Conductive film and preparation method thereof

Abstract

The present invention discloses a conductive film and a preparation method. The conductive film includes: a carrier, the carrier is provided with a first surface, the first surface is provided with a first groove and a second groove; a conductive grid, the first groove is filled with a conductive material to form the conductive grid that is interconnected; an electrode lead, the second groove is filled with a conductive material to form the electrode lead; wherein the width of the first groove is smaller than the width of the second groove; the conductive material includes at least two or more conductive materials with different particle sizes, and the average particle size of the conductive material filled in the first groove is smaller than the average particle size of the conductive material filled in the second groove. Compared with the traditional design of dense metal wires and large depth-to-width ratio in the electrode lead area, it is easier to demold, greatly extending the service life of the mold, and the conductive material density is higher and the conductivity is better.

Description

[0001] The present invention is a divisional application of the invention patent No. 201610316606.0 filed by the applicant on May 13, 2016, with the invention name being “A conductive film and preparation method”. Technical Field

[0002] The present invention relates to the technical field of conductive films, and in particular to a conductive film and a preparation method thereof. Background Art

[0003] Transparent conductive film is a conductive film with high conductivity and good transmittance to visible light, and has a wide range of applications. In recent years, it has been successfully used in the fields of liquid crystal displays, touch panels, electromagnetic wave protection, transparent electrodes of solar cells, transparent surface heaters, and flexible light-emitting devices.

[0004] Traditional touch screens generally use tin-doped indium oxide (ITO) conductive layers. When preparing the ITO layer, it is always inevitable to coat, pattern, and make electrode silver leads. And when ITO is patterned, the ITO film needs to be etched. This traditional production process is complicated and lengthy, which makes the conductivity of the conductive layer poor, resulting in a low yield rate. In addition, this production process has high requirements for technology and equipment, and also wastes a lot of ITO materials during etching, and generates a large amount of industrial waste liquid containing heavy metals.

[0005] The development of metal mesh conductive film technology has made up for the above defects. The metal mesh conductive film lead electrode generally adopts a relatively small grid design, and the depth-to-width ratio of the grid line groove is the same as that of the transparent electrode in the visible area. Its production process includes first coating a layer of UV glue or embossing glue on the substrate, then attaching the mold to the substrate, curing, and finally demolding. However, during the demolding process of the mold and the glue material, there will be glue residue on the mold, which affects the use of the mold and even causes the production to be unable to proceed normally. Summary of the invention

[0006] Based on this, it is necessary to provide a conductive film and a preparation method to solve the above-mentioned technical problems.

[0007] A technical solution of the present invention is:

[0008] A conductive film, comprising:

[0009] A carrier, wherein the carrier is provided with a first surface and a second surface arranged opposite to the first surface;

[0010] Conductive area, the first surface of the carrier is provided with first grooves, and the first grooves form interconnected grids; the first grooves are filled with conductive material to form interconnected conductive grids, and the interconnected conductive grids form the conductive area;

[0011] A lead area, wherein a second groove is formed on the first surface of the carrier, and a conductive material is filled in the second groove to form an electrode lead, and the electrode lead forms the lead area; the electrode lead is electrically connected to the conductive grid;

[0012] The first groove depth is m and the first groove width is n, and the ratio of m to n is A; the second groove depth is m and the second groove width is s, and the ratio of m to s is B; wherein B <A。

[0013] In one embodiment, the conductive area includes a plurality of conductive channels formed by a plurality of conductive grids insulated from each other, and each of the conductive channels is electrically connected to the electrode lead respectively.

[0014] In one embodiment, a color matching area is provided between adjacent conductive channels, the color matching area has the first grooves, and the first grooves form a grid; the first grooves are filled with conductive material to form the color matching area.

[0015] In one embodiment, a ratio B of the second groove depth to the second groove width is less than 0.8.

[0016] In one embodiment, a ratio B of the second groove depth to the second groove width is less than or equal to 0.5.

[0017] In one embodiment, the average particle size of the conductive material filled in the first groove is smaller than the average particle size of the conductive material filled in the second groove.

[0018] In one embodiment, the carrier is a substrate and a matrix layer disposed on the substrate, and the conductive area and the lead area are disposed on a side of the matrix layer away from the substrate; or, the carrier is a polymer, and the conductive area and the lead area are disposed on a first surface of the polymer.

