Integrated heat dissipation packaging structure based on array micro-spray structure and manufacturing method thereof

Abstract

The present invention discloses an integrated heat dissipation packaging structure based on an array micro-spray structure, comprising a CPU, an adapter plate and a housing, wherein the adapter plate is assembled in the housing, and the CPU is arranged on the packaging area of ​​the adapter plate and is sealed and connected with the adapter plate; the adapter plate is provided with a first input micro-channel, a second input micro-channel, a third input micro-channel and an output micro-channel, and a plurality of horizontal parallel grooves are arranged in the packaging area of ​​the adapter plate, and the two ends of the horizontal parallel grooves are respectively connected with the first input micro-channel and the output micro-channel, and a vertical array nozzle is arranged in the horizontal parallel groove, and the vertical array nozzle is connected with the second input micro-channel and the third input micro-channel in the vertical direction. The present invention also discloses a method for manufacturing the above-mentioned packaging structure. The present invention realizes turbulence by simultaneously arranging parallel straight-through grooves and vertical array micro-spray structures on the adapter plate, effectively improving the heat dissipation capacity while reducing the difficulty of the bonding process between the adapter plate and the CPU, thereby improving the mechanical strength of the CPU.

Description

Technical Field

[0001] The present invention relates to the field of microelectronic packaging, and more specifically to an integrated heat dissipation packaging structure based on an array micro-spray structure and a manufacturing method thereof. Background Art

[0002] With the continuous changes in the information age, the development of the semiconductor industry has made significant progress. In the face of the increasing demand for high performance and high integration, the continuous miniaturization of transistors is accompanied by a sharp increase in heat flux density. As the core component of modern computers, high-power CPUs have the characteristics of large area and high heat flux density. If the operating temperature of the CPU cannot be reduced in time, its performance will be greatly reduced. The current cooling methods include air cooling, heat pipe cooling, and integrated water cooling. However, with the development of small-scale integration of high-power CPUs, the heat flux density continues to increase, and the heat dissipation problem still becomes a problem that needs to be solved urgently in the development of high-power CPU applications.

[0003] In order to meet the heat dissipation requirements of high-power CPUs, microchannel heat dissipation technology, as an active heat dissipation technology, has extremely high heat dissipation capabilities. In 1981, Stanford University proposed a parallel straight-through silicon-based microchannel heat dissipation structure and demonstrated a 790W / cm 2 The heat dissipation capacity is 100W / cm2, and the optimal thermal resistance is 0.09℃ / W. In 2011, Georgia Institute of Technology proposed a three-dimensional integrated system concept integrating staggered cylindrical turbulent microchannel structure to achieve single-layer or multi-layer microchannel layered heat dissipation. Under the condition of flow rate of 70mL / min, 100W / cm2 can be achieved. 2 The temperature of the test chip with the highest power density was reduced to 47.9°C. In 2017, IMEC introduced a new 3D-shaped polymer multi-nozzle impingement cooler based on low-cost manufacturing technology for high-performance applications, designed to directly cool the back of high-performance chips or chip stacks. A 4×4 array jet impingement cooler with a diameter of 450μm was manufactured using PVC machining and packaged with a test chip for experimental characterization. The results show that for a flow rate of 600mL / min, the required pump power is only 0.4W, its thermal resistance is very low at 0.25K / W, and the entire chip surface has good temperature uniformity.

[0004] In the above scheme, the parallel straight-through microchannel has the characteristics of simple structure, small flow resistance, easy assembly and realization, but low heat dissipation efficiency. The staggered cylindrical spoiler microchannel has high heat dissipation efficiency, but its flow resistance is large and has high packaging requirements. If an open spoiler column microchannel is used to bond with a high-power CPU, the bonding process is difficult. The method of using an array micro-spray structure to achieve cooling has high heat dissipation efficiency because there is no thermal interface material, and the temperature distribution on the cooling surface can be uniform, but the structure has a large flow resistance. The cavity structure exposed by the bonding of the target cooling chip with the heat sink of the array micro-spray structure has stress deformation problems due to the vertical injection of the cooling medium, and the mechanical structure strength is at great risk, which may lead to performance degradation and reduced reliability of the high-power CPU. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an integrated heat dissipation packaging structure based on an array micro-spray structure and a manufacturing method thereof.

