Substrate Fixing Device

Abstract

The present invention provides a substrate fixing device, which comprises: a bottom plate, which has a gas supply part inside; and an electrostatic chuck, which is arranged on the bottom plate. The electrostatic chuck comprises: a base body, one surface of which is a bearing surface of an adsorbed object; and an insertion hole penetrating the base body, and an internal thread is formed on the inner side surface. A screw-in component with an external thread formed on the side surface is screwed into the insertion hole, and gas can be supplied from the gas supply part to the bearing surface via the screw-in component.

Description

Technical Field

[0001] The invention relates to a substrate fixing device. Background Art

[0002] Conventionally, a film forming apparatus (eg, a CVD apparatus, a PVD apparatus, etc.) or a plasma etching apparatus used in manufacturing semiconductor devices such as ICs and LSIs generally has a stage for holding a wafer with high precision in a vacuum processing chamber.

[0003] As such a stage, for example, a substrate fixing device is proposed that uses an electrostatic chuck mounted on a base plate to adsorb and hold a wafer as an adsorption object. As an example of a substrate fixing device, a device having a structure provided with a gas supply unit for cooling the wafer can be cited. The gas supply unit can supply gas to the surface of the electrostatic chuck through a gas flow path inside the base plate and a gas discharge unit (through hole) provided on the electrostatic chuck.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] (Japan) Patent No. 6420937

[0007] [Technical issues to be solved]

[0008] However, when the substrate fixing device is applied to a plasma etching device, abnormal discharge may be generated while etching the wafer and transmitted along the gas supply portion of the electrostatic chuck, causing damage to the wafer and / or the plasma etching device itself.

[0009] As a countermeasure for abnormal discharge, research has been conducted on reducing the diameter of the gas exhaust portion. However, if the diameter of the gas exhaust portion is reduced, etching byproducts and the like can easily clog the gas exhaust portion and are extremely difficult to remove, so the maintainability is poor and this is not a practical countermeasure. Summary of the invention

[0010] The present invention is proposed in view of the above-mentioned problems, and an object of the present invention is to provide a substrate fixing device having a countermeasure against abnormal discharge with good maintainability.

[0011] [Technical solution]

[0012] The substrate fixing device comprises: a base plate, which has a gas supply unit inside; and an electrostatic chuck, which is arranged on the base plate. The electrostatic chuck comprises: a base body, one surface of which is a bearing surface for an adsorbed object; and an insertion hole, which penetrates the base body and has a female screw on the inner side surface. A screw-in component with a male screw on the side surface is screwed into the insertion hole. Gas can be supplied from the gas supply unit to the bearing surface via the screw-in component.

[0013] [Beneficial Effects]

[0014] According to the disclosed technology, it is possible to provide a substrate fixing device having a countermeasure against abnormal discharge with excellent maintainability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A-1B This is a schematic cross-sectional view of the substrate fixing device according to the first embodiment.

[0016] Figure 2A-2D This is an illustration of the shape of the screw-in component.

[0017] Figure 3A-3B It is a schematic cross-sectional view showing an example of a substrate fixing device according to a second embodiment.

[0018] Figure 4 yes Figure 3B An enlarged partial cross-sectional view of the vicinity of the screw-in component.

[0019] Figure 5A-Figure 5B It is a schematic cross-sectional view of a substrate fixing device according to a third embodiment.

[0020] Figure 6A-6B It is a schematic cross-sectional view of a substrate fixing device according to a fourth embodiment.

[0021] Figure 7A-7B It is a schematic cross-sectional view of a substrate fixing device according to a fifth embodiment.

[0022] Figure 8A-8B It is a simplified cross-sectional view showing an example of a substrate fixing device according to a sixth embodiment.

[0023] Wherein, the accompanying drawings are described as follows:

[0024] 1, 2, 3, 4, 5, 6 Substrate fixing device

[0025] 10. Bottom Plate

[0026] 10a, 60a, 61a, 62a, 63a upper surface

[0027] 10b Lower surface

[0028] 11 Gas supply unit

[0029] 15 Cooling mechanism

[0030] 20 Adhesive layer

[0031] 30 Electrostatic chuck

[0032] 31 Matrix

[0033] 31a Bearing surface

[0034] 32 Electrostatic Electrode

[0035] 60, 61, 62, 63 Screw-in components

[0036] 64 Insert parts

[0037] 101, 102, 103 concavity

[0038] 111 Gas flow path

[0039] 112 Gas injection unit

[0040] 113 Gas exhaust part

[0041] 151 Refrigerant flow path

[0042] 152 Refrigerant inlet

[0043] 153 Refrigerant discharge part

[0044] 311, 312 Insertion holes

[0045] 601, 602 through hole

[0046] 611 Spherical oxide ceramic particles

[0047] 612 Mixed oxides

[0048] 621, 631 Threaded part

[0049] 622, 632 Cylinder

[0050] Slots 651 and 652 DETAILED DESCRIPTION

[0051] Hereinafter, the mode for implementing the present invention will be described with reference to the drawings. It should be noted that in each figure, the same components are given the same reference numerals and the repeated description may be omitted.

