-out motion. Thus, the intermediate transport mechanism 3 can move in and out to the first intermediate portion 4 and the second intermediate portion 5 efficiently. Therefore, the intermediate transport mechanism 3 can efficiently transport the substrate W between the first intermediate portion 4 and the second intermediate portion 5.

[0155] The first in-and-out motion of the intermediate transport mechanism 3 includes the motion of taking the substrate W from the first intermediate portion 4. Thus, the intermediate transport mechanism 3 can efficiently take the substrate W from the first intermediate portion 4. The second in-and-out motion of the intermediate transport mechanism 3 includes the motion of placing the substrate on the second intermediate portion 5. Thus, the intermediate transport mechanism 3 can efficiently place the substrate W on the second intermediate portion 5. Therefore, by the intermediate transport mechanism 3 performing the circulation motion of the intermediate transport mechanism 3, the intermediate transport mechanism 3 can efficiently transfer the substrate W from the first intermediate portion 4 to the second intermediate portion 5.

[0156] The first transport mechanism 1 places the substrate W on the first intermediate portion 4. Thus, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently receive the substrate W from the first transport mechanism 1 via the first intermediate portion 4. The second transport mechanism 2 receives the substrate W from the second intermediate portion 5. Thus, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently deliver the substrate W to the second transport mechanism 2 via the second intermediate portion 5. Therefore, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently transport the substrate W from the first transport mechanism 1 to the second transport mechanism 2.

[0157] The first in-and-out motion of the intermediate transport mechanism 3 includes the motion of placing the substrate W on the first intermediate portion 4. Thus, the intermediate transport mechanism 3 can efficiently place the substrate W on the first intermediate portion 4. The second in-and-out motion of the intermediate transport mechanism 3 includes the motion of taking the substrate W from the second intermediate portion 5. Thus, the intermediate transport mechanism 3 can efficiently take the substrate W from the second intermediate portion 5. Therefore, by the intermediate transport mechanism 3 performing the circulation motion of the intermediate transport mechanism 3, the intermediate transport mechanism 3 can efficiently transport the substrate W from the second intermediate portion 5 to the first intermediate portion 4.

[0158] The first transport mechanism 1 receives the substrate W from the first intermediate portion 4. Thus, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently deliver the substrate W to the first transport mechanism 1 via the first intermediate portion 4. The second transport mechanism 2 places the substrate W on the second intermediate portion 5. Thus, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently receive the substrate W from the second transport mechanism 2 via the second intermediate portion 5. Therefore, the intermediate transport mechanism 3 performs a circulation operation of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 can efficiently transport the substrate W from the second transport mechanism 2 to the first transport mechanism 1.

[0159] The first in-and-out operation of the intermediate transport mechanism 3 includes an operation of taking in the substrate W from the first transfer unit 4S. Thus, the intermediate transport mechanism 3 can efficiently take in the substrate W from the first transfer unit 4S.

[0160] The first in-and-out operation of the intermediate transport mechanism 3 does not include the operation of placing the substrate W on the first transfer unit 4S. Thus, the operation of the intermediate transport mechanism 3 for the first transfer unit 4S can be simplified. Thus, the control of the intermediate transport mechanism 3 by the control unit 6 can be simplified.

[0161] The second in-and-out operation of the intermediate transport mechanism 3 includes an operation of placing the substrate W on the second transfer unit 5S. Thus, the intermediate transport mechanism 3 can efficiently place the substrate W on the second transfer unit 5S.

[0162] The second in-and-out operation of the intermediate transport mechanism 3 does not include an operation of taking in the substrate W from the second transfer unit 5S. Thus, the operation of the intermediate transport mechanism 3 for the second transfer unit 5S can be simplified. Thus, the control of the intermediate transport mechanism 3 by the control unit 6 can be simplified.

[0163] The first in-and-out operation of the intermediate transport mechanism 3 includes an operation of placing the substrate W on the first transfer unit 4R. Thus, the intermediate transport mechanism 3 can efficiently place the substrate W on the first transfer unit 4R.

[0164] The first in-and-out operation of the intermediate transport mechanism 3 does not include an operation of taking in the substrate W from the first return unit 4R. Thus, the operation of the intermediate transport mechanism 3 for the first return unit 4R can be simplified. Thus, the control of the intermediate transport mechanism 3 by the control unit 6 can be simplified.

[0165] The second in-and-out operation of the intermediate transport mechanism 3 includes an operation of taking in the substrate W from the second transfer unit 5R. Thus, the intermediate transport mechanism 3 can efficiently take in the substrate W from the second transfer unit 5R.

[0166] The second in-and-out operation of the intermediate transport mechanism 3 does not include the operation of placing the substrate W on the second return unit 5R. Thus, the operation of the intermediate transport mechanism 3 for the second return unit 5R can be simplified. Thus, the control of the intermediate transport mechanism 3 by the control unit 6 can be simplified.

[0167] When the first intermediate section 4 further processes the substrate W placed thereon, the substrate W can be efficiently transferred to the first intermediate section 4 and the substrate W can be efficiently processed therein. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved. Similarly, when the second intermediate section 5 further processes the substrate W placed thereon, the substrate W can be efficiently transferred to the second intermediate section 5 and the substrate W can be efficiently processed therein. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0168] The space for non-liquid treatment is relatively small. For example, the space for non-liquid treatment is smaller than the space for liquid treatment. Here, liquid treatment is a treatment performed by supplying a treatment liquid to the substrate W. Therefore, in the case where the treatment of the first intermediate part 4 is non-liquid treatment, the first intermediate part 4 can efficiently perform non-liquid treatment on the substrate W. For example, the first intermediate part 4 can perform non-liquid treatment on a plurality of substrates W at the same time. Thus, it is possible to appropriately prevent delays in the transport of the substrate W in the first intermediate part 4. Similarly, even in the case where the treatment of the second intermediate part 5 is non-liquid treatment, it is possible to appropriately prevent delays in the transport of the substrate W in the second intermediate part 5.

[0169] The space for heat treatment is relatively small. For example, the space for heat treatment is smaller than the space for liquid treatment. Therefore, when the treatment of the first intermediate part 4 is heat treatment, the first intermediate part 4 can efficiently perform heat treatment on the substrate W. For example, the first intermediate part 4 can perform heat treatment on a plurality of substrates W at the same time. Thus, it is possible to appropriately prevent the delay of the transport of the substrate W in the first intermediate part 4. Similarly, even when the treatment of the second intermediate part 5 is heat treatment, it is possible to appropriately prevent the delay of the transport of the substrate W in the second intermediate part 5.

[0170] When the first intermediate section 4 further inspects the substrate W placed thereon, the substrate W can be efficiently transferred to the first intermediate section 4 and the substrate W can be efficiently inspected therein. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved. Similarly, when the second intermediate section 5 further inspects the substrate W placed thereon, the substrate W can be efficiently transferred to the second intermediate section 5 and the substrate W can be efficiently inspected therein. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0171] When at least one of the first transfer units 4S is a processing unit that further processes the placed substrate W, the intermediate transfer mechanism 3 can efficiently obtain the substrate W from the processing unit. Thus, the substrate W can be efficiently transferred to the first transfer unit 4S, and the substrate W can be efficiently processed in at least one of the first transfer units 4S. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved. When at least one of the second transfer units 5S is a processing unit, the intermediate transfer mechanism 3 can efficiently place the substrate W on the processing unit. Thus, the substrate W can be efficiently transferred to the second transfer unit 5S, and the substrate W can be efficiently processed in at least one of the second transfer units 5S. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0172] Similarly, when at least one of the first return units 4R is a processing unit, the intermediate transport mechanism 4 can efficiently place the substrate W on the processing unit. Thus, the substrate W can be efficiently transported to the first return unit 4R, and the substrate W can be efficiently processed in at least one of the first return units 4R. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved. When at least one of the second return units 5R is a processing unit, the intermediate transport mechanism 4 can efficiently obtain the substrate W from the processing unit. Thus, the substrate W can be efficiently transported to the second return unit 5R, and the substrate W can be efficiently processed in at least one of the second return units 5R. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0173] The size of the non-liquid processing unit is relatively small. For example, the size of the non-liquid processing unit is smaller than that of the liquid processing unit. Thus, when the first transfer unit 4S is a non-liquid processing unit, the first intermediate portion 4 can have a relatively large number of non-liquid processing units as the first transfer unit 4S. Therefore, the first transfer unit 4S can efficiently perform non-liquid processing on the substrate W. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the first transfer mechanism 1 and the intermediate transfer mechanism 3. Specifically, it is possible to appropriately prevent the transfer delay of the substrate W in the first transfer unit 4S. When the second transfer unit 5S is a non-liquid processing unit, the second intermediate portion 5 can have a relatively large number of non-liquid processing units as the second transfer unit 5S. Therefore, the second transfer unit 5S can efficiently perform non-liquid processing on the substrate W. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the second transfer mechanism 2 and the intermediate transfer mechanism 3. Specifically, it is possible to appropriately prevent the transfer delay of the substrate in the second transfer unit 5S.

[0174] Similarly, when the first return unit 4R is a non-liquid processing unit, the first intermediate portion 4 includes a relatively large number of non-liquid processing units as the first return unit 4R. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the first transport mechanism 1 and the intermediate transport mechanism 3. Specifically, it is possible to appropriately prevent the transfer delay of the substrate W in the first return unit 4R. When the second return unit 5R is a non-liquid processing unit, the second intermediate portion 5 can include a relatively large number of non-liquid processing units as the second return unit 5R. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the second transport mechanism 2 and the intermediate transport mechanism 3. Specifically, it is possible to appropriately prevent the transfer delay of the substrate W in the second return unit 5R.

[0175] The size of the heat treatment unit is relatively small. For example, the size of the heat treatment unit is smaller than that of the liquid treatment unit. Therefore, when the first transfer unit 4S is a heat treatment unit, the first intermediate part 4 has a relatively large number of heat treatment units as the first transfer unit 4S. Therefore, the first transfer unit 4S can efficiently perform heat treatment on the substrate W. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the first conveying mechanism 1 and the intermediate conveying mechanism 3. When the second transfer unit 5S is a heat treatment unit, the second intermediate part 5 can have a relatively large number of heat treatment units as the second transfer unit 5S. Therefore, the second transfer unit 5S can efficiently perform heat treatment on the substrate W. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the second conveying mechanism 2 and the intermediate conveying mechanism 3.

[0176] Similarly, when the first return unit 4R is a heat treatment unit, the first intermediate section 4 can include a relatively large number of heat treatment units as the first return unit 4R. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the first transfer mechanism 1 and the intermediate transfer mechanism 3. When the second return unit 5R is a heat treatment unit, the second intermediate section 5 can include a relatively large number of heat treatment units as the second return unit 5R. Therefore, it is possible to appropriately prevent the transfer delay of the substrate W between the second transfer mechanism 2 and the intermediate transfer mechanism 3.

[0177] When at least one of the first return units 4R is an inspection unit, the intermediate transport mechanism 3 can efficiently place the substrate W on the inspection unit. Thus, the substrate W can be efficiently transported to the first return unit 4R, and the substrate W can be efficiently inspected in at least one of the first return units 4R. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved. When at least one of the second return units 5R is an inspection unit, the intermediate transport mechanism 3 can efficiently obtain the substrate W from the inspection unit. Thus, the substrate W can be efficiently transported to the second return unit 5R, and the substrate W can be efficiently inspected in at least one of the second return units 5R. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0178] The first intermediate portion 4 is disposed outside the second area B2 where the second transport mechanism 2 can transport the substrate W. Therefore, the first transport mechanism 1 and the intermediate transport mechanism 3 can move in and out of the first intermediate portion 4 without interfering with the second transport mechanism 2 .

[0179] The second intermediate portion 5 is disposed outside the first area B1 where the first transport mechanism 1 can transport the substrate W. Therefore, the intermediate transport mechanism 3 and the second transport mechanism 2 can move in and out of the second intermediate portion 5 without interfering with the first transport mechanism 1 .

[0180] Hereinafter, the structure of the substrate processing apparatus 10 will be described in further detail.

[0181] <Overall Structure of Substrate Processing Apparatus 10 >

[0182] Figure 4 1 is a top view of a substrate processing apparatus 10 according to a first embodiment. The substrate processing apparatus 10 includes a loading block 11, a first heat treatment block 21, a first transfer block 41, a second heat treatment block 51, a second transfer block 61, and a liquid processing block 71. The loading block 11, the first heat treatment block 21, the first transfer block 41, the second heat treatment block 51, the second transfer block 61, and the liquid processing block 71 are arranged in sequence in a row.

[0183] Hereinafter, the loading block 11 will be appropriately referred to as “block 11 .” Similarly, the first heat treatment block 21 , the first transfer block 41 , the second heat treatment block 51 , the second transfer block 61 , and the liquid treatment block 71 will also be referred to as “blocks 21 , 41 , 51 , 61 , 71 .”

[0184] The direction in which blocks 11, 21, 41, 51, 61, and 71 are arranged is called the "front-to-back direction X". The front-to-back direction X is horizontal. The direction from block 71 toward block 11 in the front-to-back direction X is called the "front". The direction opposite to the front is called the "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y" or the "side". One direction of the "width direction Y" is appropriately called the "right". The direction opposite to the right is called the "left". The vertical direction is called the "up-down direction Z". The up-down direction Z is perpendicular to the front-to-back direction X and to the width direction Y. In each figure, the front, back, right, left, top, and bottom are appropriately shown for reference.

[0185] Hereinafter, the loading block 11, the first transfer block 41, the second transfer block 61, and the liquid processing block 71 of the substrate processing apparatus 10 will be described first, and then the first thermal processing block 21 and the second thermal processing block 51 will be described.

[0186] <Loading Block 11>

[0187] Figure 5 1 is a front view of the loading block 11. The loading block 11 includes carrier placement sections 12A1, 12A2, 12B1, and 12B2. Each of the carrier placement sections 12A1, 12A2, 12B1, and 12B2 places one carrier C. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

[0188] The carrier loading sections 12A1 and 12A2 are arranged in a manner arranged in the up-down direction Z. The carrier loading section 12A1 is arranged above the carrier loading section 12A2. The carrier loading sections 12B1 and 12B2 are arranged in a manner arranged in the up-down direction Z. The carrier loading section 12B1 is arranged above the carrier loading section 12B2. The carrier loading sections 12A1 and 12B1 are arranged in a manner arranged in the width direction Y. The carrier loading section 12A1 is arranged to the right of the carrier loading section 12B1. The carrier loading section 12A1 is arranged at a height position substantially the same as that of the carrier loading section 12B1. The carrier loading sections 12A2 and 12B2 are arranged in a manner arranged in the width direction Y. The carrier loading section 12A2 is arranged to the right of the carrier loading section 12B2. The carrier placement section 12A2 is arranged at substantially the same height position as that of the carrier placement section 12B2.

[0189] Hereinafter, when the carrier placement sections 12A1 and 12A2 are not distinguished, they are described as “carrier placement section 12A”. When the carrier placement sections 12B1 and 12B2 are not distinguished, they are described as “carrier placement section 12B”.

[0190] Reference Figure 4 , 6 -9. Figure 6 It is a left side view showing the left structure of the substrate processing apparatus 10. Figure 7 1. It is a left side view showing the configuration of the central portion of the substrate processing apparatus 10 in the width direction Y. FIG. Figure 8 It is a right side view showing the right structure of the substrate processing apparatus 10. Fig. 9 It is a front view showing the internal structure of the loading block 11.

[0191] The loading block 11 includes a transfer space 13. The transfer space 13 is disposed behind the carrier placement sections 12A and 12B.

[0192] The loading block 11 includes a transfer mechanism 14. The transfer mechanism 14 is provided in the transfer space 13. The transfer mechanism 14 transfers the substrate W.

[0193] The transport mechanism 14 includes a transport mechanism 15 and a transport mechanism 16. The transport mechanisms 15 and 16 transport the substrate W, respectively.

[0194] The conveying mechanisms 15 and 16 are arranged in a manner aligned in the width direction Y. The conveying mechanism 15 is arranged to the right of the conveying mechanism 16. The conveying mechanism 15 is arranged at a height position substantially the same as that of the conveying mechanism 16. The conveying mechanism 15 is arranged behind the carrier loading section 12A. The conveying mechanism 15 can enter and exit the carrier loading section 12A. The conveying mechanism 16 is arranged behind the carrier loading section 12B. The conveying mechanism 16 can enter and exit the carrier loading section 12B.