[0006] In order to achieve the above purpose, the technical solution of the present invention is:

[0007] An integrated heat dissipation packaging structure based on an array micro-spray structure comprises a CPU, an adapter plate and a shell, wherein the adapter plate is assembled in the shell, the upper surface of the adapter plate has a packaging area, the CPU is arranged on the packaging area and is sealed and connected to the adapter plate; the body of the adapter plate is provided with a first input micro-channel, a second input micro-channel, a third input micro-channel and an output micro-channel extending in vertical directions respectively, the packaging area of ​​the adapter plate is provided with a first guide structure and a plurality of horizontal parallel grooves, the two ends of the horizontal parallel grooves are respectively connected to the first input micro-channel and the output micro-channel through the first guide structure, a vertical array nozzle is provided in the horizontal parallel groove, and the vertical array nozzle is connected to the second input micro-channel and the third input micro-channel in the vertical direction; the shell is provided with flow channels respectively connected to the first input micro-channel, the second input micro-channel, the third input micro-channel and the output micro-channel.

[0008] Optionally, the first input microchannel is provided with a first outlet on the upper surface of the adapter plate, and a first inlet on the lower surface of the adapter plate; the output microchannel is provided with an output inlet on the upper surface of the adapter plate, and an output outlet on the lower surface of the adapter plate; and both ends of the horizontal parallel groove are respectively connected to the first outlet and output inlet through the first guide structure.

[0009] Optionally, a second flow guide structure and a plurality of horizontal parallel microchannels are further provided inside the adapter plate; the second input microchannel and the third input microchannel are respectively provided with a second outlet and a third outlet inside the adapter plate, and a second inlet and a third inlet are respectively provided on the lower surface of the adapter plate; the two ends of the horizontal parallel microchannels are respectively connected to the second outlet and the third outlet through the second flow guide structure; the vertical array nozzles are connected to the horizontal parallel microchannels in the vertical direction.

[0010] Optionally, the horizontal parallel microchannels and the horizontal parallel grooves are arranged perpendicular to each other.

[0011] Optionally, the top of the vertical array nozzle is a water outlet, and the water outlet is higher than the bottom of the horizontal parallel channel.

[0012] Optionally, the size of the water outlet of the vertical array nozzle is 30-100 microns.

[0013] Optionally, the apertures of the first input microfluidic channel, the second input microfluidic channel, the third input microfluidic channel and the output microfluidic channel are respectively gradually enlarged in a step-like manner from top to bottom, and are offset toward the outside of the packaging area at the step change locations.

[0014] Optionally, the back side of the CPU and the packaging area of ​​the adapter plate are connected by a graphic adhesive sealing layer, and the first input microchannel, the output microchannel, the first guide structure and the horizontal parallel grooves are closed to form a closed channel.

[0015] The manufacturing method of the above-mentioned integrated heat dissipation packaging structure based on the array micro-spray structure comprises the following steps:

[0016] 1) providing a high-resistance silicon wafer as a substrate for the adapter plate, manufacturing a first input microfluidic channel, a second input microfluidic channel, a third input microfluidic channel and an output microfluidic channel, and manufacturing a first flow guide structure, horizontal parallel channels and a vertical array nozzle in the packaging area;

[0017] 2) providing a housing having four flow channels, bonding the adapter plate to the housing, and making the first input micro-channel, the second input micro-channel, the third input micro-channel, and the output micro-channel correspond to and communicate with the four flow channels in a sealed manner;

[0018] 3) The back of the CPU is bonded to the packaging area of ​​the adapter plate through a patterned adhesive sealing layer, and the first input microchannel, the output microchannel, the first guide structure and the horizontal parallel grooves are closed to form a closed heat dissipation channel.

[0019] Optionally, step 1) further includes the following sub-steps:

[0020] 1.1 Provide a first high-resistance silicon wafer and a second high-resistance silicon wafer, make a first guide structure and a horizontal parallel groove on the upper surface of the first high-resistance silicon wafer, make two first slots penetrating the upper and lower surfaces and a vertical array nozzle penetrating the bottom of the horizontal parallel groove and the lower surface of the first high-resistance silicon wafer in the first high-resistance silicon wafer body, and the two ends of the horizontal parallel groove are respectively connected to the two first slots through the first guide structure in a one-to-one correspondence; make four second slots, a second guide structure and a horizontal parallel microchannel on the upper surface of the second high-resistance silicon wafer, and the two ends of the horizontal parallel microchannel are respectively connected to the two second slots in a one-to-one correspondence through the second guide structure, and make four third slots on the lower surface of the second high-resistance silicon wafer, and the second slots and the third slots are connected in a one-to-one correspondence, wherein the two second slots and the third slots connected to the horizontal parallel microchannel form a second input microchannel and a third input microchannel respectively;

