An integrated fan controller

Abstract

The embodiment of the present invention discloses an integrated fan controller, including a control box and a controller body, wherein the controller body is arranged in the control box, a buffer box is fixedly arranged at the rear end of the control box, an air intake valve is arranged at the upper end of the buffer box, an exhaust valve is arranged at the upper end of the control box, a semiconductor cooling plate is arranged on the rear end surface of the control box, a cold end of the semiconductor cooling plate is arranged in the buffer box, a hot end of the semiconductor cooling plate is arranged in the control box, an air inlet of the air intake valve faces the cold end of the semiconductor cooling plate, an air pump is arranged in the buffer box, a purge device, a terminal pipe and a heating box are arranged in the control box, the purge device is connected to one end of the terminal pipe, the other end of the terminal pipe is connected to the heating box, the heating box is arranged on the hot end of the semiconductor cooling plate, the air pump is connected to one end of the air supply pipe, the other end of the air supply pipe is connected to the heating box, and a temperature sensor, a humidity sensor and a control unit are arranged in the control box. The water vapor in the control box can be purged and discharged to the outside, thereby improving the stability of the use of the integrated fan controller.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of fan control, and in particular to an integrated fan controller. Background Art

[0002] A fan is a machine that relies on input mechanical energy to increase gas pressure and discharge gas. It is a driven fluid machine. Fan is the customary abbreviation for gas compression and gas delivery machinery in China. The fans usually mentioned include ventilators, blowers, wind turbines, etc. Fans are widely used in ventilation, dust removal and cooling of factories, mines, tunnels, cooling towers, vehicles, ships and buildings, ventilation and air induction of boilers and industrial furnaces; cooling and ventilation in air conditioning equipment and household appliances; drying and selection of grains, wind tunnel wind sources and inflation and propulsion of hovercraft, etc.

[0003] In the prior art, a fan requires a fan controller to control or monitor the fan speed, start time, stop time, operation stability, etc. The fan controller includes a transformer, a fan capacitor, a main controller, a contactor, a circuit breaker, and other components. Usually, the above components need to be placed in a larger box and connected in series or in parallel through guides to achieve control of the fan. With the development of technology, integrated fan controllers have now appeared, which can greatly save installation space and improve the intelligent operation of equipment monitoring.

[0004] Since the integrated fan controller needs to be installed together with the fan, if it is installed in a high-humidity environment, condensation and water droplets will easily form in the control box. Not only will it be difficult to dissipate to the outside, but long-term accumulation will cause corrosion of the controller terminals and other locations. In severe cases, it will cause direct damage to the controller or even a fire.

[0005] Therefore, how to improve the integrated fan controller in the prior art so that it can dehumidify itself and reduce the risk of controller damage due to high humidity environment is a technical problem that needs to be solved urgently by technical personnel in this field. Summary of the invention

[0006] To this end, an embodiment of the present invention provides an integrated fan controller to solve the related technical problems existing in the prior art.

[0007] In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions:

[0008] An integrated fan controller comprises a control box and a controller body, wherein the controller body is arranged in the control box, and further comprises a buffer box, an air inlet valve, an exhaust valve, a semiconductor cooling sheet, an air pump, an air supply pipe, a temperature sensor, a humidity sensor, a control unit, a heating box, a terminal pipe and a purge device, wherein the buffer box is fixedly arranged at the rear end of the control box, an air inlet valve is arranged at the upper end of the buffer box, an exhaust valve is arranged at the upper end of the control box, the semiconductor cooling sheet is arranged on the rear end surface of the control box, the cold end of the semiconductor cooling sheet is arranged in the buffer box, and the hot end of the semiconductor cooling sheet is arranged at the upper end of the control box. In the control box, the air inlet of the air intake valve faces the cold end of the semiconductor refrigeration plate, the buffer box is provided with an air pump, the control box is provided with a purge device, a terminal pipe and a heating box, the purge device is connected to one end of the terminal pipe, and the other end of the terminal pipe is connected to the heating box, the heating box is arranged on the hot end of the semiconductor refrigeration plate, the air pump is connected to one end of the air supply pipe, and the other end of the air supply pipe is connected to the heating box, the control box is provided with a temperature sensor, a humidity sensor and a control unit, and the control unit is electrically connected to the temperature sensor, the humidity sensor, the semiconductor refrigeration plate and the air pump.