[0195] Reference Figure 4 , 6 , 8, 9. The conveying mechanism 15 includes a support 17a, a lifting part 17b, a rotating part 17c, and holding parts 17d and 17e. The support 17a extends in the vertical direction Z. The support 17a is fixedly arranged. In other words, the support 17a cannot move. The lifting part 17b is supported on the support 17a. The lifting part 17b can move in the vertical direction Z relative to the support 17a. The lifting part 17b cannot move in the horizontal direction. The rotating part 17c is supported on the lifting part 17b. The rotating part 17c can rotate around the rotation axis A15 relative to the lifting part 17b. The rotation axis A15 is parallel to the vertical direction Z. The rotating part 17c cannot move in the horizontal direction. The rotation axis A15 cannot move in the horizontal direction. The holding parts 17d and 17e are supported on the rotating part 17c. The holding parts 17d and 17e can move forward and backward in the horizontal direction relative to the rotating part 17c. The holding parts 17d and 17e can move forward and backward independently of each other. The holding portions 17d and 17e are respectively in contact with the substrate W. The holding portions 17d and 17e each hold one substrate W in a horizontal posture.

[0196] The conveying mechanism 16 has a substantially similar structure to the conveying mechanism 15. That is, the conveying mechanism 16 includes a support column 17a, a lifting unit 17b, a rotating unit 17c, and holding units 17d and 17e. The rotating unit 17c of the conveying mechanism 16 can rotate around a rotation axis A16. The rotation axis A16 is parallel to the vertical direction Z.

[0197] As described above, in this specification, when different elements have the same structure, the structure is denoted by a common reference numeral and detailed description thereof is omitted.

[0198] Figure 4 The area B15 in which the transfer mechanism 15 can transfer the substrate W is shown. The area B15 is substantially circular in a plan view. The rotation axis A15 corresponds to the center of the area B15 in a plan view.

[0199] Figure 4 1 shows a region B16 in which the transfer mechanism 16 can transfer the substrate W. The region B16 is substantially circular in a plan view. The rotation axis A16 corresponds to the center of the region B16 in a plan view.

[0200] <1st transport block 41>

[0201] Reference Figure 4 , 6 -8 and Fig.10 . Fig.10 It is a front view of the first transfer block 41.

[0202] The first transfer block 41 is connected to the first heat treatment block 21 and the second heat treatment block 51. The first transfer block 41 has a substantially box shape. The first transfer block 41 is substantially rectangular in plan view, side view, and front view.

[0203] The first transport block 41 includes a frame 42. The frame 42 is provided as a skeleton of the first transport block 41. The frame 42 defines the shape of the first transport block 41. The frame 42 is made of metal, for example.

[0204] The first transfer block 41 includes a transfer space 43 . The transfer space 43 is not connected to the transfer space 13 of the loading block 11 . The transfer space 43 and the transfer space 13 are separated by the first heat treatment block 21 .

[0205] The first transfer block 41 includes transfer mechanisms 45 and 46. The transfer mechanisms 45 and 46 transfer the substrate W, respectively. The transfer mechanisms 45 and 46 are arranged so as to be aligned in the width direction Y. The transfer mechanism 45 is arranged to the right of the transfer mechanism 46. The transfer mechanism 45 is arranged at substantially the same height as the transfer mechanism 46.

[0206] The conveying mechanisms 45 and 46 have substantially the same structure as the conveying mechanism 14 (specifically, the conveying mechanisms 15 and 16). The support pillars 17a of the conveying mechanisms 45 and 46 are respectively fixed to the frame 42. The rotating parts 17c of the conveying mechanisms 45 and 46 can rotate around the rotation axes A45 and A46, respectively. The rotation axes A45 and A46 are respectively parallel to the up-down direction Z.

[0207] Figure 4 1 shows a region B45 in which the transfer mechanism 45 can transfer the substrate W. The region B45 is substantially circular in a plan view. The rotation axis A45 corresponds to the center of the region B45 in a plan view.

[0208] Figure 4 1 shows a region B46 in which the transport mechanism 46 can transport the substrate W. The region B46 is substantially circular in a plan view. The rotation axis A46 corresponds to the center of the region B46 in a plan view.

[0209] <Second transport block 61>

[0210] Reference Figure 4 , 6 -8 and Fig.11 . Fig.11 2 is a front view of the second transfer block 61. The second transfer block 61 is connected to the second heat treatment block 51 and the liquid treatment block 71. The second transfer block 61 has a substantially box shape. The second transfer block 61 is substantially rectangular in plan view, side view, and front view.

[0211] The second transfer block 61 includes a frame 62. The frame 62 is provided as a skeleton of the second transfer block 61. The frame 62 defines the shape of the second transfer block 61. The frame 62 is made of metal, for example.

[0212] The second transfer block 61 includes a transfer space 63 . The transfer space 63 is not connected to the transfer space 43 of the first transfer block 41 . The transfer space 63 and the transfer space 43 are separated by the second heat treatment block 51 .

[0213] The second transfer block 61 includes transfer mechanisms 65 and 66. The transfer mechanisms 65 and 66 transfer the substrate W, respectively. The transfer mechanisms 65 and 66 are arranged so as to be aligned in the width direction Y. The transfer mechanism 65 is arranged on the right side of the transfer mechanism 66. The transfer mechanism 65 is arranged at substantially the same height position as the transfer mechanism 66.

[0214] The conveying mechanisms 65 and 66 have substantially the same structure as the conveying mechanism 14. The support columns 17a of the conveying mechanisms 65 and 66 are fixed to the frame 62. The rotating parts 17c of the conveying mechanisms 65 and 66 are rotatable around the rotation axes A65 and A66. The rotation axes A65 and A66 are parallel to the vertical direction Z.

[0215] Figure 4 1 shows a region B65 in which the transport mechanism 65 can transport the substrate W. The region B65 is substantially circular in a plan view. The rotation axis A65 corresponds to the center of the region B65 in a plan view.

[0216] Figure 4 1 shows a region B66 in which the transport mechanism 66 can transport the substrate W. The region B66 is substantially circular in a plan view. The rotation axis A66 corresponds to the center of the region B66 in a plan view.

[0217] <Liquid Processing Block 71>

[0218] Reference Figure 4 and 6 -8. The liquid processing block 71 is connected to the second transfer block 61. The liquid processing block 71 has a substantially box shape. The liquid processing block 71 is substantially rectangular in plan view, side view, and front view.

[0219] Liquid processing block 71 has frame 72. Frame 72 is provided as a skeleton of liquid processing block 71. Frame 72 defines the shape of liquid processing block 71. Frame 72 is made of metal, for example.

[0220] The liquid processing block 71 includes a transfer space 73. The transfer space 73 is disposed in the center of the liquid processing block 71 in the width direction Y in a plan view. The transfer space 73 is connected to the transfer space 63 of the second transfer block 61. The transfer space 73 extends in the front-rear direction X.

[0221] The transfer space 73 includes a transfer space 73T and a transfer space 73B. The transfer space 73T and the transfer space 73B are arranged so as to be aligned in the up-down direction Z. The transfer space 73T is arranged above the transfer space 73B.

[0222] Reference Figure 7 The liquid processing block 71 includes a partition wall 78. The partition wall 78 has a horizontal plate shape. The partition wall 78 is disposed at the boundary between the transfer space 73T and the transfer space 73B. The partition wall 78 separates the transfer space 73T from the transfer space 73B.

[0223] The liquid processing block 71 includes a transfer mechanism 74. The transfer mechanism 74 is provided in the transfer space 73. The transfer mechanism 74 transfers the substrate W.

[0224] The transport mechanism 74 includes a transport mechanism 75 and a transport mechanism 76. The transport mechanisms 75 and 76 transport the substrate W, respectively.

[0225] The conveying mechanisms 75 and 76 are arranged in a row in the up-down direction Z. The conveying mechanism 75 is arranged above the conveying mechanism 76. The conveying mechanism 75 is arranged in the conveying space 73T. The conveying mechanism 75 is arranged above the partition wall 78. The conveying mechanism 76 is arranged in the conveying space 73B. The conveying mechanism 76 is arranged below the partition wall 78. The conveying mechanism 76 is separated from the conveying mechanism 75 by the partition wall 78.

[0226] The conveying mechanism 75 includes pillars 77a, 77b, a lifting part 77c, a horizontal moving part 77d, a rotating part 77e, and holding parts 77f, 77g. The pillars 77a, 77b extend in the vertical direction Z. The pillars 77a, 77b are arranged in a manner arranged in the front-rear direction X. The pillar 77a is arranged in the left front part of the conveying space 73T. The pillar 77b is arranged in the left rear part of the conveying space 73T. The pillars 77a, 77b are fixedly provided. The pillars 77a, 77b are fixed to the frame 72. The pillars 77a, 77b cannot move. The lifting part 77c extends in the front-rear direction X. The lifting part 77c is supported by the pillars 77a, 77b. The lifting part 77c can move in the vertical direction Z relative to the pillars 77a, 77b. The horizontal moving part 77d is supported by the lifting part 77c. The horizontal moving part 77d can move in the horizontal direction (specifically, the front-to-back direction X) relative to the lifting part 77c. The rotating part 77e is supported by the horizontal moving part 77d. The rotating part 77e can move in the horizontal direction (specifically, the front-to-back direction X) integrally with the horizontal moving part 77d. The rotating part 77e can rotate around the rotation axis A75 relative to the horizontal moving part 77d. The rotation axis A75 is parallel to the up-down direction Z. The holding parts 77f and 77g are supported by the rotating part 77e. The holding parts 77f and 77g can move forward and backward in the horizontal direction relative to the rotating part 77e. The holding parts 77f and 77g can move forward and backward independently of each other. The holding parts 77f and 77g are in contact with the substrate W respectively. The holding parts 77f and 77g each hold one substrate W in a horizontal posture.

[0227] The conveying mechanism 76 has a substantially similar structure to the conveying mechanism 75. That is, the conveying mechanism 76 includes pillars 77a, 77b, a lifting portion 77c, a horizontal moving portion 77d, a rotating portion 77e, and holding portions 77f, 77g. The rotating portion 77e of the conveying mechanism 76 can rotate around a rotation axis A76. The rotation axis A76 is parallel to the vertical direction Z.

[0228] Figure 4 The transport mechanism 75 shows regions B75 and B76 that can transport the substrate W. The regions B75 and B76 are respectively longer in the front-rear direction X than in the width direction Y. The region B76 is arranged at the same position as the region B75 in a plan view. The region B75 is arranged above the region B76.

[0229] Liquid processing block 71 includes processing section 81. Substrate W is placed on processing section 81. Processing section 81 further processes the placed substrate W. Processing section 81 is disposed on the side of transfer mechanism 74. Transfer mechanism 74 and processing section 81 are arranged in width direction Y.

[0230] Reference Figure 4 , 6, 8. The processing section 81 includes a processing section 82 and a processing section 83. The processing sections 82 and 83 are arranged in a manner arranged in the up-down direction Z. The processing section 82 is arranged above the processing section 83. The processing section 82 is arranged above the partition wall 78. The processing section 82 is arranged on the side of the conveying mechanism 75. The conveying mechanism 75 and the processing section 82 are arranged in the width direction Y. The processing section 83 is arranged below the partition wall 78. The processing section 83 is arranged on the side of the conveying mechanism 76. The conveying mechanism 76 and the processing section 83 are arranged in the width direction Y.

[0231] The processing section 82 includes a right processing section 82R and a left processing section 82L. The right processing section 82R, the conveying mechanism 75, and the left processing section 82L are arranged in the width direction Y. The conveying mechanism 75 is arranged between the right processing section 82R and the left processing section 82L. The right processing section 82R is arranged on the right side of the conveying mechanism 75. The left processing section 82L is arranged on the left side of the conveying mechanism 75.

[0232] The right processing section 82R includes a plurality of (for example, six) liquid processing units 84. The liquid processing units 84 belonging to the right processing section 82R are arranged in a matrix in the front-to-back direction X and the up-down direction Z. Three liquid processing units 84 are arranged in the upper section of the right processing section 82R. The three liquid processing units 84 arranged in the upper section of the right processing section 82R are arranged in a manner arranged in the front-to-back direction X. The three liquid processing units 84 arranged in the upper section of the right processing section 82R are accommodated in one chamber 87. The remaining three liquid processing units 84 are arranged in the lower section of the right processing section 82R. The three liquid processing units 84 arranged in the lower section of the right processing section 82R are arranged in a manner arranged in the front-to-back direction X. The three liquid processing units 84 arranged in the lower section of the right processing section 82R overlap with the three liquid processing units 84 arranged in the upper section of the right processing section 82R in a plan view. The three liquid processing units 84 arranged at the lower stage of the right processing section 82R are accommodated in another chamber 87 .

[0233] The left processing section 82L includes a plurality of (for example, six) liquid processing units 84. The liquid processing units 84 of the left processing section 82L are arranged in the same manner as the liquid processing units 84 of the right processing section 82R except that they are bilaterally symmetrical.

[0234] The processing section 83 includes a right processing section 83R and a left processing section 83L. The right processing section 83R, the conveying mechanism 76, and the left processing section 83L are arranged in the width direction Y. The conveying mechanism 76 is arranged between the right processing section 83R and the left processing section 83L. The right processing section 83R is arranged on the right side of the conveying mechanism 76. The left processing section 83L is arranged on the left side of the conveying mechanism 76.

[0235] The right processing section 83R includes a plurality of (for example, six) liquid processing units 85. The left processing section 83L includes a plurality of (for example, six) liquid processing units 85. The liquid processing units 85 of the right processing section 83R and the left processing section 83L are arranged in the same manner as the liquid processing units 84 of the right processing section 82R and the left processing section 82L.

[0236] The liquid processing unit 84 includes a rotating holding part 86a, a nozzle 86b and a cup 86c. The rotating holding part 86a holds a substrate W in a horizontal position. The rotating holding part 86a can rotate the held substrate W around an axis parallel to the up-down direction Z. The nozzle 86b sprays a processing liquid onto the substrate W. The processing liquid is, for example, a coating liquid. The nozzle 86b is arranged in a manner that can be moved to a processing position and a retreat position. The processing position is a position above the substrate W held by the rotating holding part 86a. The processing position is a position that overlaps with the substrate W held by the rotating holding part 86a when viewed from above. The retreat position is a position that does not overlap with the substrate W held by the rotating holding part 86a when viewed from above. The cup 86c is arranged around the rotating holding part 86a. The cup 86c recovers the processing liquid.

[0237] The liquid processing unit 85 has substantially the same structure and shape as the liquid processing unit 84 .

[0238] <Transportation mechanism configuration>

[0239] Reference Figure 4 The conveying mechanism 14, the conveying mechanism 45, the conveying mechanism 65, and the conveying mechanism 74 are arranged in the front-to-back direction X. The conveying mechanism 14, the conveying mechanism 46, the conveying mechanism 66, and the conveying mechanism 74 are arranged in the front-to-back direction X. Among the conveying mechanisms 14, 45, 46, 65, 66, and 74, the conveying mechanism 14 is arranged at the front. Among the conveying mechanisms 14, 45, 46, 65, 66, and 74, the conveying mechanism 74 is arranged at the rear.

[0240] Areas B15 and B45 partially overlap. Areas B45 and B65 partially overlap. Areas B65 and B75 partially overlap.

[0241] Similarly, regions B16 and B46 partially overlap, regions B46 and B66 partially overlap, and regions B66 and B76 partially overlap.

[0242] Furthermore, regions B15 and B16 partially overlap. Regions B45 and B46 partially overlap. Regions B15, B16, B45, and B46 partially overlap. Regions B65 and B66 partially overlap. Regions B65 and B76 partially overlap. Regions B66 and B75 partially overlap.

[0243] Regions B75 and B76 do not overlap because region B75 is located above region B76.

[0244] The carrier placement section 12A and the carrier C placed on the carrier placement section 12A are arranged in the area B15. The carrier placement section 12A and the carrier C placed on the carrier placement section 12A are arranged outside the areas B16, B45, B46, B65, B66, B75, and B76.

