A high-density radio frequency coaxial connection module

Abstract

The embodiment of the present invention discloses a high-density RF coaxial connection module, including a socket plate and a plug assembly that are plugged in and matched with each other, a plurality of mutually independent first interface modules are arranged on the board surface of the socket plate facing the plug assembly, each of the first interface modules includes a plurality of RF interfaces arranged in an array, the plug assembly includes a plurality of mutually independent second interface modules corresponding to the first interface modules, each of the second interface modules includes a plurality of mounting holes arranged in an array, each of the mounting holes is provided with a connector plugged in with the RF interface, and the connector is electrically connected to the corresponding RF interface. The present invention can realize the rapid plugging and unplugging of multi-core interfaces, meeting the requirements of high density, integration, and high frequency.

Description

Technical Field

[0001] The present invention belongs to the technical field of quantum computers, and in particular relates to a high-density radio frequency coaxial connection module. Background Art

[0002] In recent years, with the rapid development of quantum computing technology, the research on quantum computers has opened up new avenues for the development of information technology. The performance of quantum computers far exceeds that of current classical supercomputers, and almost all basic problems have been solved in theory. Once a general-purpose quantum computer is realized, it will greatly empower fields such as artificial intelligence, drug development, and logistics. The high-density RF coaxial connection module is an important component in a quantum computer, and its main function is to transmit chip signals. The high-density RF coaxial connection module of the prior art has a large structure and a small number of interfaces. With the development of high-bit quantum computers, the high-density RF coaxial connection module of the prior art can no longer meet the requirements of high-bit data transmission. Summary of the invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a high-density radio frequency coaxial connection module that can realize fast plugging and unplugging of multi-core interfaces and meet the requirements of high density, integration and high frequency.

[0004] An embodiment of the present invention is implemented as follows: a high-density RF coaxial connection module includes a socket plate and a plug assembly that are plugged into each other, a plurality of mutually independent first interface modules are arranged on the board surface of the socket plate facing the plug assembly, each of the first interface modules includes a plurality of RF interfaces arranged in an array, the plug assembly includes a plurality of mutually independent second interface modules corresponding to the first interface modules, each of the second interface modules includes a plurality of mounting holes arranged in an array, a connector that is plugged into the RF interface is arranged in each of the mounting holes, and the connector is electrically connected to the corresponding RF interface.

[0005] Furthermore, the socket board includes a first board body, a printed circuit board and a second board body which are stacked in sequence, a plurality of through holes are opened on the second board body to form a plurality of the RF interfaces, an inner conductor is arranged in the through hole and the inner conductor is electrically connected to the printed circuit board, and an insulating member is sandwiched between the inner conductor and the hole wall of the through hole.

[0006] Furthermore, the connector includes a spring claw that surrounds an inner cavity, and a connector inner conductor is arranged in the inner cavity. When the connector is inserted into the RF interface, the spring claw is electrically connected to the inner wall of the through hole and the inner conductor is inserted into the connector inner conductor.

[0007] Furthermore, the high-density RF coaxial connection module also includes a first locking screw, and when the connector is inserted into the RF interface, the socket board and the second interface module are fixed by the first locking screw.

[0008] Furthermore, the second interface module includes a substrate, the mounting holes are arranged on a surface of the substrate, and gripping portions extending in a direction perpendicular to the side walls of the substrate are provided on both sides of the substrate.

[0009] Furthermore, a guide post for guiding is arranged on the board surface of the socket board facing the plug assembly, and a guide hole adapted to the guide post is arranged on the base board.

[0010] Furthermore, the high-density RF coaxial connection module also includes a cable assembly, which includes a cable electrically connected to the connector and an SMA connector connected to an end of the cable away from the connector.

[0011] Furthermore, the outer surface of the cable is coated with a heat shrink tube, and a label is also provided on the surface of the cable, and the label is used to mark the position of the installation hole where the connector connected to the cable is located.

[0012] Furthermore, the high-density RF coaxial connection module also includes a second locking screw, and the first board, the printed circuit board and the second board are fixed by the second locking screw.

[0013] Furthermore, the number of the first interface modules and the second interface modules is eight, wherein four of the first interface modules are arranged with 34 of the RF interfaces, four of the first interface modules are arranged with 30 of the RF interfaces, four of the second interface modules are arranged with 34 of the mounting holes, and four of the second interface modules are arranged with 30 of the mounting holes.

