Phased Array Antenna Test Module

Abstract

An embodiment of the present invention provides a phased array antenna test module, which relates to the field of antenna technology. The phased array antenna test module includes a phased array antenna board, a heat dissipation plate and a fin heat sink. The front of the heat dissipation plate is installed on a side surface of the phased array antenna board, and a first thermal pad is also arranged between the front of the heat dissipation plate and the phased array antenna board. The first thermal pad is used to transfer the heat generated by the phased array antenna board to the heat dissipation plate. The fin heat sink is arranged on the back of the heat dissipation plate, and a plurality of heat dissipation fins are arranged on the fin heat sink. During actual testing, the heat generated on the phased array antenna board is transferred to the heat dissipation plate through the first thermal pad, and the heat dissipation plate then transfers the heat to the fin heat sink, and dissipates the heat through a plurality of heat dissipation fins. Since the heat dissipation fins are used for heat dissipation and the heat transfer efficiency is high, the heat dissipation difficulty of the test bare board is effectively solved.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a phased array antenna test module. Background Art

[0002] Existing flat-panel phased array antennas are mainly composed of multi-layer microwave boards and surface-mount devices. After processing, multiple processes need to be tested and debugged. In the prior art, bare antenna boards are usually used for debugging. Since a large number of high-heat consumption devices are arranged on the antenna array surface, if they are not heat-dissipated during the debugging stage, a large number of devices may be damaged. In addition, since the entire flat-panel phased array antenna is composed of multiple antenna array surface units, the increase in power consumption of the entire machine is also accompanied by the problem of heat dissipation difficulties. Summary of the invention

[0003] The purpose of the present invention includes, for example, providing a phased array antenna test module, which has good heat dissipation effect, can alleviate the problem of heat dissipation difficulties during testing, and avoid damage to components.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, an embodiment of the present invention provides a phased array antenna test module, comprising a phased array antenna board, a heat dissipation plate and a fin heat sink, wherein the front side of the heat dissipation plate is installed on a side surface of the phased array antenna board, and a first thermal conductive pad is also arranged between the front side of the heat dissipation plate and the phased array antenna board, and the first thermal conductive pad is used to transfer the heat generated by the phased array antenna board to the heat dissipation plate, the fin heat sink is arranged on the back side of the heat dissipation plate, and a plurality of heat dissipation fins are arranged on the fin heat sink.

[0006] In an optional embodiment, a plurality of first installation limit columns are provided on the front side of the heat dissipation temperature dispersion plate, and the plurality of first installation limit columns have the same height relative to the front side of the heat dissipation temperature dispersion plate, and an end portion of each of the first installation limit columns is used to abut against the surface of the phased array antenna board to form a first installation gap between the heat dissipation temperature dispersion plate and the phased array antenna board, and the first thermal pad is arranged in the first installation gap.

[0007] In an optional implementation, the distance between the front surface of the heat dissipation and temperature dispersion plate and the phased array antenna board is 70%-80% of the thickness of the first thermal pad.

[0008] In an optional embodiment, a first connecting hole is also formed on the end face of each first mounting limit column, and a plurality of first connecting members are arranged on the phased array antenna board. The plurality of first connecting members are arranged in one-to-one correspondence with the plurality of first mounting limit columns, and each first connecting member can be detachably assembled in the corresponding first connecting hole.

[0009] In an optional embodiment, the first thermally conductive pad includes a plurality of thermally conductive strips, and the plurality of thermally conductive strips are arranged in parallel and at intervals between the phased array antenna board and the heat dissipation vapor chamber.

[0010] In an optional embodiment, the phased array antenna test module also includes an electrically controlled thermally conductive plate, which is connected to the heat dissipation and temperature distribution plate. The phased array antenna board has a radio frequency radiation area and a digital circuit area. The heat dissipation and temperature distribution plate is installed in the radio frequency radiation area, and the electrically controlled thermally conductive plate is installed in the digital circuit area.

