Substrate processing equipment

Abstract

The present invention provides a substrate processing device. In the substrate processing device (100), a transport robot (122) for transporting a substrate (W) between an indexing part (110) and a substrate processing part (130) is arranged in a substrate transport part (120). A transport fan filter unit (126) is arranged at the upper part of the substrate transport part (120). An exhaust port (124p) is arranged in the substrate transport part (120). A circulation pipe (142) connects the exhaust port (124p) of the substrate transport part (120) with the transport fan filter unit (126). The exhaust pipe (146) is connected to the circulation pipe (142). An inert gas supply unit (148) supplies an inert gas to the circulation pipe (142). The circulation fan filter unit (144) is arranged downstream of the connection part with the exhaust pipe (146) in the circulation pipe (142) and parallel to the flow path of the circulation pipe (142).

Description

Technical Field

[0001] The invention relates to a substrate processing device. Background Art

[0002] The substrate processing device is used, for example, in the manufacture of semiconductor substrates or glass substrates. In the substrate processing device, the substrate is processed with a processing liquid and then dried. In recent years, the structure of substrates has been increasingly miniaturized, and cleaning and drying of substrates have become a problem (Patent Document 1). In the substrate processing device of Patent Document 1, the drying of the processing liquid is promoted by supplying an inert gas.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2016 / 199769 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In recent years, micro-processing of substrates has received increasing attention. In the substrate processing apparatus of Patent Document 1, although an inert gas is supplied to the substrate during substrate processing, the substrate is sometimes exposed to an oxygen environment during transport, and there is a concern that the characteristics of the substrate may be degraded due to oxidation of the substrate.

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus capable of suppressing oxidation of a substrate during transport.

[0009] Technical means of solving problems

[0010] According to one embodiment of the present invention, a substrate processing device includes: an indexing robot, an indexing section, a substrate processing section, a transporting robot, a substrate transporting section, a transporting fan filter unit, an exhaust port, a circulation piping, an exhaust duct, an inert gas supply section, and a circulation fan filter unit. The indexing robot carries in a substrate. The indexing robot is arranged in the indexing section. The substrate processing section processes the substrate. The transporting robot transports the substrate between the indexing section and the substrate processing section. The transporting robot is arranged in the substrate transporting section. The transporting fan filter unit is arranged at an upper portion of the substrate transporting section. The exhaust port is arranged in the substrate transporting section. The circulation piping connects the exhaust port of the substrate transporting section with the transporting fan filter unit. The exhaust duct is connected to the circulation piping. The inert gas supply section supplies an inert gas to the circulation piping. The circulation fan filter unit is arranged downstream of the connection portion with the exhaust duct in the circulation piping and parallel to the flow path of the circulation piping.

[0011] In one embodiment, the circulation fan filter unit is configured to extend in a vertical direction.

[0012] In one embodiment, the substrate processing apparatus further includes a valve for adjusting the flow of gas passing through the exhaust pipe.

[0013] In one embodiment, the circulation fan filter unit blows out the inert gas supplied from the inert gas supply unit toward the circulation pipe.

[0014] In one embodiment, the inert gas supply unit includes: a first supply unit that supplies the inert gas to the circulation pipe at a first flow rate; and a second supply unit that supplies the inert gas to the circulation pipe at a second flow rate greater than the first flow rate.

[0015] In one embodiment, in the case of the oxygen reduction mode, the first supply unit and the second supply unit each supply the inert gas to the circulation pipe, and in the case of the low oxygen maintenance mode, the first supply unit supplies the inert gas to the circulation pipe.

[0016] In one embodiment, the substrate processing apparatus further includes an air supply unit that supplies air to the circulation pipe.

[0017] In one embodiment, in the oxygen increasing mode, the air supply unit supplies the air to the circulation pipe.

[0018] In one embodiment, the circulation fan filter unit blows out the air supplied from the air supply unit toward the circulation pipe.

[0019] In one embodiment, a plurality of fan filter units are arranged in parallel as the circulation fan filter unit.

[0020] In one embodiment, the circulation fan filter unit comprises a fan, a filter, and a chemical filter.

[0021] In one embodiment, the substrate processing apparatus further includes a gas circulation cabinet that houses a portion of the circulation pipe and the circulation fan filter unit.

[0022] In one embodiment, the substrate processing apparatus further includes a processing liquid tank adjacent to the gas circulation tank for supplying processing liquid to the substrate processing part.

[0023] Effects of the Invention

[0024] According to the present invention, oxidation of a substrate during transport can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A is a schematic top view of a substrate processing apparatus according to this embodiment. Figure 1B It is a schematic side view of the substrate processing apparatus according to this embodiment.

[0026] Figure 2A to Figure 2C Schematic diagrams of the substrate processing apparatus according to the present embodiment in an oxygen reduction mode, a low oxygen maintenance mode, and an oxygen increase mode.

[0027] Figure 3 It is a schematic diagram of a substrate processing section in the substrate processing apparatus according to the present embodiment.

[0028] Figure 4 It is a schematic diagram of a substrate transfer unit and a gas adjustment unit in the substrate processing apparatus according to the present embodiment.

[0029] Figure 5 It is a schematic diagram of a substrate transfer unit and a gas adjustment unit in the substrate processing apparatus according to the present embodiment.

[0030] Figure 6 It is a schematic diagram of a substrate transfer unit and a gas adjustment unit in the substrate processing apparatus according to the present embodiment.

[0031] Figure 7A to Figure 7C Schematic diagrams of the substrate processing apparatus according to the present embodiment in an oxygen reduction mode, a low oxygen maintenance mode, and an oxygen increase mode.

[0032] Fig. 8A and Figure 8B It is a schematic partial enlarged view of a gas adjustment unit in the substrate processing apparatus according to the present embodiment.

[0033] Fig. 9 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0034] Explanation of symbols

[0035] 100: Substrate processing device

[0036] 101: Control Devices

[0037] 102: Control Department

[0038] 104: Storage

[0039] 110: Index Department

[0040] 112: Index Robot

[0041] 120: Substrate transport department

[0042] 122: Transport Robot

[0043] 124, 126h, 144h, 144Ah, 144Bh: Frame

[0044] 124a: Upper

[0045] 124b: Side

[0046] 124c: Bottom

[0047] 124p: Exhaust port

[0048] 124t: Platform

[0049] 126: Transport fan filter unit

[0050] 126a, 144a, 144Aa, 144Ba: Fan

[0051] 126b, 144b, 144Ab, 144Bb: Filter

[0052] 128: Oxygen concentration meter

[0053] 130: Substrate processing department

[0054] 132: Chamber

[0055] 134: Substrate holding part

[0056] 134a: Rotating base

[0057] 134b: Clamping member

[0058] 134c: Axis

[0059] 134d: Electric motor

[0060] 136: Processing liquid supply unit

[0061] 136a: Piping

[0062] 136b, 146v: valve

[0063] 136c: Nozzle

[0064] 138: Cup

[0065] 140: Gas adjustment unit

[0066] 140A: Gas circulation cabinet

[0067] 142: Circulation piping

[0068] 142p: bottom tube

[0069] 142q: Side pipe

[0070] 142r: Top tube

[0071] 142u: Upstream

[0072] 142v: Downstream

[0073] 142w: Isolation wall

[0074] 144: Circulation fan filter unit

[0075] 144A: First fan filter unit

[0076] 144B: Second fan filter unit

[0077] 146: Exhaust pipe

[0078] 146m: Motor

[0079] 148: Inert gas supply unit

[0080] 148a: First supply unit

[0081] 148b: Second supply unit

[0082] 149: Air supply unit

[0083] 150, 150A, 150B, 150C: Processing liquid cabinet

[0084] 160: Boundary Wall

[0085] Ax: Rotation axis

[0086] LP: Loading Port

[0087] R: Rotation direction

[0088] TW: Tower

[0089] W: substrate

[0090] X, Y, Z: direction DETAILED DESCRIPTION

[0091] Hereinafter, an embodiment of the substrate processing apparatus of the present invention will be described with reference to the accompanying drawings. In addition, in the drawings, the same reference symbols are given to the same or equivalent parts and the description is not repeated. In addition, in the specification of this application, in order to facilitate the understanding of the invention, mutually orthogonal X-directions, Y-directions and Z-directions are sometimes described. Typically, the X-direction and the Y-direction are parallel to the horizontal direction, and the Z-direction is parallel to the vertical direction.

