Substrate support member and application method thereof

Abstract

A method for applying raised members to a semiconductor substrate chuck, each member being used to space the substrate from the chuck when in use, the method comprising the following steps: i) providing an assembly having a carrier layer, a member adhered to the carrier layer, and a peeling layer adhered to the carrier layer so that the member is enclosed between the carrier layer and the peeling layer; ii) removing the peeling layer; and iii) adhering the member to the chuck.

Description

Technical Field

[0001] The present invention relates to an assembly for applying raised features to a semiconductor substrate chuck, a method of applying a pattern of raised substrate support features to a chuck surface, and a method of making such an assembly. Background Art

[0002] The present invention belongs to the field of semiconductor processing, wherein a substrate is supported by a chuck. During material processing, the chuck can clamp the supported substrate using electrostatic clamping (ESC) or by vacuum clamping. The supported substrate can be, for example, a semiconductor wafer, a redistribution wafer, or a panel containing a mold embedded in a polymer material, or other substrate containing electronic circuits. The material processing applications of the present invention can include vacuum or sub-atmospheric pressure processes, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implantation, and material removal by reactive ion etching or physical sputter etching. The material processing applications can also include atmospheric treatments, such as thermal annealing or other heat treatments, chemical mechanical polishing, etc.

[0003] During processing, it is often necessary to cool or heat the semiconductor substrate, which is often accomplished by supplying gas to the back side of the substrate. The uniformity of substrate heating or cooling is an important parameter that affects process uniformity. For chucks with backside gas supply, the thermal uniformity of the substrate depends on the uniformity of the gas pressure between the chuck and the substrate.

[0004] Figure 1A and Figure 1B An example of a prior art chuck 100 is shown having a chuck face 111 on which a substrate 118 may be mounted. The chuck has a cooling body 110 including a cooling fluid manifold 116 having a fluid inlet 115 and a fluid outlet 117. Gas is supplied to a gas manifold 114 through a gas inlet 113 and distributed to holes 112 to supply gas to the area between the chuck face 111 and the substrate 118. By using radial and azimuthal channels 119 machined into the chuck face 111, uniform gas distribution can be achieved.

[0005] Figure 2A and Figure 2B1 is another example of a prior art chuck 101, where reference numerals for like components are appropriately retained. Gas is supplied to a gas manifold 114 through a gas inlet 113 and distributed to one or more holes 112. The pattern of raised embossing features 120 located on the chuck face 111 protrudes toward the substrate 118, thereby allowing the gas to be evenly distributed in the area on the back side of the substrate 118, i.e., the side of the substrate closest to the chuck face 111. The chuck face 111 may be machined (e.g., by milling or by mask blasting) to provide the raised embossing features 120. Alternatively, the features 120 may be deposited on the chuck face 111 by physical vapor deposition (PVD) or chemical vapor deposition (CVD). Alternatively, a thin covering layer of a ceramic or metal material containing the raised embossing features may be adhesively bonded to the chuck face 111. The chuck face 111 may clamp the substrate 118 thereon using electrostatic or vacuum clamping. In this prior art chuck, the embossing is permanently integrated into the chuck face 111 .

[0006] Semiconductor chuck surfaces require regular maintenance. Metal, polymer, or other process-related contaminants may need to be removed from the chuck surface. The chuck embossing member 120 may be damaged during cleaning. These members may also be worn during processing due to repeated contact with the wafer or other substrate. Therefore, it is necessary to regularly replace the raised embossing members on the semiconductor chuck.

[0007] Due to cost and convenience considerations, semiconductor chuck maintenance is usually performed at or near the wafer manufacturing facility. Moreover, the embossing member needs to be replaced on-site using low-cost materials, tooling and equipment. Summary of the invention

[0008] It is an object of the present invention to provide an assembly that allows easy replacement of a chuck embossing member without expensive factory refurbishment. Another object of the present invention is to provide a method of applying the assembly to a chuck surface to deposit and bond a pattern of a support member to the surface.