[0019] In one embodiment, the second surface of the carrier is also provided with a conductive area and a lead area, and the conductive grid is electrically connected to the electrode lead; or, an insulating layer is provided on the first surface side of the carrier, and a conductive area and a lead area are provided on the side of the insulating layer away from the first surface, and the conductive grid is electrically connected to the electrode lead.

[0020] In one embodiment, the matrix layer and the polymer are thermosetting adhesive or light-curing adhesive.

[0021] In one embodiment, the filling conductive material is selected from one or more of metals, metal oxides or organic conductive materials.

[0022] In one embodiment, the conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500 nm and a conductive material with a particle size less than or equal to 500 nm.

[0023] In one embodiment, the conductive material filled in the second groove at least includes a conductive material with a particle size greater than or equal to 800 nm and a conductive material with a particle size less than or equal to 400 nm.

[0024] The present invention also discloses a method for preparing a conductive film, comprising the following steps:

[0025] S1, opening a first groove and a second groove on the surface of the carrier, wherein the first grooves form a grid interconnected with each other;

[0026] S2, let the first groove depth be m and the first groove width be n, the ratio of m to n be A, let the second groove depth be m and the second groove width be s, the ratio of m to s be B, wherein B <A;

[0027] S3. Filling the first groove and the second groove with conductive material, wherein the first groove is filled with conductive material to form an interconnected conductive grid, and the interconnected conductive grid forms a conductive area; the second groove is filled with conductive material to form an electrode lead, and the electrode lead forms a lead area; the electrode lead is electrically connected to the conductive grid.

[0028] In one embodiment, a plurality of conductive grids are arranged on the conductive area to form a plurality of conductive channels, and the conductive channels are insulated from each other, and one end of each conductive channel is electrically connected to an electrode lead.

[0029] In one embodiment, a color matching area is provided between adjacent conductive channels, the color matching area has the first grooves, and the first grooves form a grid; the first grooves are filled with conductive material to form the color matching area.

[0030] In one embodiment, the conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500 nm and a conductive material with a particle size less than or equal to 500 nm.

[0031] In one embodiment, the method of filling the first groove and the second groove with conductive material is to first fill the conductive material with a particle size greater than 500nm, and then fill the conductive material with a particle size less than 500nm; or, first fill the conductive material with a particle size less than 500nm, and then fill the conductive material with a particle size greater than 500nm.

[0032] Advantages of the present invention:

[0033] (1) In the technical solution provided by the present invention, the first groove is used for the conductive region, and the second groove is used for the electrode lead. The depth of the first groove is m and the width of the first groove is n, and the ratio of m to n is A. The depth of the second groove is m and the width of the second groove is s, and the ratio of m to s is B; wherein, B < A; compared with the design of the traditional electrode lead region where the metal wires are dense and the aspect ratio is relatively large, it is easier to demold, greatly extending the service life of the mold, and the density of the conductive material is greater and the conductivity is better.

[0034] (2) In the technical solution provided by the present invention, the conductive material filled in the second groove includes at least conductive material with a particle size greater than 500 nm and conductive material with a particle size less than or equal to 500 nm. In this way, the electrode lead region contains conductive materials with two or more particle sizes, which greatly enhances the conductivity of the electrode lead. Due to the different aspect ratios, the second groove in the electrode lead region can better accommodate the conductive material with a large particle size. Description of the drawings

[0035] Figure 1 It is a schematic cross-sectional structure diagram of a conductive film according to the present invention.

[0036] Figure 2 It is a schematic plan view structure diagram of a conductive film according to the present invention.

[0037] Figure 3 It is a schematic enlarged structure diagram of a part of a conductive film according to the present invention.

[0038] Figure 4 It is another schematic cross-sectional structure diagram of a conductive film according to the present invention.

[0039] Figure 5 It is another schematic plan view structure diagram of a conductive film according to the present invention.

[0040] Figure 6 It is another schematic enlarged structure diagram of a conductive film according to the present invention.

[0041] Figure 7 It is another schematic cross-sectional structure diagram of a conductive film according to the present invention.