[0245] The carrier placement section 12B and the carrier C placed on the carrier placement section 12B are arranged in the area B16. The carrier placement section 12B and the carrier C placed on the carrier placement section 12B are arranged outside the areas B15, B45, B46, B65, B66, B75, and B76.

[0246] The processing section 81 is arranged in a region where the transport mechanism 74 can transport the substrate W. The processing section 81 is arranged outside the regions B15, B16, B45, B46, B65, and B66.

[0247] In particular, the processing unit 82 is arranged in the area B75. The processing unit 82 is arranged outside the area B76.

[0248] The processing unit 83 is arranged in the area B76. The processing unit 83 is arranged outside the area B75.

[0249] <1st heat treatment block>

[0250] Reference Figure 4 , 6 -8, 12. Fig.12 4 is a front view of the first heat treatment block 21. The first heat treatment block 21 is connected to the loading block 11 and the first transfer block 41. The first heat treatment block 21 has a substantially box shape. The first heat treatment block 21 is substantially rectangular in plan view, side view and front view.

[0251] The first heat treatment block 21 has a frame 22. The frame 22 is provided as a skeleton of the first heat treatment block 21. The frame 22 defines the shape of the first heat treatment block 21. The frame 22 is made of metal, for example.

[0252] The first heat treatment block 21 includes intermediate portions 23 and 24. The substrate W is placed on the intermediate portions 23 and 24. The intermediate portions 23 and 24 are arranged in the width direction Y. The intermediate portion 23 is arranged to the right of the intermediate portion 24. The intermediate portions 23 and 24 partially overlap. The portion where the intermediate portions 23 and 24 overlap is referred to as a common portion.

[0253] The intermediate portion 23 is arranged between the conveying mechanism 15 and the conveying mechanism 45 which are adjacent to each other in the front-rear direction X. Specifically, the intermediate portion 23 is arranged behind the conveying mechanism 15 and in front of the conveying mechanism 45. The intermediate portion 24 is arranged between the conveying mechanism 16 and the conveying mechanism 46 which are adjacent to each other in the front-rear direction X. Specifically, the intermediate portion 24 is arranged behind the conveying mechanism 16 and in front of the conveying mechanism 46. In particular, the common portion of the intermediate portions 23 and 24 is arranged between the conveying mechanisms 14 (15, 16), 45, and 46.

[0254] The intermediate sections 23 and 24 further process the substrates W placed on the intermediate sections 23 and 24, respectively. The intermediate sections 23 and 24 further inspect the substrates W placed on the intermediate sections 23 and 24, respectively.

[0255] The middle section 23 includes a plurality of heat treatment units 25 and a plurality of placement units 26. The middle section 24 includes a plurality of heat treatment units 28 and a plurality of placement units 29. Furthermore, the middle sections 23 and 24 include the same inspection unit 27. In other words, the middle sections 23 and 24 share the inspection unit 27. The inspection unit 27 is disposed in a common portion of the middle sections 23 and 24. The inspection unit 27 belongs not only to the middle section 23 but also to the middle section 24.

[0256] The inspection unit 27 is arranged on the left side of the heat treatment unit 25 and the placement unit 26 in a plan view. The inspection unit 27 is arranged on the right side of the heat treatment unit 28 and the placement unit 29 in a plan view.

[0257] The heat treatment unit 25 and the placement unit 26 are respectively arranged behind the conveying mechanism 15 and in front of the conveying mechanism 45. The heat treatment unit 28 and the placement unit 29 are respectively arranged behind the conveying mechanism 16 and in front of the conveying mechanism 46.

[0258] The inspection unit 27 is arranged behind the conveying mechanism 14 and in front of the conveying mechanisms 45 and 46. More specifically, the inspection unit 27 is arranged behind and to the left of the conveying mechanism 15. The inspection unit 27 is arranged behind and to the right of the conveying mechanism 16. The inspection unit 27 is arranged at a position substantially equidistant from the conveying mechanisms 15 and 16. The inspection unit 27 is arranged in front of and to the left of the conveying mechanism 45. The inspection unit 27 is arranged in front of and to the right of the conveying mechanism 46. The inspection unit 27 is arranged at a position substantially equidistant from the conveying mechanisms 45 and 46.

[0259] The heat treatment units 25, 28, the placement units 26, 29, and the inspection unit 27 are respectively arranged at substantially the same height positions as the transport mechanisms 14, 45, 46. That is, the heat treatment units 25, 28, the placement units 26, 29, and the inspection unit 27 are arranged at height positions at which the transport mechanisms 14, 45, 46 can transport the substrate W. More specifically, the height positions of the heat treatment units 25, 28, the placement units 26, 29, and the inspection unit 27 are within the range of the height positions at which the holding portions 17d, 17e of the transport mechanisms 14, 45, 46 can move.

[0260] Reference Fig.12 The heat treatment units 25 are arranged in a row in the vertical direction Z. The mounting units 26 are arranged in a row in the vertical direction Z. The mounting units 26 are arranged in a row in the vertical direction Z. The mounting units 26 are arranged at a position overlapping with the heat treatment units 25 in a plan view. In other words, the heat treatment units 25 and the mounting units 26 are arranged in the vertical direction Z. The heat treatment units 25 and the mounting units 26 are arranged alternately one by one in the vertical direction Z.

[0261] The first heat treatment block 21 includes a plurality of racks 30. The racks 30 have a substantially horizontal plate shape. The racks 30 are supported by the frame 22. The racks 30 are arranged in an array in the up-down direction Z. The heat treatment units 25 and the loading units 26 are supported by the racks 30. The heat treatment units 25 and the loading units 26 are arranged between two racks 30 adjacent to each other in the up-down direction Z. In more detail, the heat treatment units 25 and the loading units 26 are arranged one by one between two racks 30 adjacent to each other in the up-down direction Z. The number of heat treatment units 25 arranged between two racks 30 adjacent to each other in the up-down direction Z is 1. The number of loading units 26 arranged between two racks 30 adjacent to each other in the up-down direction Z is 1.

[0262] The heat treatment unit 28 and the placement unit 29 are arranged similarly to the heat treatment unit 25 and the placement unit 26 except that they are bilaterally symmetrical.

[0263] Fig.13 It is a front view of the heat treatment unit 25 and the mounting unit 26. Fig.14A It is a top view of the lower part of the heat treatment unit 25. Fig. 14B It is a plan view of the upper portion of the heat treatment unit 25 and the mounting unit 26 . Fig.15 It is a side view of the heat treatment unit 25, the placement unit 26, the conveyance mechanism 15, and the conveyance mechanism 45. The heat treatment unit 25 will be described in detail.

[0264] One substrate W is placed in one heat treatment unit 25. The heat treatment unit 25 further performs heat treatment on the placed substrate W. The heat treatment performed by the heat treatment unit 25 is, for example, a hydrophobic treatment. The hydrophobic treatment is a treatment in which a treatment gas containing hexamethyldisilazane (HMDS) is supplied to the substrate W while adjusting the substrate W to a specific temperature. The hydrophobic treatment is performed to improve the adhesion between the substrate W and the coating film.

[0265] The heat treatment unit 25 includes a first plate 31a. The first plate 31a is provided on the shelf 30. The first plate 31a has a substantially disk shape. The first plate 31a has a substantially horizontal upper surface. A substrate W is placed on the upper surface of the first plate 31a.

[0266] The heat treatment unit 25 includes a second plate 31b. The second plate 31b is provided on the shelf 30. The second plate 31b has a substantially disk shape. The second plate 31b has a substantially horizontal upper surface. A substrate W is placed on the upper surface of the second plate 31b.

[0267] The second flat plate 31b is provided on the side of the first flat plate 31a. The second flat plate 31b is arranged on the right side of the first flat plate 31a. The first flat plate 31a and the second flat plate 31b are arranged in the width direction Y. The second flat plate 31b is arranged at substantially the same height as the first flat plate 31a.

[0268] The heat treatment unit 25 includes a local transfer mechanism 31c. The local transfer mechanism 31c transfers the substrate W between the first plate 31a and the second plate 31b.

[0269] The local transport mechanism 31c includes a holding portion 31d and a driving portion 31e. The holding portion 31d is in contact with the substrate W. The holding portion 31d holds one substrate W in a horizontal position. The driving portion 31e is connected to the holding portion 31d. The driving portion 31e moves the holding portion 31d in the width direction Y. The holding portion 31d can move to a first position and a second position. The first position is a position above the first flat plate 31a. When the holding portion 31d is in the first position, the holding portion 31d can place the substrate W on the first flat plate 31a, and can take the substrate W on the first flat plate 31a. Fig.14A : shows the holding part 31d in the first position. The second position is a position above the second flat plate 31b. When the holding part 31d is in the second position, the holding part 31d can place the substrate W on the second flat plate 31b and can take the substrate W on the second flat plate 31b.

[0270] The heat treatment unit 25 includes a first temperature control unit and a second temperature control unit (not shown). The first temperature control unit is mounted on the first flat plate 31a. The first temperature control unit adjusts the first flat plate 31a to a first temperature. The first flat plate 31a adjusts the substrate W to a first temperature. The second temperature control unit is mounted on the second flat plate 31b. The second temperature control unit adjusts the second flat plate 31b to a second temperature. The second flat plate 31b adjusts the substrate W to a second temperature. The second temperature is, for example, higher than the first temperature. The first flat plate 31a cools the substrate W, for example. The second flat plate 31b heats the substrate W.

[0271] Here, the first plate 31a may directly or indirectly adjust the temperature of the substrate W. For example, the first plate 31a may directly adjust the temperature of the substrate W on the first plate 31a. Alternatively, the first plate 31a may indirectly adjust the temperature of the substrate W via the holding portion 31d. Specifically, the first plate 31a may adjust the temperature of the holding portion 31d located on the first plate 31a, and the holding portion 31d may adjust the temperature of the substrate W held by the holding portion 31d.

[0272] The heat treatment unit 25 includes a cover 31f. The cover 31f is disposed above the second flat plate 31b. The cover 31f is provided so as to be movable in the up-down direction Z. The cover 31f moves to a retreat position and a treatment position. Fig.13 The cover portion 31f located at the retracted position is indicated by a solid line. Fig.13 The cover 31f at the processing position is indicated by a dotted line. The retreat position is located above the processing position. When the cover 31f is in the retreat position, the local conveying mechanism 31c can move in and out of the second flat plate 31b. Specifically, when the cover 31f is in the retreat position, the holding portion 31d can be moved to the second position. When the holding portion 31d is in a position away from the second position, the cover 31f can be moved to the processing position. When the cover 31f is in the processing position, the cover 31f covers the upper surface of the second flat plate 31b. When the cover 31f is in the processing position, the processing space below the cover 31f and above the second flat plate 31b is substantially closed.

[0273] The heat treatment unit 25 includes a gas supply unit (not shown) for supplying a process gas to the substrate W. The gas supply unit is attached to, for example, the cover 31f. The gas supply unit supplies the process gas to a process space below the cover 31f and above the second plate 31b.

[0274] The heat treatment unit 25 operates as follows. When the substrate W is placed on the first flat plate 31a, the holding part 31d moves to the first position to obtain the substrate W on the first flat plate 31a. The cover part 31f is located at the retreat position. The holding part 31d moves to the second position to place the substrate W on the second flat plate 31b. The holding part 31d returns to the first position. The cover part 31f moves from the retreat position to the processing position. The processing space below the cover part 31f and above the second flat plate 31b is substantially closed. The second flat plate 31b adjusts the substrate W to the second temperature. The gas supply part supplies the processing gas to the processing space. When a specific time has passed, the gas supply part stops the supply of the processing gas. The cover part 31f moves from the processing position to the retreat position. The local transport mechanism 31c transports the substrate W from the second flat plate 31b to the first flat plate 31a. The first flat plate 31a adjusts the substrate W to the first temperature. Thus, the heat treatment (for example, hydrophobic treatment) of the substrate W is completed.

[0275] The mounting unit 26 will be described in detail. One substrate W is mounted on one mounting unit 26. The mounting unit 26 does not process the substrate W. The substrate W is only mounted on the mounting unit 26.

[0276] The loading unit 26 includes a loading plate 32 for loading the substrate W. The loading plate 32 is supported by the frame 30. The loading plate 32 has a substantially disk shape. The loading plate 32 has a substantially horizontal upper surface. One substrate W is loaded on the upper surface of the loading plate 32. In addition, for the uppermost loading plate 32, a frame portion not shown in the figure may be provided above the uppermost loading plate 32, and the uppermost loading plate 32 may be supported by the frame portion. Alternatively, the uppermost loading plate 32 may be supported by the frame 22.

[0277] The loading plate 32 is arranged above the first flat plate 31a. The loading plate 32 is arranged at a position overlapping with the first flat plate 31a in a plan view. The loading plate 32 is arranged on the side of the cover 31f. The loading plate 32 is arranged on the left side of the cover 31f. The loading plate 32 and the cover 31f are arranged in the width direction Y. The loading plate 32 is arranged at a height position substantially the same as the cover 31f. The loading plate 32 is arranged at a height position substantially the same as the cover 31f in the retracted position.

[0278] Reference Fig.15 The first flat plate 31 a and the placement plate 32 are open to the front. The first flat plate 31 a and the placement plate 32 are open to the transfer space 13 of the loading block 11 .

[0279] The first flat plate 31a and the placement plate 32 are arranged in the area B15. Thus, the conveying mechanism 15 can enter and exit the heat treatment unit 25 and the placement unit 26. Therefore, it can be said that the heat treatment unit 25 and the placement unit 26 are arranged in the area B15.

[0280] The first plate 31a and the placement plate 32 are open to the rear. The first plate 31a and the placement plate 32 are open to the transfer space 43 of the first transfer block 41. The first plate 31a and the placement plate 32 are arranged in the area B45. Thus, the heat treatment unit 25 and the placement unit 26 are arranged in the area B45.

[0281] Therefore, the heat treatment unit 25 and the placement unit 26 are arranged in a region where the regions B15 and B45 overlap.

[0282] The heat treatment unit 28 and the mounting unit 29 have substantially the same structure and shape as the heat treatment unit 25 and the mounting unit 26 except that they are bilaterally symmetrical. The heat treatment unit 28 and the mounting unit 29 are arranged in the same manner as the heat treatment unit 25 and the mounting unit 26 except that they are bilaterally symmetrical. The heat treatment unit 28 and the mounting unit 29 are arranged in the region where the regions B16 and B46 overlap.

[0283] Fig.16 It is a top view of the inspection unit 27 . Fig.17 It is a side view of the inspection unit 27, the conveying mechanism 14, and the conveying mechanisms 45 and 46. The inspection unit 27 will be described in detail.

[0284] One substrate W is placed on one inspection unit 27. The inspection unit 27 inspects the placed substrate W. For example, the inspection unit 27 inspects the surface of the substrate W.

[0285] The inspection unit 27 includes a housing 33a. The housing 33a is supported by the frame 22. The housing 33a is substantially box-shaped. The housing 33a includes openings 33b and 33c for passing the substrate W. The opening 33b is formed on the front surface of the housing 33a. The opening 33c is formed on the back surface of the housing 33a.

[0286] The inspection unit 27 includes a mounting plate 33d. The mounting plate 33d is provided in the housing 33a. The mounting plate 33d is supported by the housing 33a. The mounting plate 33d has a substantially disk shape. The mounting plate 33d has a substantially horizontal upper surface. One substrate W is mounted on the upper surface of the mounting plate 33d.

[0287] The inspection unit 27 includes a driving unit 33e. The driving unit 33e is provided in the housing 33a. The driving unit 33e is supported by the housing 33a. The driving unit 33e is connected to the mounting plate 33d. The driving unit 33e moves the mounting plate 33d in the front-rear direction X. The mounting plate 33d moves across the front position and the rear position. Fig.16 , 17 The placement plate 33d in the front position is indicated by a solid line. Fig.16 , 17The placement plate 33d in the rear position is indicated by a dotted line. The front position is located in front of the rear position. The front position and the rear position are positions in the housing 33a.

[0288] The inspection unit 27 includes an imaging unit 33f. The imaging unit 33f is provided in the housing 33a. The imaging unit 33f is supported by the housing 33a. The imaging unit 33f is disposed, for example, above the mounting plate 33d. The imaging unit 33f images the surface of the substrate W mounted on the mounting plate 33d. When the imaging unit 33f images the substrate W, the driving unit 33e may also move the mounting plate 33d.

