Heat dissipation cabinet and communication equipment

Abstract

The embodiment of the present application provides a heat dissipation cabinet and communication equipment. The heat dissipation cabinet includes a cabinet body, a cabinet door and a baffle. The cabinet body includes a top wall, a bottom wall and a side wall connected between the top wall and the bottom wall. The cabinet door is installed on the cabinet body and is located at the position of the side wall. An air outlet channel is provided in the cabinet body near the top wall. The cabinet door is provided with an air inlet component and an air outlet component. The air outlet component is located between the air inlet component and the top wall and is located at one end of the air outlet channel. An electronic device placement area is provided in the cabinet body. The baffle is provided between the electronic device placement area and the cabinet door. The baffle includes a first opening so that the air entering through the air inlet component directly enters the electronic device placement area through the first opening. The heat dissipation cabinet provided by the embodiment of the present application improves the heat dissipation effect of the heat dissipation cabinet and ensures the heat dissipation effect of the electronic devices in the heat dissipation cabinet.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a heat dissipation cabinet and communication equipment. Background Art

[0002] Communication equipment is increasingly being installed in outdoor environments. In natural environments, heat dissipation cabinets are used to provide an outdoor physical working environment and safety guarantee for the related equipment of wireless communication sites or wired network sites. Communication devices such as base station devices, power supply devices, and transmission devices can be installed in the heat dissipation cabinet, and the heat dissipation effect of the electronic devices installed in the heat dissipation cabinet is guaranteed to provide support for the normal operation of the electronic devices. The heat dissipation effect of existing heat dissipation cabinets is limited, resulting in poor heat dissipation of the electronic devices in the heat dissipation cabinet. Summary of the invention

[0003] The embodiment of the present application provides a heat dissipation cabinet to improve the heat dissipation effect of the heat dissipation cabinet and ensure the heat dissipation effect of the electronic device in the heat dissipation cabinet.

[0004] An embodiment of the present application also provides a communication device.

[0005] In a first aspect, an embodiment of the present application provides a heat dissipation cabinet, comprising a cabinet body, a cabinet door and a baffle, wherein the cabinet body comprises a top wall, a bottom wall and a side wall connected between the top wall and the bottom wall, the cabinet door is installed on the cabinet body and is located at the position of the side wall, an air outlet channel is provided in the cabinet body near the top wall, the cabinet door is provided with an air inlet assembly and an air outlet assembly, the air outlet assembly is located between the air inlet assembly and the top wall, and is located at one end of the air outlet channel, an electronic device placement area is provided in the cabinet body, the baffle is provided between the electronic device placement area and the cabinet door, and the baffle comprises a first opening so that the air entering through the air inlet assembly directly enters the electronic device placement area through the first opening.

[0006] The heat dissipation cabinet described in the embodiment of the present application is provided with a baffle between the electronic device placement area and the cabinet door, so that the air entering through the air inlet assembly directly enters the electronic device placement area through the first opening, so as to dissipate heat for the electronic device arranged in the electronic device placement area. At the same time, an air outlet channel is provided at a position of the cabinet body close to the top wall, so that the air passing through the electronic device is guided from the air outlet channel to the air outlet assembly, and then the air (hot air) passing through the electronic device is discharged to the outside of the cabinet body through the air outlet assembly. In other words, the air outlet channel in the present application can quickly and effectively collect the heated air passing through the electronic device and discharge it to the outside of the cabinet body, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet and ensuring the electrical performance of the electronic device arranged in the heat dissipation cabinet. In other words, the present application introduces external air (cold air) directly into the electronic device placement area through a baffle, preventing the external air from diffusing in any direction in the cabinet and finally entering the electronic device placement area. In this process, the temperature of the external air will gradually rise, and when it finally reaches the electronic device placement area, the air has a poor heat dissipation effect on the electronic devices in the electronic device placement area. By directly introducing external air into the electronic device placement area, the air can be effectively prevented from heating up before entering the electronic device placement area. At the same time, by setting the air outlet channel, the air (hot air) passing through the electronic device placement area can be quickly discharged out of the cabinet, effectively preventing the hot air from flowing back to the electronic device placement area, improving the heat dissipation effect of the air on the electronic devices in the electronic device placement area, and ensuring the effective operation of the electronic devices. The baffle can also prevent the air (hot air) passing through the electronic device placement area from flowing back and mixing with the air (cold air) entering from the air inlet component, greatly improving the heat dissipation effect of the heat dissipation cabinet. The air inlet component and the air outlet component in the present application are both arranged on the cabinet door, which is convenient for maintenance, simplifies the side wall structure, and reduces production and maintenance costs.

[0007] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the air outlet channel includes a body and an air duct running through the body, and the opposite ends of the body include a second opening and a third opening connected to the air duct, the second opening is connected to the air outlet assembly, and the third opening is located above the electronic device placement area. The above the electronic device setting area is the direction of the electronic device setting area toward the top wall, and the third opening is located between the top wall and the electronic device placement area, so as to quickly collect the air passing through the electronic device placement area and discharge it to the outside of the cabinet through the air duct, thereby preventing hot air from flowing back to the electronic device placement area. At the same time, the air entering the air duct is isolated from the air outside the air duct, effectively improving the heat dissipation effect of the heat dissipation cabinet.

[0008] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the second opening and the third opening are arranged relative to each other in the direction toward the cabinet door, and the air passing through the electronic device placement area is quickly collected through the third opening and discharged to the outside of the cabinet through the air duct, thereby preventing hot air from flowing back to the electronic device placement area, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet.

[0009] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the third opening is arranged toward the electronic device placement area, that is, the third opening is arranged toward the air passing through the electronic device placement area, so that the air passing through the electronic device placement area can be effectively and quickly collected and discharged to the outside of the cabinet, preventing hot air from flowing back to the electronic device placement area, and effectively improving the heat dissipation effect of the heat dissipation cabinet.

[0010] According to the first aspect, in a possible implementation of the heat dissipation cabinet, at least one exhaust fan is provided in the air outlet channel, for extracting the air passing through the electronic device placement area. By providing an exhaust fan in the air outlet channel, the air passing through the electronic device placement area can be more effectively collected and discharged to the outside of the cabinet, thereby improving the heat dissipation effect of the electronic devices in the electronic device placement area.

[0011] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the baffle includes a first baffle and a second baffle, the first opening is located between the first baffle and the second baffle, the first baffle is arranged adjacent to the body, and the second baffle is located between the first baffle area and the bottom wall. That is to say, the present application introduces external air directly into the electronic device placement area through the first opening by spacing the first baffle and the second baffle to form the first opening exposing the electronic device placement area, which can effectively prevent the air from heating up before entering the electronic device placement area, thereby improving the heat dissipation effect of the electronic devices in the electronic device placement area. The first baffle and the second baffle can also prevent the air from flowing back through the electronic device placement area and mixing with the air entering from the air inlet assembly to heat the air entering from the air inlet assembly, thereby greatly improving the heat dissipation effect of the heat dissipation cabinet.

