A fully automatic wafer film ring cutting device

Abstract

The present invention discloses a fully automatic wafer film ring cutting device, which relates to the field of semiconductor technology, and aims to solve the technical problems of low efficiency and low safety factor when sticking film on the surface of wafer patch ring and performing ring cutting. The key points of its technical solution are: it includes a workbench, characterized in that: a film feeding box and a pulling device are respectively provided at both ends of the workbench; a loading device and a ring cutting device are provided above the workbench, and a unloading device is provided below the workbench; the loading device is close to the film feeding box, the ring cutting device is close to the pulling device, and the unloading device is located below the ring cutting device. The purpose of the present invention is to provide a fully automatic wafer film ring cutting device with high efficiency in sticking and ring cutting and a higher safety factor in operation.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a fully automatic wafer adhesive film ring cutting device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8 inches and 12 inches.

[0003] In semiconductor wafer processing, a wafer bonding ring is used. A layer of film (mostly blue film) is first pasted on one of the surfaces of the wafer bonding ring, and then the excess film is cut off with a knife. The wafer bonding ring is fixed to the wafer with the film to facilitate the smooth progress of subsequent processing operations. The film can also prevent the wafer bonding ring from scratching the wafer. However, nowadays, most of the operations are done by manual pasting and ring cutting, which not only has low efficiency, but also has the risk of scratching workers' fingers.

[0004] Therefore, a new technical solution is urgently needed to solve the above technical problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the object of the present invention is to provide a fully automatic wafer film ring cutting device with high efficiency in pasting and ring cutting and a higher operating safety factor.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: a fully automatic wafer film circular cutting device, comprising a workbench, wherein a film feeding box and a pulling device are respectively arranged at both ends of the workbench; a loading device and a circular cutting device are arranged above the workbench, and a unloading device is arranged below the workbench; the loading device is close to the film feeding box, the circular cutting device is close to the pulling device, and the unloading device is located below the circular cutting device;

[0007] The film feeding box comprises a box body and a box cover, a film feeding hole is provided on one side of the box body close to the pulling device, a film feeding rod is provided in the box body, two ends of the film feeding rod are respectively fixed to the inner wall of the box body, a film feeding shaft is sleeved on the outer wall of the film feeding rod for rotation therewith, and a film roll is sleeved on the outer wall of the film feeding shaft;

[0008] The pulling device comprises two fixed columns, a pulling rod and a pulling motor, wherein the fixed columns are fixed to the workbench, the two sides of the pulling rod are rotatably connected to the two fixed columns respectively, and one end of the pulling rod is fixed to the rotating shaft end of the pulling motor;

[0009] A groove is provided on the workbench below the circular cutting device, an opening and closing plate is provided in the groove, and the opening and closing plate is hingedly connected to the inner wall of the groove;

[0010] The side wall of the workbench is provided with a driving device for controlling the opening and closing of the opening and closing plate.

[0011] The present invention is further configured as follows: the feeding device comprises a feeding box, a discharging box, a feeding column and a feeding cylinder;

[0012] The feeding box and the feeding column are respectively fixed to the two sides of the workbench, the feeding cylinder is arranged on the side of the feeding box away from the feeding column, and a push plate is fixed on its telescopic end, the feeding box is provided with a push groove for the push plate to pass through, and the push groove runs through the feeding box;

[0013] One end of the discharge box is fixed to the loading box, and the other end is fixed to the loading column. An L-shaped discharge trough is arranged in the discharge box. The L-shaped discharge trough includes an upper trough and a lower trough. The upper trough passes through the push trough, and the lower trough passes through the side of the discharge box close to the workbench.

[0014] The present invention is further configured as follows: the side wall of the discharge box is provided with an opening and closing groove, and the opening and closing groove penetrates into the lower channel; the side wall of the discharge box is provided with an opening and closing cylinder, and the telescopic end of the opening and closing cylinder extends to the lower channel and is fixed with a discharge plate.

