Control and monitoring system of solid-state switch for high-voltage pulse power supply of excimer laser

Abstract

The present disclosure provides a control and monitoring system for a solid-state switch of a high-voltage pulse power supply of an excimer laser, comprising: an environmental signal acquisition and processing unit, for acquiring the working environment signal of the excimer laser, and forming an environmental state monitoring signal; a multi-channel state interlocking unit, connected to the environmental signal acquisition and processing unit, for latching the environmental state monitoring signal, and outputting an interlocking level signal and a state upload signal; an MCU main control unit, connected to the multi-channel state interlocking unit, for receiving and processing the state upload signal; a pulse trigger output unit, connected to the multi-channel state interlocking unit, for receiving a previous stage trigger pulse signal, and controlling the on and off of the solid-state switch according to the interlocking level signal output by the multi-channel state interlocking unit. The present disclosure can accurately control and monitor the power supply state of the laser each time it triggers light, and immediately interlock the output when an abnormality occurs, thereby protecting the reliable operation of the laser high-voltage pulse power supply.

Description

Technical Field

[0001] The present disclosure relates to the field of excimer lasers, and in particular to a solid-state switch control and monitoring system for a high-voltage pulse power supply of an excimer laser. Background Art

[0002] Excimer laser is a pulsed gas laser for deep ultraviolet characteristic applications. It has the characteristics of high repetition rate, high energy, short wavelength, narrow line width, etc. It is an excellent laser light source for lithography systems. Among them, the solid-state switch is an important component of the laser high-voltage pulse power supply, which can invert the high-voltage DC voltage into the primary pulse high-voltage signal required for laser discharge.

[0003] With the development of excimer lasers, higher requirements are placed on the stable and reliable operation of solid-state switches of high-voltage pulse power supplies. The primary pulse high-voltage signal V generated by the solid-state switch C0 , an amplitude that is too high will cause overvoltage damage to the main circuit switching device IGBT or diode, and an amplitude that is too low will cause incomplete breakdown of the laser discharge cavity and too low light output energy. At the same time, when the excimer laser discharges at a high repetition rate, the core components inside the high-voltage pulse power supply will heat up significantly, and overheating of the components will also cause the high-voltage pulse power supply to operate unstably. Therefore, there is an urgent need for a system that can accurately control and monitor the power supply status of the excimer laser each time it is triggered to emit light, so as to meet the excimer laser's requirements for the performance of each module and its service life, and protect the laser's high-voltage pulse power supply for reliable operation. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] The present disclosure provides a control and monitoring system for a solid-state switch of a high-voltage pulse power supply for an excimer laser, so as to at least partially solve the technical problems mentioned above.

[0006] (II) Technical solution

[0007] According to one aspect of the present disclosure, a control and monitoring system for a solid-state switch of an excimer laser high-voltage pulse power supply is provided, comprising:

[0008] A control and monitoring system for a solid-state switch of a high-voltage pulse power supply for an excimer laser, comprising:

[0009] An environmental signal acquisition and processing unit, used to acquire the operating environment signal of the excimer laser and form an environmental status monitoring signal;

[0010] A multi-channel state interlocking unit, connected to the environmental signal acquisition and processing unit, for latching the environmental state monitoring signal and outputting an interlocking level signal and a state upload signal; and

[0011] An MCU main control unit, connected to the multi-channel state interlocking unit, for receiving and processing the state upload signal;

[0012] The pulse trigger output unit is connected to the multi-channel state interlocking unit, and is used to receive the front-stage trigger pulse signal of the solid-state switch of the high-voltage pulse power supply, and control the on and off of the solid-state switch according to the interlocking level signal output by the multi-channel state interlocking unit.

[0013] In some embodiments, the environmental signal acquisition and processing unit includes: one or more of a pulse voltage signal acquisition and processing unit, a temperature signal acquisition and processing unit, a pulse current signal acquisition and processing unit, and a leakage signal acquisition and processing unit.

