Wafer carrier device

Abstract

The present invention provides a wafer carrier, comprising: a box for carrying wafers, a base for gripping and cooperating, a mounting seat for cooperating with a detection machine, and a cover body cooperating with the box; wherein the base and the mounting seat are separately arranged on the outside of the box and arranged in alignment; and the base and the mounting seat are both placed in parallel with the wafer. The carrier of the present invention is particularly suitable for placing large-size wafers, has high structural strength and stable wafer placement, can cover wafers, and reduce the fragmentation rate; can cooperate with manual operation or robot clamping operation, and can also place wafers horizontally or vertically, has a wide range of uses, is highly practical, ensures wafer quality, and improves production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor silicon wafer production auxiliary equipment, and in particular relates to a wafer carrying device. Background Art

[0002] In order to increase the number of chips on a single wafer and reduce production costs, the size of semiconductor wafers has developed from the existing 6-inch and 8-inch to 12-inch and 18-inch, and it is expected that semiconductor wafers with larger diameters and thinner thicknesses will be developed. However, the carrier of large-size wafers is a key device to ensure the quality of wafers, especially during production turnover or shipment, when wafers are prone to fragmentation and are easily contaminated by the on-site environment; for transportation between processes, personnel and automatic manipulators will cross-carry operations; and for different environments, the angles at which silicon wafers need to be placed are different, which is to ensure that the silicon wafers can be placed both horizontally and vertically. Summary of the invention

[0003] The present invention provides a wafer carrier, which is particularly suitable for the transfer, carrying and placement of large-size wafers, and solves the technical problems of reducing the fragmentation rate and improving the transfer efficiency during transportation and has a wide range of applications.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A wafer carrier device comprises: a box for carrying wafers, a base for grabbing and cooperating, a mounting seat for cooperating with a detection machine, and a cover for cooperating with the box; wherein the base and the mounting seat are separately arranged on the outside of the box and arranged in alignment; and the base and the mounting seat are both placed parallel to the wafer.

[0006] Furthermore, the box body is provided with several rows of body slot groups for inserting the wafers; the cover body is provided with a cover slot group corresponding to the body slot group on one side close to the box body; the wafer is placed in the gap slot formed by the body slot group and the cover slot group.

[0007] Furthermore, the cover body is embedded in the box body and covered, and the cover groove group is arranged along the length of the cover body and in the middle of its length; the cover groove group includes a plurality of clips arranged at intervals; and each clip is provided with a plurality of Z-shaped grooves arranged at intervals.

[0008] Furthermore, the Z-shaped grooves are arranged in the same direction and / or in opposite directions along the length direction of the clamping strip; and the Z-shaped grooves in adjacent clamping strips are arranged side by side or staggered.

[0009] Furthermore, two groove handles for operating the cover body are provided on a side of the cover body away from the box body, and the groove handles are symmetrically arranged relative to the cover groove group.

[0010] Furthermore, symmetrically arranged handles are provided on the sides of the box body, and the handles are placed on two side surfaces adjacent to the base.

[0011] Furthermore, the base is detachably connected to the box, and the base and the mounting seat are both flat surfaces away from the box.

[0012] Furthermore, the base is a square structure, including a plurality of sockets for card installation, and the sockets are arranged horizontally and / or vertically along the base.

[0013] Furthermore, the mounting base includes a plurality of snap-in holes adapted to the detection machine and connection holes matched to the box body; the figure formed by connecting the snap-in holes is a triangle; the connection hole is arranged close to one side of the upper end surface of the box body and is adjacent to two of the snap-in holes.

[0014] Furthermore, the mounting seat is also provided with a plurality of through-hole circles for contacting with the detection needles on the detection machine and outer edge grooves arranged along the outer edge thereof and opening outward.

[0015] Compared with the prior art, the carrying device designed by the present invention is particularly suitable for the transportation and placement of large-size wafers. It has a reasonable structural design, high strength, easy assembly and convenient operation; the wafer turnover is stable and safe; the yield rate is improved, the quality of the wafers is guaranteed, the transportation efficiency is high, the application range is wide and the practicability is strong.

