A frequency division full-duplex common-aperture phased array antenna for transmitting and receiving

Abstract

The invention discloses a frequency division full-duplex co-aperture phased array antenna for transmitting and receiving, belonging to the field of antenna technology. The phased array antenna comprises an antenna array, and the antenna array comprises a plurality of dual-frequency antenna units arranged from top to bottom and a set of TR components; the dual-frequency antenna units comprise a transmitting antenna working in a frequency band f1 and arranged on the surface of a multi-layer transmitting microwave board, and a receiving antenna working in a frequency band f2 and arranged on the surface of a multi-layer receiving microwave board, the transmitting antenna and the receiving antenna are coaxially stacked from top to bottom and the spacing is the common grating-free unit spacing; the TR component comprises a plurality of independent transmitting channels and a plurality of independent receiving channels; the phased array antenna of the invention has the characteristics of small antenna array surface occupation area, low profile, small volume, light weight, and extremely high platform environment adaptability.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a frequency division full-duplex co-aperture phased array antenna for transmitting and receiving. Background Art

[0002] In millimeter wave satellite communication and other application fields, a full-duplex working mode of transmitting and receiving frequency division is adopted to meet the needs of communication services. Traditional terminal equipment generally adopts a fixed beam antenna (such as a reflector antenna) combined with a mechanical scanning system. For different transmitting and receiving operating frequencies, the same reflector can be shared. Only different feed sources and RF front ends need to be used according to the different transmitting and receiving frequencies to realize signal transmission and reception at different transmitting and receiving frequencies. At the same time, on the basis of frequency division, polarization isolation of transmitting and receiving circular polarization in different rotation directions is further adopted to realize transmitting and receiving isolation. The reflector antenna finally used is a dual-frequency dual circularly polarized antenna.

[0003] With the development of millimeter wave phased array antenna technology, its application in terminal equipment such as communication and data transmission has gradually become popular. Its flexible and agile electronic beam scanning system has replaced the traditional fixed beam antenna combined with mechanical scanning system to meet the application requirements of high speed, high precision and high reliability. However, due to the small wavelength of the millimeter wave band, in order to meet the application requirements, the spacing between channels is limited. In the existing technical solutions, combined with the requirements of circular polarization rotation, such as Figure 1 As shown, it is only possible to design a transmitting antenna array face and a receiving antenna array face respectively for the transmitting frequency band and the receiving frequency band, that is, the transmitting antenna array uses an array antenna unit with a single transmitting frequency and a single left-hand circular polarization, and the receiving antenna array uses an array antenna unit with a single receiving frequency and a single right-hand circular polarization, and perform signal transmission and reception at the same time, and then integrate the two independent array faces on a structural plane.

[0004] In summary, under the same performance conditions, the mechanical scanning structure of the traditional fixed beam antenna is large in size, heavy in weight, and has poor beam flexibility, but the dual-frequency dual circular polarization antenna allows the transmission and reception to share the same aperture and occupy a small area; the transmitting antenna array and the receiving antenna array in the phased array antenna each require a single-frequency single circular polarization array, so the total aperture of the antenna is large, and for the platform carrier, a large installation area is required. Therefore, with the comprehensive, complex, and diversified evolution of various platform carriers for satellite communications and their application scenarios and environments, traditional fixed beam antennas and phased array antennas with separate transmission and reception cannot meet the platform adaptability requirements of terminal equipment under the conditions of meeting functions and performance, such as low profile, miniaturization, lightweight, and high isolation between the transmitting and receiving antennas. For example, the invention patent with publication number CN109904599A and patent name K / Ka dual-band co-aperture antenna array sets the Ka-band patch and the K-band patch on the same layer under the condition of no grating lobe. Although the technical effect of the co-aperture of the transmitting and receiving antennas is achieved, the circular polarization performance of the patch antenna is limited to the half-power beam width in the normal direction of the patch. Therefore, setting the Ka-band patch and the K-band patch on the same layer in this technical solution will make the polarization of the two antennas in the plane direction become approximately linear polarization, so that there is no polarization isolation of different rotation directions, and there is only near-field mutual coupling between the two patches. Due to the close physical distance, the isolation between the transmitting and receiving antennas is poor. Finally, the transmitting channel signal leaks into the receiving channel through the transmitting and receiving antennas, thereby raising the receiving noise and deteriorating the system performance.

