All-silver electronic paste and preparation method thereof

Abstract

The invention relates to an all-silver electronic paste and a preparation method thereof, and the all-silver electronic paste comprises the following components by weight percent: 86-90wt% of silver powder, 3-7wt% of organic solvent, 4-6wt% of polymer resin and 1-3wt% of inorganic additive. The preparation method comprises the following steps: (1) weighing the polymer resin and a solvent according to proportion, placing in a container, placing the container in a constant temperature water bath, carrying out dispersion and stirring on the resin and the solvent for 120 plus or minus 10 minutes, evenly mixing, keeping the water temperature of the water bath at 80 plus or minus 5 DEG C, using a 200-mesh nylon filter screen for removing impurities and then preparing an organic carrier; (2) weighing the silver powder and the inorganic additive according to the proportion, adding into the organic carrier obtained in the step (1), using a three-roller rolling machine for grinding and rolling, obtaining the all-silver electronic paste with the average fineness of less than 5mu m and further using a 500-mesh filter cloth or filter screen for removing the impurities. The obtained all-silver electronic paste has the advantages of good dispersion, superior performance and great environmental protection. The preparation method is simple and the production efficiency is high.

Description

technical field [0001] The invention relates to an all-silver electronic paste and a preparation method thereof, in particular to an all-silver electronic paste with high silver content and a preparation method thereof. Background technique [0002] Silver powder is the most widely used precious metal powder in the electrical and electronic industry. The particle size of traditional industrial silver powder is greater than 0.2 microns, which can be used to make isotropic conductive adhesives and conductive coatings, and can also be used for sintered all-silver electronic pastes, such as capacitors, inductors, resistors and other ceramic components. The typical sintering temperature of electrode paste is 650-850°C. The sintering temperature is high, the energy consumption is high, and the performance requirements of the ceramic substrate are also high. The nano-silver powder used in the electronic paste industry requires good dispersibility and high tap density. However, it ...

AI Technical Summary

Problems solved by technology

The nano-silver powder used in the electronic paste industry requires good dispersibility and high tap density. However, it is precisely because of the high activity of the nano-silver powder that it is easy to self-sinter or agglomerate. The so-called nano-silver powder on the market generally does not solve the problem of agglomeration and has poor dispersibility. , the surface activity is not high, the tap density is low, it is difficult for the organic carrier to completely wet the powder when preparing the slurry, the particle size is large, and the silver layer is not dense after sintering, the shrinkage rate is large, there are many pores, and the electrical properties are poor, which cannot meet the requirements. The needs of the further development of the electronics industry