[0014] In some embodiments, the pulse voltage signal acquisition and processing unit includes:

[0015] A pulse voltage signal acquisition circuit, used for acquiring the pulse voltage of the solid-state switch;

[0016] A first comparison circuit is connected to the pulse voltage signal acquisition circuit and outputs a voltage state monitoring signal. The first comparison circuit includes:

[0017] A pulse voltage over-high comparison circuit, used for comparing the pulse voltage with a predetermined upper limit value; and / or

[0018] A pulse voltage too low comparison circuit, used for comparing the pulse voltage with a predetermined lower limit value; and / or

[0019] The pulse voltage reverse voltage over-high comparison circuit is used to compare the reverse voltage of the pulse voltage with a predetermined upper limit value.

[0020] In some embodiments, a voltage divider circuit and a voltage follower are connected in sequence between the pulse voltage signal acquisition circuit and the first comparison circuit.

[0021] In some embodiments, the pulse voltage too low comparison circuit is a pulse enable comparison circuit, and when a TTL pulse trigger signal is received, the pulse voltage too low comparison circuit operates.

[0022] In some embodiments, the multi-way state interlocking unit includes:

[0023] A signal interlock circuit, used for receiving and latching the voltage state monitoring signal output by the pulse voltage signal acquisition and processing unit, and outputting an interlock level signal and a state upload signal;

[0024] A hardware power-on reset circuit, connected to the signal interlock circuit, for generating a narrow pulse edge when the system is powered on to reset and initialize the signal interlock circuit, and / or

[0025] The software-triggered reset circuit is connected to the signal interlock circuit and is used to receive the MCU reset signal and control the signal interlock circuit to reset when the system is working.

[0026] In some embodiments, the MCU main control unit includes:

[0027] An optical coupling isolation circuit connected to the output end of the multi-channel state interlocking unit;

[0028] The MCU main control chip is connected to the optical coupling isolation circuit and processes the status upload signal;

[0029] The isolated transceiver circuit is connected to the MCU main control chip and is used for communicating with the host computer.

[0030] In some embodiments, the MCU main control chip converts the received signal into a CANBUS signal and outputs it to the host computer.

[0031] In some embodiments, the temperature signal acquisition and processing unit is used to acquire multiple temperature states of the high-voltage pulse power supply, and output a temperature state monitoring signal through a second comparison circuit.

[0032] In some embodiments, the second comparison circuit includes: at least one of a magnetic core over-temperature comparison circuit, a housing over-temperature comparison circuit, a water cooling plate over-temperature comparison circuit, and a main control board over-temperature comparison circuit.

[0033] (III) Beneficial effects

[0034] It can be seen from the above technical solutions that the solid-state switch control and state monitoring system for high-voltage pulse power supply of excimer laser disclosed in the present invention has at least one of the following beneficial effects:

[0035] (1) By monitoring the voltage of the solid-state switch of the high-voltage pulse power supply of the excimer laser, the stable output of the primary pulse high-voltage signal generated by the solid-state switch is achieved, thereby ensuring the high repetition rate and stable discharge of the laser high-voltage pulse power supply to form microsecond narrow pulses;

[0036] (2) It can collect the temperature status signal of the high-voltage pulse power supply of the excimer laser in real time, perform status monitoring, and prevent the high-voltage pulse power supply from unstable operation due to overheating of the device;

[0037] (3) It has a reliable output logic interlocking mechanism and dual software and hardware reset functions to ensure the stable and reliable operation of the high repetition rate of the excimer laser solid-state switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a structural schematic diagram of a solid-state switch control and state monitoring system for a high-voltage pulse power supply of an excimer laser according to an embodiment of the present disclosure.

[0039] Figure 2 It is a schematic diagram of the structure of a multi-way state interlocking unit according to an embodiment of the present disclosure.

[0040] Figure 3 The schematic diagram of the structure of the solid-state switch control and state monitoring system of the high-voltage pulse power supply of the excimer laser is another example.

[0041] Figure 4 It is a schematic diagram of the structure of the pulse voltage signal acquisition and processing unit according to an embodiment of the present disclosure.

[0042] Figure 5 It is a schematic diagram of the structure of the temperature signal acquisition and processing unit according to an embodiment of the present disclosure.

[0043] Figure 6 This is a schematic diagram of the structure of the MCU main control unit of the embodiment of the present disclosure.

