Wafer suction device

Abstract

The present invention provides a wafer adsorption device, including a suction cup, a sealing ring, a fixing ring and an annular groove, wherein the suction cup is fixed with a fixing ring, the sealing ring is provided with a mounting cavity inside, the mounting cavity matches the fixing ring, an annular groove is provided below the sealing ring, a sealing cover is fixed inside the suction cup, the sealing cover is connected with the fixing ring below, an extrusion groove is fixed above the sealing cover, a bolt is provided on the suction cup, a positioning groove is provided on the sealing cover, the positioning groove is provided on the circumference of the extrusion groove, a positioner is fixed in the positioning groove, and the bolt passes through the suction cup. The wafer adsorption device has a simple structure and is easy to use. It only needs to adsorb the wafer with the suction cup, and then the air in the suction cup is emptied by the bolt to form a vacuum space between the suction cup and the wafer, so that the wafer is adsorbed firmly. The device can also detect whether the adsorption is tight during adsorption and where the loose position is.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer adsorption device. Background Art

[0002] As is known to all, the existing wafer adsorption device is an auxiliary device for semiconductor equipment, which has been widely used in the field of semiconductor equipment technology.

[0003] For example, the patent with the publication number "CN109817560A" and the patent name "A wafer adsorption device for preventing heat conduction" discloses that "the present invention belongs to the field of semiconductor production and manufacturing, specifically, a wafer adsorption device for preventing heat conduction, the upper surface of the wafer carrier is respectively provided with an inner sealing ring and an outer sealing ring, an annular vacuum chamber is formed between the inner and outer sealing rings, the interior of the inner sealing ring is a normal pressure chamber; a wafer carrier boss is provided in the vacuum chamber, and a vacuum hole is opened on the wafer carrier in the vacuum chamber; the wafer carrier in the normal pressure chamber is respectively opened Teaching hole and atmospheric pressure chamber exhaust hole; an annular boss is provided in the inner hole of the suction cup neck at the lower part of the wafer stage, the motor shaft is inserted through the inner hole of the suction cup neck and is connected only to the annular boss, a motor shaft hollow hole is provided on the motor shaft, one end of the vacuum hole is connected to the vacuum chamber, and the other end is connected to the motor shaft hollow hole; the wafer is placed on the wafer stage, supported by the wafer stage boss and the inner and outer sealing rings, one end of the atmospheric pressure chamber exhaust hole is connected to the atmospheric pressure chamber, and the other end is connected to the atmosphere at the lower part of the wafer stage. The present invention can effectively avoid the temperature change of the wafer caused by the high-speed rotation of the motor".

[0004] In an existing wafer adsorption device for preventing heat conduction, the vacuum transmitted from each vacuum hole forms an annular vacuum chamber between the inner sealing ring and the outer sealing ring to achieve the purpose of adsorbing the wafer. In order to prevent the wafer from being deformed due to the pressure difference between the vacuum chamber and the outside, a plurality of wafer support bosses are arranged between the inner sealing ring and the outer sealing ring. When the wafer contacts the wafer support bosses and the inner and outer sealing rings, a normal pressure chamber is formed inside the inner sealing ring without the wafer support bosses. The normal pressure chamber isolates the contact between the wafer support table and the wafer, thereby cutting off the heat conduction channel. The upper and lower pressures of the normal pressure chamber are equal, and the wafer will not be deformed. The function of the exhaust hole of the normal pressure chamber is to prevent the wafer from drifting or sticking due to the partial closure of the normal pressure chamber when placing or removing the wafer. In the use of an existing wafer adsorption device for preventing heat conduction, it is found that it is impossible to understand whether the wafer is adsorbed tightly, and the air in the suction cup cannot be fully exhausted during exhaust, resulting in high limitations on its use. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the shortcomings of the prior art, the present invention designs two schemes to achieve stable adsorption of the wafer. The first scheme adopts a simple mechanical movement to fix the sealing ring on the fixing ring below the suction cup through the installation cavity, and the suction cup is used to adsorb the wafer. After pressing to expel part of the air, the bolt is screwed downward using a handle. A cylinder is provided under the bolt to squeeze the extrusion groove on the sealing cover in the suction cup. The sealing cover is pressed downward to expel the air in the suction cup. The device enables the suction cup to adsorb the wafer through simple mechanical movement. As an auxiliary, an annular flange is fixed under the sealing cover. The annular flange will cause secondary adsorption to the wafer after contacting the wafer. The second scheme adopts Electrical component adsorption, a vacuum pump is provided on the device to further evacuate the air on the suction cup to prevent the suction cup from being filled with air due to vibration or other usage problems during the movement of the device, causing the wafer to fall from the suction cup. At the same time, a connecting pipe and a protective net are provided at the connection between the vacuum pump and the suction cup, and a protective pad is installed in the protective net, so that the device can ensure the adsorption strength while ensuring the safety of the wafer when in use. The device uses some electrical components to ensure the accurate positioning of the wafer when in use, providing a wafer adsorption device with a simple structure, economical and practical, and a wafer protection system.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer adsorption device, comprising a suction cup, a sealing ring, a fixing ring and an annular groove, wherein a fixing ring is fixed on the suction cup, an installation cavity is arranged inside the sealing ring, the installation cavity matches the fixing ring, an annular groove is arranged below the sealing ring, a sealing cover is fixed inside the suction cup, the sealing cover is connected to the fixing ring below, an extrusion groove is fixed above the sealing cover, a bolt is arranged on the suction cup, a positioning groove is arranged on the sealing cover, the positioning groove is arranged around the extrusion groove, a locator is fixed in the positioning groove, and the bolt passes through the suction cup.