[0011] In an optional embodiment, a dustproof protection strip is provided at the edge of the heat dissipation vapor chamber, and the dustproof protection strip abuts against the edge of the phased array antenna to seal between the phased array antenna and the heat dissipation vapor chamber.

[0012] In an optional embodiment, a splicing waterproof groove is further provided on the edge of the fin heat sink, and the splicing waterproof groove is located at the edge of a side surface of the fin heat sink away from the heat dissipation uniform temperature plate.

[0013] In an optional embodiment, a second thermal pad is further provided between the fin heat sink and the back of the heat sink, and the second thermal pad is used to transfer heat from the heat sink to the fin heat sink, and the fin heat sink and the heat sink are detachably connected.

[0014] In an optional embodiment, a plurality of second installation limit columns are provided on the back side of the heat dissipation temperature dispersion plate, and the plurality of second installation limit columns have the same height relative to the back side of the heat dissipation temperature dispersion plate, and an end portion of each second installation limit column is used to abut against the surface of the fin heat sink to form a second installation gap between the heat dissipation temperature dispersion plate and the fin heat sink, and the second thermal pad is arranged in the second installation gap.

[0015] The beneficial effects of the embodiments of the present invention include, for example:

[0016] The phased array antenna test module provided by the embodiment of the present invention is provided by installing a heat dissipation plate on one side surface of the phased array antenna board, and providing a first thermal pad between the front of the heat dissipation plate and the phased array antenna board, and providing a fin heat sink on the back of the heat dissipation plate, and providing a plurality of heat dissipation fins on the fin heat sink. In actual testing, the heat generated on the phased array antenna board is transferred to the heat dissipation plate through the first thermal pad, and the heat dissipation plate then transfers the heat to the fin heat sink, and dissipates the heat through a plurality of heat dissipation fins. Since the heat dissipation fins are used for heat dissipation and the heat transfer efficiency is high, the heat dissipation difficulty of the test bare board is effectively solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic structural diagram of a phased array antenna test module provided by the first embodiment of the present invention at a first viewing angle;

[0019] Figure 2 A schematic diagram of the structure of the phased array antenna test module provided by the first embodiment of the present invention at a second viewing angle;

[0020] Figure 3 for Figure 1 Schematic diagram of the structure of the middle heat dissipation vapor chamber from the first perspective;

[0021] Figure 4 for Figure 1 Schematic diagram of the structure of the middle heat dissipation vapor chamber at a second viewing angle;

[0022] Figure 5 for Figure 3 A partial enlarged schematic diagram of middle V;

[0023] Figure 6 A schematic diagram of the assembly structure of a phased array antenna test module provided in the first embodiment of the present invention;

[0024] Figure 7 A schematic diagram of the structure of a phased array antenna test module provided by a second embodiment of the present invention;

[0025] Figure 8 for Figure 7 Schematic diagram of the structure of the heat dissipation vapor chamber.

[0026] Icons: 100-phased array antenna test module; 110-phased array antenna board; 111-RF radiation area; 113-digital circuit area; 130-heat dissipation plate; 131-first installation limit column; 133-first connection hole; 135-first connecting piece; 137-dust protection strip; 139-spliced ​​waterproof groove; 150-fin heat sink; 151-heat dissipation fin; 153-second installation limit column; 155-second connection hole; 157-second connecting piece; 170-electrically controlled thermal conductive plate; 180-first thermal pad; 181-thermal conductive strip; 190-second thermal pad. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0032] As disclosed in the background technology, bare boards are usually used for debugging in the prior art, which may cause heat dissipation difficulties and may cause a large number of device damages. Since the phased array antenna surface board needs to go through stages such as circuit debugging, darkroom testing and environmental testing, the above-mentioned problems are unavoidable. At present, the solutions adopted by the industry for the above-mentioned problems are mainly to make independent test tools in each link or add some peripheral protection measures, and at the same time, higher operating specifications are required for participants in each link.