[0289] The placing plate 33d is open to the front through the opening 33b. The placing plate 33d is open to the transfer space 13 of the loading block 11 through the opening 33b.

[0290] The placement plate 33d in the front position is arranged in the area B15. Thus, the inspection unit 27 is arranged in the area B15. Furthermore, the placement plate 33d in the front position is arranged in the area B16. Thus, the inspection unit 27 is arranged in the area B16.

[0291] The placing plate 33d is open to the rear through the opening 33c. The placing plate 33d is open to the transfer space 43 of the first transfer block 41 through the opening 33c.

[0292] The placement plate 33d in the rear position is arranged in the area of ​​the region B45. Thus, the inspection unit 27 is arranged in the region B45. Furthermore, the placement plate 33d in the rear position is arranged in the region B46. Thus, the inspection unit 27 is arranged in the region B46.

[0293] In short, the intermediate section 23 (ie, the heat treatment unit 25 , the placement unit 26 , and the inspection unit 27 ) is disposed in the overlapping region of the regions B15 and B45 .

[0294] The intermediate section 24 (ie, the inspection unit 27 , the heat treatment unit 28 , and the placement unit 29 ) is disposed in the region where the regions B16 and B46 overlap.

[0295] In particular, the common portion of the intermediate portions 23 and 24 (i.e., the inspection unit 27) is arranged in the overlapping region of the regions B15, B16, B45, and B46. The heat treatment unit 25 and the placement unit 26 are arranged outside the regions B16 and B46. The heat treatment unit 28 and the placement unit 29 are arranged outside the regions B15 and B45.

[0296] In addition, the intermediate portions 23 and 24 are arranged outside the areas B65, B66, B75, and B76.

[0297] Reference Fig.12 , 13 The heat treatment unit 25 and the placement unit 26 are arranged at positions overlapping with the rotation axis A15 of the conveying mechanism 15 in front view. More specifically, the first plate 31a of the heat treatment unit 25 and the placement plate 32 of the placement unit 26 are arranged at positions overlapping with the rotation axis A15 of the conveying mechanism 15 in front view.

[0298] The heat treatment unit 25 and the placement unit 26 are arranged at positions overlapping the rotation axis A45 of the conveying mechanism 45 in front view. More specifically, the first plate 31a of the heat treatment unit 25 and the placement plate 32 of the placement unit 26 are arranged at positions overlapping the rotation axis A45 of the conveying mechanism 45 in front view.

[0299] The rotation axis A45 of the conveying mechanism 45 is arranged at a position overlapping with the rotation axis A15 of the conveying mechanism 15 in a front view.

[0300] Similarly, the heat treatment unit 28 and the placement unit 29 are arranged at a position overlapping with the rotation axis A16 of the conveying mechanism 16 when viewed from the front. The heat treatment unit 28 and the placement unit 29 are arranged at a position overlapping with the rotation axis A46 of the conveying mechanism 46 when viewed from the front. The rotation axis A46 of the conveying mechanism 46 is arranged at a position overlapping with the rotation axis A16 of the conveying mechanism 16 when viewed from the front.

[0301] Inspection unit 27 is disposed to the left of rotation axis A15 of conveying mechanism 15 and to the right of rotation axis 16A of conveying mechanism 16 in front view. Inspection unit 27 is disposed to the left of rotation axis A45 of conveying mechanism 45 and to the right of rotation axis 46A of conveying mechanism 46 in front view.

[0302] Although not shown in the figure, the heat treatment unit 25 and the placement unit 26 are arranged at a position overlapping with the conveying mechanism 15 in a front view. The heat treatment unit 25 and the placement unit 26 are arranged at a position overlapping with the conveying mechanism 45 in a front view. The heat treatment unit 28 and the placement unit 29 are arranged at a position overlapping with the conveying mechanism 16 in a front view. The heat treatment unit 28 and the placement unit 29 are arranged at a position overlapping with the conveying mechanism 46 in a front view.

[0303] <Second heat treatment block>

[0304] Reference Figure 4 , 6 -8, 18. Fig.184 is a front view of the second heat treatment block 51. The second heat treatment block 51 is connected to the first transfer block 41 and the second transfer block 61. The second heat treatment block 51 has a substantially box shape. The second heat treatment block 51 is substantially rectangular in plan view, side view and front view.

[0305] The second heat treatment block 51 has a frame 52. The frame 52 is provided as a skeleton of the second heat treatment block 51. The frame 52 defines the shape of the second heat treatment block 51. The frame 52 is made of metal, for example.

[0306] The second heat treatment block 51 includes an intermediate portion 53 and an intermediate portion 54 . The substrate W is placed on the intermediate portions 53 and 54 . The intermediate portions 53 and 54 are arranged so as to be aligned in the width direction Y. The intermediate portion 53 is arranged on the right side of the intermediate portion 54 .

[0307] The intermediate portion 53 is disposed between the conveying mechanism 45 and the conveying mechanism 65 which are adjacent to each other in the front-rear direction X. The intermediate portion 54 is disposed between the conveying mechanism 46 and the conveying mechanism 66 which are adjacent to each other in the front-rear direction X.

[0308] The intermediate portions 53 and 54 further process the substrate W placed on the intermediate portions 53 and 54 , respectively.

[0309] The intermediate portion 5 includes a plurality of heat treatment units 55 and a plurality of placement units 56. The intermediate portion 54 includes a plurality of heat treatment units 58 and a plurality of placement units 59. The heat treatment units 55 and the placement units 56 are arranged to the right of the heat treatment units 58 and the placement units 59 in a plan view.

[0310] The heat treatment unit 55 and the placement unit 56 are respectively arranged behind the conveying mechanism 45 and in front of the conveying mechanism 65. The heat treatment unit 58 and the placement unit 59 are respectively arranged behind the conveying mechanism 46 and in front of the conveying mechanism 66.

[0311] The heat treatment units 55, 58 and the placement units 56, 59 are respectively arranged at substantially the same height as the transfer mechanisms 45, 46, 65, 66. That is, the heat treatment units 55, 58 and the placement units 56, 59 are arranged at a height at which the transfer mechanisms 45, 46, 65, 66 can transfer the substrate W.

[0312] The heat treatment units 55 are arranged in a row in the vertical direction Z. The mounting units 56 are arranged in a row in the vertical direction Z. The mounting units 56 are arranged in a row in the vertical direction Z. The mounting units 56 are arranged at a position overlapping with the heat treatment units 55 in a plan view. In other words, the heat treatment units 55 and the mounting units 56 are arranged in a row in the vertical direction Z. The heat treatment units 55 and the mounting units 56 are arranged alternately one by one. The heat treatment units 58 and the mounting units 59 are arranged in the same manner as the heat treatment units 55 and the mounting units 56 except that they are bilaterally symmetrical.

[0313] The heat treatment units 55 and 58 and the placement units 56 and 59 are installed using the shelf unit 30 similarly to the heat treatment units 25 and 28 and the placement units 26 and 29 .

[0314] One substrate W is placed on one heat treatment unit 55. The heat treatment unit 55 further performs heat treatment on the placed substrate W. The heat treatment performed by the heat treatment unit 55 is, for example, heating treatment. The heat treatment unit 55 has substantially the same structure and shape as the heat treatment unit 25. However, the heat treatment unit 55 may not include a gas supply unit (not shown) of the heat treatment unit 25.

[0315] One substrate W is placed on one placement unit 56 . The placement unit 56 does not process the substrate W. The substrate W is placed only on the placement unit 56 . The placement unit 56 has substantially the same structure and shape as the placement unit 26 .

[0316] The heat treatment unit 58 and the placement unit 59 have substantially the same structure and shape as the heat treatment unit 55 and the placement unit 56 except that they are bilaterally symmetrical.

[0317] Reference Figure 4 The heat treatment unit 55 and the loading unit 56 are arranged in the area where the areas B45 and B65 overlap. Therefore, the middle part 53 (that is, the heat treatment unit 55 and the loading unit 56) is arranged in the area where the areas B45 and B65 overlap. In other words, the middle part 53 is adjacent to the rear of the conveying mechanism 45 and adjacent to the front of the conveying mechanism 65. The middle part 53 is arranged outside the areas B46 and B66.

[0318] The heat treatment unit 58 and the placement unit 59 are arranged in the area where the areas B46 and B66 overlap. Therefore, the middle part 54 (that is, the heat treatment unit 58 and the placement unit 59) is arranged in the area where the areas B46 and B66 overlap. In other words, the middle part 54 is adjacent to the rear of the conveying mechanism 46 and adjacent to the front of the conveying mechanism 66. The middle part 54 is arranged outside the areas B45 and B65.

[0319] In addition, the intermediate portions 53 and 54 are arranged outside the areas B15, B16, B75, and B76.

[0320] Reference Fig.18 The heat treatment unit 55 and the placement unit 56 are arranged at a position overlapping with the rotation axis A45 of the conveying mechanism 45 when viewed from the front. The heat treatment unit 55 and the placement unit 56 are arranged at a position overlapping with the rotation axis A65 of the conveying mechanism 65 when viewed from the front. The rotation axis A45 of the conveying mechanism 45 is arranged at a position overlapping with the rotation axis A65 of the conveying mechanism 65 when viewed from the front.

[0321] The heat treatment unit 58 and the placement unit 59 are arranged at a position overlapping with the rotation axis A46 of the conveying mechanism 46 in a front view. The heat treatment unit 58 and the placement unit 59 are arranged at a position overlapping with the rotation axis A66 of the conveying mechanism 66 in a front view. The rotation axis A46 of the conveying mechanism 46 is arranged at a position overlapping with the rotation axis A66 of the conveying mechanism 66 in a front view.

[0322] Although not shown in the figure, the heat treatment unit 55 and the placement unit 56 are arranged at a position overlapping with the conveying mechanism 45 in a front view. The heat treatment unit 55 and the placement unit 56 are arranged at a position overlapping with the conveying mechanism 65 in a front view. The heat treatment unit 58 and the placement unit 59 are arranged at a position overlapping with the conveying mechanism 46 in a front view. The heat treatment unit 58 and the placement unit 59 are arranged at a position overlapping with the conveying mechanism 66 in a front view.

[0323] <Middle section 92>

[0324] Reference Figure 4 , 7 , 11. The substrate processing apparatus 1 includes an intermediate portion 92. The substrate W is arranged in the intermediate portion 92.

[0325] The middle portion 92 is arranged between the conveying mechanism 65 and the conveying mechanism 74 which are adjacent to each other in the front-rear direction X. The middle portion 92 is arranged between the conveying mechanism 66 and the conveying mechanism 74 which are adjacent to each other in the front-rear direction X. The middle portion 92 is arranged behind the conveying mechanisms 65 and 66 and in front of the conveying mechanism 74. More specifically, the middle portion 92 is arranged behind and to the left of the conveying mechanism 65. The middle portion 92 is arranged behind and to the right of the conveying mechanism 66. The middle portion 92 is arranged at a position which is substantially equidistant from the conveying mechanisms 65 and 66.

[0326] The intermediate portion 92 is disposed between the second transfer block 61 and the liquid processing block 71. The intermediate portion 92 is provided across the transfer space 63 of the second transfer block 61 and the transfer space 73 of the liquid processing block 71.

[0327] The intermediate portion 92 includes an intermediate portion 93 and an intermediate portion 94. The substrate W is placed on the intermediate portions 93 and 94. The intermediate portions 93 and 94 are arranged so as to be aligned in the up-down direction Z. The intermediate portion 93 is arranged above the intermediate portion 94. The intermediate portion 94 is arranged at a position overlapping the intermediate portion 93 in a plan view.

[0328] The intermediate portion 93 is provided across the transport space 63 of the second transport block 61 and the transport space 73T of the liquid processing block 71. The intermediate portion 93 is arranged in front of the transport mechanism 75. The intermediate portion 93 is arranged at substantially the same height position as the transport mechanism 75. The intermediate portion 93 is arranged at substantially the same height position as the transport mechanisms 65 and 66. That is, the intermediate portion 93 is arranged at a height position at which the transport mechanisms 65, 66 and 75 can transport the substrate W. More specifically, the height position of the intermediate portion 93 is within the range of the height position at which the holding portions 17d and 17e of the transport mechanisms 65 and 66 can move, and is within the range of the height position at which the holding portions 77f and 77g of the transport mechanism 75 can move.

[0329] The intermediate portion 94 is provided across the transport space 63 of the second transport block 61 and the transport space 73B of the liquid processing block 71. The intermediate portion 94 is arranged in front of the transport mechanism 76. The intermediate portion 94 is arranged at substantially the same height as the transport mechanism 76. The intermediate portion 94 is arranged at substantially the same height as the transport mechanisms 65 and 66. In other words, the intermediate portion 94 is arranged at a height at which the transport mechanisms 65, 66, and 76 can transport the substrate W.

[0330] The intermediate portions 93 and 94 further process the substrate W placed on the intermediate portions 93 and 94 , respectively.

[0331] The middle portion 93 includes a plurality of loading and cooling units 95 and a plurality of loading units 96. The loading and cooling units 95 are arranged in a row in the vertical direction Z. The loading units 96 are arranged in a row in the vertical direction Z. The loading units 96 are arranged at positions overlapping the loading and cooling units 95 in a plan view. The loading and cooling units 95 and the loading units 96 are arranged in a row in the vertical direction Z.

[0332] The middle portion 94 includes a plurality of loading and cooling units 98 and a plurality of loading units 99. The loading and cooling units 98 are arranged in a row in the vertical direction Z. The loading units 99 are arranged in a row in the vertical direction Z. The loading units 99 are arranged in a position overlapping the loading and cooling units 98 in a plan view. The loading and cooling units 98 and the loading units 99 are arranged in a row in the vertical direction Z. The loading and cooling units 98 and the loading units 99 overlap with the loading and cooling units 95 and the loading units 96 in a plan view.

[0333] Reference Fig.11 One substrate W is placed on one placement and cooling unit 95. The placement and cooling unit 95 further performs a heat treatment on the placed substrate W. The heat treatment performed by the placement and cooling unit 95 is, for example, a cooling treatment.

[0334] The placement and cooling unit 95 includes a placement plate 97 . The placement plate 97 has a substantially disk shape. The placement plate 97 has a substantially horizontal upper surface. One substrate W is placed on the upper surface of the placement plate 97 .

[0335] The mounting and cooling unit 95 further includes a temperature control unit (not shown). The temperature control unit is mounted on the mounting plate 97. The temperature control unit adjusts the mounting plate 97 to a specific temperature. The specific temperature is, for example, a temperature of the substrate W suitable for liquid processing in the processing unit 81. The mounting plate 97 cools the substrate W, for example.

[0336] One substrate W is placed on one placement unit 96 . The placement unit 96 does not process the substrate W. The substrate W is placed only on the placement unit 96 . The placement unit 96 has substantially the same structure and shape as the placement unit 26 .

[0337] The placement and cooling unit 98 and the placement unit 99 have substantially the same structure and shape as the placement and cooling unit 95 and the placement unit 96 .

[0338] Reference Figure 4 The loading and cooling unit 95 and the loading unit 96 are arranged in the overlapping area of ​​the areas B65 and B75. Therefore, the middle part 93 (that is, the loading and cooling unit 95 and the loading unit 96) is arranged in the overlapping area of ​​the areas B65 and B75. In other words, the middle part 93 is adjacent to the rear of the conveying mechanism 65 and adjacent to the front of the conveying mechanism 75. Furthermore, the middle part 93 is arranged in the overlapping area of ​​the areas B66 and B75. The middle part 93 is arranged outside the area B76.

[0339] The loading and cooling unit 98 and the loading unit 99 are arranged in the overlapping area of ​​the areas B66 and B76. Therefore, the middle part 94 (that is, the loading and cooling unit 98 and the loading unit 99) is arranged in the overlapping area of ​​the areas B66 and B76. In other words, the middle part 94 is adjacent to the rear of the conveying mechanism 66 and adjacent to the front of the conveying mechanism 76. Furthermore, the middle part 94 is arranged in the overlapping area of ​​the areas B65 and B76. The middle part 94 is arranged outside the area B75.

