A low-pass structure, filter and communication equipment

Abstract

The present application discloses a low-pass structure, a filter and a communication device, wherein the low-pass structure at least comprises: a low-pass inner conductor, a heat shrink sleeve sleeved on the low-pass inner conductor, and the heat shrink sleeve is assembled in the cavity of the filter. The heat shrink sleeve at least comprises: an annular portion and a buffer portion, the buffer portion is arranged to be raised relative to the annular portion, the annular portion contacts the low-pass inner conductor, the buffer portion contacts the cavity of the filter, and the buffer portion is used to obtain an assembly buffer space when the heat shrink sleeve is assembled. Therefore, the low-pass structure provided by the present application can obtain an assembly buffer space between the heat shrink sleeve and the cavity through the buffer portion of the heat shrink sleeve, thereby improving the firmness of the assembly of the low-pass structure.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a low-pass structure, a filter and a communication device. Background Art

[0002] At present, filters, as a communication device for frequency selection and signal suppression, play an important role in the field of communication radio frequency. Filters often contain a low-pass inner conductor, and a heat shrink sleeve is generally provided outside the low-pass inner conductor to form a low-pass structure. When assembling the low-pass inner conductor, the sleeve is assembled in the cavity of the filter to fix the low-pass structure.

[0003] Among them, the heat shrink tubing is made of heat shrink material, which is also called polymer shape memory material. The heat shrink tubing made of this material has a "memory effect", that is, during production, the heat shrink tubing is heated to a high elastic state and a load is applied to expand it, and it is quickly cooled while maintaining the expansion. After cooling, it will enter the glass state and maintain the expanded state; when the tubing is used, it will return to the high elastic state as soon as it is heated, but at this time the load is gone, and it will shrink. The current heat shrink ratio of heat shrink tubing is usually in the range of 20% to 50%.

[0004] Therefore, due to the "memory effect" of the heat shrink tubing, the interference between the low-pass structure and the cavity during assembly is relatively large, which easily causes the heat shrink tubing to loosen, thereby reducing the firmness of the low-pass structure assembly. Summary of the invention

[0005] In order to solve the above-mentioned problems existing in the heat shrink tubing in the prior art, the present application provides a low-pass structure, a filter and a communication device.

[0006] In order to solve the above problems, the embodiment of the present application provides a low-pass structure, which includes a low-pass inner conductor, a heat shrink sleeve sleeved on the low-pass inner conductor, and the heat shrink sleeve is assembled in the cavity of the filter. The heat shrink sleeve at least includes: an annular portion and a buffer portion, the buffer portion is convex relative to the annular portion, the annular portion contacts the low-pass inner conductor, the buffer portion contacts the cavity of the filter, and the buffer portion is used to obtain an assembly buffer space when the heat shrink sleeve is assembled.

[0007] Furthermore, the cross-sectional shape of the annular portion is a circular ring, and the buffer portion is arranged on the outer surface of the circular ring.

[0008] Furthermore, the buffer portions are arranged sequentially along the extending direction of the annular portion.

[0009] Furthermore, the cross-sectional shape of the buffer portion is conical.

[0010] Furthermore, the cross-sectional shape of the buffer portion includes a trapezoid and a fan-shaped portion located at the upper bottom of the trapezoid.

[0011] Furthermore, the buffer portion is arranged between two adjacent annular portions, and the thickness of the buffer portion is equal to the thickness of the annular portion.

[0012] Furthermore, the cross-sectional shape of the buffer portion is an arc shape, and the outer diameter of the buffer portion is smaller than the outer diameter of the annular portion.

[0013] Furthermore, the annular portion is recessed toward the inner cavity of the heat shrinkable sleeve.

[0014] Furthermore, the material of the heat shrinkable tube is a polymer shape memory material.

[0015] To solve the above problems, an embodiment of the present application further provides a filter, which includes any of the above low-pass structures.

