Laptop computer with display side cooling system

Abstract

The present invention discloses a laptop computer with a display side cooling system. A laptop computing device includes: a base including a keyboard; and a display portion movably coupled to the base, and includes: a heat sink having a heat sink; one or more heat generating electronic devices thermally coupled to the heat sink; and at least one cooling fan configured to direct cooling air through the heat sink.

Description

Technical Field

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to U.S. Provisional Application No. 62945056, filed on December 6, 2019. The subject matter of that related application is incorporated herein by reference.

[0003] Fields of various embodiments

[0004] Embodiments of the present disclosure relate generally to computer architecture and thermal solutions for computing devices, and more particularly, to laptop computers with display-side cooling systems. Background Art

[0005] In most, if not all, laptop computers, the motherboard is located directly below the keyboard. As a result, heat generated by electronic components mounted on the motherboard, such as the central processing unit (CPU) and graphics processing unit (GPU), often causes the palm rest area of ​​the laptop to heat up during use. Sometimes, especially in high-powered laptops, the palm rest area can be so warm that it causes discomfort to the user. This problem can be alleviated by integrating various combinations of heat sinks, heat pipes, and air mover solutions into the laptop that transfer the heat generated on the motherboard to the palm rest of the laptop. However, these approaches have certain disadvantages.

[0006] First, due to space constraints, the heat sinks and fans typically used in laptops are usually relatively small. As a result, when the laptop is running at optimal performance, the fan must run at a very high speed to remove enough heat from the laptop (through the heat sink). The high speed of the fan will cause a certain degree of audible noise and vibration, thereby reducing the overall quality of the user experience. This problem is particularly true in high-performance laptops, which generate a lot of heat when processing larger and more complex workloads. Second, even when cooling the palm rest area of ​​the laptop, the surface temperature of the base of the laptop will increase. The uneven surface temperature generated by the laptop will give the user an overall poor ergonomic experience. In addition, the surface temperature of the base of the laptop can easily exceed the temperature that is considered comfortable for the user for a long time. Third, the ability of conventional laptop cooling solutions to transfer heat from the motherboard can vary significantly depending on whether the laptop is resting on a hard surface or on the user's lap. For example, when the laptop is resting on the user's lap, the inlet of the fan may be partially or even completely blocked, thereby greatly reducing the airflow through the heat sink and limiting the heat transfer of the motherboard. Requiring users to use the laptop on a hard surface to obtain better thermal performance will reduce the overall quality of the user experience.

[0007] As previously stated, what is needed in the art is a more efficient method of cooling a laptop computer during operation. Summary of the invention

[0008] One embodiment of the present disclosure describes a technique for cooling a heat generating component of a computing device. In various embodiments, a laptop computing device includes: a base portion including a keyboard; and a display portion movably coupled to the base portion, and includes: a heat sink having a heat sink; one or more heat generating electronic devices thermally coupled to the heat sink; and at least one cooling fan configured to direct cooling air through the heat sink.

[0009] One embodiment of the present disclosure describes another technique for cooling a heat generating component of a computing device. In various embodiments, a device includes: a heat sink having a plurality of heat sinks and a vapor chamber; one or more heat generating electronic devices thermally coupled to the vapor chamber; and at least one cooling fan configured to direct cooling air through the plurality of heat sinks, wherein a first heat sink included in the plurality of heat sinks and a second heat sink included in the plurality of heat sinks form a first air channel having a first air inlet and a first air outlet, wherein the first heat sink is adjacent to the second heat sink, and a first distance between the first heat sink and the second heat sink near the first air inlet is less than a second distance between the first heat sink and the second heat sink near the first air outlet.

[0010] One embodiment of the present disclosure describes a technology for cooling a heat generating component of a computing device. In various embodiments, a computing device includes: a base; a display portion movably connected to the base and including a housing having a movable panel and one or more fixed panels; and a mechanical assembly that positions the movable panel away from the one or more fixed panels when the display portion is opened from the base.

[0011] At least one technical advantage of the disclosed design over the prior art is that, in the disclosed design, the heat generating integrated circuit is arranged within the display portion of the computing device, which allows for a larger vapor chamber. A larger vapor chamber can achieve greater heat dissipation capacity and greater cooling efficiency, thereby enabling the computing device to operate at a higher operating level. In addition, in the disclosed design, a cooling fan is also disposed within the display portion of the computing device, which allows for a larger cooling fan. Because a larger cooling fan can provide a sufficient level of cooling airflow at a lower speed, the noise of the cooling fan is reduced in the disclosed design without negatively affecting the peak computing performance of the computing device. In addition, in the disclosed design, an air outlet is also arranged within the display portion of the computing device, which results in directing the cooling airflow away from the user and further reducing the noise of the overall cooling fan.

[0012] Another technical advantage of the disclosed design over the prior art is that, in the disclosed design, the fins of the heat exchanger are more aligned with the direction of the incoming airflow than the fins of a conventional heat exchanger. As a result, in the disclosed design, the pressure drop across the heat exchanger is relatively small. Among other things, the reduced pressure drop enables sufficient levels of cooling airflow to be provided at lower cooling fan speeds, thereby reducing the noise of the cooling fan without negatively affecting the peak computing performance of the computing device.