[0009] Furthermore, the purge device includes a purge box, a first opening and a second opening, wherein a plurality of the first opening and the second opening are provided, the purge box is provided at the rear end of the controller body, the first opening is provided on the surface of the purge box facing the controller body, and the second opening is provided on the outer edge of the side wall of the purge box.

[0010] Furthermore, it also includes a turntable device, which is arranged in the buffer box, and the turntable is arranged outside the cold end of the semiconductor refrigeration plate.

[0011] Furthermore, the turntable device includes a central axis, fan blades and a rubber scraper. The fan blades are provided in plurality and are evenly arranged around the central axis. A rubber scraper is fixed to the end of the fan blade, and the rubber scraper is in rotational contact with the cold end of the semiconductor refrigeration plate.

[0012] Furthermore, it also includes a first pressure sensor and a second pressure sensor, the first pressure sensor is arranged in the control box, the second pressure sensor is arranged in the buffer box, and the first pressure sensor and the second pressure sensor are both electrically connected to the control unit.

[0013] Furthermore, it also includes an ultraviolet disinfection lamp, which is arranged in the buffer box and directly below the air inlet valve.

[0014] Furthermore, it also includes a dryer, which is arranged in the buffer box and on the air supply pipe.

[0015] Furthermore, it also includes a filtering mechanism, which is arranged above the air intake valve. The filtering mechanism includes a cylinder, a filter material layer and an interlayer mesh. The cylinder is sleeved on the air intake valve, an interlayer mesh is provided on the upper end of the cylinder, and a filter material layer is provided between the interlayer meshes.

[0016] Furthermore, it also includes a drainage mechanism, which is arranged at the lower end of the buffer box.

[0017] Furthermore, the intake valve and the exhaust valve are both one-way valves.

[0018] The embodiments of the present invention have the following advantages:

[0019] 1. This application can introduce ambient air into the buffer box by setting a buffer box at the rear end of the control box, and process the air through the semiconductor refrigeration sheet between the buffer box and the control box. The cold end of the semiconductor refrigeration sheet set in the buffer box cools the air in the buffer box. The water vapor in the cooled air condenses into water droplets and remains in the buffer box, thereby reducing the humidity of the air in the buffer box. The air is sent to the heating box through the air supply pipe. The heating box is heated by the hot end of the semiconductor refrigeration sheet. The heated air is blown outward, which can heat and blow away the condensation on the controller body and the inner wall of the control box, and is discharged outward from the exhaust valve. Through the above process, the moisture in the control box is discharged outward, reducing the impact of moisture accumulation on the electrical components in the control box.

[0020] 2. A temperature sensor, a humidity sensor, a first pressure sensor and a second pressure sensor are provided at the same time, so that the temperature and humidity conditions in the control box can be monitored in real time. Through the pressure signals fed back in real time by the first pressure sensor and the second pressure sensor, the control unit makes adaptive control over the semiconductor refrigeration plate and the air pump, thereby improving the intelligence of the dehumidification process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0022] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0023] Figure 1 A front view of an integrated fan controller provided by an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the main structure of an integrated fan controller in an open state provided by an embodiment of the present invention;

[0025] Figure 3 A rear view of an integrated fan controller provided by an embodiment of the present invention;

[0026] Figure 4 A schematic diagram of the internal structure of an integrated fan controller from the right side provided in an embodiment of the present invention;

[0027] Figure 5 A position relationship diagram of a semiconductor cooling plate and a rotating disk device in an integrated fan controller provided by an embodiment of the present invention;

[0028] Figure 6 A schematic diagram of a filtering mechanism of an integrated fan controller provided in an embodiment of the present invention;

[0029] Figure 7 A schematic diagram of the structure of a purge device of an integrated fan controller provided in an embodiment of the present invention;

[0030] In the figure:

[0031] 1 control box; 2 controller body; 3 buffer box; 4 air inlet valve; 5 exhaust valve; 6 semiconductor refrigeration plate; 7 air pump; 8 air supply pipe; 9 temperature sensor; 10 humidity sensor; 11 control unit; 12 heating box; 13 terminal pipe; 14 purge device; 141 purge box; 142 first opening; 143 second opening; 15 turntable device; 151 central axis; 152 fan blade; 153 rubber scraper; 16 first pressure sensor; 17 second pressure sensor; 18 ultraviolet disinfection lamp; 19 dryer; 20 filter mechanism; 201 cylinder; 202 filter material layer; 203 interlayer mesh; 21 drainage mechanism. DETAILED DESCRIPTION

[0032] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In order to solve the related technical problems existing in the prior art, the embodiment of the present application provides an integrated fan controller for controlling a fan in a high humidity environment. Figure 1 As shown, it includes a control box 1 and a controller body 2. The controller body 2 is arranged in the control box 1. The controller body 2 is fixedly installed on the control box 1 by means of a mounting plate, bolts and other components. A switch door is arranged at the front end of the control box 1. A rubber ring is arranged on the inner wall of the switch door. When the switch door is closed, the rubber ring can be tightly matched with the front end edge of the control box 1. Therefore, after the switch door is closed, the control box 1 is in a relatively closed state, thereby reducing the influence of external humid air entering the control box 1 on the controller body 2.

[0034] Although a sealing ring and other structures are provided in the control box 1 to improve the sealing effect, moist air still enters. In order to discharge the moist air in the control box 1 and reduce the condensation of moist air and the influence on the controller body 2, further, as Figure 2-7 , a buffer box 3, an air inlet valve 4, an exhaust valve 5, a semiconductor cooling plate 6, an air pump 7, an air supply pipe 8, a temperature sensor 9, a humidity sensor 10, a control unit 11, a heating box 12, a terminal pipe 13 and a purge device 14 are also provided. The buffer box 3 is a rectangular box, which is connected to the control box 1 by pasting, welding, etc. Specifically, the buffer box 3 is fixed at the rear end of the control box 1, and the rear end surface of the buffer box 3 and the rear end surface of the control box 1 are tightly fitted without any gap. The upper end of the buffer box 3 is provided with an air inlet valve 4, which is used to introduce external air into the buffer box 3 and provide purge gas; the upper end of the control box 1 is provided with an exhaust valve 5, which is used to discharge the air in the control box 1 to the outside and discharge the humid air to the outside. In this embodiment, the air inlet valve 4 and the exhaust valve 5 are both one-way valves.

[0035] The semiconductor refrigeration sheet 6 is arranged on the rear end surface of the control box 1. During installation, a sealing structure (such as a sealing ring) is arranged between the control box 1 and the semiconductor refrigeration sheet 6 to prevent the gas in the buffer box 3 from directly leaking into the control box 1. The cold end of the semiconductor refrigeration sheet 6 is arranged in the buffer box 3, so the air entering the buffer box 3 can be cooled by the semiconductor refrigeration sheet 6, and the water vapor in the cooled air condenses into water droplets, and the water content in the air is reduced; the hot end of the semiconductor refrigeration sheet 6 is arranged in the control box 1, and the air entering the control box 1 is heated at the hot end of the semiconductor refrigeration sheet 6, and the heated gas is swept toward the controller body 2 and the inner wall of the control box 1, so that the condensation can be melted into water vapor, and at the same time, the water vapor in the air is prevented from condensing on the controller body.

[0036] In order to improve the cooling effect of the air entering the buffer box 3, the air inlet of the air inlet valve 4 faces the cold end of the semiconductor cooling plate 6. The buffer box 3 is provided with an air pump 7, the air inlet of the air pump 7 is connected to the air environment in the buffer box 3, the air pump 7 is connected to one end of the air supply pipe 8, and the other end of the air supply pipe 8 is connected to the heating box 12. In this embodiment, the air supply pipe 8 passes from the buffer box 3 into the control box 1 and is not exposed to the external environment. On the one hand, it reduces the impact of the environment on the air supply pipe 8, and at the same time reduces the length of the air supply pipe 8. The control box 1 is provided with a purge device 14, a terminal pipe 13 and a heating box 12. The purge device 14 is connected to one end of the terminal pipe 13, and the other end of the terminal pipe 13 is connected to the heating box 12. The heating box 12 is arranged on the hot end of the semiconductor cooling plate 6. Therefore, when in use, the treated air in the buffer box 3 enters the heating box 12 through the air pump 7 and the air supply pipe 8, and the temperature is increased by the heating action of the hot end of the semiconductor refrigeration plate 6. It is blown outwards through the first opening 142 and the second opening 143 set on the purge box 141, which can melt the condensation on the controller body 2 and the condensation on the inner wall of the control box 1 into water vapor, and discharge it outwards through the exhaust valve 5. At the same time, the high-temperature and relatively dry air is continuously discharged outwards through the purge box 141, which can also reduce the possibility of condensation on the controller body 2 and the inner wall of the control box 1, thereby greatly improving the stability of the use of the integrated fan controller.