[0033] Phased array antenna boards will be tested for digital circuits and antenna performance in the early stage. If the heat dissipation treatment is not performed on the various heat-generating components, the components will suffer performance degradation or burn out due to excessive temperature. In order to solve the heat dissipation problem in this link, the corresponding heat dissipation tooling is usually used for heat dissipation, that is, heat dissipation is performed through external heat dissipation components. After the test is completed, the components are removed from the heat dissipation tooling, which is very troublesome. In addition, the exposed components of the phased array antenna board are easily damaged or crashed during the testing process or transportation process of each link, but improving the operating specifications of the participants and adding a transportation protection box can only reduce the probability of occurrence to a limited extent, and cannot solve the problem of component damage or crashing. In addition, the flat-panel phased array antenna is generally composed of multiple phased array antenna boards. Due to structural limitations, the antenna board fixing screws are generally selected with smaller screws, which is not conducive to multiple disassembly and assembly. In order to solve the heat dissipation problem of the antenna board, a high thermal conductivity interface material is usually installed between the high-power consumption component and the heat dissipation tooling. The heat of the component is dissipated through the main frame, but the thermal conductive interface material (thermal conductive pad) cannot be used for multiple disassembly and assembly, which is not conducive to the disassembly and assembly of the antenna.

[0034] In order to solve the above problems, an embodiment of the present invention provides another phased array antenna test module. It should be noted that the features in the embodiments of the present invention can be combined with each other in the absence of conflict.

[0035] First embodiment

[0036] Please refer to Figures 1 to 6 The present embodiment provides a phased array antenna test module 100, which can alleviate the problem of antenna heat dissipation difficulties during testing, avoid damage to the device, and has good heat dissipation effect and protection effect. It is simple to process and has low processing cost, and simplifies the assembly process.

[0037] The phased array antenna test module 100 provided in this embodiment includes a phased array antenna board 110, a heat dissipation plate 130, a fin heat sink 150 and an electrically controlled heat conductive plate 170. The front of the heat dissipation plate 130 is installed on a side surface of the phased array antenna board 110, and a first heat conductive pad 180 is also arranged between the front of the heat dissipation plate 130 and the phased array antenna board 110. The first heat conductive pad 180 is used to transfer the heat generated by the phased array antenna board 110 to the heat dissipation plate 130. The fin heat sink 150 is arranged on the back of the heat dissipation plate 130, and a plurality of heat dissipation fins 151 are arranged on the fin heat sink 150. The electrically controlled heat conductive plate 170 is connected to the heat dissipation plate 130. The phased array antenna board 110 has a radio frequency radiation area 111 and a digital circuit area 113. The heat dissipation plate 130 is installed in the radio frequency radiation area 111, and the electrically controlled heat conductive plate 170 is installed in the digital circuit area 113.

[0038] In this embodiment, the heat dissipation plate 130 and the fin heat sink 150 are integrally arranged, that is, a plurality of heat dissipation fins 151 are arranged on the back of the heat dissipation plate 130 for heat dissipation. The integrated structure simplifies the assembly structure. It is only necessary to assemble the heat dissipation plate 130 and the phased array antenna board 110 together, which is very convenient. Specifically, the heat dissipation plate 130, the fin heat sink 150 and the heat dissipation fins 151 are all made of metal or alloy materials with high thermal conductivity, such as aluminum alloy, wherein the heat generated by the phased array antenna board 110 is conducted to the heat dissipation plate 130 by the first thermal pad 180, and the heat dissipation plate 130 plays the role of heat dissipation and uniform heat dissipation, thereby avoiding local heat concentration on the phased array antenna board 110 causing excessive temperature.

[0039] In this embodiment, a plurality of integrated chips are mounted on the surface of one side of the phased array antenna board 110 connected to the heat dissipation and temperature dispersion plate 130. Specifically, the plurality of integrated chips are mounted on the RF radiation area 111 of the phased array antenna board 110. The top sides of the plurality of integrated chips are located in the same plane and constitute the mounting plane of the phased array antenna board 110. The first thermal pad 180 is disposed on the mounting plane. The plurality of integrated chips will generate a large amount of heat when in operation or debugging, and the heat will be conducted to the heat dissipation and temperature dispersion plate 130 through the first thermal pad 180.