[0052] <First Embodiment>

[0053] Figure 1A-1B is a schematic cross-sectional view of a substrate fixing device according to a first embodiment. Figure 1A For the overall picture, Figure 1B for Figure 1A A partial enlarged view of part A. Figure 1A-1B As can be seen, the substrate fixing device 1 includes a base plate 10 , an adhesive layer 20 , and an electrostatic chuck 30 as main components.

[0054] The base plate 10 is a component for mounting the electrostatic chuck 30. The thickness of the base plate 10 is, for example, about 20 to 40 mm. The base plate 10 is, for example, formed of aluminum and can be used as an electrode for controlling plasma. By supplying a predetermined high-frequency power to the base plate 10, the energy for causing the generated ions in a plasma state to collide with the wafer adsorbed on the electrostatic chuck 30 can be controlled, thereby enabling efficient etching processing.

[0055] A gas supply unit 11 is provided inside the base plate 10 . The gas supply unit 11 includes a gas flow path 111 , a gas injection unit 112 , and a gas discharge unit 113 .

[0056] The gas flow path 111 is, for example, a hole formed in an annular shape inside the base plate 10. The gas injection portion 112 is a hole whose one end is connected to the gas flow path 111 and whose other end is exposed to the outside from the lower surface 10b of the base plate 10, and an inert gas (for example, He, Ar, etc.) can be introduced into the gas flow path 111 from the outside of the substrate fixing device 1. The gas exhaust portion 113 is a hole whose one end is connected to the gas flow path 111 and whose other end is exposed to the outside from the upper surface 10a of the base plate 10 and penetrates the adhesive layer 20, and the inert gas introduced into the gas flow path 111 can be exhausted. The gas exhaust portions 113 are dispersed on the upper surface 10a of the base plate 10 in a plan view. The number of the gas exhaust portions 113 can be appropriately determined according to needs, for example, it can be dozens to hundreds.

[0057] It should be noted that the plan view refers to a view when the object is observed along the normal direction of the upper surface 10 a of the base plate 10 , and the planar shape refers to the shape of the object when it is observed along the normal direction of the upper surface 10 a of the base plate 10 .

[0058] A cooling mechanism 15 is provided inside the base plate 10. The cooling mechanism 15 includes a refrigerant flow path 151, a refrigerant inlet portion 152, and a refrigerant discharge portion 153. The refrigerant flow path 151 is, for example, a hole formed in an annular shape inside the base plate 10. The refrigerant inlet portion 152 is a hole whose one end is connected to the refrigerant flow path 151 and whose other end is exposed to the outside from the lower surface 10b of the base plate 10, and a refrigerant (for example, cooling water, heat transfer liquid (galden) etc.) can be introduced into the refrigerant flow path 151 from the outside of the substrate fixing device 1. The refrigerant discharge portion 153 is a hole whose one end is connected to the refrigerant flow path 151 and whose other end is exposed to the outside from the lower surface 10b of the base plate 10, and the refrigerant introduced into the refrigerant flow path 151 can be discharged.

[0059] The cooling mechanism 15 is connected to a refrigerant control device (not shown) provided outside the substrate fixing device 1. The refrigerant control device (not shown) can introduce the refrigerant into the refrigerant flow path 151 from the refrigerant introduction portion 152, and can discharge the refrigerant from the refrigerant discharge portion 153. By making the cooling mechanism 15 circulate the refrigerant to cool the base plate 10, the wafer adsorbed on the electrostatic chuck 30 can be cooled.

[0060] The electrostatic chuck 30 is a part that sucks and holds a wafer as a suction target. The planar shape of the electrostatic chuck 30 is, for example, circular. The diameter of the wafer as a suction target of the electrostatic chuck 30 is, for example, 8, 12, or 18 inches.

[0061] The electrostatic chuck 30 is provided on the upper surface 10a of the base plate 10 via the adhesive layer 20. The adhesive layer 20 is, for example, a silicone adhesive. The thickness of the adhesive layer 20 is, for example, about 0.1 to 1.0 mm. The adhesive layer 20 can bond the electrostatic chuck 30 and the base plate 10, and has the effect of reducing the stress generated by the difference in thermal expansion coefficient between the ceramic electrostatic chuck 30 and the aluminum base plate 10.

[0062] The electrostatic chuck 30 includes a base 31 and an electrostatic electrode 32. The upper surface of the base 31 is a support surface 31a for an adsorbed object. The electrostatic chuck 30 is, for example, a Johnsen-Rahbeck electrostatic chuck. However, the electrostatic chuck 30 may also be a Coulomb force electrostatic chuck.

[0063] The substrate 31 is a dielectric, and ceramics such as alumina (Al2O3) and aluminum nitride (AlN) can be used as the substrate 31. The thickness of the substrate 31 is, for example, about 1 to 5 mm, and the relative permittivity (1 kHz) of the substrate 31 is, for example, about 9 to 10.

[0064] The electrostatic electrode 32 is a thin film electrode and is built into the base 31. The electrostatic electrode 32 is connected to a power source provided outside the substrate fixing device 1. When a predetermined voltage is applied from the power source, an adsorption force based on static electricity is generated between the electrostatic electrode 32 and the wafer. Accordingly, the wafer can be adsorbed and held on the carrying surface 31a of the base 31 of the electrostatic chuck 30. As for the adsorption and holding force, the higher the voltage applied to the electrostatic electrode 32, the stronger it is. The electrostatic electrode 32 can be in a monopolar shape or a bipolar shape. As the material of the electrostatic electrode 32, for example, tungsten, molybdenum, etc. can be used.