[0012] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the width of the first opening in the direction from the bottom wall to the top wall is less than or equal to the width of the electronic device placement area from the bottom wall to the top wall, thereby effectively avoiding the first opening being too large, resulting in air not directly entering the electronic device placement area, and air reflux through the electronic device placement area and mixing with the air entering from the air inlet assembly to heat the air entering from the air inlet assembly, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet.

[0013] According to the first aspect, in a possible implementation of the heat dissipation cabinet, a gap is formed between the first baffle plate and the second baffle plate and the side wall, so that the air entering through the air inlet assembly enters the electronic device placement area through the gap. For an electronic device whose internal air duct direction is parallel to the direction between the two side walls connecting the cabinet door, the air entering the air inlet assembly bypasses the gap through the first baffle plate and the second baffle plate and enters the side wall position of the cabinet body, and then enters the internal air duct of the electronic device, so as to quickly dissipate the heat of the electronic device. That is to say, the air in the present application enters the electronic device along the internal air duct of the electronic device for heat dissipation, which can quickly and effectively dissipate the heat of the electronic device and improve the heat dissipation effect of the electronic device. At the same time, the first baffle plate and the second baffle plate can also prevent the air from flowing back through the electronic device placement area and mixing with the air entering from the air inlet assembly to heat the air entering from the air inlet assembly, which greatly improves the heat dissipation effect of the heat dissipation cabinet.

[0014] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the air inlet assembly includes a first cover body and an inlet fan, the first cover body includes a storage space and a fourth opening and a fifth opening located at opposite ends of the first cover body and connected to the storage space, the inlet fan is arranged on the side of the fifth opening, and the inlet fan draws air outside the cabinet into the cabinet. In other words, the air is drawn into the cabinet through the air inlet assembly, that is, the cabinet is a positive pressure system, and the air entering the cabinet is heated after passing through the electronic device placement area, flows toward the top wall, and then is discharged to the outside of the cabinet through the air outlet assembly located near the top wall. If the fan is arranged in the air outlet assembly, that is, the fan is used to draw out the air in the cabinet, thereby forming a negative pressure system in the cabinet, and the external air will be sucked into the cabinet through the air inlet assembly under the action of the negative pressure. For a negative pressure system, air can not only enter the cabinet through the air inlet assembly, but also enter the cabinet through other screw holes of the cabinet, thereby sucking dust and water outside the cabinet into the cabinet through screw holes, wiring holes and other holes, affecting the performance of the device in the cabinet. The positive pressure system of the present application can effectively prevent air from entering the cabinet from other holes other than the air inlet assembly, and can effectively prevent dust and water outside the cabinet from being sucked into the cabinet through screw holes, wiring holes and other holes, thereby ensuring the performance of the device in the cabinet.

[0015] According to the first aspect, in a possible implementation of the heat dissipation cabinet, a portion of the first cover body is located on the inner side of the cabinet door, and a portion is located on the outer side of the cabinet door, the fourth opening is located on the outer side of the cabinet door, and the fifth opening is located on the inner side of the cabinet door, so that the air inlet assembly does not take up too much space in the cabinet, thereby ensuring the capacity of the cabinet. At the same time, the air inlet assembly partially protrudes outward from the outer side of the cabinet door, thereby ensuring a neat appearance of the heat dissipation cabinet and facilitating the transportation of the heat dissipation cabinet, thereby preventing the air inlet assembly from being damaged by bumps during transportation and use.

[0016] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the first cover is located on the inner side of the cabinet door, and the fourth opening is connected to the air inlet of the cabinet door, that is, the air inlet assembly does not protrude from the outer side of the cabinet door, thereby ensuring the neat appearance of the heat dissipation cabinet and preventing the air inlet assembly from being damaged by collision during transportation and use. Or the first cover is located on the outer side of the cabinet door, and the fifth opening is connected to the air inlet of the cabinet door, that is, the air inlet assembly does not occupy the space in the cabinet, thereby ensuring that the space in the cabinet is large enough to meet the large capacity requirements of customers.

[0017] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the air inlet assembly further includes a filter, and the filter is located in the accommodating space and on a side of the air inlet fan facing the fifth opening. The filter is used to filter impurities in the external air to prevent the impurities from entering the cabinet and affecting the electrical performance of the electronic device in the cabinet, thereby increasing the service life of the electronic device.

[0018] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the filter element includes a dustproof element and a first waterproof element, and the dustproof element is arranged close to the inlet fan relative to the first waterproof element, or the first waterproof element is arranged close to the inlet fan relative to the dustproof element, thereby effectively preventing dust and water from entering the cabinet, preventing dust and water from affecting the electrical performance of the electronic device in the cabinet, and improving the service life of the electronic device.

[0019] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the air outlet assembly includes a second waterproof component, which is used to prevent water from entering the cabinet, thereby avoiding water from affecting the electrical performance of the electronic device in the cabinet and improving the service life of the electronic device.

[0020] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the number of the air outlet components and the number of the air inlet components are both multiple to achieve different heat dissipation requirements.

[0021] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the heat dissipation cabinet includes a temperature sensor and a controller, the temperature sensor is arranged in the electronic device placement area, and the controller is electrically connected to the temperature sensor and the inlet fan to control the rotation speed of the inlet fan according to the temperature of the electronic device.

[0022] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the cabinet door is connected to a first cover plate and a second cover plate, the first cover plate is used to open or close the air outlet component, and the second cover plate is used to open or close the air inlet component, that is, the unused air inlet component or air outlet component can be closed to ensure the airtightness of the cabinet body, effectively control the air flow in the cabinet body, improve the heat dissipation effect of the heat dissipation cabinet, and reduce the energy consumption of the heat dissipation cabinet during use, thereby saving usage costs.

[0023] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the cabinet door is provided with a driving member, and the driving member is connected to the controller, the first cover plate and the second cover plate to drive the first cover plate and the second cover plate to open or close the air outlet component and the air inlet component respectively, so that the first cover plate and the second cover plate can be automatically controlled by the controller to improve user experience.

[0024] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the heat dissipation cabinet further includes a support frame, the support frame is arranged in the cabinet body, the area of ​​the support frame used to set the relevant electronic devices is the electronic device placement area, and the body is fixed to the part of the support frame close to the top wall. In other words, the support frame can not only assist in installing the electronic device, but also be used to fix the body, thereby avoiding the introduction of a new structure to fix the body, simplifying the structure of the heat dissipation cabinet, and reducing the production cost of the heat dissipation cabinet.

[0025] According to the first aspect, in a possible implementation of the heat dissipation cabinet, the heat dissipation cabinet further includes an auxiliary air outlet component, and the auxiliary air outlet component is arranged in the middle of the cabinet door. That is, the air passing through the electronic device located on the bottom wall can be discharged to the outside of the cabinet through the auxiliary air outlet component, thereby avoiding the step-by-step transmission of hot air between different electronic devices, thereby preventing the heat dissipation effect of other electronic devices from being affected, and effectively improving the overall heat dissipation effect of multiple electronic devices.

