An LED integrated lamp bead capable of simulating a standard light source and a spectrum adjustment adaptation method

Abstract

The present invention discloses an LED integrated lamp bead capable of simulating a standard light source and a spectrum adjustment adaptation method. The LED integrated lamp bead of the present invention comprises a substrate, an LED chip and a fluorescent adhesive layer. A PCB circuit is integrated on the substrate, and the PCB circuit is electrically connected to the LED chip. The LED chips are in multiple groups, and the multiple groups of LED chips are arranged in parallel. Each group of LED chips comprises multiple LED chips, and multiple LED chips in each group are arranged in series. The multiple groups of LED chips are evenly arranged on the substrate in a rectangular array and are welded and fixed to the substrate. The fluorescent adhesive layer covers the top of multiple LED chips and the substrate for spectrum adjustment and overall packaging. The LED integrated lamp bead has a reasonable design, a simple structure, and high operational flexibility. It can realize the fitting of multiple standard spectra, has good spectrum continuity, and a high matching degree. At the same time, the LED integrated lamp bead can also achieve the beneficial effects of energy saving and environmental protection, long service life, high energy efficiency, low cost, and adjustable brightness, and has a good market application prospect.

Description

Technical Field

[0001] The present invention relates to the technical field of spectrum adjustment and adaptation, and more particularly to an LED integrated lamp bead capable of simulating a standard light source and a spectrum adjustment and adaptation method. Background Art

[0002] The spectral distribution characteristics of the light source have a very important influence on the color rendering index, color temperature, color difference, etc. of the light source. In some special lighting fields, such as textiles, printing and dyeing, plastics, pigments, inks, paints, photography occasions, etc., there are strict color control requirements for light sources. At this time, it is necessary to use lighting sources that meet the standards, such as D65 international standard artificial daylight, D50 simulated sunlight, TL84 Chinese commercial simulated light source, etc. In order to achieve the lighting of standard light sources, it is necessary to have a light source that meets the standard light source. The existing ordinary light source is a fluorescent tube, which often needs to be matched with a certain light box structure to achieve the lighting of the light source. Although the spectral characteristics of the general light source are somewhat different from the actual light source, it has a decisive influence on its spectral characteristics. Therefore, it is extremely valuable to study the method of achieving high spectral matching of the light source.

[0003] Therefore, it is an urgent problem for technical personnel in this field to provide an LED integrated lamp bead and a spectrum adjustment adaptation method that can simulate a standard light source and has good spectral continuity, high matching degree, high operational flexibility, and can meet the lighting needs of a standard lighting source. Summary of the invention

[0004] In view of this, in order to solve the technical problems in the prior art that the spectral characteristics of the light-emitting body are certain different from the actual light source, resulting in the inability to effectively obtain the required standard light source, the present invention, on the one hand, provides an LED integrated lamp bead that has good spectral continuity, high matching degree, high operational flexibility, and can meet the lighting needs of standard lighting sources and can simulate a standard light source.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions on one hand:

[0006] An LED integrated lamp bead capable of simulating a standard light source comprises a substrate, an LED chip and a fluorescent adhesive layer, wherein a PCB circuit is integrated on the substrate, and the PCB circuit is electrically connected to the LED chip; the LED chips are in multiple groups, the multiple groups of LED chips are arranged in parallel, each group of LED chips comprises multiple LED chips, and the multiple LED chips in each group are arranged in series, the multiple groups of LED chips are evenly arranged in a rectangular array on the substrate and are welded and fixed to the substrate; the fluorescent adhesive layer covers the multiple LED chips and the top of the substrate, and is used for spectrum adjustment and overall packaging.

[0007] Through the above technical solutions, it can be known that compared with the prior art solutions, the present invention discloses, on the one hand, a LED integrated lamp bead capable of simulating a standard light source, which can realize the power supply to the LED chip on the substrate by utilizing the substrate and the PCB circuit on the substrate, and ensure that the LED chip plays a normal lighting role as a light source, and the LED chips on the substrate are arranged in a rectangular array, so as to realize the fitting of a variety of standard spectra, and the light source spectrum fitted by the LED integrated lamp bead has good continuity and a higher spectral matching degree, and the energy proportion of a specific band of the LED chip can be adjusted by using the fluorescent glue layer, so as to further achieve the purpose of fitting the target spectrum. The LED integrated lamp bead capable of simulating a standard light source of the present invention not only has a reasonable design, a simple structure, and high operational flexibility, but also can realize the fitting of a variety of standard spectra, and has good spectral continuity and high matching degree, so that the LED integrated lamp bead can achieve the beneficial effects of energy saving and environmental protection, long service life, high energy efficiency, low cost and adjustable brightness, and has a good market application prospect.

