82results about How to "Guaranteed electrical performance" patented technology

The invention discloses an insulating pull rod lightweight design method based on a multi-objective optimization algorithm, and aims to solve the problems of heavy weight and heavy workload of a bearing tool in hot-line work of an ultra-high voltage transmission line. The method comprises the following steps: setting electrical and mechanical property parameters of the insulating pull rod; then, a three-dimensional model is built through SolidWorks, and finite element analysis is carried out through COMSOL; then, an optimized data set is obtained through joint simulation of MATLAB, COMSOL and SolidWorks; secondly, establishing a mathematical optimization model, solving by adopting a particle swarm-grey wolf optimization algorithm, and improving the algorithm through Sine-Tent-Cosine chaotic mapping population initialization and a crisscross strategy; and finally performing simulation verification on the optimization scheme. The device is applied to the lightweight design of large-load insulating force-bearing tools, effectively shortens the development period of the tools, saves the production cost, improves the safety coefficient of hot-line work, and remarkably reduces the workload of hot-line workers.

The invention relates to conductive hydrogel, which is CS hydrogel of Ga grafted MXene, Ga is liquid metal gallium, MXene is Ti3C2Tx, Tx is-F,-OH or-O, CS is chitosan, a two-dimensional sheet structure of single-layer MXene provides a chain, and adjacent chains are connected through liquid metal Ga spheres to provide a three-dimensional chain structure of the conductive hydrogel. The invention also relates to the conductive hydrogel, a preparation method thereof, a flexible electrochemical sensor and application of the flexible electrochemical sensor in glucose detection. According to the invention, disease markers such as glucose in human sweat can be rapidly detected with high sensitivity for a long time, the operation is simple, professional workers are not needed, and real-time daily monitoring can be realized.

The invention relates to the technical field of cables, and discloses a long-life photovoltaic cable which comprises a conductor, an insulating layer arranged outside the conductor and a sheath layer arranged outside the insulating layer, the conductor is formed by stranded tinned copper wires, the surface of each copper wire is covered with a layer of tin, and the sheath layer is arranged outside the insulating layer. Both the insulating layer and the sheath layer adopt a flame-retardant halogen-free polyolefin material with at least temperature resistance as a base material, the content of carbon black in the sheath layer is greater than%, and the materials of the insulating layer and the sheath layer are subjected to an irradiation crosslinking processing procedure. The invention aims to provide the long-life photovoltaic cable which is temperature-resistant, aging-resistant, acid and alkali-resistant, flame-retardant and excellent in ultraviolet-proof performance.

The invention discloses an STDCell pin adaptive selection method and related equipment, and the method comprises the steps: carrying out the preprocessing operation of basic design rule check data, so as to obtain the rule data needed by a DRC rule engine through calculation; reading a user chip design file to perform pre-design operation to form pre-design data; generating a 3D space candidate VIA access point coordinate set of the metal layer where the pin is located, and generating a three-dimensional DRC evaluation value corresponding to each candidate coordinate; according to a VIA generation rule, pre-generated VIA information and pin physical information, performing physical information matching operation based on geometric operation to generate combined data with a three-dimensional DRC evaluation value; according to the three-dimensional DRC evaluation value in the combined data, performing optimization operation by adopting a target optimal algorithm so as to determine optimal combined data and a sequence thereof; and performing wiring access operation based on the optimal combination data and the sequence thereof to generate constrained six-degree-of-freedom wiring information.

The invention discloses a wafer moving device. The wafer moving device comprises a carrier, a driving unit and a connecting rod assembly. The wafer moving device is used for the cleaning box, the carrier is used for mounting a wafer and is suitable for being movably arranged in the cleaning box, the driving unit is arranged on the outer side of the cleaning box, at least part of the connecting rod assembly is located in the cleaning box, the connecting rod assembly is connected with the driving unit and the carrier and comprises a guide rod, and the guide rod is movably arranged in the cleaning box in the vertical direction. The driving unit drives the carrier to move by driving the guide rod to move up and down. According to the wafer moving device, the wafer moving device can move the wafer in the cleaning box to improve the cleaning effect, and the transmission stability is high.