[0005] In addition, the implementation form of the phased array antenna with one array for each transmission and reception requires a set of large-scale T components or R components for each transmission and reception array, resulting in a large total number of components and high material costs, which makes it difficult to meet the needs of various platforms for low-cost, mass-produced, and industrialized high-performance millimeter-wave satellite communication terminal equipment. For example, the invention patent with the publication number CN109904599A and the patent name K / Ka dual-band co-aperture antenna array, although it realizes the co-aperture of transmission and reception, the design of the back-end TR components, control circuits, power supply circuits, etc., has to be realized in the vertical height space. In the end, the antenna array has a high profile and a large volume, which cannot meet the needs of existing application scenarios. Summary of the invention

[0006] The purpose of the present invention is to overcome the problems of high profile, large volume, poor isolation between transmitting and receiving antennas and high cost in the prior art phased array antenna, and to provide a transmitting and receiving frequency division full-duplex common-aperture phased array antenna.

[0007] The object of the present invention is achieved through the following technical solutions: a frequency division full-duplex co-aperture phased array antenna for transmitting and receiving, comprising an antenna array, the antenna array comprising a plurality of dual-frequency antenna units and a set of TR components arranged from top to bottom, the plurality of dual-frequency antenna units and the TR components being integrated on the same multi-layer microwave board to form the antenna array;

[0008] The dual-frequency antenna unit includes a transmitting antenna operating in the frequency band f1 and arranged on the surface of the multi-layer transmitting microwave board, and a receiving antenna operating in the frequency band f2 and arranged on the surface of the multi-layer receiving microwave board. The transmitting antenna and the receiving antenna are coaxially stacked from top to bottom and the spacing is the spacing of the common grating-free unit.

[0009] The TR component includes multiple independent transmitting channels and multiple independent receiving channels; each of the transmitting channels includes a transmitting phase shift attenuation circuit, a power amplifier circuit and a receiving resistance filter circuit connected in sequence, and the receiving resistance filter circuit is connected to the transmitting antenna; each of the receiving channels includes a transmitting resistance filter circuit, a low-noise amplifier circuit and a receiving phase shift attenuation circuit connected in sequence, and the receiving antenna in the dual-frequency antenna unit is connected to the transmitting resistance filter circuit.

[0010] Specifically, the transmitting antenna and the receiving antenna are patch antennas.

[0011] Specifically, the TR component in the antenna array and the plurality of dual-frequency antenna units are vertically interconnected via transmission lines and coaxial conversions arranged inside the multi-layer microwave board.

[0012] Specifically, a plurality of dual-frequency antenna units in the antenna array are arranged in a rectangular array with a common grating-lobe-free unit spacing to form a dual-frequency common-aperture antenna array plane.

[0013] Specifically, the phased array antenna further includes a wave control circuit, and an output end of the wave control circuit is connected to the phase shift attenuation circuit.

[0014] Specifically, the phased array antenna also includes a power supply conversion circuit, and an output end of the power supply conversion circuit is connected to the wave control circuit, the transmitting channel, and the receiving channel.

[0015] Specifically, the multiple transmitting phase shift attenuation circuits, the multiple receiving phase shift attenuation circuits, the multiple transmitting power dividers, and the multiple receiving power dividers in the antenna array are integrated into a multi-channel phase shift chip using a CMOS process;

[0016] The multiple power amplifier circuits and multiple low-noise amplifier circuits in the antenna array are integrated into a multi-channel TR final chip using GaAs technology;

[0017] The multi-channel phase shift chip and the multi-channel TR final stage chip are mixed and packaged into a multi-channel multifunctional integrated chip.

