Substrate polishing device

Abstract

The present invention relates to a substrate polishing device for preventing a conveyor belt of a substrate conveying part from being damaged, comprising: a substrate conveying part for conveying a substrate; and a substrate polishing part, comprising a polishing plate arranged on the substrate conveying part and a polishing pad arranged on the lower surface of the polishing plate, and controlling the inclination of the polishing plate toward the substrate based on the relative position of the substrate relative to the polishing plate.

Description

Technical Field

[0001] The present invention relates to a substrate polishing device, and in particular to a substrate polishing device capable of preventing a conveyor belt (adsorption conveyor belt) of a substrate conveying portion from being damaged. Background Art

[0002] The surface of a substrate used in a display device can be flattened by a substrate grinding device. The substrate grinding device includes a grinding plate with a grinding pad attached thereto. If the center of gravity of the grinding plate of the substrate grinding device is not supported, the grinding plate will fall toward the conveyor belt of the substrate conveying part, and the conveyor belt may be damaged. Summary of the invention

[0003] An object of the present invention is to provide a substrate polishing device which can prevent a conveyor belt of a substrate conveying portion from being damaged.

[0004] In order to achieve the purpose as stated above, the substrate polishing device involved in the present invention includes: a substrate conveying part for conveying a substrate; and a substrate polishing part, including a polishing plate arranged on the substrate conveying part and a polishing pad arranged on the lower surface of the polishing plate, and controlling the inclination of the polishing plate toward the substrate based on the relative position of the substrate relative to the polishing plate.

[0005] When the downstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center portion of the grinding plate or at the upstream edge position of the grinding plate, the grinding plate is inclined toward the substrate.

[0006] The grinding plate is inclined so that a downstream side edge position of the grinding plate is located at a higher position than an upstream side edge position of the grinding plate.

[0007] When the upstream edge of the substrate is located between the center of the grinding plate and the downstream edge of the grinding plate or at the downstream edge of the grinding plate, the grinding plate is inclined toward the substrate.

[0008] The grinding plate is inclined so that an upstream side edge position of the grinding plate is located at a higher position than a downstream side edge position of the grinding plate.

[0009] When the downstream edge position of the substrate is located at the center of the grinding plate, or the downstream edge position of the substrate is located at the downstream edge position of the grinding plate, or the downstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate, or the upstream edge position of the substrate is located at the center of the grinding plate, or the upstream edge position of the substrate is located at the upstream edge position of the grinding plate, or the upstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate, or the upstream edge position of the grinding plate and the downstream edge position of the grinding plate are located between the upstream edge position of the substrate and the downstream edge position of the substrate, the grinding plate is configured to be parallel to the substrate.

[0010] The substrate grinding part also includes: a shell; and a plurality of air bags, which are arranged in the shell and used to control the inclination of the grinding plate. The grinding plate includes: a base, which is arranged in the shell; and an extension, which protrudes from the base and extends toward the grinding pad side through the hole of the shell.

[0011] The multiple airbags include: a first airbag, arranged between the upper inner side surface of the shell and the upstream edge position of the base; a second airbag, arranged between the lower inner side surface of the shell and the upstream edge position of the base; a third airbag, arranged between the upper inner side surface of the shell and the downstream edge position of the base; and a fourth airbag, arranged between the lower inner side surface of the shell and the downstream edge position of the base.

[0012] When the downstream edge position of the substrate is between the upstream edge position of the grinding plate and the center of the grinding plate or at the upstream edge position of the grinding plate, the first airbag has a greater pressure than the third airbag, and the second airbag has a smaller pressure than the fourth airbag.

[0013] When the upstream edge position of the substrate is between the center of the grinding plate and the downstream edge position of the grinding plate or at the downstream edge position of the grinding plate, the first airbag has a smaller pressure than the third airbag, and the second airbag has a larger pressure than the fourth airbag.

[0014] When the downstream edge position of the substrate is located at the center of the grinding plate, or the downstream edge position of the substrate is located at the downstream edge position of the grinding plate, or the downstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate, or the upstream edge position of the substrate is located at the center of the grinding plate, or the upstream edge position of the substrate is located at the upstream edge position of the grinding plate, or the upstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate, or the upstream edge position of the grinding plate and the downstream edge position of the grinding plate are located between the upstream edge position of the substrate and the downstream edge position of the substrate, the first airbag and the third airbag have the same pressure, and the second airbag and the fourth airbag have the same pressure.

[0015] The substrate polishing section further includes: a plurality of auxiliary air bags disposed between the base portion and the polishing pad, and the plurality of auxiliary air bags are arranged in a direction intersecting a substrate conveying direction.

[0016] The pressure of each of the plurality of auxiliary airbags is controlled individually.

[0017] In addition, in order to achieve the purpose as described above, the substrate polishing device involved in the present invention includes: a substrate conveying part, which conveys a substrate; a substrate polishing part, including a polishing plate arranged on the substrate conveying part and a polishing pad arranged on the lower surface of the polishing plate; a first supporting plate, which can be configured to support the lower surface of one side edge position of the polishing pad or not support the polishing pad; and a second supporting plate, which can be configured to support the lower surface of the other side edge position of the polishing pad or not support the polishing pad, and the configuration positions of the first supporting plate and the second supporting plate are controlled based on the relative position of the substrate relative to the polishing plate.

[0018] When the downstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate or at the upstream edge position of the grinding plate, the first support plate and the second support plate are respectively configured on the lower surface of one side edge position of the grinding pad and the lower surface of the other side edge position of the grinding pad.

[0019] When the upstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate or at the downstream edge position of the grinding plate, the first support plate and the second support plate are respectively configured on the lower surface of one side edge position of the grinding pad and the lower surface of the other side edge position of the grinding pad.

[0020] When the downstream edge position of the substrate is located at the center of the grinding plate, or the downstream edge position of the substrate is located at the downstream edge position of the grinding plate, or the downstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate, or the upstream edge position of the substrate is located at the center of the grinding plate, or the upstream edge position of the substrate is located at the upstream edge position of the grinding plate, or the upstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate, or the upstream edge position of the grinding plate and the downstream edge position of the grinding plate are located between the upstream edge position of the substrate and the downstream edge position of the substrate, the first support plate and the second support plate are configured not to support the grinding pad.

[0021] In addition, in order to achieve the purpose as described above, the substrate polishing device involved in the present invention includes: a substrate conveying part, which conveys the substrate; and a substrate polishing part, including a polishing plate arranged on the substrate conveying part and a polishing pad arranged on the lower surface of the polishing plate, the substrate conveying part includes: a first roller and a second roller arranged separately from each other; a conveyor belt, which surrounds the center portion of the first roller and the center portion of the second roller, and is used to convey the substrate; a first auxiliary conveyor belt, which surrounds one side edge position of the first roller and one side edge position of the second roller, and has a higher height than the conveyor belt; and a second auxiliary conveyor belt, which surrounds the other side edge position of the first roller and the other side edge position of the second roller, and has a higher height than the conveyor belt.

[0022] The first auxiliary conveyor belt and the second auxiliary conveyor belt have the same height.

[0023] The first auxiliary conveyor belt and the second auxiliary conveyor belt have a lower height than the base plate.

[0024] The substrate polishing device according to the present invention can prevent the conveyor belt of the substrate conveying part from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a perspective view of a substrate polishing apparatus according to an embodiment of the present invention.

[0026] Figure 2 yes Figure 1 Cross-sectional view at line I-I'.

[0027] Figure 3 It is used to illustrate Figure 2 Figure 2 shows the fastening structure of the first to fourth airbags and the outer shell.