[0042] Figure 8 It is another schematic cross-sectional structure diagram of a conductive film according to the present invention. Detailed implementation manners

[0043] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0044] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0046] A conductive film, comprising: a carrier, the carrier having a first surface and a second surface disposed opposite to the first surface; a conductive region, a first groove being formed on the first surface of the carrier, and the first groove forming a grid that communicates with each other; a conductive material being filled in the first groove to form a conductive grid that communicates with each other, and the conductive grid that communicates with each other forms the conductive region; a lead region, a second groove being formed on the first surface of the carrier, a conductive material being filled in the second groove to form an electrode lead, and the electrode lead forms the lead region; the electrode lead being electrically connected to the conductive grid; the depth of the first groove being m and the width of the first groove being n, the ratio of m to n being A, the depth of the second groove being m and the width of the second groove being s, the ratio of m to s being B; wherein, B < A. The carrier is a substrate and a matrix layer provided on the substrate or the carrier is a polymer, wherein the matrix layer and the polymer are thermosetting adhesives or photocurable adhesives, and the conductive region and the lead region are disposed on the side of the matrix layer away from the substrate or the conductive region and the lead region are disposed on the first surface of the polymer.

[0047] In order to collect signals at different locations, the conductive area includes a plurality of conductive channels formed by a plurality of conductive grids insulated from each other, and each of the conductive channels corresponds to an electrically connected electrode lead; each conductive channel has at least one electrode lead that leads the signal of the conductive channel to an external device, so that the changes in the electrical signal can be well collected; wherein the electrode leads connected to each conductive channel are independent of each other.

[0048] In order to ensure the consistency of the overall optical effect of the conductive film surface, a color matching area is provided between adjacent conductive channels, and the color matching area has a first groove, and the first groove forms a grid; the first groove is filled with a conductive material to form a color matching area or filled with a non-conductive material, and the color matching area and the conductive channel are insulated from each other; the grid parameters of the color matching area and the grid parameters in the conductive channel can be the same or different, and the grid structure can also be different, the grids in the color matching area can be connected or each grid can be disconnected from each other; the insulation method between the color matching area and the conductive channel can be a disconnected type or the grid vertices at the boundary are staggered.

[0049] In order to improve the performance of the electrode lead, the ratio B of the second groove depth to the second groove width is less than or equal to 0.8, further, the ratio B of the second groove depth to the second groove width is less than or equal to 0.5, and further, the ratio B of the second groove depth to the second groove width is less than 0.15, but the ratio B of the second groove depth to the second groove width is greater than 0; since narrow frames are currently mainly used, the width of the electrode lead is as narrow as possible while ensuring the performance of the electrode lead.

[0050] The conductive layer must ensure conductivity and optical effects, and the ratio A of the first groove depth to the first groove width is greater than or equal to 0.8.

[0051] The conductive film can also be a double-layer structure. When used as a touch screen, two layers of conductive film are more often used, so that the position can be better positioned. The second surface of the carrier is also provided with a conductive area and a lead area, and the conductive grid is electrically connected to the electrode lead; or, the first surface side of the carrier is provided with an insulating layer, and the side of the insulating layer away from the first surface is provided with a conductive area and a lead area, and the conductive grid is electrically connected to the electrode lead. The second conductive layer structure can be a convex structure or a groove structure. Of course, the conductive film can also be a single-layer multi-point structure.

[0052] Among them, the conductive materials filled in the first groove and the second groove are selected from one or more of graphene, carbon, metal, metal oxide or organic conductive material. The metal can be gold, silver or copper, etc. The conductive metal oxide can be ITO, etc. The organic conductive material can be PEDOT. Among them, the average particle size of the conductive material filled in the first groove is smaller than the average particle size of the conductive material filled in the second groove. For example, the conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500 nm and a conductive material with a particle size less than or equal to 500 nm; further, the conductive material filled in the second groove at least includes a conductive material with a particle size greater than or equal to 800 nm and a conductive material with a particle size less than or equal to 400 nm; the first groove may contain a conductive material with a large particle size, and the large particle size conductive material is a particle size greater than 500 nm. If the particle size of the filled conductive material is larger, it may not be filled into the first groove due to the influence of the width of the first groove.

[0053] Therefore, from another perspective, the conductive film of the present invention includes a carrier and a lead area provided on the carrier. The carrier has a first surface and a second surface opposite to the first surface, and the first surface of the carrier is provided with a second groove. The second groove is filled with a conductive material to form an electrode lead, and the electrode lead forms the lead area. The conductive material at least includes two or more conductive materials with different particle sizes.