[0018] Specifically, the phased array antenna further includes a feed network, which includes a transmitting feed network, a receiving feed network, a plurality of transmitting power splitters and a plurality of receiving power splitters;

[0019] The transmitting feed network is connected to the plurality of transmitting power dividers, and the output end of the transmitting power divider is connected to the transmitting phase shift attenuation circuit; the receiving feed network is connected to the plurality of receiving power dividers, and the receiving power divider is connected to the output end of the receiving phase shift attenuation circuit.

[0020] Specifically, a stripline power divider is arranged in the multi-layer microwave board, a microstrip line power divider is arranged in the multi-channel integrated chip, and the stripline power divider and the microstrip line power divider are cascaded to form the feeding network.

[0021] Specifically, a plurality of transmitting channels and a plurality of receiving channels in the phased array antenna operate simultaneously.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) The phased array antenna of the present invention includes an antenna array, which includes a plurality of dual-frequency antenna units and a set of TR components arranged from top to bottom, wherein the dual-frequency antenna unit includes a transmitting antenna operating in frequency band f1 and a receiving antenna operating in frequency band f2, and the transmitting antenna and the receiving antenna are coaxially stacked from top to bottom and the spacing is the common grating-free unit spacing, which has excellent transmit and receive polarization isolation, so that the transmission and reception work simultaneously without affecting each other, and meet the high performance requirements of satellite communication. Furthermore, the dual-frequency antenna units and TR components are arranged from top to bottom and integrated on the same multi-layer microwave board to form an antenna array. This arrangement can greatly reduce the volume of the phased array antenna, occupy a small area, and the entire antenna has a low profile.

[0024] (2) The transmitting antenna and receiving antenna of the present invention are specifically patch antennas, and the final antenna array has a low profile, small size, light weight, and extremely high platform environment adaptability.

[0025] (3) The multiple dual-frequency antenna units in the antenna array of the present invention are arranged in a rectangular array with a common grating-free unit spacing to form a dual-frequency common-aperture antenna array surface, integrating the transmitting and receiving antenna array surfaces of phased array antennas with different operating frequencies into one aperture. The antenna array surface occupies a small area and has a very high aperture utilization rate, meeting the miniaturization requirements.

[0026] (4) The phase shift attenuation circuit and the power divider of the present invention are integrated into a multi-channel phase shift chip using CMOS technology, and the power amplifier circuit and the low-noise amplifier circuit are integrated into a multi-channel TR final chip using GaAs technology. The multi-channel phase shift chip and the multi-channel TR final chip are mixed and packaged into a multi-channel multi-functional integrated chip. By integrating multiple channels and multiple multi-functional circuits on the chip, the number of components and the scale are greatly reduced, and the material cost is reduced. Furthermore, through packaging, the assembly process of the TR component is greatly simplified, the production cost is significantly reduced, and the low cost of the phased array antenna is finally achieved, which is conducive to mass production and industrialization. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings. The accompanying drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The same reference numerals are used in these drawings to represent the same or similar parts. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0028] Figure 1 It is a schematic diagram of a conventional phased array antenna with separate transmit and receive functions according to the prior art of the present invention;

[0029] Figure 2 This is a functional block diagram of the phased array antenna of the present invention;

[0030] Figure 3 This is a schematic diagram of the 4T4R multi-channel multi-function integrated chip circuit of the present invention;

[0031] Figure 4 It is a schematic diagram of the working process of the phased array antenna of the present invention;

[0032] Figure 5 It is a schematic diagram of the cascaded layers of the phased array antenna of the present invention;

[0033] Figure 6 is a schematic diagram of the appearance of the phased array antenna of the present invention;

[0034] Figure 7 It is a schematic diagram of the layout of the common-aperture antenna array of the phased array antenna 1024T / 2048R of the present invention.