[0092] Reference Figure 1A and Figure 1B , a substrate processing apparatus 100 according to this embodiment will be described. Figure 1A is a schematic top view of the substrate processing apparatus 100 according to the present embodiment. Figure 1B It is a schematic side view of the substrate processing apparatus 100 according to the present embodiment.

[0093] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface processing, imparting characteristics, forming a processing film, removing at least a portion of a film, and cleaning the substrate W.

[0094] The substrate W is in the shape of a thin plate. Typically, the substrate W is in the shape of a thin, roughly circular plate. Examples of the substrate W include semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for field emission displays (FED), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0095] The substrate processing apparatus 100 processes the substrate W using the processing liquid. Here, the substrate processing apparatus 100 processes the substrates W one by one using the processing liquid.

[0096] like Figure 1A As shown, the substrate processing apparatus 100 includes an indexing unit 110, a substrate conveying unit 120, a substrate processing unit 130, and a gas adjusting unit 140. Here, the indexing unit 110, the substrate conveying unit 120, and the gas adjusting unit 140 are arranged in a straight line along the X direction, and the substrate conveying unit 120 and the substrate processing unit 130 are arranged in a straight line along the Y direction. The substrate W is conveyed from the load port LP to the substrate processing unit 130 via the indexing unit 110 and the substrate conveying unit 120, and is processed in the substrate processing unit 130. Thereafter, the substrate W is conveyed from the substrate processing unit 130 to the load port LP via the substrate conveying unit 120 and the indexing unit 110.

[0097] The gas adjustment unit 140 adjusts the components of the gas in the substrate conveying unit 120. Here, the gas adjustment unit 140 adjusts the oxygen concentration of the gas in the substrate conveying unit 120.

[0098] The gas adjustment unit 140 supplies an inert gas to the substrate conveying unit 120. In addition, the gas adjustment unit 140 exhausts the gas in the substrate conveying unit 120. In addition, the gas adjustment unit 140 may switch the gas supplied to the substrate conveying unit 120 between an inert gas and air.

[0099] The load port LP is disposed adjacent to the index portion 110. The load port LP accommodates a plurality of substrates W stacked on top of each other.

[0100] The index unit 110 is provided with an index robot 112 . The index robot 112 transfers the substrate W. The index robot 112 transfers the substrate W between the load port LP and the substrate transfer unit 120 .

[0101] The substrate transfer unit 120 is provided with a transfer robot 122. The transfer robot 122 transfers the substrate W between the index unit 110 and the substrate processing unit 130. The transfer robot 122 is sometimes referred to as a center robot.

[0102] The substrate transfer unit 120 includes a housing 124 . The transfer robot 122 is surrounded by the housing 124 .

[0103] The frame 124 includes an upper portion 124a, a side portion 124b, and a bottom portion 124c. The upper portion 124a is connected to the side portion 124b, and the bottom portion 124c is connected to the side portion 124b. The side portion 124b surrounds the transport robot 122. The upper portion 124a is located above the transport robot 122. The transport robot 122 may also be set on the bottom portion 124c.

[0104] A stage 124t is provided at a portion of the side portion 124b of the frame 124 that faces the index unit 110. The index robot 112 places the substrate W on the stage 124t of the frame 124. The transport robot 122 receives the substrate W placed on the stage 124t. The stage 124t is used for transferring the substrate W.

[0105] A transport fan filter unit 126 is provided at the upper portion 124a of the substrate transport portion 120. The transport fan filter unit 126 sucks in external gas, filters the gas, and blows the gas out in a predetermined direction. For example, the transport fan filter unit 126 sucks in gas from one side, filters the gas, and blows the gas out in the other side. The transport fan filter unit 126 blows gas into the frame 124. In addition, in this specification, the transport fan filter unit 126 is sometimes described as transport FFU126.

[0106] The transport FFU 126 has a fan and a filter. In the transport FFU 126, the fan and the filter are arranged in a frame. The filter of the transport FFU 126 is arranged on the side where the gas is blown out by the fan. The filter filters suspended matter from the passing gas.

[0107] The transport FFU 126 is provided at the upper portion 124a of the substrate transport unit 120, and the blowout port of the transport FFU 126 faces the bottom 124c of the frame 124. Therefore, the gas blown out from the transport FFU 126 flows vertically downward. Therefore, a downward airflow is formed in the substrate transport unit 120 by the transport FFU 126.

[0108] In addition, an exhaust port 124p is provided in the frame 124. Figure 1BIn the embodiment, the exhaust port 124p is provided at the bottom 124c of the frame 124. Alternatively, the exhaust port 124p may be provided at the side 124b of the frame 124. The gas blown from the transport FFU 126 toward the frame 124 passes through the interior of the frame 124 and then flows toward the exhaust port 124p.

[0109] The gas adjustment unit 140 includes a circulation pipe 142, a circulation fan filter unit 144, an exhaust pipe 146, and an inert gas supply unit 148. In addition, in this specification, the circulation fan filter unit 144 is sometimes described as a circulation FFU 144. In addition, in this specification, the inert gas supply unit 148 is sometimes described as simply a gas supply unit 148.

[0110] The circulation pipe 142 connects the exhaust port 124p of the substrate transport unit 120 and the transport FFU 126. The exhaust port 124p is located upstream of the circulation pipe 142, and the transport FFU 126 is located downstream of the circulation pipe 142. The circulation pipe 142 allows the gas in the substrate transport unit 120 to circulate.

[0111] The circulation FFU 144 is provided in the circulation pipe 142 . The circulation FFU 144 filters the passing gas and blows the gas into the circulation pipe 142 .

[0112] The circulation FFU144 has a fan and a filter. The fan and filter of the circulation FFU144 are arranged in the frame. The circulation FFU144 sucks in external gas, filters the gas, and blows out the gas. The filter of the circulation FFU144 is arranged at a position where the gas is blown out by the fan. The filter filters the gas passing through.

[0113] The circulation FFU 144 is arranged in parallel with the flow path of the circulation pipe 142 . Therefore, the circulation FFU 144 blows out gas toward the side surface of the circulation pipe 142 .

[0114] The exhaust pipe 146 is connected to the circulation pipe 142. The gas in the substrate transport unit 120 passes through the circulation pipe 142 and passes through the exhaust pipe 146 to be exhausted to the outside.

[0115] A valve 146v is provided at a connection portion between the circulation pipe 142 and the exhaust pipe 146. The valve 146v adjusts the flow of gas passing through the exhaust pipe 146. The valve 146v is disposed in the exhaust pipe 146 near a connection portion with the circulation pipe 142.

[0116] The valve 146v can be opened and closed. The valve 146v can be switched between an open state and a closed state. For example, the valve 146v can also be switched between an open state and a closed state in multiple stages.

[0117] When the valve 146v is opened, the circulation pipe 142 is connected to the outside through the exhaust pipe 146. Therefore, the air in the substrate conveying unit 120 passes through the circulation pipe 142 from the exhaust port 124p and is exhausted to the outside through the exhaust pipe 146. In addition, the amount of gas exhausted from the substrate conveying unit 120 is substantially the same as the amount of gas supplied to the substrate conveying unit 120, and the pressure in the substrate conveying unit 120 is maintained substantially constant.

[0118] When the valve 146v is closed, the circulation pipe 142 is not connected to the outside via the exhaust pipe 146. Therefore, the air in the substrate transport unit 120 passes through the circulation pipe 142 via the exhaust port 124p and then returns to the substrate transport unit 120 again.

[0119] The inert gas supply unit 148 supplies the inert gas to the circulation pipe 142 . The inert gas supplied to the circulation pipe 142 flows into the substrate transport unit 120 .