[0009] These objects are achieved according to the invention by forming the component and adhering it to a release layer, ie a layer that provides protection and reduces contamination during application but is removable by peeling, which can then be removed to retain the component on the chuck.

[0010] According to a first aspect of the present invention, there is provided an assembly for applying raised members to a semiconductor substrate chuck, each member being used, in use, to space a substrate from the chuck, the assembly comprising:

[0011] a carrier layer having a first main side and a second main side;

[0012] at least one component adhered to the first major side of the carrier layer; and

[0013] a release layer adhered to the first main side of the carrier layer such that the at least one component is enclosed between the carrier layer and the release layer,

[0014] Herein, the member can be applied to the chuck by removing the release layer and then adhering the member to the chuck.

[0015] According to a second aspect of the present invention, there is provided a method of applying raised members to a semiconductor substrate chuck, each member being used to space a substrate from the chuck in use, the method comprising the steps of:

[0016] i) providing the component according to the first aspect;

[0017] ii) removing the release layer; and

[0018] iii) adhering the member to the chuck.

[0019] According to a third aspect of the present invention, there is provided a method for manufacturing the assembly according to the first aspect, comprising the following steps:

[0020] combining the release layer, the adhesive layer, and the polymer embossing layer together to form a multi-layer structure;

[0021] removing a portion of the embossed layer and the adhesive layer to produce at least one member bonded to the release layer; and

[0022] The carrier layer is adhered to the release layer to surround the at least one member therebetween.

[0023] Further particular aspects and features of the invention are set out in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The invention will now be described with reference to the accompanying drawings (not to scale), in which:

[0025] Figure 1A and Figure 1B Schematic plan and cross-sectional views, respectively, of a prior art chuck showing backside gas distribution through channels.

[0026] Figure 2A and Figure 2B Schematic plan and cross-sectional views, respectively, of a prior art chuck showing backside gas distribution through an integrated embossing member.

[0027] FIG. 3A to FIG. 3D Schematic cross-sectional views of an assembly for depositing a support member on a chuck are shown during initial and intermediate manufacturing steps in accordance with an embodiment of the present invention.

[0028] Figure 4A and Figure 4B A partial schematic cross-sectional view and a plan view, respectively, of an assembly for depositing a support member on a chuck in an intermediate manufacturing step are shown.

[0029] Figure 5A and Figure 5B Schematic plan and cross-sectional views, respectively, of the assembly are shown with the component deposited on a chuck after fabrication.

[0030] Figure 6 A schematic cross-sectional view of a chuck, an applicator assembly for depositing a support member on the chuck, and a manufacturing tool are shown.

[0031] Figure 7 A schematic cross-sectional view of a chuck having a deposition member for supporting a substrate is shown.

[0032] List of reference numerals:

[0033] 100, 101, 230-Chuck

[0034] 110-cooling body

[0035] 111-Chuck surface

[0036] 112-hole

[0037] 113-Gas inlet

[0038] 114-Gas manifold

[0039] 115-Fluid inlet

[0040] 116-Cooling fluid manifold

[0041] 117-Fluid outlet

[0042] 118-Substrate

[0043] 119-Channel

[0044] 120-Embossed component

[0045] 200-Components

[0046] 210-Peeling off the supporting polymer layer

[0047] 211-Adhesive layer

[0048] 212-Embossed layer

[0049] 213-Supporting member

[0050] 214-Adhesive backing

[0051] 215-Carrier layer

[0052] 216-Positioning hole

[0053] 217-convex edge

[0054] 218-Location pin

[0055] 219-Heating tooling

[0056] 220-convex ring

[0057] 231-Chuck surface. DETAILED DESCRIPTION

[0058] Figure 3A The initial structure for depositing the support member on the chuck in the initial manufacturing step is schematically shown in cross section. In this manufacturing step, three bonding layers are shown, namely the embossed layer 212, which is bonded to the smooth surface release support polymer layer 210 (hereinafter referred to as "release layer 210") through the adhesive layer 211 (in this embodiment, a pressure sensitive adhesive layer).