[0008] Furthermore, the substrate is made of a copper substrate material or an alumina ceramic substrate material.

[0009] The beneficial effect of adopting the above technical solution is that the LED integrated lamp bead has good thermal conductivity, can withstand mechanical and thermal stress, has strong anti-aging ability and a long service life.

[0010] Furthermore, the material of the fluorescent adhesive layer is a mixed colloid of fluorescent powder and light-transmitting adhesive, and the weight of the fluorescent powder accounts for 5-25% of the total weight of the fluorescent adhesive layer.

[0011] Optionally, the fluorescent powder includes three types: blue powder, green powder and red powder, wherein the blue powder emits light waves in the 420-490nm band, the green powder emits light waves in the 500-580nm band, and the red powder emits light waves in the 600-650nm band.

[0012] The beneficial effect of adopting the above technical solution is that by adjusting the composition ratio of different types of phosphors in the fluorescent glue layer, the energy proportion of a specific band can be directionally adjusted so that the integrated lamp bead can achieve the purpose of fitting the target spectrum and obtain fitting of multiple standard spectra.

[0013] Furthermore, the thickness of the fluorescent glue layer is 200-300 μm.

[0014] The beneficial effect of adopting the above technical solution is that the emission peaks of the first and second spectrum can be adjusted by adjusting the thickness of the fluorescent glue layer. At the same time, the fluorescent glue layer can also be used to achieve the overall packaging of the LED chip and fix the LED chip array on the substrate.

[0015] Furthermore, the LED chip is a multi-band LED chip, and the multi-band LED chip is an integrated multi-chip structure.

[0016] Optionally, the power of a single LED chip is 1 W, and the power of each group of LED chips is above 10 W.

[0017] The beneficial effect of adopting the above technical solution is that the composition of multiple LED chips in the LED integrated lamp bead is highly flexible, and it is easier to achieve matching with the target spectrum.

[0018] Furthermore, the multi-band LED chip includes an excitation band LED and a direct radiation band LED, and the light wave emitted by the excitation band LED matches the excitation wavelength of the phosphor in the fluorescent glue layer.

[0019] The beneficial effect of adopting the above technical solution is that the light wave emitted by the excitation band LED matches the excitation wavelength of the phosphor in the fluorescent glue layer, which can excite the phosphor to produce new light radiation and produce a first type of spectrum. The unexhausted excitation light of the excitation band LED can be mixed with the direct radiation light of the direct radiation band LED to produce a second type of spectrum. At the same time, the short-wave component in the direct radiation band LED can also excite the phosphor.

[0020] Furthermore, the excitation band LED adopts a blue light LED, and the peak wavelength of the blue light LED is 430-480nm.

[0021] Optionally, the peak wavelength of the blue light LED is one of 435nm, 460nm or 470nm.

[0022] The beneficial effect of adopting the above technical solution is that the peak wavelength of the excitation band LED is in the short-wave band, which has a high matching degree with the excitation wavelength of the phosphor, can be used as the main energy source for exciting the phosphor, and improves the excitation efficiency of the phosphor.

[0023] Furthermore, the direct radiation band LED includes one or more of a blue-violet LED, a red light LED and a near-infrared light LED, and the peak wavelength of the blue-violet LED is 380-430nm, the peak wavelength of the red light LED is 680-720nm, and the peak wavelength of the near-infrared light LED is 720-780nm.

[0024] The beneficial effect of adopting the above technical solution is that the blue-violet light in the direct radiation band LED can cooperate with the excitation band LED to excite the phosphor, and the red light and near-infrared light in the direct radiation band LED can be mixed with the unexhausted excitation light of the excitation band LED to produce two types of spectra, so that the spectrum continuity of the integrated lamp bead is good and the matching degree with the excitation wavelength of the phosphor is higher.