[0026] In a second aspect, an embodiment of the present application provides a communication device, the communication device comprising an electronic device and a heat dissipation cabinet as described in any possible implementation of the first aspect, the electronic device being arranged in the electronic device placement area of ​​the heat dissipation cabinet. The communication device has good heat dissipation effect and excellent electrical performance.

[0027] The heat dissipation cabinet described in the embodiment of the present application is provided with a baffle between the electronic device placement area and the cabinet door, so that the air entering through the air inlet assembly directly enters the electronic device placement area through the first opening, so as to dissipate heat for the electronic device arranged in the electronic device placement area. At the same time, an air outlet channel is provided at a position of the cabinet body close to the top wall, so that the air passing through the electronic device is guided from the air outlet channel to the air outlet assembly, and then the air (hot air) passing through the electronic device is discharged to the outside of the cabinet body through the air outlet assembly. In other words, the air outlet channel in the present application can quickly and effectively collect the heated air passing through the electronic device and discharge it to the outside of the cabinet body, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet and ensuring the electrical performance of the electronic device arranged in the heat dissipation cabinet. In other words, the present application introduces external air (cold air) directly into the electronic device placement area through the baffle, so as to prevent the external air from diffusing in any direction in the cabinet and finally entering the electronic device placement area. In this process, the temperature of the external air will gradually rise, and when it finally reaches the electronic device placement area, the air will have a poor heat dissipation effect on the electronic devices in the electronic device placement area. By directly introducing external air into the electronic device placement area, it is possible to effectively prevent the air from heating up before entering the electronic device placement area. At the same time, by providing the air outlet channel, the air (hot air) passing through the electronic device placement area can be quickly discharged out of the cabinet, effectively preventing the hot air from flowing back into the electronic device placement area, thereby improving the heat dissipation effect of the air on the electronic devices in the electronic device placement area and ensuring the effective operation of the electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of a communication device provided in an embodiment of the present application.

[0029] Figure 2 It is a structural schematic diagram of the first embodiment of the heat dissipation cabinet provided in the embodiments of the present application.

[0030] Figure 3 yes Figure 2 A schematic diagram of the structure of the heat dissipation cabinet provided from another angle.

[0031] Figure 4 It is a structural diagram of the negative pressure system of the heat dissipation cabinet.

[0032] Figure 5 It is a schematic diagram of the air flow in the cabinet.

[0033] Figure 6 This is another schematic diagram of the air flow in the cabinet.

[0034] Figure 7 It is a structural schematic diagram of the second embodiment of the heat dissipation cabinet provided in the embodiment of the present application.

[0035] Figure 8 It is a structural schematic diagram of the third embodiment of the heat dissipation cabinet provided in the embodiment of the present application.

[0036] Fig. 9 It is a structural schematic diagram of the fourth embodiment of the heat dissipation cabinet provided in the embodiments of the present application.

[0037] Fig.10 yes Fig. 9 A schematic structural diagram of another embodiment of a heat dissipation cabinet is provided.

[0038] Fig.11 It is a structural schematic diagram of the fifth embodiment of the heat dissipation cabinet provided in the embodiments of the present application.

[0039] Fig.12 It is a structural schematic diagram of the fifth embodiment of the heat dissipation cabinet provided in the embodiments of the present application.

[0040] Fig.13 It is a structural schematic diagram of the sixth embodiment of the heat dissipation cabinet provided in the embodiments of the present application. DETAILED DESCRIPTION

[0041] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0042] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of a communication device provided in an embodiment of the present application. The communication device 100 includes a heat dissipation cabinet 10 and an electronic device 20, and the electronic device 20 is arranged in the electronic device placement area 114 of the heat dissipation cabinet 10. In this embodiment, the communication device 100 is a workstation such as a wireless communication station and a network workstation, and the electronic device 20 may include one or more of a base station device, a power supply device, a battery, a transmission device, etc. The electronic device 20 is arranged in the heat dissipation cabinet 10, which can ensure that the electronic device 20 has a good heat dissipation effect and excellent electrical performance.

[0043] See also Figure 2 and Figure 3 , Figure 2 It is a structural schematic diagram of the first embodiment of the heat dissipation cabinet provided in the embodiments of the present application. Figure 3 yes Figure 2A schematic structural diagram of a heat dissipation cabinet from another angle is provided. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet body 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet body 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 can directly enter the electronic device placement area 114 through the first opening 141.

[0044] The heat dissipation cabinet 10 of the present application is provided with a baffle 14 between the electronic device placement area 114 and the cabinet door 12, so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141, so as to dissipate the heat of the electronic device 20 arranged in the electronic device placement area 114 ( Figure 2The arrow in the middle indicates the approximate flow direction of the air in the cabinet 11). At the same time, an air outlet channel 13 is provided at a position of the cabinet 11 close to the top wall 111, so that the air passing through the electronic device 20 is guided from the air outlet channel 13 to the air outlet assembly 16, and then the air (hot air) passing through the electronic device 20 is discharged to the outside of the cabinet 11 through the air outlet assembly 16. In other words, the air outlet channel 13 in the present application can quickly and effectively collect the heated air passing through the electronic device 20 and discharge it to the outside of the cabinet 11, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10 and ensuring the electrical performance of the electronic device 20 arranged in the heat dissipation cabinet 10. In other words, the present application introduces external air (cold air) directly into the electronic device placement area 114 through the baffle 14, so as to prevent the external air from diffusing in any direction in the cabinet 11 and finally entering the electronic device placement area 114. In this process, the temperature of the external air will gradually rise, and when it finally reaches the electronic device placement area 20, the air has a poor heat dissipation effect on the electronic device 20 in the electronic device placement area 114. By directly introducing the external air into the electronic device placement area 114, it can effectively prevent the air from heating up before entering the electronic device placement area 114. At the same time, by setting the air outlet channel 13, the air (hot air) passing through the electronic device placement area 114 can be quickly discharged out of the cabinet 11, effectively preventing the hot air from flowing back to the electronic device placement area 114, improving the heat dissipation effect of the air on the electronic device 20 in the electronic device placement area 114, and ensuring the effective operation of the electronic device 20. The baffle 14 can also prevent the air (hot air) passing through the electronic device placement area 114 from flowing back and mixing with the air (cold air) entering from the air inlet component 15, greatly improving the heat dissipation effect of the heat dissipation cabinet 10. The air inlet assembly 15 and the air outlet assembly 16 in the present application are both arranged on the cabinet door 12, which is convenient for maintenance, simplifies the structure of the side wall 113, and reduces production costs and maintenance costs.