[0065] A heating element may be disposed inside the base 31 . When a voltage is applied from the outside of the substrate fixing device 1 , the heating element generates heat and heats the support surface 31 a of the base 31 to a predetermined temperature.

[0066] An insertion hole 311 is provided at a position of the base 31 corresponding to each gas exhaust portion 113, which penetrates the base 31 and exposes the other end of the gas exhaust portion 113. The planar shape of the insertion hole 311 is, for example, a circle with an inner diameter of about 2 to 5 mm. The insertion hole 311 can be formed, for example, by drilling, laser processing, etc. An internal thread is provided (cut) on the inner side surface of the insertion hole 311, and the screw-in component 60 can be screwed in and out.

[0067] Figure 2A-2D is an example of the shape of the screwed-in component. Figure 2A As shown, the screw-in component 60 is a cylindrical component formed of ceramics such as aluminum oxide and aluminum nitride, and has an external thread on the side. When the substrate fixing device 1 is used, the screw-in component 60 is screwed into the insertion hole 311. When the substrate fixing device 1 is maintained, there is a situation where the screw-in component 60 is screwed out (removed) from the insertion hole 311. It should be noted that screw connection refers to a state in which the external thread formed on the first component and the internal thread formed on the second component are meshed with each other, thereby the first component and the second component are combined.

[0068] The screw-in component 60 is formed with a through hole 601 having one end opening on the bearing surface 31a of the base 31 and the other end communicating with the gas discharge portion 113 of the gas supply portion 11. The planar shape of the through hole 601 is, for example, circular. The diameter φ1 of the screw-in component 60 is, for example, about 2 to 5 mm. The diameter φ2 of the through hole 601 is less than 0.1 mm, preferably about 0.05 mm.

[0069] The through hole 601 of the screw-in component 60 screwed into the insertion hole 311 is connected to the gas discharge portion 113 of the gas supply portion 11, so that the gas can be supplied from the gas supply portion 11 to the bearing surface 31a of the base 31 through the through hole 601. The upper surface 60a of the screw-in component 60 is, for example, coplanar (coplanar) with the bearing surface 31a of the base 31.

[0070] For example, Figure 2B As shown, a slot 651 of a straight line is provided on the upper surface 60a of the screw-in component 60. By placing a straight-line screwdriver in the slot 651 and rotating the screw-in component 60, the screw-in component 60 can be screwed into the insertion hole 311 or screwed out of the insertion hole 311.

[0071] For example, Figure 2C As shown, a cross-shaped groove 652 may also be provided on the upper surface 60a of the screw-in component 60. In this case, the screw-in component 60 may be screwed into the insertion hole 311 or may be screwed out of the insertion hole 311 by placing a cross screwdriver or a flat-blade screwdriver into the groove 652 and rotating the screw-in component 60.

[0072] For example, Figure 2D As shown, a pair of notches 653 arranged opposite to each other with the through hole 601 sandwiched therebetween may be provided at the outer periphery of the upper surface 60a of the screw-in component 60. In this case, by inserting a special tool (jaw) for rotation into the pair of notches 653 and rotating the screw-in component 60, the screw-in component 60 can be screwed into the insertion hole 311 or screwed out of the insertion hole 311.

[0073] It should be noted that any structure that can be provided on the portion of the screw-in component 60 exposed on the bearing surface 31a and can rotate the screw-in component 60 is sufficient, that is, the structure for rotating the screw-in component 60 is not limited to Figure 2B to Figure 2D In other words, any structure for rotating the screw-in member 60 may be provided on the portion of the screw-in member 60 exposed on the bearing surface 31a.

[0074] When manufacturing the screw-in member 60, first, a paste is prepared as a precursor of the screw-in member 60. The paste may contain, for example, aluminum oxide particles and / or aluminum nitride particles at a predetermined weight ratio.

[0075] Then, prepare a linear component with a diameter of less than 0.1 mm. Next, put the paste into a cylindrical mold for forming the screw-in component 60 and form it. At this time, make the linear component pass through the central part of the length direction of the paste. Thereafter, the formed paste is sintered and the linear component is pulled out. Accordingly, a cylindrical (hollow noodle (macaroni)) shaped component having a through hole of less than 0.1 mm in the central part of the length direction can be formed. The component is cut (truncated) into a predetermined length, and an external thread is formed on the side, thereby making the screw-in component 60.

[0076] According to the inventor's research results, if the diameter of the hole opened by the gas supply unit 11 on the supporting surface 31a of the substrate 31 is large, abnormal discharge may occur through the gas supply unit 11. In this regard, by making the diameter of the hole opened by the gas supply unit 11 on the supporting surface 31a of the substrate 31 to be 0.1 mm or less, abnormal discharge occurring through the gas supply unit 11 can be suppressed.

