Relay

A technology of relays and circuit boards, applied in the direction of relays, electromagnetic relays, detailed information of electromagnetic relays, etc., can solve problems such as difficult direct dispensing and sealing, reduce, and destroy the electrical performance of relays, and achieve the effect of ensuring electrical performance

Active Publication Date: 2016-08-10
TYCO ELECTRONICS SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the base and the cover are generally assembled with each other using a snap-fit ​​structure, therefore, there will inevitably be a gap between the base and the cover, because the gap between the base and the cover follows a complicated path Stretches, difficult to seal with direct dispensing
When soldering the input and output terminals of the relay to the circuit board (for example, when soldering to the circuit board by wave soldering), molten flux and vaporized flux (for example, rosin) will pass through the base and The gap between the covers enters the interior of the relay, which can degrade or even destroy the electrical performance of the relay

Method used

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Embodiment Construction

[0021] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention.

[0022] According to a general technical concept of the present invention, a relay is provided, including: a housing having a base and a cover covering a side opening of the base; a coil element and a contact element accommodated in the housing; and an input terminal and an output terminal, respectively electrically connected to the coil element and the contact element, protruding from the bottom of the housing so as to be soldered to the circu...

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Abstract

The present invention discloses a relay comprising: a housing having a base and a cover covering a side opening of the base; a coil element and a contact element accommodated in the housing; and an input terminal and an output terminal, are respectively electrically connected to the coil element and the contact element, and protrude from the bottom of the housing so as to be soldered to the circuit board. Wherein, the relay also includes a protective cover made of insulating material, the protective cover is covered on the bottom of the housing, and is used to seal the gap between the base and the cover; and the protection A first jack corresponding to the output terminal and a second jack corresponding to the input terminal are formed on the cover, and the output terminal and the input terminal pass through the first jack and the second jack respectively. Two jacks. In the present invention, the gap on the bottom of the casing is sealed by the protective cover, thereby effectively preventing solder flux from entering the interior of the relay and ensuring the electrical performance of the relay.

Description

technical field [0001] The invention relates to a relay. Background technique [0002] A relay is a commonly used electrical component. Generally, a relay mainly includes an insulating casing and components such as a coil element, a contact element, and an electromagnet accommodated in the casing. The input terminal of the relay is electrically connected to the coil element, and the output terminal of the relay is electrically connected to the contact element. The input and output terminals of the relay typically protrude from the bottom of the case for soldering to the circuit board. [0003] The housing of the relay generally consists of a base and a cover mounted on the base. In the prior art, the base and the cover are generally assembled with each other using a snap-fit ​​structure, therefore, there will inevitably be a gap between the base and the cover, because the gap between the base and the cover follows a complicated path Stretches, difficult to seal directly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H50/02H01H50/14
Inventor 付振兴张晓宁胡协力
Owner TYCO ELECTRONICS SHENZHEN
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