Optoelectronic semiconductor display screen

Abstract

The present invention relates to the field of optoelectronic semiconductor technology, and in particular to an optoelectronic semiconductor display screen. It includes a light-transmitting circuit substrate, a plurality of light-emitting bodies and a guide back plate, wherein the plurality of light-emitting bodies are arranged on the front of the light-transmitting circuit substrate, and the guide back plate is arranged on the back of the light-transmitting circuit substrate; the plurality of light-emitting bodies are distributed in a matrix and include a plurality of light-emitting body rows arranged at intervals; the front of the guide back plate faces the light-transmitting circuit substrate and is formed with a plurality of grooves arranged at intervals, and the grooves and the back of the light-transmitting circuit substrate form an airflow channel, and the two ends of the grooves are respectively provided with a first opening and a second opening connected to the external air, so that the external air can flow in the grooves; the area where the light-emitting body row is directly projected on the back of the light-transmitting circuit substrate falls into the area where the corresponding groove is directly projected on the back of the light-transmitting circuit substrate. The photoconductor display screen has a good heat dissipation effect, and solves a series of quality problems such as overheating damage and shortened life caused by excessively high operating temperature of the optoelectronic semiconductor display screen.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic semiconductors, and in particular to an optoelectronic semiconductor display screen. Background Art

[0002] Light Emitting Diode (LED) is a photoelectric semiconductor component, which is mostly used as an indicator light, a display light emitting diode board, etc. With the development of light emitting diode boards, that is, photoelectric semiconductor display screens, it has been widely used in people's daily lives.

[0003] However, during operation, the optoelectronic semiconductor display screen converts part of its energy into heat, which causes the temperature of the optoelectronic semiconductor display screen to rise, which will directly affect the display screen's performance, such as luminous efficiency, reliability, and service life. However, the existing optoelectronic semiconductor display screen has poor heat dissipation effect, which causes the temperature of the optoelectronic semiconductor display screen to be too high during use, resulting in a series of quality problems such as overheating damage and shortened service life of the optoelectronic semiconductor display screen. Therefore, how to make the optoelectronic semiconductor display screen dissipate heat efficiently is a technical problem that urgently needs to be solved in the application process of optoelectronic semiconductor display screens in the current field.

[0004] The Chinese utility model patent with application number CN202020643018.4 and authorization announcement date of November 3, 2020 discloses an LED display unit with splicable LED display screens, which includes an LED display unit body, and the two sides of the back of the LED display unit body are slidably connected with card blocks, two card blocks are provided, and the sides where the two card blocks are close to each other are respectively provided with push rods, and two push rods are provided, and the two push rods are respectively inserted into the cavity at one end of the sleeve rod, and a spring is connected between the push rod and the sleeve rod, and the sleeve rod is provided with two sleeve rods, and the two ends of the push-pull rod are respectively inserted into the cavity at one end of the two sleeve rods, and the push-pull rod is threadedly connected to the sleeve rod. The main body of the LED display unit can be conveniently spliced ​​and fixed on the back frame, and the spacing between the card blocks is adjustable, and can be fixed on the back frame with different size spacings, making the installation more flexible and convenient. This utility model solves the problem of the convenience of installing the LED display unit on the back panel, but does not solve the problem of the optoelectronic semiconductor display screen having too high a temperature during use, which leads to a series of quality problems such as overheating damage and shortened life of the optoelectronic semiconductor display screen. Summary of the invention

[0005] The present invention aims to solve the problem that the existing optoelectronic semiconductor display screen has poor heat dissipation effect, which leads to the quality damage of the optoelectronic semiconductor display screen mentioned in the background art.

[0006] The present invention provides a photoelectric semiconductor display screen, which includes a light-transmitting circuit substrate, a plurality of light-emitting bodies and a guide back plate, wherein the plurality of light-emitting bodies are arranged on the front side of the light-transmitting circuit substrate, and the guide back plate is arranged on the back side of the light-transmitting circuit substrate; the plurality of light-emitting bodies are distributed in a matrix and include a plurality of light-emitting body rows arranged at intervals; the guide back plate faces the light-transmitting circuit substrate on the front side and is formed with a plurality of grooves arranged at intervals, wherein the grooves and the back side of the light-transmitting circuit substrate form an air flow channel, and the two ends of the grooves are respectively provided with a first opening and a second opening connected to the external air, so that the external air can flow in the grooves; the area of ​​the light-emitting body row projected on the back side of the light-transmitting circuit substrate falls into the corresponding area of ​​the groove projected on the back side of the light-transmitting circuit substrate.