[0014] Compared with the prior art, the embodiments of the present invention have the following beneficial effects: the present invention respectively sets a plurality of mutually corresponding first interface modules and second interface modules on the socket board and the plug assembly, and the first interface modules and the second interface modules are arranged with RF interfaces forming an array and are connected to each other, thereby integrating more RF interfaces into a smaller space, realizing fast plugging and unplugging of multi-core interfaces, meeting the requirements of high density, integration, and high frequency, and realizing the operation of high-bit quantum computers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of a high-density radio frequency coaxial connection module provided by an embodiment of the present invention;

[0016] Figure 2is a schematic diagram of another perspective of a high-density radio frequency coaxial connection module provided by an embodiment of the present invention;

[0017] Figure 3 yes Figure 2 AA direction section diagram;

[0018] Figure 4 yes Figure 3 A schematic diagram of the enlarged structure of part B;

[0019] Figure 5 yes Figure 1 A schematic diagram of the structure of the socket board;

[0020] Figure 6 is a schematic structural diagram of a plug assembly provided by an embodiment of the present invention when the plug assembly is not connected to a cable assembly;

[0021] Figure 7 It is a schematic diagram of the connection between the plug assembly and the cable assembly provided in an embodiment of the present invention.

[0022] In the accompanying drawings, each reference numeral represents:

[0023] 10. Socket board; 20. Plug assembly; 11. First interface module; 111. Guide column; 12. RF interface; 21. Second interface module; 211. Base plate; 2111. Grip; 22. Mounting hole; 13. First board; 14. Printed circuit board; 15. Second board; 16. Inner conductor; 17. Insulator; 18. Lower cover; 23. Connector; 231. Spring claw; 232. Connector inner conductor; 30. First locking screw; 41. Cable; 42. SMA connector; 43. Heat shrink tube; 44. Label; 45. Cable tie; 50. Second locking screw. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] like Figures 1 to 7As shown, a high-density RF coaxial connection module provided by an embodiment of the present invention includes a socket plate 10 and a plug assembly 20 that are plugged into each other. A plurality of mutually independent first interface modules 11 are arranged on the board surface of the socket plate 10 facing the plug assembly 20. Each first interface module 11 includes a plurality of RF interfaces 12 arranged in an array. The plug assembly 20 includes a plurality of mutually independent second interface modules 21 corresponding to the first interface modules 11. Each second interface module 21 includes a plurality of mounting holes 22 arranged in an array. A connector 23 that is plugged into the RF interface 12 is arranged in each mounting hole 22. The connector 23 is electrically connected to the corresponding RF interface 12.

[0026] The present invention respectively sets a plurality of first interface modules 11 and second interface modules 21 corresponding to each other on the socket board 10 and the plug assembly 20. The first interface module 11 and the second interface module 21 are arranged with RF interfaces and connectors forming an array and are connected to each other, so as to integrate more RF interfaces into a smaller space and realize fast plugging and unplugging of multi-core interfaces, meeting the requirements of high density, integration and high frequency, and realizing the operation of high-bit quantum computers.

[0027] The shapes of the multiple first interface modules 11 on the socket board 10 may be the same or different, and the RF interfaces 12 on different first interface modules 11 may form the same array or different arrays. Figure 5 As shown, the RF interfaces 12 on the first interface module 11 are arranged to form a rectangular array. In other possible implementations, the RF interfaces 12 on the first interface module 11 may also be arranged to form a triangular array, a pentagonal array, or a hexagonal array, etc. This embodiment does not limit this.

[0028] In this embodiment, Figure 6As shown. The second interface module 21 includes a substrate 211, and mounting holes 22 are arranged on the board surface of the substrate 211. The two sides of the substrate 211 are provided with gripping parts 2111 extending in the direction perpendicular to the side walls of the substrate 211. The gripping parts 2111 can facilitate the operator to hold the substrate 211 and plug and separate the second interface module 21 from the socket board 10. The number of the first interface modules 11 and the second interface modules 21 is eight. The socket board 10 is a rectangular structure. The eight first interface modules 11 surround the periphery of the board surface of the socket board 10. Three first interface modules 11 are arranged on each side of the socket board 10, wherein four first interface modules 11 are arranged with 34 radio frequency interfaces 12, and four first interface modules 11 are arranged with 30 radio frequency interfaces 12. The first interface modules 11 arranged with 34 radio frequency interfaces 12 are located at the four corners of the board surface of the socket board 10, and four second interface modules 21 are arranged with 34 mounting holes 22, and four second interface modules 21 are arranged with 30 mounting holes 22. In other possible implementations, the number of RF interfaces 12 on each first interface module 11 and the number of mounting holes 22 on each second interface module 21 may also be 20, 30, 40, etc. This embodiment does not limit the number of RF interfaces 12 and mounting holes 22.