[0340] In addition, the intermediate portion 92 (93, 94) is arranged outside the regions B15, B16, B45, and B46.

[0341] <Cyclic operation of each transport mechanism>

[0342] Conveying mechanisms 14, 45, 46, 65, 66, 74 are as follows Figure 1 The control of the control unit 6 shown above repeatedly executes a loop operation.

[0343] The cyclic motion of the transport mechanism 15 is composed of only the first in-and-out motion and the second in-and-out motion. The first in-and-out motion of the transport mechanism 15 is the motion of moving in and out to the carrier C placed on the carrier placement portion 12A. The first in-and-out motion of the transport mechanism 15 includes the motion of moving the substrate W out of the carrier C placed on the carrier placement portion 12A and the motion of moving the substrate W into the carrier C placed on the carrier placement portion 12A. The second in-and-out motion of the transport mechanism 15 is the motion of moving in and out to the intermediate portion 23. The second in-and-out motion of the transport mechanism 15 includes the motion of placing the substrate W on the thermal treatment unit 25 and the motion of taking the substrate W from the placement unit 26 or the inspection unit 27.

[0344] The cyclic motion of the transport mechanism 16 is composed of only the first in-and-out motion and the second in-and-out motion. The first in-and-out motion of the transport mechanism 16 is the motion of moving in and out to the carrier C placed on the carrier placement portion 12B. The first in-and-out motion of the transport mechanism 16 includes the motion of moving the substrate W out of the carrier C placed on the carrier placement portion 12B, and the motion of moving the substrate W into the carrier C placed on the carrier placement portion 12B. The second in-and-out motion of the transport mechanism 16 is the motion of moving in and out to the intermediate portion 24. The second in-and-out motion of the transport mechanism 16 includes the motion of placing the substrate W on the heat treatment unit 28, and the motion of taking the substrate W from the placement unit 29 or the inspection unit 27.

[0345] The cyclic operation of the transport mechanism 45 is composed of only the first in-and-out operation and the second in-and-out operation. The first in-and-out operation of the transport mechanism 45 is an operation of moving in and out toward the intermediate portion 23. The first in-and-out operation of the transport mechanism 45 includes an operation of taking in a substrate W from the thermal treatment unit 25 and an operation of placing the substrate W on the placement unit 26 or the inspection unit 27. The second in-and-out operation of the transport mechanism 45 is an operation of moving in and out toward the intermediate portion 53. The second in-and-out operation of the transport mechanism 45 includes an operation of placing the substrate W on the placement unit 56 and an operation of taking out a substrate W from the thermal treatment unit 55.

[0346] The cyclic operation of the transport mechanism 46 is composed of only the first in-and-out operation and the second in-and-out operation. The first in-and-out operation of the transport mechanism 46 is an operation of moving in and out toward the intermediate portion 24. The first in-and-out operation of the transport mechanism 46 includes an operation of taking in a substrate W from the thermal treatment unit 28 and an operation of placing the substrate W on the placement unit 29 or the inspection unit 27. The second in-and-out operation of the transport mechanism 46 is an operation of moving in and out toward the intermediate portion 54. The second in-and-out operation of the transport mechanism 46 includes an operation of placing the substrate W on the placement unit 59 and an operation of taking in a substrate W from the thermal treatment unit 58.

[0347] The cyclic operation of the transport mechanism 65 is composed of only the first in-and-out operation and the second in-and-out operation. The first in-and-out operation of the transport mechanism 65 is an operation of moving in and out toward the intermediate portion 53. The first in-and-out operation of the transport mechanism 65 includes an operation of taking in a substrate W from the mounting unit 56 and an operation of placing the substrate W on the heat treatment unit 55. The second in-and-out operation of the transport mechanism 65 is an operation of moving in and out toward the intermediate portion 93. The second in-and-out operation of the transport mechanism 65 includes an operation of placing the substrate W on the mounting and cooling unit 95 and an operation of taking out the substrate W from the mounting unit 96.

[0348] The cyclic operation of the transport mechanism 66 is composed of only the first in-and-out operation and the second in-and-out operation. The first in-and-out operation of the transport mechanism 66 is an operation of moving in and out toward the intermediate portion 54. The first in-and-out operation of the transport mechanism 66 includes an operation of taking in a substrate W from the mounting unit 59 and an operation of placing the substrate W on the heat treatment unit 58. The second in-and-out operation of the transport mechanism 66 is an operation of moving in and out toward the intermediate portion 94. The second in-and-out operation of the transport mechanism 66 includes an operation of placing the substrate W on the mounting and cooling unit 98 and an operation of taking out a substrate W from the mounting unit 99.

[0349] The cyclic operation of the conveying mechanism 75 consists only of the first in-and-out operation and the second in-and-out operation.

[0350] The first in-and-out movement of the transport mechanism 75 is an in-and-out movement toward the intermediate portion 93. The first in-and-out movement of the transport mechanism 75 includes an movement of taking a substrate W from the placement and cooling unit 95 and an movement of placing the substrate W on the placement unit 96. The second in-and-out movement of the transport mechanism 75 is an in-and-out movement toward the processing portion 82. The second in-and-out movement of the transport mechanism 75 includes an movement of placing the substrate W on the liquid processing unit 84 and an movement of taking the substrate W from the liquid processing unit 84.

[0351] The cyclic operation of the transport mechanism 76 is composed of only the first in-and-out operation and the second in-and-out operation. The first in-and-out operation of the transport mechanism 76 is an operation of moving in and out toward the intermediate portion 94. The first in-and-out operation of the transport mechanism 76 includes an operation of taking a substrate W from the placement and cooling unit 98 and an operation of placing the substrate W on the placement unit 99. The second in-and-out operation of the transport mechanism 76 is an operation of moving in and out toward the processing portion 83. The second in-and-out operation of the transport mechanism 76 includes an operation of placing the substrate W on the liquid processing unit 85 and an operation of taking the substrate W from the liquid processing unit 85.

[0352] illustrate Figure 4 -18 The elements shown are Figure 13. The conveying mechanisms 15 and 65 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 45 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 23 and 53 correspond to the first and second intermediate parts 4 and 5. The heat treatment unit 25 corresponds to the first transfer unit 4S, and the placement unit 26 and the inspection unit 27 correspond to the first return unit 4R. The placement unit 56 corresponds to the second transfer unit 5S, and the heat treatment unit 55 corresponds to the second return unit 5R.

[0353] Similarly, the conveying mechanisms 16 and 66 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 46 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 24 and 54 correspond to the first and second intermediate parts 4 and 5. The heat treatment unit 28 corresponds to the first transfer unit 4S, and the inspection unit 27 and the placement unit 29 correspond to the first return unit 4R. The placement unit 59 corresponds to the second transfer unit 5R, and the heat treatment unit 58 corresponds to the second return unit 5R.

[0354] The conveying mechanisms 45 and 75 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 65 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 53 and 93 correspond to the first and second intermediate parts 4 and 5. The placing unit 56 corresponds to the first conveying unit 4S, and the heat treatment unit 55 corresponds to the first return unit 4R. The placing and cooling unit 95 corresponds to the second conveying unit 5S, and the placing unit 96 corresponds to the second return unit 5R.

[0355] Similarly, the conveying mechanisms 46 and 76 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 66 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 54 and 94 correspond to the first and second intermediate parts 4 and 5. The placement unit 59 corresponds to the first transfer unit 4S, and the heat treatment unit 58 corresponds to the first return unit 4R. The placement and cooling unit 98 corresponds to the second transfer unit 5S, and the placement unit 99 corresponds to the second return unit 5R.

[0356] The conveying mechanism 14 (15, 16) is an example of the front-end conveying mechanism in the present invention. The conveying mechanism 74 (75, 76) is an example of the rear-end conveying mechanism in the present invention. The conveying mechanisms 45, 46, 65, 66 are examples of the intermediate conveying mechanism in the present invention. The intermediate parts 23, 24 are examples of the front-end intermediate parts in the present invention. The intermediate part 92 (93, 94) is an example of the rear-end intermediate part in the present invention. The processing part 81 (82, 83) is an example of the rear-end processing part in the present invention.

[0357] <Operation Example of Substrate Processing Apparatus 10>

[0358] Fig.191 is a diagram schematically showing a transport path of the substrate W. The transport of the substrate W by the transport mechanisms 15, 45, 65, and 75 is similar to the transport of the substrate W by the transport mechanisms 16, 46, 66, and 76. Therefore, the transport of the substrate W by the transport mechanisms 15, 45, 65, and 75 will be described, and the description of the transport of the substrate W by the transport mechanisms 16, 46, 66, and 76 will be omitted.

[0359] The transport mechanism 15 transports the substrate W from the carrier C placed on the carrier placement portion 12A (a first in-and-out motion of the transport mechanism 15). The transport mechanism 15 places the substrate W on the thermal treatment unit 25 (specifically, the first plate 31a of the thermal treatment unit 25) (a second in-and-out motion of the transport mechanism 15). The thermal treatment unit 25 performs a hydrophobic treatment on the substrate W.

[0360] The transport mechanism 45 takes the substrate W from the heat treatment unit 25 (specifically, the first plate 31a of the heat treatment unit 25) (first in-and-out operation of the transport mechanism 45). The transport mechanism 45 places the substrate W on the placement unit 56 (second in-and-out operation of the transport mechanism 45).

[0361] The transport mechanism 65 takes the substrate W from the placement unit 56 (first moving-in and moving-out operation of the transport mechanism 65 ). The transport mechanism 65 places the substrate W on the placement and cooling unit 95 (second moving-in and moving-out operation of the transport mechanism 65 ). The placement and cooling unit 95 cools the substrate W.

[0362] The transport mechanism 75 obtains the substrate W from the placement and cooling unit 95 (the first in-and-out movement of the transport mechanism 75). The transport mechanism 75 places the substrate W on the liquid treatment unit 84 (the second in-and-out movement of the transport mechanism 75). The liquid treatment unit 84 performs liquid treatment on the substrate W. The transport mechanism 75 obtains the substrate W from the liquid treatment unit 84 (the second in-and-out movement of the transport mechanism 75). The transport mechanism 75 places the substrate W on the placement unit 96 (the first in-and-out movement of the transport mechanism 75).

[0363] The transport mechanism 65 takes the substrate W from the mounting unit 96 (second moving-in and moving-out operation of the transport mechanism 65 ). The transport mechanism 65 mounts the substrate W on the thermal treatment unit 55 (first moving-in and moving-out operation of the transport mechanism 65 ). The thermal treatment unit 55 performs thermal treatment on the substrate W.

[0364] The transport mechanism 45 takes in the substrate W from the thermal processing unit 55 (second carrying-in / out operation of the transport mechanism 45 ). The transport mechanism 45 transports the substrate W to either the mounting unit 26 or the inspection unit 27 (first carrying-in / out operation of the transport mechanism 45 ).

[0365] When the transport mechanism 45 transports the substrate W to the mounting unit 26, the transport mechanism 15 obtains the substrate W from the mounting unit 26 (second in-and-out operation of the transport mechanism 15). When the transport mechanism 45 transports the substrate W to the inspection unit 27, the inspection unit 27 inspects the substrate W. Thereafter, the transport mechanism 15 obtains the substrate W from the inspection unit 27 (second in-and-out operation of the transport mechanism 15).

[0366] The transport mechanism 15 transports the substrate W to the carrier C placed on the carrier placement portion 12A (first in-and-out operation of the transport mechanism 15 ).

[0367] <Other Effects of the First Embodiment>

[0368] The main effects of the first embodiment are as described above. For example, the cyclic action of the conveying mechanism 45 is composed of only two in-and-out actions (i.e., the first in-and-out action and the second in-and-out action). Therefore, the conveying efficiency of the conveying mechanism 45 is relatively high. As a result, the throughput of the substrate processing apparatus 10 can be appropriately improved.

[0369] For the same reason, the transfer efficiency of the transfer mechanisms 46, 65, and 66 is relatively high. This can appropriately improve the throughput of the substrate processing apparatus 10.

[0370] Other effects of the first embodiment will be described below.

[0371] The first transfer units 4S are arranged in a row in the vertical direction Z, so the first conveying mechanism 1 and the intermediate conveying mechanism 3 can easily enter and exit each first transfer unit 4S. The second transfer units 5S are arranged in a row in the vertical direction Z, so the intermediate conveying mechanism 3 and the second conveying mechanism 2 can easily enter and exit each second transfer unit 5S. For example, the heat treatment units 25 are arranged in a row in the vertical direction Z, so the conveying mechanisms 15 and 45 can easily enter and exit each heat treatment unit 25. For the same reason, the conveying mechanisms 16 and 46 can easily enter and exit each heat treatment unit 28. The conveying mechanisms 45 and 65 can easily enter and exit each loading unit 56. The conveying mechanisms 46 and 66 can easily enter and exit each loading unit 59. The conveying mechanisms 65 and 75 can easily enter and exit the loading and cooling unit 95. The conveying mechanisms 66 and 76 can easily enter and exit the loading and cooling unit 98.

[0372] The first return units 4R are arranged in a row in the vertical direction Z, so the first conveying mechanism 1 and the intermediate conveying mechanism 3 can easily enter and exit each first return unit 4R. The second return units 5R are arranged in a row in the vertical direction Z, so the intermediate conveying mechanism 3 and the second conveying mechanism 2 can easily enter and exit each second return unit 5R. For example, the loading units 26 are arranged in a row in the vertical direction Z, so the conveying mechanisms 15 and 45 can easily enter and exit each loading unit 26. For the same reason, the conveying mechanisms 16 and 46 can easily enter and exit each loading unit 29. The conveying mechanisms 45 and 65 can easily enter and exit each heat treatment unit 55. The conveying mechanisms 46 and 66 can easily enter and exit each heat treatment unit 58. The conveying mechanisms 65 and 75 can easily enter and exit each loading unit 96. The conveying mechanisms 66 and 76 can easily enter and exit each loading unit 99.

[0373] The first return unit 4R is arranged at a position overlapping with the first transfer unit 4S in a plan view, so the first conveying mechanism 1 and the intermediate conveying mechanism 3 can easily enter and exit both the first transfer unit 4S and the first return unit 4R. The second return unit 5R is arranged at a position overlapping with the second transfer unit 5S in a plan view, so the intermediate conveying mechanism 3 and the second conveying mechanism 2 can easily enter and exit both the second transfer unit 5S and the second return unit 5R. For example, the loading unit 26 is arranged at a position overlapping with the heat treatment unit 25 in a plan view, so the conveying mechanisms 15 and 45 can easily enter and exit both the heat treatment unit 25 and the loading unit 26. For the same reason, the conveying mechanisms 16 and 46 can easily enter and exit both the heat treatment unit 28 and the loading unit 29. The conveying mechanisms 45 and 65 can easily enter and exit both the heat treatment unit 55 and the loading unit 56. The transport mechanisms 46 and 66 can easily enter and exit both the heat treatment unit 58 and the placement unit 59. The transport mechanisms 65 and 75 can easily enter and exit both the placement and cooling unit 95 and the placement unit 96. The transport mechanisms 66 and 76 can easily enter and exit both the placement and cooling unit 98 and the placement unit 99.

[0374] The middle section 23 includes a relatively large number of heat treatment units 25. Thus, the middle section 23 can efficiently perform heat treatment on the substrate W. For example, the middle section 23 can perform heat treatment on a plurality of substrates W at the same time. Furthermore, the middle section 23 includes a relatively large number of loading units 26. Therefore, it is possible to appropriately prevent the delay in the transportation of the substrate W in the middle section 23. For the same reason, it is possible to appropriately prevent the delay in the transportation of the substrate W in the middle sections 24, 53, and 54. Thus, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0375] The heat treatment units 25 and the loading units 26 are arranged alternately one by one. Thus, the transport mechanisms 15 and 45 can more easily enter and exit both the heat treatment units 25 and the loading units 26. For the same reason, the transport mechanisms 16 and 46 can more easily enter and exit both the heat treatment units 28 and the loading units 29. The transport mechanisms 45 and 65 can more easily enter and exit both the heat treatment units 55 and the loading units 56. The transport mechanisms 46 and 66 can more easily enter and exit both the heat treatment units 58 and the loading units 59, respectively.