[0077] In the substrate fixing device 1, the screw-in component 60 having a through hole 601 with a diameter of 0.1 mm or less is screwed into the insertion hole 311 formed on the base 31. That is, the diameter of the through hole 601 of the portion opened on the bearing surface 31a of the base 31 is 0.1 mm or less, so that the abnormal discharge generated by the gas supply unit 11 can be suppressed. It should be noted that a plurality of through holes 601 with a diameter of 0.1 mm or less can be provided on one screw-in component 60 as needed.

[0078] In addition, the screw-in component 60 is fixed in the insertion hole 311 in a state where it can be loaded and unloaded (screwed in and out). Therefore, when there is a problem with the screw-in component 60, such as when a foreign object blocks the through hole 601, the screw-in component 60 can be simply removed and replaced with a new screw-in component 60. In the prior art, as long as a gas exhaust part 113 has a problem, the entire electrostatic chuck 30 becomes a defective product, which will cause a great loss in terms of cost. However, in terms of the substrate fixing device 1, since the screw-in component 60 can be easily replaced, it has a great advantage from the perspective of cost and life.

[0079] It should be noted that, in theory, the substrate fixing device 1 may not use the screw-in component 60, but directly form a through hole 601 with a diameter of less than 0.1 mm on the base 31. However, in reality, it is extremely difficult to set a plurality of through holes 601 with a diameter of less than 0.1 mm on the base 31, which is also the main reason for the low yield and high cost. In addition, when the substrate fixing device 1 is used in a dry etching device, etc., once the etching byproducts and the like block the through hole 601, it is extremely difficult to remove it. That is, the measure of directly forming a through hole 601 with a diameter of less than 0.1 mm on the base 31 is not a practical measure that can deal with abnormal discharge caused by the gas supply unit 11. By fixing the screw-in component 60 with a through hole 601 with a diameter of less than 0.1 mm in the insertion hole 311 in a removable state, these problems can be solved, and a substrate fixing device 1 with a better maintainability and a countermeasure for abnormal discharge can be provided.

[0080] <Second Embodiment>

[0081] The second embodiment exemplifies a substrate fixing device having a screw-in member different from that of the first embodiment. It should be noted that in the second embodiment, descriptions of components identical to those of the embodiments already described may be omitted.

[0082] Figure 3A-3B is a schematic cross-sectional view of a substrate fixing device according to a second embodiment. Figure 3A For the overall picture, Figure 3B for Figure 3A A partial enlarged view of part B. Figure 3A-3B It can be seen that the substrate fixing device 2 is different from the substrate fixing device 1 (see Figure 1A-1B )different.

[0083] The screw-in component 61 has an external thread on its side surface and is screwed into the insertion hole 311 having an internal thread on its inner side surface. The upper surface 61a of the screw-in component 61 is coplanar with the bearing surface 31a of the base 31, for example.

[0084] The upper surface 61a of the screw-in component 61 is provided with Figure 2B to Figure 2D Any one structure in or be used for making other arbitrary structure of screwing into component 61 rotation. For this reason, screwing into component 61 can be screwed in the insertion hole 311 when necessary, and also can be screwed out from insertion hole 31.

[0085] Unlike the screw-in member 60, the screw-in member 61 is formed of a porous body mainly composed of ceramics such as aluminum oxide and aluminum nitride. The content of ceramics such as aluminum oxide and aluminum nitride in the screw-in member 61 can be set to, for example, 80% by weight to 97% by weight. Since the porous body constituting the screw-in member 61 allows gas to pass through, the screw-in member 61 does not have a through hole corresponding to the through hole 601 of the screw-in member 60.

[0086] Figure 4 yes Figure 3B A partial enlarged cross-sectional view of the screw-in component. Figure 4 As shown, the porous screw-in member 61 includes a plurality of spherical oxide ceramic particles 611 and a mixed oxide 612 that bonds and integrates the plurality of spherical oxide ceramic particles 611 .

[0087] The diameter of the spherical oxide ceramic particles 611 is, for example, in the range of 30 μm to 1000 μm. A preferred example of the spherical oxide ceramic particles 611 is spherical aluminum oxide particles. The spherical oxide ceramic particles 611 are preferably contained in the screw-in component 61 at a weight ratio of 80 wt % or more (97 wt % or less).

[0088] The mixed oxide 612 is fixed to a part of the outer surface (spherical surface) of the plurality of spherical oxide ceramic particles 611 and supports the particles. The mixed oxide 612 is formed of two or more oxides selected from silicon (Si), magnesium (Mg), calcium (Ca), aluminum (Al) and yttrium (Y), for example.

[0089] Pores P are formed inside the screw-in component 61. The pores P extend from the lower side of the screw-in component 61 toward the upper side and communicate with the outside in a manner that allows gas to pass through. The porosity of the pores P formed in the screw-in component 61 is preferably in the range of 20% to 50% of the entire volume of the screw-in component 61. A portion of the outer surface of the spherical oxide ceramic particles 611 and the mixed oxide 612 are exposed on the inner surface of the pores P.

[0090] When manufacturing the screw-in component 61, first, a paste is prepared as a precursor of the screw-in component 61. The paste contains, for example, spherical aluminum oxide particles at a predetermined weight ratio. The remainder of the paste contains, for example, oxides of five components including silicon, magnesium, calcium, aluminum, and yttrium, and further contains an organic binder and / or a solvent. As an organic binder, for example, polyvinyl butyral can be used. As a solvent, for example, ethanol can be used.