[0120] Here, the circulation FFU 144 is disposed between the circulation piping 142 and the gas supply unit 148. Therefore, the inert gas supplied from the inert gas supply unit 148 flows into the circulation piping 142 via the circulation FFU 144. In this case, when the inert gas is supplied from the gas supply unit 148 to the circulation piping 142, the inert gas is filtered and blown out in the circulation FFU 144. Thus, it is possible to suppress the flow of suspended matter into the substrate transport unit 120 together with the inert gas.

[0121] In addition, the circulation FFU 144 is preferably capable of switching between inert gas and air to blow toward the circulation pipe 142. In this case, when the circulation FFU 144 blows air toward the circulation pipe 142, the air is filtered in the circulation FFU 144 and blown out. Thus, it is possible to suppress the flow of suspended matter into the substrate transport unit 120 together with the air.

[0122] When the substrate transport unit 120 transports the substrate W, the gas adjustment unit 140 supplies an inert gas to the substrate transport unit 120 via the circulation pipe 142, thereby suppressing oxidation of the substrate W during transport. In one example, the gas adjustment unit 140 supplies nitrogen as the inert gas to the substrate transport unit 120. Alternatively, the gas adjustment unit 140 may also supply a rare gas as the inert gas to the substrate transport unit 120. For example, the gas adjustment unit 140 may also supply argon as the inert gas to the substrate transport unit 120.

[0123] In the substrate processing apparatus 100 of the present embodiment, the circulation FFU 144 is arranged in parallel with the flow path of the circulation pipe 142, downstream of the connection portion with the exhaust pipe 146 in the circulation pipe 142. The circulation FFU 144 can supply the fluid from which the contaminants are removed due to its structure, and thus can suppress the contamination inside the substrate transport unit 120. The circulation FFU 144 of the present embodiment achieves the following effects by the above arrangement. Downstream of the connection portion with the exhaust pipe 146 in the circulation pipe 142, the pressure of the fluid flowing in the circulation pipe 142 is likely to drop, and the oxygen component is likely to remain. In contrast, in the substrate processing apparatus 100, since the circulation FFU 144 is located downstream of the connection portion with the exhaust pipe 146 in the circulation pipe 142, the pressure drop of the fluid flowing in the circulation pipe 142 can be suppressed. In addition, since the circulation FFU 144 is arranged in parallel with the flow path of the circulation pipe 142, the fluid is supplied in a direction that crosses the flow path direction of the circulation pipe 142. The supplied fluid has a function of suppressing the entry of fluid mixed from the circulation pipe 142 or the exhaust pipe 146, the circulation pipe 142 being located upstream from the circulation FFU 144. Thus, for example, when an inert gas is blown out from the circulation FFU 144, the possibility of oxygen mixed from the outside through the exhaust pipe 146 intruding into the substrate transport unit 120 can be reduced.

[0124] Furthermore, in the substrate processing apparatus 100, the gas supply unit 148 supplies an inert gas downstream of the connection portion of the circulation pipe 142 with the exhaust pipe 146, thereby suppressing the entry of air from the exhaust pipe 146 into the circulation pipe 142, and reducing the oxygen concentration in the circulation pipe 142. Therefore, the oxygen concentration in the circulation pipe 142 and the oxygen concentration of the gas in the substrate transport unit 120 can be reduced.

[0125] Here, the circulation FFU 144 is arranged so that the long side direction is along the vertical direction. Therefore, the circulation FFU 144 is arranged along the flow path of the circulation pipe 142. By arranging the circulation FFU 144 along the vertical direction, the increase in the floor area for installing the circulation FFU 144 can be suppressed.

[0126] The substrate processing apparatus 100 of the present embodiment can be suitably used for processing a semiconductor substrate provided with a semiconductor. The semiconductor substrate is processed in the substrate processing unit 130. Typically, a conductive layer and an insulating layer are stacked on the base material of the semiconductor substrate. When manufacturing a semiconductor substrate, the substrate processing apparatus 100 can be suitably used for cleaning and / or processing (e.g., etching, property change, etc.) of the conductive layer and / or the insulating layer.

[0127] The circulation pipe 142 includes a bottom pipe 142p, a side pipe 142q, and an upper pipe 142r. The bottom pipe 142p is connected to the side pipe 142q, and the side pipe 142q is connected to the upper pipe 142r. The bottom pipe 142p is located vertically below the frame 124 of the substrate conveying unit 120. The side pipe 142q corresponds to the height of the frame 124. The upper pipe 142r is located vertically above the frame 124 of the substrate conveying unit 120.

[0128] The bottom pipe 142p and the upper pipe 142r extend in the horizontal direction, and the side pipe 142q extends in the vertical direction. Here, the circulation FFU 144 is installed on the side of the side pipe 142q of the circulation pipe 142.

[0129] The substrate processing apparatus 100 further includes a control device 101 . The control device 101 controls various operations of the substrate processing apparatus 100 .

[0130] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 includes a processor. The processor, for example, has a central processing unit (CPU). Alternatively, the processor may also have a general-purpose computer. For example, the control unit 102 controls the indexing unit 110, the substrate transport unit 120, the substrate processing unit 130, and the gas adjustment unit 140. In one example, the control unit 102 controls the indexing robot 112, the transport robot 122, the transport FFU 126, the substrate processing unit 130, the circulation FFU 144, the valve 146v, and the gas supply unit 148.

[0131] The storage unit 104 stores data and computer programs. The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable medium. The control unit 102 executes the computer program stored in the storage unit 104.

[0132] In addition, a computer program defining a procedure is stored in advance in the storage unit 104 , and the substrate processing apparatus 100 operates according to the procedure defined in the computer program.

[0133] The control unit 102 may also control the gas adjustment unit 14 to adjust the gas composition of the substrate conveying unit 120. For example, the oxygen concentration of the gas in the substrate conveying unit 120 may be changed from a state of being equal to the oxygen concentration in the air to a state of being less than the oxygen concentration in the air. In this specification, a mode of reducing the oxygen concentration of the gas in the substrate conveying unit 120 is sometimes referred to as an oxygen reduction mode.

[0134] Alternatively, the oxygen concentration of the gas in the substrate transport unit 120 may be changed from a state lower than the oxygen concentration in air to a state equal to the oxygen concentration in air. In this specification, a mode of increasing the oxygen concentration of the gas in the substrate transport unit 120 is sometimes referred to as an oxygen increase mode.

[0135] In addition, the control unit 102 can also control the gas adjustment unit 140 in a manner to maintain the oxygen concentration of the gas in the substrate conveying unit 120. For example, the oxygen concentration of the gas in the substrate conveying unit 120 can be maintained at a state lower than the oxygen concentration in the air. In this specification, the mode of maintaining the oxygen concentration of the gas in the substrate conveying unit 120 at a state lower than the oxygen concentration in the air is sometimes referred to as a low oxygen maintenance mode. Typically, when the substrate W is conveyed across the substrate conveying unit 120 between the indexing unit 110 and the substrate processing unit 130, the substrate conveying unit 120 is maintained at a low oxygen concentration.

[0136] Below, refer to FIG. 2A to FIG. 2C , adjustment of the oxygen concentration of the substrate conveying unit 120 by the gas adjustment unit 140 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 2A is a schematic diagram of the substrate processing apparatus 100 in the oxygen reduction mode, Figure 2B is a schematic diagram of the substrate processing apparatus 100 maintained in a low oxygen mode, Figure 2C Schematic diagram of the substrate processing apparatus 100 in the oxygen addition mode. Figure 2A to Figure 2C In, only Figure 1A and Figure 1B The substrate transfer unit 120 and the gas adjustment unit 140 in the substrate processing apparatus 100 shown in FIG.

[0137] like Figure 2A As shown, in the case of the oxygen reduction mode, the substrate processing apparatus 100 replaces the gas in the substrate conveying unit 120 with an inert gas, thereby reducing the oxygen concentration of the gas in the substrate conveying unit 120. In this case, the gas adjustment unit 140 supplies the inert gas to the substrate conveying unit 120. In addition, the gas adjustment unit 140 exhausts the gas in the substrate conveying unit 120.