[0035] In the figure: transmitting antenna array 1, receiving antenna array 2, common aperture antenna array 3, transmitting RF interface 4, receiving RF interface 5, wave control interface 6, power supply interface 7 DETAILED DESCRIPTION

[0036] The technical solution of the present invention is described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be noted that the directions or positional relationships indicated by "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are directions or positional relationships based on the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] The phased array antenna of the present invention has a low profile, light weight, high performance, a small number of components, and miniaturization. It has extremely high platform environment adaptability and low cost, and can meet the needs of various platforms for low-cost, mass-production, and industrialization of high-performance millimeter-wave satellite communication terminal equipment. A frequency-division full-duplex co-aperture phased array antenna for transmitting and receiving, such as Figure 2 As shown, it specifically includes an antenna array, which includes 2048 dual-frequency antenna units arranged from top to bottom and a set of TR components.

[0041] Furthermore, the dual-frequency antenna unit includes a transmitting antenna operating in the frequency band f1 and arranged on a multi-layer transmitting microwave board, and a receiving antenna operating in the frequency band f2 and arranged on a multi-layer receiving microwave board. The multi-layer transmitting microwave board and the multi-layer receiving microwave board are coaxially stacked from top to bottom and share a common grating-free unit spacing. Among them, the operating frequency band f1 of the transmitting antenna is 29GHz to 31GHz, and the operating frequency band f2 of the receiving antenna is 19GHz to 21GHz, which can realize millimeter wave frequency band communication, so that the phased array antenna of the present invention can be applied to satellite communications and other fields. More specifically, the grating-free unit spacing, that is, the theoretical value of the maximum spacing of the beam without grating lobes formed by the phased array antenna within the beam scanning range, is calculated as follows:

[0042]

[0043] Wherein, D is the spacing between antenna units, λ is the wavelength of the radio frequency signal, and θ is the off-axis angle. In this embodiment, the transmitting operating frequency is 30 GHz, and the receiving operating frequency is 20 GHz. According to the performance requirements of the phased array antenna, the antenna beam scanning range is 60° off-axis angle, and the rotation angle is 360°. Substituting the above calculation formula for the grating-free lobe spacing, it can be seen that the theoretical grating-free lobe unit spacing of the phased array antenna transmitting operation is 5.36 mm, and the theoretical grating-free lobe unit spacing of the phased array antenna receiving operation is 8.04 mm. In order to make the phased array antenna with a common aperture of the transmitting and receiving frequency division full-duplex have no grating lobes during beam scanning, a smaller theoretical calculated value is selected as the grating-free lobe unit spacing value of the dual-frequency antenna unit. In this embodiment, the common grating-free lobe unit spacing of the transmitting and receiving antennas is 5 mm, and then 2048 dual-frequency antenna units are arranged in a rectangular array with a spacing of 5 mm to form an antenna array.

[0044] Furthermore, if Figure 2 As shown, each transmitting channel includes a transmitting phase shift attenuation circuit, a power amplifier circuit and a receiving block filter circuit connected in sequence, and the receiving block filter circuit is connected to the transmitting antenna in the dual-frequency antenna unit; each receiving channel includes a transmitting block filter circuit, a low-noise amplifier circuit and a receiving phase shift attenuation circuit, and the receiving antenna in the dual-frequency antenna unit is connected to the transmitting block filter. More specifically, the receiving block filter set in the transmitting channel can suppress the receiving frequency band signal, prevent the signal in the transmitting channel from leaking to the receiving channel to increase the signal noise; the transmitting block filter set in the receiving channel can suppress the transmitting frequency band signal, prevent the signal in the receiving channel from leaking to the transmitting channel to increase the signal noise, and ensure the communication quality.

[0045] Furthermore, the transmitting antenna and the receiving antenna are specifically patch antennas, and the phased array antenna has a low profile.

[0046] Furthermore, a set of TR components in the antenna array is vertically interconnected with 2048 dual-frequency antenna units via transmission lines and coaxial conversions arranged inside the multi-layer microwave board, and the entire antenna has a low profile.