[0044] [Description of the main component symbols of the embodiment of the present disclosure in the accompanying drawings]

[0045] 10. Pulse trigger output unit; 20. Environmental signal acquisition unit; 30. Multi-channel state interlocking unit; 40. MCU main control unit; 210. Pulse voltage signal acquisition and processing unit; 211. Pulse voltage signal acquisition circuit; 212. Pulse voltage too high comparison circuit; 213. Pulse voltage too low comparison circuit; 214. Pulse voltage reverse voltage too high comparison circuit; 220. Temperature signal acquisition and processing unit; 221. Core over-temperature comparison circuit; 222. Case over-temperature comparison circuit; 223. Water-cooled plate over-temperature comparison circuit; 224. Main control board over-temperature comparison circuit; 230. Pulse current signal acquisition and unit; 240. Leakage signal acquisition and unit; 301. Hardware power-on reset circuit; 302. Signal interlocking circuit; 303. Software trigger reset circuit; 401. Optocoupler isolation circuit; 402. MCU main control chip; 403. Isolation transceiver circuit. DETAILED DESCRIPTION

[0046] The present invention provides a solid-state switch control and state monitoring system for a high-voltage pulse power supply of an excimer laser, which can accurately control and monitor the power supply state of the laser each time it is triggered to emit light. When an abnormality occurs, the output is immediately interlocked, an alarm signal is generated, and the monitoring state is uploaded to a host computer, so as to protect the reliable operation of the high-voltage pulse power supply of the laser.

[0047] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0048] Certain embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, some but not all of which will be shown. In fact, the various embodiments of the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure satisfies applicable legal requirements.

[0049] In an exemplary embodiment of the present disclosure, a solid-state switch control and state monitoring system for a high-voltage pulse power supply for an excimer laser is provided.

[0050] Figure 1 Schematic diagram of the structure of the solid-state switch control and state monitoring system for high-voltage pulse power supply of excimer laser according to the embodiment of the present disclosure. Figure 1 As shown, the solid-state switch control and state monitoring system of the high-voltage pulse power supply of this embodiment includes a pulse trigger output unit 10, an environmental signal acquisition and processing unit 20, a multi-channel state interlocking unit 30 and an MCU main control unit 40.

[0051] The system monitors the working environment status of the laser through the environmental signal acquisition and processing unit 20. When any one or more abnormal states are detected, the multi-channel state interlocking unit 30 immediately interlocks the output and uploads it to the host computer. The interlocking level signal is sent to the pulse trigger output unit 10 to control the on and off of the solid-state switch, thereby protecting the reliable operation of the laser high-voltage pulse power supply.

[0052] Figure 2 FIG. 3 is a schematic diagram of the structure of the multi-way state interlocking unit 30 according to an embodiment of the present disclosure. Figure 2 As shown, the multi-channel interlocking unit 30 includes a signal interlocking circuit 302, a hardware power-on reset circuit 301 and a software trigger reset circuit 303. The signal interlocking circuit 302 receives the state monitoring signal of the environmental signal acquisition and processing unit 80, which can convert the TTL edge trigger signal output by the comparator into a high and low level signal, and is divided into two paths for output, one of which forms an interlocking level signal and is transmitted to the pulse trigger output unit 10, and the other forms a state upload signal and is transmitted to the MCU main control unit 40 for state monitoring.

[0053] The hardware power-on reset circuit 301 can generate a narrow pulse edge when the system is powered on to reset and initialize the signal interlock circuit, and / or the software triggered reset circuit 302 can receive the MCU reset signal when the system is working to control the signal interlock circuit 302 to reset.

[0054] The status monitoring signal of the environmental signal acquisition and processing unit 20 can be one or more of the voltage status signal collected by the pulse voltage signal acquisition and processing unit 210, the temperature status signal collected by the temperature signal acquisition and processing unit 220, the current status signal collected by the pulse current signal acquisition and unit 230; and the liquid status signal collected by the leakage signal acquisition and unit 240.

[0055] Figure 3 FIG. 1 is a structural diagram of a solid-state switch control and state monitoring system for a high-voltage pulse power supply of an excimer laser as another example. Figure 3 As shown, the environmental signal acquisition and processing unit 20 may include a pulse voltage signal acquisition and processing unit 210, a temperature signal acquisition and processing unit 220, a pulse current signal acquisition and processing unit 230, and a leakage signal acquisition and processing unit 240. The following description is made by taking the pulse voltage signal acquisition and processing unit and the temperature signal acquisition and processing unit as examples.