[0007] Further, the groove is a long strip structure, and the groove includes a first sub-groove and a second sub-groove; the first sub-groove has the first opening and the third opening connected to the external air at both ends, so that the external air can flow in the first sub-groove through the third opening, the interior of the first sub-groove and the air flow channel formed by the first opening; the second sub-groove has the fourth opening and the second opening connected to the external air at both ends, so that the external air can flow in the second sub-groove through the second opening, the interior of the second sub-groove and the air flow channel formed by the fourth opening.

[0008] Further, a first bending section is provided at an end portion of the first sub-groove adjacent to the second sub-groove, a second bending section is provided at an end portion of the second sub-groove adjacent to the first sub-groove, the third opening is located at an end adjacent to the first bending section and the second bending section and passes through to the back side of the guide back plate, the fourth opening is located at an end adjacent to the second bending section and the first bending section and passes through to the back side of the guide back plate, and the third opening and the fourth opening are staggered in the length direction of the groove.

[0009] Furthermore, a third bending section is provided at the end of the first sub-groove away from the second sub-groove, and the first opening is located at one end of the third bending section away from the first bending section and penetrates to the back side of the guide back plate; a fourth bending section is provided at the end of the second sub-groove away from the first sub-groove, and the second opening is located at one end of the fourth bending section away from the second bending section and penetrates to the back side of the guide back plate; the first opening and the second opening are staggered in the length direction of the groove.

[0010] Furthermore, the groove depth of the groove is greater than the wavelength of visible light.

[0011] Furthermore, a plurality of metal pads are provided on the back of the light-transmitting circuit substrate, the number of the metal pads is adapted to the number of the light-emitting bodies, and the area where the metal pads are projected onto the back of the light-transmitting circuit substrate falls within the area where the corresponding light-emitting body is projected onto the back of the light-transmitting circuit substrate.

[0012] Furthermore, the area of ​​the metal pad projected onto the back side of the light-transmitting circuit substrate is equal to the area of ​​the corresponding light-emitting body projected onto the back side of the light-transmitting circuit substrate.

[0013] Furthermore, it also includes a connecting component for combining the light-transmitting circuit substrate and the guide back plate, and the connecting component is only located at the periphery of the light-transmitting circuit substrate and the periphery of the guide back plate.

[0014] Furthermore, the connecting member comprises a plurality of screws, each of the plurality of screws penetrates into the periphery of the guide back plate, and the periphery of the light-transmitting circuit substrate is inserted between the nuts of the plurality of screws and the front surface of the guide back plate.

[0015] Furthermore, it also includes an exhaust device; with the extension direction of the light-emitting body row as the up and down direction, the exhaust device is arranged above the guide back plate, and the air in some of the grooves is sucked through the exhaust device.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The photoconductor display screen has a good heat dissipation effect, and solves a series of quality problems such as overheating damage, shortened life, etc. caused by excessively high temperature of the photoelectric semiconductor display screen during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 is a schematic diagram of the three-dimensional structure of the optoelectronic semiconductor display screen of Example 1;

[0020] Figure 2 for Figure 1 Schematic diagram of partial structural decomposition;

[0021] Figure 3 for Figure 1 A partial enlarged view of point D;

[0022] Figure 4is a schematic diagram of the three-dimensional structure of the optoelectronic semiconductor display screen of Example 2;

[0023] Figure 5 for Figure 4 Schematic diagram of partial structural decomposition;

[0024] Figure 6 Schematic diagram of the three-dimensional structure of the guide back plate in Example 2;

[0025] Figure 7 for Figure 5 A top view of

[0026] Figure 8 for Figure 5 Bottom view of

[0027] Fig. 9 for Figure 7 A local enlarged view of point A;

[0028] Fig.10 for Figure 7 A partial enlarged view of point B;

[0029] Fig.11 for Figure 7 A partial enlarged view of point C.