[0059] The embossed layer 212 may be formed of a polymer material such as polyetheretherketone (PEEK) or polyimide, and its thickness may be in the range of 5-100 μm, preferably between 10-30 μm. The peeling layer 210 may include fabric, nylon or other synthetic polymer materials. The thickness of the peeling layer 210 may be in the range of 0.1-1.0 mm. The adhesive layer 211 may be formed of an adhesive pad material, which may be made of a variety of polymers, including, for example, acrylates, polyurethanes, and silicones, and its bond strength should be greater than 10 lb / inch (1750 N / m), and should be above 150 ° Flow at a temperature of C.

[0060] Figure 3B The assembly in the second manufacturing step is schematically shown in an enlarged cross-sectional view, which is performed after laser cutting the embossed layer 212 and the adhesive layer 211 to remove portions thereof, leaving a plurality of small support members 213. These support members 213 can be, for example, rectangular, circular, or other shapes when viewed from above (i.e., toward the release layer 210). The width and length (parallel to the dimension of the release layer 210) or diameter of the support members 213 are between 0.25-3 mm.

[0061] Figure 3C and Figure 3DMore details of the assembly in the second manufacturing step are schematically shown in a plan view and an enlarged cross-sectional view, respectively. The laser cutting of the embossed layer 212 and the adhesive layer 211 is controlled to form a member in the form of a flange 217 around the periphery of the release layer 210. When applied to the chuck, the flange 217 is defined as a continuous boundary around all other members such as the support member 213. In addition, the laser cutting is controlled to form other members in the form of multiple raised rings 220, and when applied to the chuck, each raised ring 220 is defined as a closed shape that does not surround other members. The flange 217 and the raised ring 220 both protrude outward from the release layer 210. The width of the flange 217 and the raised ring 220 can be in the range of 0.5-5.0 mm, and can preferably be less than 3 mm. For a circular substrate, the outer diameter of the flange 217 should match the diameter of the substrate 118. For substrates of other shapes, the outer edge of the flange 217 should coincide with the edge of the substrate 118. The protruding ring 220 is used to isolate the hole on the chuck (e.g., 112, see Figure 1A-1B and Figure 2A-2B ) to prevent gas leakage.

[0062] Figure 4A and Figure 4B The components for depositing the support member 213 on the chuck in the third manufacturing step are schematically shown in an enlarged cross-sectional view and an enlarged plan view, respectively. The carrier layer 215 having the adhesive backing 214 directly adhered to the lower surface of the carrier layer 215 is aligned and placed on Figure 3A-3D The peeling layer 210 and the carrier layer 215 are pressed together with sufficient pressure to firmly mount and adhere the support member 213 to the carrier layer 215. The carrier layer 215 is made of a polymer, such as fabric, nylon or other synthetic materials. The thickness of the carrier layer 215 can be between 0.1-1.0 mm.

[0063] Figure 5A and Figure 5B The applicator assembly 200 is schematically shown in plan view and cross-sectional view, respectively, and in a final manufacturing step, a plurality of locating holes 216 are laser cut in the carrier layer 215, after which the applicator assembly 200 is used to deposit the component onto a chuck when its manufacturing is completed. For example, the release layer 210 has been manually removed by inserting a small tool between the release layer and the carrier layer. The smooth surface of the release layer 210 facilitates its removal. In addition, the adhesive backing 214 and the adhesive layer 211 are selected so that at room temperature, the adhesion between the carrier layer 215 and the embossed layer 212 exceeds the adhesion between the release layer 210 and the embossed layer 212. It should be noted that Figure 4A different, Figure 5B The carrier layer 215 in FIG. 2 is smooth. This difference is simply due to the different scales between the two figures.