[0091] Then, the paste is placed in a cylindrical mold for forming the screw-in component 61 and formed. Thereafter, the formed paste is fired at a predetermined temperature, cut into a predetermined length, and then an external thread is formed on the side surface, thereby manufacturing the screw-in component 61.

[0092] As described above, if the diameter of the hole opened by the gas supply unit 11 on the mounting surface 31 a of the base 31 is large, abnormal discharge may occur through the gas supply unit 11 .

[0093] In the substrate fixing device 2, the screw-in component 61 of the porous body is screwed into the insertion hole 311 formed on the base 31. No through hole is formed on the screw-in component 61, and gas can be supplied from the gas supply unit 11 to the support surface 31a of the base 31 through the multiple connected gas holes P. In this way, since there is no through hole opened on the support surface 31a of the base 31 in the substrate fixing device 2, abnormal discharge generated by the gas supply unit 11 can be suppressed.

[0094] Furthermore, the screw-in component 61 is fixed in the insertion hole 311 in a removable state. Therefore, when a problem occurs in the screw-in component 61, such as when a part of the air hole P is blocked by foreign matter, the screw-in component 61 can be simply removed and replaced with a new screw-in component 61. In the prior art, as long as a problem occurs in one gas exhaust portion 113, the entire electrostatic chuck 30 becomes a defective product, which will cause a great loss in terms of cost. However, in the substrate fixing device 2, since the screw-in component 61 can be easily replaced, it has a great advantage from the perspective of cost and life.

[0095] <Third Embodiment>

[0096] The third embodiment exemplifies a substrate fixing device having a screw-in member different from the first and second embodiments. It should be noted that in the third embodiment, descriptions of components identical to those of the embodiments already described may be omitted.

[0097] Figure 5A-Figure 5B is a schematic cross-sectional view of a substrate fixing device according to a third embodiment. Figure 5A For the overall picture, Figure 5B for Figure 5A A partial enlarged view of part C of the Figure 5A-Figure 5B It can be seen that the substrate fixing device 3 is different from the substrate fixing device 1 (see Figure 1A-1B )different.

[0098] An insertion hole 312 is provided at a position of the base 31 corresponding to each gas exhaust portion 113, which penetrates the base 31 and the adhesive layer 20 and exposes the other end of the gas exhaust portion 113. The planar shape of the insertion hole 312 is, for example, a circle with an inner diameter of about 2 to 5 mm. The insertion hole 312 can be formed, for example, by drilling, laser processing, etc. No internal thread is formed on the inner side surface of the insertion hole 312.

[0099] At the position corresponding to each gas discharge part 113 on the upper surface 10a side of the bottom plate 10, a recessed part 101 (counter hole) is provided, the opening side of which is connected to the insertion hole 312 and the bottom surface of which exposes the other end of the gas discharge part 113. The planar shape of the recessed part 101 is, for example, a circle with an inner diameter of about 2 to 5 mm. The recessed part 101 can be formed, for example, by drilling processing, laser processing, etc. An internal thread is formed on the inner side surface of the recessed part 101.

[0100] The screw-in component 62 is, for example, a component formed of ceramics such as aluminum oxide and aluminum nitride. The screw-in component 62 includes a threaded portion 621 and a cylindrical portion 622 continuously formed at the end of the length direction of the threaded portion 621. In the screw-in component 62, an external thread is formed on the side of the threaded portion 621, but no thread is provided on the side of the cylindrical portion 622. That is, in the screw-in component 62, an external thread is formed on the side of the base plate 10 side, and no external thread is provided on the side of the electrostatic chuck 30 side. When the substrate fixing device 3 is used, the screw-in component 62 is screwed into the connected insertion hole 312 and the recess 101. When the substrate fixing device 3 is maintained, there is a case where the screw-in component 62 is taken out (screwed out) from the connected insertion hole 312 and the recess 101.

[0101] It should be noted that the threaded portion 621 is screwed into the recess 101 having an internal thread formed on the inner side surface, but the cylindrical portion 622 is only inserted into the insertion hole 312 and is not fixed. The side surface of the cylindrical portion 622 and the inner side surface of the insertion hole 312 are in contact with each other or there is a very small clearance between the two.

[0102] The screw-in component 62 is formed with a through hole 602 whose one end is opened on the bearing surface 31a of the base 31 and the other end is connected to the gas discharge portion 113 of the gas supply portion 11. The planar shape of the through hole 602 is, for example, circular. The diameter of the screw-in component 62 is, for example, about 2 to 5 mm. The diameter of the through hole 602 is 0.1 mm or less, preferably about 0.05 mm.

[0103] The through hole 602 of the screw-in component 62 screwed into the connected insertion hole 312 and the recess 101 is connected to the gas discharge portion 113 of the gas supply portion 11, so that the gas can be supplied from the gas supply portion 11 to the bearing surface 31a of the base 31 through the through hole 602. The upper surface 62a of the screw-in component 62 is, for example, coplanar with the bearing surface 31a of the base 31.