[0016] By setting a patterned groove on the top inner side of the cover body, the upper end of each wafer can be embedded and placed, thereby reducing the shaking of the wafer during the transfer and transportation process and reducing the occurrence of fragments; the coverable carrying device not only prevents the wafer from being contaminated, but also reduces the occurrence of wafer cracking during the transfer and transportation process, thereby improving the yield rate and ensuring product quality.

[0017] The carrying device can be suitable for manual handling operations through symmetrically arranged handles. For special environments or short-distance turnover, it is convenient and saves operation time. It also does not require the installation of supporting facilities, thereby reducing production costs.

[0018] At the same time, a base is provided on the other side of the carrying device for easy clamping by the robot. The structure is simple, and the base can also be used to place the wafer horizontally and stably on the table; the box structure of the base and the carrying device is a detachable structure, which is easy to maintain and process.

[0019] The lower bottom surface of the box is a flat surface and is provided with four arc-shaped columns with openings facing outward, which are convenient for cooperating with the columns arranged on the platform to prevent the supporting device from sliding or shaking when placed vertically, avoiding the risk of falling, so that the silicon wafers can be placed upright to meet the needs of different working conditions, ensure the quality of the wafers and improve transportation efficiency.

[0020] The carrying device is also provided with a mounting seat that cooperates with the detection machine, so that the carrying device can be accurately placed on the upper loading platform of the detection machine and the wafer can be placed horizontally and stably; the mounting seat and the box body are detachable and matched, and the structure is simple and easy to process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a three-dimensional diagram of a wafer carrying device according to an embodiment of the present invention;

[0022] Figure 2 is a side view of a carrying device according to an embodiment of the present invention;

[0023] Figure 3 is a bottom view of a carrying device according to an embodiment of the present invention;

[0024] Figure 4 It is a structural schematic diagram of a box body according to an embodiment of the present invention;

[0025] Figure 5 is a schematic structural diagram of a base according to an embodiment of the present invention;

[0026] Figure 6 is a schematic structural diagram of a mounting base according to an embodiment of the present invention;

[0027] Figure 7 is a schematic diagram of the back structure of a cover body according to an embodiment of the present invention;

[0028] Figure 8 is a front structural schematic diagram of a cover body according to an embodiment of the present invention;

[0029] Fig. 9 1 is a schematic diagram of the structure of the Z-shaped groove distribution in the cover groove group of the first embodiment of the present invention;

[0030] Fig.10 It is a structural schematic diagram of the Z-shaped groove distribution in the cover groove group of the second embodiment of the present invention.

[0031] In the figure:

[0032] 10, box body 11, body slot group 111, slot group 1

[0033] 112, slot group 2 12, pillar 13, handle

[0034] 14. Insertion column 20, cover body 21, cover groove assembly

[0035] 22. Clip strip 23. Z-shaped groove 24. Grooved handle

[0036] 30, base 31, short column 32, center hole

[0037] 33, socket 34, side groove 40, mounting seat

[0038] 41, snap-on hole 42, outer groove 43, through hole circle

[0039] 44. Connection hole DETAILED DESCRIPTION

[0040] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] This embodiment provides a wafer carrier device, such as Figure 1-3 As shown, there is a box body 10 for carrying wafers and a cover body 20 that can be detachably matched with the box body 10, wherein the box body 10 and the cover body 20 are independently arranged, and the cover body 20 is embedded and fixed on the upper end surface of the box body 10, and the cover body 20 is operated to cover or disassemble. Among them, a plurality of rows of body slot groups 11 for inserting wafers are arranged in the box body 10; a cover slot group 21 corresponding to the body slot group 11 is arranged on the side of the cover body 20 close to the box body 10; the wafer is placed in the gap slot formed by the body slot group 11 and the cover slot group 21; at the same time, a base 30 that can be grasped and matched is arranged on one side of the box body 10; the side of the base 30 away from the box body 10 and the bottom of the box body 10 are both flat surfaces.