[0037] In this embodiment, the control box 1 is provided with a temperature sensor 9, a humidity sensor 10 and a control unit 11. The temperature sensor 9 is used to monitor the temperature change in the control box 1 and transmit the temperature signal to the control unit 11. The humidity controller is used to monitor the humidity change in the control box 1 and transmit the humidity signal to the control unit 11. The control unit 11 is electrically connected to the temperature sensor 9, the humidity sensor 10, the semiconductor cooling sheet 6 and the air pump 7. The control unit 11 makes a judgment based on the received temperature signal and humidity signal, and controls the semiconductor cooling sheet 6 and the air pump 7 accordingly.

[0038] In this embodiment, the purge device 14 includes a purge box 141, a first opening 142 and a second opening 143, wherein a plurality of the first opening 142 and the second opening 143 are provided, and the purge box 141 is provided at the rear end of the controller body 2, and the first opening 142 is provided on the surface of the purge box 141 facing the controller body 2, and the second opening 143 is provided on the outer edge of the side wall of the purge box 141, and the first opening 142 and the second opening 143 are evenly arranged.

[0039] In order to better guide the air entering the buffer box 3 through the air intake valve 4, and improve the heat exchange effect between the air and the cold end of the semiconductor refrigeration plate 6. Further, it also includes a turntable device 15, which is arranged in the buffer box 3, and the turntable is arranged outside the cold end of the semiconductor refrigeration plate 6. Specifically, the turntable device 15 includes a central axis 151, a fan blade 152 and a rubber scraper 153. The fan blade 152 is provided in plurality, and the plurality of the fan blades 152 are evenly arranged around the central axis 151. The end of the fan blade 152 is fixed with a rubber scraper 153, and the rubber scraper 153 is in rotational contact with the cold end of the semiconductor refrigeration plate 6. The fan blade 152 can buffer the incoming air, so that the air is evenly in contact with the cold end of the semiconductor refrigeration plate 6. At the same time, the rubber scraper 153 can clean up the condensation on the cold end of the semiconductor refrigeration plate 6, so as to ensure the stability of the use effect of the semiconductor refrigeration plate 6.

[0040] In order to ensure that the control box 1 is in a positive pressure state and prevent the outside air from directly entering the control box 1, specifically, it also includes a first pressure sensor 16 and a second pressure sensor 17. The first pressure sensor 16 is arranged in the control box 1, and the second pressure sensor 17 is arranged in the buffer box 3. The first pressure sensor 16 and the second pressure sensor 17 are both electrically connected to the control unit 11. The first pressure sensor 16 monitors the air pressure in the control box 1, and the second pressure sensor 17 monitors the air pressure in the buffer box 3. It is necessary to ensure that the monitoring value of the first air pressure sensor is greater than the monitoring value of the second air pressure sensor, so as to ensure that the control box 1 is in a positive pressure state. When the monitoring value of the first pressure sensor 16 is less than the monitoring value of the second pressure sensor 17, the control unit 11 needs to control the air pump 7 to increase the delivery volume.

[0041] In order to reduce the impact of bacteria in humid air entering the buffer box 3 and causing bacteria to grow in the buffer box 3. Further, it also includes an ultraviolet disinfection lamp 18, which is arranged in the buffer box 3 and is arranged directly below the air intake valve 4. It also includes a filter mechanism 20, which is arranged above the air intake valve 4. The filter mechanism 20 includes a cylinder 201, a filter material layer 202 and an interlayer mesh 203. The cylinder 201 is sleeved on the air intake valve 4, and an interlayer mesh 203 is arranged on the upper end of the cylinder 201. A filter material layer 202 is arranged between the interlayer meshes 203.