[0021] 1.2 The lower surface of the first high-resistance silicon wafer and the upper surface of the second high-resistance silicon wafer are connected by a wafer-level bonding process to form an adapter plate, so that the two first slots and the other two second slots are matched one by one to form a first input microchannel and an output microchannel;

[0022] 1.3 Thinning the adapter plate.

[0023] The beneficial effects of the present invention are:

[0024] 1) A parallel straight-through microchannel is arranged on the upper surface of the adapter plate to align and bond with the back substrate of the high-power CPU, thereby reducing the mechanical impact of the vertically injected fluid on the high-power CPU and improving the mechanical strength of the bonding between the high-power CPU and the adapter plate;

[0025] 2) Parallel straight-through microchannels and vertical nozzles are simultaneously arranged on the upper surface of the adapter plate to achieve turbulence, and the advantages of small flow resistance of horizontal parallel channels and high heat dissipation efficiency of micro-spraying and turbulence are combined to make the formed structure optimal in terms of flow resistance and heat dissipation efficiency;

[0026] 3) The vertical nozzle wall surface arranged on the upper surface of the adapter plate is higher than the bottom surface of the horizontal parallel groove, so as to prevent the horizontally flowing liquid from directly pouring into the vertical nozzle, thereby reducing the performance of the jet and simplifying the structure for easy processing.

[0027] 4) The integrated water-cooling heat dissipation structure consisting of the adapter plate and the shell can be directly packaged to the back of the high-power CPU, which is convenient for commercialization. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of an integrated heat dissipation packaging structure based on an array micro-spray structure in an embodiment;

[0029] Figure 2 It is a schematic diagram of the structure of the adapter board;

[0030] Figure 3 yes Figure 2 and Figure 1 A top cross-sectional view along the directions a-a', b-b', c-c', and d-d';

[0031] Figure 4 is a top view schematic diagram of the connection relationship between the adapter plate and the shell flow channel;

[0032] Figure 5 This is a schematic diagram of the manufacturing process of the adapter board. DETAILED DESCRIPTION

[0033] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. The various drawings of the present invention are only for illustration to make it easier to understand the present invention, and the specific proportions can be adjusted according to design requirements. The upper and lower relationships of the relative elements and the definitions of the front / back in the figures described in the text should be understood by those skilled in the art to refer to the relative positions of the components, so they can all be flipped to present the same components, which should all fall within the scope disclosed in this specification.

[0034] An integrated heat dissipation packaging structure based on an array micro-spray structure, such as Figure 1 As shown, it mainly includes a high-power CPU 000, an adapter board 130 and a housing 210. The adapter board 130 is assembled in the housing 210, and the upper surface of the adapter board 130 has a packaging area, and the CPU 000 is arranged on the packaging area and is sealed and connected to the adapter board 130.

[0035] refer to Figures 1 to 4 The body of the adapter plate is provided with a first input microfluidic channel a, an output microfluidic channel b, a second input microfluidic channel c and a third input microfluidic channel d extending in the vertical direction respectively. The packaging area of ​​the adapter plate 130 is provided with a first guide structure 137x and a plurality of horizontal parallel channels 118. The two ends of the horizontal parallel channels 118 are respectively connected to the first input microfluidic channel a and the output microfluidic channel b through the first guide structure 137x. The horizontal parallel channels 118 are provided with a vertical array nozzle 112, and the vertical array nozzle 112 is connected to the second input microfluidic channel c and the third input microfluidic channel d in the vertical direction. The housing 210 is provided with flow channels connected to the first input microfluidic channel, the second input microfluidic channel, the third input microfluidic channel and the output microfluidic channel respectively.