[0009] In order to facilitate the annular groove to have a greater adsorption force on the wafer, the present invention has an improvement that the annular groove is small at the top and large at the bottom and is trapezoidal.

[0010] In order to facilitate the use of the bolt to lift and lower to empty the air in the suction cup, the present invention is improved in that a handle is fixed to the other end of the bolt.

[0011] In order to facilitate the clamping of the handle, the present invention is improved in that the circumference of the handle is a regular polygon.

[0012] In order to facilitate the extrusion of the extrusion groove, the present invention has an improvement that a cylinder is arranged below the bolt, the cylinder is connected to the bolt, and the cylinder matches the extrusion groove.

[0013] In order to facilitate the suction cup to further absorb the wafer, the present invention is improved in that an annular flange is arranged in the sealing cover.

[0014] In order to facilitate stable adsorption, the present invention is improved in that the annular flange is arranged in multiple groups.

[0015] In order to understand the adsorption force of the device on the wafer, the present invention is improved in that a pressure sensor is fixedly arranged in the sealing ring.

[0016] In order to facilitate understanding of whether the suction force of the edge of the wafer suction cup of the device is uniform, the present invention is improved in that the pressure sensors are arranged in multiple groups, the pressure sensors are evenly arranged in the sealing ring, and the pressure sensors are arranged between the installation cavity and the annular groove.

[0017] In order to conveniently remind the user that the device is not tightly adsorbed, the present invention is improved in that the warning device includes an indicator light and a buzzer, and the indicator light is arranged around the buzzer.

[0018] In order to prevent the vacuum pump from damaging the device during adsorption, the present invention is improved in that the protection net is filled with a protection pad.

[0019] (III) Beneficial effects

[0020] Compared with the prior art, the present invention provides a wafer adsorption device, which has the following beneficial effects:

[0021] The wafer adsorption device has a simple structure and is easy to manufacture. The sealing ring is fixed on the fixing ring below the suction cup through the installation cavity, the suction cup is used to adsorb the wafer, and after some air is discharged by mechanical pressing, the bolt is screwed downward by the handle, and the device moves downward by the bolt. A positioning groove is arranged below the bolt to prevent damage caused by squeezing the sealing cover. The positioning groove is limited to make the device more accurately positioned when in use. A cylinder is arranged below the bolt to squeeze the squeezing groove on the sealing cover in the suction cup, and the sealing cover is pressed downward to discharge the air in the suction cup. An annular flange is fixed under the sealing cover, and the annular flange causes secondary adsorption to the wafer after contacting the wafer. The positioning device and the pressure sensor can be used to adjust the wafer. In order to better achieve the adsorption of the wafer, the vacuum pump can be used to make the suction cup firmly adsorb the wafer, the pressure sensor transmits information to the controller, the display screen shows the position that is not adsorbed firmly, and the alarm is sounded. The device is equipped with a vacuum pump to further exhaust the air on the suction cup. The vacuum pump enables the device to adsorb the wafer three times to prevent the device from being filled with air in the suction cup due to vibration or other usage problems during movement, causing the wafer to fall from the suction cup. At the same time, a connecting pipe and a protective net are provided at the connection between the vacuum pump and the suction cup, and a sealing pad is installed in the protective net to ensure the adsorption strength while ensuring the safety of the wafer when the device is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the present invention;