[0015] The present invention is further configured as follows: a suction groove penetrating into the lower trough is provided on the side of the discharge box away from the workbench, a suction fan is provided in the suction groove, the suction fan includes a suction hole and an air outlet hole, the suction hole faces the lower trough, and the air outlet hole faces the outside of the discharge box.

[0016] The present invention is further configured as follows: the circular cutting device comprises a gantry, a lifting cylinder, a motor plate, a circular cutting motor, a knife holder and a film cutting knife;

[0017] The gantry frame includes a vertical rod and a horizontal rod, the two vertical rods are respectively fixed to the two sides of the workbench, the horizontal rod is provided with a cylinder groove running through it from top to bottom, and a lifting cylinder is provided on the side of the horizontal rod away from the workbench, and the telescopic end of the lifting cylinder runs through the cylinder groove and is fixed to the motor plate;

[0018] The circular cutting motor is fixed to the motor plate, and its rotating end is fixed to the knife holder, and the film cutting knife is fixed to the knife holder.

[0019] The present invention is further configured as follows: the number of the film cutting knives is three, and the film cutting knives are arranged equidistantly around the circumference.

[0020] The present invention is further configured as follows: a knife groove for fixing the film cutting knife is provided on a side of the knife holder away from the circular cutting motor, the knife groove extends toward the center of the knife holder, and the knife holders are arranged in three rows at even distances around the center of the knife holder.

[0021] The present invention is further configured as follows: the material unloading device comprises a material unloading channel and a material unloading box, one end of the material unloading channel is fixed to the workbench, and the inner channel thereof wraps the groove;

[0022] The side wall of the material discharge channel is provided with an arc groove extending therein, and the driving device is a driving rod, which passes through the arc groove and is inserted into the material discharge channel, and the driving rod placed in the material discharge channel is fixed with a connecting plate, and the other end of the connecting plate is fixed to the opening and closing plate.

[0023] The present invention is further configured as follows: a pulley is provided at the bottom of the unloading box, and the number of the pulleys is four.

[0024] The present invention has the following beneficial effects: 1. Through the cooperation of structures such as the film feeding box and the pulling device, the equipment can realize fully automatic pasting and ring cutting functions without the user having to put his hands close to operate. Therefore, while improving the efficiency of wafer pasting and ring cutting, it also eliminates the risk of operator injury.

[0025] 2. After the wafer is pushed to the discharge box, it will fall directly from the L-shaped discharge chute. At this time, the wafer may fall crookedly. By setting the discharge plate, the wafer can be pushed onto the discharge plate first, and then the discharge plate can be pulled away by opening and closing the cylinder, so as to realize the vertical drop of the wafer, thereby ensuring the subsequent precise processing of the wafer.

[0026] 3. By setting up the suction fan, the wafer can be first sucked by the suction fan, then the unloading plate is pulled out, and then the suction fan is turned off to make the wafer fall vertically. This can minimize the impact of other structures (such as the unloading plate) on the falling path of the wafer when it is pulled open, thereby further ensuring the subsequent precise processing of the wafer.

[0027] 4. Through the setting of the unloading device, users can choose manual or fully automatic unloading according to their budget. At the same time, after unloading, the wafer patches fall into the unloading box. The user pushes the unloading box to send the wafer patches to the installation site for installation, so as to achieve the purpose of convenience for users.

[0028] 5. Through the setting of the knife groove, the user can select the size of the circular cutting to adapt to the circular cutting of the adhesive film of wafers of different sizes, so as to achieve the purpose of adjustable circular cutting size. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a three-dimensional diagram of this embodiment;

[0030] Figure 2 This is a schematic diagram of the internal structure of the film delivery box of this embodiment;

[0031] Figure 3 This is a sectional stereoscopic view of the discharge box structure after the opening and closing cylinder of this embodiment is removed;

[0032] Figure 4 for Figure 3 A schematic diagram of the enlarged structure of the G portion;

[0033] Figure 5 It is a sectional stereoscopic view of part of the workbench and the material discharge channel of this embodiment;

[0034] Figure 6 This is a schematic diagram of the structure of the suction fan of this embodiment;

[0035] Figure 7 Schematic diagram of the plan view of the tool holder of this embodiment.