[0138] The fan of the circulation FFU 144 is driven, and the gas supply unit 148 supplies the inert gas to the circulation FFU 144. Therefore, the circulation FFU 144 blows the inert gas supplied from the gas supply unit 148 toward the transport FFU 126 along the circulation pipe 142. Therefore, the inert gas reaches the transport FFU 126 via the circulation FFU 144. The transport FFU 126 blows the inert gas into the frame 124. Figure 2A to Figure 2C In any of the above, the fan of the transport FFU 126 is driven, and the transport FFU 126 supplies the gas passing through the circulation pipe 142 to the substrate transport unit 120 .

[0139] The valve 146v is opened, and the exhaust pipe 146 is connected to the outside. Therefore, the air in the substrate transport unit 120 passes through the circulation pipe 142 and is exhausted to the outside through the exhaust pipe 146. In addition, the amount of gas exhausted from the substrate transport unit 120 is substantially the same as the amount of gas supplied to the substrate transport unit 120, and the pressure in the substrate transport unit 120 is maintained substantially constant.

[0140] By continuing the supply of the inert gas to the substrate transport unit 120 and the exhaust of the gas from the substrate transport unit 120 for a predetermined time, the oxygen concentration of the gas in the substrate transport unit 120 can be reduced. For example, at the beginning of the oxygen reduction mode, the oxygen concentration of the gas in the substrate transport unit 120 is about 20%, but at the end of the oxygen reduction mode, the oxygen concentration of the gas in the substrate transport unit 120 can be reduced to 1000 ppm or less. For example, the oxygen concentration of the gas in the substrate transport unit 120 can also be 5 ppm or more and 100 ppm or less.

[0141] In addition, in the oxygen reduction mode, it is preferred that the substrate transport unit 120 does not transport the substrate W. However, in the oxygen reduction mode, the transport robot 122 may be operated independently of the transport of the substrate W. The operation of the transport robot 122 stirs the gas in the housing 124, so that the gas in the entire housing 124 can be quickly replaced with an inert gas. In this case, it is preferred that the transport robot 122 operate within the maximum range within the movable range.

[0142] like Figure 2B As shown, in the case of maintaining the low oxygen mode, the substrate processing apparatus 100 maintains the oxygen concentration of the gas in the substrate conveying unit 120. In this case, the gas adjustment unit 140 circulates the gas in the substrate conveying unit 120. In addition, the gas adjustment unit 140 does not exhaust the gas from the substrate conveying unit 120. In the low oxygen mode, the inert gas is circulated and used, thereby suppressing the increase in cost associated with the use of the inert gas.

[0143] For example, the gas supply unit 148 stops supplying the inert gas, and the fan of the circulation FFU 144 stops driving. However, the fan of the transport FFU 126 keeps driving.

[0144] In addition, the valve 146v is closed, and the circulation pipe 142 is isolated from the outside. Therefore, the gas passing through the circulation pipe 142 is not discharged to the outside through the exhaust pipe 146.

[0145] When the transport FFU 126 blows gas into the frame 124, the gas in the substrate transport unit 120 flows through the exhaust port 124p in the circulation pipe 142. Thereafter, the gas reaches the transport FFU 126, and the transport FFU 126 blows gas into the frame 124 again. In this way, the gas in the substrate transport unit 120 circulates. In addition, the amount of gas exhausted from the substrate transport unit 120 is substantially the same as the amount of gas supplied to the substrate transport unit 120 again, and the pressure in the substrate transport unit 120 is substantially maintained constant.

[0146] However, if a small amount of gas leaks from the substrate transport unit 120 and / or the circulation pipe 142, the pressure of the gas circulating in the substrate transport unit 120 and the circulation pipe 142 decreases. Therefore, the gas supply unit 148 may supply a small amount of inert gas to the circulation pipe 142 via the transport FFU 126.

[0147] Thus, it is preferred that the substrate W is transported in the substrate transport unit 120 while the oxygen concentration of the gas in the substrate transport unit 120 has decreased. For example, the transport robot 122 receives the substrate W from the index unit 110 and transports the substrate W to the substrate processing unit 130 while the oxygen concentration of the gas in the substrate transport unit 120 has decreased. In addition, the transport robot 122 receives the substrate W from the substrate processing unit 130 and transports the substrate W to the index unit 110 while the oxygen concentration of the gas in the substrate transport unit 120 has decreased.

[0148] In addition, after the processing of the substrate W is completed, the oxygen concentration of the gas in the substrate conveyor 120 is restored from the reduced state to the normal state. For example, when the power of the substrate processing apparatus 100 is turned off, the oxygen concentration of the gas in the substrate conveyor 120 is restored from the reduced state to the normal state. Alternatively, the oxygen concentration of the gas in the substrate conveyor 120 may be restored from the reduced state to the normal state for maintenance.

[0149] like Figure 2C As shown, in the case of the oxygen increase mode, the substrate processing apparatus 100 replaces the gas in the substrate conveying unit 120 with air, thereby increasing the oxygen concentration of the gas in the substrate conveying unit 120. In this case, the gas adjustment unit 140 supplies air to the substrate conveying unit 120. In addition, the gas adjustment unit 140 exhausts the gas (mainly inert gas) in the substrate conveying unit 120.

[0150] For example, when the circulation FFU 144 is connected to the air, the fan of the circulation FFU 144 is driven, and the circulation FFU 144 blows air toward the circulation pipe 142. Therefore, the air reaches the transport FFU 126 through the circulation pipe 142. The transport FFU 126 blows air into the housing 124.

[0151] The valve 146v is opened, and the exhaust pipe 146 is connected to the outside. Therefore, the inert gas in the substrate transport unit 120 passes through the circulation pipe 142 and is exhausted to the outside through the exhaust pipe 146. In addition, the amount of inert gas exhausted from the substrate transport unit 120 is substantially the same as the amount of air supplied to the substrate transport unit 120, and the pressure in the substrate transport unit 120 is maintained substantially constant.

[0152] The supply of air to the substrate transport unit 120 and the exhaust of the inert gas from the substrate transport unit 120 are continued for a predetermined time, thereby increasing the oxygen concentration of the gas in the substrate transport unit 120. For example, at the start of the oxygen increase mode, the oxygen concentration of the gas in the substrate transport unit 120 is 1000 ppm or less, whereas at the end of the oxygen increase mode, the oxygen concentration of the gas in the substrate transport unit 120 increases to about 20%.

[0153] As described above, in the substrate processing apparatus 100 of the present embodiment, the substrate transfer unit 120 can be switched to any one of the oxygen reduction mode, the low oxygen maintenance mode, and the oxygen increase mode, and the oxygen concentration of the gas in the substrate transfer unit 120 can be adjusted.

[0154] In the substrate processing apparatus 100 of the present embodiment, in the substrate processing section 130 , the substrate W is processed using the processing liquid while being held in a substantially horizontal state.

[0155] Then, refer to Figure 3 , the substrate processing unit 130 in the substrate processing apparatus 100 of the present embodiment will be described. Figure 3 1 is a schematic diagram of a substrate processing unit 130 in the substrate processing apparatus 100 .

[0156] like Figure 3 As shown, the substrate processing unit 130 includes: a chamber 132, a substrate holding unit 134, a processing liquid supply unit 136, and a cup 138. The chamber 132 accommodates the substrate W. The chamber 132 is generally box-shaped with an internal space. Here, the substrate processing device 100 is a sheet-by-sheet type that processes the substrates W one by one, and the substrates W are accommodated in the chamber 132 one by one. The substrates W are accommodated in the chamber 132 and processed in the chamber 132. The substrate holding unit 134, the processing liquid supply unit 136, and at least a part of the cup 138 are accommodated in the chamber 132.