[0023] Figure 2 For the present invention Figure 1 A schematic diagram of the local enlarged structure at point A in the middle;

[0024] Figure 3 For the present invention Figure 1 A schematic diagram of the local enlarged structure at B in the middle;

[0025] Figure 4 It is a bottom view of the structure of the present invention;

[0026] Figure 5 It is a top view of the structure of the present invention.

[0027] In the figure: 1. suction cup; 2. sealing ring; 3. fixing ring; 4. annular groove; 5. installation cavity; 6. sealing cover; 7. extrusion groove; 8. bolt; 9. positioning groove; 10. positioner; 11. handle; 12. annular flange; 13. pressure sensor; 14. cylinder; 15. controller; 16. display screen; 17. warning device; 18. indicator light; 19. buzzer; 20. vacuum pump; 21. connecting pipe; 22. protection net; 23. protection pad. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-5 The wafer adsorption device includes a suction cup 1, a sealing ring 2, a fixing ring 3 and an annular groove 4. The fixing ring 3 is fixed on the suction cup 1. The sealing ring 2 is provided with a mounting cavity 5 inside, and the mounting cavity 5 matches the fixing ring 3. An annular groove 4 is provided below the sealing ring 2. A sealing cover 6 is fixed inside the suction cup 1. The sealing cover 6 is connected to the fixing ring 3 below, and an extrusion groove 7 is fixed above the sealing cover 6. A bolt 8 is provided on the suction cup 1, and a positioning groove 9 is provided on the sealing cover 6. The positioning groove 9 is provided on the periphery of the extrusion groove 7. A positioner 10 is fixed in the positioning groove 9, and the bolt 8 passes through the suction cup 1.

[0030] The annular groove 4 is trapezoidal in shape, with a small top and a large bottom, so that the annular groove 4 can have a greater adsorption force on the wafer.

[0031] A handle 11 is fixed to the other end of the bolt 8 for conveniently utilizing the bolt 8 to lift and lower to exhaust the air in the suction cup 1 .

[0032] The handle 11 has a regular polygonal shape around it, so that the handle 11 can be easily clamped.

[0033] A cylinder 14 is arranged below the bolt 8 , and the cylinder 14 is connected to the bolt 8 . The cylinder 14 matches the extrusion groove 7 , so as to facilitate extrusion of the extrusion groove 7 .

[0034] An annular flange 12 is provided inside the sealing cover 6 to facilitate the suction cup 1 to further absorb the wafer.

[0035] The annular flanges 12 are arranged in multiple groups for the convenience of adsorption and stability.

[0036] A pressure sensor 13 is fixedly disposed inside the sealing ring 2 in order to understand the adsorption force of the device on the wafer.

[0037] The pressure sensors 13 are arranged in multiple groups, and the pressure sensors 13 are evenly arranged in the sealing ring 2. The pressure sensors 13 are arranged between the mounting cavity 5 and the annular groove 4, in order to facilitate understanding whether the device adsorbs the edge suction force of the wafer suction cup 1 evenly.

[0038] The warning device 17 includes an indicator light 18 and a buzzer 19. The indicator light 18 is arranged around the buzzer 19 to conveniently remind the user that the device is not tightly adsorbed.

[0039] The protection net 22 is filled with a protection pad 23 to prevent the vacuum pump 20 from damaging the device during adsorption.

