A semiconductor integrated heat dissipation system and method for use at sea

Abstract

The present invention discloses a semiconductor integrated heat dissipation system for use at sea. A semiconductor refrigeration sheet is attached to a target device, and a heat dissipation cold head is attached to the other side. When the semiconductor is energized, a temperature difference is generated between the two poles, thereby conducting heat to the heat dissipation cold head. The heat dissipation cold head is connected to the radiator through a water pipe via an integrated water pump, so that the heat in the heat dissipation cold head enters the radiator through the coolant via the integrated water pump. When the coolant flows through the heat sink on the radiator, the heat is released into the air, and then the hot air is blown away by the heat dissipation fan. After the coolant releases heat in the radiator, it enters the heat dissipation cold head and continues to take away the heat in the cold head. This cycle continues to circulate, and the target device is continuously cooled. The present invention uses semiconductor heat dissipation, liquid heat dissipation, gas heat dissipation and other methods in combination, and has the advantages of good refrigeration effect, high reliability, low environmental pollution, strong corrosion resistance, strong environmental adaptability, etc., and can adapt to various complex working environments at sea.

Description

Technical Field

[0001] The present invention belongs to the technical field of computer manufacturing, and in particular relates to a semiconductor integrated heat dissipation system and method. Background Art

[0002] Chassis plays an important role in many industrial fields. However, due to the difficulty of heat dissipation inside the chassis, especially the closed chassis, it is easy to form a closed high-temperature environment inside the chassis, which is very harmful to the electrical components inside the chassis. With global climate change, extreme high-temperature environments are becoming more and more frequent. Industrial equipment, especially marine equipment, is also facing an increasingly harsh operating environment. How to efficiently cool the chassis and protect the internal electronic components is very important.

[0003] Existing heat dissipation technologies mainly use water cooling or air cooling technology for passive cooling, which will cause energy waste, excessive component loss and other problems. At the same time, for equipment working in complex environments such as the sea, due to the need for waterproofing, windproofing and corrosion resistance, the equipment chassis mostly adopts a closed chassis. When the components inside the chassis are working, the high-temperature air inside cannot come out, which greatly reduces the cooling efficiency of existing cooling technologies such as water cooling and air cooling, and it is difficult to effectively conduct the heat inside the chassis for heat dissipation. Equipment working in a high-temperature environment under strong solar radiation at sea has high temperature and humidity in the environment, and existing water cooling and air cooling technologies cannot achieve ideal cooling effects.

[0004] As an existing active refrigeration system, the working principle of air conditioning is to compress the refrigerant into a high-pressure saturated gas (ammonia or Freon), and this gaseous refrigerant is then condensed by the condenser. After being throttled by the throttling device, it is passed into the evaporator to cool the medium to be cooled and exchange heat. The air conditioning compressor plays the role of compressing and driving the refrigerant in the air conditioning refrigerant circuit. The compressor extracts the refrigerant from the low-pressure area, compresses it, and sends it to the high-pressure area for cooling and condensation, and dissipates heat into the air through the heat sink. When the air conditioner is in refrigeration operation, the low-temperature and low-pressure refrigerant gas is sucked into the compressor and pressurized to become a high-temperature and high-pressure refrigerant gas. The high-temperature and high-pressure refrigerant gas releases heat in the outdoor heat exchanger and becomes a medium-temperature and high-pressure liquid. The medium-temperature and high-pressure liquid is then reduced in pressure by the throttling component and becomes a low-temperature and low-pressure liquid. It enters the compressor for compression and circulates in this way. However, this refrigeration method consumes a lot of electricity. In complex outdoor environments, there are problems such as inconvenient power supply and unstable voltage. If the heat dissipation equipment consumes too much power, it will affect the normal power supply of the working equipment. At the same time, the cooling system equipment is too large and takes up a lot of space, which will limit the installation location and installation method of the working equipment, causing installation difficulties and transportation inconveniences. The cooling system also requires a large number of components to work, which causes problems such as high costs and serious component losses.