[0028] Figures 4a to 4d It is used to illustrate the use of Figure 1 FIG. 1 is a diagram of a substrate polishing method of a substrate polishing apparatus.

[0029] Figure 5 It is a top view of a substrate polishing apparatus according to another embodiment of the present invention.

[0030] Figure 6 yes Figure 5 Cross-sectional view at line I-I'.

[0031] Figures 7a to 9 It is used to illustrate the use of Figure 5 FIG. 1 is a diagram of a substrate polishing method of a substrate polishing apparatus.

[0032] Fig.10 It is a perspective view of a substrate polishing device according to another embodiment of the present invention.

[0033] Fig.11 yes Fig.10 Cross-sectional view at line I-I'.

[0034] Fig.12 It is a perspective view of a substrate polishing portion of a substrate polishing apparatus according to another embodiment of the present invention.

[0035] Fig.13 yes Fig.12 Cross-sectional view at line I-I'.

[0036] Fig.14 It is used to illustrate Fig.12 Diagram showing the configuration relationship between the substrate polishing part and the substrate.

[0037] Explanation of symbols:

[0038] 211, 221: cross bar; 110: substrate conveying part; 121: first roller; 122: second roller; 103: conveyor belt; 900: opposing support part; 300: substrate; U1-U4: upstream edge position; D1-D4: downstream edge position; 500: substrate grinding part; 510: housing; 530: grinding plate; 531: base; 532: extension part; 521-524: first airbag to fourth airbag; 540: grinding pad; 555: slurry supply part; 555a: slurry; 50: hole. DETAILED DESCRIPTION

[0039] References and Attachments Figure 1The embodiments described in detail below can clarify the advantages, features and methods of achieving these advantages and features of the present invention. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in many other ways. The following embodiments are only provided to make the disclosure of the present invention complete and to fully inform the technical personnel in the technical field to which the present invention belongs of the scope of the invention. The present invention is defined only based on the scope of the claims. Therefore, in each embodiment, in order to avoid the explanation of the present invention from becoming vague, the known process steps, known component structures and known technologies will not be specifically described. Throughout the specification, the same symbols refer to the same constituent elements.

[0040] In the accompanying drawings, the thickness is shown in an enlarged manner in order to clearly indicate each layer and region. The same symbols are attached to similar parts throughout the specification. When it is recorded that a layer, film, region, plate or other part is located "on" another part, this includes not only the case where it is directly located on other parts, but also the case where other parts are provided therebetween. On the contrary, when it is recorded that a certain part is directly located on other parts, it means that there are no other parts therebetween. In addition, when it is recorded that a layer, film, region, plate or other part is located "under" another part, this includes not only the case where it is directly located under other parts, but also the case where there are other parts therebetween. On the contrary, when it is recorded that a certain part is directly located under other parts, it means that there are no other parts therebetween.

[0041] Spatially relative terms such as "below", "beneath", "lower", "above", "upper", etc., as shown in the accompanying drawings, can be used to easily describe the relationship between one element or constituent element and other elements or constituent elements. Spatially relative terms should be understood as terms that include different directions of elements when used or working based on the direction of the diagram. For example, in the case of flipping the illustrated elements, elements described as "below" or "beneath" other elements may be located "above" other elements. Therefore, "below or below" as an exemplary term can include both upper and lower directions. Elements can also be configured in other directions, and the spatially relative terms can then be interpreted based on the configuration.

[0042] In this specification, when a part is described as being connected to another part, this includes not only a direct connection but also a connection with another element therebetween. In addition, when a part is described as including a certain component, other components are not excluded and other components may be further included unless otherwise specified.

[0043] In this specification, the terms first, second, third, etc. may be used to describe various constituent elements, but these constituent elements are not limited to the terms. The terms are used to distinguish one constituent element from other constituent elements. For example, without exceeding the scope of the present invention, the first constituent element may be named as the second or third constituent element, and similarly, the second or third constituent element may be named alternately.

[0044] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification may be used in the sense commonly understood by those skilled in the art to which the present invention belongs. Furthermore, commonly used undefined terms should not be interpreted as having an ideal or exaggerated meaning unless they are specifically defined.

[0045] Below, refer to Figures 1 to 14 The substrate polishing apparatus according to the present invention will be described in detail.

[0046] Figure 1 is a perspective view of a substrate polishing device according to an embodiment of the present invention. Figure 2 yes Figure 1 Cross-sectional view at line I-I'.

[0047] The substrate polishing device 1000 according to one embodiment of the present invention is a device for planarizing the surface of a substrate 300. Figure 1 as well as Figure 2 As shown, it includes a substrate loading part 210 , a substrate unloading part 220 , a substrate conveying part 110 , a substrate polishing part (or a polishing head) 500 , an opposing support part 900 and a slurry supply part 555 .

[0048] The substrate loading part 210 transfers the substrate 300 from the outside to the substrate transfer part 110. The substrate loading part 210 may include a plurality of rails 211 arranged along the Y-axis direction.

[0049] The substrate unloading portion 220 unloads the substrate 300 from the substrate transfer portion 110 to the outside. The substrate unloading portion 220 may include a plurality of crossbars 221 arranged along the Y-axis direction.

[0050] The substrate transfer part 110 is disposed between the substrate loading part 210 and the substrate unloading part 220. The substrate transfer part 110 may include a first roller 121, a second roller 122, and a transfer belt 130.

[0051] The first roller 121 may rotate in a clockwise direction or a counterclockwise direction. To this end, the rotation axis of the first roller 121 may be connected to a motor that provides a rotation force in a clockwise direction or a counterclockwise direction. The first roller 121 may have a cylindrical shape.

[0052] The second roller 122 can rotate in a clockwise direction or a counterclockwise direction. To this end, the rotation axis of the second roller 122 can be connected to a motor that provides a rotation force in a clockwise direction or a counterclockwise direction. The second roller 122 can rotate in the same direction as the first roller 121. The second roller 122 can have a cylindrical shape.

[0053] The conveyor belt 130 may have a closed curve shape surrounding the first roller 121, the second roller 122, and the opposing support portion 900. An edge position on one side of the conveyor belt 130 is wound around the outer peripheral surface of the first roller 121, and an edge position on the other side of the conveyor belt 130 is wound around the outer peripheral surface of the second roller 122. The conveyor belt 130 may be rotated in the same rotation direction as the first roller 121 and the second roller 122 by the rotation of the first roller 121 and the second roller 122. That is, the conveyor belt 130 may be rotated in the same direction as the first roller 121 and the second roller 122 by utilizing the rotational force provided by the first roller 121 and the second roller 122. For example, Figure 2 As shown, the first roller 121, the second roller 122 and the conveyor belt 130 can rotate in a clockwise direction. The outer side of the conveyor belt 130 contacts the substrate 300. In order to prevent the substrate 300 from slipping, the conveyor belt 130 can be formed of a rubber material. The conveyor belt 130 can be an adsorption conveyor belt capable of fixing the substrate 300.

[0054] The substrate 300 may be disposed on the substrate transfer part 110. For example, the substrate 300 may be disposed on the conveyor belt 130. The substrate 300 is transferred from the substrate loading part 210 to the substrate transfer part 110, and the substrate 300 on the substrate transfer part 110 is transferred to the substrate unloading part 220 while being polished by the substrate polishing part 500. The substrate 300 may be moved along the Y-axis direction through the substrate loading part 210, the substrate transfer part 110, and the substrate unloading part 220.