[0104] The upper surface 62a of the screw-in component 62 is provided with Figure 2B to Figure 2D Any one of the structures or any other arbitrary structure for rotating the screw-in component 62. To this end, the screw-in component 62 can be screwed into the connected insertion hole 312 and the recess 101 when necessary, and can also be screwed out from the connected insertion hole 312 and the recess 101. The manufacturing method of the screw-in component 62 is basically the same as the manufacturing method of the screw-in component 60.

[0105] As described above, if the diameter of the hole opened by the gas supply unit 11 on the mounting surface 31 a of the base 31 is large, abnormal discharge may occur through the gas supply unit 11 .

[0106] In the substrate fixing device 3, the screw-in component 62 having a through hole 602 with a diameter of 0.1 mm or less is screwed into the insertion hole 312 and the recess 101. That is, the diameter of the through hole 602 of the portion opened on the bearing surface 31a of the base 31 is 0.1 mm or less, so that the abnormal discharge generated by the gas supply unit 11 can be suppressed. It should be noted that a plurality of through holes 602 with a diameter of 0.1 mm or less can be provided on one screw-in component 62 as needed.

[0107] Furthermore, the screw-in component 62 is fixed in the insertion hole 312 and the recess 101 in a removable state. Therefore, when a problem occurs with the screw-in component 62, such as when a foreign object blocks the through hole 602, the screw-in component 62 can be simply removed and replaced with a new screw-in component 62. In the prior art, as long as a problem occurs in one gas exhaust portion 113, the entire electrostatic chuck 30 becomes a defective product, which results in a great loss in terms of cost. However, in the substrate fixing device 3, since the screw-in component 62 can be easily replaced, it has a great advantage in terms of cost and life.

[0108] <Fourth Implementation Method>

[0109] The fourth embodiment exemplifies a substrate fixing device having a screw-in member different from the first to third embodiments. In the fourth embodiment, description of the same components as those in the embodiments already described may be omitted.

[0110] Figure 6A-6B is a schematic cross-sectional view of a substrate fixing device according to a fourth embodiment. Fig. 6A For the overall picture, Figure 6B for Fig. 6A A partial enlarged view of part D of FIG. Figure 6A-6B It can be seen that the substrate fixing device 4 is different from the substrate fixing device 3 (see Figure 5A-Figure 5B )different.

[0111] The screw-in component 63 includes a threaded portion 631 and a cylindrical portion 632 continuously formed at the end of the threaded portion 631 in the longitudinal direction. In the screw-in component 63, an external thread is formed on the side of the threaded portion 631, but no thread is provided on the side of the cylindrical portion 632. That is, with respect to the screw-in component 63, an external thread is provided on the side of the base plate 10 side, and no external thread is formed on the side of the electrostatic chuck 30 side. When the substrate fixing device 4 is used, the screw-in component 63 is screwed into the connected insertion hole 312 and the recess 101. When the substrate fixing device 4 is maintained, there is a case where the screw-in component 63 is taken out (screwed out) from the connected insertion hole 312 and the recess 101.

[0112] It should be noted that the threaded portion 631 is screwed into the recess 101 having an internal thread on the inner side surface, but the cylindrical portion 632 is only inserted into the insertion hole 312 and is not fixed. The side surface of the cylindrical portion 632 and the inner side surface of the insertion hole 312 are in contact with each other or there is a very small gap between them. The upper surface 63a of the screw-in component 63 is, for example, coplanar with the bearing surface 31a of the base 31.

[0113] The upper surface 63a of the screw-in member 63 is provided with Figure 2B to Figure 2D Any one structure in or other arbitrary structure for rotating the screw-in component 63. For this reason, the screw-in component 63 can be screwed into the connected insertion hole 312 and the recess 101 when necessary, and can also be screwed out from the connected insertion hole 312 and the recess 101.

[0114] Like the screw-in member 61, the screw-in member 63 is made of a porous body mainly composed of ceramics such as alumina and aluminum nitride (see Figure 4 Since the porous body constituting the screw-in component 63 allows gas to pass through, no through hole equivalent to the through hole 602 of the screw-in component 62 is formed on the screw-in component 63. The method for manufacturing the screw-in component 63 is substantially the same as the method for manufacturing the screw-in component 61.

[0115] As described above, if the diameter of the hole opened by the gas supply unit 11 on the mounting surface 31 a of the base 31 is large, abnormal discharge may occur through the gas supply unit 11 .

[0116] In the substrate fixing device 4, the screw-in component 63 of the porous body is screwed into the connected insertion hole 312 and the recessed portion 101. No through hole is formed in the screw-in component 63, and gas can be supplied from the gas supply unit 11 to the support surface 31a of the substrate 31 through the connected multiple gas holes P. In this way, since there is no through hole opened on the support surface 31a of the substrate 31 in the substrate fixing device 4, abnormal discharge generated by the gas supply unit 11 can be suppressed.

[0117] Furthermore, the screw-in component 63 is fixed in the connected insertion hole 312 and the recess 101 in a removable state. Therefore, when a problem occurs in the screw-in component 63, such as when a part of the air hole P is blocked by foreign matter, the screw-in component 63 can be simply removed and replaced with a new screw-in component 63. In the prior art, as long as a problem occurs in one gas exhaust portion 113, the entire electrostatic chuck 30 becomes a defective product, which will cause a great loss in terms of cost. However, in terms of the substrate fixing device 4, since the screw-in component 63 can be easily replaced, it has a great advantage from the perspective of cost and life.