[0040] In this embodiment, a plurality of first installation limiting posts 131 are provided on the front of the heat dissipation and temperature averaging plate 130. The plurality of first installation limiting posts 131 have the same height relative to the front of the heat dissipation and temperature averaging plate 130, and the end of each first installation limiting post 131 is used to abut against the surface of the phased array antenna board 110, so that a first installation gap is formed between the heat dissipation and temperature averaging plate 130 and the phased array antenna board 110, and the first thermal pad 180 is provided in the first installation gap. By providing a plurality of first installation limiting posts 131, during assembly, the plurality of first installation limiting posts 131 are located between the heat dissipation and temperature averaging plate 130 and the phased array antenna board 110, and abut against the surface of the phased array antenna board 110, so that a certain gap is provided between the heat dissipation and temperature averaging plate 130 and the phased array antenna board, so as to facilitate the accommodation of the first thermal pad 180, and limit the deformation of the first thermal pad 180, so as to avoid the first thermal pad 180 being over-extruded and affecting the heat transfer effect.

[0041] In the present embodiment, the first thermal pad 180 is made of an interface material with high thermal conductivity, such as silica gel or a heat dissipation pad, etc., which is not specifically limited here.

[0042] In this embodiment, the width of the first gap is smaller than the thickness of the first thermal pad 180, so that the two sides of the first thermal pad 180 are respectively against the heat dissipation plate 130 and the phased array antenna board 110 to ensure the heat transfer effect. Specifically, since the deformation of the interface material is kept between 20% and 30% to exert its maximum performance and the heat transfer effect is the best, the distance between the front of the heat dissipation plate 130 and the phased array antenna board 110 is 70% to 80% of the thickness of the first thermal pad 180, so as to control the deformation of the interface material to ensure the heat transfer effect. That is, the width of the first gap is 70% to 80% of the thickness of the first thermal pad 180. Of course, due to the different interface materials, the optimal deformation is also different, so the ratio between the first gap and the thickness of the first thermal pad 180 is only an example and does not have a limiting effect.

[0043] It should be noted that the distance between the front side of the heat dissipation and temperature dispersion plate 130 and the phased array antenna board 110 refers to the height of the first mounting limit column 131 when the integrated chip is flush with the surface of the phased array antenna; when the integrated chip protrusion is set on the surface of the phased array antenna, it refers to the difference between the height of the first mounting limit column 131 and the height of the integrated chip protrusion, that is, the distance between the mounting plane and the heat dissipation and temperature dispersion plate 130.

[0044] In this embodiment, the end surface of each first installation limit column 131 is further provided with a first connection hole 133, and a plurality of first connection members 135 are provided on the phased array antenna board 110, and the plurality of first connection members 135 are provided one-to-one with the plurality of first installation limit columns 131, and each first connection member 135 is detachably assembled in the corresponding first connection hole 133. Specifically, the first connection member 135 is a screw, and the first connection hole 133 is a screw hole, that is, the screw passes through the phased array antenna board 110 and is assembled in the corresponding screw hole, so that the phased array antenna board 110 is fixed to the plurality of first installation limit columns 131 by screws, and is fixed to the heat dissipation and temperature absorbing plate 130. Of course, the first connection member 135 here can also be other connection members such as a pin or a plug-in.

[0045] In this embodiment, the first thermal pad 180 includes a plurality of thermally conductive strips 181, which are arranged in parallel and at intervals between the phased array antenna board 110 and the heat dissipation plate 130. Both sides of each thermally conductive strip 181 are in contact with the phased array antenna board 110 and the heat dissipation plate 130, respectively, so as to achieve a heat transfer function, and the spacing between two adjacent thermally conductive strips 181 is adapted to the spacing of the integrated chip on the phased array antenna board 110, so that each thermally conductive strip 181 is mounted on the surface of the corresponding integrated chip, so that the heat transfer effect is better.

