A PCB baking device

Abstract

The present invention discloses a PCB baking device, and relates to the technical field of circuit board processing. An embodiment of the present invention provides a PCB baking device, comprising a box. A heating chamber is provided in the box, and a heating component is provided in the heating chamber. The heating component comprises an air filter, a heater, and an air inlet arranged in sequence, and the air inlet is connected to an air inlet pipe; wherein the air entering from the air inlet is heated by the heater and then enters the heating chamber through the air filter. The plate undergoes heat exchange in the heating chamber to complete the baking operation.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a PCB baking device. Background Art

[0002] After the PCB is manufactured, it has a shelf life. If it exceeds this shelf life, the PCB needs to be baked, otherwise it is easy to cause the PCB to explode when it is put into SMT production. Baking can eliminate the internal stress of the PCB board and stabilize the size of the PCB.

[0003] PCB baking is usually done in an oven. Air enters through the air inlet, passes through the heat pipe and is heated before flowing into the oven. However, the airflow close to the heat pipe is heated quickly, while the airflow far from the heat pipe is heated slowly. Some airflow is sent into the oven before it is evenly heated, resulting in low overall heating efficiency and high energy consumption. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the existing ovens have low heating efficiency and high energy consumption, and a novel PCB baking device is provided.

[0005] In order to solve the above problems, the present invention proposes the following technical solutions:

[0006] A PCB baking device comprises a box body, a heating chamber is arranged in the box body, a heating component is arranged in the heating chamber, the heating component comprises an air filter, a heater and an air inlet arranged in sequence, and the air inlet is connected to an air inlet pipe; wherein the air entering from the air inlet is heated by the heater and then enters the heating chamber through the air filter.

[0007] Furthermore, the heating component includes at least two air inlets, and the air inlet pipes connected to the air inlets are all connected to the main air inlet pipe, and the main air inlet pipe is connected to the fan.

[0008] Furthermore, the heating chamber is provided with at least two heating components.

[0009] Furthermore, the heating component is arranged at the bottom of the heating chamber.

[0010] Furthermore, the heating chamber is provided with an exhaust port.

[0011] Furthermore, the PCB baking device also includes an exhaust pipe, one end of which is connected to the exhaust port, and the other end of which is arranged on the outside of the box.

[0012] Furthermore, the heating chamber is provided with an inner door.

[0013] Furthermore, the box body is provided with an outer door, and the outer door is arranged on one side of the inner door.

[0014] Furthermore, a lifting baffle is provided at the outlet of the box body.

[0015] Furthermore, a lifting baffle is provided at the entrance of the box body.

[0016] Compared with the prior art, the technical effects that can be achieved by the present invention include: the air in the device is directly heated by the heater after entering through the air inlet, and the air flow speed at the air inlet is fast, so the air close to the heater and the air far away from the heater can be quickly mixed and heated, and then enter the heating chamber to work, with high heat transfer efficiency and effective reduction of heat loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0018] Figure 1 A schematic diagram of the structure of a PCB baking device provided by an embodiment of the present invention;

[0019] Figure 2 for Figure 1 The structural enlarged diagram of the AA part;

[0020] Figure 3 A schematic structural diagram of a box body of a PCB baking device provided by an embodiment of the present invention;

[0021] Figure 4 Another structural schematic diagram of a box of a PCB baking device provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of the external structure of a box of a PCB baking device provided in an embodiment of the present invention.

[0023] Reference numerals

[0024] Box body 10, outer door 11, lifting baffle 12, heating chamber 20, heating assembly 21, air filter 211, heater 212, air inlet 213, air inlet duct 214, main air inlet duct 215, air outlet 22, inner door 23, exhaust duct 30. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Similar component numbers in the drawings represent similar components. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0027] It should also be understood that the terms used in this description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms of "a", "an" and "the" are intended to include plural forms.

[0028] See also Figure 1-5 The embodiment of the present invention provides a PCB baking device, including a box 10. A heating chamber 20 is provided in the box 10, and a heating assembly 21 is provided in the heating chamber 20. The heating assembly 21 includes an air filter 211, a heater 212 and an air inlet 213 arranged in sequence, and the air inlet 213 is connected to an air inlet pipe 214; wherein the air entering from the air inlet 213 is heated by the heater 212 and then enters the heating chamber 20 through the air filter 211. The board undergoes heat exchange in the heating chamber 20 to complete the baking operation.