[0055] The substrate polishing section 500 is disposed on the substrate conveying section 110. For example, the substrate polishing section 500 is disposed on the conveyor belt 130. At this time, the substrate polishing section 500 can be disposed on the central portion of the conveyor belt 130. The substrate polishing section 500 can move downward toward the conveyor belt 130, or can move upward away from the conveyor belt 130. For example, the substrate polishing section 500 can move in the opposite direction of the Z axis (hereinafter, referred to as the -Z axis direction) or the Z axis direction. In addition, the substrate polishing section 500 can move in a direction intersecting with the moving direction of the conveyor belt 130 (or the moving direction of the substrate). For example, the substrate polishing section 500 can move in the X axis direction or the opposite direction of the X axis direction (hereinafter, referred to as the -X axis direction).

[0056] The substrate polishing part 500 may include a housing 510 , a plurality of air bags 521 , 522 , 523 , 524 , a polishing plate 530 , and a polishing pad 540 .

[0057] The housing 510 has a storage space inside and has a hole 50 that exposes the storage space. The hole 50 of the housing 510 is arranged on the lower side of the housing 510. The hole 50 of the housing 510 faces the conveyor belt 130.

[0058] The plurality of airbags 521, 522, 523, 524 and the base portion 531 of the grinding plate 530 are disposed inside the housing 510. In other words, the plurality of airbags 521, 522, 523, 524 and the base portion 531 of the grinding plate 530 are disposed in the storage space of the housing 510.

[0059] The grinding plate 530 includes a base portion 531 and an extension portion 532. The extension portion 532 protrudes from the base portion 531 and is exposed to the outside through the hole 50 of the housing 510. The extension portion 532 is arranged in a portion other than the two edge positions D4 and U4 of the base portion 531 (for example, the center portion of the base portion 531). Here, the two edge positions D4 and U4 of the base portion 531 are edge positions facing each other in the Y-axis direction. One edge position U4 of the edge positions U4 and D4 of the base portion 531 is an upstream edge position located on the upstream side with reference to the substrate conveying direction (i.e., the Y-axis direction), and the other edge position D4 is a downstream edge position located on the downstream side with reference to the conveying direction (i.e., the Y-axis direction) of the substrate. The inclination of the grinding plate 530 can be controlled based on the relative position of the substrate 300 relative to the grinding plate 530.

[0060] The polishing pad 540 is disposed on the lower surface of the extension portion 532. For example, a surface of the extension portion 532 facing the conveyor belt 130 may be defined as the lower surface of the extension portion 532, and the polishing pad 540 may be attached to the lower surface of the extension portion 532. The polishing pad 540 is in physical contact with the substrate 300, thereby mechanically polishing the surface of the substrate 300.

[0061] The plurality of airbags may include first to fourth airbags 521 to 524. The grinding plate 530 may float in the Z-axis direction or the -Z-axis direction through the first to fourth airbags 521 to 524. That is, when the substrate 300 moving in the Y-axis direction contacts the grinding pad 540 attached to the grinding plate 530, the grinding plate 530 may float in the Z-axis direction or the -Z-axis direction along the curvature of the surface of the substrate 300. Thus, the entire surface of the substrate 300 may contact the grinding pad smoothly.

[0062] The first airbag 521 is arranged between the upper inner side surface of the housing 510 and the upstream edge position U4 of the base portion 531, the second airbag 522 is arranged between the lower inner side surface of the housing 510 and the upstream edge position U4 of the base portion 531, the third airbag 523 is arranged between the upper inner side surface of the housing 510 and the downstream edge position D4 of the base portion 531, and the fourth airbag 524 is arranged between the lower inner side surface of the housing 510 and the downstream edge position D4 of the base portion 531. Thus, the upstream edge position U4 of the base portion 531 is arranged between the first airbag 521 and the second airbag 522, and the downstream edge position D4 of the base portion 531 is arranged between the third airbag 523 and the fourth airbag 524. The first airbag 521 is larger than the second airbag 522, and the third airbag 523 is larger than the fourth airbag 524. In addition, the first airbag 521 and the third airbag 523 may have the same size, and the second airbag 522 and the fourth airbag 524 may have the same size.

[0063] Although not shown, the pressure of each of the first to fourth airbags 521 to 524 can be individually controlled by a control unit (not shown). The control unit can be built into the substrate grinding unit 500. As another embodiment, the control unit can also be located outside the substrate grinding unit 500. The pressure of each of the first to fourth airbags 521 to 524 can change according to the relative position of the substrate 300 relative to the substrate grinding unit 500.

[0064] The opposing support part 900 is disposed between the first roller 121 and the second roller 122 in the conveyor belt 130. The opposing support part 900 and the substrate polishing part 500 face each other with the conveyor belt 130 therebetween. The opposing support part 900 supports the conveyor belt 130 on the substrate polishing part 500 and provides the polishing pressure applied to the substrate 300 by the substrate polishing part 500 uniformly to the substrate 300.

[0065] The slurry supply unit 555 supplies slurry toward the conveyor belt 130. The slurry from the slurry supply unit 555 is supplied to the surface of the substrate arranged on the conveyor belt. The slurry reacts chemically with the surface of the substrate 300, and the substrate 300 is chemically polished. Thus, the substrate polishing device 1000 of the present invention performs chemical and mechanical polishing on the substrate 300 to flatten the surface of the substrate. That is, the substrate polishing device 1000 of the present invention can be a chemical-mechanical polishing device (CMP, Chemical Mechanical Polishing).

[0066] Figure 3 It is used to illustrate Figure 2 FIG. 5 is a diagram of the fastening structure of the first airbag 521 to the fourth airbag 524 and the housing 510 .

[0067] like Figure 3 As shown, the first airbag 521 is fixed to the upper inner side surface of the outer shell 510 by the first combining portion 21 and the first screw 11, the second airbag 522 is fixed to the lower inner side surface of the outer shell 510 by the second combining portion 22 and the second screw 12, the third airbag 523 is fixed to the upper inner side surface of the outer shell 510 by the third combining portion 23 and the third screw 13, and the fourth airbag 524 is fixed to the lower inner side surface of the outer shell 510 by the fourth combining portion 24 and the fourth screw 14.

[0068] The first coupling portion 21 is disposed between the first airbag 521 and the upper inner side surface, the second coupling portion 22 is disposed between the second airbag 522 and the lower inner side surface, the third coupling portion 23 is disposed between the third airbag 523 and the upper inner side surface, and the fourth coupling portion 24 is disposed between the fourth airbag 524 and the lower inner side surface. Here, the first coupling portion 21 is attached to the first airbag 521, the second coupling portion 22 is attached to the second airbag 522, the third coupling portion 23 is attached to the third airbag 523, and the fourth coupling portion 24 is attached to the fourth airbag 524.

[0069] The first screw 11 passes through the fastening hole of the housing 510 and is coupled to the fastening groove of the first coupling portion 21, the second screw 12 passes through the fastening hole of the housing 510 and is coupled to the fastening groove of the second coupling portion 22, the third screw 13 passes through the fastening hole of the housing 510 and is coupled to the fastening groove of the third coupling portion 23, and the fourth screw 14 passes through the fastening hole of the housing 510 and is coupled to the fastening groove of the fourth coupling portion 24. A thread groove corresponding to the thread of each screw is arranged on the inner wall of each fastening hole. In addition, a thread groove corresponding to the thread of each screw is arranged on the inner wall of each fastening groove.

[0070] Figures 4a to 4d It is used to illustrate the use of Figure 1 FIG. 1 is a diagram of a substrate polishing method of a substrate polishing apparatus 1000 .