[0056] Figure 4 Schematic diagram of the structure of the pulse voltage signal acquisition and processing unit according to the embodiment of the present disclosure. The pulse voltage signal acquisition and processing unit 210 is used to acquire the high-precision pulse voltage signal V of the solid-state switch. C0 , through the first comparison circuit, to form a pulse voltage state monitoring signal. Wherein, the first comparison circuit is a multi-channel comparison circuit, which is used to compare the pulse voltage signal V C0 Compare overvoltage, undervoltage and reverse overvoltage.

[0057] Specifically, the pulse high voltage passes through a high-precision and low-temperature drift circuit and enters the voltage follower. After isolation and following, it passes through a multi-channel comparator for overvoltage comparison, undervoltage comparison, and reverse overvoltage comparison to form a multi-channel voltage status monitoring signal. Figure 4 The pulse voltage signal acquisition and processing unit 210 includes a high-precision pulse voltage signal acquisition circuit 211 , a pulse voltage too high comparison circuit 212 , a pulse voltage too low comparison circuit 213 and a pulse voltage reverse voltage too high comparison circuit 214 .

[0058] The pulse voltage too low comparison circuit 213 is a pulse enable comparison circuit. When the pulse trigger output unit 210 receives a TTL narrow pulse trigger signal, the pulse voltage too low comparison circuit 213 operates.

[0059] By monitoring the primary pulse high voltage signal generated by the solid-state switch of the high-voltage pulse power supply of the excimer laser through the pulse voltage signal acquisition and processing unit 210, it is possible to avoid the problem that the primary pulse high voltage signal is too high, causing damage to the components in the solid-state switch and poor stability of the solid-state switch; or the primary pulse high voltage signal is too low, causing insufficient voltage of the high-voltage pulse power supply, incomplete breakdown of the laser discharge cavity, and ultimately causing the laser light output energy to be too low.

[0060] Since the voltage overvoltage or undervoltage of the high-voltage pulse power supply may be instantaneous high voltage or low voltage, it is necessary to latch each state signal through the multi-channel state interlocking unit 30 and convert the TTL pulse edge signal into a high and low level signal to realize the monitoring of each signal.

[0061] Figure 5 Schematic diagram of the structure of the temperature signal acquisition and processing unit of the embodiment of the present disclosure. The temperature signal acquisition and processing unit 220 is used to acquire the multi-channel temperature status of the high-voltage pulse power supply and form a temperature status monitoring signal through a comparison circuit. Figure 5 As shown, the temperature signal acquisition and processing unit 220 acquires the multi-channel temperature status of the high-voltage pulse power supply, and the second comparison circuit compares the acquired signals of each channel. The second comparison circuit includes a magnetic core over-temperature comparison circuit 221, a casing over-temperature comparison circuit 222, a water-cooled plate over-temperature comparison circuit 223, and a main control board over-temperature comparison circuit 224, which respectively compare the acquired magnetic core temperature, casing temperature, water-cooled plate temperature, and main control board temperature. Each channel of temperature signals is collected by the NTC thermistor at different monitoring points and converted into a voltage signal, and each passes through the temperature comparison circuit to form a multi-channel temperature status monitoring signal.

[0062] By setting up a temperature signal acquisition and processing unit 220, the temperature of the high-voltage pulse power supply is monitored, and signal transmission and interaction with the main control unit 40 and the multi-channel state interlocking unit 30 are performed, so as to avoid unstable operation of the high-voltage pulse power supply due to overheating.

[0063] In other embodiments, the environmental signal acquisition and processing unit 20 may also include a pulse current signal acquisition and processing unit 230 or a leakage signal acquisition and processing unit 240, wherein the pulse current signal acquisition and processing unit 230 is used to generate a primary pulse current monitoring signal; the leakage signal acquisition and processing unit 240 is used to generate a high-voltage pulse power supply leakage monitoring signal.