[0005] Semiconductor cooling chip, also called thermoelectric cooling chip, is a heat pump. Its advantage is that it has no sliding parts and is used in some places where space is limited, reliability is high, and there is no refrigerant pollution. Using the Peltier effect of semiconductor materials, when direct current passes through a thermocouple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, achieving the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, and its characteristics are no moving parts, good cooling effect, and high reliability. Summary of the invention

[0006] In order to overcome the shortcomings of the prior art, the present invention provides a semiconductor integrated heat dissipation system for use at sea. A semiconductor refrigeration sheet is attached to the target device, and the other side is attached to a heat dissipation cold head. After the semiconductor is energized, a temperature difference is generated between the two poles, thereby conducting heat to the heat dissipation cold head. The heat dissipation cold head is connected to the radiator through a water pipe via an integrated water pump, so that the heat in the heat dissipation cold head enters the heat dissipation cold head through the coolant through the integrated water pump. When the coolant flows through the heat sink on the heat dissipation cold head, the heat is released into the air, and then the hot air is blown away by the heat dissipation fan. After the coolant releases heat in the heat dissipation cold head, it enters the heat dissipation cold head and continues to take away the heat in the cold head. This cycle continues to cool down the target device. The present invention uses semiconductor heat dissipation, liquid heat dissipation, gas heat dissipation and other methods in combination, and has the advantages of good refrigeration effect, high reliability, low environmental pollution, strong corrosion resistance, strong environmental adaptability, etc., and can adapt to various complex working environments at sea.

[0007] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0008] A semiconductor integrated heat dissipation system for offshore use, comprising a semiconductor module, a water cooling module, an air cooling module, a control module and a power supply module;

[0009] The semiconductor module cools down the target device after being powered on; the water cooling module transfers the heat in the semiconductor module to the air cooling module, and the air cooling module releases the heat into the air; the power supply module provides power to the semiconductor module, the water cooling module, and the air cooling module; the control module monitors the temperature status of the target device and adjusts the heat dissipation system in real time;

[0010] The semiconductor module includes a semiconductor cooling sheet; one side of the semiconductor cooling sheet is attached to the target device;

[0011] The water cooling module includes a heat sink, an integrated water pump, a heat sink, a water pipe and a coolant; the other side of the semiconductor refrigeration sheet is attached to the heat sink; the water pipe connects the scattering cold head, the integrated water pump and the heat sink, and the three form a cycle; the coolant is injected into the water pipe, and the heat in the heat sink is transferred to the integrated water pump through the flow of the coolant in the water pipe, and the integrated water pump then transfers the coolant to the heat sink; the heat sink releases the heat in the coolant into the air; after the coolant releases the heat in the heat sink, it flows into the heat sink and continues to take away the heat in the heat sink;

[0012] The air cooling module includes a heat dissipation fan; the heat dissipation fan is installed on the heat dissipation radiator to dissipate the heat released by the heat dissipation radiator into the air;

[0013] The control module includes a temperature sensor, an industrial computer and an electromagnetic relay; the industrial computer is connected to the temperature sensor and the electromagnetic relay respectively; the temperature sensor is installed inside the target device, performs temperature measurement and monitoring on the target device, and converts the temperature signal into an electrical signal and transmits it to the industrial computer; the industrial computer controls the electromagnetic relay according to the electrical signal from the temperature sensor: when the temperature of the target device exceeds a preset threshold, the industrial computer controls the electromagnetic relay to turn on the power supply module and operate the cooling system; when the temperature of the target device is lower than the preset threshold, the industrial computer controls the electromagnetic relay to turn off the power supply module and shut down the cooling system.

[0014] Furthermore, the number of the semiconductor refrigeration plates is 2 to 100 groups.

[0015] Furthermore, the air cooling module includes two groups of heat dissipation fans.