[0045] like Figure 2 and Figure 3 As shown, the cabinet 11 is in the shape of a square cylinder. Specifically, there are three side walls 113, which are connected in sequence and surrounded by the top wall 111 and the bottom wall 112 to form a receiving space to accommodate the electronic device 20. The cabinet door 12 is arranged on the side wall 113 located at the opening of the receiving space, and is opened and closed relative to the cabinet 11 to open or close the receiving space. A carrier (not shown) is arranged in the cabinet 11, and the carrier is composed of a plurality of square hole bars, for example. The area where the carrier is used to set the electronic device 20 is the electronic device placement area 114, and the carrier is used to install the electronic device 20 so that the electronic device 20 is stably arranged in the cabinet 11. Of course, in other embodiments, the carrier is not limited to the above description, as long as it can fix or carry the electronic device 20.

[0046] The cabinet door 12 is plate-shaped and is arranged on the side wall 113 through a rotating structure such as a hinge, and can be opened and closed relative to the opening of the receiving space. The cabinet door 12 includes an inner side 121 and an outer side 122, the inner side 121 faces the receiving space, and the outer side 122 faces away from the receiving space. The cabinet door 12 is provided with an air inlet and an air outlet that penetrate the inner side 121 and the outer side 122, the air inlet is connected to the air inlet assembly 15, and the air outlet is connected to the air outlet assembly 16, so that the air outside the cabinet body 11 enters the cabinet body 11 through the air inlet assembly 15, and the air inside the cabinet body 11 is discharged from the outside of the cabinet body 11 through the air outlet assembly 16, thereby ensuring the heat dissipation performance of the heat dissipation cabinet 10.

[0047] In this embodiment, there are two air inlet assemblies 15, and the two air inlet assemblies 15 are arranged on the cabinet door 12 at intervals. The air inlet assembly 15 includes a first cover 151, a filter 152 and an air inlet fan 153. The first cover 151 includes a receiving space 1511 and a fourth opening 1512 and a fifth opening 1513 located at opposite ends of the first cover 151 and communicating with the receiving space 1511. The air inlet fan 153 is arranged on the side of the fifth opening 1513. The filter 152 is located in the receiving space 1511 and on the side of the air inlet fan 153 facing the fifth opening 1513. The air inlet fan 153 draws air from the outside of the cabinet 11 into the cabinet 11. Specifically, the first cover body 151 is located on the inner side 121 of the cabinet door 12, and the fourth opening 1512 is connected to the air inlet of the cabinet door 12, that is, the air inlet assembly 15 does not protrude from the outer side 122 of the cabinet door 12, thereby ensuring the neat appearance of the heat dissipation cabinet 10 and preventing the air inlet assembly 15 from being damaged by collision during transportation and use. The filter 152 is used to filter impurities in the external air to prevent impurities from entering the cabinet 11 and affecting the electrical performance of the electronic device 20 in the cabinet 11, thereby improving the service life of the electronic device 20. Of course, in other embodiments, the number of air inlet assemblies 15 can be set according to actual needs to achieve different heat dissipation requirements. The air inlet assembly 15 can remove the fan and switch to an air outlet assembly as needed. The air inlet assembly 15 can also be arranged on the outer side 122 of the cabinet door 12, or a part of the air inlet assembly 15 is located on the inner side 121 of the cabinet door 12, and a part is located on the outer side 122 of the cabinet door 12.

[0048] In this embodiment, the air is drawn into the cabinet 11 through the air inlet assembly 15, that is, the cabinet 11 is a positive pressure system. The air entering the cabinet 11 is heated after passing through the electronic device placement area 114, flows toward the top wall 111, and then is discharged to the outside of the cabinet 11 through the air outlet assembly 16 located near the top wall 111. Figure 4) or the air outlet assembly 16, that is, the fan 16a is used to extract the air in the cabinet 11, thereby forming a negative pressure system in the cabinet 11. Under the action of negative pressure, the external air will be sucked into the cabinet 11 through the air inlet assembly 15. For the negative pressure system, the air can not only enter the cabinet 11 through the air inlet assembly 15, but also enter the cabinet 11 through other screw holes of the cabinet 11, thereby sucking the dust and water outside the cabinet 11 into the cabinet 11 through the screw holes, wiring holes and other holes, affecting the performance of the device in the cabinet 11. The positive pressure system of the present application can effectively prevent air from entering the cabinet 11 from other holes other than the air inlet assembly 15, and can effectively prevent dust and water outside the cabinet 11 from being sucked into the cabinet 11 through the screw holes, wiring holes and other holes, thereby ensuring the performance of the device in the cabinet 11. Of course, in other embodiments, the inlet fan can also be removed, and an outlet fan can be set on the air outlet assembly 16, so as to switch the heat dissipation cabinet 10 of the positive pressure system to the heat dissipation cabinet of the negative pressure system.

[0049] like Figure 2 As shown, the filter element 152 includes a dustproof element 1521 and a first waterproof element 1522. In this embodiment, the dustproof element 1521 is, for example, a dustproof structure such as a dustproof net, and the first waterproof element 1522 is, for example, a waterproof structure such as a water retaining plate. The dustproof element 1521 is arranged close to the inlet fan 153 relative to the first waterproof element 1522, that is, the first waterproof element 1522 is arranged close to the fourth opening 1512, that is, close to the external air, so as to effectively prevent water and dust from entering the cabinet 11, prevent water and dust from affecting the electrical performance of the electronic device 20 in the cabinet 11, and improve the service life of the electronic device 20. Of course, in other embodiments, the first waterproof element 1522 is arranged close to the inlet fan 153 relative to the dustproof element 1521.

[0050] The baffle 14 includes a first baffle 142 and a second baffle 143, both of which are in the shape of a plate body, and a first opening 141 is located between the first baffle 142 and the second baffle 143, that is, the first baffle 142 and the second baffle 143 are arranged at intervals to form the first opening 141 exposing the electronic device placement area 114, the first baffle 142 is arranged adjacent to the air outlet channel 13, and the second baffle 143 is located between the first baffle 142 area and the bottom wall 112. Specifically, the side of the first baffle 142 close to the air outlet channel 13 is connected to the air outlet channel 13, so as to cooperate with the air outlet channel 13 to prevent the air entering from the air inlet assembly 15 from being directly discharged from the air outlet assembly 16 without passing through the electronic device placement area 114. The first baffle 142 and the second baffle 143 are both fixed to the carrier and can be detachably connected to the carrier. The first baffle 142 and the second baffle 143 may also be composed of a plurality of sub-baffles (not shown), and the size of the first opening 141 may be determined according to the volume of the electronic device 20. The size of the first opening 141 may be changed by changing the number of sub-baffles of the first baffle 142 and the second baffle 143, so that the size of the first opening 141 may be set according to actual needs. Of course, in other embodiments, the first baffle 142 and the second baffle 143 may also be arranged on other structures in the cabinet 11.