[0046] In this embodiment, the electrically controlled heat conductive plate 170 is a high thermal conductivity metal plate, which is integrally arranged at the edge of the heat dissipation and temperature averaging plate 130, and is fixed to the digital circuit area 113 of the phased array antenna board 110 by screws. Since the digital circuit area 113 of the phased array antenna board 110 is provided with a large number of copper layers and thermal conductive metal holes, in this embodiment, the frame thermal conductive copper layer of the digital circuit area 113 of the phased array antenna board 110 is tightly fitted to the electrically controlled heat conductive plate 170 by screws. Since both surfaces are smooth, the screws can effectively fit the two, thereby reducing the interface thermal resistance between the two.

[0047] In this embodiment, a dustproof protection strip 137 is provided at the edge of the heat dissipation and temperature averaging plate 130, and the dustproof protection strip 137 abuts against the edge of the phased array antenna to seal between the phased array antenna board 110 and the heat dissipation and temperature averaging plate 130. Specifically, the dustproof protection strip 137 is a rubber strip, and its height is greater than the distance between the heat dissipation and temperature averaging plate 130 and the phased array antenna board 110, so that the dustproof protection strip 137 can abut against the phased array antenna board 110, so that the first installation gap is isolated from the outside, and external dust and other impurities are prevented from entering between the phased array antenna board 110 and the heat dissipation and temperature averaging plate 130, and at the same time, it can also play a protective role to prevent damage to the phased array antenna board 110 during transportation.

[0048] In this embodiment, the edge of the fin heat sink 150 is further provided with a splicing waterproof groove 139, and the splicing waterproof groove 139 is located at the edge of the surface of the side of the fin heat sink 150 away from the heat dissipation and temperature balancing plate 130, so as to achieve a waterproof function. Specifically, during actual debugging, multiple phased array antenna panels 110 need to be spliced ​​together and fixed with a fixed mounting frame, and a sealing surface corresponding to the splicing waterproof groove 139 is provided on the fixed mounting frame to achieve waterproof sealing of each phased array antenna test module 100.

[0049] The phased array antenna test module 100 provided in this embodiment only needs to consider the integrated installation of the antenna array surface module during the overall design, and does not need to consider the heat dissipation of each phased array antenna test module 100 separately. During installation, there is no need to install various thermal conductive interface materials and heat transfer structures. Since each module has a separate waterproof sealing structure, it is only necessary to set a corresponding sealing surface on the overall fixed installation frame of the structure, thereby minimizing the whole machine splicing installation process, reducing the operation risks of each link, and improving the reliability of module integrated installation.

[0050] In summary, the phased array antenna test module 100 provided in this embodiment is provided by installing a heat dissipation plate 130 on one side surface of the phased array antenna board 110, and setting a first thermal pad 180 between the front of the heat dissipation plate 130 and the phased array antenna board 110, and setting a fin heat sink 150 on the back of the heat dissipation plate 130, and multiple heat dissipation fins 151 are set on the fin heat sink 150. During the actual test, the heat generated on the phased array antenna board 110 is transferred to the heat dissipation plate 130 after passing through the first thermal pad 180, and the heat dissipation plate 130 then transfers the heat to the fin heat sink 150, and dissipates the heat through multiple heat dissipation fins 151. Since the heat dissipation fins 151 are used for heat dissipation and the heat transfer efficiency is high, the heat dissipation difficulty of the test bare board is effectively solved. In addition, by setting the dustproof protection strip 137 and the splicing waterproof groove 139, the waterproof and dustproof effect can be achieved, and the damage to the phased array antenna board 110 during transportation can be prevented. In addition, the modular phased array antenna test module 100 is very convenient to assemble, and the difficulty of designing and processing the antenna structure is greatly reduced during assembly, which can reduce the structural parts processing cost by 40%. At the same time, it also simplifies the installation process of the whole machine and reduces the risk of whole machine assembly.

[0051] Second embodiment

[0052] Please refer to Figure 7 and Figure 8 This embodiment provides a phased array antenna test module 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brief description, parts not mentioned in this embodiment may refer to the corresponding contents in the first embodiment.