[0157] The substrate holding part 134 holds the substrate W. The substrate holding part 134 holds the substrate W horizontally with the upper surface of the substrate W facing upward and the back surface of the substrate W facing vertically downward. In addition, the substrate holding part 134 rotates the substrate W while holding the substrate W.

[0158] For example, the substrate holding portion 134 may be a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding portion 134 may have an arbitrary mechanism that holds the substrate W from the back. For example, the substrate holding portion 134 may be a vacuum type. In this case, the substrate holding portion 134 holds the substrate W horizontally by adsorbing the central portion of the back side (lower surface) of the substrate W, which is a non-element forming surface, onto the upper surface. Alternatively, the substrate holding portion 134 may combine a clamping type that makes a plurality of clamping pins contact the peripheral end surface of the substrate W with a vacuum type.

[0159] For example, the substrate holding unit 134 includes a rotating base 134a, a clamping member 134b, a shaft 134c, and an electric motor 134d. The clamping member 134b is provided on the rotating base 134a. The clamping member 134b clamps the substrate W. Typically, a plurality of clamping members 134b are provided on the rotating base 134a.

[0160] The shaft 134c is a hollow shaft. The shaft 134c extends in the vertical direction along the rotation axis Ax. The rotating base 134a is coupled to the upper end of the shaft 134c. The back surface of the substrate W contacts the rotating base 134a, and the substrate W is placed on the rotating base 134a.

[0161] The rotating base 134a is in the shape of a disk and horizontally supports the substrate W. The shaft 134c extends downward from the central portion of the rotating base 134a. The electric motor 134d imparts a rotational force to the shaft 134c. The electric motor 134d rotates the shaft 134c in a rotation direction R, thereby rotating the substrate W and the rotating base 134a around the rotation axis Ax. Here, the rotation direction R is counterclockwise.

[0162] The processing liquid supply unit 136 includes: a pipe 136a, a valve 136b, and a nozzle 136c. The processing liquid flows into the pipe 136a. The nozzle 136c is connected to the pipe 136a. The processing liquid from the processing liquid supply source is supplied to the pipe 136a. The valve 136b is arranged on the pipe 136a. If the valve 136b is opened, the processing liquid is supplied from the nozzle 136c to the substrate W. The substrate W is processed by the processing liquid.

[0163] The cup 138 recovers the processing liquid supplied to the substrate W. The cup 138 is provided around the substrate holding portion 134 .

[0164] For example, the cup 138 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. In addition, even when the processing liquid is not supplied to the substrate W, the cup 138 blocks the flow of gas (airflow) generated by the rotation of the substrate W and makes the airflow flow downward.

[0165] The cup 138 may also be movable in the vertical direction. For example, the cup 138 may rise to cover the side of the substrate W when the substrate W is processed by the processing liquid, and then fall downward from the side of the substrate W after the substrate W is processed by the processing liquid. In this way, the substrate W is processed in the substrate processing unit 130.

[0166] In addition, Figure 1A and Figure 1B as well as FIG. 2A to FIG. 2C In the embodiment, the circulation FFU 144 is installed on the side of the circulation piping 142, and the inert gas from the gas supply unit 148 is supplied to the circulation piping 142 via the circulation FFU 144, but the present embodiment is not limited thereto. The circulation FFU 144 may also be provided in the circulation piping 142. In addition, the inert gas from the gas supply unit 148 may also be blown out by the circulation FFU 144 after being supplied to the circulation piping 142.

[0167] Then, refer to Figure 4 , the gas adjustment unit 140 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 4 It is a schematic diagram of the substrate transfer unit 120 and the gas adjustment unit 140 in the substrate processing apparatus 100 .

[0168] like Figure 4 As shown, a partition wall 142w is provided in the circulation piping 142. The partition wall 142w is arranged between the exhaust port 124p and the transport FFU 126. Here, the partition wall 142w is arranged inside the side pipe 142q. The circulation piping 142 is divided into an upstream portion 142u and a downstream portion 142v by the partition wall 142w. The upstream portion 142u is formed by the bottom pipe 142p and a part of the side pipe 142q. The downstream portion 142v is formed by the remaining part of the side pipe 142q and the upper pipe 142r.

[0169] The partition wall 142w is provided with an opening. The opening of the partition wall 142w connects the upstream portion 142u and the downstream portion 142v.

[0170] The circulation FFU 144 is installed on the partition wall 142w. Specifically, the circulation FFU 144 is installed at the opening of the partition wall 142w in the downstream portion 142v. The upstream portion 142u and the downstream portion 142v of the circulation pipe 142 are connected through the area where the circulation FFU 144 is installed in the partition wall 142w. The circulation FFU 144 sucks the gas of the upstream portion 142u and blows it toward the downstream portion 142v.

[0171] The circulation FFU 144 has a fan 144a, a filter 144b, and a frame 144h. The fan 144a and the filter 144b are arranged in the frame 144h. The frame 144h is provided with an inlet for sucking in air and an outlet for blowing out air. In addition, the inlet of the circulation FFU 144 faces the opening of the partition wall 142w and is connected to the upstream portion 142u via the opening.

[0172] In the circulation FFU 144, the fan 144a is arranged on the upstream side of the circulation path, and the filter 144b is arranged on the downstream side of the circulation path. The airflow blown out by the fan 144a is filtered by the filter 144b when passing through the filter 144b.

[0173] The frame 144h is extended in the long-side direction. The frame 144h is installed in such a manner that the long-side direction of the circulation FFU 144 is along the partition wall 142w of the circulation piping 142. Here, the circulation FFU 144 is arranged in the partition wall 142w in such a manner that the long-side direction of the circulation FFU 144 is along the vertical direction. Therefore, the circulation FFU 144 is arranged along the flow path of the circulation piping 142. By arranging the circulation FFU 144 in the vertical direction inside the circulation piping 142, the circulation FFU 144 can be installed in the relatively thin circulation piping 142.

[0174] The inert gas supply unit 148 supplies the inert gas to the circulation pipe 142. The inert gas supply unit 148 supplies the inert gas to the circulation pipe 142 in the oxygen reduction mode and the low oxygen maintenance mode.

[0175] Specifically, the inert gas supply unit 148 is connected to the side surface of the upstream portion 142u of the circulation pipe 142. The inert gas supply unit 148 supplies the inert gas to the upstream portion 142u of the circulation pipe 142.

[0176] The circulation FFU 144 sucks the inert gas supplied from the inert gas supply unit 148, filters the inert gas, and blows out the inert gas. Here, the circulation FFU 144 sucks the inert gas at the upstream portion 142u, filters the inert gas, and blows out the inert gas toward the downstream portion 142v.

[0177] The air supply unit 149 supplies air to the circulation pipe 142. The air supply unit 149 supplies air to the circulation pipe 142 in the oxygen increasing mode.

[0178] Specifically, the air supply unit 149 is connected to the side surface of the upstream portion 142u of the circulation pipe 142. The air supply unit 149 supplies air to the upstream portion 142u of the circulation pipe 142.

[0179] The circulation FFU 144 sucks in the air supplied from the air supply unit 149, filters the air, and blows out the air. Here, the circulation FFU 144 sucks in the air at the upstream portion 142u, filters the air, and blows out the air toward the downstream portion 142v.

[0180] In addition, it is preferable that the circulation FFU 144 is driven even when the inert gas supply unit 148 and the air supply unit 149 do not supply the inert gas and the air, respectively. In this case, the circulation FFU 144 sucks the gas of the upstream part 142u, filters it, and blows it toward the downstream part 142v.

[0181] The gas supply unit 148 and the air supply unit 149 are connected to the side of the upstream portion 142u of the circulation pipe 142. Preferably, the connection portion between the gas supply unit 148 and the air supply unit 149 and the upstream portion 142u of the circulation pipe 142 faces the circulation FFU 144 via the upstream portion 142u of the circulation pipe 142. Thus, the circulation FFU 144 can efficiently inhale the inert gas supplied from the gas supply unit 148 and the air supplied from the air supply unit 149, and efficiently blow them toward the downstream portion 142v.