[0376] The racks 30 are arranged in the vertical direction Z, so that the heat treatment units 25 and the placement units 26 can be appropriately installed. Similarly, the heat treatment units 28, 55, 58 and the placement units 29, 56, 59 can be appropriately installed using the racks 30.

[0377] The number of heat treatment units 25 disposed between two racks 30 adjacent to each other in the vertical direction Z is one. The number of mounting units 26 disposed between two racks 30 adjacent to each other in the vertical direction Z is one. Therefore, the heat treatment units 25 and the mounting units 26 can be easily disposed in a manner of being arranged alternately one by one in the vertical direction Z. For the same reason, the heat treatment units 28 and the mounting units 29 can be easily disposed in a manner of being arranged alternately one by one in the vertical direction Z. The heat treatment units 55 and the mounting units 56 can be easily disposed in a manner of being arranged alternately one by one in the vertical direction Z. The heat treatment units 58 and the mounting units 59 can be easily disposed in a manner of being arranged alternately one by one in the vertical direction.

[0378] The mounting plate 32 of the mounting unit 26 is arranged above the first flat plate 31a of the heat treatment unit 25 and on the side of the cover 31f of the heat treatment unit 25. Therefore, the installation space of the heat treatment unit 25 and the mounting unit 26 can be reduced. Thus, the middle part 23 can be equipped with a relatively large number of heat treatment units 25 and a relatively large number of mounting units 26. For the same reason, the installation space of the heat treatment unit 28 and the mounting unit 29 can be reduced. Thus, the middle part 24 can be equipped with a relatively large number of heat treatment units 28 and a relatively large number of mounting units 29. The installation space of the heat treatment unit 55 and the mounting unit 56 can be reduced. Thus, the middle part 53 can be equipped with a relatively large number of heat treatment units 55 and a relatively large number of mounting units 56. The installation space of the heat treatment unit 58 and the mounting unit 59 can be reduced. Thus, the middle part 54 can be equipped with a relatively large number of heat treatment units 58 and a relatively large number of mounting units 59.

[0379] The intermediate portion 23 further processes the substrate W placed on the intermediate portion 23, so the throughput of the substrate processing apparatus 10 can be effectively improved. Similarly, the intermediate portions 24, 53, 54, 93, 94 further process the substrate W placed on the intermediate portions 24, 53, 54, 92 (93, 94), respectively, so the throughput of the substrate processing apparatus 10 can be effectively improved.

[0380] The processing in the intermediate portion 23 is non-liquid processing, so it is possible to appropriately prevent the delay in the transfer of the substrate W in the intermediate portion 23. Similarly, the processing in the intermediate portions 24, 53, 54, 92 (93, 94) is non-liquid processing, so it is possible to appropriately prevent the delay in the transfer of the substrate W in the intermediate portions 24, 53, 54, 92 (93, 94).

[0381] The processing of the intermediate portion 23 is heat treatment, so it is possible to appropriately prevent the transfer delay of the substrate W in the intermediate portion 23. Similarly, the processing of the intermediate portions 24, 53, 54, 92 (93, 94) is heat treatment, so it is possible to appropriately prevent the transfer delay of the substrate W in the intermediate portions 24, 53, 54, 92 (93, 94).

[0382] The intermediate section 23 inspects the substrate W placed thereon, so the throughput of the substrate processing apparatus 10 can be effectively improved. Similarly, the intermediate section 24 inspects the substrate W placed thereon, so the throughput of the substrate processing apparatus 10 can be effectively improved.

[0383] The area B45 is roughly circular in a plan view. Thus, the conveying mechanism 45 can easily enter and exit the middle portion 23 and the middle portion 53. For the same reason, the conveying mechanism 46 can easily enter and exit the middle portion 24 and the middle portion 54. The conveying mechanism 65 can easily enter and exit the middle portion 53 and the middle portion 93. The conveying mechanism 66 can easily enter and exit the middle portion 54 and the middle portion 94. The conveying mechanism 15 can easily enter and exit the carrier C placed on the carrier placement portion 12A and the middle portion 23. The conveying mechanism 16 can easily enter and exit the carrier C placed on the carrier placement portion 12B and the middle portion 24.

[0384] The rotating portion 17c of the conveying mechanism 45 is set so as not to be movable in the horizontal direction. Thus, the conveying mechanism 45 can easily enter and exit the middle portion 23 and the middle portion 53. For the same reason, the conveying mechanism 46 can easily enter and exit the middle portion 24 and the middle portion 54. The conveying mechanism 65 can easily enter and exit the middle portion 53 and the middle portion 93. The conveying mechanism 66 can easily enter and exit the middle portion 54 and the middle portion 94. The conveying mechanism 15 can easily enter and exit the carrier C placed on the carrier placement portion 12A and the middle portion 23. The conveying mechanism 16 can easily enter and exit the carrier C placed on the carrier placement portion 12B and the middle portion 24.

[0385] The transport mechanisms 14, 45, 65, and 74 are arranged in the front-to-back direction X, and the intermediate portions 23, 53, and 92 are arranged between the transport mechanisms 14, 45, 65, and 74. As described above, the circulation motions of the transport mechanisms 45 and 65 are each composed of only two in-and-out motions. Thus, the transport mechanisms 45 and 65 can efficiently transport the substrate W between the intermediate portion 23 and the intermediate portion 92. Similarly, the transport mechanisms 14, 46, 66, and 74 are arranged in the front-to-back direction X, and the intermediate portions 24, 53, and 92 are arranged between the transport mechanisms 14, 46, 66, and 74. As described above, the circulation motions of the transport mechanisms 46 and 66 are each composed of only two in-and-out motions. Thus, the transport mechanisms 46 and 66 can efficiently transport the substrate W between the intermediate portion 24 and the intermediate portion 92.

[0386] The number of in-and-out movements included in the circulation movement of the conveying mechanism 15 is 2. Therefore, the conveying efficiency of the conveying mechanism 15 is relatively high. Similarly, the number of in-and-out movements included in the circulation movement of the conveying mechanism 16 is 2. Therefore, the conveying efficiency of the conveying mechanism 16 is relatively high. As a result, the throughput of the substrate processing apparatus 10 can be further improved.

[0387] In the first in-and-out movement of the transport mechanism 15, the transport mechanism 15 moves in and out toward the carrier C placed on the carrier placement portion 12A. In the second in-and-out movement of the transport mechanism 15, the transport mechanism 15 moves in and out toward the intermediate portion 23. Therefore, by repeatedly performing the cycle movement, the transport mechanism 15 moves in and out alternately toward the carrier C and the intermediate portion 23. Thus, the transport mechanism 15 moves in and out efficiently toward the carrier C and the intermediate portion 23. Therefore, the transport mechanism 15 efficiently transports the substrate W between the carrier C and the intermediate portion 23. Similarly, the transport mechanism 16 efficiently transports the substrate W between the carrier C and the intermediate portion 24.

[0388] The transport mechanism 15 places the substrate W on the heat treatment unit 25. Thus, the substrate W can be efficiently transported between the transport mechanism 15 and the transport mechanism 45, and the substrate W can be efficiently processed between the transport mechanism 15 and the transport mechanism 45. Specifically, the substrate W can be processed quickly after being unloaded from the carrier C. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0389] Similarly, the transport mechanism 16 places the substrate W on the thermal processing unit 28. Thus, the substrate W can be efficiently transported between the transport mechanism 16 and the transport mechanism 46, and the substrate W can be efficiently processed between the transport mechanism 16 and the transport mechanism 46. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0390] The number of in-and-out movements included in the circulation movement of the conveying mechanism 75 is 2. Therefore, the conveying efficiency of the conveying mechanism 75 is relatively high. Similarly, the number of in-and-out movements included in the circulation movement of the conveying mechanism 76 is 2. Therefore, the conveying efficiency of the conveying mechanism 76 is relatively high. As a result, the throughput of the substrate processing apparatus 10 can be further improved.

[0391] In the first in-and-out movement of the transport mechanism 75, the transport mechanism 75 moves in and out toward the intermediate portion 93. In the second in-and-out movement of the transport mechanism 75, the transport mechanism 75 moves in and out toward the processing portion 82. Therefore, by repeatedly performing the cyclic movement of the transport mechanism 75, the transport mechanism 75 moves in and out toward the intermediate portion 93 and the processing portion 82 alternately. Thus, the transport mechanism 75 can move in and out toward the intermediate portion 93 and the processing portion 82 efficiently. Therefore, the transport mechanism 75 can efficiently transport the substrate W between the intermediate portion 93 and the processing portion 82. Similarly, the transport mechanism 76 can efficiently transport the substrate W between the intermediate portion 94 and the processing portion 83.

[0392] The processing section 81 processes the substrate W. Thus, the substrate W can be efficiently transferred to the processing section 81 and can be efficiently processed in the processing section 81. Therefore, the throughput of the substrate processing apparatus 10 can be effectively improved.

[0393] [Second embodiment]

[0394] A substrate processing apparatus 10 according to a second embodiment will be described with reference to the drawings. The same components as those of the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0395] <Overview of substrate processing apparatus>

[0396] Fig. 20 This is a conceptual diagram of the substrate processing apparatus according to the second embodiment. The first intermediate section 4 includes a plurality of first transfer units 4S. However, the first intermediate section 4 does not include a return unit 4R.

[0397] The second intermediate section 5 includes a plurality of second transfer units 5S. However, the second intermediate section 5 does not include a return unit 5R.

[0398] At least one of the first transfer unit 4S and the second transfer unit 5S may be a processing unit or an inspection unit.

[0399] The first transport mechanism 1 places the substrate W on the first intermediate portion 4. Specifically, the first transport mechanism 1 places the substrate W on the first transfer unit 4S.

[0400] The second transport mechanism 2 takes in the substrate from the second intermediate portion 5. Specifically, the second transport mechanism 2 takes in the substrate W from the second transfer unit 5S.

[0401] Fig.21 The figure schematically shows the cyclic operation of the intermediate conveying mechanism 3. According to the control performed by the control unit 6, the intermediate conveying mechanism 3 repeatedly performs Fig.21 The cyclic operation shown in the figure. The cyclic operation of the intermediate conveying mechanism 3 is composed of only the first in-and-out operation and the second in-and-out operation.

[0402] The first advancing and withdrawing operation of the intermediate conveying mechanism 3 is an operation in which the intermediate conveying mechanism 3 advances and withdraws toward the first intermediate portion 4 .

[0403] The first in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 taking the substrate W from the first intermediate portion 4. However, the first in-and-out motion of the intermediate transport mechanism 3 does not include the motion of the intermediate transport mechanism 3 placing the substrate W on the first intermediate portion 4. Specifically, the first in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 taking the substrate W from the first transfer unit 4S. However, the first in-and-out motion of the intermediate transport mechanism 3 does not include the motion of the intermediate transport mechanism 3 placing the substrate W on the first transfer unit 4S.

[0404] As described above, in the first in-and-out operation of the intermediate transport mechanism 3 , the intermediate transport mechanism 3 only performs an operation of taking in the substrate W from the first intermediate portion 4 , and does not perform an operation of placing the substrate W on the first intermediate portion 4 .

[0405] The second advancing and withdrawing operation is an operation in which the intermediate transport mechanism 3 advances and withdraws toward the second intermediate portion 5 .

[0406] The second in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 placing the substrate on the second intermediate portion 5. However, the second in-and-out motion of the intermediate transport mechanism 3 does not include the motion of the intermediate transport mechanism 3 taking the substrate W from the second intermediate portion 5. Specifically, the second in-and-out motion of the intermediate transport mechanism 3 includes the motion of the intermediate transport mechanism 3 placing the substrate W on the second transfer unit 5S. However, the second in-and-out motion of the intermediate transport mechanism 3 does not include the motion of the intermediate transport mechanism 3 taking the substrate W from the second transfer unit 5S.

[0407] As described above, in the second in-and-out operation of the intermediate transport mechanism 3 , the intermediate transport mechanism 3 only performs the operation of placing the substrate W on the second intermediate portion 5 , and does not include the operation of taking the substrate W from the second intermediate portion 5 .

[0408] The intermediate transport mechanism 3 performs one cycle of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 transports the substrate W from the first intermediate portion 4 to the second intermediate portion 5. Specifically, the intermediate transport mechanism 3 performs one cycle of the intermediate transport mechanism 3, and the intermediate transport mechanism 3 transports the substrate W from the first transfer unit 4S to the second transfer unit 5S. However, the intermediate transport mechanism 3 does not transport the substrate W from the second intermediate portion 5 to the first intermediate portion 4.

[0409] For convenience, refer to Figure 3A An operation example of the substrate processing apparatus 10 will be described. In accordance with the control of the control unit 6, the substrate W is transferred from the first transfer mechanism 1 to the second transfer mechanism 2.

[0410] Specifically, the first transport mechanism 1 places one substrate W on the first transfer unit 4S. When the first transfer unit 4S is a processing unit or an inspection unit, the first transfer unit 4S processes or inspects the placed substrate W.

[0411] The intermediate transport mechanism 3 receives the substrate W from the first transfer unit 4S (first in-and-out operation of the intermediate transport mechanism 3). In this way, the intermediate transport mechanism 3 receives the substrate W from the first transport mechanism 1 via the first transfer unit 4S (first intermediate portion 4).

[0412] The intermediate transport mechanism 3 places the substrate W received from the first transfer unit 4S on the second transfer unit 5S (second in-and-out operation of the intermediate transport mechanism 3 ). In this manner, the intermediate transport mechanism 3 transports the substrate W from the first intermediate portion 4 to the second intermediate portion 5 .

[0413] When the second transfer unit 5S is a processing unit or an inspection unit, the second transfer unit 5S processes or inspects the substrate W placed thereon.

[0414] The second transport mechanism 2 receives the substrate W from the second transfer unit 5S. In this manner, the intermediate transport mechanism 3 delivers the substrate W to the second transport mechanism 2 via the second intermediate portion 5 .

[0415] <Main Effects of Second Embodiment>

[0416] According to the substrate processing apparatus 10, the following effects are achieved.

[0417] The cyclic operation of the intermediate transport mechanism 3 consists only of the first in-and-out operation and the second in-and-out operation. Therefore, in the second embodiment, the transport efficiency of the intermediate transport mechanism 3 is relatively high. Thus, the throughput of the substrate processing apparatus 10 can be suitably improved.

[0418] The first in-and-out movement of the intermediate transport mechanism 3 does not include the movement of placing the substrate W on the first intermediate portion 4. Therefore, the time required for the first in-and-out movement of the intermediate transport mechanism 3 is shorter. The second in-and-out movement of the intermediate transport mechanism 3 does not include the movement of taking the substrate W from the second intermediate portion 5. Therefore, the time required for the second in-and-out movement of the intermediate transport mechanism 3 is shorter. Therefore, the time required for the circulation movement of the intermediate transport mechanism 3 is shorter. The intermediate transport mechanism 3 does not transport the substrate from the second intermediate portion 5 to the first intermediate portion 4. Therefore, the transport efficiency of the intermediate transport mechanism 3 is higher. Therefore, the throughput of the substrate processing apparatus 10 can be further improved.

[0419] Hereinafter, the structure of the substrate processing apparatus 10 will be described in further detail.

[0420] <Overall Structure of Substrate Processing Apparatus 10 >

[0421] Fig. 22 1 is a top view of a substrate processing apparatus 10 according to a second embodiment. The substrate processing apparatus 10 includes a loading block 11, a first heat treatment block 21, a first transfer block 41, and a liquid processing block 71. The loading block 11, the first heat treatment block 21, the first transfer block 41, and the liquid processing block 71 are arranged in a row in sequence. The substrate processing apparatus 10 according to the second embodiment does not include the second heat treatment block 51 and the second transfer block 61 of the first embodiment. The first block 41 is connected to the liquid processing block 71.

[0422] The conveying mechanism 14, the conveying mechanism 45, and the conveying mechanism 74 are arranged in the front-rear direction X. The conveying mechanism 14, the conveying mechanism 46, and the conveying mechanism 74 are arranged in the front-rear direction X. Among the conveying mechanisms 14, 45, 46, and 74, the conveying mechanism 14 is arranged at the front. Among the conveying mechanisms 14, 45, 46, and 74, the conveying mechanism 74 is arranged at the rear.

[0423] Areas B15 and B45 partially overlap. Areas B45 and B75 partially overlap. Areas B45 and B76 partially overlap.