[0030] Reference numerals:

[0031] 100 guide back plate 200 light-transmitting circuit substrate 300 luminous body

[0032] 110 groove 111 first opening 112 second opening

[0033] 113 third opening 114 fourth opening 115 first bending section

[0034] 116 second bending section 117 third bending section 118 fourth bending section

[0035] 210 metal pad 110a first segment groove 110b second segment groove

[0036] 400 connecting member 310 light emitting body row DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0039] The present invention provides Figure 1-3 The optoelectronic semiconductor display screen shown in Example 1 includes a light-transmitting circuit substrate 200, a plurality of light-emitting bodies 300 and a guide back plate 100. The plurality of light-emitting bodies 300 are arranged on the front side of the light-transmitting circuit substrate 200, and the guide back plate 100 is arranged on the back side of the light-transmitting circuit substrate 200. The plurality of light-emitting bodies 300 are distributed in a matrix and include a plurality of light-emitting body rows 310 arranged at intervals. The guide back plate 100 faces the light-transmitting circuit substrate 200 on the front side and is formed with a plurality of grooves 110 arranged at intervals. The three inner walls of the groove 110, namely the bottom surface and the two side walls, are surrounded with the back side of the light-transmitting circuit substrate 200 to form an air flow channel. The first opening 111 and the second opening 112 communicating with the external air are respectively arranged at both ends of the groove 110 to allow the external air to circulate in the groove 110. The area where the light-emitting body row 310 is directly projected on the back side of the light-transmitting circuit substrate 200 falls into the area where the corresponding groove 110 is directly projected on the back side of the light-transmitting circuit substrate 200.

[0040] A conductor circuit and a plurality of welding pads are provided on the front of the light-transmitting circuit substrate 200, and the plurality of welding pads are connected to the conductor circuit. A plurality of light-emitting bodies 300 are fixedly arranged on the light-transmitting circuit substrate 200 in a matrix distribution and are respectively connected to the plurality of welding pads. The plurality of light-emitting bodies 300 are electrically connected to the conductor circuit through the plurality of welding pads. The external control system is electrically connected to the conductive circuit to control the plurality of light-emitting bodies 300 to emit light, so that the optoelectronic semiconductor display screen emits light and displays patterns. Among them, the light-emitting body row 310 is composed of a plurality of light-emitting bodies 300; the light-emitting body 300 is, for example, an LED chip or an LED chip package; the material of the light-transmitting circuit substrate 200 can be, but is not limited to, one of transparent materials such as glass, and the conductive circuit can be provided on the front of the light-transmitting circuit substrate 200 by printing or other methods.

[0041] In addition to the aforementioned components and implementations, the optoelectronic semiconductor display screen has, in the use state, an extension direction of the length of the groove 110 and an extension direction of the arrangement of the plurality of light emitters 300 in the light emitter row 310 that are toward the direction of gravity, wherein the length and width of the groove 110 are set according to the length and width of the light emitter row 310 so that the area where the light emitter row 310 is directly projected onto the back of the light-transmitting circuit substrate 200 falls within the corresponding area where the groove 110 is directly projected onto the back of the light-transmitting circuit substrate 200; in this embodiment 1, the groove 110 is a long strip structure, and those skilled in the art can set the length of the groove 110 according to the length of the light emitter row 310, including but not limited to the above-mentioned long strip structure.

[0042] When the light emitting body 300 in the optoelectronic semiconductor display screen emits light, the heat generated by the light emitting body 300 is transmitted from the front side of the light-transmitting circuit substrate 200 to the back side of the light-transmitting circuit substrate 200, heating the air in the air flow channel formed by the groove 110 and the back side of the light-transmitting circuit substrate 200, so that the air temperature rises. According to the principle of hot air rising, the hot air rises in the groove 110 arranged in the direction of gravity, and flows to the outside through the first opening 111, thereby forming an air flow in the up and down directions in the groove 110, that is, the external air continuously flows in from the second opening 112, flows through the inside of the groove 110, and flows out from the first opening 111, continuously taking away the heat transmitted to the back side of the light-transmitting circuit substrate 200, thereby taking away the heat generated by the light emitting body 300, and achieving the effect of efficient heat dissipation.