[0042] In the case of using the semiconductor cooling sheet 6, in order to further reduce the water content in the air, a dryer 19 can be provided, the dryer 19 is provided in the buffer box 3, and the dryer 19 is provided on the air supply pipe 8. The dryer 19 can be filled with a drying material.

[0043] Furthermore, it also includes a drainage mechanism 21, which is arranged at the lower end of the buffer box 3. In this embodiment, the drainage mechanism 21 can be a drainage valve, which is opened when drainage is required and closed when drainage is not required.

[0044] The use process of the embodiment of the present invention is as follows:

[0045] The humidity in the control box 1 is monitored in real time by the humidity sensor 10, and the humidity signal is transmitted to the control unit 11. When the humidity exceeds the preset value, the control unit 11 controls the semiconductor cooling sheet 6 and the air pump 7 to turn on. Under the attraction of the air pump 7, the outside air forms a relative negative pressure in the buffer box 3, and the outside air enters the buffer box 3 through the air inlet valve 4. The incoming air blows on the turntable device 15, and the fan blades 152 buffer the air so that the air blows evenly on the cold end of the semiconductor cooling sheet 6. The air and the semiconductor cooling sheet 6 exchange heat, and the water vapor condenses into water droplets after the air is cooled, and the water content of the air is reduced. At the same time, during the rotation of the fan blades 152, the rubber scraper 153 scrapes off the condensed water droplets on the semiconductor cooling sheet 6. The cleaned cold end of the semiconductor cooling sheet 6 can achieve a good cooling effect. The air after cooling and drying enters the air pump 7, and further enters the heating box 12 through the air supply pipe 8. The air in the heating box 12 is heated by the hot end of the semiconductor refrigeration plate 6, and then sent to the purge box 141 through the terminal pipe 13. The purge box 141 blows hot air outwards through the first opening 142 and the second opening 143, which can blow and evaporate the condensation on the inner wall of the control box 1 and the controller body 2, and can prevent water vapor from condensing again. The purged wet air is discharged outwards through the exhaust valve 5.

[0046] 1. The present application can introduce ambient air into the buffer box 3 by setting a buffer box 3 at the rear end of the control box 1, and process the air through the semiconductor refrigeration sheet 6 between the buffer box 3 and the control box 1. The cold end of the semiconductor refrigeration sheet 6 set in the buffer box 3 cools the air in the buffer box 3. The water vapor in the cooled air condenses into water droplets and remains in the buffer box 3, thereby reducing the humidity of the air in the buffer box 3. The air is sent to the heating box 12 through the air supply pipe 8. The heating box 12 is heated by the hot end of the semiconductor refrigeration sheet 6. The heated air is blown outward, which can heat and blow away the condensation on the inner wall of the controller body 2 and the control box 1, and is discharged outward from the exhaust valve 5. Through the above process, the moisture in the control box 1 is discharged outward, reducing the influence of moisture accumulation on the electrical components in the control box 1.

[0047] 2. A temperature sensor 9, a humidity sensor 10, a first pressure sensor 16 and a second pressure sensor 17 are provided at the same time, so that the temperature and humidity conditions in the control box 1 can be monitored in real time. Through the pressure signals fed back in real time by the first pressure sensor 16 and the second pressure sensor 17, the control unit 11 makes adaptive control of the semiconductor refrigeration plate 6 and the air pump 7, thereby improving the intelligence of the dehumidification process.

[0048] At the same time, the present application may also partially improve the internal structure of the integrated fan controller, as follows:

[0049] 1. By directly using magnetic latching relays to replace any peripheral components such as AC contactors and KB0, the fan can be directly connected to operate, and the wiring is simple.

[0050] 2. There is a single-chip microcomputer in the circuit board inside the controller body, which realizes the real-time display of three-phase voltage and current. The operating data is clear at a glance. Overvoltage, undervoltage, phase loss, overload, etc. can be alarmed and output. If necessary, it can directly trip. The alarm light is set on the controller body.

[0051] 3. There is a 485 communication interface at the bottom of the controller body, which has 485 communication function and can be networked to realize remote Internet of Things platform control.