[0182] The transport FFU 126 includes a fan 126a, a filter 126b, and a housing 126h. The fan 126a and the filter 126b are disposed inside the housing 126h. The housing 126h is provided with an inlet for sucking in air and an outlet for blowing out air.

[0183] In the transport FFU 126, the fan 126a is arranged on the upstream side of the circulation path, and the filter 126b is arranged on the downstream side of the circulation path. The airflow blown out by the fan 126a is filtered by the filter 126b when passing through the filter 126b.

[0184] In addition, Figure 1A and Figure 1B to Figure 4 In the substrate processing apparatus 100 shown in FIG. 1 , the gas supply unit 148 supplies the inert gas through one pipe, but the present embodiment is not limited thereto. The gas supply unit 148 may supply the inert gas through a plurality of pipes.

[0185] Then, refer to Figure 5 , the gas adjustment unit 140 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 5 It is a schematic diagram of the substrate transfer unit 120 and the gas adjustment unit 140 in the substrate processing apparatus 100 . Figure 5 The gas adjustment unit 140 shown in FIG. 1 has the same structure as that of FIG. 1 except that the gas supply unit 148 has a plurality of pipes. Figure 4 The gas adjustment unit 140 has the same structure, and repeated description is omitted to avoid redundancy.

[0186] like Figure 5 As shown, the inert gas supply unit 148 includes a first supply unit 148a and a second supply unit 148b. The first supply unit 148a supplies the inert gas to the circulation pipe 142. The first supply unit 148a supplies the inert gas to the circulation pipe 142 at a relatively low flow rate. For example, the first supply unit 148a supplies the inert gas to the circulation pipe 142 in the oxygen reduction mode and / or the low oxygen maintenance mode.

[0187] The second supply unit 148b supplies the inert gas to the circulation pipe 142. The second supply unit 148b supplies the inert gas to the circulation pipe 142 at a higher flow rate than the first supply unit 148a. For example, the second supply unit 148b supplies the inert gas to the circulation pipe 142 in the oxygen down mode.

[0188] For example, the flow rate of the inert gas supplied by the second supply unit 148b may be more than 2 times and less than 100 times the flow rate of the inert gas supplied by the first supply unit 148a. Preferably, the type of the inert gas supplied by the second supply unit 148b is the same as the type of the inert gas supplied by the first supply unit 148a.

[0189] The first supply unit 148a, the second supply unit 148b, and the air supply unit 149 are connected to the side of the upstream portion 142u of the circulation pipe 142. Preferably, the connection portion between the first supply unit 148a, the second supply unit 148b, and the air supply unit 149 and the upstream portion 142u of the circulation pipe 142 faces the circulation FFU 144 via the upstream portion 142u of the circulation pipe 142. Thus, the circulation FFU 144 can efficiently inhale the inert gas supplied from the first supply unit 148a and the second supply unit 148b and the air supplied from the air supply unit 149, and efficiently blow them toward the downstream portion 142v.

[0190] For example, in the oxygen reduction mode, the first supply unit 148a and the second supply unit 148b each supply an inert gas to the circulation pipe 142. By supplying the inert gas using the first supply unit 148a and the second supply unit 148b, the oxygen concentration of the gas in the substrate transfer unit 120 can be quickly reduced.

[0191] In the low oxygen maintenance mode, the first supply unit 148a supplies the inert gas to the circulation pipe 142. At this time, the second supply unit 148b does not supply the inert gas to the circulation pipe 142. Thus, the oxygen concentration of the gas in the substrate conveying unit 120 can be maintained while suppressing the consumption of the inert gas.

[0192] In addition, if Figure 5As shown in FIG. 1 , it is preferable to configure an oxygen concentration meter 128 in the substrate conveying unit 120. The pressure in the substrate conveying unit 120 can be measured by the oxygen concentration meter 128. In addition, the valve 146v configured in the exhaust pipe 146 is opened and closed by the drive of the motor 146m. The opening and closing of the valve 146v is preferably controlled by the motor 146m driven according to the measurement result of the oxygen concentration meter 128.

[0193] For example, the control unit 102 (see Figure 1A and Figure 1B ) The valve 146v is controlled according to the measurement result of the oxygen concentration meter 128, and the first supply unit 148a, the second supply unit 148b and the air supply unit 149 are controlled. Thus, the oxygen concentration of the gas in the substrate conveying unit 120 can be appropriately adjusted.

[0194] In addition, in the frame 124, the air pressure inside the transfer robot 122 is substantially constant with the air pressure outside the transfer robot 122, but sometimes a fan is provided inside the transfer robot 122 to make the inside of the transfer robot 122 slightly negative pressure relative to the outside, so as to prevent the fine dust inside the transfer robot 122 from spreading to the outside of the transfer robot 122 due to the operation of the transfer robot 122. In this case, it is preferred to provide the frame 124 with an exhaust port 124p located outside the transfer robot 122, and to provide another exhaust port that connects the inside of the transfer robot 122 to the circulation pipe 142.

[0195] Then, refer to Figure 6 , the gas adjustment unit 140 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 6 It is a schematic diagram of the substrate transfer unit 120 and the gas adjustment unit 140 in the substrate processing apparatus 100 . Figure 6 The gas adjustment unit 140 shown in FIG. 1 has the same characteristics as those of the reference except that a plurality of fan filter units are arranged in parallel as the circulation FFU 144. Figure 5 The gas adjustment unit 140 has the same structure, and repeated description is omitted to avoid redundancy.

[0196] like Figure 6 As shown, the first fan filter unit 144A and the second fan filter unit 144B are arranged in parallel as the circulation FFU 144. In this specification, the first fan filter unit 144A is sometimes described as FFU144A, and the second fan filter unit 144B is sometimes described as FFU144B.

[0197] The FFU 144A includes a fan 144Aa, a filter 144Ab, and a frame 144Ah. The second fan filter unit 144B includes a fan 144Ba, a filter 144Bb, and a frame 144Bh.

[0198] The FFU 144A and the second fan filter unit 144B are respectively arranged along the flow path of the circulation pipe 142. Here, the second fan filter unit 144B is arranged on the downstream side compared with the FFU 144A. In addition, the FFU 144A and the second fan filter unit 144B are respectively provided on the partition wall 142w.

[0199] In addition, the first supply unit 148a, the second supply unit 148b, and the air supply unit 149 are connected to the side of the upstream portion 142u of the circulation pipe 142. It is preferred that the connection portion between the first supply unit 148a, the second supply unit 148b, and the air supply unit 149 and the upstream portion 142u of the circulation pipe 142 faces at least one of the FFU144A and the FFU144B, or faces between the FFU144A and the FFU144B. In particular, it is preferred that the connection portion between the first supply unit 148a, the second supply unit 148b, and the air supply unit 149 and the upstream portion 142u of the circulation pipe 142 faces the FFU144B, or faces between the FFU144A and the FFU144B. Thus, the circulation FFU 144 can efficiently suck the inert gas supplied from the first supply part 148 a and the second supply part 148 b and the air supplied from the air supply part 149 , and efficiently blow them toward the downstream part 142 v .

[0200] In the substrate processing apparatus 100 of this embodiment, the control unit 102 controls the first supply unit 148a, the second supply unit 148b, and the air supply unit 149 in addition to the transfer robot 122, the transfer FFU 126, and the circulation FFU 144. Thus, the oxygen concentration of the gas in the substrate transfer unit 120 can be adjusted.

[0201] Below, refer to 7A to 7C , adjustment of the oxygen concentration of the substrate conveying unit 120 by the gas adjustment unit 140 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 7A to Figure 7C Schematic diagrams of the substrate processing apparatus 100 in oxygen reduction mode, low oxygen maintenance mode, and oxygen increase mode, respectively. Figure 7A to Figure 7C In, only Figure 1A and Figure 1B The substrate transfer unit 120 and the gas adjustment unit 140 in the substrate processing apparatus 100 shown in FIG.