[0071] like Figure 4a As shown, the substrate 300 from the substrate loading unit 210 moves along the substrate conveying direction (i.e., the Y-axis direction) toward the substrate conveying unit 110. The substrate 300 on the substrate conveying unit 110 moves along the Y-axis direction with the conveyor belt 130. At this time, the downstream edge position D1 of the substrate 300 overlaps with the upstream edge position U2 of the polishing pad 540.

[0072] As the substrate polishing section 500 descends in the -Z-axis direction, the upstream edge position U2 of the polishing pad 540 included in the substrate polishing section 500 contacts the downstream edge position D1 of the substrate 300. At this time, the polishing plate 530 of the substrate polishing section 500 is inclined at a predetermined angle relative to the conveyor belt 130 (or the substrate 300) of the substrate conveying section 110. In other words, the polishing plate 530 is inclined at a predetermined angle relative to one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 that contacts the substrate 300), so that the downstream edge position D3 of the polishing plate 530 is farther away from the conveyor belt 130 than the upstream edge position U3 of the polishing plate 530. Thus, the distance between the downstream edge position D3 of the polishing plate 530 and the conveyor belt 130 in the Z-axis direction is greater than the distance between the upstream edge position U3 of the polishing plate 530 and the conveyor belt 130 in the Z-axis direction. Here, the upstream edge position U3 of the grinding plate 530 refers to the upstream edge position U3 of the extending portion 532 , and the downstream edge position D3 of the grinding plate 530 refers to the downstream edge position D3 of the extending portion 532 .

[0073] The polishing pad 540 attached to the lower surface of the polishing plate 530 is also inclined at the same angle as the polishing plate 530. That is, the polishing pad 540 is inclined at a predetermined angle relative to one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 in contact with the substrate 300), so that the downstream side edge position D2 of the polishing pad 540 is farther away from the conveyor belt 130 than the upstream side edge position U2 of the polishing pad 540. To this end, the pressure of the first airbag 521 to the fourth airbag 524 of the substrate polishing unit 500 can be controlled. For example, Figure 4a As shown, the pressure of the first airbag 521 can be greater than the pressure of the second airbag 522 , and the pressure of the second airbag 522 can be less than the pressure of the fourth airbag 524 .

[0074] like Figure 4a As shown, in a state where the grinding plate 530 and the grinding pad 540 are tilted at a predetermined angle, the substrate grinding portion 500 descends toward the downstream edge position D1 of the substrate 300. As a result, the upstream edge position U2 of the grinding pad 540 contacts the downstream edge position D1 of the substrate 300. At this time, the central portion of the grinding plate 530 (the portion corresponding to the center of gravity) and the downstream edge position D3 of the grinding plate 530 are not supported by the substrate 300. Therefore, when only the upstream edge position U3 of the grinding plate 530 contacts the downstream edge position D1 of the substrate 300, the downstream edge position D3 of the grinding plate 530 may fall toward the conveyor belt 130. This is because the grinding plate 530 can float in the -Z axis direction through the first to fourth airbags 521 to 524. However, as Figure 4aAs shown, since the upstream edge position U3 of the grinding plate 530 contacts the downstream edge position D1 of the substrate 300 when the downstream edge position D3 of the grinding plate 530 is raised higher than the upstream edge position U3, the falling distance of the downstream edge position D3 of the grinding plate 530 can be reduced. Thus, the problem that the grinding pad 540 attached to the grinding plate 530 contacts the conveyor belt 130 due to the falling of the grinding plate 530 can be solved. When the grinding pad 540 contacts the conveyor belt 130, the conveyor belt 130 is damaged. On the other hand, when the grinding pad 540 contacts the substrate 300, the substrate grinding part 500 moves alternately in the X-axis direction and the -X-axis direction. Thus, the grinding pad 540 and the substrate grinding part 500 perform the same movement, and the surface of the substrate 300 contacting the grinding pad 540 is mechanically polished. Along with this, the slurry 555 a is supplied from the slurry supply unit 555 onto the substrate 300 , so that the surface of the substrate 300 is chemically polished.

[0075] As described above, when the downstream edge position D1 of the substrate 300 is located between the upstream edge position U3 of the grinding plate 530 and the center portion of the grinding plate 530, or when the downstream edge position D1 of the substrate 300 is located at the upstream edge position U3 of the grinding plate 530, the grinding plate 530 is inclined toward the substrate 300. For example, the grinding plate 530 is inclined so that the downstream edge position D3 of the grinding plate 530 is located at a higher position than the upstream edge position U3 of the grinding plate 530.

[0076] Then, if Figure 4b As shown, as the substrate 300 further moves along the substrate conveying direction, the downstream side edge position D1 of the substrate 300 may overlap with the center portion of the grinding plate 530 (or the grinding pad 540). At this time, the grinding plate 530 is configured to be parallel to the conveyor belt 130. Specifically, the lower surface of the extension portion 532 of the grinding plate 530 and one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 in contact with the substrate 300) are configured to be parallel. To this end, the pressure of the first airbag 521 to the fourth airbag 524 of the substrate grinding section 500 may be controlled. For example, as Figure 4bAs shown, the pressure of the first airbag 521 can be the same as the pressure of the second airbag 522, and the pressure of the second airbag 522 can be the same as the pressure of the fourth airbag 524. The pressures of the first airbag 521 to the fourth airbag 524 can be controlled by the control unit. On the other hand, in a state where the polishing pad 540 is in contact with the substrate 300, the substrate polishing unit 500 moves alternately in the X-axis direction and the -X-axis direction. Thus, the polishing pad 540 performs the same movement as the substrate polishing unit 500, and the surface of the substrate 300 in contact with the polishing pad 540 is mechanically polished. Along with this, slurry 555a is provided from the slurry supply unit 555 to the substrate 300, so that the surface of the substrate 300 is chemically polished.

[0077] Then, if Figure 4c As shown, as the substrate 300 further moves along the substrate conveying direction, the center portion of the substrate 300 may overlap with the center portion of the grinding plate 530 (or the grinding pad 540). At this time, the grinding plate 530 is configured to be parallel to the conveyor belt 130. Specifically, the lower surface of the extension portion 532 of the grinding plate 530 and one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 in contact with the substrate 300) are configured to be parallel. To this end, the pressure of the first airbag 521 to the fourth airbag 524 of the substrate grinding section 500 may be controlled. For example, as Figure 4c As shown, the pressure of the first airbag 521 can be the same as the pressure of the second airbag 522, and the pressure of the second airbag 522 can be the same as the pressure of the fourth airbag 524. The pressures of the first airbag 521 to the fourth airbag 524 can be controlled by the control unit. On the other hand, in a state where the polishing pad 540 is in contact with the substrate 300, the substrate polishing unit 500 moves alternately in the X-axis direction and the -X-axis direction. Thus, the polishing pad 540 performs the same movement as the substrate polishing unit 500, and the surface of the substrate 300 in contact with the polishing pad 540 is mechanically polished. Along with this, slurry 555a is provided from the slurry supply unit 555 to the substrate 300, so that the surface of the substrate 300 is chemically polished.

[0078] As described above, when the downstream edge position D1 of the substrate 300 is located at the center of the grinding plate 530, or the downstream edge position D1 of the substrate 300 is located at the downstream edge position D3 of the grinding plate 530, or the downstream edge position D1 of the substrate 300 is located between the center of the grinding plate 530 and the downstream edge position D3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the center of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the upstream edge position U3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located between the upstream edge position U3 of the grinding plate 530 and the center of the grinding plate 530, or the upstream edge position U3 and the downstream edge position D3 of the grinding plate 530 are located between the upstream edge position U1 of the substrate 300 and the downstream edge position D1 of the substrate 300, the grinding plate 530 is arranged to be parallel to the substrate 300 (or a surface of the conveyor belt 130 in contact with the substrate 300).