[0036] The first input microfluidic channel a and the output microfluidic channel b respectively include, from top to bottom, a first slot hole (represented by 111a and 111b in the figure) that is connected and has different calibers, a second slot hole 121 (respectively 121a and 121b) and a third slot hole 122, wherein the first input microfluidic channel a is provided with a first outlet 111a on the upper surface of the adapter plate 130, and a first inlet 122a is provided on the lower surface of the adapter plate 130; the output microfluidic channel b is provided with an output inlet 111b on the upper surface of the adapter plate 130, and an output outlet 122b is provided on the lower surface of the adapter plate 130; the two ends of the horizontal parallel slot 118 are respectively connected to the first outlet 111a and the output inlet 122b through the first guide structure 137x. The fluid enters the first input microchannel a through the first inlet 122a, flows horizontally through the horizontal parallel channels 118 through the first outlet 111a, enters the output microchannel b through the output inlet 111b, and then flows out through the output outlet 122b.

[0037] The second input microchannel c and the third input microchannel d respectively include a second slot 121 and a third slot 122 which are connected and have different calibers from top to bottom. The adapter plate 130 is also provided with a second guide structure 137y and a plurality of horizontal parallel microchannels 119; the second input microchannel c and the third input microchannel d are respectively provided with a second outlet 121c and a third outlet 121d in the adapter plate 130, and a second inlet 122c and a third inlet 122d on the lower surface of the adapter plate 130; the two ends of the horizontal parallel microchannel 119 are respectively connected to the second outlet 121c and the third outlet 121d through the second guide structure 137y; the bottom of the vertical array nozzle 112 is connected to the horizontal parallel microchannel 119 in the vertical direction, and the top is located in the horizontal parallel slot 118. The fluid enters the second input microchannel c and the third input microchannel d through the second inlet 122c and the third inlet 122d respectively, and then converges into the horizontal parallel microchannel 119 through the second outlet 121c and the third outlet 121d respectively, and is ejected from the top of the vertical array nozzle 112 into the horizontal parallel groove 118 and then flows out from the output microchannel b.

[0038] The adapter plate 130 is a high-resistance silicon substrate with a resistivity of ≥1000Ω·Cm. The apertures of the first slot, the second slot 121, and the third slot 122 are gradually enlarged and shifted outward layer by layer in a step-by-step manner, so that the first inlet 122a and the output outlet 122b are respectively located outside the first outlet 111a and the output inlet 111b. Preferably, the horizontal parallel microchannels 119 and the horizontal parallel channels 118 are arranged perpendicular to each other, so that the first input microchannel a and the output microchannel b are arranged relative to each other in the first direction, the second input microchannel c and the third input microchannel d are arranged relative to each other in the second direction, and the first direction and the second direction are perpendicular.

[0039] The top of the vertical array nozzle 112 is a water outlet, and the water outlet is higher than the bottom of the horizontal parallel channel 118, that is, the wall surface of the vertical array nozzle 112 is higher than the bottom surface of the horizontal parallel channel 118, so as to prevent the horizontally flowing liquid from directly pouring into the vertical nozzle, reduce the performance of the jet, simplify the structure, and facilitate processing. The characteristic size (caliber) of the water outlet of the vertical array nozzle 112 is 30-100 microns, and the characteristic size can be adjusted according to the heat dissipation object.

[0040] The adapter plate 130 is assembled in the housing 210. The housing 210 has four flow channels 210a, 210b, 210c and 210d, and the flow channels 210a, 210b, 210c and 210d are connected with the first inlet 122a, the output outlet 122b, the third inlet 122c and the fourth inlet 122d. The high-power CPU 000 is arranged on the adapter plate 130, and the packaging area is bonded with the high-power CPU. Specifically, the back of the CPU is provided with a first graphic adhesive sealing layer 013, and the upper surface of the adapter plate 130 is provided with a second graphic adhesive sealing layer 136. The first graphic adhesive sealing layer 013 and the second graphic adhesive sealing layer 136 are connected correspondingly, and the first outlet 111a, the output inlet 111b, the first guide structure 137x and the horizontal parallel groove 118 are closed to form a closed flow channel system. Thus, the external fluid is divided into three paths and enters the first input microchannel a, the second input microchannel c and the third input microchannel d through the flow channels 210a, 210c and 210d of the shell respectively, one of which enters the horizontal parallel channel 118, and the other two are vertically ejected from the vertical array nozzle 112 to the bottom of the high-power CPU 000, and all fluids flow back to the flow channel 210b of the shell from the output microchannel b. The above structure simultaneously sets parallel straight-through microchannels and vertical nozzles to achieve turbulence, combining the advantages of small flow resistance of horizontal parallel channels and high heat dissipation efficiency of micro-spraying and turbulence, and achieves the best in terms of flow resistance and heat dissipation efficiency.