[0051] See also Figure 2 and Figure 5 , Figure 5 FIG. 1 is a schematic diagram of the air flow in the cabinet. Part of the structure of the heat dissipation cabinet 10 is not shown. Figure 5 Please refer to Figure 2 . Figure 5 The direction of the internal air duct of the electronic device 20 is from the cabinet door 12 to the side wall 113 opposite to the cabinet door 12. It can be understood that the cabinet door 12 is the front and the side wall 113 opposite to the cabinet door 12 is the back. The direction of the internal air duct of the electronic device 20 is the direction from the front to the back. When the electronic device 20 is cooled, the external air enters through the air inlet assembly 15 and then enters the internal air duct of the electronic device 20 through the first opening 141 ( Figure 5 The solid arrow portion) is used to dissipate heat from the electronic device 20. After the air passing through the electronic device 20 is discharged from the electronic device 20, a portion of the air will flow back through the upper and lower sides of the electronic device 20, that is, through the side facing the top wall 111 and the side facing the bottom wall 112 ( Figure 5(the dotted arrow part), due to the arrangement of the first baffle 142 and the second baffle 143, the return air cannot be mixed with the air entering from the air inlet assembly 15. It can be understood that the first opening 141 is formed by the first baffle 142 and the second baffle 143, so that the external air is directly introduced into the electronic device placement area 114 through the first opening 141, which can effectively prevent the air from heating up before entering the electronic device placement area 114, thereby improving the heat dissipation effect of the electronic device 20 in the electronic device placement area 114. At the same time, the first baffle 142 and the second baffle 143 can also prevent the air returning through the electronic device placement area 114 from mixing with the air entering from the air inlet assembly 15 and heating the air entering from the air inlet assembly 15, thereby greatly improving the heat dissipation effect of the heat dissipation cabinet 10.

[0052] In this embodiment, the width of the first opening 141 in the direction from the bottom wall 112 to the top wall 111 is less than or equal to the width of the electronic device placement area 114 in the direction from the bottom wall 112 to the top wall 111, thereby effectively preventing the air from directly entering the electronic device placement area 114 due to the first opening 141 being too large, and preventing the air from flowing back through the electronic device placement area 114 and mixing with the air entering from the air inlet assembly 15 to heat the air entering from the air inlet assembly 15, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10. Of course, in other embodiments, when the heat dissipation demand is not large, the width of the first opening 141 in the direction from the bottom wall 112 to the top wall 111 can also be greater than the width of the electronic device placement area 114 in the direction from the bottom wall 112 to the top wall 111.

[0053] See also Figure 2 and Figure 6 , Figure 6 FIG. 1 is another schematic diagram of the air flow in the cabinet. Part of the structure of the heat dissipation cabinet 10 is not shown in FIG. Figure 6 Please refer to Figure 2 . A gap a is formed between the first baffle 142 and the second baffle 143 and the side wall 113. Specifically, a gap a is formed between the baffle 15 and its two adjacent side walls 13, so that the air entering through the air inlet assembly 15 enters the electronic device placement area 114 through the gap a. For the electronic device 20 in which the direction of the internal air duct of the electronic device 20 is parallel to the direction between the two side walls 113 connected to the cabinet door 12, it can be understood that, taking the cabinet door 12 as the front, the two side walls 113 connected to the cabinet door 12 are the left side wall and the side wall respectively, and the direction of the internal air duct of the electronic device 20 is from the left side wall to the right side wall, or the direction of the internal air duct of the electronic device 20 is from the right side wall to the left side wall. When the electronic device 20 is cooled, the air entering through the air inlet assembly 15 mainly passes through the first baffle 142 and the second baffle 143 to bypass the gap a and enter the side wall 113 of the cabinet 11, and then enters the internal air duct of the electronic device 20, so as to quickly cool the electronic device 20 ( Figure 6 After the air passing through the electronic device 20 is discharged from the electronic device 20, a part of the air will flow back through the upper and lower sides of the electronic device 20, that is, through the side facing the top wall 111 and the side facing the bottom wall 112 ( Figure 6 The dotted arrow portion), due to the arrangement of the first baffle 142 and the second baffle 143, the return air cannot be mixed with the air entering from the air inlet assembly 15. That is to say, the air in the present application enters the electronic device 20 along the internal air duct of the electronic device 20 for heat dissipation, which can quickly and effectively dissipate the heat of the electronic device 20 and improve the heat dissipation effect of the electronic device 20. At the same time, the first baffle 142 and the second baffle 143 can also prevent the air return through the electronic device placement area 114 from mixing with the air entering from the air inlet assembly 15 to heat the air entering from the air inlet assembly 15, thereby greatly improving the heat dissipation effect of the heat dissipation cabinet 10. For the electronic device 20 whose internal air duct direction is from the left side wall to the right side wall, or from the right side wall to the left side wall, since the internal air duct direction of the electronic device 20 is not from the front to the back, that is, the electronic device 20 has no air intake channel at the first opening 141, the air entering from the air intake assembly 15 will not enter the inside of the electronic device 20 through the first opening 141 between the first baffle 142 and the second baffle 143, but will enter the electronic device placement area 114 through the gap a, and then enter the internal air duct of the electronic device 20 to dissipate heat for the electronic device 20. The arrangement of the first baffle 142 and the second baffle 143 in the present application has a good heat dissipation effect for the electronic devices 20 with different internal air duct directions, and has a wide range of applications. The second baffle 143 forms a gap with the bottom wall 112, so that the air entering through the air intake assembly 15 enters the bottom wall 112 to dissipate heat for the related heating components arranged on the bottom wall 112. Of course, in other embodiments, a gap is formed between the baffle 15 and one of the side walls 13. For the electronic device 20 whose internal air duct direction is parallel to the direction between the two side walls 113 connecting the cabinet door 12 , the first opening may not be provided between the first baffle 142 and the second baffle 143 .

[0054] See also Figure 2The air outlet channel 13 includes a body 131 and an air duct 132 penetrating the body 131. The body 131 is fixed to a portion of the support frame close to the top wall 111, and the first baffle 141 is connected to the body 131. The opposite ends of the body 131 include a second opening 1311 and a third opening 1312 communicating with the air duct 132. Specifically, the second opening 1311 and the third opening 1312 are arranged opposite to each other in a direction toward the cabinet door 12. The second opening 1311 is communicated with the air outlet assembly 16, and the third opening 1312 is located above the electronic device placement area 114. The upper part of the electronic device setting area 113 is the direction from the electronic device setting area 113 to the top wall 111. The third opening 1312 is located between the top wall 111 and the electronic device placement area 114, so as to quickly collect the air passing through the electronic device placement area 114 and discharge it to the outside of the cabinet 11 through the air duct 132, thereby preventing the hot air from flowing back to the electronic device placement area 114. At the same time, the air entering the air duct 132 is isolated from the air outside the air duct 132, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10. The body 131 is arranged on the carrier frame, thereby avoiding the introduction of a new structure to fix the body 131, simplifying the structure of the heat dissipation cabinet 10, and reducing the production cost of the heat dissipation cabinet 10. Of course, in other embodiments, the third opening 1312 can also be oriented toward the electronic device placement area 114. An exhaust fan can also be arranged in the air duct 132.