[0202] like Fig. 7AAs shown, in the case of oxygen reduction mode, the substrate processing apparatus 100 replaces the gas of the substrate conveying unit 120 with an inert gas, thereby reducing the oxygen concentration of the gas in the substrate conveying unit 120. In this case, the first supply unit 148a and the second supply unit 148b supply the inert gas to the circulation pipe 142. The FFU 144A and the FFU 144B are driven to blow the inert gas downstream. The inert gas flowing in the circulation pipe 142 reaches the conveying FFU 126, and the conveying FFU 126 blows the inert gas into the frame 124.

[0203] The valve 146 v is opened, and the exhaust pipe 146 exhausts the gas in the substrate transport unit 120 . Therefore, the air in the substrate transport unit 120 passes through the circulation pipe 142 and is exhausted to the outside through the exhaust pipe 146 .

[0204] By continuing the supply of the inert gas to the substrate transport unit 120 and the exhaust of the gas from the substrate transport unit 120 for a predetermined time, the oxygen concentration of the gas in the substrate transport unit 120 can be reduced. For example, before the start of the oxygen reduction mode, the oxygen concentration of the gas in the substrate transport unit 120 is about 20%, but at the end of the oxygen reduction mode, the oxygen concentration of the gas in the substrate transport unit 120 can be reduced to about 1000 ppm.

[0205] like Figure 7B As shown, when the low oxygen mode is maintained, the substrate processing apparatus 100 maintains the oxygen concentration of the gas in the substrate transport unit 120. In this case, the first supply unit 148a supplies the inert gas to the circulation pipe 142, while the second supply unit 148b does not supply the inert gas to the circulation pipe 142. The FFU 144A and the FFU 144B are driven to blow the inert gas downstream. The inert gas flowing in the circulation pipe 142 reaches the transport FFU 126, and the transport FFU 126 blows the inert gas into the frame 124.

[0206] The valve 146v is closed, and the exhaust pipe 146 does not exhaust the gas from the substrate transport unit 120. Therefore, the air from the substrate transport unit 120 passes through the exhaust port 124p and the circulation pipe 142 to reach the FFU144A and FFU144B. The FFU144A and FFU144B blow the gas into the frame 124 again. In addition, it is preferred that the flow rate from the first supply unit 148a is the amount of gas leaking from the substrate transport unit 120 and / or the circulation pipe 142.

[0207] Thus, the substrate conveyor 120 conveys the substrate W in a state where the oxygen concentration of the gas in the substrate conveyor 120 is reduced. After the processing of the substrate W is completed, the oxygen concentration of the gas in the substrate conveyor 120 is restored from the reduced state to the normal state.

[0208] like Figure 7C As shown, in the case of the oxygen increase mode, the substrate processing apparatus 100 replaces the gas in the substrate transport unit 120 with air, thereby increasing the oxygen concentration of the gas in the substrate transport unit 120. In this case, the air supply unit 149 supplies air to the circulation pipe 142. The FFU 144A and the FFU 144B are driven to blow air downstream. The air flowing in the circulation pipe 142 reaches the transport FFU 126, and the transport FFU 126 blows air into the frame 124.

[0209] The valve 146 v is opened, and the gas (mainly inert gas) in the substrate transport unit 120 is exhausted from the exhaust pipe 146 . Therefore, the gas in the substrate transport unit 120 passes through the circulation pipe 142 and is exhausted to the outside through the exhaust pipe 146 .

[0210] The supply of air to the substrate transport unit 120 and the exhaust of air from the substrate transport unit 120 are continued for a predetermined time, thereby increasing the oxygen concentration of the gas in the substrate transport unit 120. For example, before the start of the oxygen increase mode, the oxygen concentration of the gas in the substrate transport unit 120 is about 1000 ppm, but at the end of the oxygen increase mode, the oxygen concentration of the gas in the substrate transport unit 120 can be increased to about 20%.

[0211] As described above, in the substrate processing apparatus 100 of the present embodiment, the substrate transfer unit 120 can be switched to any one of the oxygen reduction mode, the low oxygen maintenance mode, and the oxygen increase mode, and the oxygen concentration of the gas in the substrate transfer unit 120 can be adjusted.

[0212] In addition, Figure 6 In the loop FFU 144 shown in FIG. 7 , FFU 144A and FFU 144B are arranged in parallel along the vertical direction, but the present embodiment is not limited thereto. FFU 144A and FFU 144B may also be arranged in parallel along the horizontal direction. For example, FFU 144A and FFU 144B may also be arranged in parallel along the Y direction.

[0213] Typically, a lubricant of an organic solvent is applied to the transport robot 122 to enable the transport robot 122 to operate smoothly. In this case, if the vaporized component of the lubricant flows in the circulation pipe 142 and passes through the circulation FFU 144 and the transport FFU 126, the fan 144a, the filter 144b, the fan 126a and / or the filter 126b may be contaminated. Therefore, it is preferred to provide a chemical filter in at least one of the circulation FFU 144 and the transport FFU 126. In particular, it is preferred that the circulation FFU 144 located on the upstream side of the circulation pipe 142 includes a chemical filter.

[0214] Here, refer to Fig. 8A and Figure 8B, the structure of the circulation FFU 144 of the gas adjustment unit 140 in the substrate processing apparatus 100 of the present embodiment will be described. Fig. 8A It is a schematic partial enlarged view of the gas adjustment unit 140 in the substrate processing apparatus 100 .

[0215] like Fig. 8A As shown, the circulation FFU 144 includes a chemical filter 144c in addition to the fan 144a and the filter 144b. Here, the fan 144a, the filter 144b and the chemical filter 144c are arranged in this order from the upstream to the downstream of the circulation pipe 142.

[0216] The fan 144a sucks in external gas and blows the gas in a predetermined direction. The filter 144b filters suspended matter in the passing gas. The chemical filter 144c adsorbs organic solvents in the passing gas. The chemical filter 144c adsorbs the gasified components of the lubricating oil even if the lubricating oil of the transfer robot 122 is vaporized and mixed into the gas, thereby preventing the fan 144a and the filter 144b from being contaminated by the lubricating oil.

[0217] In addition, Fig. 8A In the circulation FFU 144 shown in FIG, the fan 144a, the filter 144b, and the chemical filter 144c are sequentially arranged from upstream to downstream of the circulation pipe 142, but the present embodiment is not limited thereto. The fan 144a, the filter 144b, and the chemical filter 144c may be arranged in another order.

[0218] like Figure 8B As shown, the chemical filter 144c can also be arranged on the upstream side compared with the fan 144a and the filter 144b. Thus, when the circulation starts or the driving of the conveying robot 122 starts, even if a relatively large amount of gasified components of the organic solvent flows into the circulation pipe 142, the fan 144a and the filter 144b can be prevented from being contaminated by the organic solvent.

[0219] In addition, Figure 8B In the embodiment, the chemical filter 144c is arranged in the frame 144h of the circulation FFU 144, but the present embodiment is not limited thereto. The chemical filter 144c may also be installed outside the frame 144h. Alternatively, the chemical filter 144c may also be arranged at a place away from the frame 144h. For example, the chemical filter 144c may also be arranged at the upstream portion 142u of the circulation piping 142.

[0220] In this way, the gas supply unit 148 can also supply gas to the fan 144a and the filter 144b without passing through the chemical filter 144c. Thus, the organic solvent in the circulation pipe 142 is adsorbed by the chemical filter 144c, and even if the chemical filter 144c is slightly contaminated, the inert gas from the gas supply unit 148 can be supplied to the downstream of the circulation pipe 142 with little contamination.

[0221] in addition, Figure 1A and Figure 1B to Figure 8A and Figure 8B The circulation FFU144 of the gas adjustment unit 140 shown in the figure is arranged along the flow path along the vertical direction in the circulation piping 142, and the long side direction of the circulation FFU144 is arranged along the vertical direction, but the present embodiment is not limited to this. The circulation FFU144 may also be arranged along the flow path along the horizontal direction in the circulation piping 142, and the long side direction of the circulation FFU144 may also be arranged along the horizontal direction. For example, when the horizontal portion extending in the horizontal direction in the circulation piping 142 is longer than the vertical portion extending in the vertical direction in the circulation piping 142, it is preferred that the long side direction of the circulation FFU144 is arranged along the horizontal direction. In this way, the oxygen component remaining in the circulation piping 142 can be reduced, and the oxidation of the substrate W when the substrate W is transported in the substrate transport unit 120 can be suppressed.