[0016] Furthermore, the power supply module model is YHM-Q600S12G, which converts AC176~264V alternating current into DC12V direct current.

[0017] Furthermore, the heat dissipation radiator model is ROG STRIX LC 240 thickened radiator, and its working parameters are: the radiator material is aluminum and the base material is copper.

[0018] Furthermore, the working parameters of the coolant are: working temperature -65°C to 106°C, density 1.085 to 1.090 g / ml, and pH ≤ 8.5.

[0019] Furthermore, the model of the electromagnetic relay is JQX-38F, the model of the integrated water pump is SC-300T, the model of the cooling fan is MGA12012HB-O38, and the model of the semiconductor refrigeration plate is TEC1-12708.

[0020] Furthermore, the preset threshold value of the temperature sensor is 40°C.

[0021] A semiconductor integrated heat dissipation method for use at sea, comprising the following steps:

[0022] Step 1: When the temperature sensor detects that the internal temperature of the target device rises to a preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer;

[0023] Step 2: After processing the electrical signal from the temperature sensor, the industrial computer issues an instruction to turn on the electromagnetic relay, which then attracts and connects the circuit between the power supply module and the semiconductor cooling sheet, the cooling fan, and the integrated water pump;

[0024] Step 3: The heat generated by the target device is transferred to a fixed position through the internal copper heat conductive sheet and silicone sheet. A semiconductor cooling sheet is fixed outside the position to transfer the heat to the outside of the target device.

[0025] Step 4: One side of the semiconductor cooling sheet is attached to the target device, and the other side is attached to the heat sink. The semiconductor cooling sheet transfers the heat from the target device to the coolant through the heat sink. Driven by the integrated water pump, the coolant passes through the heat sink, the integrated water pump and the heat sink in turn through the water pipe, and continuously transfers the heat to the heat sink of the heat sink. The heat sink releases the heat into the air by exchanging heat with the air.

[0026] Step 5: The cooling fan removes the heat released by the radiator;

[0027] Step 6: When the temperature sensor detects that the temperature of the target device drops to the preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer. After processing the electrical signal from the temperature sensor, the industrial computer issues an instruction to disconnect the relay. The relay disconnects and cuts off the circuit between the power supply module and the semiconductor cooling plate, cooling fan, and integrated water pump, and the cooling system stops working.

[0028] The beneficial effects of the present invention are as follows:

[0029] (1) The present invention uses semiconductor heat dissipation, liquid heat dissipation, gas heat dissipation and other methods in combination, and adopts an active heat dissipation method. The heat dissipation work is controlled in real time by an industrial computer, and the number and power of semiconductors are adjusted to achieve the effect of controlling the heat dissipation power. The heat dissipation power is related to the power of active work, so it has the advantages of good refrigeration effect, good sealing, high reliability, and low environmental pollution.

[0030] (2) The present invention uses coolant to transfer heat, which is less polluting than refrigerant. Since the market price of coolant is lower than that of refrigerant, the cost of using coolant is lower. In addition, the coolant does not need to be converted into a certain form, so the system of this invention can adapt to various complex marine environments, which is superior to the traditional heat dissipation mode.

[0031] (3) The controller module of the present invention can autonomously sense the temperature status of the target device and autonomously regulate the operation of the heat dissipation system, thereby timely dissipating heat for the target device and preventing damage to the device components. It has the advantages of artificial intelligence and energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structure of the system of the present invention.

[0033] Figure 2 It is a working principle diagram of the system of the present invention.