[0029] In order to prevent the holding portions 2111 of multiple second interface modules 21 that are plugged in and matched with the socket board 10 from interfering with each other, the holding portions 2111 of the second interface modules 21 that are plugged in and matched with the first interface modules 11 located at the four corners of the socket board 10 extend along the diagonal direction of the substrate 211, while the holding portions 2111 of the second interface modules 21 that are plugged in and matched with the remaining first interface modules 11 located on the socket board 10 are arranged on two opposite sides of the substrate 211.

[0030] Preferably, Figure 3 and Figure 4As shown, the socket board 10 includes a first board body 13, a printed board 14 and a second board body 15 which are stacked in sequence. A plurality of through holes are provided on the second board body 15 to form a plurality of radio frequency interfaces 12. An inner conductor 16 is provided in the through hole and the inner conductor 16 is electrically connected to the printed board 14. An insulating member 17 is sandwiched between the inner conductor 16 and the hole wall of the through hole. Compared with the prior art which requires the separate processing of the socket housing and a single male connector, and the welding of the outer conductor of each male connector to the printed board 14 in sequence, the present application directly provides a through hole on the second board body 15 and embeds the inner conductor 16, which is equivalent to integrating the outer conductor of the male connector with the second board body 15, without the existence of independent male connectors, and improving the fixing method of the radio frequency interface, thereby reducing the cost of parts processing, reducing the weight of the high-density radio frequency coaxial connection module, reducing the difficulty of assembling the male connector and improving the overall assembly efficiency of the product, and this fixing method enhances the stability of the fixing of the radio frequency interface 12 and reduces the risk of the radio frequency interface 12 falling off.

[0031] Specifically, the connector 23 includes a spring claw 231 that is surrounded to form an inner cavity, and a connector inner conductor 232 is arranged in the inner cavity. When the connector 23 is inserted into the RF interface 12, the spring claw 231 is electrically connected to the inner wall of the through hole and the inner conductor 16 is inserted into the connector inner conductor 232, thereby realizing the electrical connection between the connector 23 and the RF interface 12. The high-density RF coaxial connection module of this embodiment also includes a cable assembly, which includes a cable 41 electrically connected to the connector 23 and an SMA connector 42 connected to an end of the cable 41 away from the connector 23, and the cable assembly is used to input and output signals. The outer surface of the cable 41 is coated with a heat shrink tube 43, and the surface of the cable 41 is also provided with a label 44, which is used to mark the position of the mounting hole 22 where the connector 23 connected to the cable 41 is located. For example, if a mounting hole 22 on the plug assembly 20 is labeled "23", then for the cable 41 connected to the connector 23 on the mounting hole 22, "23" can be marked on the label 44 of the insulating outer layer 43 to prevent the wrong interface from being connected. The heat shrink tube 43 has excellent flame retardant and insulating properties, is very soft and elastic, has a low shrinking temperature, shrinks quickly, and can better protect the cable 41. In addition, all cables 41 connected to each second interface module 21 on the plug assembly 20 can be tied up with a cable tie 45, which not only looks beautiful, but also prevents the cables 41 on different second interface modules 21 from interfering with each other.

[0032] The high-density RF coaxial connection module also includes a first locking screw 30. When the connector 23 is inserted into the RF interface 12, the socket board 10 and the second interface module 21 are fixed by the first locking screw 30, which prevents the second interface module 21 from falling off the socket board 10 due to the heavy weight of the cable 41 bundle, resulting in signal interruption, thereby enhancing the working stability of the high-density RF coaxial connection module. In addition, the high-density RF coaxial connection module also includes a second locking screw 50. The first board 13, the printed board 14 and the second board 15 are fixed by the second locking screw 50 to realize the function of the socket board 10. Compared with the prior art of welding each male connector to the printed board 14 separately, the production difficulty is greatly reduced and the production efficiency is improved. The socket board 10 of this embodiment also includes a lower cover plate 18. After the chip is bound to the printed board 14, it can be packaged through the lower cover plate 18.

[0033] Furthermore, a guide post 111 is provided on the board surface of the socket board 10 facing the plug assembly 20, and a guide hole adapted to the guide post 111 is provided on the base board 211. The guide post 111 and the guide hole have a guiding function, which can prevent the second interface module 21 from being inserted obliquely when being plugged into the socket board 10, prevent damage to the second interface module 21 or the socket board 10, and facilitate the quick plug-in of the second interface module 21 and the socket board 10.