[0047] Furthermore, 2048 dual-frequency antenna units are arranged in a rectangular array with a common grating-free spacing of 5 mm to form a dual-frequency common-aperture antenna array surface 3. The antenna array surface occupies a small area, and adjacent dual-frequency antenna units obtain excellent axial ratio characteristics by rotating the array.

[0048] Furthermore, the phased array antenna also includes a wave control circuit, and the output end of the wave control circuit is connected to the phase shift attenuation circuit. Specifically, the output end of the wave control circuit is connected to the phase shifter, which is used to configure the amplitude and phase of 2048 transmitting antennas and 2048 receiving antennas to achieve the transmission and reception of signals in a specified direction, forming highly directional communication.

[0049] Furthermore, the phased array antenna also includes a power supply conversion circuit, the output end of the power supply conversion circuit is connected to the wave control circuit, the transmitting phase shift attenuation circuit and the power amplifier circuit in the transmitting channel, and the low-noise amplifier circuit and the receiving phase shift attenuation circuit in the receiving channel, so as to provide power for each circuit in the phased array antenna.

[0050] Furthermore, a stripline power divider is arranged in the multilayer microwave board to form a 1-to-512 transmission feed network and a 1-to-512 reception feed network. Specifically, Figure 3 As shown, a transmitting 1-to-4 microstrip line power divider is arranged in the multi-channel integrated chip, and one input end of the transmitting 1-to-4 microstrip line power divider is connected to one output end of the 1-to-512 transmitting feed network, and four output ends are connected to four transmitting phase shift attenuation circuits to distribute signals to different transmitting channels; a receiving 1-to-4 microstrip line power divider is arranged in the multi-channel integrated chip, and one output end of the receiving 1-to-4 microstrip line power divider is connected to one input end of the 1-to-512 receiving feed network, and four input ends are connected to four receiving phase shift attenuation circuits to synthesize signals from four different receiving channels.

[0051] Furthermore, the 4 transmitting phase shift attenuation circuits of the 4 transmitting channels, the 4 receiving phase shift attenuation circuits of the 4 receiving channels, the 1 4-power divider in the transmitting channel, and the 1 4-power divider in the receiving channel in the TR component are integrated into a 4-channel phase shift chip using CMOS technology; the 4 power amplifier circuits of the 4 transmitting channels and the low-noise amplifier circuits of the 4 receiving channels in the TR component are integrated into a 4-channel TR final-stage chip using GaAs technology; the 4-channel phase shift chip and the 4-channel TR final-stage chip are mixed and packaged into a 4T4R multifunctional integrated chip, and the 4T4R multifunctional integrated chip and the 4 dual-frequency antenna units are vertically interconnected through the transmission lines and coaxial conversions arranged inside the multi-layer microwave board. Figure 5As shown, this embodiment includes 512 4T4R multi-function integrated chips. The size of the 4T4R multi-function integrated chip is less than 10mm×10mm, which meets the spacing layout area of ​​4 transmitting channels and 4 receiving channels corresponding to 4 dual-frequency antenna units, and adapts to the design requirements of low profile and small volume.

[0052] Furthermore, 512 4T4R multifunctional integrated chips are arranged on the bottom layer of the multilayer microwave board, and the top layer of the multilayer microwave board is a dual-frequency antenna array surface, forming an AoB architecture. The multilayer microwave board is assembled in a metal structure cavity, and a wave control circuit for configuring the amplitude and phase of each antenna and a power supply conversion circuit for powering the TR component and the wave control circuit are also provided inside the cavity. The power supply conversion circuit is connected to an external power supply via a power supply interface 7 provided on the outer frame of the cavity to realize power supply of the entire phased array antenna; the wave control circuit leads to a wave control interface 6 provided on the outer frame of the cavity. More specifically, a transmitting radio frequency interface 4 connected to a transmitting feed interface and a receiving radio frequency interface 5 connected to a receiving feed interface are provided on the outer frame of the cavity. The appearance of the 2048T / 2048R transceiver frequency division full-duplex common-aperture phased array antenna of the present invention is as shown in the figure. Figure 6 As shown, the entire phased array antenna has a size of 320mm×320mm×40mm, with a low profile, small volume, and small occupied area.