[0036] Description of the drawings: 1. Workbench;

[0037] 2. film delivery box; 201. box body; 202. box cover;

[0038] 3. Pulling device; 301. Fixed column; 302. Pulling rod; 303. Pulling motor;

[0039] 4. Feeding device; 401. Feeding box; 402. Discharging box; 403. Feeding column; 404. Feeding cylinder;

[0040] 5. Circular cutting device; 501. Gantry; 5011. Crossbar; 5012. Vertical bar; 503. Motor plate; 504. Circular cutting motor; 505. Knife holder; 506. Film cutting knife;

[0041] 6. Unloading device; 601. Unloading channel; 602. Unloading box;

[0042] 7. Film delivery hole; 8. Film delivery rod; 9. Film delivery shaft; 10. Film roll; 11. Groove; 12. Opening and closing plate; 13. Driving rod; 14. Push plate; 15. Push groove;

[0043] 16. L-shaped discharge chute; 1601. upper chute; 1602. lower chute;

[0044] 18. Opening and closing cylinder; 19. Unloading plate; 20. Air suction slot;

[0045] 21. Suction fan; 2101. Air suction hole; 2102. Air outlet hole;

[0046] 22. Cylinder groove; 25. Arc groove; 27. Connecting plate. DETAILED DESCRIPTION

[0047] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0048] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0049] As shown in the figure, a fully automatic wafer film circular cutting device comprises a workbench 1, both ends of the workbench 1 are provided with a storage table, and the storage table is respectively provided with an L-shaped film feeding box 2 and a pulling device 3; a loading device 4 and a circular cutting device 5 are provided above the workbench 1, and a unloading device 6 is provided below the workbench 1; the loading device 4 is close to the film feeding box 2, the circular cutting device 5 is close to the pulling device 3, and the unloading device 6 is located below the circular cutting device 5;

[0050] The film feeding box 2 includes a box body 201 and a box cover 202. A film feeding hole 7 is provided on one side of the box body 201 close to the pulling device 3. A film feeding rod 8 is provided inside the box body 201. Both ends of the film feeding rod 8 are respectively threadedly connected to the inner wall of the box body 201. The outer wall of the film feeding rod is covered with a film feeding shaft 9 rotatably connected thereto. The outer cover of the film feeding shaft 9 is covered with a film roll 10.

[0051] The pulling device 3 includes two fixed columns 301, a pulling rod 302 and a pulling motor 303. The fixed column 301 is fixed to the workbench 1. Both sides of the pulling rod 302 are respectively inserted into the two fixed columns 301 and are rotatably connected thereto. One end of the pulling rod 302 is threadedly connected to the rotating shaft end of the pulling motor 303.

[0052] The workbench 1 located below the circular cutting device 5 is provided with a groove 11, and an opening and closing plate 12 is provided in the groove 11. The opening and closing plate 12 is hingedly connected to the inner wall of the groove 11 close to the film feeding box 2.

[0053] A driving device for controlling the opening and closing of the opening and closing plate 12 is disposed on the side wall of the workbench 1 .

[0054] The feeding device 4 includes a feeding box 401, a discharging box 402, a feeding column 403 and a feeding cylinder 404;

[0055] The loading box 401 and the loading column 403 are respectively fixed to the two sides of the upper end surface of the workbench 1, the loading cylinder 404 is arranged on the side of the loading box 401 away from the loading column 403, and a push plate 14 is fixed to its telescopic end, the loading box 401 is provided with a push groove 15 for the push plate 14 to pass through, the push groove 15 runs through the loading box 401, and a space for the push plate 14 to be placed is provided inside the loading cylinder 404, and the push plate 14 can be retracted to the internal space of the loading cylinder 404 by the telescopic end of the loading cylinder 404;