[0013] Yet another technical advantage of the disclosed design relative to the prior art is that, in the disclosed design, an air inlet for a cooling fan is formed in a surface of a computing device other than a bottom surface of the computing device. Thus, with the disclosed design, the cooling efficiency of the computing device is not affected by the surface on which the computing device is placed. Additionally, in the disclosed design, the air inlet for the cooling fan formed via the movable panel has a larger free area and a correspondingly lower pressure drop relative to an air inlet disposed on the bottom surface of a conventional laptop computer. In particular, the lower pressure drop enables a sufficient level of cooling airflow to be provided at lower cooling fan speeds, thereby reducing the noise of the cooling fan without negatively affecting the peak computing performance of the computing device.

[0014] These technical advantages represent one or more technical improvements over prior art computing device designs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order that the manner in which the above-mentioned features of the present invention may be understood in detail, the present invention may be described in more detail by reference to embodiments, which have been briefly summarized above, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only typical embodiments of the present invention and are therefore not to be construed as limiting the scope of the present invention, as the present invention may admit of other equally effective embodiments.

[0016] Figure 1 A laptop computer configured to implement one or more aspects of the various embodiments is shown;

[0017] Figure 2A According to various embodiments Figure 1 A schematic front view of a display portion of a laptop computer;

[0018] Figure 2B According to various embodiments Figure 1 A schematic side view of a display portion of a laptop computer;

[0019] Figure 2C According to various embodiments, along Figure 2A The section line AA shown is taken Figure 1 A partial cross-sectional view of a display portion of a laptop computer;

[0020] Figure 3 According to various embodiments Figure 1 A schematic front view of a display portion of a laptop computer;

[0021] Figure 4 According to various embodiments Figure 2A-2C A schematic diagram of a portion of a heat sink;

[0022] Figure 5 According to various embodiments, Figure 2A-2C A schematic diagram of a heat sink and heat exchanger fins viewed through a plenum chamber showing a portion of the heat sink;

[0023] Figure 6 is a schematic side view of a portion of a laptop computer having a cooling air inlet of variable size according to various embodiments;

[0024] Figure 7 is a partial side view of a laptop computer according to various embodiments, wherein a display portion includes a housing having a removable panel; and

[0025] Figure 8 is a schematic front view of a display portion of a laptop computer including a heat sink having an array of radially distributed fins according to various embodiments. DETAILED DESCRIPTION

[0026] In the following description, numerous specific details are set forth to provide a more thorough understanding of the embodiments of the present disclosure. However, it will be apparent to one skilled in the art that the embodiments of the present disclosure may be practiced without one or more of these specific details.

[0027] introduce

[0028] Various embodiments of the present disclosure provide a laptop computer with a display-side cooling system. In some embodiments, the display portion of the laptop computer houses a motherboard having one or more processors, such as a central processing unit (CPU) and / or a graphics processing unit (GPU), mounted thereon, and a single heat sink on the motherboard and at least one cooling fan configured to direct cooling air through the fins of the heat sink. Therefore, in such embodiments, the largest heat sources in the laptop computer and the cooling system for removing the heat generated by these heat sources are arranged in the display portion of the laptop computer, rather than in the base of the laptop computer that houses the keyboard.

[0029] In addition, in some embodiments, the vapor chamber included in the heat sink is configured as a support structure for the motherboard and / or one or more cooling fans located in the display portion. In such embodiments, the vapor chamber can be formed of titanium and can include a novel internal support column structure that reduces the weight and / or deflection of the vapor chamber compared to a conventional heat sink vapor chamber. In addition, in some embodiments, the display portion of the laptop computer includes one or more cooling fan inlets and / or one or more cooling fan outlets, each of which is located within or on the surface of the display portion. In such embodiments, the size of one or more cooling fan inlets can be fixed, or can be configured to open when the display portion of the laptop computer is opened from the base. In addition, in some embodiments, the heat sink thermally coupled to the vapor chamber is configured as an array of radially divergent heat sinks. In such embodiments, the radially divergent heat sinks can be aligned with the direction of the incoming airflow, which reduces the pressure drop associated with the airflow through the heat sink. In addition, in some embodiments, the display portion of the laptop computer includes a display screen that is configured to be away from a heat generating component in the display portion, such as a motherboard, when the display portion is opened from the base. Thus, in such an embodiment, the air gap between the display screen and the heat generating components in the display portion is separated by the air gap, which prevents overheating of portions of the display screen during operation of the laptop computer.

[0030] System Overview

[0031] Figure 1A laptop computer 100 is shown, which is configured to implement one or more aspects of various embodiments. The laptop computer 100 is a laptop personal computer with a hinged or "clamshell" configuration, and generally includes the functionality of a desktop computer and associated external devices. For example, in some embodiments, the laptop computer 100 includes an integrated keyboard 101, a touchpad (or trackpad) 102, and a display screen 121. By folding the display screen 121 over the keyboard 101, the laptop computer 100 can be easily stored and carried. Therefore, the laptop computer 100 can be easily transported and is suitable for mobile use. As shown, the laptop computer 100 includes a base 110 and a display portion 120 movably coupled to the base 110. The base 110 includes a keyboard 101, a touchpad 102, and a palm rest 103, and the display portion 120 includes a display screen 121, such as a display screen based on a liquid crystal display (LCD) or a light emitting diode (LED). The laptop computer 100 may further include physical interfaces for various input and output devices along the side edge 105 of the base 110, such as one or more Universal Serial Bus (USB) ports, an external display port, an Ethernet port, etc. The laptop computer 100 may further include one or more integrated webcams and / or built-in microphones (not shown).