[0055] In this embodiment, there is one air outlet assembly 16. The air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162. The second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 located at both ends of the second cover body 161 and connected to the inside of the second cover body 161. The second cover body 161 is located on the inner side 121 of the cabinet door 12. The seventh opening 1612 is connected to the second opening 1311 of the air outlet channel 13, and the sixth opening 1611 is connected to the air outlet of the cabinet door 12. In other words, the air outlet assembly 16 does not protrude from the outer side 122 of the cabinet door 12, thereby ensuring the neat appearance of the heat dissipation cabinet 10 and preventing the air outlet assembly 16 from being damaged by collision during transportation and use. The second waterproof member 162 is, for example, a waterproof structure such as a water baffle. The second waterproof member 162 is used to prevent water from entering the cabinet 11, to prevent water from affecting the electrical performance of the electronic device 20 in the cabinet 11, and to improve the service life of the electronic device 20. Of course, in other embodiments, the number of air outlet components 16 can be set according to actual needs to achieve different heat dissipation requirements. A dustproof piece can also be set in the air outlet component 16, and the air outlet component 16 can also be set on the outer side 122 of the cabinet door 12, or a part of the air outlet component 16 is located on the inner side 121 of the cabinet door 12, and a part is located on the outer side 122 of the cabinet door 12.

[0056] The heat dissipation cabinet 10 also includes a temperature sensor (not shown) and a controller (not shown). The temperature sensor is arranged in the electronic device placement area 114, and the controller is arranged in the accommodation space. The controller is electrically connected to the temperature sensor and the air inlet fan 153 to control the rotation speed of the air inlet fan 153 according to the temperature of the electronic device 20, so as to realize automatic regulation of the heat dissipation system and improve the user experience.

[0057] See also Figure 7 , Figure 7 1 is a structural schematic diagram of a second embodiment of a heat dissipation cabinet provided in an embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet passage 13 is arranged in the cabinet 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet passage 13. An electronic device placement area 114 is arranged in the cabinet 11. The electronic device placement area 114 is located on the side of the air outlet passage 13 close to the bottom wall 112. The baffle plate 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle plate 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141. In this embodiment, the heat dissipation cabinet 10 also includes an auxiliary air outlet assembly 17, which is arranged in the middle of the cabinet door 12 and between the two air inlet assemblies 15. There is one auxiliary air outlet assembly 17, and the structure of the auxiliary air outlet assembly 17 is the same as that of the air outlet assembly 16. The cabinet door 12 is provided with an air outlet connected to the auxiliary air outlet assembly 17, so that the air in the cabinet 11 can be discharged through the auxiliary air outlet assembly 17. By providing the auxiliary air outlet assembly 17, the air passing through the electronic device located on the bottom wall 112 can be discharged to the outside of the cabinet 11 through the auxiliary air outlet assembly 17, thereby avoiding the step-by-step transmission of hot air between different electronic devices, thereby affecting the heat dissipation effect of other electronic devices, and effectively improving the overall heat dissipation effect of multiple electronic devices. Of course, in other embodiments, the number and position of the auxiliary air outlet assembly 17 can also be set according to actual needs, and the auxiliary air outlet assembly 17 can also be switched to an auxiliary air inlet assembly by setting a fan.

[0058] See also Figure 8 , Figure 81 is a schematic diagram of the structure of the third embodiment of the heat dissipation cabinet provided in the embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141. In this embodiment, the air outlet channel 13 includes a body 131 and an air duct 132 that runs through the body 131. The body 131 is fixed to a portion of the carrier close to the top wall 111. The opposite ends of the body 131 include a second opening 1311 and a third opening 1312 that are connected to the air duct 132. The second opening 1311 is connected to the air outlet assembly 16, and the third opening 1312 is located above the electronic device placement area 114. Specifically, the third opening 1312 is arranged toward the electronic device placement area 114, that is, the third opening 1312 is arranged toward the air passing through the electronic device placement area 114, so that the air passing through the electronic device placement area 114 can be effectively collected and discharged to the outside of the cabinet 11 quickly, preventing hot air from flowing back to the electronic device placement area 114, and effectively improving the heat dissipation effect of the heat dissipation cabinet 10. Of course, in other embodiments, the heat dissipation cabinet 10 includes an auxiliary air outlet assembly. An exhaust fan may also be provided in the air duct 132.

[0059] See also Fig. 9 , Fig. 91 is a schematic diagram of the structure of the fourth embodiment of the heat dissipation cabinet provided in the embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141. In this embodiment, the air outlet channel 13 includes a body 131 and an air duct 132 that runs through the body 131. The body 131 is fixed to a portion of the carrier close to the top wall 111. The opposite ends of the body 131 include a second opening 1311 and a third opening 1312 that are connected to the air duct 132. The second opening 1311 and the third opening 1312 are arranged opposite to each other in the direction toward the cabinet door 12. The second opening 1311 is connected to the air outlet assembly 16, and the third opening 1312 is located above the electronic device placement area 114. An exhaust fan is provided in the air outlet channel 13. Specifically, the exhaust fan is provided in the air duct 132 and is arranged close to the third opening 1312, and is used to extract the air passing through the electronic device placement area 114. By providing an exhaust fan 18 in the air outlet channel 13, the air passing through the electronic device placement area 114 can be more effectively collected and discharged to the outside of the cabinet 11, thereby improving the heat dissipation effect of the electronic devices in the electronic device placement area 114. The exhaust fan 18 is connected to the controller so that the switch and speed of the exhaust fan 18 can be controlled by the controller. Of course, in other embodiments, the number and position of the exhaust fan 18 can also be set according to actual needs. The third opening is arranged toward the electronic device placement area 114 (such as Fig.10 ). The heat dissipation cabinet 10 includes an auxiliary air outlet component.

[0060] See also Fig.11 , Fig.111 is a schematic diagram of the structure of the fifth embodiment of the heat dissipation cabinet provided in the embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet body 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet body 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 can directly enter the electronic device placement area 114 through the first opening 141.

[0061] In this embodiment, the air inlet assembly 15 includes a first housing 151, a filter 152 and an air inlet fan 153. The first housing 151 includes a receiving space 1511 and a fourth opening 1512 and a fifth opening 1513 located at opposite ends of the first housing 151 and communicating with the receiving space 1511. The air inlet fan 153 is disposed on the side of the fifth opening 1513. The filter 152 is located in the receiving space 1511 and on the side of the air inlet fan 153 facing the fifth opening 1513. The air inlet fan 153 draws air from the outside of the cabinet 11 into the cabinet 11. Specifically, a portion of the first cover body 151 is located on the inner side 121 of the cabinet door 12, and a portion is located on the outer side 122 of the cabinet door 12. The fourth opening 1512 is located on the outer side 122 of the cabinet door 12, and the fifth opening 1513 is located on the inner side 121 of the cabinet door 12, so that the air inlet assembly 15 will not occupy too much space in the cabinet 11, thereby ensuring the capacity of the cabinet 11. At the same time, part of the air inlet assembly 15 protrudes outward from the outer side 122 of the cabinet door 12, thereby ensuring the neat appearance of the heat dissipation cabinet 10 and facilitating the transportation of the heat dissipation cabinet 10, thereby preventing the air inlet assembly 15 from being damaged by bumps during transportation and use.