[0054] The present invention also discloses a method for preparing a conductive film, including the following steps:

[0055] S1. A first groove and a second groove are formed on the surface of the carrier, and the first grooves form a grid that communicates with each other; the carrier can directly be a thermosetting or photocuring polymer, and the first groove and the second groove are directly formed using a mold; or the carrier is a substrate with a matrix layer on the surface, and the matrix layer has thermosetting or photocuring properties, and the first groove and the second groove are formed on the side of the matrix layer away from the substrate using a mold; among them, "forming" can be in a stamping manner, a laser direct writing manner, a photolithography manner, etc.;

[0056] S2. The depth of the first groove is m and the width of the first groove is n, and the ratio of m to n is A. The depth of the second groove is m and the width of the second groove is s, and the ratio of m to s is B, where B < A. The ratio of the depth of the second groove to the width of the second groove B is less than or equal to 0.15. Further, the ratio of the depth of the second groove to the width of the second groove B is less than or equal to 0.5. Further still, the ratio of the depth of the second groove to the width of the second groove B is less than 0.8, but the ratio of the depth of the second groove to the width of the second groove B is greater than 0;

[0057] S3. Fill the first groove and the second groove with conductive material, wherein the conductive material filled in the first groove forms an interconnected conductive grid, and the interconnected conductive grid forms a conductive area; the conductive material filled in the second groove forms an electrode lead; the electrode lead forms a lead area, and the electrode lead is electrically connected to the conductive grid. The conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500nm and a conductive material with a particle size less than or equal to 500nm.

[0058] Wherein, a plurality of conductive grids are arranged on the conductive area to form a plurality of conductive channels, and the conductive channels are insulated from each other, and one end of each conductive channel is electrically connected to an electrode lead. Each conductive channel has at least one electrode lead to lead the signal of the conductive channel to an external device, so that the change of the electrical signal can be well collected; wherein, the electrode leads connected to each conductive channel are independent of each other.

[0059] Among them, a color matching area is provided between the adjacent conductive channels, the color matching area has a first groove, and the first groove forms a grid; the first groove is filled with a conductive material to form the color matching area. The grid parameters of the color matching area and the grid parameters in the conductive channel can be the same or different, and the grid structure can also be different. The grids in the color matching area can be connected or each grid is disconnected from each other; the insulation method between the color matching area and the conductive channel can be disconnected or the grid vertices at the boundary are staggered.

[0060] Among them, the method of filling the first groove and the second groove with conductive material is to first fill the conductive material with a particle size greater than 500nm, and then fill the conductive material with a particle size less than 500nm; or, first fill the conductive material with a particle size less than 500nm, and then fill the conductive material with a particle size greater than 500nm.

[0061] The following is a detailed description of the implementation of the present invention with reference to the accompanying drawings. Figure 1 , which is a cross-sectional structure of a conductive film, wherein the conductive film is, from bottom to top, a base PET 11 with a thickness of 100 μm; an adhesion promoting layer 12, wherein the adhesive layer may not be required, and is only used to increase the adhesion; the bearing layer is an acrylic UV glue 13 with a groove structure, the second groove 14 in the lead area has a depth of 3 μm and a width of 20 μm, 10 μm, 6 μm or 3.75 μm, and the first groove 15 in the conductive area has a depth of 3 μm and a width of 2.2 μm; the groove depth-to-width ratio in the lead area is smaller than that in the conductive area; the second groove 14 and the first groove 15 are filled with metallic silver, the average diameter of the metallic silver particles in the second groove 14 is 1 um, and the average diameter of the metallic silver particles in the first groove 15 is 500 nm; the thickness of the metallic silver is less than the groove depth, which is about 2 μm, or the thickness of the metallic silver is equal to the groove depth, which is about 3 μm.

[0062] See also Figure 2 This is a plan view of the carrier layer of this embodiment, on which a conductive area 21 and a lead area 22 are provided. The pattern of the conductive channel 210 can be set to multiple rows and columns as needed, and the electrodes of each pattern need to be connected to the corresponding electrode leads 220 respectively to achieve electrical signal transmission. The conductive channel 210 is composed of a diamond grid, with a grid line width of 2.2μm, a grid line side length of preferably 260μm, and an acute angle of 60°. The electrode lead 220 is composed of a single line with a line width of 20μm. Specifically, Figure 3 As shown in the enlarged view of the lead area, the black line of the conductive channel 210 is formed by filling the first groove 15 with metallic silver, the black line of the electrode lead 220 is formed by filling the second groove 14 with metallic silver, and the blank area is an insulating area, and the blank area is acrylic UV glue 13.