[0016] To solve the above problems, an embodiment of the present application further provides a communication device, which includes any of the above low-pass structures.

[0017] Compared with the prior art, the low-pass structure of the present application at least includes: a low-pass inner conductor and a heat shrink sleeve sleeved on the low-pass inner conductor, and the heat shrink sleeve is assembled in the cavity of the filter. The heat shrink sleeve at least includes an annular portion and a buffer portion, the buffer portion is protruded relative to the annular portion, the annular portion is in contact with the low-pass inner conductor, the buffer portion is in contact with the cavity of the filter, and the buffer portion is used to obtain an assembly buffer space when the heat shrink sleeve is assembled. Therefore, the low-pass structure provided by the present application can obtain the buffer space for assembly between the heat shrink sleeve and the cavity through the buffer portion of the heat shrink sleeve, thereby improving the firmness of the assembly of the low-pass structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 is a cross-sectional schematic diagram of a low-pass structure in the prior art;

[0020] Figure 2 is a cross-sectional schematic diagram of a first embodiment of the low-pass structure of the present application;

[0021] Figure 3 This is a structural schematic diagram of a low-pass inner conductor of the low-pass structure of the present application;

[0022] Figure 4 It is a schematic diagram of the overall structure of the low-pass structure of the present application;

[0023] Figure 5is a cross-sectional schematic diagram of a heat shrink sleeve of a first embodiment of a low-pass inner conductor of the present application;

[0024] Figure 6 is a schematic cross-sectional view of a buffer portion of a heat shrink sleeve of a first embodiment of a low-pass inner conductor of the present application;

[0025] Figure 7 is a cross-sectional schematic diagram of a second embodiment of the low-pass structure of the present application;

[0026] Figure 8 It is a cross-sectional schematic diagram of a heat shrink tubing of a second embodiment of the low-pass structure of the present application. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present application.

[0028] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0029] See also Figure 1 , Figure 1 is a schematic cross-sectional view of a low-pass structure 10 in the prior art.

[0030] like Figure 1 As shown, the low-pass structure 10 in the prior art includes a low-pass inner conductor 11 and a heat shrink sleeve 12, the heat shrink sleeve 12 is sleeved on the low-pass inner conductor 11, and the heat shrink sleeve 12 is assembled in a cavity 13. As can be seen from the figure, the heat shrink sleeve 12 in the prior art includes a sleeve wall, and the wall thickness of the sleeve wall is uniform. When the heat shrink sleeve 12 is assembled, the heat shrink sleeve 12 will shrink, causing the heat shrink sleeve 12 to collapse, or the gap between the heat shrink sleeve 12 and the cavity 13 outside the sleeve is too large, causing the low-pass inner conductor 11 to be assembled loosely.

[0031] The present application provides a low-pass structure 20 , which can be firmly assembled in a cavity of a filter.

[0032] See also Figure 2 , Figure 2 2 is a cross-sectional schematic diagram of a first embodiment of the low-pass structure 20 of the present application.

[0033] The low-pass structure 20 of this embodiment includes a low-pass inner conductor 21 and a heat shrinkable sleeve 22 sleeved on the low-pass inner conductor 21. The heat shrinkable sleeve 22 is assembled in the cavity 23 of the filter to achieve the assembly of the low-pass structure 20. Figure 3 , Figure 3 2 is a schematic structural diagram of a low-pass inner conductor 21 of the low-pass structure 20 of the present application.

[0034] like Figure 3 As shown, in this embodiment, the low-pass inner conductor 21 includes a metal main rod 211 and a metal disk 212, wherein the metal disk 212 is disposed on the metal main rod 211. The low-pass inner conductor 21 may also include a connecting rod 213, which may be disposed at at least one end of the low-pass inner conductor 21. In this embodiment, the connecting rod 213 is disposed at both ends of the low-pass inner conductor 21. It can be understood that the metal main rod 211 can also be referred to as a high-impedance section of the low-pass inner conductor 21, and the metal main rod 211 can also be referred to as a low-impedance section of the low-pass inner conductor 21.