This utility model proposes a centralized power distribution box for subway tunnels, comprising: a box body and a fixing assembly. A fan is installed on the box body; a window is opened on the box body, and an air inlet assembly is rotatably connected inside the window. The outer wall of the air inlet assembly fits against the inner wall of the window. The air inlet assembly includes two symmetrically arranged air guide chambers, each with a fan-shaped cross-section. A first filter screen is provided on the arc-shaped surface of each air guide chamber, and an opening is provided on each air guide chamber located inside the box body. A limiting plate is provided on each air guide chamber, abutting against the inner wall of the box body. The fixing assembly is mounted on the box body. This utility model's centralized power distribution box for subway tunnels can utilize the piston-like wind effect during subway operation to further accelerate the airflow inside the power distribution box, thereby ensuring the electrical performance inside the power distribution box and reducing the failure rate.

This utility model discloses a wire-pair shielded data transmission cable with high transmission performance, comprising: a cross-shaped frame, the four isolation walls of the cross-shaped frame having different wall thicknesses, a buffer groove provided at the top of the isolation wall, and a folded groove aligned with the bottom of the buffer groove on the outer wall of the isolation wall, a filling rope and a set of twisted core wires arranged in the cavity between two adjacent isolation walls, aluminum-plastic composite tape wrapped around the twisted core wires, and tinned copper wire braided tape woven on the cross-shaped frame, the tinned copper wire braided tape being in direct contact with the aluminum surface of the aluminum-plastic composite tape, the tinned copper wire braided tape abutting against the twisted core wires and compressing the buffer groove, the groove wall of the buffer groove bending along the folded groove and abutting against the tinned copper wire braided tape after being compressed by the tinned copper wire braided tape, a wrapping tape wrapped around the tinned copper wire braided tape, and a sheath extruded onto the wrapping tape. This utility model has a simple structure and excellent signal shielding performance both internally and externally.

The utility model discloses a tensile cable which comprises an insulating layer and an outer sheath, the outer sheath is arranged on the outer side of the insulating layer, and a conductor is wrapped in the insulating layer; the cable further comprises a reinforcing layer, and the reinforcing layer is attached to the outer side of the insulating layer and is formed by weaving multiple layers of high-strength fibers. The cable further comprises an elastic buffer layer used for buffering the tensile force of the outside to the cable, the elastic buffer layer is composed of an inner sleeve and an outer sleeve which are respectively attached between the reinforcing layer and the outer sheath, and an anti-tensile structure located between the inner sleeve and the outer sleeve interlayer, and the anti-tensile structure is formed by X-shaped anti-tensile belts which are distributed around the circumference of the outer wall of the inner sleeve in an array mode. The two ends of the tensile belt are fixedly connected with the outer wall of the inner sleeve and the inner wall of the outer sleeve respectively, and the outer side of the outer sheath is also provided with a corrugated pipe. The utility model belongs to the technical field of cables, and particularly provides a cable for solving the problems of poor electrical performance and potential safety hazards caused by deformation and damage due to poor tensile property in the prior art.

This invention discloses a cable tray box and a handcart-type switch cabinet having the same, comprising a box body, a stripping component, an anti-pull component, and a straightening component. The stripping component, installed inside the box body, can strip the cable sheath. The anti-pull component, installed inside the box body, limits the cable winding and prevents the other end of the cable from being pulled or causing the cable end with the terminal to fall off during the stripping process. The straightening component, installed inside the box body, straightens the bent cable, restoring it to a straight state. By integrating the stripping component, the anti-pull component, and the straightening component, this invention achieves precise stripping, effective anti-pull, and automatic straightening, thereby improving cable routing efficiency, safety, and reliability. It solves the problems of inaccurate stripping, easy pulling of cables leading to loosening, and bending caused by clamping that exist in traditional handcart-type switch cabinets during the cable routing process.

The utility model discloses a core package preheating device and a core package hot-pressing system, the device comprises a heating box and a conveying mechanism, the heating box is provided with a feed port and a discharge port, the feed port and the discharge port are located at different heights in the height direction of the heating box, and the feed port and the discharge port are communicated with a cavity of the heating box; the conveying mechanism is arranged in the heating box and comprises a plurality of conveying belts used for conveying core packages, the conveying belts are arranged at intervals in the height direction of the heating box, the conveying directions of the adjacent conveying belts are opposite, the feeding end of the conveying mechanism corresponds to the feeding port in position, and the discharging end of the conveying mechanism corresponds to the discharging port in position. The technical problem of poor hot pressing effect of the core package caused by insufficient heating of the core package in the prior art is solved, and the technical effects of improving the hot pressing effect of the core package and ensuring the electrical performance of the battery prepared from the core package are further achieved.