[0053] Furthermore, 2048 transmitting channels and 2048 receiving channels operate simultaneously at their respective operating frequencies and share one dual-frequency antenna array aperture.

[0054] Furthermore, the working process of the 2048T / 2048R transceiver frequency division full-duplex common-aperture phased array antenna of the present invention is as follows: the external power supply is turned on, and the external power supply is converted into various voltages required by the wave control circuit and various components in the TR component through the power supply conversion circuit, and distributed and transmitted to the corresponding devices.

[0055] The transmission signal (29GHz~31GHz) from the transmission channel is input by the transmission RF interface. The signal is distributed to 2048 transmission channels in 512 4T4R multifunctional integrated chips through the transmission feed network and other power. Each transmission channel contains a phase shift attenuation circuit. The wave control circuit calculates the amplitude and phase values ​​of each transmission channel at the transmission signal frequency at this time according to the requirements of the system for the beam pointing angle received at this time and the position coordinates of each transmitting antenna unit. The wave control circuit outputs the wave control signal to control the phase shift amount and attenuator of the transmission phase shift attenuation circuit, and realizes the amplitude and phase configuration at the transmission feed end of each antenna. The transmission signal amplified by the power amplifier is suppressed by the receiving working frequency (19GHz~21GHz) through the stop filter and then fed into the dual-frequency antenna unit. It works at the transmission working frequency (29GHz~31GHz) and synthesizes the transmission beam in the specified direction in space.

[0056] The receiving signal (19GHz~21GHz) from the target in a certain angle direction is received by the dual-frequency antenna unit of the antenna array working at the receiving working frequency (19GHz~21GHz), and enters 512 4T4R multi-function integrated chips with a total of 2048 receiving channels. In each receiving channel, the transmitting working frequency (29GHz~31GHz) is filtered and suppressed, and the signal is amplified by the low-noise amplifier while suppressing noise. The output wave control signal of the wave control circuit controls the receiving phase shift attenuation circuit to ensure that the antenna array can effectively synthesize the signal of the target in this direction, and is synthesized into 1 channel through the receiving feed network and enters the receiving channel through the receiving RF interface.

[0057] As an option, this embodiment also includes a 1024T / 2048R common aperture antenna array, such as Figure 7 As shown, it specifically includes 256 4T4R multifunctional integrated chips and 256 4R multifunctional integrated chips, each 4T4R multifunctional integrated chip includes 4 TR channels, a total of 1024 TR channels; each 4R multifunctional integrated chip includes 4 single R channels, a total of 1024 single R channels. More specifically, 256 4T4R multifunctional integrated chips and 256 4R multifunctional integrated chips are arranged on the bottom layer of the multilayer microwave board, and are connected to 2048 dual-frequency antenna units on the surface of the multilayer microwave board through vertical interconnection of transmission lines and coaxial conversions arranged inside the multilayer microwave board. The 2048 dual-frequency antenna units are arranged in a rectangular array with a spacing of 5mm to form a dual-frequency co-aperture antenna array surface; wherein 1024 TR channels are distributed in the central area of ​​the dual-frequency co-aperture antenna array surface, and 1024 single R channels are distributed in the edge area of ​​the dual-frequency co-aperture antenna array surface. This embodiment can flexibly allocate the transmission channel scale and transmission power design under the premise of ensuring the signal receiving capability to adapt to the application requirements of satellite communications of various platforms.

[0058] The above specific implementation methods are detailed descriptions of the present invention. It cannot be determined that the specific implementation methods of the present invention are limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions and substitutions can be made without departing from the concept of the present invention, which should be regarded as belonging to the protection scope of the present invention.