[0222] in addition, Figure 1A and Figure 1B The substrate processing apparatus 100 shown in FIG. 1 includes one substrate processing unit 130 , but the present embodiment is not limited thereto. The substrate processing apparatus 100 may include a plurality of substrate processing units 130 .

[0223] Below, refer to Fig. 9 A substrate processing apparatus 100 according to this embodiment will be described. Fig. 9 1 is a schematic top view of the substrate processing apparatus 100 . Fig. 9 The substrate processing apparatus 100 shown in FIG. 1 has the same structure as that of the reference 1 except that it includes a plurality of substrate processing units 130, a gas circulation cabinet 140A, a processing liquid cabinet 150, and a boundary wall 160. Figure 1A and Figure 1B The above-mentioned substrate processing apparatus 100 has the same structure, and repeated description is omitted to avoid redundancy.

[0224] like Fig. 9 As shown in FIG. 1 , the substrate processing apparatus 100 of the present embodiment includes a plurality of substrate processing units 130. The plurality of substrate processing units 130 form a plurality of towers TW ( Fig. 9 Each tower TW includes a plurality of substrate processing units 130 ( Fig. 9There are three substrate processing units in the figure).

[0225] In addition, the substrate processing apparatus 100 of the present embodiment includes a gas circulation cabinet 140A, a processing liquid cabinet 150, and a boundary wall 160 in addition to the indexing unit 110, the substrate transport unit 120, the substrate processing unit 130, and the gas adjustment unit 140. The gas circulation cabinet 140A accommodates a portion of the circulation piping 142 and the circulation FFU 144. For example, the gas circulation cabinet 140A accommodates the circulation FFU 144 and the side pipe 142q of the circulation piping 142 (see Figure 1A and Figure 1B as well as Figure 4 ).

[0226] The gas circulation cabinet 140A supplies gas to the substrate conveying unit 120 . Also, the gas circulation cabinet 140A exhausts gas from the substrate conveying unit 120 .

[0227] In the substrate processing apparatus 100, three processing liquid tanks 150A, 150B, and 150C are arranged as processing liquid tanks 150. The processing liquid tank 150A is arranged adjacent to the processing liquid tank 150B, and the processing liquid tank 150C is arranged adjacent to the gas circulation tank 140A.

[0228] In addition, the processing liquids in the processing liquid tank 150A, the processing liquid tank 150B, and the processing liquid tank 150C are supplied to the substrate processing unit 130. Fig. 9 In order to avoid making the drawing too complicated, the supply and recovery paths of the processing liquid from the processing liquid tank 150A to each tower TW are shown.

[0229] The boundary wall 160 is located at the boundary between the region where the index unit 110, the substrate transfer unit 120, and the substrate processing unit 130 are provided and the region where the gas circulation cabinet 140A and the processing liquid cabinet 150 are provided. The height of the boundary wall 160 is preferably the same as the height of the tower TW of the substrate processing unit 130.

[0230] In the area where the index unit 110, the substrate transfer unit 120, and the substrate processing unit 130 are provided, the substrate W is transferred or processed. In the area where the gas circulation cabinet 140A and the processing liquid cabinet 150 are provided, the gas or processing liquid supplied to the substrate transfer unit 120 and / or the substrate processing unit 130 is adjusted.

[0231] Preferably, an operator can enter and operate the area where the gas circulation cabinet 140A and the processing liquid cabinet 150 are installed even when the substrate W is being transported or processed. For example, an operation area is formed between the processing liquid cabinet 150A and the processing liquid cabinet 150B and the gas circulation cabinet 140A and the processing liquid cabinet 150C. Even when the substrate W is being transported or processed, the operator of the substrate processing apparatus 100 can enter the operation area and adjust the gas or processing liquid of the gas circulation cabinet 140A and the processing liquid cabinet 150.

[0232] Above, the embodiments of the present invention are described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments, and can be implemented in various forms without departing from the main purpose thereof. In addition, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the embodiments. For example, several constituent elements can also be removed from all the constituent elements shown in the embodiments. Furthermore, constituent elements related to different embodiments can also be appropriately combined. For easy understanding, the accompanying drawings are schematically represented with each constituent element as the main body, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings are different from the actual situation due to the relationship of the drawing production. In addition, the material, shape, size, etc. of each constituent element shown in the embodiments are an example, and are not particularly limited. Various changes can be made within the scope of not substantially departing from the effect of the present invention.

[0233] Industrial Applicability

[0234] The present invention can be suitably used in a substrate processing apparatus.

Claims

1. A substrate processing device, comprising: Indexing robot, moving in substrates; An indexing unit, provided with the indexing robot; A substrate processing unit for processing the substrate; A transport robot transports the substrate between the indexing section and the substrate processing section; A substrate conveying unit, provided with the conveying robot; A conveying fan filter unit is arranged on the upper part of the substrate conveying part; An exhaust port is provided in the substrate conveying part; a circulation pipe connecting the exhaust port of the substrate conveying unit to the conveying fan filter unit; An exhaust pipe connected to the circulation pipe; an inert gas supply unit that supplies an inert gas to the circulation pipe; and The circulation fan filter unit is arranged downstream of the connection portion of the circulation piping with the exhaust pipe and in parallel with the flow path of the circulation piping. A partition wall is provided inside the side pipe of the circulation pipe, and the side pipe of the circulation pipe is divided into an upstream portion and a downstream portion by the partition wall. The circulating fan filter unit comprises a fan and a filter, The circulation fan filter unit is configured in a manner extending along the vertical direction. The fan sucks gas from the upstream portion of the side duct from a suction port on one side of the fan, and blows the gas toward the filter from a blow port on the other side of the fan. The filter receives the gas sent by the fan from an inlet on one side of the filter, and allows the gas to flow to the downstream portion of the side pipe from an outlet on the other side of the filter. 2 . The substrate processing apparatus according to claim 1 , further comprising a valve adjusting a flow of the gas passing through the exhaust pipe. 3 . The substrate processing apparatus according to claim 1 , wherein the circulation fan filter unit blows the inert gas supplied from the inert gas supply part toward the circulation pipe.

4. The substrate processing apparatus according to claim 1, wherein the inert gas supply unit comprises: a first supply unit that supplies the inert gas toward the circulation pipe at a first flow rate; and The second supply unit supplies the inert gas toward the circulation pipe at a second flow rate greater than the first flow rate.

5. The substrate processing apparatus according to claim 4, wherein in the case of the oxygen down mode, the first supply unit and the second supply unit respectively supply the inert gas to the circulation pipe, When the hypoxic mode is maintained, the first supply unit supplies the inert gas to the circulation pipe. 6 . The substrate processing apparatus according to claim 1 , further comprising an air supply unit that supplies air to the circulation pipe. 7 . The substrate processing apparatus according to claim 6 , wherein in a case of an oxygen increasing mode, the air supply unit supplies the air toward the circulation pipe. 8 . The substrate processing apparatus according to claim 6 , wherein the circulation fan filter unit blows out the air supplied from the air supply part toward the circulation pipe. 9 . The substrate processing apparatus according to claim 1 , wherein a plurality of fan filter units are arranged in parallel as the circulation fan filter unit. 10 . The substrate processing apparatus according to claim 1 , wherein the circulation fan filter unit further comprises a chemical filter. 11 . The substrate processing apparatus according to claim 1 , further comprising a gas circulation cabinet accommodating a portion of the circulation pipe and the circulation fan filter unit. 12 . The substrate processing apparatus according to claim 11 , further comprising a processing liquid tank adjacent to the gas circulation tank and configured to supply processing liquid to the substrate processing part.

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