The invention discloses a laser diode and a method of manufacturing a stacked high density laser diode array wherein the laser diode comprises a substrate and a stacked layer, the stacked layer comprising a P-type layer with ridge strips, the laser diode having a waveguide surface, a light output surface, a reflective surface, and a bottom surface; the top surface of the P-type layer is a waveguide surface, the bottom surface of the substrate is a bottom surface, and the waveguide surface and the bottom surface are oppositely arranged; the bottom surface is provided with at least one groove, and the extending direction of the groove is perpendicular to the ridge-shaped strip. The two side edges of the waveguide surface, the light output surface and the reflection surface are all plated with coatings. According to the laser diode and the method for manufacturing the stacked high-density laser diode array, the structure of the laser diode is improved, and at least one groove is formed in the bottom surface of the laser diode, so that the two side edges, the light output surface and the reflecting surface of the waveguide surface are conveniently coated with coatings, and the light output surface and the reflecting surface are coated with the coatings; and the electrical performance of the laser diode is further ensured.

According to the control mechanism for forming the Z-shaped pin of the lead frame, the upper mold assembly and the lower mold assembly move relatively, and the side pushing block, the pre-pressing assembly and the side pushing column are matched with one another, so that the Z-shaped pin is formed; the pre-pressing assembly abuts against or is staggered with the first protrusion of the side pushing block through the second protrusion of the ejector plate under the matching effect of the first inclined face of the side pushing block and the second inclined face of the side pushing column, and therefore the effects of pre-pressing the pin and delaying stripping are achieved.

The present application relates to the technical field of connector, especially to an electric connector assembly. The electric connector assembly comprises a shell, a PCB adapter plate is arranged in the shell, two or more rows of non-ground cables are electrically and fixedly connected to the PCB adapter plate, two or more rows of connecting pads are arranged on the front and back surfaces of the PCB adapter plate respectively, each row of connecting pads comprises a row of signal pads and ground pads, the core wire of the non-ground cable is electrically and fixedly connected to the signal pad on the front surface, the conductive outer sheath is electrically connected to the ground pad on the front surface, the signal pad and the ground pad on the back surface are used for being electrically connected to the corresponding terminals of a PCB female plate or being electrically connected to the corresponding terminals of an adapter socket and then being electrically connected to the PCB female plate, the PCB adapter plate is internally arranged with a conductive circuit to correspondingly connect the connecting pads on the front and back surfaces of the PCB adapter plate, and the electric connector assembly further comprises a load bottom support which is locked and connected to the shell. The electric connector assembly can realize multi-row high-density wiring and greatly improve the performance of the connector.

This utility model discloses a WLAN antenna structure and a microcomputer, relating to the field of antenna technology. The WLAN antenna structure includes an antenna unit, which includes a dielectric substrate, an antenna ground plane, and radiating stubs. The radiating stubs are connected to the antenna ground plane, and the radiating stubs and the antenna ground plane are located on the same side of the dielectric substrate. The antenna unit is disposed in the microcomputer with the motherboard spaced apart and isolated from each other, and is connected by a feed line.

The utility model discloses a motor stator single-tooth structure which comprises a stator, stator single teeth are integrally connected on the stator, one end of each stator single tooth is provided with an arc-shaped surface, and one surface opposite to the arc-shaped surface is provided with a rotor surface. The utility model belongs to the technical field of motors, and particularly relates to a single-tooth structure of a motor stator, which can prevent the electrical performance of the motor from being reduced due to the change of an end face structure and reduce the vibration noise of the motor through designing the single-tooth end face structure of the motor stator.