[0041] refer to Figures 1 to 5 , the preparation method is described in detail below.

[0042] 1) Adapter plate 130: Reference Figure 5 Combined with Figures 2 to 4 ,

[0043] 1.1) Provide a first high-resistance silicon wafer 110 and a second high-resistance silicon wafer 120 polished on both sides, with a resistivity of ≥1000Ω·cm, such as Figure 2As shown, a first flow guide structure 137x and a horizontal parallel groove 118 are fabricated on the upper surface of the first high-resistance silicon wafer 110 by photolithography, deep silicon etching (DRIE), laser and other processes, and two first slots penetrating the upper and lower surfaces are fabricated, and the two ends of the horizontal parallel groove 118 are respectively connected to the two first slots through the first flow guide structure 137x in a one-to-one correspondence; a vertical array nozzle 112 penetrating the lower surface to the bottom of the horizontal parallel groove is fabricated on the lower surface of the first high-resistance silicon wafer 110; a vertical array nozzle 112 with a certain depth is fabricated on the upper surface of the second high-resistance silicon wafer 120; The second high-resistance silicon wafer 120 is provided with four second slots 121, a second guide structure 137y and a horizontal parallel microchannel 119, and two ends of the horizontal parallel microchannel 119 are respectively connected to two of the second slots 121 through the second guide structure 137y in a one-to-one correspondence. Four third slots 122 are made on the lower surface of the second high-resistance silicon wafer 120, and the second slots 121 and the third slots 122 are connected in a one-to-one correspondence, wherein the two second slots 121 and the third slots 122 connected to the horizontal parallel microchannel 119 form a second input microchannel c and a third input microchannel d, respectively.

[0044] 1.2) The lower surface of the first high-resistance silicon wafer 110 and the upper surface of the second high-resistance silicon wafer 120 are connected by a wafer-level bonding process to form an adapter plate 130, so that the first slot of the first high-resistance silicon wafer 110 and the other two second slots 121 of the second high-resistance silicon wafer 120 correspond to each other one by one, thereby forming a first input microchannel a and an output microchannel b. The bonding process is silicon-silicon bonding, polymer bonding, gold-gold bonding, gold-tin bonding, copper-tin bonding, etc.

[0045] 1.3) A thinning process is performed on the adapter plate 130 by mechanical thinning, grinding, chemical polishing and other processes, so as to reduce the overall thickness of the substrate.

[0046] 2) The bonding body of the adapter plate 130 is assembled to the housing 210 by using conductive glue, solder, nano silver paste, etc. The housing has four flow channels 210a, 210b, 210c and 210d, and the first input micro-channel a, the second input micro-channel c, the third input micro-channel d and the output micro-channel b are sealed and connected with the four flow channels 210a, 210b, 210c and 210d one by one. The housing 210 can be made of aluminum alloy, copper, or AlN ceramic.

[0047] 3) At least on the upper surfaces of the substrate of the high-power CPU 000 and the adapter plate 130, a corresponding first patterned adhesive sealing layer 013 and a second patterned adhesive sealing layer 136 are respectively made, which can be achieved by patterned electroplating of Cu / Sn, Au / Sn, Ag / Sn solder or coating of organic materials such as BCB, or printing of glass paste, etc. The patterned adhesive sealing layer at least surrounds and closes the first outlet 111a, the output inlet 111b and the horizontal parallel grooves 118 of the adapter plate 130 to form a closed heat dissipation channel system.