[0043] Among them, "several" and "plurality" in this article mean greater than 1, and the "up" direction and "down" direction in this article refer to the direction of extension of the length of the groove 110 and the direction of extension of the plurality of light-emitting bodies 300 arranged in the light-emitting body row 310 as the up and down direction.

[0044] Preferably, there is also provided Figure 4-11 The optoelectronic semiconductor display screen shown in Example 2 includes a light-transmitting circuit substrate 200, a plurality of light-emitting bodies 300 and a guide back plate 100, wherein the relative positions of the three, the basic structural design of the plurality of light-emitting bodies 300 and the light-transmitting circuit substrate 200, and the material of the light-transmitting circuit substrate 200 are similar to those of Example 1. On this basis, Figure 4-11As shown, the groove 110 in the optoelectronic semiconductor display screen is set to a long strip structure, and the groove 110 includes a first section sub-groove 110a and a second section sub-groove 110b; the first section sub-groove 110a is provided with a first opening 111 and a third opening 113 at both ends thereof, which are connected to the external air, so that the external air flows through the air flow channel formed by the third opening 113, the interior of the first section sub-groove 110a and the first opening 111 in the first section sub-groove 110a; the second section sub-groove 110b is provided with a fourth opening 114 and a second opening 112 at both ends thereof, which are connected to the external air, so that the external air flows through the air flow channel formed by the second opening 112, the interior of the second section sub-groove 110b and the fourth opening 114 in the second section sub-groove 110b.

[0045] Since the heat in the light-transmitting circuit substrate 200 is evenly distributed, when a single airflow channel on the back of the light-transmitting circuit substrate 200 is too long, the flow rate of the airflow generated by the chimney effect will be reduced, resulting in poor heat dissipation effect. In the present embodiment 2, the long strip structure groove 110 includes a first segment groove 110a and a second segment groove 110b. When the light-emitting body 300 emits light and generates heat, according to the principle of hot air rising, the hot air rises in the groove 110 arranged in the direction of gravity, that is, the external air flows through the airflow channel formed by the third opening 113, the inside of the first segment groove 110a and the first opening 111, and flows in the first segment groove 110a, thereby continuously taking away the heat transmitted to the back of the light-transmitting circuit substrate 200; and at the same time, the external air flows through the airflow channel formed by the second opening 112, the inside of the second segment groove 110b and the fourth opening 114, and flows in the second segment groove 110b, thereby continuously taking away the heat transmitted to the back of the light-transmitting circuit substrate 200. Thus, the lower temperature external air enters the second segment groove 110b from the second opening 112, is heated by the back of the light-transmitting circuit substrate 200, and flows out from the fourth opening 114; and the lower temperature external air also enters the first segment groove 110a from the third opening 113, is heated by the back of the light-transmitting circuit substrate 200, and flows out from the first opening 111. Expelling hot air and injecting cold air in the middle section of the longer air flow channel can effectively improve the heat dissipation effect.

[0046] The number of sub-grooves can be adaptively selected according to the length of the light-emitting body row 310. When the length of the light-emitting body row 310 is long, those skilled in the art can add multiple segments of sub-grooves, including but not limited to two segments of sub-grooves.

[0047] Preferably, if Figure 4-11As shown, a first bending section 115 is provided at an end adjacent to the first sub-groove 110a and the second sub-groove 110b, a second bending section 116 is provided at an end adjacent to the second sub-groove 110b and the first sub-groove 110a, a third opening 113 is located at an end adjacent to the first bending section 115 and the second bending section 116 and penetrates to the back side of the guide back plate 100, a fourth opening 114 is located at an end adjacent to the second bending section 116 and the first bending section 115 and penetrates to the back side of the guide back plate 100, and the third opening 113 and the fourth opening 114 are staggered in the length direction of the groove 110, so that the third opening 113 is located between two adjacent fourth openings 114 and the fourth opening 114 is located between two adjacent third openings 113.