The invention provides a solar cell and a photovoltaic module. The solar cell comprises a silicon substrate, a doped semiconductor layer, an anti-reflection layer and an electrode, the electrode comprises a seed layer and a transmission layer; the doped semiconductor layer is arranged on at least one surface of the silicon substrate; an anti-reflection layer is arranged in at least partial region of one side, deviating from the silicon substrate, of the doped semiconductor layer; the surface of the doped semiconductor layer comprises a target region without an anti-reflection layer; the seed layer is arranged on the side, away from the silicon substrate, of the doped semiconductor layer and at least covers the target area, and the transmission layer is arranged on the side, away from the doped semiconductor layer, of the seed layer; the height of the position in the edge region of the seed layer is greater than the height of the position, deviating from the edge region, in the seed layer. According to the design, the blocking effect of the seed layer on the transmission layer can be improved, and the electrical performance of the solar cell is ensured.

The invention relates to the technical field of backlight preparation, in particular to backlight flexible circuit board and light guide plate attaching equipment which comprises a rack, a first air cylinder, a suction cup, a first connecting rod and a hook claw. A conveying belt is installed on the rack, the upper side of the conveying belt is used for containing a back plate, the back plate is used for containing a flexible circuit board, and the first air cylinder is horizontally installed on the rack in a sliding mode; a suction cup is connected below the first air cylinder and used for adsorbing a light guide plate, a clamping assembly and a lifting assembly are installed on the rack, hook claws are symmetrically arranged on the rack, each hook claw comprises a contact part and a supporting part, the supporting parts are in sliding connection with the rack and connected with the lifting assembly and the clamping assembly, and the contact parts are used for being connected with a flexible circuit board. The lifting assembly and the clamping assembly drive the claw to clamp and lift the flexible circuit board away from the horizontal projection plane of the light guide plate on the back plate, so that the flexible circuit board is prevented from being damaged due to extrusion when the light guide plate is installed.

The embodiment of the present application provides a heat dissipation cabinet and communication equipment. The heat dissipation cabinet includes a cabinet body, a cabinet door and a baffle. The cabinet body includes a top wall, a bottom wall and a side wall connected between the top wall and the bottom wall. The cabinet door is installed on the cabinet body and is located at the position of the side wall. An air outlet channel is provided in the cabinet body near the top wall. The cabinet door is provided with an air inlet component and an air outlet component. The air outlet component is located between the air inlet component and the top wall and is located at one end of the air outlet channel. An electronic device placement area is provided in the cabinet body. The baffle is provided between the electronic device placement area and the cabinet door. The baffle includes a first opening so that the air entering through the air inlet component directly enters the electronic device placement area through the first opening. The heat dissipation cabinet provided by the embodiment of the present application improves the heat dissipation effect of the heat dissipation cabinet and ensures the heat dissipation effect of the electronic devices in the heat dissipation cabinet.

The present invention discloses a high-strength insulating baffle for a flexible direct current converter valve power module, comprising a baffle frame and reinforcing fins. The baffle frame comprises a top connecting plate, two side connecting plates and a bottom reinforcing rib plate. The two ends of the top connecting plate are respectively connected to the upper ends of the two side connecting plates, the two ends of the bottom reinforcing rib plate are respectively connected to the lower ends of the two side connecting plates, the plate surface of the top connecting plate and the plate surface of the bottom reinforcing rib plate are perpendicular to each other, and the top connecting plate, the two side connecting plates and the bottom reinforcing rib plate are jointly enclosed to form a socket space; the reinforcing fins are located on both sides of the baffle frame, the reinforcing fins are connected to the side connecting plates, and the reinforcing fins are extended along the length direction of the side connecting plates. The high-strength insulating baffle of the present invention is connected to the power module radiator to achieve rapid installation and disassembly. By adopting a polymer one-piece molding process, by controlling the length and proportion of glass fibers in the polymer, the structural strength is improved while ensuring electrical performance, and the impact of explosive force is effectively resisted.

This utility model discloses a cable for robot conduits, comprising: insulated core wires, two insulated core wires twisted together to form a twisted pair, a first PTFE tape wrapped around the twisted pair, a first wound shielding layer wound around the first PTFE tape, a first non-woven fabric wrapped around the first wound shielding layer, four sets of twisted pairs wrapped with the first non-woven fabric twisted circumferentially around a central filler rope to form a cable, three composite filler ropes and one ground wire filling the four gaps between the four sets of twisted pairs in the cable, the composite filler ropes and the ground wire having the same diameter, a second PTFE tape wrapped around the four sets of twisted pairs in the cable, a second wound shielding layer wound around the second PTFE tape, a second non-woven fabric wrapped around the second wound shielding layer, and a sheath extruded onto the second non-woven fabric. This utility model has excellent bending resistance, torsion resistance, and tensile strength, and can maintain good shielding performance even under frequent bending and torsion.