[0079] Then, if Figure 4d As shown, as the substrate 300 further moves along the substrate conveying direction, the upstream edge position U1 of the substrate 300 may overlap with the downstream edge position D3 of the grinding plate 530 (or the grinding pad 540). At this time, the grinding plate 530 of the substrate grinding section 500 is inclined at a predetermined angle relative to the conveyor belt 130 (or the substrate) of the substrate conveying section 110. In other words, the grinding plate 530 is inclined at a predetermined angle relative to one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 that contacts the substrate 300), so that the upstream edge position U3 of the grinding plate 530 is farther away from the conveyor belt 130 than the downstream edge position D3 of the grinding plate 530. Accordingly, the distance between the upstream edge position U3 of the grinding plate 530 and the conveyor belt 130 in the Z-axis direction is greater than the distance between the downstream edge position D3 of the grinding plate 530 and the conveyor belt 130 in the Z-axis direction. Thus, the polishing pad 540 attached to the lower surface of the polishing plate 530 is also inclined at the same angle as the polishing plate 530. That is, the polishing pad 540 is inclined at a predetermined angle relative to one side of the conveyor belt 130 (i.e., the side of the conveyor belt 130 in contact with the substrate 300), so that the upstream edge position U2 of the polishing pad 540 is farther away from the conveyor belt 130 than the downstream edge position D2 of the polishing pad 540. To this end, the pressure of the first airbag 521 to the fourth airbag 524 of the substrate polishing unit 500 can be controlled. For example, Figure 4d As shown, the pressure of the first airbag 521 is smaller than the pressure of the third airbag 523 , and the pressure of the second airbag 522 is larger than the pressure of the fourth airbag 524 .

[0080] like Figure 4dAs shown, the downstream edge position D2 of the grinding pad 540 contacts the upstream edge position U1 of the substrate 300. At this time, since the central portion of the grinding plate 530 (the portion corresponding to the center of gravity) and the upstream edge position U3 of the grinding plate 530 are not supported by the substrate 300, only when the downstream edge position D3 of the grinding plate 530 contacts the upstream edge position U1 of the substrate 300, the upstream edge position U3 of the grinding plate 530 may fall toward the conveyor belt 130. This is because the grinding plate 530 can float in the -Z axis direction through the first airbag 521 to the fourth airbag 524. However, as Figure 4d As shown, in a state where the upstream edge position U3 of the grinding plate 530 is raised higher than the downstream edge position D3 thereof, the downstream edge position D3 of the grinding plate 530 contacts the upstream edge position U1 of the substrate 300, thereby reducing the falling distance of the upstream edge position U3 of the grinding plate 530. Thus, the problem that the grinding pad 540 attached to the grinding plate 530 contacts the conveyor belt 130 due to the falling of the grinding plate 530 can be solved. On the other hand, in a state where the grinding pad 540 contacts the substrate 300, the substrate grinding unit 500 moves alternately in the X-axis direction and the -X-axis direction. Thus, the grinding pad 540 and the substrate grinding unit 500 perform the same movement, and the surface of the substrate 300 contacting the grinding pad 540 is mechanically polished. Along with this, the slurry 555a is provided to the substrate 300 from the slurry supply unit 555, so that the surface of the substrate 300 is chemically polished.

[0081] As described above, when the upstream edge position U1 of the substrate 300 is located between the center portion of the grinding plate 530 and the downstream edge position D3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the downstream edge position D3 of the grinding plate 530, the grinding plate 530 is inclined toward the substrate 300. For example, the grinding plate 530 is inclined so that the upstream edge position U3 of the grinding plate 530 is located at a higher position than the downstream edge position D3 of the grinding plate 530.

[0082] Then, as the substrate 300 further advances along the substrate transfer direction, the substrate 300 is transferred to the substrate unloading portion 220. Figures 4a to 4d In the process, the entire surface of the substrate 300 is grinded sequentially.

[0083] Figure 5 is a top view of a substrate polishing device according to another embodiment of the present invention, Figure 6 yes Figure 5 Cross-sectional view at line I-I'.

[0084] The substrate polishing device 2000 according to another embodiment of the present invention is a device for planarizing the surface of the substrate 300. Figure 5 as well as Figure 6 As shown, the substrate loading unit 210, the substrate unloading unit 220, the substrate conveying unit 110, the substrate polishing unit 500, the opposing support unit 900, the first support plate 601 and the second support plate 602 are included. On the other hand, although not shown, the substrate polishing apparatus 2000 further includes the slurry supply unit 555 described above.

[0085] The substrate loading unit 210, the substrate unloading unit 220, the substrate conveying unit 110, the substrate polishing unit 500 and the opposing supporting unit 900 are respectively connected to the above-mentioned Figures 1 to 3 The substrate loading unit 210, substrate unloading unit 220, substrate conveying unit 110, substrate polishing unit 500 and opposing support unit 900 are the same. Figure 5 as well as Figure 6 The substrate polishing section 500 may include the above Figure 2 The first to fourth airbags. Figure 5 as well as Figure 6 The first to fourth airbags included in the substrate polishing unit 500 can be always arranged in the same manner as the substrate 300 regardless of the relative position of the substrate 300 relative to the substrate polishing unit 500. Figure 4b The same pressure is maintained in the first airbag 521 to the fourth airbag 524.

[0086] The first support plate 601 and the second support plate 602 are provided so as to sandwich the substrate polishing unit 500. For example, the first support plate 601 and the second support plate 602 face each other in the X-axis direction with the substrate polishing unit 500 sandwiched therebetween.

[0087] The first support plate 601 is disposed adjacent to the first edge position 51 of the substrate polishing section 500, and the second support plate 602 is disposed adjacent to the second edge position 52 of the substrate polishing section 500. The first edge position 51 of the substrate polishing section 500 and the second edge position 52 of the substrate polishing section 500 face each other in the X-axis direction.

[0088] The first support plate 601 can move in the X-axis direction or the -X-axis direction. If the first support plate 601 moves in the X-axis direction, the first support plate 601 can be arranged at the lower side of the first edge position 41 of the polishing pad 540. The first support plate 601 arranged at the lower side of the first edge position 41 overlaps with the first edge position 41 of the polishing pad 540. The first support plate 601 arranged at the lower side of the first edge position 41 supports the first edge position 41 of the polishing pad 540. On the other hand, if the first support plate 601 moves in the -X-axis direction, the entirety of the polishing pad 540 including the first edge position 41 of the polishing pad 540 will not be supported by the first support plate 601. Here, the first edge position 41 of the polishing pad 540 corresponds to the first edge position 51 of the substrate polishing section 500 described above.

[0089] The second support plate 602 can move in the X-axis direction or the -X-axis direction. If the second support plate 602 moves in the -X-axis direction, the second support plate 602 can be arranged at the lower side of the second edge position 42 of the polishing pad 540. The second support plate 602 arranged at the lower side of the second edge position 42 overlaps with the second edge position 42 of the polishing pad 540. The second support plate 602 arranged at the lower side of the second edge position 42 supports the second edge position 42 of the polishing pad 540. On the other hand, if the second support plate 602 moves in the X-axis direction, the entirety of the polishing pad 540 including the second edge position 42 of the polishing pad 540 will not be supported by the second support plate 602. Here, the second edge position 42 of the polishing pad 540 corresponds to the second edge position 52 of the substrate polishing section 500 described above. The first edge position 41 of the polishing pad 540 and the second edge position 42 of the polishing pad 540 face each other in the X-axis direction.