[0056] One end of the discharge box 402 is fixed to the loading box 401, and the other end is fixed to the loading column 403. An L-shaped discharge trough 16 is arranged in the discharge box 402. The L-shaped discharge trough 16 includes an upper trough 1601 and a lower trough 1602. The upper trough 1601 passes through the push groove 15, and the lower trough 1602 passes through the side of the discharge box 402 close to the workbench 1; the upper trough 1601 can only pass one wafer patch;

[0057] The side wall of the discharge box 402 is provided with an opening and closing groove, which penetrates to the lower channel 1602; the side wall of the discharge box 402 is provided with an opening and closing cylinder 18, the telescopic end of the opening and closing cylinder 18 extends to the lower channel 1602 and is fixed with a discharge plate 19, and a space for placing the discharge plate 19 is provided inside the opening and closing cylinder 18, and the discharge plate 19 can be retracted to the internal space of the opening and closing cylinder 18 by the telescopic end of the opening and closing cylinder 18;

[0058] A suction groove 20 penetrating into the lower groove 1602 is provided on the side of the discharge box 402 away from the workbench 1. A suction fan 21 is provided in the suction groove 20. The suction fan 21 includes a suction hole 2101 and an air outlet hole 2102. The suction hole 2101 faces the lower groove 1602, and the air outlet hole 2102 faces the outside of the discharge box 402.

[0059] The circular cutting device 5 includes a gantry 501, a lifting cylinder, a motor plate 503, a circular cutting motor 504, a knife holder 505 and a film cutting knife 506;

[0060] The gantry 501 includes a vertical rod and a horizontal rod. The two vertical rods are respectively fixed to the two sides of the workbench 1. The horizontal rod is provided with a cylinder groove 22 that passes through the vertical direction. A lifting cylinder is provided on the side of the horizontal rod away from the workbench 1. The telescopic end of the lifting cylinder passes through the cylinder groove 22 and is fixed to the motor plate 503.

[0061] The circular cutting motor 504 is fixed to the motor plate 503 , and its rotating end is fixed to the knife holder 505 , and the film cutting knife is fixed to the knife holder 505 .

[0062] There are three film cutting knives 506 , which are arranged in a circle equidistant from the center of the knife holder 505 .

[0063] A knife groove for fixing the film cutting knife 506 is provided on one side of the knife holder 505 away from the circular cutting motor 504 . The knife groove extends toward the center of the knife holder 505 and is evenly spaced in three rows around the center of the knife holder 505 .

[0064] The material discharge device 6 comprises a material discharge channel 601 and a material discharge box 602. One end of the material discharge channel 601 is fixed to the workbench 1, and the inner channel thereof wraps the groove 11.

[0065] The side wall of the material discharge channel 601 is provided with an arc groove 25 extending therein, (1) the driving device is a driving rod 13, the driving rod 13 passes through the arc groove 25 and is inserted into the material discharge channel 601, and the driving rod 13 placed in the material discharge channel 601 is fixed with a connecting plate 27, and the other end of the connecting plate 27 is fixed to the opening and closing plate 12.

[0066] (2) The driving device may also be a rotary cylinder, which is arranged on one side of the workbench 1 close to the arc groove 25. A rotating rod is fixed to the rotating section of the rotary cylinder. The rotating rod passes through the arc groove 25 and is fixed with a connecting plate 27. The other end of the connecting plate 27 is fixed to the opening and closing plate 12.

[0067] The above two different driving devices correspond to the manual unloading method and the fully automatic unloading method respectively. Users can choose and customize according to economic conditions.

[0068] The bottom of the unloading box 602 is provided with four pulleys.

[0069] Working principle: (1) Before starting work, the user needs to put the film onto the film feeding shaft 9, then pull a section of the film to and roll it onto the pulling rod 302, with the sticky side of the film roll 10 facing upwards; at the same time, the user needs to stack a certain number of wafer patches into the loading box 401.