[0042] Specifically, Figure 1 and Figure 2 As shown, the side wall of the box 10 is a rectangular structure, and the width of the box 10 is gradually reduced along its height, with a width at the top and a narrowness at the bottom, and a vertical section in the middle; at the same time, the inner side of the top upper end surface of the box 10 is a stepped structure, the purpose is to allow the cover 20 to be embedded and placed on the box 10, and complete the cover with the cover 20. In this embodiment, the box 10 is a closed structure, and after it is matched with the cover 20, the wafer is completely sealed in the carrying device. The matching device of this structure is mainly suitable for handling and carrying during packaging and shipment, and prevents particles and metals from contaminating the surface of the wafer during transportation. The purpose of this structure is to ensure that the wafer is smoothly inserted into the box 10, requiring the width and length of the upper end surface of the box 10 to be greater than the width of the wafer slot, that is, the part of the box 10 where the wafer slot is placed and the top of the box 10 are connected in a transitional manner. The box 10 can be placed vertically or horizontally, but can be used to carry wafers, and the wafers are placed along the width direction of the box 10 .

[0043] like Figure 3As shown, the outer side surface of the bottom of the box 10 is a flat bottom surface, which can be directly connected to the box 10 as a whole, or it can be an added flat surface, which can be determined according to the actual working conditions. In this embodiment, since the load-bearing device needs to be placed on a special placement rack when it is placed upright, two symmetrically arranged panels are specially arranged and four arc-shaped columns 12 are arranged on the outer sides of the panels. There are also gap grooves between the panels, which are all arranged perpendicular to the direction in which the wafers are placed horizontally, that is, arranged along the length direction of the box 10; the height of the arc-shaped columns 12 is higher than the height of the position where the panels are located, and the openings of the four arc-shaped columns 12 are all arranged outward, and the arc of the columns 12 is at least a semicircular structure; it is used to cooperate with the columns arranged on the placed platform to prevent the load-bearing device from sliding or shaking when placed vertically, and avoid the risk of falling. Of course, it can also be a bottom surface of other structures, as long as the bottom surface is guaranteed to be a flat plane, it is within the protection scope of this case. The lower bottom surface of the box is a flat surface and is provided with four arc-shaped columns 12 with openings facing outward, which are convenient for cooperating with the columns arranged on the placed platform to prevent the supporting device from sliding or shaking when placed vertically, and avoid the risk of falling, so that the silicon wafers can be placed upright to meet the needs of different working conditions, ensure the quality of the wafers, and improve transportation efficiency.

[0044] like Figure 4 As shown, the body slot group 11 includes a slot group 111 arranged along the height of the box body 10 and a slot group 2 112 arranged along the bottom width of the box body 10. In order to facilitate the processing and manufacturing of slot group 111 and slot group 2 112, preferably, slot group 111 and slot group 2 112 form an intermittent U-shaped slot, and the wafer is placed along the direction of the slot.

[0045] The slot group 111 is arranged along the height direction of the box 10. Compared with the slot group 2 112, the slot group 111 is more stable and safer for the wafer to be clamped. Therefore, the height of the slot group 111 is required to be less than the diameter of the wafer and greater than the radius of the wafer. The purpose is to ensure that the height of the area where the slot group 111 contacts the wafer is at least 1 / 2 of its diameter, so as to ensure the stability of the wafer being clamped on both sides. Preferably, the slot group 111 is an arc-shaped structure with a wide top and a narrow bottom, which is more conducive to the stability of the wafer and the clamping slot, and can prevent the wafer from shaking in the clamping slot, reducing the cracks caused by shaking.