[0063] See also Figure 4 , a schematic cross-sectional view of another conductive film. The conductive film is composed of a base glass 41 (also referred to as a carrier) from bottom to top, with a thickness of 0.5 mm; the carrier layer is an acrylic UV glue 42 with a groove structure, the second groove 43 in the lead area has a depth of 3.5 μm and a width of 10 μm, and the first groove 44 in the conductive area has a depth of 3.5 μm and a width of 2.5 μm; the second groove in the lead area has a smaller depth-to-width ratio than the conductive area. The second groove 43 and the first groove 44 are filled with metallic copper, the average diameter of the metallic silver particles in the second groove 43 is 800 nm or 1 μm, and the average diameter of the metallic copper particles in the first groove 44 is 400 nm or 500 nm; the thickness of the metallic silver is less than, greater than or equal to the groove depth.

[0064] See also Figure 5 It is a plan view of the conductive film of this embodiment. Among them, the carrier layer is provided with a conductive area 51 and a lead area 52. The conductive channel 510 and the electrode lead 520 are both composed of a grid. The pattern of the conductive channel 510 can be set to multiple rows and columns as needed, and the conductive channels of each pattern need to be respectively connected to the corresponding electrode leads 520 to realize electrical signal transmission. The conductive channel 510 is composed of an irregular polygonal random grid, the grid line width is 2.5μm, and the average grid diameter is preferably 150um. The electrode lead 520 is composed of a square grid with a grid line of 10um, and the side length of the square grid is 20um. Specifically, it can be seen from Figure 6 The black lines of the conductive channel 510 are formed by filling the first groove 44 with copper metal, the black lines of the electrode lead 520 are formed by filling the second groove 43 with copper metal, and the blank area is an insulating area, which is an acrylic UV glue 42.

[0065] In the conductive film provided in the above embodiment, the grid of the conductive channel can be a regular shape such as a square, a parallelogram, a regular hexagon, a curved quadrilateral or a polygon in addition to a rhombus or an irregular polygon. A curved quadrilateral refers to a quadrilateral having four curved sides, and two opposite curved sides have the same shape and a curved direction. In addition to a single line or a square, the electrode lead can also be a regular shape such as a parallelogram, a regular hexagon, a curved quadrilateral or a polygon.

[0066] The metal material filled in the grooves of the metal grid conductive layer of the present invention may be gold, silver, copper, aluminum, nickel, zinc or an alloy of any two or more thereof.

[0067] Acrylic UV glue with a groove structure can also be replaced by organic materials such as UV curing materials, thermoplastic materials or thermosetting materials that have the same properties as UV glue or can achieve the same purpose, such as PMMA, PC, PDMS, etc.

[0068] See also Figure 7 , the conductive film of the present invention can also be a double-sided structure. The conductive film is provided with a first bearing layer, a substrate 60 and a second bearing layer from top to bottom. The first bearing layer is an acrylic UV glue 61 with a groove structure. The second groove 65 in the lead area has a depth of 3.5μm and a width of 5μm. The first groove 63 in the conductive area has a depth of 3.5μm and a width of 2.5μm. The second groove in the lead area has a smaller depth-to-width ratio than the conductive area. The second bearing layer is an acrylic UV glue 62 with a groove structure. Similarly, the second groove 66 in the lead area has a depth of 3.5μm and a width of 5μm. The first groove 64 in the conductive area has a depth of 3.5μm and a width of 2.5μm. The second groove in the lead area has a smaller depth-to-width ratio than the conductive area.