[0032] According to various embodiments, the laptop computer 100 also includes a display-side cooling system and architecture that prevents the palm rest 103 and the bottom surface 104 of the base 110 from reaching elevated temperatures during use. In an embodiment, one or more primary heat sources in the laptop computer 100, such as a processor mounted on a motherboard, are located in the display portion 100 rather than in the base 110. Additionally, in an embodiment, one or more heat transfer devices are also located in the display portion 100 rather than in the base 110, such as one or more cooling fans and a heat sink that is fluidly coupled to the cooling fans and thermally coupled to the heat sources. Figure 2A , 2B One such embodiment is shown in and 2C.

[0033] Figure 2A is a schematic front view of the display portion 120 according to various embodiments. Figure 2B is a schematic side view of the display portion 120 according to various embodiments. Figure 2C According to various embodiments, Figure 2A The partial cross-sectional view of the display portion 120 is taken along the section line AA.

[0034] The display portion 120 includes a heat sink 220 configured as a support structure within a housing 201 or other housing of the display portion 120. In addition, the display portion 120 includes a cooling fan 230 mounted on the heat sink 220 and a printed circuit board (PCB) 240 mounted on the heat sink 220. For example, in some embodiments, the PCB 240 is a motherboard of the laptop computer 100. In this way, various heat-generating electronic devices 241 (in Figure 2A 241 , such as a central processing unit (CPU) 242, a graphics processing unit (GPU) 243, one or more memory chips 244, one or more flash memory devices 245, other heat-generating integrated circuits (not shown), etc. In operation, heat generated by the heat-generating electronic devices 241 is transferred from the PCB 240 and away from the display portion 120 via the heat sink 220 and cooling air forced through the surface of the heat sink 220 by the fan 230. In some embodiments, one or more surfaces of the housing 201 include a high-emissivity coating or surface to further increase the heat transferred from the display portion 120 via radiative heat transfer. FIG. 2A to FIG. 2C In the illustrated embodiment, the PCB 240 is located between the heat generating electronic device 241 and the heat sink 220. In other embodiments, the PCB 240 is located on one side of the heat generating electronic device 241 and the heat sink 220 is located on the opposite side of the heat generating electronic device 241.

[0035] Display side heat sink

[0036] The heat sink 220 is a substantially planar structure that is placed parallel to the display screen 121 and, in some embodiments, is separated from the display screen 121 by an airflow gap 221. In some embodiments, the heat sink 220 is configured as a vapor chamber including a vapor region 222 and a condensate collection region 223. The working fluid disposed within the heat sink 220 may include any technically feasible liquid that evaporates at a temperature reached by the condensate collection region 223 during operation of the laptop computer 100. For example, suitable working fluids include water, methanol, propylene glycol, various combinations thereof, and the like. In some embodiments, the inner surfaces of the vapor region 222 and the condensate collection region 223 have been passivated to prevent corrosion of the heat sink 220 and to enhance wetting of the inner surfaces of the vapor region 222. In such embodiments, the heat sink 220 may further include a wicking structure (not shown) formed of titanium or a titanium-containing alloy disposed within the vapor region 222 and / or the condensate collection region 223. In some embodiments, the wicking structure also undergoes a passivation process.

[0037] In some embodiments, the heat sink 220 is formed of titanium or a titanium-containing alloy. In such embodiments, the heat sink 220 generally has sufficient mechanical strength and rigidity to be used as a structural element of the display portion 120. Therefore, in such embodiments, the heat sink 220 can have a mounted cooling fan 230, PCB 240 and / or other components, rather than on a portion of the housing 201. As a result, in such embodiments, the heat sink 220 can be used to cool multiple heat-generating devices, such as a CPU and a GPU. In contrast, heat sinks in conventional computing devices are typically dedicated to a single high-power device, such as a single processor.

[0038] like Figure 2B and Figure 2C As shown, the vapor region 222 and the condensate collection region 223 are both located within the heat sink 220 and are in fluid communication with each other. In such an embodiment, the condensate collection region 223 is configured to collect the condensed liquid cooled in the vapor region 222 of the heat sink 220 and is located adjacent to or in contact with the PCB 240. Therefore, the heat generated by the heat generating electronic device 241 is directed by the PCB 240 into the condensate collection region 223, heating the condensed liquid in the condensate collection region 223 and evaporating it into vapor, and the vapor flows into the vapor region 222. The vapor condenses on the inner surface of the heat sink 220 in the vapor region 222 and then transfers the heat energy from the PCB 240 to the wall 224 of the vapor region 222. The wall 224 of the vapor region 222 conducts the heat energy to the assembly of heat exchanger fins 225, which are coupled to the outer surface of the vapor region 222, and cools the air from the air chamber 232 through the heat exchanger fins 225 and out of the cooling air outlet 231 to remove the heat energy from the display portion 120. In some embodiments, the heating heat sink 220 also includes a conduit 229 for directing the cooling air from the heat exchanger fins 225 to the cooling air outlet 231. Alternatively, some or all of the heat exchanger fins 225 may extend to the cooling air outlet 231. Such an embodiment is Figure 3 Shown in.