[0035] Please read further Figure 4 , Figure 4 It is a schematic diagram of the overall structure of the low-pass structure 20 of the present application.

[0036] like Figure 4 As shown, the low-pass structure 20 includes a low-pass inner conductor 21 and a heat shrink sleeve 22 sleeved outside the low-pass inner conductor 21. That is, the heat shrink sleeve 22 is sleeved on the metal plate 212 of the low-pass inner conductor 21 to achieve the assembly of the low-pass inner conductor 21 and the heat shrink sleeve 22.

[0037] See also Figure 5 , Figure 5 1 is a schematic cross-sectional view of a heat shrink tubing 22 of a first embodiment of a low-pass inner conductor 21 of the present application.

[0038] The heat shrinkable sleeve 22 specifically includes: an annular portion 221 and a buffer portion 222. In this embodiment, the buffer portion 222 is provided to be raised relative to the annular portion 221. The buffer portion 222 is used to obtain an assembly buffer space between the heat shrinkable sleeve 22 and the cavity 23 when the heat shrinkable sleeve 22 is assembled in the cavity 23.

[0039] Specifically, the heat shrink sleeve 22 is sleeved outside the low-pass inner conductor 21 and assembled in the cavity 23 of the filter, that is, the annular portion 221 of the heat shrink sleeve 22 contacts the metal disk 212 of the low-pass inner conductor 21, and the buffer portion 222 contacts the cavity to fix the heat shrink sleeve 22 to the cavity 23. Since the buffer portion 222 is convex relative to the annular portion 221, there is a certain movable space between the annular portion 221 of the heat shrink sleeve 22 and the cavity 23 through the buffer portion 222, which is the buffer space.

[0040] Therefore, the low-pass structure 20 provided in the present application can obtain a buffer space for assembly through the buffer portion 222 of the heat shrinkable tube 22. Even if the heat shrinkable tube 22 shrinks during assembly, the presence of the buffer portion 222 can ensure the firmness of the assembly of the heat shrinkable tube 22.

[0041] Specifically, the cross-sectional shape of the annular portion 221 of the heat shrinkable sleeve 22 of this embodiment can be a circular ring, and the buffer portion 222 is arranged on the outer surface of the annular portion 221. Preferably, the buffer portion 222 of this embodiment is integrally formed with the annular portion 221 to reduce the manufacturing process and improve the tightness of the buffer portion 222.

[0042] The buffer portions 222 are sequentially arranged along the extension direction of the annular portion 221, that is, in this embodiment, the buffer portions 222 are sequentially arranged along the extension direction of the central axis of the annular annular portion 221. More specifically, the extension direction of the heat shrinkable sleeve 22 includes a plurality of sequentially arranged cross sections having the buffer portions 222, and each cross section includes at least three buffer portions 222.

[0043] The cross-sectional shape of the buffer portion 222 is conical. That is, the buffer portion 222 is a cone disposed on the outer surface of the annular portion 221. That is, the buffer portion 222 is a convex rib disposed on the outer surface of the heat shrinkable sleeve 22.

[0044] In one embodiment, if Figure 6 As shown, the cross section of the buffer portion 222 includes a trapezoid 31 and a sector 32 disposed on the upper bottom of the trapezoid 31. Specifically, the trapezoid 31 is an isosceles trapezoid, and the sector 32 is a semicircle. That is, the buffer portion 222 is formed integrally by a truncated cone body disposed on the outer surface of the annular portion 221 and a hemispherical body disposed on the upper surface of the truncated cone body, and the bottom surface of the hemispherical body coincides with the upper surface of the truncated cone.