[0048] In this way, by providing the bending section, not only the area where the light-emitting body row 310 is projected onto the back side of the light-transmitting circuit substrate 200 still falls within the area where the corresponding groove 110 is projected onto the back side of the light-transmitting circuit substrate 200, but also the third opening 113 and the fourth opening 114 are staggered, so that the external cold air inlet (third opening 113) of the first-segment sub-groove 110a and the hot air outlet (fourth opening 114) of the second-segment sub-groove 110b are staggered, so as to prevent the hot air of the second-segment sub-groove 110b from being discharged directly through the external cold air inlet of the first-segment sub-groove 110a, i.e., the third opening 113, and flowing into the first-segment sub-groove 110a, resulting in a reduction in the heat dissipation effect in the first-segment sub-groove 110a.

[0049] like Fig. 9 As shown, the first bending section 115 and the second bending section 116 are bent toward the width direction, and the bending directions of the two are opposite. The first bending section 115 is bent to the right, and the first bending section 115 forms an angle θ1 with the extension line of the length direction of the groove 110, while the second bending section 116 is bent to the left, and forms an angle θ2 with the extension line of the length direction of the groove 110, and the angles θ1 and θ2 are both greater than zero. Thus, the third opening 113 faces the left side of the groove 110, and the fourth opening 114 faces the right side of the groove 110, so that the third opening 113 and the fourth opening 114 are staggered in the length direction of the groove 110, so as to achieve the effect of the external cold air inlet and the internal hot air outlet of the two adjacent sub-grooves being staggered with each other. It should be understood that the first bending section 115 is bent to the right and the second bending section 116 is bent to the left, and the design purpose is to make the two bending directions opposite, and the third opening 113 and the fourth opening 114 are staggered in the length direction of the groove 110. The solution of the first bending section 115 bending to the left and the second bending section 116 bending to the right can also achieve the desired effect.

[0050] The “length direction” mentioned herein is parallel to the length extension direction of the groove 110 or the arrangement extension direction of the plurality of light emitters 300 in the light emitter row 310 , and the “width direction” is a direction perpendicular to the “length direction”.

[0051] Preferably, if Figure 4-11 As shown, a third bending section 117 is provided at the end of the first sub-groove 110a away from the second sub-groove 110b, and the first opening 111 is located at one end of the third bending section 117 away from the first bending section 115 and penetrates to the back of the guide back plate 100; a fourth bending section 118 is provided at the end of the second sub-groove 110b away from the first sub-groove 110a, and the second opening 112 is located at one end of the fourth bending section 118 away from the second bending section 116 and penetrates to the back of the guide back plate 100; the first opening 111 and the second opening 112 are staggered in the length direction of the groove 110.

[0052] like Figure 10-11 As shown, the third bending section 117 and the fourth bending section 118 are bent in the width direction, and the bending directions of the two are opposite. In the width direction, the third bending section 117 is bent to the left and forms an angle θ3 with the extension line of the length direction of the groove 110, and the fourth bending section 118 is bent to the right and forms an angle θ4 with the extension line of the length direction of the groove 110, so that the first opening is toward the left side of the groove 110 and the second opening 112 is toward the right side of the groove 110, so that the first opening 111 and the second opening 112 are staggered in the length direction of the groove 110, and the angles θ3 and θ2 are equal and the angles θ4 and θ1 are equal. In this way, when the size of the optoelectronic semiconductor display screen needs to be increased, multiple guide back plates 100 are directly spliced ​​to form a large guide back plate 100, so that the external cold air inlet and the internal hot air outlet of the two adjacent sub-grooves between the spliced ​​guide back plates 100 can be staggered with each other, which is convenient for use.

[0053] Preferably, the groove 110 has a depth greater than the wavelength of visible light. Setting the groove 110 to have a depth greater than the wavelength of visible light can effectively reduce the light in the transparent circuit substrate 200 from penetrating into the guide back plate 100 through the groove 110 and affecting the vision of people on the back side of the guide back plate 100.