[0118] <Fifth Implementation Method>

[0119] In the fifth embodiment, a substrate fixing device having an insertion member in addition to a screw-in member is exemplified. It should be noted that in the fifth embodiment, descriptions of components identical to those of the embodiments already described may be omitted.

[0120] Figure 7A-7B is a simplified cross-sectional view of a substrate fixing device according to a fifth embodiment. Fig. 7A For the overall picture, Figure 7B for Fig. 7A A partial enlarged view of part E of the Figure 7A-7B It can be seen that in the substrate fixing device 5, the insertion member 64 is added to the recess 102, which is different from the substrate fixing device 1 (see Figure 1A-1B )different.

[0121] A concave portion 102 is provided at a position corresponding to each gas discharge portion 113 on the upper surface 10a side of the bottom plate 10 and on the adhesive layer 20, the opening side of which is connected to the insertion hole 311 and the bottom surface of which exposes the other end of the gas discharge portion 113. The planar shape of the concave portion 102 is, for example, a circle with an inner diameter of about 2 to 5 mm. The concave portion 102 can be formed, for example, by drilling, laser processing, etc. No thread is formed on the inner side surface of the concave portion 102.

[0122] The insertion member 64 is only inserted into the recess 102 and is not fixed. The side surface of the insertion member 64 and the inner side surface of the recess 102 are in contact with each other or a very small gap is provided between the two.

[0123] Like the screw-in member 61, the insertion member 64 is made of a porous body mainly composed of ceramics such as alumina and aluminum nitride (see Figure 4 Since the porous body constituting the inserting member 64 allows gas to pass through, no through hole communicating with the through hole 601 of the screw-in member 60 is formed on the inserting member 64. The manufacturing method of the inserting member 64 is basically the same as the manufacturing method of the screw-in member 61.

[0124] After the insertion component 64 is inserted into the recess 102 , the screw-in component 60 is screwed into the insertion hole 311 , so the insertion component 64 will not fall off from the recess 102 .

[0125] As described above, if the diameter of the hole opened by the gas supply unit 11 on the mounting surface 31 a of the base 31 is large, abnormal discharge may occur through the gas supply unit 11 .

[0126] Similar to the substrate fixing device 1, in the substrate fixing device 5, the screw-in component 60 having a through hole 601 with a diameter of less than 0.1 mm is fixed in the insertion hole 311 formed on the base 31. In addition, on the lower surface 10b side of the bottom plate 10 of the screw-in component 60, an insertion component 64 of a porous body is inserted in a manner connected to the screw-in component 60. Gas can be supplied from the gas supply unit 11 to the supporting surface 31a of the base 31 through the through hole 601 of the screw-in component 60 and the multiple connected pores of the insertion component 64. Accordingly, compared with the substrate fixing device 1, the effect of suppressing abnormal discharge caused by the gas supply unit 11 can be further improved. It should be noted here that the other effects of the substrate fixing device 5 are the same as those of the substrate fixing device 1.

[0127] <Sixth Implementation Method>

[0128] In the sixth embodiment, a substrate fixing device having an insertion member in addition to a screw-in member is exemplified. It should be noted that in the sixth embodiment, description of the same components as those in the embodiments already described may be omitted.

[0129] Figure 8A-8B is a simplified cross-sectional view of a substrate fixing device according to a sixth embodiment. Fig. 8A For the overall picture, Figure 8B for Fig. 8A A partial enlarged view of part F of the Figure 8A-8B It can be seen that in the substrate fixing device 6, an insertion member 64 is added to the recess 103, which is different from the substrate fixing device 3 (see Figure 5A-Figure 5B )different.

[0130] At the position corresponding to each gas discharge part 113 on the upper surface 10a side of the bottom plate 10, a recessed part 103 is provided, the opening side of which is connected to the insertion hole 312 and the bottom surface of which exposes the other end of the gas discharge part 113. The planar shape of the recessed part 103 is, for example, a circle with an inner diameter of about 2 to 5 mm. The recessed part 103 can be formed, for example, by drilling, laser processing, etc. An internal thread is provided on the adhesive layer 20 side of the inner side surface of the recessed part 103. No thread is provided on the bottom side of the inner side surface of the recessed part 103 (the side of the inner side surface of the recessed part 103 opposite to the adhesive layer 20).

[0131] The insertion member 64 is inserted into the non-threaded area of ​​the bottom surface of the recess 103 but is not fixed. The side surface of the insertion member 64 and the bottom surface of the inner surface of the recess 103 are in contact with each other or there is a very small gap between them.

[0132] After the insertion component 64 is inserted into the bottom side of the recess 103, the screw-in component 62 is screwed into the connected insertion hole 312 and the area where the thread is formed on the adhesive layer 20 side of the recess 103, so the insertion component 64 will not fall off from the recess 103.

[0133] As described above, if the diameter of the hole opened by the gas supply unit 11 on the mounting surface 31 a of the base 31 is large, abnormal discharge may occur through the gas supply unit 11 .