[0048] The above embodiments are only used to further illustrate an integrated heat dissipation packaging structure based on an array micro-spray structure and a manufacturing method thereof of the present invention, but the present invention is not limited to the embodiments. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An integrated heat dissipation packaging structure based on an array micro-spray structure, characterized in that: It includes a CPU, an adapter board and a housing, wherein the adapter board is assembled in the housing, the upper surface of the adapter board has a packaging area, the CPU is arranged on the packaging area and is sealed and connected to the adapter board; The adapter plate is provided with a first input microfluidic channel, a second input microfluidic channel, a third input microfluidic channel and an output microfluidic channel extending in vertical directions respectively. The packaging area of ​​the adapter plate is provided with a first guide structure and a plurality of horizontal parallel grooves. The two ends of the horizontal parallel grooves are respectively connected with the first input microfluidic channel and the output microfluidic channel through the first guide structure. A vertical array nozzle is provided in the horizontal parallel groove. The vertical array nozzle is connected with the second input microfluidic channel and the third input microfluidic channel in a vertical direction. The top of the vertical array nozzle is a water outlet, and the water outlet is higher than the bottom of the horizontal parallel groove. The first input microfluidic channel is provided with a first outlet on the upper surface of the adapter plate, and a first inlet on the lower surface of the adapter plate. The output microfluidic channel is provided with an output inlet on the upper surface of the adapter plate. An output outlet is provided on the lower surface of the adapter plate; the two ends of the horizontal parallel groove are respectively connected to the first outlet and the output inlet through the first guide structure; the interior of the adapter plate is also provided with a second guide structure and a plurality of horizontal parallel microchannels; the second input microchannel and the third input microchannel are respectively provided with a second outlet and a third outlet inside the adapter plate, and a second inlet and a third inlet are provided on the lower surface of the adapter plate; the two ends of the horizontal parallel microchannel are respectively connected to the second outlet and the third outlet through the second guide structure; the vertical array nozzle is connected to the horizontal parallel microchannel in the vertical direction; the calibers of the first input microchannel, the second input microchannel, the third input microchannel and the output microchannel are respectively gradually expanded from top to bottom in a step-like manner, and are offset to the outside of the packaging area at the step change position; The housing is provided with flow channels respectively communicating with the first input micro-flow channel, the second input micro-flow channel, the third input micro-flow channel and the output micro-flow channel.

2. The integrated heat dissipation packaging structure according to claim 1, characterized in that: The horizontal parallel microchannels and the horizontal parallel channels are arranged perpendicular to each other.

3. The integrated heat dissipation packaging structure according to claim 1, characterized in that: The size of the water outlet of the vertical array nozzle is 30-100 microns.

4. The integrated heat dissipation packaging structure according to claim 1, characterized in that: The back of the CPU and the packaging area of ​​the adapter plate are connected by a patterned adhesive sealing layer, and the first input microchannel, the output microchannel, the first guide structure and the horizontal parallel grooves are closed to form a closed channel.

5. The method for manufacturing an integrated heat dissipation packaging structure based on an array micro-spray structure according to any one of claims 1 to 4, characterized in that The following steps are involved: 1) providing a high-resistance silicon wafer as a substrate for the adapter plate, manufacturing a first input microfluidic channel, a second input microfluidic channel, a third input microfluidic channel and an output microfluidic channel, and manufacturing a first flow guide structure, horizontal parallel channels and a vertical array nozzle in the packaging area; Specifically include 1.1) Provide a first high-resistance silicon wafer and a second high-resistance silicon wafer, make a first guide structure and a horizontal parallel groove on the upper surface of the first high-resistance silicon wafer, make two first slots penetrating the upper and lower surfaces in the first high-resistance silicon wafer body and a vertical array nozzle penetrating the bottom of the horizontal parallel groove and the lower surface of the first high-resistance silicon wafer, and the two ends of the horizontal parallel groove are connected to the two first slots in a one-to-one correspondence through the first guide structure; make four second slots, a second guide structure and a horizontal parallel microchannel on the upper surface of the second high-resistance silicon wafer, and the two ends of the horizontal parallel microchannel are connected to the two second slots in a one-to-one correspondence through the second guide structure, and make four third slots on the lower surface of the second high-resistance silicon wafer, and the second slots and the third slots are connected in a one-to-one correspondence, wherein the two second slots and the third slots connected to the horizontal parallel microchannel form a second input microchannel and a third input microchannel respectively; 1.2) The lower surface of the first high-resistance silicon wafer and the upper surface of the second high-resistance silicon wafer are connected by a wafer-level bonding process to form an adapter plate, so that the two first slots and the other two second slots are matched one by one to form a first input microchannel and an output microchannel; 1.3) Thinning the adapter plate; 2) providing a housing having four flow channels, bonding the adapter plate to the housing, and making the first input micro-channel, the second input micro-channel, the third input micro-channel, and the output micro-channel correspond to and communicate with the four flow channels in a sealed manner; 3) The back of the CPU is bonded to the packaging area of ​​the adapter plate through a patterned adhesive sealing layer, and the first input microchannel, the output microchannel, the first guide structure and the horizontal parallel grooves are closed to form a closed heat dissipation channel.

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