[0054] Preferably, the groove 110 has a depth greater than 1000 nm. Setting the groove depth greater than 1000 nm can ensure that it is greater than the wavelength of visible light and ensure that air can flow smoothly through the groove 110 .

[0055] Preferably, a plurality of metal pads 210 are provided on the back of the above-mentioned transparent circuit substrate 200, and the number of the plurality of metal pads 210 is adapted to the number of the plurality of light-emitting bodies 300, and the area where the metal pads 210 are projected onto the back of the transparent circuit substrate 200 falls within the area where the corresponding light-emitting body 300 is projected onto the back of the transparent circuit substrate 200.

[0056] By arranging metal pads 210 one by one in the position behind each light-emitting body 300, that is, on the back of the light-transmitting circuit substrate 200 corresponding to the position of each light-emitting body 300, and because the metal pads have a certain thickness, the three walls of the metal pads 210 protrude into the groove 110 and the back of the light-transmitting circuit substrate 200 form an air flow channel. The metal pads 210 are good conductors of heat, and have high heat transfer efficiency. They can efficiently transfer the heat in the light-transmitting circuit substrate 200, further improving the heat dissipation efficiency of the optoelectronic semiconductor display. The material of the metal pads 210 is preferably copper, which has good thermal conductivity and is cheap and easy to obtain.

[0057] The number of the metal pads 210 is adapted to the number of the light-emitting bodies 300 , which means that the original design purpose is that the number of the metal pads 210 is the same as the number of the light-emitting bodies 300 and they are used in combination with each other.

[0058] Preferably, the area of ​​the metal pad 210 projected on the back of the light-transmitting circuit substrate 200 is equal to the area of ​​the corresponding light-emitting body 300 projected on the back of the light-transmitting circuit substrate 200 .

[0059] The light-transmitting circuit substrate 200 is made of transparent material, and the metal pad 210 is made of opaque material. The area of ​​the metal pad 210 is adjusted so that the area of ​​the metal pad 210 projected on the back of the light-transmitting circuit substrate 200 is equal to the area of ​​the corresponding light-emitting body 300 projected on the back of the light-transmitting circuit substrate 200. In this way, the area of ​​the metal pad 210 will be maximized without increasing the shading area of ​​the light-transmitting circuit substrate 200, and the heat generated by the light-emitting body 300 will be effectively transmitted without increasing the non-transparent area.

[0060] Preferably, if Figure 1-3 As shown in the first embodiment, a connecting member 400 for combining the light-transmitting circuit substrate 200 and the guide back plate 100 is also included. The connecting member 400 is only located around the periphery of the light-transmitting circuit substrate 200 and the periphery of the guide back plate 100 .

[0061] like Figure 3 As shown, disposing the connecting member 400 around the periphery of the light-transmitting circuit substrate 200 and the periphery of the guide back plate 100 can avoid affecting the transparency of the main display area of ​​the optoelectronic semiconductor display screen.

[0062] Preferably, if Figure 1-3 As shown in Example 1, the size of the guide back plate 100 is slightly larger than the size of the transparent circuit substrate 200, that is, the length of the guide back plate 100 is slightly larger than the length of the transparent circuit substrate 200, and the width of the guide back plate 100 is slightly larger than the width of the transparent circuit substrate 200. Figure 3As shown, the connecting component 400 includes a plurality of screws 400, each of which is inserted into the periphery of the guide back plate 100 and distributed around the guide back plate 100. The periphery of the light-transmitting circuit substrate 200 is inserted between the nuts of the plurality of screws 400 and the front side of the guide back plate 100. In this way, the guide back plate 100 and the light-transmitting circuit substrate 200 are connected. The connection between the two is firm and detachable, and is convenient to use.

[0063] Preferably, the optoelectronic semiconductor display screen also includes an exhaust device (not shown in the figure); with the extension direction of the light-emitting body row 310 as the up and down direction, an exhaust device is provided above the guide back plate 100, and the air in a plurality of grooves 110 is sucked by the exhaust device to enhance the airflow in the air flow channel formed by the three walls of the grooves 110 and the back side of the light-transmitting circuit substrate 200, thereby further enhancing the heat dissipation effect.