[0025] On the other hand, the present invention also discloses a spectrum adjustment and adaptation method for LED integrated lamp beads that can simulate a standard light source, comprising the following steps: first, a plurality of LED chips are evenly arranged in a rectangular array on a substrate, and the plurality of LED chips are divided into a plurality of groups of LED chips arranged in parallel, each group of LED chips includes a plurality of LED chips arranged in series, and the number of LED chips in each group of LED chips is the same; secondly, a PCB circuit in the substrate is powered on, and the current is adjusted so that the current difference between different groups of LED chips is controlled within 10%, and the voltages of different LED chips in the same group are ensured to be similar; finally, the light source spectrum energy transmitted by the LED chip through the fluorescent glue layer is observed and recorded.

[0026] It can be seen from the above technical solution that, compared with the prior art, the second aspect of the present invention provides a method for adjusting and adapting the spectrum of LED integrated lamp beads that can simulate a standard light source. The operation is simple, and the purpose of global linear adjustment of the current can be achieved during the operation. It has high flexibility, and can fit a variety of standard spectra by adjusting the arrangement of the LED chips. The spectrum has good continuity and high matching degree. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0028] Figure 1 The accompanying drawing is a schematic structural diagram of an LED integrated lamp bead capable of simulating a standard light source provided by the present invention;

[0029] Figure 2 The accompanying drawing is a front view of an LED integrated lamp bead capable of simulating a standard light source provided by the present invention;

[0030] Figure 3 The accompanying drawing is one of the single experimental spectrum diagrams of an LED integrated lamp bead provided by the present invention that can simulate a standard light source;

[0031] Figure 4 The accompanying drawing is a second single-unit experimental spectrum diagram of an LED integrated lamp bead capable of simulating a standard light source provided by the present invention;

[0032] Figure 5 The accompanying drawing is a third single-unit experimental spectrum diagram of an LED integrated lamp bead capable of simulating a standard light source provided by the present invention;

[0033] Figure 6The accompanying drawing is a single experimental color rendering index diagram of an LED integrated lamp bead provided by the present invention that can simulate a standard light source.

[0034] Among them: 1-substrate, 2-LED chip, 3-fluorescent adhesive layer. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] The present invention discloses an LED integrated lamp bead capable of simulating a standard light source, comprising a substrate 1, an LED chip 2 and a fluorescent adhesive layer 3, wherein a PCB circuit is integrated on the substrate 1, and the PCB circuit is electrically connected to the LED chip 2; the LED chips 2 are divided into multiple groups, the multiple groups of LED chips 2 are arranged in parallel, each group of LED chips 2 comprises multiple LED chips 2, and the multiple LED chips 2 in each group are arranged in series, the multiple groups of LED chips 2 are evenly arranged on the substrate 1 in a rectangular array and are welded and fixed to the substrate 1; the fluorescent adhesive layer 3 covers the multiple LED chips 2 and the top of the substrate 1, and is used for spectrum adjustment and overall packaging.

[0041] According to an optional embodiment of the present invention, the substrate 1 is made of a copper substrate material, so that the LED integrated lamp bead has good thermal conductivity, can withstand mechanical and thermal stress, has strong anti-aging ability, and has a long service life.

[0042] According to an optional embodiment of the present invention, the material used for the fluorescent glue layer 3 is a mixed colloid of fluorescent powder and light-transmitting glue; specifically, the weight of the fluorescent powder accounts for 5-25% of the total weight of the fluorescent glue layer, and the fluorescent powder includes green powder and red powder, wherein the red fluorescent powder is a nitrogen oxide fluorescent powder doped with rare earth elements, and the green fluorescent powder is a chlorate fluorescent powder doped with rare earth elements, the green powder emits light waves in the 500-580nm band, and the red powder emits light waves in the 600-650nm band. By adjusting the composition ratio of different types of fluorescent powders in the fluorescent glue layer, the energy proportion of a specific band can be directionally adjusted so that the integrated lamp bead can achieve the purpose of fitting the target spectrum.

[0043] According to an optional embodiment of the present invention, the thickness of the fluorescent glue layer 3 is 250 μm, so that the emission peaks of the first and second spectrum can be adjusted. At the same time, the fluorescent glue layer can also be used to achieve overall packaging of the LED chip and fix the LED chip array on the substrate.

[0044] According to an optional embodiment of the present invention, the LED chip 2 adopts a multi-band LED chip, and the multi-band LED chip is an integrated multi-chip structure; specifically, the power of a single LED chip 2 is 1W, and the power of each group of LED chips 2 is 10W, so that the composition of multiple LED chips in the LED integrated lamp bead is highly flexible and it is easier to match the target spectrum.