[0046] Since the groove group 2 112 is only used to support the wafer so that the wafer forms a stable structure of three-point contact in the card slot, the length of the groove group 2 112 is required to be less than the radius of the wafer, but the groove group 2 112 is required to be an arc groove with independent ends, which is set at the connection between the side and the bottom surface, and its height is higher than the lowest point of the bottom surface. When the wafer is placed, the groove group 2 112 contacts the two sides of the lowest point of the wafer, and the lowest position of the wafer is suspended to ensure that the depth of contact with the wafer is small, so as to further improve the stability of the wafer placement and prevent it from shaking during transportation. Preferably, the groove group 1 111 and the groove group 2 112 are both slats with the same thickness, and the gap width between adjacent grooves is the same, which is not only convenient for processing, but also has good structural consistency.

[0047] like Figure 1-4 As shown, a symmetrically arranged handle 13 is also provided on the side of the box body 10, and the handle 13 is placed on two side surfaces adjacent to the base 30, that is, the handle 13 is arranged on two side surfaces in the width direction of the box body 10, and is arranged on the side surface close to the body slot group 11. Preferably, the handle 13 and the side surface of the box body 10 are detachably mounted, and are arranged tilted toward one side of the base 30.

[0048] Since the diameter of the wafer is relatively large, and in order to ensure the stable placement of the wafer, the carrier itself needs a certain thickness and an external structure that is larger than the diameter of the wafer, so its overall weight is heavier. In order to ensure the transportation of the carrier carrying the wafer or the empty carrier, a certain external force is required to extract it, and the tilted handle 13 is more conducive to the operator's transportation, especially when the wafer is placed horizontally. The detachable handle 13 can be used in operating procedures with certain space restrictions. The carrier can be suitable for manual handling operations through the symmetrically arranged handles 13. For special environments or short-distance turnover, it is convenient and saves operating time. There is no need to install supporting facilities, which reduces production costs.

[0049] Preferably, if Figure 5 As shown, a base 30 is also provided on any side of the box 10 parallel to the wafer, and the base 30 and the box 10 are detachably connected. In this embodiment, the side of the base 30 away from the box 10 is a flat surface and a square structure, and of course it can also be other structural shapes. A short column 31 is provided on the side close to the box 10, and a center hole 32 is provided at the center of the short column 31. The short column 31 is fixed in the boss on the outer wall of the box 10 and embedded in the center hole 32. A plurality of sockets 33 for clamping with a robot are also provided on the side of the base 30 away from the box 10. The sockets 33 are arranged at the outer edge of the center hole 32, and the specific position can be determined according to actual conditions.

[0050] In order to improve the adjustability of the base 30 and the manipulator, four jacks 33 are selected, two of which are arranged along the horizontal direction of the base 30, and the other two are arranged along the vertical direction of the base 30, that is, they can be adjusted in both the horizontal direction and the vertical direction. Of course, four jacks 33 can also be arranged along the horizontal direction of the base 30, or along the vertical direction of the base 30. A plurality of side grooves 34 of different shapes and openings facing outward are provided on the side of the base 30 away from the box 10, which can also be matched with the clamping head on the platform to clamp the base 30 to meet the requirements of different clamping methods.

[0051] The base 30 is suitable for long-distance transportation or automated control processes, which is not only convenient to operate but also stable and safe. At the same time, the structural design of the entire base 30 is very simple, and the base 30 can be used as a reference to place the wafer horizontally and stably on the workbench; the structure of the base 30 and the box 10 of the carrying device is a detachable structure, which is more convenient for maintenance and processing.

[0052] like Figure 6 As shown, a mounting base 40 for cooperating with a detection machine is also provided on the side of the box body 10, and the mounting base 40 is arranged opposite to the base 30. Preferably, the mounting base 40 and the box body 10 are also detachably installed. Three snap-in holes 41 adapted to the detection machine are also provided on the mounting base 40, and the three snap-in holes 41 are all oblong hole structures, and the center points of the three snap-in holes 41 are connected to form a stable isosceles triangle. At the same time, a plurality of outer grooves 42 with openings facing outward are provided on the outer edge of the mounting base 40, which are used to adapt to the positioning pins on the detection machine. A plurality of distributed through-hole circles 43 are also provided on the mounting base 40, which are used to contact with the detection pins on the detection machine, so as to judge the accuracy of the placement position of the carrier device.