[0053] The phased array antenna test module 100 includes a phased array antenna board 110, a heat dissipation plate 130, a fin heat sink 150 and an electrically controlled heat conductive plate 170. The front of the heat dissipation plate 130 is installed on a side surface of the phased array antenna board 110, and a first heat conductive pad 180 is also arranged between the front of the heat dissipation plate 130 and the phased array antenna board 110. The first heat conductive pad 180 is used to transfer the heat generated by the phased array antenna board 110 to the heat dissipation plate 130. The fin heat sink 150 is arranged on the back of the heat dissipation plate 130, and a plurality of heat dissipation fins 151 are arranged on the fin heat sink 150. The electrically controlled heat conductive plate 170 is connected to the heat dissipation plate 130. The phased array antenna board 110 has a radio frequency radiation area 111 and a digital circuit area 113. The heat dissipation plate 130 is installed in the radio frequency radiation area 111, and the electrically controlled heat conductive plate 170 is installed in the digital circuit area 113.

[0054] In this embodiment, the heat dissipation plate 130 and the fin heat sink 150 are separately provided, and a second thermal pad 190 is further provided between the fin heat sink 150 and the back of the heat dissipation plate 130. The second thermal pad 190 is used to transfer the heat on the heat dissipation plate 130 to the fin heat sink 150, and the fin heat sink 150 is detachably connected to the heat dissipation plate 130. Specifically, the second thermal pad 190 is made of an interface material with high thermal conductivity, such as silica gel or a heat dissipation gasket, etc., which is not specifically limited here.

[0055] In this embodiment, a plurality of second installation limiting posts 153 are provided on the back of the heat dissipation and temperature averaging plate 130, and the plurality of second installation limiting posts 153 have the same height relative to the back of the heat dissipation and temperature averaging plate 130, and the end of each second installation limiting post 153 is used to abut against the surface of the fin heat sink 150, so that a second installation gap is formed between the heat dissipation and temperature averaging plate 130 and the fin heat sink 150, and the second thermal pad 190 is arranged in the second installation gap. The width of the second gap is less than the thickness of the second thermal pad 190, so that the two sides of the second thermal pad 190 abut against the heat dissipation and temperature averaging plate 130 and the fin heat sink 150 respectively to ensure the heat transfer effect. Specifically, since the deformation amount of the interface material is kept between 20% and 30% to exert its maximum performance and the heat transfer effect is the best, the distance between the front of the heat dissipation and temperature averaging plate 130 and the fin heat sink 150 is 70% to 80% of the thickness of the second thermal pad 190, so as to control the deformation amount of the interface material to ensure the heat transfer effect. That is, the width of the second gap is 70%-80% of the thickness of the second thermal pad 190. Of course, due to the different interface materials, the optimal deformation amount is also different. Therefore, the ratio between each second gap and the thickness of the second thermal pad 190 is only an example and does not have a limiting effect.

[0056] In this embodiment, the end surface of the second installation limit column 153 is further provided with a second connection hole 155, and the fin heat sink 150 is provided with a plurality of second connection members 157, and the plurality of second connection members 157 correspond to the plurality of second installation limit columns 153 one by one, and each second connection member 157 is detachably assembled in the corresponding second connection hole 155. Specifically, the second connection member 157 is a screw, and the second connection hole 155 is a screw hole, that is, the screw passes through the fin heat sink 150 and is assembled in the corresponding screw hole, so that the fin heat sink 150 is fixed to the plurality of second installation limit columns 153 by the screw, and is fixed to the heat dissipation and temperature absorbing plate 130. Of course, the second connection member 157 here can also be other connection members such as a pin or a plug-in.

[0057] In this embodiment, the second thermal pad 190 is a whole piece structure and is laid between the fin heat sink 150 and the heat dissipation plate 130 , wherein the second thermal pad 190 is provided with a plurality of holes for the second installation limit posts 153 to pass through.