[0029] It can be understood that the air inlet 213 is provided with a filter to filter particles in the gas.

[0030] In this embodiment, the air is directly heated by the heater 212 after entering through the air inlet 213, and the air flow speed at the air inlet 213 is fast. The air close to the heater 212 and the air far away from the heater 212 can be quickly mixed and heated, and then enter the heating chamber 20 to work, with high heat transfer efficiency, effectively reducing heat loss.

[0031] Please continue to see Figure 1-5 In a specific embodiment, the heating component 21 includes at least two air inlets 213, and the air inlet pipes 214 connected to the air inlets 213 are all connected to the main air inlet pipe 215, and the main air inlet pipe 215 is connected to the fan.

[0032] In this embodiment, the airflow of the main air inlet pipe 215 is divided into each air inlet pipe 214 and enters the heater 212, so that the air can be heated more quickly and the heating efficiency is improved.

[0033] In other embodiments, the heating chamber 20 is provided with at least two heating components 21. The heating components 21 are provided at the bottom of the heating chamber 20. In a specific implementation, the number of heating components 21 is set according to the bottom area of ​​the heating chamber 20. In order to improve the heating efficiency, the heating components 21 can be arranged side by side at the bottom of the heating chamber 20, and a plurality of heaters 212 are provided to achieve a rapid heating effect.

[0034] In a specific embodiment, the heating chamber 20 is provided with an exhaust port 22. The heated air bakes the plate through heat conduction, and the temperature drops, and the low-temperature air is discharged from the heating chamber 20 through the exhaust port 22, which will not affect the temperature inside the heating chamber 20.

[0035] In a specific implementation, the PCB baking device further includes an exhaust duct 30, one end of which is connected to the exhaust port 22, and the other end is disposed outside the box 10. The exhaust duct 30 discharges low-temperature air out of the heating chamber 20. In other embodiments, the other end of the exhaust duct 30 is connected to the inlet of the fan to achieve an air circulation effect.

[0036] In a specific implementation, in order to improve the thermal efficiency of the heating component and reduce heat loss, the heating chamber 20 is provided with an inner door 23 , and the number of the inner door 23 can be multiple. The provision of the inner door 23 is helpful for the maintenance and cleaning of the heating chamber 20 .

[0037] In one embodiment, partitions are provided at the top and bottom of the heating chamber 20 to isolate it from the box body 10. The space between the partitions and the box body can slow down the heat loss of the heating chamber 20 and prevent the heating chamber 20 from directly contacting the outside air.

[0038] In one embodiment, the box body 10 is provided with an outer door 11 , and the outer door 11 is provided on one side of the inner door 23 .

[0039] The outlet and the inlet of the box body 10 are both provided with lifting baffles 12. When the plate enters the PCB baking device, the lifting baffles 12 can close the outlet and the inlet, start baking the plate, reduce the heat loss of the heating chamber, and save energy.

[0040] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0041] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A PCB baking device, comprising a box, characterized in that: A heating chamber is provided in the box body, and a heating component is provided in the heating chamber. The heating component includes an air filter, a heater and an air inlet which are arranged in sequence, and the air inlet is connected to the air inlet pipe; wherein the air entering from the air inlet is heated by the heater and then enters the heating chamber through the air filter.

2. The PCB baking device according to claim 1, characterized in that: The heating component includes at least two air inlets, and the air inlet pipes connected to the air inlets are all connected to the main air inlet pipe, and the main air inlet pipe is connected to the fan.

3. The PCB baking device according to claim 2, characterized in that: The heating chamber is provided with at least two heating components.

4. The PCB baking device according to claim 3, characterized in that: The heating component is arranged at the bottom of the heating chamber.

5. The PCB baking device according to claim 4, characterized in that: The heating chamber is provided with an exhaust port.

6. The PCB baking device according to claim 5, characterized in that: It also includes an exhaust pipe, one end of which is connected to the exhaust port, and the other end of which is arranged on the outside of the box body.

7. The PCB baking device according to claim 6, characterized in that: The heating chamber is provided with an inner door.

8. The PCB baking device according to claim 7, characterized in that: The box body is provided with an outer door, and the outer door is arranged on one side of the inner door.

9. The PCB baking device according to claim 8, characterized in that: The outlet of the box body is provided with a lifting baffle.

10. The PCB baking device according to claim 9, characterized in that: The entrance of the box body is provided with a lifting baffle.

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