[0062] The air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162. The second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 located at both ends of the second cover body 161 and connected to the interior of the second cover body 161. A portion of the second cover body 161 is located on the inner side 121 of the cabinet door 12, and a portion is located on the outer side 122 of the cabinet door 12. The sixth opening 1611 is located on the outer side 122 of the cabinet door 12, and the seventh opening 1612 is located on the inner side 121 of the cabinet door 12. Therefore, the air outlet assembly 16 will not occupy too much space in the cabinet 11, thereby ensuring the capacity of the cabinet 11. At the same time, part of the air outlet assembly 16 protrudes outward from the outer side 122 of the cabinet door 12, thereby ensuring the neat appearance of the heat dissipation cabinet 10, facilitating the transportation of the heat dissipation cabinet 10, and preventing the air outlet assembly 16 from being damaged by bumps during transportation and use. Of course, in other embodiments, the air outlet assembly 16 and the air inlet assembly 15 may also be disposed on the inner side 121 of the cabinet door 12 or on the outer side 122 of the cabinet door 12. The heat dissipation cabinet 10 includes an auxiliary air outlet assembly. An exhaust fan may also be disposed in the air duct 132.

[0063] See also Fig.12 , Fig.12 1 is a schematic diagram of the structure of the fifth embodiment of the heat dissipation cabinet provided in the embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet body 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet body 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 can directly enter the electronic device placement area 114 through the first opening 141.

[0064] In this embodiment, the air inlet assembly 15 includes a first cover 151, a filter 152 and an air inlet fan 153. The first cover 151 includes a receiving space 1511 and a fourth opening 1512 and a fifth opening 1513 located at opposite ends of the first cover 151 and connected to the receiving space 1511. The air inlet fan 153 is arranged on the side of the fifth opening 1513. The filter 152 is located in the receiving space 1511 and is located on the side of the air inlet fan 153 facing the fifth opening 1513. The air inlet fan 153 draws air from the outside of the cabinet 11 into the cabinet 11. Specifically, the first cover 151 is located on the outer side 122 of the cabinet door 12, and the fifth opening 1513 is connected to the air inlet of the cabinet door 12. That is to say, the air inlet assembly 15 does not occupy the space in the cabinet 11, so as to ensure that the space in the cabinet 11 is large enough to meet the large capacity requirements of customers.

[0065] The air outlet assembly 16 includes a second cover body 161 and a second waterproof member 162. The second cover body 161 includes a sixth opening 1611 and a seventh opening 1612 located at both ends of the second cover body 161 and connected to the interior of the second cover body 161. The second cover body 161 is located on the outer side 122 of the cabinet door 12, and the seventh opening 1612 is connected to the air outlet of the cabinet door 12. In other words, the air outlet assembly 16 does not occupy the space in the cabinet 11, so as to ensure that the space in the cabinet 11 is large enough to meet the customer's large capacity requirements. Of course, in other embodiments, the air outlet assembly 16 and the air inlet assembly 15 can also be arranged on the inner side 121 of the cabinet door 12, or the air outlet assembly 16 and the air inlet assembly 15 are partially arranged on the outer side 122 of the cabinet door 12, and partially arranged on the inner side 121 of the cabinet door 12. The heat dissipation cabinet 10 includes an auxiliary air outlet assembly. An exhaust fan can also be provided in the air duct 132.

[0066] See also Fig.13 , Fig.13 1 is a structural schematic diagram of a sixth embodiment of a heat dissipation cabinet provided in an embodiment of the present application. The heat dissipation cabinet 10 includes a cabinet body 11, a cabinet door 12, an air outlet channel 13 and a baffle 14. The cabinet body 11 includes a top wall 111, a bottom wall 112 and a side wall 113 connected between the top wall 111 and the bottom wall 112. The cabinet door 12 is installed on the cabinet body 11 and is located at the position of the side wall 113, and can be opened and closed relative to the cabinet body 11. The air outlet channel 13 is arranged in the cabinet body 11 and close to the top wall 111. The cabinet door 12 is provided with an air inlet assembly 15 and an air outlet assembly 16. The air outlet assembly 16 is located between the air inlet assembly 15 and the top wall 111 and at one end of the air outlet channel 13. An electronic device placement area 114 is arranged in the cabinet body 11. The electronic device placement area 114 is located on a side of the air outlet channel 13 close to the bottom wall 112. The baffle 14 is arranged between the electronic device placement area 114 and the cabinet door 12. The baffle 14 includes a first opening 141 so that the air entering through the air inlet assembly 15 can directly enter the electronic device placement area 114 through the first opening 141.

[0067] In this embodiment, the cabinet door 12 is connected with a first cover plate 191 and a second cover plate 192, and the first cover plate 191 and the second cover plate 192 are slidably connected to the cabinet door 12. The first cover plate 191 is used to open or close the air outlet assembly 16, and the second cover plate 192 is used to open or close the air inlet assembly 15, that is, the unused air inlet assembly 15 or the air outlet assembly 16 can be closed to ensure the airtightness in the cabinet 11, effectively control the air flow in the cabinet 11, improve the heat dissipation effect of the heat dissipation cabinet 10, and reduce the energy consumption of the heat dissipation cabinet 10 during use, saving the use cost. In this embodiment, the number of the first cover plate 191 and the number of the air outlet assembly 16 are both one, and the number of the second cover plate 192 and the number of the air inlet assembly 15 are both two. Of course, in other embodiments, the connection method of the first cover plate 191 and the second cover plate 192 to the cabinet door 12 can also be other connection methods such as rotation connection. The number of the air outlet assembly 16 and the air inlet assembly 15 can also be set according to actual needs. The number of first cover plates 191 may be less than the number of air outlet components 16 , and the number of second cover plates 192 may be less than the number of air inlet components 15 , that is, not all air outlet components 16 and air inlet components 15 are provided with cover plates.

[0068] Specifically, the cabinet door 12 is provided with a driving member (not shown), which is connected to the controller, the first cover plate 191 and the second cover plate 192 to drive the first cover plate 191 and the second cover plate 192 to open or close the air outlet assembly 16 and the air inlet assembly 15 respectively, so that the first cover plate 191 and the second cover plate 192 can be automatically controlled by the controller to improve the user experience. Of course, in other embodiments, the first cover plate and the second cover plate can also be respectively arranged on the air outlet assembly 16 or the air inlet assembly 15, and can be located at any position of the air outlet assembly 16 or the air inlet assembly 15. The air outlet assembly 16 and the air inlet assembly 15 can also be arranged on the outer side 122 of the cabinet door 12, or the air outlet assembly 16 and the air inlet assembly 15 are partially arranged on the outer side 122 of the cabinet door 12, and partially arranged on the inner side 121 of the cabinet door 12. The heat dissipation cabinet 10 also includes an auxiliary air outlet assembly and / or an exhaust fan, and the exhaust fan is arranged in the air outlet channel, and the auxiliary air outlet assembly can be controlled to open and close by the cover plate.