[0039] Figure 3 is a schematic front view of the display unit 320 according to various embodiments. Figure 3 In the illustrated embodiment, the heat exchanger fins 324 extend to the cooling air outlet 231. In addition, in some embodiments, the display portion 320 includes a heat exchanger fin 324 having a heat exchanger fin 324 extending to the cooling air outlet 231. Figure 2A The air chamber 232 has a different structure than the air chamber 332. Figure 3In the illustrated embodiment, one or more heat generating electronic devices 241 may be positioned on the PCB 240 in a manner such that they are partially or fully disposed within the plenum 332. Thus, in such an embodiment, cooling air received by the plenum 332 and flowing toward the heat exchanger fins 324 may flow directly over such heat generating electronic devices 241.

[0040] return Figure 2A-2C , the wall 224 of the vapor region 222 can extend across the entire width of the display portion 120. Thus, the wall 224 has a large surface area and can integrate one or more large surface area assemblies of heat exchanger fins 225 in the display portion 120. Unlike the assembly of heat exchanger fins associated with a conventional heat sink (which is disposed within the base of a laptop computer), the heat exchanger fins 225 are distributed over a wide surface area, such as from the left edge 202 to the right edge 203 of the housing 201. Because the heat exchanger fins 225 are distributed over a large surface area, the heat exchanger fins 225 have less resistance to airflow (and therefore produce less pressure drop) and can accommodate a greater amount of pressure-cooled airflow than the fins associated with a conventional heat sink placed in the base portion of a laptop computer. As a result, airflow passing through or across the heat exchange fins 225 can remove the same amount of thermal energy from the heat sink 220 at a significantly lower rate than airflow passing through or across the heat exchanger fins associated with a conventional heat sink disposed within the base of a laptop computer. Therefore, there is much less fan noise (due to the slower speed at which the fan rotates) and exhaust noise (due to the slower cooling rate present in the laptop computer 100) to remove thermal energy from the heat sink 220 than when a conventional fan and heat sink are used in a laptop computer.

[0041] Due to the size of the heat sink 220, pressure changes within the heat sink 220 may cause undesired deflection of one or more surfaces of the heat sink 220. In some embodiments, the vapor region 222 and / or the condensate collection region 223 are internally reinforced with support columns. Figure 4 One such embodiment is described.

[0042] Figure 4is a schematic diagram of a portion of a heat sink 220 according to various embodiments. As shown, the heat sink 220 includes a vapor region 222 and a condensate collection region 223 (represented by dashed lines). In addition, the heat sink 220 includes a plurality of internal support columns 401 arranged within the vapor region 222 and / or the condensate collection region 223. The internal support columns 401 are configured to reduce deflection of one or more surfaces of the heat sink 220 due to changes in pressure within the heat sink 220 during operation. In some embodiments, the internal support columns 401 are formed of titanium. In some embodiments, the internal support columns 401 are arranged in a repeating triangular pattern 402. In contrast to the configuration of the internal support columns 401 arranged in a repeating rectangular pattern, Figure 4 The repeating triangular pattern shown provides the same stiffness and / or deflection of the heat sink 220 with up to 11% less internal support posts 401. Additionally, because fewer total internal support posts 401 are placed within the heat sink 220, there is less resistance to condensate flow during operation.

[0043] return FIG. 2A to FIG. 2C , the heat exchanger fins 225 are separated from the display screen 121 by an airflow gap 221 through which cooling air is forced during operation of the laptop computer 100. In such an embodiment, the cooling air forced through the airflow gap 221 cools the display screen 121 and thermally isolates the display screen 121 from the PCB 240 and the heat generating electronic devices 241 mounted on the PCB 240. In other embodiments, some or all of the heat exchanger fins 225 are in contact with and / or thermally coupled to the display screen 121 and are cooled by conduction of heat conducted to the heat exchanger fins 225.

[0044] In some embodiments, the airflow impedance created by the heat exchanger fins 225 is further reduced because the airflow openings between the heat exchanger fins 225 are significantly larger than the openings between the heat exchanger fins associated with conventional laptop computer heat sinks. Figure 2B Such an opening may have a larger free area than the openings between the heat exchanger fins of a conventional radiator. Figure 5 One such embodiment is shown in . Figure 5 2 is a schematic diagram of the heat sink 220 and the heat exchanger fins 225 when viewed from the air chamber 232 of the display portion 120 according to various embodiments. As shown, the heat exchanger fins 225 are disposed on the wall 224 of the heat sink 220 and on the side of the wall 224 opposite to the vapor region 222 (indicated by the dotted line).