[0045] The heat shrink sleeve 22 contacts the cavity 23 through the buffer portion 222 and deforms, and the annular portion 221 of the heat shrink sleeve 22 does not contact the cavity 23, so that a certain buffer space is left between the annular portion 221 of the heat shrink sleeve 22 and the cavity 23. Therefore, when assembling the low-pass structure 20, even if the heat shrink sleeve 22 shrinks, it can still contact the cavity 23 of the filter through the buffer portion 222 of the heat shrink sleeve 22, and the problem of loose assembly of the low-pass structure 20 will not be caused by the loose contact between the heat shrink sleeve 22 and the cavity 23.

[0046] The present embodiment at least has the following beneficial effects: the low-pass structure 20 provided in the present embodiment includes a low-pass inner conductor 21 and a heat shrinkable sleeve 22 sleeved on the low-pass inner conductor 21, the heat shrinkable sleeve 22 contacts the inner wall of the cavity 23 through the buffer portion 222 and deforms, so that a certain retraction buffer space is left between the annular portion 221 of the heat shrinkable sleeve 22 and the cavity 23. Therefore, even if the heat shrinkable sleeve 22 retracts during assembly, it can still contact the cavity 23 closely through the buffer portion 222, thereby avoiding the problem of loose assembly caused by the retraction of the heat shrinkable sleeve 22.

[0047] See also Figure 7 , Figure 7 It is a cross-sectional schematic diagram of a second embodiment of the low-pass structure 20 provided in the present application.

[0048] like Figure 7 As shown, the low-pass structure 20 includes a low-pass inner conductor 21 , a heat shrink sleeve 22 sleeved on the low-pass inner conductor 21 , and the heat shrink sleeve 22 is assembled in a cavity 23 of the filter to achieve assembly of the low-pass structure 20 .

[0049] See also Figure 8 , Figure 8 It is a schematic cross-sectional view of the heat shrinkable tube 22 of the low-pass structure 20 according to the second embodiment of the present application.

[0050] Specifically, Figure 8 As shown, the buffer portion 222 of the heat shrinkable tube 22 of the low-pass structure 20 provided in this embodiment is arranged between two adjacent annular portions 221, and the thickness of the buffer portion 222 is equal to the thickness of the annular portion 221, which is easy to manufacture. The buffer portion 222 and the annular portion 221 are integrally formed to reduce the process and ensure the firmness of the heat shrinkable tube 20.

[0051] The cross-sectional shape of the buffer portion 222 is an arc shape, and the outer diameter 223 and the inner diameter 224 of the buffer portion 222 are both arc shapes.

[0052] The centers of the outer diameter 223 and the inner diameter 224 of the buffer portion 222 are both located in the inner cavity of the heat shrinkable sleeve 22 , so that the buffer portion 222 bulges outward.

[0053] The annular portion 221 is recessed toward the inner cavity of the heat shrinkable tube 22. Specifically, the annular portion 221 is arc-shaped, the outer diameter 225 and the inner diameter 226 of the annular portion 221 are both arcs, and the center of the outer diameter 225 and the inner diameter 226 of the annular portion 221 is located outside the inner cavity of the heat shrinkable tube 22, so that the annular portion 221 is recessed toward the inner cavity of the heat shrinkable tube 22.

[0054] Among them, the length of the inner diameter 224 of the buffer part 222 is smaller than the length of the outer diameter 223, and the length of the inner diameter 226 of the annular part 221 is larger than the length of the outer diameter 225 of the annular part 221, so as to achieve a smooth connection between the outer diameter 225 of the annular part 221 and the outer diameter 223 of the buffer part 222, and a smooth connection between the inner diameter 226 of the annular part 221 and the inner diameter 224 of the buffer part 222.

[0055] The curvature of the buffer portion 222 is greater than the curvature of the annular portion 221 , that is, the arc radius of the buffer portion 222 is smaller than the arc radius of the annular portion 221 .

[0056] Therefore, the buffer portion 222 is provided to protrude relative to the annular portion 221 , and the buffer portion 222 can obtain an assembly buffer space between the cavity 23 .