[0058] In summary, the phased array antenna test module 100 provided in this embodiment reduces the weight of a single module by separately setting the heat dissipation temperature plate 130 and the fin heat sink 150 and fixing them with screws. The split design and manufacturing reduces the manufacturing difficulty and provides diversified heat dissipation methods for the whole machine.

[0059] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A phased array antenna test module, characterized in that: It includes a phased array antenna board, a heat dissipation plate and a fin heat sink, wherein the front of the heat dissipation plate is installed on a side surface of the phased array antenna board, and a first thermal pad is further arranged between the front of the heat dissipation plate and the phased array antenna board, and the first thermal pad is used to transfer the heat generated by the phased array antenna board to the heat dissipation plate, the fin heat sink is arranged on the back of the heat dissipation plate, and a plurality of heat dissipation fins are arranged on the fin heat sink; The first thermally conductive pad includes a plurality of thermally conductive strips, and the plurality of thermally conductive strips are arranged in parallel and at intervals between the phased array antenna board and the heat dissipation and temperature absorbing board; Among them, a plurality of integrated chips distributed in an array are mounted on the surface of one side of the phased array antenna board connected to the heat dissipation and temperature dispersion plate, and the spacing between two adjacent thermal conductive strips is adapted to the spacing between the integrated chips, so that each of the thermal conductive strips is mounted on the surface of the corresponding integrated chip; The phased array antenna test module also includes an electrically controlled thermally conductive plate, which is connected to the heat dissipation and temperature averaging plate. The phased array antenna board has a radio frequency radiation area and a digital circuit area. The heat dissipation and temperature averaging plate is installed in the radio frequency radiation area, and the electrically controlled thermally conductive plate is installed in the digital circuit area.

2. The phased array antenna test module according to claim 1, characterized in that: A plurality of first installation limit columns are arranged on the front side of the heat dissipation temperature dispersion plate, and the plurality of first installation limit columns have the same height relative to the front side of the heat dissipation temperature dispersion plate, and an end portion of each of the first installation limit columns is used to abut against the surface of the phased array antenna board to form a first installation gap between the heat dissipation temperature dispersion plate and the phased array antenna board, and the first thermal conductive pad is arranged in the first installation gap.

3. The phased array antenna test module according to claim 2, characterized in that: The distance between the front side of the heat dissipation and temperature dispersion plate and the phased array antenna board is 70%-80% of the thickness of the first thermal pad.

4. The phased array antenna test module according to claim 2, characterized in that: A first connecting hole is also formed on the end face of each of the first mounting limit columns. A plurality of first connecting members are arranged on the phased array antenna board. The plurality of first connecting members correspond to the plurality of first mounting limit columns one by one, and each of the first connecting members can be detachably assembled in the corresponding first connecting hole.

5. The phased array antenna test module according to claim 1, characterized in that: The edge of the heat dissipation and temperature evaporating plate is provided with a dustproof protection strip, and the dustproof protection strip abuts against the edge of the phased array antenna to seal between the phased array antenna and the heat dissipation and temperature evaporating plate.

6. The phased array antenna test module according to claim 1, characterized in that: The edge of the fin heat sink is also provided with a splicing waterproof groove, and the splicing waterproof groove is located at the edge of a side surface of the fin heat sink away from the heat dissipation uniform temperature plate.

7. The phased array antenna test module according to any one of claims 1 to 5, characterized in that: A second thermal pad is further provided between the fin heat sink and the back of the heat sink and the temperature averaging plate, and the second thermal pad is used to transfer the heat on the heat sink and the temperature averaging plate to the fin heat sink, and the fin heat sink and the heat sink and the temperature averaging plate are detachably connected.

8. The phased array antenna test module according to claim 7, characterized in that: A plurality of second installation limit columns are arranged on the back side of the heat dissipation temperature dispersion plate, and the plurality of second installation limit columns have the same height relative to the back side of the heat dissipation temperature dispersion plate, and an end portion of each second installation limit column is used to abut against the surface of the fin heat sink to form a second installation gap between the heat dissipation temperature dispersion plate and the fin heat sink, and the second thermal conductive pad is arranged in the second installation gap.

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