The utility model discloses a 90 degree welding copper strip type 4 core plastic connector with better air tightness and contact stability. The technical scheme is that the socket shell is arranged at 90 degree angle, the power plug pin terminal is arranged in the socket shell and the socket rubber core is arranged at the lower end of the socket shell, the power plug pin terminal is also arranged at 90 degree angle and is integrally formed in the socket shell, the power female terminal is arranged in the socket rubber core and is connected with the lower end of the power plug pin terminal, and the power female terminal is crimped with the power welding plug pin at the rear end.

The utility model provides a capacitor assembly, which comprises a plurality of capacitor modules, the plurality of capacitor modules are connected in sequence to form the capacitor assembly, and each capacitor module comprises a capacitor with a connecting end and a fixed end which are arranged oppositely; the busbar is arranged at the connecting ends of the plurality of capacitors, and the plurality of capacitors are electrically connected through the busbar; the base is arranged at the fixed ends of the plurality of capacitors, the plurality of capacitors are fixed on the base, connecting pieces are arranged on the side edges of the base, and the connecting pieces on the corresponding side edges of two adjacent bases are arranged in a staggered manner. According to the technical scheme of the utility model, the problem that the current path is influenced by the large overall size of the capacitor assembly in the prior art can be solved.

The present invention discloses a semiconductor device and a manufacturing method thereof, the manufacturing method comprising: providing a substrate, forming a shallow trench isolation structure in the substrate, forming a gate structure on the surface of the substrate, forming a source and a drain in the substrate on both sides of the gate structure, respectively, the shallow trench isolation structure is located outside the drain or the source and away from the gate structure; forming at least one groove in at least one of the source and the drain; forming a dielectric layer, covering the surface of the substrate and filling the groove. By forming at least one groove in at least one of the source or the drain and filling the groove, the stress in the vertical direction of the channel surface of the MOS device can be reduced by adding the groove, so that the stress distribution of the active area is more uniform, thereby ensuring the electrical performance of the device.

The utility model relates to electrician technical field, and specifically disclose a kind of extra-high voltage isolating switch shield of asymmetric layered structure, pass through shielding device design, to reach the effect of equipment closure, accurate control asymmetric electric field, solve the problem of "local electric field concentration", give consideration to "high insulation" and "partial discharge protection", adapt complex insulation scene, strengthen "mechanical performance adaptability", cope with asymmetric load, optimize "environmental tolerance", solve the problem of "local corrosion or wear", reduce "corona loss" and "temperature rise risk", adapt extra-high voltage energy-saving demand, first annular frame and second annular frame are used to guide component rotation, optimize electric field distribution, inhibit corona and insulation breakdown, isolate external pollutants, protect key components, resist external force impact, maintain structural stability, optimize current path, reduce local overheating.

The present invention relates to the field of chassis technology, specifically a line collection device for a new energy vehicle charging pile, comprising a charging pile body, a connecting line fixed to one side of the charging pile body, a charging gun fixed to the other end of the connecting line, a collecting box fixed to one side of the charging pile body, and a collection assembly, which comprises a motor fixed to one side of the charging pile body with the collecting box through a connecting component, a circular shaft fixed to the output end of the motor, an extrusion cylinder fixed to the outside of the circular shaft, the extrusion cylinder is driven to rotate by controlling the motor, and the extrusion cylinder drives the connecting line to move into the collecting box; a support assembly, which transmits the rotational force of the motor to the support member through a connecting rod with circular gear two, driving the support member to move. The present invention adopts a collection assembly, a support assembly and a support member, which can realize the layered collection, recovery and release of the connecting lines, and avoids mutual extrusion and entanglement between the connections after collection.