[0424] Similarly, regions B16 and B46 partially overlap, regions B46 and B75 partially overlap, and regions B46 and B76 partially overlap.

[0425] Furthermore, the regions B15 and B16 partially overlap, and the regions B45 and B46 partially overlap.

[0426] The second embodiment is substantially the same as the first embodiment in terms of the structures of the loading block 11 , the first transfer block 41 , and the liquid processing block 71 . Therefore, the structures of the first heat treatment block 21 and the intermediate portion 92 will be described below.

[0427] <First heat treatment block 21>

[0428] Reference Fig. 22 , 23 . Fig.23 It is a front view of the first heat treatment block 21.

[0429] The first heat treatment block 21 includes intermediate parts 103 and 104. The substrate W is placed on the intermediate parts 103 and 104. The intermediate parts 103 and 104 are arranged in the width direction Y. The intermediate part 103 is arranged on the right side of the intermediate part 104. The intermediate part 103 does not overlap with the intermediate part 104. The intermediate part 103 is arranged between the conveying mechanism 15 and the conveying mechanism 45 adjacent to each other in the front-rear direction X. The intermediate part 104 is arranged between the conveying mechanism 16 and the conveying mechanism 46 adjacent to each other in the front-rear direction X.

[0430] The middle section 103 includes a plurality of heat treatment units 105. The middle section 103 does not include a placement unit and an inspection unit. The middle section 104 includes one inspection unit 27 and a plurality of heat treatment units 108. The inspection unit 27 belongs only to the middle section 104 and does not belong to the middle section 103. The middle section 104 does not include a placement unit.

[0431] The heat treatment unit 105 is arranged on the right side of the inspection unit 27 in a plan view. The heat treatment unit 105 is arranged behind the conveying mechanism 15 and in front of the conveying mechanism 45. The heat treatment unit 108 is arranged on the left side of the inspection unit 27 in a plan view. The heat treatment unit 108 is arranged behind the conveying mechanism 16 and in front of the conveying mechanism 46.

[0432] The heat treatment units 105 are arranged in a row in the vertical direction Z. The heat treatment units 108 are arranged in a row in the vertical direction Z. The heat treatment units 105, 108 and the inspection unit 27 are respectively arranged at substantially the same height positions as the conveying mechanisms 14, 45, 46. That is, the heat treatment units 105, 108 and the inspection unit 27 are respectively arranged at height positions at which the conveying mechanisms 14, 45, 46 can convey the substrate W.

[0433] The heat treatment unit 105 has substantially the same structure as the heat treatment units 25 and 28 described in the first embodiment. The heat treatment performed by the heat treatment unit 105 is, for example, a hydrophobic treatment.

[0434] The heat treatment unit 108 has substantially the same structure as the heat treatment units 55 and 58 described in the first embodiment. The heat treatment performed by the heat treatment unit 108 is, for example, a heating treatment.

[0435] The heat treatment unit 105 is arranged in the region where the regions B15 and B45 overlap. That is, the middle portion 103 is arranged in the region where the regions B15 and B45 overlap. The middle portion 103 is arranged outside the regions B16 and B46.

[0436] The inspection unit 27 and the heat treatment unit 108 are arranged in the region where the regions B16 and B46 overlap. That is, the middle portion 104 is arranged in the region where the regions B16 and B46 overlap. The middle portion 104 is arranged outside the regions B15 and B45.

[0437] In addition, the intermediate portions 103 and 104 are arranged outside the areas B75 and B76.

[0438] <Middle section 92>

[0439] Reference Fig. 22 The middle portion 92 is disposed between the conveying mechanism 45 and the conveying mechanism 74 which are adjacent to each other in the front-rear direction X. The middle portion 92 is disposed between the conveying mechanism 46 and the conveying mechanism 74 which are adjacent to each other in the front-rear direction X. The middle portion 92 is disposed behind the conveying mechanisms 45 and 46 and in front of the conveying mechanism 74. More specifically, the middle portion 92 is disposed behind and to the left of the conveying mechanism 45. The middle portion 92 is disposed behind and to the right of the conveying mechanism 46. The middle portion 92 is disposed at a position which is substantially equidistant from the conveying mechanisms 45 and 46.

[0440] The intermediate portion 92 is disposed between the first transfer block 41 and the liquid processing block 71. The intermediate portion 92 is provided across the transfer space 43 of the first transfer block 41 and the transfer space 73 of the liquid processing block 71.

[0441] The intermediate portion 93 is provided across the transfer space 43 of the first transfer block 41 and the transfer space 73T of the liquid processing block 71. The intermediate portion 93 is arranged at substantially the same height as the transfer mechanisms 45, 46, 75. That is, the intermediate portion 93 is arranged at a height at which the transfer mechanisms 45, 46, 75 can transfer the substrate W.

[0442] The intermediate portion 94 is provided across the transport space 43 of the first transport block 41 and the transport space 73B of the liquid processing block 71 (the intermediate portion 94 and the transport space 73B will be described in detail in detail below). Figure 7 The intermediate portion 94 is disposed at substantially the same height as the transport mechanisms 45, 46, and 76. That is, the intermediate portion 94 is disposed at a height at which the transport mechanisms 45, 46, and 76 can transport the substrate W.

[0443] The middle portion 93 is arranged in the region where the regions B45 and B75 overlap. Furthermore, the middle portion 93 is arranged in the region where the regions B46 and B75 overlap. The middle portion 93 is arranged outside the region B76.

[0444] The middle portion 94 is arranged in the region where the regions B46 and B76 overlap. Furthermore, the middle portion 94 is arranged in the region where the regions B45 and B76 overlap. The middle portion 94 is arranged outside the region B75.

[0445] In addition, the intermediate portions 93 and 94 are arranged outside the areas B15 and B16.

[0446] <Cyclic operation of each transport mechanism>

[0447] Conveying mechanisms 14, 45, 46, 74 according to Figure 1 The control of the control unit 6 shown above repeatedly executes a loop operation.

[0448] The cyclic action of the conveying mechanism 15 is composed of only the first in-and-out action and the second in-and-out action. The first in-and-out action of the conveying mechanism 15 is an action of moving in and out to the carrier C placed on the carrier placement portion 12A. The first in-and-out action of the conveying mechanism 15 includes an action of moving the substrate W out of the carrier C placed on the carrier placement portion 12A. However, the first in-and-out action of the conveying mechanism 15 does not include an action of moving the substrate W into the carrier C placed on the carrier placement portion 12A. The second in-and-out action of the conveying mechanism 15 is an action of moving in and out to the intermediate portion 103. The second in-and-out action of the conveying mechanism 15 includes an action of placing the substrate W on the thermal treatment unit 105. However, the second in-and-out action of the conveying mechanism 15 does not include an action of taking the substrate W from the intermediate portion 103.

[0449] The cyclic action of the conveying mechanism 16 is composed of only the first in-and-out action and the second in-and-out action. The first in-and-out action of the conveying mechanism 16 is an action of moving in and out to the carrier C placed on the carrier placement portion 12B. The first in-and-out action of the conveying mechanism 16 includes an action of moving the substrate W into the carrier C placed on the carrier placement portion 12B. However, the first in-and-out action of the conveying mechanism 16 does not include an action of moving the substrate W out of the carrier C placed on the carrier placement portion 12B. The second in-and-out action of the conveying mechanism 16 is an action of moving in and out to the intermediate portion 104. The second in-and-out action of the conveying mechanism 16 includes an action of taking the substrate W from the heat treatment unit 108 or the inspection unit 27. However, the second in-and-out action of the conveying mechanism 16 does not include an action of placing the substrate W on the intermediate portion 104.

[0450] The cyclic action of the conveying mechanism 45 is composed of only the first in-and-out action and the second in-and-out action. The first in-and-out action of the conveying mechanism 45 is an action of moving in and out to the intermediate portion 103. The first in-and-out action of the conveying mechanism 45 includes an action of taking in the substrate W from the heat treatment unit 105. However, the first in-and-out action of the conveying mechanism 45 does not include an action of placing the substrate W on the intermediate portion 103. The second in-and-out action of the conveying mechanism 45 is an action of moving in and out to the intermediate portion 92. The second in-and-out action of the conveying mechanism 45 includes an action of placing the substrate W on the placing and cooling unit 95 or the placing and cooling unit 98. However, the second in-and-out action of the conveying mechanism 45 does not include an action of taking in the substrate W from the intermediate portion 92.

[0451] The cyclic action of the conveying mechanism 46 is composed of only the first in-and-out action and the second in-and-out action. The first in-and-out action of the conveying mechanism 46 is an action of moving in and out to the intermediate portion 92. The first in-and-out action of the conveying mechanism 46 includes an action of obtaining a substrate W from any one of the mounting units 96 and 99. However, the first in-and-out action of the conveying mechanism 46 does not include an action of placing the substrate W on the intermediate portion 92. The second in-and-out action of the conveying mechanism 46 is an action of moving in and out to the intermediate portion 104. The second in-and-out action of the conveying mechanism 46 includes an action of placing the substrate W on the heat treatment unit 108 or the inspection unit 27. However, the second in-and-out action of the conveying mechanism 46 does not include an action of obtaining a substrate W from the intermediate portion 104.

[0452] The circulation operation of the conveying mechanisms 75 and 76 is the same as that of the first embodiment.

[0453] illustrate Fig. 22 -23 The elements shown are Fig. 20 -21 correspondence of the elements. The conveying mechanisms 15 and 74 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 45 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 103 and 92 correspond to the first and second intermediate parts 4 and 5. The heat treatment unit 105 corresponds to the first conveying unit 4S, and the placement and cooling units 95 and 98 correspond to the second conveying unit 5S.

[0454] Furthermore, the conveying mechanisms 74 and 16 correspond to the first and second conveying mechanisms 1 and 2, the conveying mechanism 46 corresponds to the intermediate conveying mechanism 3, and the intermediate parts 92 and 104 correspond to the first and second intermediate parts 4 and 5. The placing units 96 and 99 correspond to the first transfer unit 4S, and the heat treatment unit 108 and the inspection unit 27 correspond to the second transfer unit 5S.

[0455] The conveying mechanism 14 (15, 16) is an example of the front-end conveying mechanism in the present invention. The conveying mechanism 74 (75, 76) is an example of the rear-end conveying mechanism in the present invention. The conveying mechanisms 45, 46 are examples of the intermediate conveying mechanism in the present invention. The intermediate parts 103, 104 are examples of the front-end intermediate parts in the present invention. The intermediate part 92 (93, 94) is an example of the rear-end intermediate part in the present invention. The processing part 81 (82, 83) is an example of the rear-end processing part in the present invention.

[0456] <Operation Example of Substrate Processing Apparatus 10>

[0457] Fig.24 FIG. 2 is a diagram schematically showing a transport path of a substrate W. FIG.

[0458] The transport mechanism 15 transports the substrate W from the carrier C placed on the carrier placement portion 12A (first in-and-out operation of the transport mechanism 15 ). The transport mechanism 15 places the substrate W on the thermal treatment unit 105 (second in-and-out operation of the transport mechanism 15 ). The thermal treatment unit 105 performs a hydrophobic treatment on the substrate W.

[0459] The transport mechanism 45 receives the substrate W from the heat treatment unit 105 (the first in-and-out operation of the transport mechanism 45). The transport mechanism 45 places the substrate W on either the placement and cooling unit 95 or 98 (the second in-and-out operation of the transport mechanism 45). For example, the transport mechanism 45 may alternately place the substrate W on the placement and cooling unit 95 or 98 each time the transport mechanism 45 performs a circulation operation.

[0460] The transport mechanism 75 obtains the substrate W from the placement and cooling unit 95 (the first in-and-out movement of the transport mechanism 75). The transport mechanism 75 places the substrate W on the liquid treatment unit 84 (the second in-and-out movement of the transport mechanism 75). The liquid treatment unit 84 performs liquid treatment on the substrate W. The transport mechanism 75 obtains the substrate W from the liquid treatment unit 84 (the second in-and-out movement of the transport mechanism 75). The transport mechanism 75 places the substrate W on the placement unit 96 (the first in-and-out movement of the transport mechanism 75).

[0461] The transport mechanism 76 obtains the substrate W from the placement and cooling unit 98 (the first in-and-out movement of the transport mechanism 76). The transport mechanism 76 places the substrate W on the liquid treatment unit 85 (the second in-and-out movement of the transport mechanism 76). The liquid treatment unit 85 performs liquid treatment on the substrate W. The transport mechanism 76 obtains the substrate W from the liquid treatment unit 85 (the second in-and-out movement of the transport mechanism 76). The transport mechanism 76 places the substrate W on the placement unit 99 (the first in-and-out movement of the transport mechanism 76).

[0462] The transport mechanism 46 takes the substrate W from either the placement unit 96 or 99 (first moving operation of the transport mechanism 46 ). The transport mechanism 46 places the substrate W on either the thermal treatment unit 108 or the inspection unit 27 (second moving operation of the transport mechanism 46 ).

[0463] When the transport mechanism 46 transports the substrate W to the thermal treatment unit 108 , the thermal treatment unit 108 performs thermal treatment (eg, heating treatment) on the substrate W. When the transport mechanism 46 transports the substrate W to the inspection unit 27 , the inspection unit 27 inspects the substrate W.

[0464] The transport mechanism 16 takes in the substrate W from either the thermal processing unit 108 or the inspection unit 27 (second loading and unloading operation of the transport mechanism 16). The transport mechanism 16 loads the substrate W into the carrier C placed on the carrier placement portion 12B (first loading and unloading operation of the transport mechanism 16).

[0465] <Other Effects of Second Embodiment>

[0466] The main effects of the second embodiment are as described above. For example, the first in-and-out operation of the transport mechanism 45 does not include the operation of placing the substrate W on the intermediate portion 103. The second in-and-out operation of the transport mechanism 45 does not include the operation of taking the substrate W from the intermediate portion 92. As a result, the transport efficiency of the transport mechanism 45 is higher.

[0467] Similarly, the first in-and-out movement of the transport mechanism 46 does not include the movement of placing the substrate W on the intermediate portion 92. The second in-and-out movement of the transport mechanism 46 does not include the movement of taking the substrate W from the intermediate portion 104. As a result, the transport efficiency of the transport mechanism 46 is also higher. Therefore, the throughput of the substrate processing apparatus 10 can be further improved.

[0468] Other effects of the second embodiment will be described below.

[0469] The first in-and-out operation of the transport mechanism 15 does not include the operation of transporting the substrate W to the carrier C placed on the carrier placement portion 12A. The second in-and-out operation of the transport mechanism 15 does not include the operation of taking the substrate W from the intermediate portion 103. Thus, the transport efficiency of the transport mechanism 15 is further improved.

[0470] The first in-and-out operation of the transport mechanism 16 does not include an operation of taking a substrate W from the carrier C placed on the carrier placement portion 12B. The second in-and-out operation of the transport mechanism 16 does not include an operation of placing the substrate W on the intermediate portion 104. Thus, the transport efficiency of the transport mechanism 16 is further increased.

[0471] The present invention is not limited to the first and second embodiments described above, and can be modified as follows.

[0472] In the first and second embodiments, the intermediate parts 23, 24, 53, 54, 92 (93, 94), 103, 104 further process the mounted substrate W. However, this is not limiting. At least one of the intermediate parts 23, 24, 53, 54, 92 (93, 94), 103, 104 may process the mounted substrate W. None of the intermediate parts 23, 24, 53, 54, 92 (93, 94), 103, 104 may process the mounted substrate W.

[0473] In the first embodiment, the substrate W is transferred from the transfer mechanism 45 to the transfer mechanism 15. For example, the transfer mechanism 15 acquires the substrate W placed on the mounting unit 26 or the inspection unit 27 by the transfer mechanism 45. However, the present invention is not limited thereto. The substrate W may be transferred from the transfer mechanism 45 to the transfer mechanism 16. For example, the transfer mechanism 16 acquires the substrate W placed on the inspection unit 27 by the transfer mechanism 45.

[0474] In the first embodiment, the substrate W is transferred from the transfer mechanism 46 to the transfer mechanism 16. For example, the transfer mechanism 16 acquires the substrate W placed on the inspection unit 27 or the placement unit 29 by the transfer mechanism 46. However, the present invention is not limited thereto. The substrate W may be transferred from the transfer mechanism 46 to the transfer mechanism 15. For example, the transfer mechanism 15 acquires the substrate W placed on the inspection unit 27 by the transfer mechanism 46.