[0052] 4. There is a fan fault input interface at the bottom of the product. When the fan fails, the product stops running, an alarm is displayed, an alarm sound is issued through the built-in buzzer, and a yellow fault indicator light is displayed. The indicator light is set on the controller body.

[0053] 5. There is a damper fault input interface at the bottom of the product. When the external temperature reaches 280 degrees, the damper will have a signal input to the interface, and there will be an alarm display and a yellow indicator light.

[0054] 6. There is a fire forced cut interface at the bottom of the product. The forced cut interface means that when the fire 24V signal is input, the microcontroller detects the 24V signal input and realizes the forced cut function.

[0055] 7. There is a fire-fighting forced-start interface at the bottom of the product. The forced-start interface means that when the fire-fighting 24V signal is input, the microcontroller detects the 24V signal input and realizes the forced-start function.

[0056] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. An integrated fan controller, comprising a control box and a controller body, wherein the controller body is arranged in the control box, and an alarm light is arranged on the controller body, characterized in that: It also includes a buffer box, an air inlet valve, an exhaust valve, a semiconductor refrigeration sheet, an air pump, an air supply pipe, a temperature sensor, a humidity sensor, a control unit, a heating box, a terminal pipe and a purge device, wherein the buffer box is fixedly arranged at the rear end of the control box, an air inlet valve is arranged at the upper end of the buffer box, an exhaust valve is arranged at the upper end of the control box, the semiconductor refrigeration sheet is arranged on the rear end surface of the control box, the cold end of the semiconductor refrigeration sheet is arranged in the buffer box, the hot end of the semiconductor refrigeration sheet is arranged in the control box, the air inlet of the air inlet valve faces the cold end of the semiconductor refrigeration sheet, an air pump is arranged in the buffer box, a purge device, a terminal pipe and a heating box are arranged in the control box, the purge device is connected to one end of the terminal pipe, the other end of the terminal pipe is connected to the heating box, the heating box is arranged on the hot end of the semiconductor refrigeration sheet, the air pump is connected to one end of the air supply pipe, the other end of the air supply pipe is connected to the heating box, the control box is provided with a temperature sensor, a humidity sensor and a control unit, and the control unit is electrically connected to the temperature sensor, the humidity sensor, the semiconductor refrigeration sheet and the air pump; The purge device comprises a purge box, a first opening and a second opening, wherein a plurality of the first opening and the second opening are provided, the purge box is provided at the rear end of the controller body, the first opening is provided on the surface of the purge box facing the controller body, and a second opening is provided on the outer edge of the side wall of the purge box; It also includes a turntable device, which is arranged in the buffer box, and the turntable is arranged outside the cold end of the semiconductor refrigeration plate; The turntable device includes a central axis, fan blades and a rubber scraper. A plurality of fan blades are provided, and the plurality of fan blades are evenly arranged around the central axis. A rubber scraper is fixed to the end of the fan blade, and the rubber scraper is in rotational contact with the cold end of the semiconductor refrigeration plate.

2. The integrated fan controller according to claim 1, characterized in that: It also includes a first pressure sensor and a second pressure sensor, wherein the first pressure sensor is disposed in the control box, and the second pressure sensor is disposed in the buffer box, and both the first pressure sensor and the second pressure sensor are electrically connected to the control unit.

3. The integrated fan controller according to claim 2, characterized in that: It also includes an ultraviolet disinfection lamp, which is arranged in the buffer box and directly below the air inlet valve.

4. The integrated fan controller according to claim 3, characterized in that: It also includes a dryer, which is arranged in the buffer box and on the air supply pipe.

5. The integrated fan controller according to claim 4, characterized in that: It also includes a filtering mechanism, which is arranged above the air intake valve. The filtering mechanism includes a cylinder, a filter material layer and an interlayer mesh. The cylinder is sleeved on the air intake valve, an interlayer mesh is arranged on the upper end of the cylinder, and a filter material layer is arranged between the interlayer meshes.

6. The integrated fan controller according to claim 5, characterized in that: It also includes a drainage mechanism, which is arranged at the lower end of the buffer box.

7. The integrated fan controller according to claim 6, characterized in that: The air inlet valve and the exhaust valve are both one-way valves.

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