[0045] Because the heat exchanger fins 225 extend across the wall 224 from the left edge 202 to the right edge 203 of the housing 201, each heat exchanger fin 225 can be separated by a relatively wide spacing 501. In addition, since the heat sink 220 is disposed in the display portion 220, rather than under the keyboard 101 of the base 110, each heat exchanger fin 225 can have a larger opening height 225A. For example, in some embodiments, the airflow channels 502 between the heat exchanger fins 225 each have an opening height 225A extending from the surface of the wall 224 to the airflow gap 221 near the display screen 121. In some embodiments, each airflow channel 502 between the heat exchanger fins 225 has an opening height 225A extending from the surface of the wall 224 to the surface of the display screen 121. In some embodiments, each airflow channel 502 between the heat exchanger fins 225 has an opening height 225A that is greater than half of the thickness 505 of the display portion 120. In other embodiments, the airflow channels 502 between the heat exchanger fins 225 may have varying sizes and opening heights. As a result, each airflow channel 502 between the heat exchanger fins 225 has a free area that is significantly greater than the free area of ​​the airflow channels associated with conventional laptop heat exchangers. Therefore, for a particular airflow, the airflow impedance through the airflow channels 502 is significantly reduced compared to the airflow impedance through the airflow channels associated with conventional laptop heat exchangers, thereby allowing the notebook computer 100 to operate more quietly.

[0046] Low impedance cooling air inlet and outlet

[0047] return Figure 2A-2C , the cooling fan 230 is mounted on the heat sink 220 and is configured to force cooling air to pass through the heat sink 225 and out of the display portion 120. The cooling air enters the display portion 120 through one or more cooling air inlets 233, is forced to cross the heat exchanger fins 225 through the booster chamber 232, and leaves the display portion 120 through the cooling air outlet 231. The cooling air inlet 233 and the cooling air outlet 231 are arranged on the surface of the housing 201 of the display portion 120 or formed in the surface of the housing 201, rather than on the surface of the base 110. Therefore, the cooling air inlet 233 and the cooling air outlet 231 are not affected by the side edge 105 ( Figure 1The available surface area on the laptop computer (as shown) is limited to the free area, in which case the physical interfaces for various input and output devices (such as USB ports, external display ports, Ethernet ports, etc.) can greatly reduce the available space for the air inlet and / or outlet in the cooling base 110. As a result, the cooling air inlet 233 and the cooling air outlet 231 generate lower air flow impedance and related air flow noise compared to the smaller free area of ​​the cooling air inlet and cooling air outlet provided on the surface of the base of the laptop computer. In addition, the cooling air outlet 231 faces upward and / or backward (i.e., away from the display screen 121). Therefore, the cooling air outlet 231 guides the exhausted air, fan noise, and air flow noise toward the user, thereby further reducing the audibility of such noise to the user. In addition, the cooling air outlet 231 guides the exhausted air, fan noise, and air flow noise away from any laptop computer 100 resting thereon. Because such a surface can reflect fan noise and air flow noise back to the user, the construction of the cooling air outlet 231 as described herein prevents fan noise and air flow noise from being reflected toward the user. In addition, the cooling air inlet 233 cannot be blocked by the user's knees or other surfaces on which the laptop computer 100 is placed. On the contrary, whenever the display portion 120 is unfolded for use, the cooling air inlet is not completely blocked.

[0048] exist Figure 2A-2C In the illustrated embodiment, when the display portion is unfolded for use, the cooling air outlet 231 is arranged to be higher than the cooling air inlet 233. That is, the cooling air inlet 233 is located in the surface of the housing 201 so that when the base 110 is located on a horizontal surface and the display portion 120 is opened, away from the base 110, the cooling air inlet 233 is located below the cooling air outlet 231. As a result, the cooling air flow through the heat exchanger fins 225 is assisted by free convection. In addition, in some embodiments, when the laptop computer 100 is operated at certain low operating powers, the free convection of cooling air across the heat exchanger fins 225 is sufficient to cool the heat-generating electronic device 241, and the cooling fan 230 does not have to be operated.

[0049] Display side cooling fan

[0050] Because the cooling fan 230 is disposed in the display portion 120 rather than in the base portion 110, the size of the cooling fan 230 can be increased relative to the overall size of the laptop computer 100. That is, the available space is large compared to the display portion 120. Thus, the size of the cooling fan 230 can be larger relative to the amount of cooling air that is forced to flow through the heat exchanger fins 225. Therefore, in operation, the cooling fan 230 can rotate at a lower speed and generate less fan noise than a smaller fan that would be required to be fixed in the base portion 110 (e.g., around or below the keyboard 101, physical interface ports, and other interfering components placed in the base portion 110).