[0053] Meanwhile, the mounting seat 40 is also provided with a plurality of connection holes 44 that match the plug posts 14 disposed on the side of the box body 10. Preferably, the connection holes 44 are disposed close to the clamping holes 41. In this embodiment, two connection holes 44 are disposed, and accordingly, the number of the plug posts 14 is also two. In order to increase the stability of its fixed placement, two plug posts 14 are selected to be disposed close to one side of the upper end surface of the box body 10, so that the mounting seat 40 can be stably matched with the box body 10, and the box body 10 can be stably placed on the upper loading platform of the detection machine.

[0054] The setting of the mounting seat 40 allows the carrying device to cooperate with the detection machine, allows the carrying device to be accurately placed on the upper loading platform of the detection machine, and can stably place the wafer horizontally; the mounting seat 40 and the box body 10 are detachable and matched, and the structure is simple and easy to process.

[0055] like Figure 7 and Figure 8As shown, the cover 20 is embedded in the box 10 and covered, and the inner side of the cover 20 is also a stepped structure, which is adapted to the upper end surface of the box 10; and the cover groove group 21 is arranged along the length of the cover 20 and located in the middle of its length. Among them, the cover groove group 21 includes a plurality of card strips 22 arranged in gaps, and a card slot for clamping a wafer is provided between adjacent card strips 22. In this embodiment, the length of the card strip 22 is less than 1 / 2 of the length of the cover 20 and greater than 1 / 4 of the length of the cover 20. This is because if the length of the card strip 22 is greater than 1 / 2, the length of the card strip 22 will be increased, and the card slot formed by the card strip 22 only contacts the top of the wafer. Due to the thickness limitation of the cover 20 itself, the depth of the card slot formed by the card strip 22 is also limited, and the area of ​​contact between the wafer and the card strip 22 cannot be too large. On the contrary, a card strip 22 that is too long will waste its material, thereby affecting its matching accuracy with the wafer. If the length of the card strip 22 is less than 1 / 4 of the length of the cover body 20, the area in which the card slot formed by the card strip 22 contacts the wafer is too short, and its placement stability cannot be further improved. Preferably, the length of the card strip 22 is less than 1 / 3 of the length of the cover body 20 and greater than 1 / 4 of the length of the cover body 20. Under the premise of ensuring that the wafer is stably placed, the length of the strip 22 can be minimized to reduce the processing cost of the cover body 20.

[0056] like Figure 9-10 As shown, each clip strip 22 is provided with a plurality of Z-shaped grooves 23 arranged at intervals, and each clip strip 22 is provided with at least two Z-shaped grooves 23, two adjacent Z-shaped grooves 23 are connected by a rectangular solid block, and the Z-shaped grooves 23 on each clip strip 22 are arranged at intervals, and the spacing between adjacent Z-shaped grooves 23 is the same. The Z-shaped grooves 23 in each clip strip 22 are arranged in the same direction and / or in the opposite direction along the length direction of the clip strip 22, and the Z-shaped grooves 23 in adjacent clip strips 22 are arranged side by side or staggered.

[0057] like Fig. 9 As shown, the Z-shaped grooves 23 are arranged parallel to the card strips 22 along the length direction of the card strips 22, and the Z-shaped grooves 23 in all the card strips 22 are arranged in the same direction and at the same spacing. For example, the Z-shaped grooves 23 in adjacent card strips 22 are arranged side by side in the same direction; or the Z-shaped grooves 23 in adjacent card strips 22 are arranged staggered in the same direction, which is omitted in the figure.