[0064] The signal collection and processing of the pulse current signal collection and unit 230 and the leakage signal collection and unit 240 are the same as the signal transmission and interaction between the above-mentioned pulse voltage signal collection and processing unit 210 and the temperature signal collection and processing unit 220 and the main control unit 40 and the multi-channel state interlocking unit 30, and will not be repeated here.

[0065] The MCU main control unit 40 is used to receive and process the status upload signal, communicate with the host computer, upload the status signal, and receive the host computer instruction set.

[0066] Figure 6 Schematic diagram of the structure of the MCU main control unit in the embodiment of the present disclosure. Figure 6As shown, the MCU main control unit 40 includes an optical coupling isolation circuit 401 , an MCU main control chip 402 , and an isolation transceiver circuit 403 .

[0067] In this embodiment, the state upload signal output by the multi-way interlocking unit 30 is transmitted to the MCU main control chip 402 through the optical coupling isolation circuit 401. The MCU main control chip 402 processes the signal and converts it into a CANBUS signal and outputs it to the host computer through the isolation transceiver circuit 403. At the same time, the main control chip 402 can receive the host computer multi-mode state monitoring switching instruction and software reset instruction, and transmit the software reset instruction to the multi-way interlocking unit 30 through the optical coupling isolation circuit 401. It can be understood that in this embodiment, the CANBUS bus is used to realize the connection between the MCU main control unit and the host computer. In other embodiments, other buses can also be used for transmission.

[0068] The present invention monitors the voltage of the solid-state switch of the high-voltage pulse power supply of the excimer laser, collects the temperature state signal of the high-voltage pulse power supply of the excimer laser in real time, performs state monitoring, and realizes the stable output of the primary pulse high-voltage signal generated by the solid-state switch, thereby ensuring the high repetition frequency stable discharge of the laser high-voltage pulse power supply to form microsecond narrow pulses; and is able to prevent the high-voltage pulse power supply from being unstable due to overheating of the device.

[0069] So far, the embodiments of the present disclosure have been described in detail in conjunction with the accompanying drawings. It should be noted that the implementation methods not shown or described in the drawings or the body of the specification are all forms known to ordinary technicians in the relevant technical field and are not described in detail. In addition, the above definitions of each element and method are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and ordinary technicians in the field can simply change or replace them.

[0070] Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0071] The ordinal numbers used in the specification and claims, such as "first", "second", "third", etc., to modify the corresponding elements, do not themselves mean that the elements have any ordinal numbers, nor do they represent the order of one element and another element, or the order in the manufacturing method. The use of these ordinal numbers is only used to clearly distinguish a component with a certain name from another component with the same name.

[0072] The present disclosure can be implemented by means of hardware including several different elements and by means of a suitably programmed computer. The various component embodiments of the present disclosure can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all functions of some or all components in the related equipment according to the embodiments of the present disclosure. The present disclosure can also be implemented as a device or apparatus program (e.g., computer program and computer program product) for executing part or all of the methods described herein. Such a program implementing the present disclosure can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0073] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and set in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition they may be divided into multiple submodules or subunits or subcomponents. All features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this manner may be combined in any combination, except that at least some of such features and / or processes or units are mutually exclusive. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose. Furthermore, in a unit claim that lists several devices, several of these devices may be embodied by the same hardware item.

[0074] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various disclosed aspects, in the above description of the exemplary embodiments of the present disclosure, the various features of the present disclosure are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the following intention: the claimed disclosure requires more features than the features explicitly recited in each claim. More specifically, as reflected in the claims below, the disclosed aspects are less than all the features of the single embodiment disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present disclosure.