[0051] In some embodiments, the cooling fan 230 is controlled to operate synchronously, that is, to run at the same speed. For example, in some embodiments, each of the cooling fans 230 runs at a speed within about 100 revolutions per minute of each other. In such an embodiment, the beat frequency phenomenon caused by the constructive and destructive interference of the fan noise of two different frequencies is avoided. As a result, the user's acoustic experience is improved. On the contrary, in a conventional laptop computer including multiple cooling fans (e.g., a fan for cooling the CPU and a fan for cooling the GPU), when adjusting the fan speed of a cooling fan, an audible beat frequency is generated due to the difference between the rotational frequencies of the two fans, which reduces the user's auditory experience. In addition, in an embodiment where the rotational frequencies of the two cooling fans 230 are controlled together and therefore both run in unison, even when only one CPU 242 is used, the heat dissipation capacity of the radiator 220 can be used to remove heat from the PCB 240, or the GPU 243 generates a large amount of heat. Therefore, when only the CPU 242 or the GPU 243 generates a large amount of heat, a lower fan speed can be used, and the fan noise and airflow noise are therefore reduced. In contrast, conventional laptop computers typically include a dedicated cooling fan and associated heat sink for the CPU and a separately controlled cooling fan and associated heat sink for the GPU. Therefore, when only one of the CPU or GPU is generating a significant amount of heat, the cooling fan associated with that heat generating component will necessarily run at or near the maximum rotational frequency, thereby generating fan noise and airflow noise that can be heard by the user.

[0052] Variable size air inlet

[0053] exist Figure 2A-2C In the illustrated embodiment, the cooling air inlet 233 is depicted as a fixed opening in the surface of the housing 201. In other embodiments, the cooling air inlet may be configured as an opening of variable size. Figure 6 One such embodiment is shown in . Figure 6FIG. 6 is a schematic side view of a display portion 620 having a cooling air inlet with a variable size according to various embodiments. As shown in the figure, in addition to the display portion 620 including a variable air inlet 633, the display portion 620 and Figure 2A-2C The display unit 120 is basically similar. Figure 6 In the illustrated embodiment, when the back cover 602 of the housing 601 of the display portion 620 is opened, a variable air inlet 633 is formed. That is, the bottom edge 603 of the back cover 602 is rotated outward from the display portion 620 to form the variable air inlet 633 between the back cover 602 and the rest of the display portion 620. Therefore, a triangular opening 604 is formed near the side edge of the back cover 602, and an edge opening 605 is formed near the bottom edge 603 of the back cover 602. In some embodiments, the display portion 620 is configured with a variable air inlet 633 to replace one or more fixed-size cooling air inlets formed in the housing 601, such as Figure 2B Alternatively, in some embodiments, the display portion 620 is configured with a variable air inlet 633 in addition to one or more cooling air inlets having a fixed size formed in the housing 601 .

[0054] In some embodiments, for example, when the display portion 620 is unfolded for use, the variable air inlet 633 is opened via a mechanical linkage. Alternatively or additionally, in some embodiments, the variable air inlet 633 is opened and closed in response to one or more measured temperatures, such as the temperature of the CPU 242, GPU 243, PCB 240, heat sink 220, and / or cooling air exiting the cooling air outlet 231. In such an embodiment, the size of the variable air inlet 633 can be changed by an electric actuator. Alternatively or additionally, in some embodiments, the variable air inlet 633 is opened and closed in response to the measured power usage of one or more heat-generating electronic devices 241, such as the power usage of the CPU 242, GPU 243, etc. In such an embodiment, the size of the variable air inlet 633 is changed by an electric actuator.

[0055] Figure 77 is a partial side view of a laptop computer 700 according to various embodiments, wherein a display portion 720 includes a housing 701 having a removable panel 702. The laptop computer 700 includes a base 710 having one or more fixed panels 703 and a display portion 720. As shown, a mechanical linkage 750 mechanically couples the base 710 to the removable panel 702, wherein a cooling fan (not shown) is formed when the display portion 720 is opened from the base 710, and actuation of the mechanical linkage 750 causes an inlet 704 for the cooling fan. When the display portion 720 is opened away from the base 710, the inlet 704 is formed by the mechanical linkage 750 positioning the removable panel 702 away from the one or more fixed panels 703 of the base 710.

[0056] exist Figure 7 In the illustrated embodiment, the mechanical linkage 750 includes a rotating element 751 that rotates about an axis 759 when the display portion 720 is opened in a direction away from the base 710. The mechanical linkage 750 also includes a positioning arm 752 that mechanically couples the movable panel 702 to the rotating element 751. The positioning arm 752 is included in the rotating element 751 or is mechanically coupled to the rotating element 751. Therefore, when the rotating element 751 rotates about the axis 759 (e.g., counterclockwise), the positioning arm 752 rotates about the axis 759 in the same direction (e.g., counterclockwise). Figure 7 In the illustrated embodiment, the rotation of the rotating element 751 in the clockwise direction is caused by the display portion 720 opening from the base portion 710. Figure 7 In the illustrated embodiment, the rotation of the rotating element 751 in the counterclockwise direction is caused by the display portion 720 closing toward the base 710. In the illustrated embodiment, this rotation is possible because the shaft 759 is fixed to the base 710 and the rotating element 751 is configured as a driven gear coupled to the drive gear 753. The drive gear 753 is fixed relative to the base 710, so when the display portion 720 is opened away from the base 710 or closed toward the base 710, the drive gear 753 remains stationary relative to the base 710.