[0058] like Fig.10 As shown, the Z-shaped groove 23 is also arranged parallel to the card strip 22 along the length direction of the card strip 22, and the Z-shaped grooves 23 in each card strip 22 are arranged in the same direction, but the Z-shaped grooves 23 in some card strips are arranged in the same direction as shown in FIG. Fig. 9The Z-shaped grooves 23 in the card strip 22 are arranged in opposite directions, that is, the Z-shaped grooves 23 in some card strips 22 are arranged in opposite directions, and the spacing between adjacent Z-shaped grooves 23 in all the same card strips 22 is the same; the card strips 22 where the reverse Z-shaped grooves 23 are located are arranged at intervals from the card strips 22 where the forward Z-shaped grooves 23 are located; of course, the arrangement of the card strips 22 where the reverse Z-shaped grooves 23 are located and the card strips 22 where the forward Z-shaped grooves 23 are located can also be other ways, but they are all within the protection scope of this case. For example, the Z-shaped grooves 23 in adjacent card strips 22 are arranged side by side; or the Z-shaped grooves 23 in adjacent card strips 22 are arranged in an alternating manner, and the drawings are omitted.

[0059] Further, the Z-shaped grooves 23 are arranged along the length direction of the card strip 22, but the Z-shaped grooves 23 on each card strip 22 may be arranged in the forward direction or in the reverse direction, that is, the adjacent Z-shaped grooves 23 in each card strip 22 may be arranged in the forward direction or in the reverse direction, or one may be arranged in the forward direction and the other in the reverse direction; at the same time, the Z-shaped grooves 23 in adjacent card strips 22 may be arranged side by side in the same direction, or may be arranged side by side in the reverse direction, or may be arranged side by side in the forward and reverse directions. Of course, for the structure in which the Z-shaped grooves 23 in adjacent card strips 22 are arranged in a staggered manner, the staggered Z-shaped grooves 23 may all be arranged in the same direction, or may all be arranged in the reverse direction, or may exist in both the forward and reverse directions, which is omitted in the drawings.

[0060] By arranging a Z-shaped pattern groove on the inner side of the cover body 20, the upper end of each wafer is embedded and placed, thereby reducing the shaking of the wafer during transfer and transportation and reducing the occurrence of fragments; the covering carrying device not only prevents the wafer from being contaminated, but also reduces the occurrence of wafer cracking during transfer and transportation, thereby improving the yield and ensuring product quality.

[0061] Furthermore, two circular groove handles 24 for operating the cover 20 are provided on the side of the cover 20 away from the box 10. The groove handles 24 are symmetrically arranged relative to the cover groove group 21, and from the outside, the groove handles 24 are two diagonally arranged fan-shaped grooves and two diagonally arranged arc-shaped holes. The corresponding side close to the box 10 is an operating space formed by two rectangular plates of different widths and coaxially arranged stacked, and a circular groove for the groove handle 24 is provided in the middle of the two stacked rectangular plates. The setting of this structure not only does not affect the cooperation between the wafer and the cover groove group 21, but also allows the cover 20 and the box 10 to be freely operated, which is safe, reliable, energy-saving and environmentally friendly.

[0062] 1. The carrying device designed by the present invention is particularly suitable for the transportation and placement of large-size wafers. It has a reasonable structural design, high strength, easy assembly and convenient operation; the wafer turnover is stable and safe; the yield rate is improved, the quality of the wafers is guaranteed, the transportation efficiency is high, the scope of use is wide and the practicability is strong. After the closed structure box and the cover are matched, the wafers are completely sealed in the carrying device. This structural match is more suitable for the handling and carrying of wafers during packaging and shipment, preventing particles and metals from contaminating the surface of the wafers during transportation, ensuring the surface quality of the wafers, and improving the carrying efficiency.

[0063] 2. By setting a pattern groove on the top of the inner side of the cover, the upper end of each wafer is embedded and placed, thereby reducing the shaking of the wafer during the transfer and transportation process and reducing the occurrence of fragments; the coverable carrying device not only prevents the wafer from being contaminated, but also reduces the occurrence of wafer cracking during the transfer and transportation process, thereby improving the yield rate and ensuring product quality.