[0064] Figure 6 A chuck 230, an assembly 200 for depositing a raised member on the chuck 230, and a locating pin 218 are schematically shown in cross-section, which has been inserted into and engaged with the locating hole 216 of the assembly 200 to properly position the assembly relative to the chuck 230. The chuck 230 has previously been cleared of all raised members, for example, raised members previously attached using a similar assembly. The assembly 200 is pressed onto the chuck 230 using a heated fixture 219 to activate the adhesive layer 211, thereby bonding the raised support member 213, the raised ring 220, and the flange 217 to the chuck 230. It will be appreciated by those skilled in the art that other methods of applying pressure and heat may also be used to adhesively bond the assembly 200 to the chuck 230. The chuck is then cooled, and after cooling, the carrier layer 215 may be removed by mechanical stripping, while retaining the raised member 213 bonded to the chuck 230.

[0065] Figure 7 A chuck 230 is schematically shown in cross-section after being processed with the assembly 200 and ready for use in a semiconductor process. Components 113, 115, 116, 117 may be referred to above. Figure 1B and Figure 2B The raised support member 213, the raised ring 220 and the flange 217 are all in contact with the substrate 118. The gas supplied by the hole 112 is evenly distributed between the chuck face 231 and the back side of the substrate 118. The back side gas pressure is maintained by the seal with the substrate 118 provided by the flange 217.

[0066] The above-described embodiments are merely exemplary, and other possibilities and alternatives within the scope of the invention will be apparent to those skilled in the art.

Claims

1. An assembly for applying raised members to a semiconductor substrate chuck, each member being used to space the substrate from the chuck when in use, the assembly include: a carrier layer having a first main side and a second main side; at least one component adhered to the first major side of the carrier layer; as well as a release layer adhered to the first main side of the carrier layer such that the at least one component is enclosed between the carrier layer and the release layer, Herein, the member can be applied to the chuck by removing the release layer and then adhering the member to the chuck.

2. The assembly of claim 1, comprising an adhesive layer between the component and the release layer for subsequently adhering the component to the chuck.

3. The assembly according to claim 2, in, The adhesive layer includes a polymer.

4. The assembly according to claim 3, in, The adhesive layer may be one of acrylate, polyurethane and silicone.

5. The assembly of claim 1 comprising an adhesive backing adhered directly to the first major side of the carrier layer.

6. The assembly of claim 1 comprising a plurality of components and wherein at least one component comprises an edge that, when applied to said chuck, defines a continuous boundary around the remaining plurality of said components.

7. The assembly of claim 1 comprising a plurality of components and wherein at least one component comprises a ring, the ring being defined as a closed shape that does not surround other components when applied to the chuck.

8. An assembly according to claim 7, comprising an aperture in the carrier layer adjacent the ring to align the assembly with the chuck in use.

9. An assembly according to claim 8, including a locating pin extending through the aperture to engage the chuck in use.

10. The assembly according to claim 1, in, The release layer includes one of a fabric or a synthetic polymer material.

11. The assembly according to claim 1, in, The at least one member comprises a polymer material.

12. The assembly according to claim 11, in, The at least one member may be polyetheretherketone or polyimide.

13. A method of applying raised members to a semiconductor substrate chuck, each member being used to space a substrate from the chuck in use, the method The following steps are involved: i) providing an assembly according to claim 1; ii) removing the peeling layer; as well as iii) adhering the member to the chuck.

14. The method according to claim 13, in, Step iii) comprises aligning the assembly with the chuck prior to adhering the component to the chuck.

15. The method according to claim 13, in, At least two alignment pins pass through the component and are inserted into the chuck to align the component with the chuck.

16. The method according to claim 13, in, In step iii), adhering the component to the chuck includes applying heat and pressure to the chuck and the assembly.

17. The method according to claim 13, further comprising: The following steps are involved: (iv) cooling the chuck after step iii).

18. The method of claim 13, further comprising the step of finally removing the carrier layer from the assembly.

19. A method of manufacturing an assembly according to claim 1, The following steps are involved: bonding the release layer, the adhesive layer, and the polymer embossing layer together to form a multi-layer structure; removing a portion of the embossed layer and the adhesive layer to produce at least one member bonded to the release layer; A carrier layer is adhered to the release layer to surround the at least one member therebetween.

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