[0057] exist Figure 7 In the illustrated embodiment, the positioning arm 752 is mechanically coupled to the movable panel 702 of the display portion 720 via the positioning slot 755. Thus, in such an embodiment, the positioning arm 752 is slidably coupled to the display portion 720. As a result, clockwise rotation of the positioning arm 752 moves the movable panel 702 away from the base 710 and causes the air intake hole 704 to be formed. Conversely, counterclockwise rotation of the positioning arm 752 moves the movable panel 702 toward the base 710, such as into a stowed position, in which the movable panel 702 is moved into contact with one or more fixed panels 705 of the laptop computing device 700.

[0058] exist Figure 7 In the illustrated embodiment, the removable panel 702 comprises a surface of the computing device 700, which is the top surface of the computing device 700 when the display portion 720 is closed against the base 710. In other embodiments, the removable panel 702 comprises one or more other surfaces of the display portion 720, such as a side or edge surface of the display portion 720. Figure 7 In the illustrated embodiment, the removable panel 702 is disposed in the display portion 720 to form an air inlet for one or more cooling fans (not shown) that may also be disposed in the display portion 720. In other embodiments, the removable panel 702 is disposed in the base 710 to form an inlet for one or more cooling fans that are also disposed in the base 710.

[0059] Radiator with radial radiating fins

[0060] exist Figure 2A-2C In the illustrated embodiment, the heat sink fins are configured as an array of parallel fins. In some embodiments, the heat sink includes a radially distributed array of fins that are arranged substantially aligned with or substantially parallel to the airflow direction associated with cooling air flowing from the cooling fan into the heat sink. As a result, the heat sink reduces the pressure drop associated with the cooling air flowing through the heat sink fins. Figure 8 One such embodiment is described.

[0061] Figure 8 8 is a schematic front view of a display portion 800 of a laptop computer according to various embodiments, the display portion 800 including a heat sink 820 having a series of radially divergent fins 824. As shown, an air channel 830 is formed between each pair of adjacent radially divergent fins 824. In addition, each air channel 830 includes an inlet 831 and an outlet 832. Because the radially divergent fins 824 are separated from each other in the air flow direction, the free area of ​​the air inlet 831 for a specific air channel 830 is smaller than the free area of ​​the air outlet 832 for the specific air channel.

[0062] exist Figure 8 In the illustrated embodiment, each radially-spaced fin 824 has a linear configuration, but in other embodiments, one or more of the radially-spaced fins 824 have a curved configuration. Figure 8In the illustrated embodiment, for a pair of adjacent radially spaced fins 824, a first line 825 defined by a first radially spaced fin 824 (e.g., fin 824A) intersects a second line 826 defined by a second fin (e.g., fin 824A). In such an embodiment, the orientation of the first line 825 can be selected to be parallel to an airflow direction 827 associated with cooling air flowing through an inlet 831 associated with the first radially spaced fin.

[0063] Although the above embodiments are described in terms of laptop computers, these embodiments may also be implemented in other types of computing devices, such as desktop computers, electronic tablets, smart phones, etc.

[0064] In summary, a laptop computer is configured to have heat-generating electronic devices, such as a CPU and / or a GPU, which are arranged in a display portion rather than in a base portion. In addition, a heat transfer device for dissipating the heat energy generated by the heat-generating electronic devices, such as a cooling fan and a heat sink with a large surface area and low airflow resistance, is also arranged in the display portion. In addition, the heat sink may include cooling fins configured as an array of radially diverging fins. In addition, the housing of the laptop computer may include one or more movable panels that are positioned away from the housing to form a cooling air inlet when the laptop computer is opened.

[0065] At least one technical advantage of the disclosed design relative to the prior art is that, in the disclosed design, the heat generating integrated circuit is arranged within the display portion of the computing device, which allows for a larger vapor chamber. A larger vapor chamber can achieve greater heat dissipation capacity and greater cooling efficiency, thereby enabling the computing device to operate at a higher operating level. In addition, in the disclosed design, the cooling fan is also disposed within the display portion of the computing device, which allows for a larger cooling fan. Because a larger cooling fan can provide a sufficient level of cooling airflow at a lower speed, the noise of the cooling fan is reduced in the disclosed design without negatively affecting the peak computing performance of the computing device. In addition, in the disclosed design, the air outlet is also arranged within the display portion of the computing device, which directs the cooling airflow away from the user and further reduces the noise of the overall cooling fan.

[0066] Another technical advantage of the disclosed design over the prior art is that, in the disclosed design, the fins of the heat exchanger are more aligned with the direction of the incoming airflow than the fins of a conventional heat exchanger. As a result, in the disclosed design, the pressure drop across the heat exchanger is relatively small. Among other things, the reduced pressure drop enables sufficient levels of cooling airflow to be provided at lower cooling fan speeds, thereby reducing the noise of the cooling fan without negatively affecting the peak computing performance of the computing device.

[0067] Yet another technical advantage of the disclosed design over the prior art is that, in the disclosed design, an air inlet for a cooling fan is formed in a surface of a computing device other than a bottom surface of the computing device. Thus, with the disclosed design, the cooling efficiency of the computing device is not affected by the surface on which the computing device is placed. Additionally, in the disclosed design, the air inlet for the cooling fan formed via the movable panel has a larger free area and a correspondingly lower pressure drop relative to an air inlet disposed on the bottom surface of a conventional laptop computer. In particular, the lower pressure drop enables a sufficient level of cooling airflow to be provided at lower cooling fan speeds, thereby reducing the noise of the cooling fan without negatively affecting the peak computing performance of the computing device.