[0064] 3. The carrying device can be suitable for manual handling operations through symmetrically arranged handles. For special environments or short-distance turnover, it is convenient and saves operation time. It does not require the installation of supporting facilities, thereby reducing production costs.

[0065] 4. At the same time, a base is provided on the other side of the carrying device for easy clamping by the robot. The structure is simple, and the base can also be used to place the wafer horizontally and stably on the table; the box structure of the base and the carrying device is a detachable structure, which is convenient for maintenance and processing.

[0066] 5. The lower bottom surface of the box is a flat surface with four arc-shaped columns with openings facing outward, which are convenient for cooperating with the columns set on the platform to prevent the supporting device from sliding or shaking when placed vertically, avoiding the risk of falling, so that the silicon wafers can be placed upright to meet the needs of different working conditions, ensure the quality of the wafers, and improve transportation efficiency.

[0067] 6. The carrying device is also provided with a mounting seat that cooperates with the detection machine, so that the carrying device can be accurately placed on the upper loading platform of the detection machine and the wafer can be placed horizontally and stably; the mounting seat and the box body can be detachably matched, and the structure is simple and easy to process.

[0068] The above embodiments of the present invention are described in detail, and the contents are only preferred embodiments of the present invention, and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A wafer carrier device, characterized in that: The invention comprises: a box for carrying a wafer, a base for grabbing and cooperating, a mounting seat for cooperating with a detection machine, and a cover body cooperating with the box; wherein the base and the mounting seat are separately arranged outside the box and arranged in alignment; and the base and the mounting seat are both placed in parallel with the wafer; The box body is provided with a plurality of rows of body slot groups for inserting the wafers; the cover body is provided with a cover slot group corresponding to the body slot group on one side close to the box body; the wafer is placed in a gap slot formed by the body slot group and the cover slot group; The cover groove group is arranged along the length of the cover body and in the middle of the length thereof; the cover groove group includes a plurality of clamping strips arranged at intervals; each clamping strip is provided with a plurality of Z-shaped grooves arranged at intervals; The Z-shaped grooves are arranged in the same direction and / or in opposite directions along the length direction of the clip strip; the Z-shaped grooves in adjacent clip strips are arranged side by side or staggered; Two symmetrically arranged panels are arranged at the bottom of the box body and four arc-shaped columns are arranged on the outside of the panels. There are also gap grooves between the panels, all of which are arranged perpendicular to the horizontal direction of the wafers. The height of the arc-shaped columns is higher than the height of the panels, and the openings of the arc-shaped columns are all arranged outwards.

2. A wafer carrier device according to claim 1, characterized in that: The cover body is embedded in the box body and covers the box body.

3. A wafer carrier according to claim 1 or 2, characterized in that: Two groove handles for operating the cover body are arranged on a side of the cover body away from the box body, and the groove handles are symmetrically arranged relative to the cover groove group.

4. A wafer carrier device according to claim 3, characterized in that: The side surfaces of the box body are also provided with symmetrically arranged handles, and the handles are placed on two side surfaces adjacent to the base.

5. A wafer carrier according to any one of claims 1-2 and 4, characterized in that: The base is detachably connected to the box body, and the base and the mounting seat are both flat surfaces away from the box body.

6. A wafer carrier device according to claim 5, characterized in that: The base is a square structure, comprising a plurality of plug holes for card installation, and the plug holes are arranged horizontally and / or vertically along the base.

7. A wafer carrier according to any one of claims 1-2, 4 and 6, characterized in that: The mounting base includes a plurality of snap-in holes adapted to the detection machine and connection holes matched to the box body; the figure formed by connecting the snap-in holes is a triangle; the connection hole is arranged close to one side of the upper end surface of the box body and is adjacent to two of the snap-in holes.

8. A wafer carrier device according to claim 7, characterized in that: The mounting seat is also provided with a plurality of through hole circles for contacting with the detection needles on the detection machine and outer edge grooves arranged along the outer edge thereof and opening outward.

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