[0064] Although the terms such as transparent circuit substrate, luminous body, guide back plate, groove, first opening, second opening, third opening, fourth opening, first bending section, second bending section, third bending section, fourth bending section, metal pad, first section groove, second section groove, connecting member, luminous body row, etc. are used more frequently in this article, the possibility of using other terms is not excluded. The use of these terms is only for more convenient description and explanation of the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A photoelectric semiconductor display screen, Features: It includes a light-transmitting circuit substrate, a plurality of light-emitting bodies and a flow-guiding back plate, wherein the light-emitting bodies are arranged on the front side of the light-transmitting circuit substrate, and the flow-guiding back plate is arranged on the back side of the light-transmitting circuit substrate; The plurality of light-emitting bodies are distributed in a matrix and include a plurality of light-emitting body rows arranged at intervals; the front side of the guide back plate faces the light-transmitting circuit substrate and is formed with a plurality of grooves arranged at intervals, the grooves and the back side of the light-transmitting circuit substrate form an air flow channel, and the two ends of the grooves are respectively provided with a first opening and a second opening communicating with the external air, so that the external air can flow in the grooves; The area of ​​the light-emitting body row projected on the back of the light-transmitting circuit substrate falls into the area of ​​the corresponding groove projected on the back of the light-transmitting circuit substrate; the groove is a long strip structure, and the groove includes a first section sub-groove and a second section sub-groove; The first opening and the third opening are respectively provided at both ends of the first section groove, which are connected to the outside air, so that the outside air flows in the first section groove through the air flow channel formed by the third opening, the inside of the first section groove and the first opening; The second sub-groove has a fourth opening and the second opening at both ends thereof which are connected to the outside air, so that the outside air can flow in the second sub-groove through the air flow channel formed by the second opening, the inside of the second sub-groove and the fourth opening; the first sub-groove has a first bending section at an end adjacent to the second sub-groove, and the second sub-groove has a second bending section at an end adjacent to the first sub-groove; the third opening is located at an end adjacent to the first bending section and the second bending section and penetrates to the back of the guide back plate; the fourth opening is located at The end of the second bending section adjacent to the first bending section passes through to the back of the guide back plate, and the third opening and the fourth opening are staggered in the length direction of the groove; the end of the first section groove away from the second section groove is provided with a third bending section, and the first opening is located at an end of the third bending section away from the first bending section and passes through to the back of the guide back plate; the end of the second section groove away from the first section groove is provided with a fourth bending section, and the second opening is located at an end of the fourth bending section away from the second bending section and passes through to the back of the guide back plate; The first through opening and the second through opening are staggered in the length direction of the groove; the groove depth of the groove is greater than the wavelength of visible light.

2. The optoelectronic semiconductor display screen according to claim 1, Features: A plurality of metal pads are provided on the back of the light-transmitting circuit substrate, the number of the metal pads being adapted to the number of the light-emitting bodies, and the area of ​​the metal pads projected onto the back of the light-transmitting circuit substrate falls within the area of ​​the corresponding light-emitting body projected onto the back of the light-transmitting circuit substrate.

3. The optoelectronic semiconductor display screen according to claim 2, Features: The area of ​​the metal pad projected on the back of the light-transmitting circuit substrate is equal to the area of ​​the corresponding light-emitting body projected on the back of the light-transmitting circuit substrate.

4. The optoelectronic semiconductor display screen according to claim 1, Features: It also includes a connecting component for combining the light-transmitting circuit substrate and the guide back plate, and the connecting component is only located at the periphery of the light-transmitting circuit substrate and the periphery of the guide back plate.

5. The optoelectronic semiconductor display screen according to claim 4, Features: The connecting member comprises a plurality of screws, each of which penetrates into the periphery of the guide back plate, and the periphery of the light-transmitting circuit substrate is inserted between the nuts of the plurality of screws and the front surface of the guide back plate.

6. The optoelectronic semiconductor display screen according to claim 1, Features: It also includes an exhaust device; with the extension direction of the light-emitting body row as the up and down direction, the exhaust device is arranged above the guide back plate, and the air in the grooves is sucked through the exhaust device.

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