[0090] The first support plate 601 and the second support plate 602 support or do not support the grinding plate 530 and the grinding pad 540 according to the relative position of the substrate 300 relative to the grinding plate 530. The movement of the first support plate 601 and the second support plate 602 in the X-axis and -X-axis directions can be controlled by the control unit.

[0091] Figures 7a to 9 It is used to illustrate the use of Figure 5 FIG. 2 is a diagram of a substrate polishing method of a substrate polishing apparatus 2000. Here, Figure 7b yes Figure 7a The cross-sectional view at the I-I' line, Figure 8b yes Figure 8a Cross-sectional view at line I-I'.

[0092] like Figure 7a as well as Figure 7bAs shown, the substrate 300 from the substrate loading unit 210 moves along the substrate conveying direction (i.e., the Y-axis direction) toward the substrate conveying unit 110. The substrate 300 on the substrate conveying unit 110 moves along the Y-axis direction with the conveyor belt 130. At this time, the downstream edge position D1 of the substrate 300 first overlaps with the upstream edge position U2 of the polishing pad 540.

[0093] As the substrate polishing section 500 descends in the -Z axis direction, the polishing pad 540 of the substrate polishing section 500 contacts the downstream edge position D1 of the substrate 300. At the same time, the first support plate 601 moves in the X axis direction and supports the first edge position 41 of the polishing pad 540, and the second support plate 602 moves in the -X axis direction and supports the second edge position 42 of the polishing pad 540. In other words, the first support plate 601 supports the lower surface of the first edge position 41 of the polishing pad 540, and the second support plate 602 supports the lower surface of the second edge position 42 of the polishing pad 540. At this time, the first support plate 601 contacts the lower surface of the first edge position 41 of the polishing pad 540, and the second support plate 602 contacts the lower surface of the second edge position 42 of the polishing pad 540. As the polishing pad 540 is supported by the first support plate 601 and the second support plate 602, the polishing plate 530 can be prevented from falling. On the other hand, the substrate polishing unit 500 moves alternately in the X-axis direction and the -X-axis direction while the polishing pad 540 is in contact with the substrate 300. As a result, the polishing pad 540 performs the same movement as the substrate polishing unit 500, thereby mechanically polishing the surface of the substrate 300 in contact with the polishing pad 540. At the same time, slurry 555a is supplied from the slurry supply unit 555 to the substrate 300, thereby chemically polishing the surface of the substrate 300.

[0094] As described above, when the downstream edge position D1 of the substrate 300 is located between the upstream edge position U3 of the grinding plate 530 and the center portion of the grinding plate 530, or the downstream edge position D1 of the substrate 300 is located at the upstream edge position U3 of the grinding plate 530, the first support plate 601 and the second support plate 602 are respectively arranged on the lower surface of the first edge position 41 of the grinding pad 540 and the lower surface of the second edge position 42 of the grinding pad 540.

[0095] Afterwards, if Figure 8a as well as Figure 8bAs shown, as the substrate 300 further moves along the substrate conveying direction (Y-axis direction), the downstream side edge position D1 of the substrate 300 can overlap with the center of the grinding plate 530 (or the grinding pad 540). At this time, the first support plate 601 moves in the -X axis direction, and the second support plate 602 moves in the X axis direction. As a result, the grinding pad 540 is not supported by the first support plate 601 and the second support plate 602. On the other hand, in a state where the grinding pad 540 and the substrate 300 are in contact, the substrate grinding unit 500 moves alternately in the X axis direction and the -X axis direction. Accompanying this, the grinding pad 540 performs the same movement as the substrate grinding unit 500, thereby the surface of the substrate 300 in contact with the grinding pad 540 is mechanically polished. At the same time, slurry 555a is provided to the substrate 300 from the slurry supply unit 555, so that the surface of the substrate 300 is chemically polished.

[0096] As described above, when the downstream edge position D1 of the substrate 300 is located at the center of the grinding plate 530, or the downstream edge position D1 of the substrate 300 is located at the downstream edge position D3 of the grinding plate 530, or the downstream edge position D1 of the substrate 300 is located between the center of the grinding plate 530 and the downstream edge position D3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the center of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the upstream edge position U3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located between the upstream edge position U3 of the grinding plate 530 and the center of the grinding plate 530, or the upstream edge position U3 and the downstream edge position D3 of the grinding plate 530 are located between the upstream edge position U1 of the substrate 300 and the downstream edge position D1 of the substrate 300, the first support plate 601 and the second support plate 602 are configured not to support the grinding pad 540.

[0097] Then, if Fig. 9 as well as Figure 7b As shown, as the substrate 300 further moves along the substrate conveying direction (Y-axis direction), the upstream edge position U1 of the substrate 300 may overlap with the downstream edge position D3 of the polishing plate 530 (or the polishing pad 540 ).

[0098] The downstream edge position D2 of the polishing pad 540 included in the substrate polishing section 500 contacts the upstream edge position U1 of the substrate 300. At the same time, the first support plate 601 moves in the X-axis direction to support the first edge position 41 of the polishing pad 540, and the second support plate 602 moves in the -X-axis direction to support the second edge position 42 of the polishing pad 540. In other words, the first support plate 601 supports the lower surface of the first edge position 41 of the polishing pad 540, and the second support plate 602 supports the lower surface of the second edge position 42 of the polishing pad 540. At this time, the first support plate 601 contacts the lower surface of the first edge position 41 of the polishing pad 540, and the second support plate 602 contacts the lower surface of the second edge position 42 of the polishing pad 540. As the polishing pad 540 is supported by the first support plate 601 and the second support plate 602, the polishing plate 530 can be prevented from falling. On the other hand, the substrate polishing unit 500 moves alternately in the X-axis direction and the -X-axis direction while the polishing pad 540 is in contact with the substrate 300. As a result, the polishing pad 540 performs the same movement as the substrate polishing unit 500, and the surface of the substrate 300 in contact with the polishing pad 540 is mechanically polished. At the same time, slurry 555a is supplied from the slurry supply unit 555 to the substrate 300, and the surface of the substrate 300 is chemically polished.

[0099] As described above, when the upstream edge position U1 of the substrate 300 is located between the center of the grinding plate 530 and the downstream edge position D3 of the grinding plate 530, or the upstream edge position U1 of the substrate 300 is located at the downstream edge position D3 of the grinding plate 530, the first support plate 601 and the second support plate 602 are respectively arranged on the lower surface of the first edge position 41 of the grinding pad 540 and the lower surface of the second edge position 42 of the grinding pad 540.

[0100] Then, as the substrate 300 further advances along the substrate transfer direction (Y-axis direction), the substrate 300 is transferred to the substrate unloading portion 220. Figures 7a to 9 In the process, the entire surface of the substrate 300 is grinded sequentially.

[0101] Fig.10 is a perspective view of a substrate polishing device 3000 according to another embodiment of the present invention. Fig.11 yes Fig.10 Cross-sectional view at line I-I'.

[0102] The substrate polishing device 3000 according to another embodiment of the present invention is a device for planarizing the surface of the substrate 300. Fig.10 as well as Fig.11As shown, it includes a substrate loading unit 210, a substrate unloading unit 220, a substrate conveying unit 110, a substrate polishing unit 500, an opposing support unit 900 and a slurry supply unit 555. At this time, Fig.10 The slurry supplying portion 555 is arranged to correspond to the conveyor belt 130 of the substrate conveying portion 110 .