[0069] The protection scope of the present application is not limited to the above-mentioned embodiments 1 to 6. Any combination of embodiments 1 to 6 is also within the protection scope of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0070] The heat dissipation cabinet 10 of the embodiment of the present application is provided with a baffle 14 between the electronic device placement area 114 and the cabinet door 12, so that the air entering through the air inlet assembly 15 directly enters the electronic device placement area 114 through the first opening 141, so as to dissipate the heat of the electronic device 20 arranged in the electronic device placement area 114. At the same time, an air outlet channel 13 is provided at a position close to the top wall 111 of the cabinet 11, so that the air passing through the electronic device 20 is guided from the air outlet channel 13 to the air outlet assembly 16, and then the air (hot air) passing through the electronic device 20 is discharged to the outside of the cabinet 11 through the air outlet assembly 16. In other words, the air outlet channel 13 in the present application can quickly and effectively collect the heated air passing through the electronic device 20 and discharge it to the outside of the cabinet 11, thereby effectively improving the heat dissipation effect of the heat dissipation cabinet 10 and ensuring the electrical performance of the electronic device 20 arranged in the heat dissipation cabinet 10. In other words, the present application introduces external air (cold air) directly into the electronic device placement area 114 through the baffle 14, so as to prevent the external air from diffusing in any direction in the cabinet 11 and finally entering the electronic device placement area 114. In this process, the temperature of the external air will gradually rise, and when it finally reaches the electronic device placement area 20, the air has a poor heat dissipation effect on the electronic device 20 in the electronic device placement area 114. By directly introducing the external air into the electronic device placement area 114, it can effectively prevent the air from heating up before entering the electronic device placement area 114. At the same time, by setting the air outlet channel 13, the air (hot air) passing through the electronic device placement area 114 can be quickly discharged out of the cabinet 11, effectively preventing the hot air from flowing back to the electronic device placement area 114, improving the heat dissipation effect of the air on the electronic device 20 in the electronic device placement area 114, and ensuring the effective operation of the electronic device 20. The baffle 14 can also prevent the air (hot air) passing through the electronic device placement area 114 from flowing back and mixing with the air (cold air) entering from the air inlet component 15, greatly improving the heat dissipation effect of the heat dissipation cabinet 10. The temperature control devices such as the air inlet assembly 15 and the air outlet assembly 16 of the present application are all arranged on the cabinet door 12, which is convenient for maintenance. By replacing the cabinet doors 12 of different forms, the heat dissipation cabinet 10 can be smoothly switched between the direct ventilation system, the heat exchange system and the air-conditioning system to meet the user's needs in different scenarios, reduce maintenance costs, reduce user usage costs, and improve user experience.

[0071] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation cabinet, characterized in that: The cabinet comprises a cabinet body, a cabinet door and a baffle, wherein the cabinet body comprises a top wall, a bottom wall and a side wall connected between the top wall and the bottom wall, the cabinet door is installed on the cabinet body and located at the side wall, an air outlet channel is provided in the cabinet body near the top wall, the cabinet door is provided with an air inlet assembly and an air outlet assembly, the air outlet channel comprises a body and an air duct running through the body, and opposite ends of the body comprise a second opening and a third opening communicating with the air duct, and the second opening is communicated with the air outlet assembly; The air outlet assembly is located between the air inlet assembly and the top wall, and is located at one end of the air outlet passage. An electronic device placement area is arranged in the cabinet, and the baffle is arranged between the electronic device placement area and the cabinet door. The baffle comprises a first opening, and the air outlet of the air inlet assembly faces the first opening, so that the air entering through the air inlet assembly directly enters the electronic device placement area through the first opening. The third opening is located above the electronic device placement area, and the third opening is arranged toward the electronic device placement area. The air inlet assembly comprises a first cover body and an inlet fan, the first cover body comprises a accommodating space and a fourth opening and a fifth opening located at opposite ends of the first cover body and connected to the accommodating space, the inlet fan is arranged on the side of the fifth opening, the inlet fan draws air outside the cabinet into the cabinet, and the air outlet passage or the air outlet assembly is not provided with an exhaust fan for extracting air inside the cabinet to the outside of the cabinet, so that a positive pressure system is formed in the cabinet. The first cover body includes a first area, a second area located below the first area in the height direction of the cabinet, and a third area located behind the first area in the depth direction of the cabinet, the second area is connected to the first area, and the third area is connected to the first area; The air inlet assembly also includes a dustproof part and a first waterproof part, the first waterproof part is arranged in the second area, the dustproof part is arranged in the third area, and the fourth opening is located below the first waterproof part in the height direction of the cabinet and is connected to the second area.

2. The heat dissipation cabinet according to claim 1, characterized in that: The baffle includes a first baffle and a second baffle, the first opening is located between the first baffle and the second baffle, the first baffle is disposed adjacent to the body, and the second baffle is located between the first baffle area and the bottom wall.

3. The heat dissipation cabinet according to claim 2, characterized in that: The width of the first opening in the direction from the bottom wall to the top wall is less than or equal to the width of the electronic device placement area in the direction from the bottom wall to the top wall.

4. The heat dissipation cabinet according to claim 3, characterized in that: Gaps are formed between the first baffle plate, the second baffle plate and the side wall, so that the air entering through the air inlet assembly can enter the electronic device placement area through the gaps.

5. The heat dissipation cabinet according to claim 1, characterized in that: A portion of the first cover body is located on the inner side of the cabinet door, and a portion of the first cover body is located on the outer side of the cabinet door. The fourth opening is located on the outer side of the cabinet door, and the fifth opening is located on the inner side of the cabinet door.

6. The heat dissipation cabinet according to claim 1, characterized in that: The first cover body is located on the inner side of the cabinet door, and the fourth opening is communicated with the air inlet of the cabinet door; or the first cover body is located on the outer side of the cabinet door, and the fifth opening is communicated with the air inlet of the cabinet door.

7. The heat dissipation cabinet according to claim 1, characterized in that: The heat dissipation cabinet further comprises a support frame, which is arranged in the cabinet body. The area of ​​the support frame used to arrange related electronic devices is the electronic device placement area, and the body is fixed to a portion of the support frame close to the top wall.

8. The heat dissipation cabinet according to claim 1, characterized in that: The heat dissipation cabinet also includes an auxiliary air outlet component, and the auxiliary air outlet component is arranged in the middle of the cabinet door.

9. A communication device, characterized in that: The communication equipment comprises an electronic device and a heat dissipation cabinet according to any one of claims 1 to 8, wherein the electronic device is arranged in the electronic device placement area of ​​the heat dissipation cabinet.

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