Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process

Abstract

The invention discloses an embedding unpackaging method for a plastic packaged device packaged by a flip chip bonding process. The method comprises the following steps of: first longitudinally preparing a sample by adopting embedding sample preparation equipment; then grinding off a chip bonding soldering block in the sample to expose a chip bonding salient point by adopting an automatic / manual grinding system; next unpackaging the front surface or back surface of the sample, namely the surface with a chip circuit by adopting an acid etching method, wherein an opening has a size which is less than or equal to that of a chip, and is deep enough to expose the surface of the chip; and finally, immediately washing the acid-unpackaged sample, drying the sample with air and inspecting the dried sample. By the method, a semiconductor device packaged in a flip chip bonding way or a chip size package (CSP) way is unpackaged in a way of combining a mechanical method and the acid etching method, structures such as a bonding structure and the like in the sample can be integrally reserved after the sample is unpackaged, the electrical properties of the sample also can be maintained after the sample is unpackaged, and the requirement of subsequent inspection such as destructive physical analysis, failure analysis and the like on the integrity of the sample is completely met.

Description

technical field [0001] The invention relates to an inlay unsealing method for electronic components, in particular to an inlay unsealing method for plastic-encapsulated devices packaged by a flip-chip welding process. Background technique [0002] At present, some semiconductor devices are packaged in the form of flip-chip or CSP in order to improve performance and reduce volume. This special structure semiconductor device can greatly increase the operating frequency of the device and reduce the volume and weight of the device package. Therefore, flip-chip and CSP These two packaging forms are more and more widely used in the field of semiconductor packaging. In order to test the performance indicators of semiconductor devices, semiconductor devices are generally unsealed. At present, flip-chip and CSP-packaged devices are generally unsealed by a single chemical wet method. Although this method is simple and efficient, it uses This unsealing method often causes damage to th...

AI Technical Summary

Problems solved by technology

Solve the problem that the internal chip of the device is often damaged due to excessive corrosion by the chemical wet method, and the physical structure of the device will also be destroyed and lose its original state, making it difficult to continue destructive physical analysis and failure analysis