[0134] Similar to the substrate fixing device 3, in the substrate fixing device 6, a screw-in component 62 having a through hole 602 with a diameter of less than 0.1 mm is fixed in the insertion hole 312 and the recess 103. In addition, on the lower surface 10b side of the base plate 10 of the screw-in component 62, an insertion component 64 of a porous body is also inserted in a manner connected to the screw-in component 62. Gas can be supplied from the gas supply unit 11 to the supporting surface 31a of the base 31 through the through hole 602 of the screw-in component 62 and the multiple connected pores of the insertion component 64. Accordingly, compared with the substrate fixing device 3, the effect of suppressing abnormal discharge caused by the gas supply unit 11 can be further improved. It should be noted here that the other effects of the substrate fixing device 6 are the same as those of the substrate fixing device 3.

[0135] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above embodiments, and various modifications and substitutions may be made to the above embodiments without departing from the scope of the claims.

[0136] For example, as the suction target of the substrate fixing device of the present invention, in addition to semiconductor wafers (silicon wafers, etc.), glass substrates used in the manufacturing process of liquid crystal panels, etc. can be listed.

[0137] Based on the above, a substrate fixing device can be provided, which comprises: a base plate, which has a gas supply unit inside; and an electrostatic chuck, which is arranged on the base plate. The electrostatic chuck comprises: a base body, one surface of which is a bearing surface of an adsorbed object; and an insertion hole, which penetrates the base body and has an internal thread formed on the inner side surface. A screw-in component with an external thread formed on the side surface is screwed into the insertion hole. Gas can be supplied to the bearing surface from the gas supply unit via the screw-in component.

[0138] In addition, a substrate fixing device can also be provided, which comprises: a base plate, which has a gas supply part inside; and an electrostatic chuck, which is arranged on the base plate. The electrostatic chuck comprises: a base body, one surface of which is a bearing surface of an adsorbed object; and an insertion hole, which passes through the base body. The base plate comprises: a recess, an inner side surface of which is formed with an internal thread, and is connected to the insertion hole. A screw-in component with an external thread formed on the side surface of the base plate is inserted into the insertion hole and the recess, and is screwed with the recess. Gas can be supplied to the bearing surface from the gas supply part via the screw-in component.

[0139] The screw-in component has a through hole with a diameter of 0.1 mm or less, one end of which is open to the mounting surface and the other end of which is connected to the gas supply unit. Gas can be supplied from the gas supply unit to the mounting surface through the through hole.

[0140] The screw-in member is a porous body having a plurality of communicating pores, and gas can be supplied from the gas supply unit to the placement surface through the plurality of communicating pores.

[0141] The second screw-in component connected to the screw-in component is inserted into the bottom plate side of the screw-in component. The screw-in component is formed with a through hole with a diameter of 0.1 mm or less, one end of which is opened on the bearing surface and the other end is opened on the second screw-in component side. The second screw-in component is a porous body having a plurality of connected pores. Gas can be supplied from the gas supply unit to the bearing surface via the through hole and the connected pores.

[0142] A structure for rotating the screw-in component is provided on a portion of the screw-in component exposed from the bearing surface. The screw-in component includes aluminum oxide or aluminum nitride.

[0143] Although the embodiments of the present invention have been described above, the above contents are not intended to limit the present invention.

Claims

1. A substrate fixing device, comprising: a bottom plate having a gas supply portion therein; and an electrostatic chuck disposed on the bottom plate, The electrostatic chuck has: A substrate, one surface of which is a support surface for the adsorption object; and The insertion hole that passes through the base body has an internal thread formed on its inner side surface. in, A screw-in component having an external thread formed on the side surface is screwed into the insertion hole. A second screw-in component connected to the screw-in component is inserted into the bottom plate side of the screw-in component, The screw-in component is formed with a through hole having a diameter of 0.1 mm or less, one end of which is opened on the bearing surface and the other end of which is opened on the second screw-in component side. The second screw-in member is a porous body having a plurality of interconnected pores. Gas is supplied from the gas supply portion to the placement surface via the through hole and the plurality of communicating gas holes.

2. A substrate fixing device, comprising: a bottom plate having a gas supply portion therein; and an electrostatic chuck disposed on the bottom plate, The electrostatic chuck has: A substrate, one surface of which is a support surface for the adsorption object; and an insertion hole extending through the base body, The bottom plate has: The recessed portion connected to the insertion hole has an internal thread formed on its inner side surface. in, A screw-in component having an external thread formed on the side surface of the bottom plate is inserted into the insertion hole and the recess and is screwed with the recess. A second screw-in component connected to the screw-in component is inserted into the bottom plate side of the screw-in component, The screw-in component is formed with a through hole having a diameter of 0.1 mm or less, one end of which is opened on the bearing surface and the other end of which is opened on the second screw-in component side. The second screw-in member is a porous body having a plurality of interconnected pores. Gas is supplied from the gas supply portion to the placement surface via the through hole and the plurality of communicating gas holes.

3. The substrate fixing device according to claim 1 or 2, wherein: A structure for rotating the screw-in component is provided on a portion of the screw-in component exposed from the bearing surface.

4. The substrate fixing device according to claim 1 or 2, wherein: The screw-in component includes aluminum oxide or aluminum nitride.

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