[0475] In the first and second embodiments, the inspection unit 27 is arranged in the region where the transport mechanisms 15, 16, 45, 46 can transport the substrate W (that is, the region where the regions B15, 16, 45, 46 overlap). However, the present invention is not limited to this. At least one of the placement unit and the processing unit may be arranged in the region where the transport mechanisms 15, 16, 45, 46 can transport the substrate W.

[0476] In the first and second embodiments, the substrate processing apparatus 10 includes two conveying mechanisms 15 and 16 as front-end conveying mechanisms. However, this is not limiting. The number of front-end conveying mechanisms may be one or three or more. For example, either conveying mechanism 15 or 16 may be omitted.

[0477] In the first and second embodiments, the substrate processing apparatus 10 includes two conveying mechanisms 75 and 76 as the back-end conveying mechanisms. However, the present invention is not limited thereto. The number of the back-end conveying mechanisms may be one or three or more. For example, one of the conveying mechanisms 75 and 76 may be omitted.

[0478] In the first and second embodiments, the processing unit 81 is disposed on the side of the conveying mechanism 74. However, the present invention is not limited thereto and the processing unit 81 may be disposed on at least one of the side of the conveying mechanism 74 and the rear of the conveying mechanism 74.

[0479] In the first and second embodiments, the processing section 82 is disposed on the side of the conveying mechanism 75. However, the present invention is not limited thereto and the processing section 82 may be disposed on at least one of the side of the conveying mechanism 75 and the rear of the conveying mechanism 75.

[0480] In the first and second embodiments, the processing unit 83 is disposed on the side of the conveying mechanism 76. However, the present invention is not limited thereto and the processing unit 83 may be disposed on at least one of the side of the conveying mechanism 76 and the rear of the conveying mechanism 76.

[0481] In the first embodiment, the intermediate portion 23 includes one inspection unit 27. However, the present invention is not limited thereto and the number of inspection units 27 included in the intermediate portion 23 may be zero or two or more.

[0482] In the first embodiment, the intermediate portion 24 includes one inspection unit 27. However, the present invention is not limited thereto and the number of inspection units 27 included in the intermediate portion 24 may be zero or two or more.

[0483] In the first embodiment, the intermediate portion 53 does not include the inspection unit. However, the present invention is not limited thereto and the intermediate portion 53 may include the inspection unit.

[0484] In the first embodiment, the intermediate portion 54 does not include the inspection means. However, the present invention is not limited thereto and the intermediate portion 54 may include the inspection means.

[0485] In the second embodiment, the intermediate portion 103 does not include the inspection unit. However, the present invention is not limited thereto and the intermediate portion 103 may include the inspection unit.

[0486] In the second embodiment, the intermediate portion 104 includes one inspection unit 27. However, the present invention is not limited thereto and the number of inspection units 27 included in the intermediate portion 104 may be zero or two or more.

[0487] The first and second embodiments and each modified embodiment described above may be appropriately modified by replacing or combining each configuration with the configuration of other modified embodiments.

[0488] The present invention may be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0489] [Explanation of Symbols]

[0490] 1. First transport mechanism

[0491] 2 Second transport mechanism

[0492] 3 Intermediate transport mechanism

[0493] 4 1st middle part

[0494] 4S 1st transfer unit

[0495] 4R 1st return unit

[0496] 5. Second middle section

[0497] 5S 2nd transfer unit

[0498] 5R 2nd return unit

[0499] 6 Control Unit

[0500] 11 Loading Blocks

[0501] 12A, 12A1, 12A2, 12B, 12B1, 12B2 Carrier mounting portion

[0502] 14, 15, 16 conveying mechanism (front end conveying mechanism)

[0503] 17a Pillar

[0504] 17b Lifting unit

[0505] 17c Rotating part

[0506] 17d, 17e holding part

[0507] 21 Heat treatment block 1

[0508] 23, 24 middle part (middle part of front end)

[0509] 25, 28 Heat treatment unit

[0510] 26, 29 Loading unit

[0511] 27 Inspection Unit

[0512] 30 Shelf

[0513] 31a 1st plate

[0514] 31b Second Plate

[0515] 31f Cover

[0516] 32 Loading plate

[0517] 41 1st transport block

[0518] 45, 46 transport mechanism (intermediate transport mechanism)

[0519] 51 No. 2 Heat Treatment Block

[0520] 53, 54 middle part

[0521] 55, 58 Heat treatment unit

[0522] 56, 59 Loading unit

[0523] 61 Second transport block

[0524] 65, 66 transport mechanism (intermediate transport mechanism)

[0525] 71 Liquid handling block

[0526] 74, 75, 76 transport mechanism (rear transport mechanism)

[0527] 81, 82, 83 Processing Unit (Backend Processing Unit)

[0528] 84, 85 Liquid handling unit

[0529] 92, 93, 94 middle part

[0530] 95, 98 Loading and cooling unit

[0531] 96, 99 Loading Unit

[0532] 103, 104 middle part

[0533] 105, 108 Heat treatment unit

[0534] A15, A16, A45, A46, A65, A66, A75, A76 rotation axis

[0535] B1 Area 1

[0536] B2 Area 2

[0537] B3 Middle Area

[0538] BO1 1st Overlap Zone

[0539] BO2 2nd Overlap Area

[0540] B15, B16, B45, B46, B65, B66, B75, B76 area

[0541] C Vehicles

[0542] W substrate

[0543] X front and back direction

[0544] Y width direction

[0545] Z up and down direction

Claims

1. A substrate processing device comprising: A first transport mechanism for transporting a substrate; A second transport mechanism for transporting the substrate; an intermediate conveying mechanism, disposed between the first conveying mechanism and the second conveying mechanism, and conveying the substrate; a first intermediate portion, arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey a substrate, and for placing a substrate thereon; a second intermediate portion, which is arranged in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey the substrate and on which the substrate is placed; and a control unit that controls the first conveying mechanism, the second conveying mechanism, and the intermediate conveying mechanism; and According to the control of the control unit, the intermediate conveying mechanism repeatedly performs a cyclic action. The circulation action of the intermediate conveying mechanism is composed of only a first in-and-out action toward the first intermediate portion and a second in-and-out action toward the second intermediate portion. The first conveying mechanism places the substrate on the first intermediate portion. The second conveying mechanism obtains the substrate from the second intermediate portion, The first in-and-out action of the intermediate transport mechanism includes an action of taking a substrate from the first intermediate portion. The second in-and-out movement of the intermediate transport mechanism includes placing the substrate on the second intermediate portion. The intermediate conveying mechanism performs the circulation action of the intermediate conveying mechanism through the intermediate conveying mechanism, the intermediate conveying mechanism receives the substrate from the first conveying mechanism via the first intermediate portion, conveys the substrate from the first intermediate portion to the second intermediate portion, and delivers the substrate to the second conveying mechanism via the second intermediate portion, the first in-and-out action of the intermediate conveying mechanism does not include an action of placing the substrate on the first intermediate portion, The second in-and-out movement of the intermediate transport mechanism does not include an action of taking in a substrate from the second intermediate portion. The intermediate transfer mechanism does not transfer the substrate from the second intermediate portion to the first intermediate portion.

2. The substrate processing apparatus according to claim 1, wherein The first in-and-out movement of the intermediate transport mechanism includes placing a substrate on the first intermediate portion. The second in-and-out action of the intermediate transport mechanism includes an action of taking in a substrate from the second intermediate portion. The circulation operation of the intermediate transport mechanism is performed by the intermediate transport mechanism, and the intermediate transport mechanism transports the substrate from the second intermediate portion to the first intermediate portion.

3. The substrate processing apparatus according to claim 2, wherein The first conveying mechanism obtains the substrate from the first intermediate portion, The second conveying mechanism places the substrate on the second intermediate portion. The circulation operation of the intermediate transport mechanism is performed by the intermediate transport mechanism, and the intermediate transport mechanism receives the substrate from the second transport mechanism via the second intermediate portion and delivers the substrate to the first transport mechanism via the first intermediate portion.

4. The substrate processing apparatus according to claim 1, wherein The first intermediate portion is arranged outside a second region where the second transfer mechanism can transfer the substrate. The second intermediate portion is arranged outside a first region where the first transfer mechanism can transfer a substrate.

5. The substrate processing apparatus according to claim 1, wherein The intermediate region where the intermediate transfer mechanism can transfer the substrate is circular in plan view.

6. The substrate processing apparatus according to claim 1, wherein The intermediate conveying mechanism comprises: A rotating portion capable of rotating about a rotation axis parallel to the up-down direction; and a holding portion supported by the rotating portion and holding the substrate; and The rotating part is arranged to be unable to move in the horizontal direction.

7. A substrate processing device comprising: A first transport mechanism for transporting a substrate; A second transport mechanism for transporting the substrate; an intermediate conveying mechanism, disposed between the first conveying mechanism and the second conveying mechanism, and conveying the substrate; a first intermediate portion, arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey a substrate, and for placing a substrate thereon; a second intermediate portion, which is arranged in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey the substrate and on which the substrate is placed; and a control unit that controls the first conveying mechanism, the second conveying mechanism, and the intermediate conveying mechanism; and According to the control of the control unit, the intermediate conveying mechanism repeatedly performs a cyclic action. The circulation action of the intermediate conveying mechanism is composed of only a first in-and-out action toward the first intermediate portion and a second in-and-out action toward the second intermediate portion. The first intermediate portion includes a plurality of first transfer units for placing a substrate. The second intermediate portion includes a plurality of second transfer units for placing one substrate. The first in-and-out movement of the intermediate transfer mechanism includes an action of taking a substrate from the first transfer unit, and does not include an action of placing a substrate on the first transfer unit. The second in-and-out operation of the intermediate transfer mechanism includes an operation of placing a substrate on the second transfer unit, and does not include an operation of taking a substrate from the second transfer unit.

8. The substrate processing apparatus according to claim 7, wherein The first transfer unit is arranged in a row in the vertical direction. The second transfer units are arranged in a row in the up-down direction.

9. The substrate processing apparatus according to claim 7, wherein The first intermediate portion includes a plurality of first transfer units for placing a substrate. The second intermediate portion includes a plurality of second transfer units for placing one substrate. The first in-and-out movement of the intermediate transfer mechanism includes an action of placing a substrate on the first transfer unit, and does not include an action of taking a substrate from the first transfer unit. The second in-and-out operation of the intermediate transfer mechanism includes an operation of taking in a substrate from the second transfer unit, and does not include an operation of placing a substrate on the second transfer unit.

10. The substrate processing apparatus according to claim 9, wherein The first return unit is arranged in a row in the vertical direction. The second return units are arranged in a row in the up-down direction.

11. The substrate processing apparatus according to claim 9, wherein The first return unit is arranged at a position overlapping with the first transfer unit in a plan view. The second return unit is arranged at a position overlapping with the second transfer unit in a plan view.

12. The substrate processing apparatus according to claim 9, wherein At least one of the first transfer units is one of a heat treatment unit for heat-treating the substrate and a placement unit for placing the substrate without performing any treatment on the substrate. At least one of the first transfer units is the other of the heat treatment unit and the placement unit, The mounting unit is arranged at a position overlapping with the heat treatment unit in a plan view. The heat treatment units and the placement units are arranged in an alternating manner.

13. The substrate processing apparatus according to claim 12, wherein The substrate processing apparatus includes a plurality of racks. The plurality of racks are arranged in an up-and-down direction and support the heat treatment unit and the mounting unit. The number of the heat treatment unit disposed between two of the racks adjacent to each other in the vertical direction is one, The number of the placement unit disposed between two of the shelf parts adjacent to each other in the up-down direction is one.

14. The substrate processing apparatus according to claim 12, wherein The heat treatment unit comprises: A first plate for mounting a substrate; a second plate, disposed on the side of the first plate, for placing the substrate; and A cover portion is disposed above the second flat plate; and The placing unit includes a placing plate, The mounting plate is arranged above the first flat plate and on the side of the cover portion, and is used to mount the substrate. The first in-and-out motion of the intermediate conveying mechanism is an in-and-out motion toward the first flat plate and the placement plate.

15. The substrate processing apparatus according to claim 7, wherein The first intermediate portion is arranged outside a second region where the second transfer mechanism can transfer the substrate. The second intermediate portion is arranged outside a first region where the first transfer mechanism can transfer a substrate.

16. The substrate processing apparatus according to claim 7, wherein The intermediate region where the intermediate transfer mechanism can transfer the substrate is circular in plan view.

17. The substrate processing apparatus according to claim 7, wherein The intermediate conveying mechanism comprises: A rotating portion capable of rotating about a rotation axis parallel to the up-down direction; and a holding portion supported by the rotating portion and holding the substrate; and The rotating part is arranged to be unable to move in the horizontal direction.

18. A substrate processing device comprising: A first transport mechanism for transporting a substrate; A second transport mechanism for transporting the substrate; an intermediate conveying mechanism, disposed between the first conveying mechanism and the second conveying mechanism, and conveying the substrate; a first intermediate portion, arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey a substrate, and for placing a substrate thereon; a second intermediate portion, which is arranged in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey the substrate and on which the substrate is placed; and a control unit that controls the first conveying mechanism, the second conveying mechanism, and the intermediate conveying mechanism; and According to the control of the control unit, the intermediate conveying mechanism repeatedly performs a cyclic action. The circulation action of the intermediate conveying mechanism is composed of only a first in-and-out action toward the first intermediate portion and a second in-and-out action toward the second intermediate portion. At least one of the first intermediate portion and the second intermediate portion further inspects the mounted substrate.

19. The substrate processing apparatus according to claim 18, wherein The first intermediate portion is arranged outside a second region where the second transfer mechanism can transfer the substrate. The second intermediate portion is arranged outside a first region where the first transfer mechanism can transfer a substrate.

20. The substrate processing apparatus according to claim 18, wherein The intermediate region where the intermediate transfer mechanism can transfer the substrate is circular in plan view.

21. The substrate processing apparatus according to claim 18, wherein The intermediate conveying mechanism comprises: A rotating portion capable of rotating about a rotation axis parallel to the up-down direction; and a holding portion supported by the rotating portion and holding the substrate; and The rotating part is arranged to be unable to move in the horizontal direction.

22. A substrate processing device comprising: A first transport mechanism for transporting a substrate; A second transport mechanism for transporting the substrate; an intermediate conveying mechanism, disposed between the first conveying mechanism and the second conveying mechanism, and conveying the substrate; a first intermediate portion, arranged in a first overlapping region where the first conveying mechanism and the intermediate conveying mechanism can convey a substrate, and for placing a substrate thereon; a second intermediate portion, which is arranged in a second overlapping region where the intermediate conveying mechanism and the second conveying mechanism can convey the substrate and on which the substrate is placed; and a control unit that controls the first conveying mechanism, the second conveying mechanism, and the intermediate conveying mechanism; and According to the control of the control unit, the intermediate conveying mechanism repeatedly performs a cyclic action. The circulation action of the intermediate conveying mechanism is composed of only a first in-and-out action toward the first intermediate portion and a second in-and-out action toward the second intermediate portion. The treatment is a heat treatment, The heat treatment is at least one of a hydrophobic treatment and a heating treatment.

23. The substrate processing apparatus according to claim 22, wherein At least one of the first intermediate portion and the second intermediate portion further processes the mounted substrate.

24. The substrate processing apparatus according to claim 23, wherein The above-mentioned treatment is a non-liquid treatment performed without supplying a treatment liquid to the substrate.

25. The substrate processing apparatus according to claim 22, wherein The first intermediate portion is arranged outside a second region where the second transfer mechanism can transfer a substrate, and the second intermediate portion is arranged outside a first region where the first transfer mechanism can transfer a substrate.

26. The substrate processing apparatus according to claim 22, wherein The intermediate region where the intermediate transfer mechanism can transfer the substrate is circular in plan view.

27. The substrate processing apparatus according to claim 22, wherein The intermediate conveying mechanism comprises: A rotating portion capable of rotating about a rotation axis parallel to the up-down direction; and a holding portion supported by the rotating portion and holding the substrate; and The rotating part is arranged to be unable to move in the horizontal direction.

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