[0045] According to an optional embodiment of the present invention, the multi-band LED chip includes an excitation band LED and a direct radiation band LED. The light wave emitted by the excitation band LED matches the excitation wavelength of the phosphor in the fluorescent glue layer 3, and can excite the phosphor to produce new light radiation, thereby generating a first type of spectrum. The unexhausted excitation light of the excitation band LED can be mixed with the direct radiation light of the direct radiation band LED to generate a second type of spectrum. At the same time, the short-wave component in the direct radiation band LED can also excite the phosphor.

[0046] According to an optional embodiment of the present invention, the excitation band LED adopts a blue light LED, and the peak wavelength of the blue light LED is 435nm, so that the peak wavelength of the excitation band LED is in the short wave band, which has a high matching degree with the excitation wavelength of the phosphor, and can be used as the main energy source for exciting the phosphor, thereby improving the excitation efficiency of the phosphor.

[0047] According to an optional embodiment of the present invention, the direct radiation band LED includes a blue-violet LED, a red light LED and a near-infrared light LED, and the peak wavelength of the blue-violet LED is 410nm, the peak wavelength of the red light LED is 700nm, and the peak wavelength of the near-infrared LED is 750nm. The blue-violet light in the direct radiation band LED can cooperate with the excitation band LED to excite the phosphor, and the red light and near-infrared light in the direct radiation band LED can be mixed with the unexhausted excitation light of the excitation band LED to produce two types of spectra, so that the spectral continuity of the integrated lamp bead is good and the matching degree with the excitation wavelength of the phosphor is higher.

[0048] On the other hand, the present invention also discloses a spectrum adjustment and adaptation method for LED integrated lamp beads that can simulate a standard light source, comprising the following steps: first, a plurality of LED chips 2 are evenly arranged in a rectangular array on a substrate 1, and the plurality of LED chips 2 are divided into a plurality of groups of LED chips 2 arranged in parallel, each group of LED chips 2 includes a plurality of LED chips 2 arranged in series, and the number of LED chips 2 in each group of LED chips 2 is the same; secondly, the PCB circuit in the substrate 1 is powered on, and the current is adjusted so that the current difference between different groups of LED chips 2 is controlled within 10%, and the voltages of different LED chips 2 in the same group are ensured to be similar; finally, the light source spectrum energy transmitted by the LED chip 2 through the fluorescent glue layer 3 is observed and recorded.

[0049] According to an optional embodiment of the present invention, the radiation spectrum of the simulated spectrum LED integrated lamp bead involved in the present invention is as shown in the attached Figure 3 -Attached Figure 5 As shown, its specific features are as follows:

[0050] Spectral feature 1 has a peak between 380-400nm. Spectral feature 1 is the peak generated by the emission spectrum of the purple LED. The number of purple LED chips accounts for 5%-25%;

[0051] Spectral feature 2 has a peak between 400-435nm. Spectral feature 2 is the peak generated by the emission spectrum of the blue-violet LED chip. The number of blue-violet LED chips accounts for 20%-40%;

[0052] Spectral feature three has a peak between 440-500nm. Spectral feature three is the peak generated by the emission spectrum of the blue light LED chip. The number of blue light chips accounts for 35%-55%, including chips with multiple wavelengths of 450nm, 465nm, and 480nm.

[0053] Spectral feature four, with a continuous smooth spectrum between 500-670nm, and the continuous smooth spectrum has multiple peaks between 500-600nm and multiple peaks between 600-670nm. Spectral feature four is the light wave component emitted by the blue light chip simultaneously exciting the red powder and the green powder, wherein the 500-580nm band is mainly generated by the green powder being excited and radiated by the blue light, and the 610-670nm band is mainly generated by the red powder being excited and radiated by the blue light. At the same time, the ultraviolet chip with a peak wavelength of 380-400nm can also excite the two phosphors to generate radiation light waves. Therefore, the radiation characteristics of the single LED integrated lamp bead are a combination of the radiation light waves of multiple chips themselves and the radiation light waves of the two phosphors being excited and radiated;

[0054] Spectral feature five has a peak between 670-720nm. Spectral feature five is mainly the red 690-700nm LED direct radiation light wave component, and contains the long-wave part where red powder is excited. The number of red LED chips accounts for 5%;

[0055] Spectral feature six has a peak between 720-760nm. Spectral feature six is ​​the deep red 730-750nm LED direct radiation light wave component, and the number of deep red LED chips accounts for 5%.