[0103] The substrate conveying portion 110 includes a first roller 121 , a second roller 122 , a conveying belt 130 , a first auxiliary conveying belt 141 , and a second auxiliary conveying belt 142 .

[0104] The first roller 121 may rotate in a clockwise direction or a counterclockwise direction. To this end, the rotation axis of the first roller 121 may be connected to a motor that provides a rotation force in a clockwise direction or a counterclockwise direction. The first roller 121 may have a cylindrical shape.

[0105] The second roller 122 can rotate in a clockwise direction or a counterclockwise direction. To this end, the rotation axis of the second roller 122 can be connected to a motor that provides a rotation force in a clockwise direction or a counterclockwise direction. The second roller 122 can rotate in the same direction as the first roller 121. The second roller 122 can have a cylindrical shape.

[0106] The conveyor belt 130 may have a closed curve shape surrounding the center of the first roller 121, the center of the second roller 122, and the opposing support portion 900. The edge position of one side of the conveyor belt 130 is wound around the outer peripheral surface of the center of the first roller 121, and the edge position of the other side of the conveyor belt 130 is wound around the outer peripheral surface of the center of the second roller 122. The conveyor belt 130 can rotate in the same rotation direction as the first roller 121 and the second roller 122 by the rotation of the first roller 121 and the second roller 122. That is, the conveyor belt 130 can rotate in the same direction as the first roller 121 and the second roller 122 by the rotation force provided by the first roller 121 and the second roller 122. For example, the first roller 121, the second roller 122, and the conveyor belt 130 can rotate in the clockwise direction. The outer side surface of the conveyor belt 130 contacts the substrate 300, and in order to prevent the substrate 300 from slipping, the conveyor belt 130 can be formed of a rubber material.

[0107] The first auxiliary conveyor belt 141 may have a closed curve shape surrounding one side edge of the first roller 121 and one side edge of the second roller 122. One side edge of the first auxiliary conveyor belt 141 is wound around the outer circumference of one side edge of the first roller 121, and the other side edge of the first auxiliary conveyor belt 141 is wound around the outer circumference of one side edge of the second roller 122. The first auxiliary conveyor belt 141 may rotate in the same rotation direction as the first roller 121 and the second roller 122 by the rotation of the first roller 121 and the second roller 122. That is, the first auxiliary conveyor belt 141 may rotate in the same direction as the first roller 121 and the second roller 122 by the rotation force provided from the first roller 121 and the second roller 122. For example, the first roller 121, the second roller 122, and the first auxiliary conveyor belt 141 may rotate in the clockwise direction.

[0108] like Fig.11 As shown, the height H1 of the first auxiliary conveyor belt 141 is greater than the height H0 of the conveyor belt 130. For example, when the lower surface of the conveyor belt 130 in contact with the opposing support portion 900 is defined as a reference surface, the height H1 from the reference surface to the upper surface of the first auxiliary conveyor belt 141 in the Z-axis direction is greater than the height H0 from the reference surface to the upper surface of the conveyor belt 130 in the Z-axis direction. In addition, the height H1 of the first auxiliary conveyor belt 141 is less than the height H3 of the substrate 300. For example, the height H1 from the reference surface to the upper surface of the first auxiliary conveyor belt 141 in the Z-axis direction is less than the height H3 from the reference surface to the upper surface of the substrate 300 in the Z-axis direction.

[0109] The second auxiliary conveyor belt 142 may have a closed curve shape surrounding the other side edge position of the first roller 121 and the other side edge position of the second roller 122. One side edge position of the second auxiliary conveyor belt 142 is wound around the outer circumference of the other side edge position of the first roller 121, and the other side edge position of the second auxiliary conveyor belt 142 is wound around the outer circumference of the other side edge position of the second roller 122. The second auxiliary conveyor belt 142 may rotate in the same rotation direction as the first roller 121 and the second roller 122 by the rotation of the first roller 121 and the second roller 122. That is, the second auxiliary conveyor belt 142 may rotate in the same direction as the first roller 121 and the second roller 122 by the rotation force provided by the first roller 121 and the second roller 122. For example, the first roller 121, the second roller 122, and the second auxiliary conveyor belt 142 may rotate in the clockwise direction. The height H2 of the second auxiliary conveyor belt 142 is greater than the height H0 of the conveyor belt 130. For example, when the lower surface of the conveyor belt 130 in contact with the opposing support portion 900 is defined as a reference surface, the height H2 from the reference surface to the upper surface of the second auxiliary conveyor belt 142 in the Z-axis direction is greater than the height H0 from the reference surface to the upper surface of the conveyor belt 130 in the Z-axis direction. In addition, the height H2 of the second auxiliary conveyor belt 142 is smaller than the height H3 of the substrate 300. For example, the height H2 from the reference surface to the upper surface of the second auxiliary conveyor belt 142 in the Z-axis direction is smaller than the height H3 from the reference surface to the upper surface of the substrate 300 in the Z-axis direction. On the other hand, the height H2 of the second auxiliary conveyor belt 142 may be the same as the height H1 of the first auxiliary conveyor belt 141. For example, the height H1 from the reference surface to the upper surface of the first auxiliary conveyor belt 141 in the Z-axis direction may be the same as the height H2 from the reference surface to the upper surface of the second auxiliary conveyor belt 142 in the Z-axis direction.

[0110] use Fig.11 The substrate polishing method of the substrate polishing apparatus 3000 is substantially the same as that of the above-mentioned Figures 7a to 9The polishing method shown in the figure is the same. However, when the upstream edge position U2 of the polishing pad 540 contacts the downstream edge position D1 of the substrate 300, the polishing plate 530 does not fall onto the conveyor belt 130, but falls onto the first auxiliary conveyor belt 141 and the second auxiliary conveyor belt 142. Therefore, the polishing plate 530 does not contact the conveyor belt 130, but contacts the first auxiliary conveyor belt 141 and the second auxiliary conveyor belt 142. Therefore, the conveyor belt 130 can be prevented from being damaged. In addition, when the downstream edge position D2 of the polishing pad 540 contacts the upstream edge position U1 of the substrate 300, the polishing plate 530 does not fall onto the conveyor belt 130, but falls onto the first auxiliary conveyor belt 141 and the second auxiliary conveyor belt 142. Therefore, the polishing plate 530 does not contact the conveyor belt 130, but contacts the first auxiliary conveyor belt 141 and the second auxiliary conveyor belt 142. Therefore, the conveyor belt 130 can be prevented from being damaged.

[0111] Fig.12 is a perspective view of a substrate polishing unit 500 of a substrate polishing device according to another embodiment of the present invention. Fig.13 yes Fig.12 A cross-sectional view at line I-I' of Fig.14 It is used to illustrate Fig.12 FIG. 5 is a diagram showing the configuration relationship between the substrate polishing section 500 and the substrate 300 .

[0112] like Figure 12 to Figure 14 As shown, the substrate grinding unit 500 of the substrate grinding device according to other embodiments of the present invention includes a grinding plate 530, a plurality of auxiliary air bags 800, a protection plate 755, a first fixing unit 701 and a second fixing unit 702. On the other hand, the substrate grinding unit 500 according to other embodiments of the present invention may also include the above-mentioned Figure 2 The housing 510 and the first to fourth airbags 521 to 524 are provided.

[0113] The grinding plate 530 includes a base portion 531 , an extension portion 532 , a first protrusion 541 , and a second protrusion 542 . Fig.12 The base portion 531 and the extension portion 532 of the grinding plate 530 are the same as those of the above-mentioned Figure 1 The base portion 531 and the extension portion 532 are the same.