This utility model provides an immersion washing device for circuit board production, relating to the field of circuit board manufacturing technology. The immersion washing device includes a filter box and an immersion tank. The bottom surface of the immersion tank is fixedly connected to the filter box. A filtration mechanism is installed inside the filter box. The filtration mechanism includes a fixing frame, the outer surface of which is fixedly connected to the filter box. A first filter plate and a second filter plate are fixedly connected to the inner wall of the fixing frame. A drive roller is rotatably connected to the inner wall of the fixing frame. Through the coordinated arrangement of the components in the filtration mechanism, this immersion washing device enables filtration during the recycling of the working fluid, effectively separating and retaining impurities generated during immersion washing, significantly improving the cleaning efficiency of the circuit boards, ensuring a higher standard of surface cleanliness, and thus effectively guaranteeing the production quality and electrical performance of the circuit boards.

The invention belongs to the technical field of semiconductor manufacturing, relates to a contact hole and a forming method thereof, and aims to solve the problems of over-etching of a gate contact hole, side wall loss of a shared contact hole and'eating through 'of the bottom of a gate in the prior art. The method comprises the following steps: firstly, forming a metal gate and a side wall on substrate silicon, and etching to regulate and control the height of the metal gate, so that the height difference between the metal gate and the side wall is equal to the thickness of a second contact etching stop layer; sequentially depositing the stop layer and a second interlayer dielectric layer, and completely retaining the stop layer after polishing; depositing a contact hole lamination layer and etching, and taking the stop layer as a stop interface; and finally, etching the stop layer to accurately form two types of contact holes. According to the process, through the closed-loop design of height difference presetting, stop layer deposition and step-by-step etching, over-etching is completely eradicated, meanwhile, the side wall loss of the shared contact hole is reduced, the bottom is prevented from being broken through, and the performance and reliability of the device are guaranteed.

Provided is a joint of a copper terminal and an aluminium conductor. A copper terminal connecting member of the joint is connected to a conductive core of the aluminium conductor by means of a transition welding layer, and the joint can also be provided with a reinforcing welding layer. Further provided is a method for preparing the joint using plasma arc welding. According to the invention, the connection portion of the copper terminal with the aluminium conductor is filled with solder in a plasma arc welding manner, such that copper and aluminium are connected by means of the solder. Damage to an aluminium oxide layer during welding increases the conductivity and can also isolate the copper terminal and the aluminium conductor, thus preventing an electrochemical reaction between the copper and the aluminium, prolonging the service life of the joint of the copper terminal and the aluminium conductor, and ensuring the mechanical and electrical performances of the connection structure.

The invention is applied to the technical field of semiconductor processing, and discloses a preparation method of a silicon oxide polishing solution for silicon carbide substrate CMP (chemical mechanical polishing), which comprises the following steps: S1, preparing a solution A and a solution B, respectively storing the solution A and the solution B in independent containers, and maintaining respective stable chemical properties and components in the storage and transportation processes; according to the preparation method of the silicon oxide polishing solution for the CMP of the silicon carbide substrate, the solution A is subjected to fine treatment, silica sol and resin are in full contact in a resin purification device by utilizing polystyrene-divinylbenzene copolymer resin under the conditions of proper temperature and pressure, it is guaranteed that impurities in the treated solution A are greatly reduced, and the quality of the solution A is improved; the multi-step impurity removal process can effectively prevent the impurities from forming scratches and pits on the surface of the silicon carbide substrate, the surface quality of the polished substrate is remarkably improved, and the electrical performance and reliability of a subsequent semiconductor device are guaranteed.

The application relates to the technical field of connectors, in particular to a PCB adapter plate and a groundless high-speed cable connector. The groundless high-speed cable connector comprises a PCB adapter plate and two or more rows of groundless cables electrically and fixedly connected to the PCB adapter plate. The front and back surfaces of the PCB adapter plate are respectively provided with two or more rows of connecting pads arranged in a row in the longitudinal direction and arranged side by side in the transverse direction. Each row of connecting pads comprises a row of signal pads and ground pads. The core wires of the groundless cables are electrically and fixedly connected to the signal pads on the front surface, the conductive outer sheath is electrically connected to the ground pads on the front surface, and the signal pads and the ground pads on the back surface are used for abutting and electrically connecting corresponding terminals of an external connector. The PCB adapter plate is internally provided with conductive circuits to correspondingly connect the connecting pads on the front and back surfaces of the PCB adapter plate. The groundless high-speed cable connector can realize multi-row high-density wiring and greatly improve the performance of the connector.