[0070] (2) The pulling motor 303 is started, and the pulling motor 303 rolls up the film roll 10, and the film roll 10 moves toward the pulling motor 303;

[0071] (3) The loading cylinder 404 pushes a wafer into the L-shaped channel, and the wafer passes through the upper groove 1601 to the unloading plate 19 of the lower groove 1602;

[0072] (4) The suction fan 21 is started and absorbs the wafer. After the absorption is completed, the opening and closing cylinder 18 opens the unloading plate 19. After the unloading plate 19 is fully opened, the suction fan 21 stops the absorption, and the unloading plate 19 falls to the sticky side of the film roll 10 and is stuck;

[0073] (5) The wafer continues to move along with the film roll 10, and when it reaches the bottom of the knife holder, the pulling motor 303 stops pulling, and the lifting motor pushes the knife holder 505 downward, and the knife holder presses the wafer down, and after pressing, the circular cutting motor 504 rotates the knife holder 505, and the film cutting knife 506 circularly cuts the film roll 10;

[0074] (6) After the film cutting knife 506 is completed, it is pulled up by the lifting cylinder. At the same time, the user can open the clamping plate 12 through the driving rod 13 or the rotary motor, and the wafer will fall into the unloading box 602 along the unloading channel 601;

[0075] (7) After closing the opening and closing plate 12, continue to start the pulling motor 303, and then repeat the above steps.

[0076] Through the cooperation of structures such as the film feeding box 2 and the pulling device 3, the equipment can realize fully automatic pasting and ring cutting functions without the user having to put his hands close to operate. Therefore, while improving the efficiency of wafer pasting and ring cutting, it also eliminates the risk of operator injury.

[0077] After the wafer is pushed to the discharge box 402, it will fall directly from the L-shaped discharge slot 16. At this time, the wafer may fall crookedly. By setting the discharge plate 19, the wafer can be pushed onto the discharge plate 19 first, and then the discharge plate 19 can be pulled away by the opening and closing cylinder 18, so as to realize the vertical drop of the wafer, thereby ensuring the subsequent precise processing of the wafer.

[0078] By setting the suction fan 21, the wafer can be first sucked by the suction fan 21, and then the unloading plate 19 is pulled out, and then the suction fan 21 is turned off to make the wafer fall vertically. The influence of other structures (such as the unloading plate 19) on the falling path of the wafer when being pulled open can be minimized, thereby further ensuring the subsequent precise processing of the wafer.

[0079] Through the setting of the unloading device 6, the user can choose manual or fully automatic unloading according to the budget. After unloading, the wafer patches fall into the unloading box 602. The user pushes the unloading box 602 to send the wafer patches to the installation site for installation.

[0080] By setting the knife groove, the user can select the size of the circular cutting circle to adapt to the circular cutting of the adhesive film of wafers of different sizes.