[0114] The first protrusion 541 protrudes from the upstream edge position U3 of the extending portion 532 in the −Z axis direction.

[0115] The second protrusion 542 protrudes from the downstream side edge position D3 of the extending portion 532 in the −Z axis direction.

[0116] A plurality of auxiliary airbags 800 are arranged between the grinding plate 530 and the protective plate 755. For example, a plurality of auxiliary airbags 800 are arranged between the extension portion 532 of the grinding plate 530 and the protective plate 755. At this time, a plurality of auxiliary airbags 800 are arranged between the first protrusion 541 and the second protrusion 542 of the extension portion 532. The plurality of auxiliary airbags 800 are arranged in a row along the extension portion 532. For example, the plurality of auxiliary airbags 800 are arranged in a row along the X-axis direction. The plurality of auxiliary airbags 800 can be arranged at certain intervals. The plurality of auxiliary airbags 800 can have different pressures. The pressure of each of these plurality of auxiliary airbags 800 can be controlled by the above-mentioned control unit.

[0117] When the height difference of the surface of the substrate 300 in the X-axis direction is large, the polishing pad 540 having parallel surfaces in the X-axis direction may not be completely and tightly attached to the surface of the substrate 300 in the X-axis direction. In this case, the surface of the substrate 300 in the X-axis direction may not be properly polished. The multiple auxiliary airbags 800 arranged along the X-axis direction can be controlled to have different pressures, thereby improving the adhesion between the polishing pad 540 and the surface of the substrate 300 in the X-axis direction. For example, Fig.14 In the surface of the substrate 300 shown, when the edge positions on both sides have a relatively low height (or thickness) compared to other parts, the auxiliary airbags arranged at the outermost left side and the auxiliary airbags arranged at the outermost right side can be controlled to have a higher pressure than other auxiliary airbags. In this case, the pressure of the outermost auxiliary airbag increases, so that the part of the grinding pad 540 corresponding to the outermost auxiliary airbag can protrude further in the -Z axis direction than other parts. With this, the edge positions on both sides of the substrate 300 and the parts of the grinding pad 540 corresponding thereto can be correctly and tightly fitted.

[0118] The protection plate 755 is disposed between the plurality of auxiliary air bags 800 and the polishing pad 540 . The protection plate 755 protects the plurality of auxiliary air bags 800 .

[0119] The first fixing portion 701 is disposed at the upstream edge position U3 of the extension portion 532 and the upstream edge position U5 of the protection plate 755. The first fixing portion 701 may be attached to the upstream edge position U3 of the extension portion 532 and the upstream edge position U5 of the protection plate 755 using an adhesive. The first fixing portion 701 may have a bar shape extending in the X-axis direction.

[0120] The second fixing portion 702 is disposed at the downstream edge position D3 of the extension portion 532 and the downstream edge position D5 of the protection plate 755. The second fixing portion 702 may be attached to the downstream edge position D3 of the extension portion 532 and the downstream edge position D5 of the protection plate 755 using an adhesive. The second fixing portion 702 may have a bar shape extending in the X-axis direction.

[0121] on the other hand, Fig.13 The structure of the substrate polishing section can be applied to Figure 1 The substrate polishing device 1000, Figure 5 The substrate polishing device 2000 and Fig.10 A substrate polishing device 3000 is provided.

[0122] The present invention described above is not limited to the above embodiments and drawings, and those skilled in the art to which the present invention belongs should be able to appreciate that various substitutions, deformations and changes can be made without departing from the technical concept of the present invention.

Claims

1. A substrate polishing device, comprising: A substrate conveying unit, for conveying a substrate; as well as The substrate polishing section includes a polishing plate disposed on the substrate conveying section and a polishing pad disposed on the lower surface of the polishing plate. controlling the grinding plate to tilt toward the substrate at a predetermined angle based on a relative position of an edge of the substrate relative to an edge of the grinding plate or a relative position of an edge of the substrate relative to a center of the grinding plate, When the downstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center portion of the grinding plate or located at the upstream edge position of the grinding plate, the grinding plate is inclined so that the downstream edge position of the grinding plate is located at a higher position than the upstream edge position of the grinding plate. When the upstream edge position of the substrate is located between the center portion of the grinding plate and the downstream edge position of the grinding plate or at the downstream edge position of the grinding plate, the grinding plate is tilted so that the upstream edge position of the grinding plate is located at a higher position than the downstream edge position of the grinding plate.

2. The substrate polishing device according to claim 1, wherein: When the downstream edge position of the substrate is located at the center of the grinding plate, or the downstream edge position of the substrate is located at the downstream edge position of the grinding plate, or the downstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate, or the upstream edge position of the substrate is located at the center of the grinding plate, or the upstream edge position of the substrate is located at the upstream edge position of the grinding plate, or the upstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate, or the upstream edge position of the grinding plate and the downstream edge position of the grinding plate are located between the upstream edge position of the substrate and the downstream edge position of the substrate, the grinding plate is configured to be parallel to the substrate.

3. The substrate polishing device according to claim 1, wherein: The substrate grinding section further includes: a housing; and a plurality of air bags, which are arranged in the housing and are used to control the inclination of the grinding plate. The polishing plate includes: a base portion disposed in the housing; and an extension portion protruding from the base portion and extending toward the polishing pad through a hole of the housing.

4. The substrate polishing device according to claim 3, wherein: The plurality of air bags include: A first airbag is disposed between the upper inner side surface of the shell and the upstream edge position of the base portion; A second airbag is disposed between the lower inner side surface of the shell and the upstream edge position of the base portion; a third airbag disposed between the upper inner side surface of the housing and the downstream edge position of the base portion; and The fourth airbag is disposed between the lower inner side surface of the outer shell and the downstream edge position of the base portion.

5. The substrate polishing device according to claim 4, wherein: When the downstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center portion of the grinding plate or at the upstream edge position of the grinding plate, the first airbag has a greater pressure than the third airbag, and the second airbag has a smaller pressure than the fourth airbag.

6. The substrate polishing device according to claim 4, wherein: When the upstream edge position of the substrate is located between the center portion of the grinding plate and the downstream edge position of the grinding plate or at the downstream edge position of the grinding plate, the first airbag has a smaller pressure than the third airbag, and the second airbag has a larger pressure than the fourth airbag.

7. The substrate polishing device according to claim 4, wherein: When the downstream edge position of the substrate is located at the center of the grinding plate, or the downstream edge position of the substrate is located at the downstream edge position of the grinding plate, or the downstream edge position of the substrate is located between the center of the grinding plate and the downstream edge position of the grinding plate, or the upstream edge position of the substrate is located at the center of the grinding plate, or the upstream edge position of the substrate is located at the upstream edge position of the grinding plate, or the upstream edge position of the substrate is located between the upstream edge position of the grinding plate and the center of the grinding plate, or the upstream edge position of the grinding plate and the downstream edge position of the grinding plate are located between the upstream edge position of the substrate and the downstream edge position of the substrate, the first airbag and the third airbag have the same pressure, and the second airbag and the fourth airbag have the same pressure.

8. The substrate polishing device according to claim 3, wherein: The substrate polishing section further includes: a plurality of auxiliary air bags disposed between the base portion and the polishing pad, and the plurality of auxiliary air bags are arranged in a direction intersecting a substrate conveying direction.

9. The substrate polishing device according to claim 8, wherein: The pressure of each of the plurality of auxiliary airbags is controlled individually.

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