[0075] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A control and monitoring system for a solid-state switch of a high-voltage pulse power supply for an excimer laser, comprising: An environmental signal collection and processing unit (20) is used to collect the working environment signal of the excimer laser and form an environmental status monitoring signal; The environmental signal acquisition and processing unit (20) comprises: a pulse voltage signal acquisition and processing unit (210); The pulse voltage signal acquisition and processing unit (210) comprises: A pulse voltage signal acquisition circuit (211), used for acquiring the pulse voltage of the solid-state switch; A first comparison circuit is connected to the pulse voltage signal acquisition circuit and outputs a voltage state monitoring signal. The first comparison circuit includes: A pulse voltage over-high comparison circuit (212), used for comparing the pulse voltage with a predetermined upper limit value; and / or A pulse voltage too low comparison circuit (213), used for comparing the pulse voltage with a predetermined lower limit value; and / or A pulse voltage reverse voltage over-high comparison circuit (214), used for comparing the reverse voltage of the pulse voltage with a predetermined upper limit value; A multi-channel state interlocking unit (30), connected to the environmental signal acquisition and processing unit (20), used for latching the environmental state monitoring signal and outputting an interlocking level signal and a state upload signal; and An MCU main control unit (40), connected to the multi-channel state interlocking unit (30), and used for receiving and processing the state upload signal; A pulse trigger output unit (10) is connected to the multi-channel state interlocking unit (30) and is used to receive a front-stage trigger pulse signal of a solid-state switch of a high-voltage pulse power supply, and to control the on and off of the solid-state switch according to an interlocking level signal output by the multi-channel state interlocking unit (30).

2. The control and monitoring system for the solid-state switch of the high-voltage pulse power supply for the excimer laser according to claim 1 is characterized in that: The environmental signal acquisition and processing unit (20) comprises: one or more of a temperature signal acquisition and processing unit (220), a pulse current signal acquisition and processing unit (230), and a liquid leakage signal acquisition and processing unit (240).

3. The control and monitoring system for the solid-state switch of the high-voltage pulse power supply of the excimer laser according to claim 2, characterized in that: A voltage divider circuit and a voltage follower are connected in sequence between the pulse voltage signal acquisition circuit (211) and the first comparison circuit.

4. The control and monitoring system for a solid-state switch of a high-voltage pulse power supply for an excimer laser according to claim 2 or 3, characterized in that: The pulse voltage too low comparison circuit (213) is a pulse enable comparison circuit, and when a TTL pulse trigger signal is received, the pulse voltage too low comparison circuit (213) operates.

5. The control and monitoring system for solid-state switch of high-voltage pulse power supply for excimer laser according to claim 1, characterized in that: The environmental signal acquisition and processing unit (20) comprises a pulse voltage signal acquisition and processing unit (210), and the multi-channel state interlocking unit (30) comprises: A signal interlock circuit (302) is used to receive and latch the voltage state monitoring signal output by the pulse voltage signal acquisition and processing unit (210), and output an interlock level signal and a state upload signal; A hardware power-on reset circuit (301) is connected to the signal interlock circuit (302) and is used to generate a narrow pulse edge when the system is powered on to reset and initialize the signal interlock circuit, and / or A software-triggered reset circuit (303) is connected to the signal interlock circuit (302) and is used to receive an MCU reset signal when the system is working, and control the signal interlock circuit (302) to reset.

6. The control and monitoring system for solid-state switch of high-voltage pulse power supply for excimer laser according to claim 1, characterized in that: The MCU main control unit (40) comprises: An optical coupling isolation circuit (401) connected to the output end of the multi-channel state interlocking unit (30); An MCU main control chip (402) is connected to the optical coupling isolation circuit (401) and processes the status upload signal; The isolated transceiver circuit (403) is connected to the MCU main control chip (402) and is used for communicating with a host computer.

7. The control and monitoring system for solid-state switch of high-voltage pulse power supply for excimer laser according to claim 6, characterized in that: The MCU main control chip (402) converts the received signal into a CANBUS signal and outputs it to the host computer.

8. The control and monitoring system for solid-state switch of high-voltage pulse power supply for excimer laser according to claim 1, characterized in that: The environmental signal acquisition and processing unit (20) comprises a temperature signal acquisition and processing unit (220), wherein the temperature signal acquisition and processing unit (220) is used to acquire multiple temperature states of the high-voltage pulse power supply and output a temperature state monitoring signal via a second comparison circuit.

9. The control and monitoring system for solid-state switch of high-voltage pulse power supply for excimer laser according to claim 8, characterized in that: The second comparison circuit comprises: at least one of a magnetic core over-temperature comparison circuit (221), a housing over-temperature comparison circuit (222), a water cooling plate over-temperature comparison circuit (223), and a main control board over-temperature comparison circuit (224).

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