[0040] In summary, when the wafer adsorption device is in use, the sealing ring 2 is fixed to the fixing ring 3 on the bottom of the suction cup 1 through the installation cavity 5, and the suction cup 1 is used to adsorb the wafer. After pressing to expel part of the air, the bolt 8 is screwed downward using the handle 11. A cylinder 14 is provided under the bolt 8 to squeeze the extrusion groove 7 on the sealing cover 6 in the suction cup 1. The sealing cover 6 is pressed down to expel the air in the suction cup 1. The device enables the suction cup 1 to adsorb the wafer through simple mechanical movement. An annular flange 12 is fixed under the sealing cover 6. The annular flange 12 will cause secondary adsorption to the wafer after contacting the wafer. The wafer adsorption can be better achieved with the help of the positioner 10 and the pressure sensor 13. The suction cup 1 can firmly adsorb the wafer through the vacuum pump 20. The pressure sensor 13 transmits information to the controller 15. The display screen 16 shows which position is not adsorbed firmly. When the alarm 17 sounds, the device is provided with a vacuum pump 20 to further evacuate the air on the suction cup 1 to prevent the device from being filled with air in the suction cup 1 due to vibration or other usage problems during movement, causing the wafer to fall from the suction cup 1. At the same time, a connecting pipe 21 and a protective net 22 are provided at the connection between the vacuum pump 20 and the suction cup 1, and a protective pad 23 is installed in the protective net 22, so that the device can ensure the adsorption strength while ensuring the safety of the wafer when in use. The device uses some electrical components to ensure accurate positioning of the wafer when the device is in use. Through the cooperation of the pressure sensor 13 and the display screen 16 on the controller 15, the wafer can be adsorbed better and more intelligently, and it is convenient to understand the wafer position that is not fixed. The device cooperates with the vacuum pump 20 to facilitate further adsorption of the wafer. The wafer can be triple adsorbed using this device.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer adsorption device, comprising a suction cup (1), a sealing ring (2), a fixing ring (3) and an annular groove (4), characterized in that: A fixing ring (3) is fixed on the suction cup (1), a mounting cavity (5) is arranged inside the sealing ring (2), the mounting cavity (5) matches the fixing ring (3), an annular groove (4) is arranged below the sealing ring (2), a sealing cover (6) is fixed inside the suction cup (1), the sealing cover (6) is connected to the fixing ring (3) at the bottom, an extrusion groove (7) is fixed above the sealing cover (6), a bolt (8) is arranged on the suction cup (1), a positioning groove (9) is arranged on the periphery of the extrusion groove (7), and a positioner ( 10), the bolt (8) passes through the suction cup (1), a controller (15) is arranged on one side of the suction cup (1), a display screen (16) is fixed on one side of the controller (15), a warning device (17) is fixed on the other side of the display screen (16), the display screen (16) is connected to the warning device (17), a vacuum pump (20) is arranged on the other side of the suction cup (1), the vacuum pump (20) is connected to the suction cup (1) through a connecting pipe (21), a protective net (22) is fixed at the connection between the connecting pipe (21) and the suction cup (1), and the vacuum pump (20) is connected to the controller (15); The annular groove (4) is trapezoidal in shape, with a smaller top and a larger bottom. A handle (11) is fixed to the other end of the bolt (8). The circumference of the handle (11) is a regular polygon. A cylinder (14) is arranged below the bolt (8), the cylinder (14) is connected to the bolt (8), and the cylinder (14) matches the extrusion groove (7); An annular flange (12) is arranged inside the sealing cover (6).

2. The wafer adsorption device according to claim 1, characterized in that: The annular flanges (12) are arranged in multiple groups.

3. The wafer adsorption device according to claim 1, characterized in that: A pressure sensor (13) is fixedly arranged in the sealing ring (2).

4. The wafer adsorption device according to claim 1, characterized in that: The pressure sensors (13) are arranged in multiple groups, the pressure sensors (13) are evenly arranged in the sealing ring (2), and the pressure sensors (13) are arranged between the installation cavity (5) and the annular groove (4).

5. The wafer adsorption device according to claim 1, characterized in that: The warning device (17) comprises an indicator light (18) and a buzzer (19), wherein the indicator light (18) is arranged around the buzzer (19); and a protection pad (23) is filled in the protection net (22).

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