[0056] According to an optional embodiment of the present invention, the integrated lamp bead embodiment uses an LED chip array 2 formed by a blue LED chip as the main light, a purple light, a blue-purple light and a red light LED chip 2 as the supplementary light, and a fluorescent glue layer 3 with a suitable proportion of red and green phosphors to achieve a simulated D75 standard spectrum, as shown in the attached Figure 3 -Attached Figure 6 As shown, the experimental spectrum curve has good continuity, the average color rendering index Ra reaches 98.7, and the correlated color temperature is between 7350-7650K. On this basis, with a certain optical structure, the light source design requirements that meet the D75 standard can be achieved.

[0057] According to an optional embodiment of the present invention, the integrated lamp bead can be split into a combination lamp bead, which includes two single integrated lamp beads. The two single integrated lamp beads need to appear in pairs and be lit at the same time. After lighting, the target spectrum of the two single integrated lamp beads is consistent with the spectrum of the integrated lamp beads before splitting, thereby realizing the diversification of the forms of the integrated lamp beads.

[0058] The second aspect of the present invention provides a method for adjusting and adapting the spectrum of an LED integrated lamp bead that can simulate a standard light source. The method is simple to operate, can achieve the purpose of global linear adjustment of the current during operation, has high flexibility, and can fit a variety of standard spectra by adjusting the arrangement of the LED chips, and has good spectral continuity and high matching degree.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0060] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An LED integrated lamp bead capable of simulating a standard light source, characterized in that: The invention comprises a substrate (1), an LED chip (2) and a fluorescent glue layer (3); the substrate (1) is integrated with a PCB circuit, and the PCB circuit is electrically connected to the LED chip (2); the LED chips (2) are multiple groups, the multiple groups of LED chips (2) are arranged in parallel, each group of LED chips (2) comprises multiple LED chips (2), and the multiple LED chips (2) in each group are arranged in series, the multiple groups of LED chips (2) are evenly arranged in a rectangular array on the substrate (1) and are welded and fixed to the substrate (1); the fluorescent glue layer (3) covers the multiple LED chips (2) and the top of the substrate (1) for spectrum adjustment and overall packaging; The substrate (1) is made of a copper substrate material or an alumina ceramic substrate material; The material used for the fluorescent adhesive layer (3) is a mixed colloid of fluorescent powder and light-transmitting adhesive, and the weight of the fluorescent powder accounts for 5-25% of the total weight of the fluorescent adhesive layer (3); The LED chip (2) is a multi-band LED chip, and the multi-band LED chip is an integrated multi-chip structure; The multi-band LED chip comprises an excitation band LED and a direct radiation band LED, and the light wave emitted by the excitation band LED matches the excitation wavelength of the phosphor in the fluorescent glue layer (3); The excitation band LED adopts a blue light LED, and the peak wavelength of the blue light LED is 430-480nm; The direct radiation band LED includes one or more of a blue-violet LED, a red light LED and a near-infrared light LED, and the peak wavelength of the blue-violet LED is 380-430nm, the peak wavelength of the red light LED is 680-720nm, and the peak wavelength of the near-infrared light LED is 720-780nm.

2. The LED integrated lamp bead capable of simulating a standard light source according to claim 1, characterized in that: The thickness of the fluorescent glue layer (3) is 200-300 μm.

3. A spectrum adjustment and adaptation method for an LED integrated lamp bead capable of simulating a standard light source as claimed in any one of claims 1 to 2, characterized in that: The method comprises the following steps: firstly, arranging a plurality of LED chips (2) uniformly in a rectangular array on a substrate (1), and dividing the plurality of LED chips (2) into a plurality of groups of LED chips (2) arranged in parallel, wherein each group of LED chips (2) comprises a plurality of LED chips (2) arranged in series, and the number of LED chips (2) in each group of LED chips (2) is the same; secondly, energizing a PCB circuit in the substrate (1) and adjusting the current so that the current difference between different groups of LED chips (2) is controlled within 10%, and ensuring that the voltages of different LED chips (2) in the same group are similar; and finally, observing and recording the light source spectrum energy transmitted by the LED chips (2) through the fluorescent glue layer (3).

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