[0068] These technical advantages represent one or more technical improvements over prior art computing device designs.

[0069] [Claim combinations are added prior to filing.]

[0070] Any and all combinations of any claim elements recited in any claim and / or any elements described in this application, in any manner, are within the intended scope of the invention and protection.

[0071] The description of the various embodiments has been given for purposes of illustration, but is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

[0072] Aspects of the present embodiment may be embodied as a system, method or computer program product. Therefore, aspects of the present disclosure may take the form of a complete hardware embodiment, a complete software embodiment (including firmware, resident software, microcode, etc.) or an embodiment in which software and hardware aspects that are generally referred to as "modules", "systems" or "computers" are combined. In addition, any hardware and / or software technology, process, function, component, engine, module or system described in the present disclosure may be implemented as a circuit or a group of circuits. In addition, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer-readable media having computer-readable program code embodied thereon.

[0073] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the disclosure is determined by the claims that follow.

Claims

1. A portable computing device comprising: a base, the base including a keyboard; as well as A display portion is movably coupled to the base portion and includes: A heat sink having cooling fins; at least one of a central processing unit or a graphics processing unit thermally coupled to the heat sink; and A plurality of cooling fans, wherein each of the plurality of cooling fans is configured to force cooling air to flow along a path from the cooling fan and then through at least a portion of the at least one of a central processing unit or a graphics processing unit included in the display portion and then through the heat sink.

2. The portable computing device of claim 1, wherein: The at least one of a central processing unit or a graphics processing unit is mounted on a printed circuit board coupled to the heat sink. 3 . The portable computing device of claim 1 , wherein the heat sink comprises a vapor chamber thermally coupled to the heat sink. 4 . The portable computing device of claim 3 , wherein at least one of the plurality of cooling fans is mounted on the vapor chamber.

5. The portable computing device of claim 3, wherein the vapor chamber comprises a plurality of built-in pillars arranged in a repeating triangular pattern.

6. The portable computing device of claim 5, wherein each built-in pillar included in at least a subset of the plurality of built-in pillars is adjacent to six other built-in pillars included in the plurality of built-in pillars.

7. The portable computing device of claim 1, wherein at least one of the central processing unit or the graphics processing unit comprises at least two processing units.

8. The portable computing device of claim 7, wherein the heat sink comprises a single vapor chamber, and the at least two processing units are thermally coupled to the single vapor chamber.

9. The portable computing device of claim 1, wherein: The display portion further includes a display screen physically separated from the heat sink by an air gap.

10. The portable computing device of claim 1, wherein: The display portion has a first surface, and the display portion further includes a first air inlet formed in the first surface and fluidly coupled to at least one of the plurality of cooling fans.

11. The portable computing device of claim 10, wherein: The plurality of cooling fans include a first cooling fan and a second cooling fan; the first air inlet being fluidly coupled to the first cooling fan; as well as The display portion further includes a second air inlet formed on the first surface and fluidly coupled to the second cooling fan.

12. The portable computing device of claim 1, wherein: The display portion has a first surface; The display portion further includes a first air outlet fluidly coupled to the plurality of cooling fans; and The display unit further includes a first air inlet formed on the first surface, and the position of the first air inlet is set as follows: When the base rests on a horizontal surface and the display portion is opened away from the base, the first air inlet is disposed below the first air outlet.

13. The portable computing device of claim 1, wherein the display portion includes an air inlet fluidly coupled to a first inlet of at least one of the plurality of cooling fans, and wherein, When the display portion is opened away from the base portion, the size of the air inlet increases.

14. The portable computing device of claim 1, wherein the plurality of cooling fans includes a first cooling fan and a second cooling fan, both of which exhaust cooling air into a plenum before flowing through the cooling fans.

15. The portable computing device of claim 14, wherein the first cooling fan is configured to operate at a rotational speed that is within 100 revolutions per minute of a rotational speed associated with the second cooling fan.

16. The portable computing device of claim 3, wherein the at least one of a central processing unit or a graphics processing unit is disposed in an evaporator portion proximate to the vapor chamber.

17. A display comprising: case; A radiator, the radiator having a heat sink, and the heat sink is arranged inside the housing; at least one of a central processing unit or a graphics processing unit, the at least one of the central processing unit or the graphics processing unit being thermally coupled to the heat sink and disposed within the housing; and A plurality of cooling fans, wherein each of the plurality of cooling fans is configured to force cooling air to flow along a path from the cooling fan and then through at least a portion of at least one of a central processing unit or a graphics processing unit included in the display and then through the heat sink, wherein the plurality of cooling fans are disposed within the housing.

18. The display according to claim 17, wherein: The display is configured to be removably coupled to a base of a computing device including a keyboard.

19. The display according to claim 17, wherein: The heat sink includes a vapor chamber thermally coupled to the heat sink.

20. The display according to claim 19, wherein: At least one of the plurality of cooling fans is mounted on the steam chamber.

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