[0034] In summary, the present invention respectively arranges a plurality of first interface modules 11 and second interface modules 21 corresponding to each other on the socket board 10 and the plug assembly 20. The first interface module 11 and the second interface module 21 are arranged with RF interfaces and connectors forming an array and are connected to each other, so as to integrate more RF interfaces into a smaller space and realize fast plugging and unplugging of multi-core interfaces, meeting the requirements of high density, integration and high frequency, and realizing the operation of high-bit quantum computers.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-density radio frequency coaxial connection module, characterized in that: The invention comprises a socket plate (10) and a plug assembly (20) which are plugged into each other, the socket plate (10) being of a rectangular structure, and eight mutually independent first interface modules (11) being arranged on the surface of the socket plate (10) facing the plug assembly (20), the eight first interface modules (11) surrounding the periphery of the surface of the socket plate (10), and three first interface modules (11) being arranged on each side of the socket plate (10), each first interface module (11) comprising a plurality of radio frequency interfaces (12) arranged in an array, and the plug assembly (20) comprising eight mutually independent and connected first interface modules (11). A second interface module (21) corresponding to the port module (11), each of the second interface modules (21) comprising a plurality of mounting holes (22) arranged in an array, each of the mounting holes (22) being provided with a connector (23) plugged into the radio frequency interface (12), the connector (23) being electrically connected to the corresponding radio frequency interface (12); the second interface module (21) comprising a substrate (211), the mounting holes (22) being arranged on a surface of the substrate (211), and gripping portions (2111) extending in a direction perpendicular to the side walls of the substrate (211) being provided on both sides of the substrate (211); Wherein, in the second interface module (21) pluggable with the first interface modules (11) located at the four corners of the socket board (10), its holding portion (2111) extends along the diagonal direction of the base plate (211), and in the second interface module (21) pluggable with the remaining first interface modules (11) located at the socket board (10), its holding portion (2111) is arranged on two opposite sides of the base plate (211).

2. The high-density radio frequency coaxial connection module according to claim 1, characterized in that: The socket board (10) comprises a first board body (13), a printed circuit board (14) and a second board body (15) which are stacked in sequence, a plurality of through holes are provided on the second board body (15) to form a plurality of radio frequency interfaces (12), an inner conductor (16) is provided in the through hole and the inner conductor (16) is electrically connected to the printed circuit board (14), and an insulating member (17) is sandwiched between the inner conductor (16) and the hole wall of the through hole.

3. The high-density RF coaxial connection module according to claim 2, characterized in that: The connector (23) comprises an elastic claw (231) which is surrounded to form an inner cavity, wherein a connector inner conductor (232) is arranged in the inner cavity, and when the connector (23) is inserted into the radio frequency interface (12), the elastic claw (231) is electrically connected to the inner wall of the through hole and the inner conductor (16) is inserted into the connector inner conductor (232).

4. The high-density RF coaxial connection module according to claim 1, characterized in that: The high-density radio frequency coaxial connection module also includes a first locking screw (30), and when the connector (23) is inserted into the radio frequency interface (12), the socket board (10) and the second interface module (21) are fixed by the first locking screw (30).

5. The high-density radio frequency coaxial connection module according to claim 4, characterized in that: A guide column (111) for guiding is arranged on the board surface of the socket board (10) facing the plug assembly (20), and a guide hole adapted to the guide column (111) is arranged on the base board (211).

6. The high-density RF coaxial connection module according to claim 1, characterized in that: The high-density radio frequency coaxial connection module also includes a cable assembly, wherein the cable assembly includes a cable (41) electrically connected to the connector (23) and an SMA connector (42) connected to an end of the cable (41) away from the connector (23).

7. The high-density radio frequency coaxial connection module according to claim 6, characterized in that: The outer surface of the cable (41) is coated with a heat shrink tube (43), and the surface of the cable (41) is also provided with a label (44), and the label (44) is used to mark the position of the installation hole (22) where the connector (23) connected to the cable (41) is located.

8. The high-density radio frequency coaxial connection module according to claim 2, characterized in that: The high-density radio frequency coaxial connection module also includes a second locking screw (50), and the first board (13), the printed board (14) and the second board (15) are fixed by the second locking screw (50).

9. The high-density radio frequency coaxial connection module according to any one of claims 1 to 8, characterized in that: The number of the first interface modules (11) and the second interface modules (21) is eight, wherein four of the first interface modules (11) are arranged with 34 of the radio frequency interfaces (12), four of the first interface modules (11) are arranged with 30 of the radio frequency interfaces (12), four of the second interface modules (21) are arranged with 34 of the mounting holes (22), and four of the second interface modules (21) are arranged with 30 of the mounting holes (22).

Images