Claims

1. A frequency division full-duplex co-aperture phased array antenna for transmitting and receiving, characterized in that: The phased array antenna includes an antenna array, the antenna array includes a plurality of dual-frequency antenna units and a set of TR components arranged from top to bottom, the plurality of dual-frequency antenna units and the TR components are integrated on the same multi-layer microwave board to form the antenna array; The dual-frequency antenna unit includes a transmitting antenna operating in the frequency band f1 and arranged on the surface of the multi-layer transmitting microwave board, and a receiving antenna operating in the frequency band f2 and arranged on the surface of the multi-layer receiving microwave board. The transmitting antenna and the receiving antenna are coaxially stacked from top to bottom, and the spacing between the dual-frequency antenna units is the spacing between the common grating-free units. The TR component includes a plurality of independent transmitting channels and a plurality of independent receiving channels; each of the transmitting channels includes a transmitting phase shift attenuation circuit, a power amplifier circuit and a receiving filter circuit connected in sequence, and the receiving filter circuit is connected to the transmitting antenna; each of the receiving channels includes a transmitting filter circuit, a low noise amplifier circuit and a receiving phase shift attenuation circuit connected in sequence, and the receiving antenna in the dual-frequency antenna unit is connected to the transmitting filter circuit; the receiving filter is used to suppress the receiving frequency band signal, and the transmitting filter is used to suppress the transmitting frequency band signal; A plurality of dual-frequency antenna units in the antenna array are arranged in a rectangular array with a common grating-free unit spacing to form a dual-frequency common-aperture antenna array surface; The multiple transmitting phase shift attenuation circuits, multiple receiving phase shift attenuation circuits, multiple transmitting power dividers, and multiple receiving power dividers in the antenna array are integrated into a multi-channel phase shift chip using CMOS technology; The multiple power amplifier circuits and multiple low-noise amplifier circuits in the antenna array are integrated into a multi-channel TR final chip using GaAs technology; The multi-channel phase shift chip and the multi-channel TR final stage chip are mixed and packaged into a multi-channel multifunctional integrated chip; The multilayer microwave board is assembled in a metal structure cavity, and a wave control circuit for configuring the amplitude and phase of an antenna and a power supply conversion circuit for powering the TR component and the wave control circuit are also arranged inside the cavity; the output end of the power supply conversion circuit is connected to the wave control circuit, the transmitting channel, and the receiving channel, and the power supply conversion circuit is connected to an external power supply via a power supply interface arranged on the outer frame of the cavity; the output end of the wave control circuit is connected to the phase shift attenuation circuit, and the wave control circuit leads to a wave control interface arranged on the outer frame of the cavity.

2. The transmit-receive frequency division full-duplex common-aperture phased array antenna according to claim 1, characterized in that: The transmitting antenna and the receiving antenna are specifically patch antennas.

3. The transmitting and receiving frequency division full-duplex common aperture phased array antenna according to claim 1, characterized in that: A set of TR components in the antenna array and a plurality of dual-frequency antenna units are vertically interconnected via transmission lines and coaxial conversions arranged inside the multi-layer microwave board.

4. The transmitting and receiving frequency division full-duplex common aperture phased array antenna according to claim 1, characterized in that: The phased array antenna further comprises a feed network, wherein the feed network comprises a transmitting feed network, a receiving feed network, a plurality of transmitting power splitters and a plurality of receiving power splitters; The transmitting feed network is connected to the plurality of transmitting power dividers, and the output end of the transmitting power divider is connected to the transmitting phase shift attenuation circuit; the receiving feed network is connected to the plurality of receiving power dividers, and the receiving power divider is connected to the output end of the receiving phase shift attenuation circuit.

5. The transmitting and receiving frequency division full-duplex common aperture phased array antenna according to claim 4, characterized in that: A stripline power divider is arranged in the multi-layer microwave board, a microstrip line power divider is arranged in the multi-channel phase shift chip, and the stripline power divider and the microstrip line power divider are cascaded to form the feeding network.

Images