[0069] See also Figure 8 , the conductive film of the present invention can also be a single-sided double-layer structure. The conductive film is provided with a first bearing layer, a second bearing layer and a substrate 70 from bottom to top. The first bearing layer is an acrylic UV glue 71 with a groove structure. The second groove 75 in the lead area has a depth of 3.5μm and a width of 5μm. The first groove 73 in the conductive area has a depth of 3.5μm and a width of 2.5μm. The second groove in the lead area has a smaller depth-to-width ratio than the conductive area. The second bearing layer is an acrylic UV glue 72 with a groove structure. Similarly, the second groove 76 in the lead area has a depth of 3.5μm and a width of 5μm. The first groove 74 in the conductive area has a depth of 3.5μm and a width of 2.5μm. The second groove in the lead area has a smaller depth-to-width ratio than the conductive area.

[0070] In summary, for the conductive film disclosed in the present invention, the first groove is used for the conductive region, and the second groove is used for the electrode lead. The depth of the first groove is m, and the width of the first groove is n. The ratio of m to n is A. The depth of the second groove is m, and the width of the second groove is s. The ratio of m to s is B. Among them, B < A. Compared with the traditional design in which the metal wires in the electrode lead region are dense and the aspect ratio is large, it is easier to demold, greatly prolonging the service life of the mold, and the density of the conductive material is greater and the conductivity is better. And the conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500 nm and a conductive material with a particle size less than or equal to 500 nm. In this way, the electrode lead region contains conductive materials with more than two particle sizes, which greatly enhances the conductivity of the electrode lead. Due to the different aspect ratios, the second groove in the electrode lead region can better accommodate the conductive material with a large particle size.

[0071] In addition, the first carrier layer and the second carrier layer described here are only numbered for the convenience of description, and there is no sequence. The first groove and the second groove are grooves with different groove parameters and are distinguishable grooves. The first grooves 15, 44, 63, 64, 73, 74 and the second grooves 14, 43, 65, 66, 75, 76 are only numbered differently in different structures for better description. The first groove is the groove in the conductive channel, and the second groove is the groove of the electrode lead. However, there is no sequence between the first and the second.

[0072] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the above description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from the above description. Those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed above. And, the technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0073] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A conductive film comprising: A carrier, wherein the carrier is provided with a first surface, and the first surface is provided with a first groove and a second groove; A conductive grid, wherein the first grooves are filled with a conductive material to form the conductive grids interconnected with each other, and the conductive grids interconnected with each other form a conductive area; An electrode lead, wherein the second groove is filled with a conductive material to form the electrode lead, and the electrode lead forms a lead area; The width of the first groove is smaller than the width of the second groove; the conductive material includes at least two conductive materials with different particle sizes, and the average particle size of the conductive material filled in the first groove is smaller than the average particle size of the conductive material filled in the second groove; the ratio B of the second groove depth to the second groove width is less than 0.8, but the ratio B of the second groove depth to the second groove width is greater than 0; The second groove is in a grid shape, the conductive grid and the electrode lead are both composed of grids, and the average grid diameter of the conductive grid is greater than the average grid diameter of the electrode lead; The conductive area includes a plurality of conductive channels formed by a plurality of conductive grids insulated from each other, each of the conductive channels corresponds to an electrically connected electrode lead; a color matching area is provided between adjacent conductive channels, the color matching area has a first groove, and the first groove forms a grid; the first groove is filled with a conductive material to form a color matching area or filled with a non-conductive material, and the color matching area and the conductive channel are insulated from each other; The carrier is provided with a second surface arranged opposite to the first surface, the second surface of the carrier is also provided with a conductive area and a lead area, and the conductive area and the lead area of ​​the second surface are electrically connected; or, the first surface side of the carrier is provided with an insulating layer, the side of the insulating layer away from the first surface is provided with a conductive area and a lead area, and the conductive area and the lead area of ​​the side of the insulating layer away from the first surface are electrically connected; The conductive material filled in the second groove at least includes a conductive material with a particle size greater than 500 nm and a conductive material with a particle size less than or equal to 500 nm; The first groove depth is m and the first groove width is n, and the ratio of m to n is A; the second groove depth is m and the second groove width is s, and the ratio of m to s is B; wherein B <A。 2. A conductive film according to claim 1, characterized in that: The conductive material filled in the second groove at least includes a conductive material with a particle size greater than or equal to 800 nm and a conductive material with a particle size less than or equal to 400 nm.

3. A conductive film according to claim 2, characterized in that: The conductive material filled in the first groove does not include conductive material with a particle size greater than or equal to 800 nm.

4. A conductive film according to claim 1, characterized in that: The electrode leads are composed of square grids.

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