[0057] Among them, the length of the outer diameter 223 of the buffer portion 222 is smaller than the length of the outer diameter 225 of the annular portion 221, the length of the inner diameter 224 of the buffer portion 222 is smaller than the length of the inner diameter 226 of the annular portion 221, and the curvature of the buffer portion 222 is greater than the curvature of the annular portion 221, so as to obtain a better buffering effect through the buffer portion 222.

[0058] Among them, when the heat shrink sleeve 22 is sleeved on the low-pass inner conductor 21 and assembled in the cavity 23, the annular portion 221 of the heat shrink sleeve 22 contacts and deforms the low-pass inner conductor 21, and a certain gap is left between the cavity 23; the buffer portion 222 of the heat shrink sleeve 22 contacts and deforms the cavity 23, and a certain gap is left between the low-pass inner conductor 21.

[0059] Therefore, when assembling the low-pass structure 20, since the buffer portion 222 of the heat shrinkable tube 22 is in contact with the cavity 23 and deformed, and the annular portion 221 is in contact with the low-pass inner conductor 21 and deformed, when the heat shrinkable tube 22 retracts, the deformation of the buffer portion 222 and the annular portion 221 is released, so that the heat shrinkable tube 22 can still be firmly assembled in the cavity 23. In addition, even if the heat shrinkable tube 22 retracts, since there is a gap between the buffer portion 222 and the low-pass inner conductor 21, a certain retraction buffer space can be provided for the heat shrinkable tube 22, so the heat shrinkable tube 22 will not be damaged due to heat shrinkage.

[0060] This embodiment has at least the following beneficial effects: when assembling the low-pass structure 20, since the buffer portion 222 of the heat shrinkable tube 22 is in contact with and deformed in the cavity 23, and the annular portion 221 is in contact with and deformed in the low-pass inner conductor 23, when the heat shrinkable tube 22 retracts, the deformation of the buffer portion 222 and the annular portion 221 is released, so that the heat shrinkable tube 22 can still be firmly assembled in the cavity 23, thereby avoiding the problem of loose assembly caused by the retraction of the heat shrinkable tube 22. In addition, the retraction buffer space is left between the buffer portion 222 of the heat shrinkable tube 22 and the low-pass inner conductor 21, so the heat shrinkable tube 22 will not be damaged due to retraction.

[0061] The embodiment of the present application further provides a filter, which includes the above-mentioned low-pass structure 20.

[0062] An embodiment of the present application further provides a communication device, which includes the above-mentioned low-pass structure 20.

[0063] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A low-pass structure, characterized in that: The low-pass structure comprises: A low-pass inner conductor and a heat shrink sleeve sleeved on the low-pass inner conductor, wherein the heat shrink sleeve is assembled in the cavity of the filter; The heat shrinkable sleeve at least comprises an annular portion and a buffer portion, wherein the buffer portion is arranged to be raised relative to the annular portion, and the buffer portion is used to obtain an assembly buffer space when the heat shrinkable sleeve is assembled. The buffer portion is disposed between two adjacent annular portions, and a thickness of the buffer portion is equal to a thickness of the annular portion, wherein a curvature of the buffer portion is greater than a curvature of the annular portion.

2. The low-pass structure according to claim 1, characterized in that: The cross-sectional shape of the buffer portion is an arc shape, the outer diameter of the buffer portion and the outer diameter of the annular portion are arc shapes, and the length of the outer diameter of the buffer portion is smaller than the length of the outer diameter of the annular portion.

3. The low-pass structure according to claim 1, characterized in that: The annular portion is recessed toward the inner cavity of the heat shrinkable sleeve.

4. A filter, characterized in that: The filter comprises the low-pass structure according to any one of claims 1 to 3.

5. A communication device, characterized in that: The communication device comprises the low-pass structure according to any one of claims 1 to 3.

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