[0081] The specific embodiments are merely explanations of the present invention and are not limitations of the present invention. After reading this specification, those skilled in the art may make modifications to the embodiments without any creative contribution as needed. However, such modifications are protected by the patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A fully automatic wafer film ring cutting device, comprising a workbench (1), Features: The two ends of the workbench (1) are respectively provided with a film feeding box (2) and a pulling device (3); a loading device (4) and a circular cutting device (5) are provided above the workbench (1), and a unloading device (6) is provided below the workbench (1); the loading device (4) is close to the film feeding box (2), the circular cutting device (5) is close to the pulling device (3), and the unloading device (6) is located below the circular cutting device (5); The film delivery box (2) comprises a box body (201) and a box cover (202); a film delivery hole (7) is provided on one side of the box body (201) close to the pulling device (3); a film delivery rod (8) is provided inside the box body (201); two ends of the film delivery rod (8) are respectively fixed to the inner wall of the box body (201); an outer wall of the film delivery rod (8) is sleeved with a film delivery shaft (9) rotatably connected thereto; and an outer sleeve of the film delivery shaft (9) is sleeved with a film roll (10); The pulling device (3) comprises two fixed columns (301), a pulling rod (302) and a pulling motor (303); the fixed columns (301) are fixed to the workbench (1); both sides of the pulling rod (302) are rotatably connected to the two fixed columns (301) respectively; one end of the pulling rod (302) is fixed to the rotating shaft end of the pulling motor (303); A working table located below the circular cutting device (5) is provided with a groove (11), an opening and closing plate (12) is provided in the groove (11), and the opening and closing plate (12) is hingedly connected to the inner wall of the groove (11); A driving device for controlling the opening and closing of the opening and closing plate (12) is provided on one side of the workbench (1); The feeding device (4) comprises a feeding box (401), a discharging box (402), a feeding column (403) and a feeding cylinder (404); The loading box (401) and the loading column (403) are respectively fixed to two sides of the workbench (1); the loading cylinder (404) is arranged on a side of the loading box (401) away from the loading column (403), and a push plate (14) is fixed to its telescopic end; the loading box (401) is provided with a push groove (15) for the push plate (14) to pass through, and the push groove (15) runs through the loading box (401); One end of the discharge box (402) is fixed to the loading box (401), and the other end is fixed to the loading column (403); an L-shaped discharge trough (16) is provided in the discharge box (402); the L-shaped discharge trough (16) comprises an upper trough (1601) and a lower trough (1602); the upper trough (1601) passes through the push groove (15), and the lower trough (1602) passes through a side of the discharge box (402) close to the workbench (1); The side wall of the discharge box (402) is provided with an opening and closing groove, and the opening and closing groove extends through the lower channel (1602); the side wall of the discharge box (402) is provided with an opening and closing cylinder (18), and the telescopic end of the opening and closing cylinder (18) extends to the lower channel (1602) and is fixed with a discharge plate (19); The circular cutting device (5) comprises a gantry (501), a lifting cylinder, a motor plate (503), a circular cutting motor (504), a knife rest (505) and a film cutting knife (506); The gantry (501) comprises a vertical rod (5012) and a horizontal rod (5011), the two vertical rods (5012) are respectively fixed to two sides of the workbench (1), the horizontal rod (5011) is provided with a cylinder groove (22) penetrating up and down, and a lifting cylinder is provided on a side of the horizontal rod (5011) away from the workbench (1), and the telescopic end of the lifting cylinder penetrates the cylinder groove (22) and is fixed to the motor plate (503); The circular cutting motor (504) is fixed to the motor plate (503), and its rotating end is fixed to the knife holder (505), and the film cutting knife (506) is fixed to the knife holder (505).

2. A fully automatic wafer film ring cutting device according to claim 1, Features: A suction groove (20) extending through the lower channel (1602) is provided on a side of the discharge box (402) away from the workbench (1); a suction fan (21) is provided in the suction groove (20); the suction fan (21) comprises a suction hole (2101) and an air outlet hole (2102); the suction hole (2101) faces the lower channel (1602), and the air outlet hole (2102) faces the outside of the discharge box (402).

3. The fully automatic wafer film ring cutting device according to claim 1, Features: The number of the film cutting knives (506) is three, and the film cutting knives (506) are arranged equidistantly around the circumference.

4. The fully automatic wafer film ring cutting device according to claim 1, Features: A knife groove for fixing the film cutting knife (506) is provided on one side of the knife holder (505) away from the circular cutting motor (504), the knife groove extending towards the center of the knife holder (505), and the knife grooves are arranged in three rows at even distances around the center of the knife holder (505).

5. The fully automatic wafer film ring cutting device according to claim 1, Features: The material discharge device (6) comprises a material discharge channel (601) and a material discharge box (602); one end of the material discharge channel (601) is fixed to the workbench (1), and the inner channel thereof wraps around the groove (11); The side wall of the material discharge channel (601) is provided with an arc-shaped groove (25) extending therein, and the driving device is a driving rod (13). The driving rod (13) passes through the arc-shaped groove (25) and is inserted into the material discharge channel (601), and the driving rod (13) disposed in the material discharge channel (601) is fixed with a connecting plate (27), and the other end of the connecting plate (27) is fixed to the opening and closing plate (12).

6. The fully automatic wafer film ring cutting device according to claim 5, Features: The bottom of the unloading box (602) is provided with pulleys, and the number of the pulleys is four.

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