[0034] In the figure: 1-temperature sensor, 2-industrial computer, 3-semiconductor refrigeration sheet, 4-integrated water pump, 5-heat dissipation radiator, 6-cooling fan, 7-electromagnetic relay, 8-heat dissipation cold head, 9-power supply module, 10-relay fixing bracket, 11-water pump fixing bracket. DETAILED DESCRIPTION

[0035] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0036] The purpose of the present invention is to overcome the defects of low heat dissipation efficiency, low reliability, poor corrosion resistance and other defects of the prior art, and propose an active semiconductor integrated heat dissipation system that can be used in the offshore environment and is reliable and durable. Combined with the harsh environment of high temperature and high corrosion at sea, the present invention comprehensively utilizes semiconductor heat dissipation, liquid heat dissipation, gas heat dissipation and other methods to perform comprehensive heat dissipation for the system working in the high temperature environment at sea. The core idea is: one side of the semiconductor refrigeration sheet is attached to the component to be dissipated, and the principle of the temperature difference between the two poles when the semiconductor refrigeration sheet is working is used to conduct the heat to the other side of the semiconductor, and then the water cooling module is connected to take the heat away from the heat dissipation component through the coolant, and finally a cooling fan is installed to discharge the heat into the air.

[0037] like Figure 1 As shown, a semiconductor integrated heat dissipation system for offshore use includes a semiconductor module, a water cooling module, an air cooling module, a control module and a power supply module;

[0038] The semiconductor module cools down the target device after being powered on; the water cooling module transfers the heat in the semiconductor module to the air cooling module, and the air cooling module releases the heat into the air; the power supply module provides power to the semiconductor module, the water cooling module, and the air cooling module; the control module monitors the temperature status of the target device and adjusts the heat dissipation system in real time;

[0039] The semiconductor module includes a semiconductor cooling sheet 3; one side of the semiconductor cooling sheet 3 is attached to the target device;

[0040] The water cooling module includes a heat sink 8, an integrated water pump 4, a heat sink 5, a water pipe and a coolant; the other side of the semiconductor refrigeration sheet 3 is attached to the heat sink 8; the water pipe connects the scattering cold head 8, the integrated water pump 4 and the heat sink 5, and the three form a cycle; the coolant is injected into the water pipe, and the heat in the heat sink 8 is transmitted to the integrated water pump 4 through the flow of the coolant in the water pipe, and the integrated water pump 4 then transmits the coolant to the heat sink 5; the heat sink 5 releases the heat in the coolant into the air; after the coolant releases the heat in the heat sink 5, it flows into the heat sink 8 and continues to take away the heat in the heat sink 8;

[0041] The air cooling module includes a heat dissipation fan 6; the heat dissipation fan 6 is installed on the heat dissipation radiator 5 to discharge the heat released by the heat dissipation radiator 5 into the air;

[0042] The control module includes a temperature sensor 1, an industrial computer 2 and an electromagnetic relay 7; the industrial computer 2 is connected to the temperature sensor 1 and the electromagnetic relay 7 respectively; the temperature sensor 1 is installed inside the target device, performs temperature measurement and monitoring on the target device, and converts the temperature signal into an electrical signal and transmits it to the industrial computer 2; the industrial computer 2 controls the electromagnetic relay 7 according to the electrical signal transmitted by the temperature sensor 1: when the temperature of the target device exceeds a preset threshold, the industrial computer 2 controls the electromagnetic relay 7 to put the power supply module 9 in an on state and the cooling system runs; when the temperature of the target device is lower than the preset threshold, the industrial computer 2 controls the electromagnetic relay 7 to put the power supply module 9 in a disconnected state and the cooling system is turned off.

[0043] Furthermore, the number of the semiconductor cooling sheets 3 is 2 to 100 groups.

[0044] Furthermore, the air cooling module includes two groups of cooling fans 6 .

[0045] Furthermore, the power supply module 9 converts AC176-264V alternating current into DC12V direct current.

[0046] Furthermore, the heat dissipation radiator 5 model is ROG STRIX LC 240 thickened radiator, and its working parameters are: the radiator material is aluminum, and the base material is copper.

[0047] Furthermore, the working parameters of the coolant are: working temperature -65°C to 106°C, density 1.085 to 1.090 g / ml, and pH ≤ 8.5.

[0048] Furthermore, the model of the electromagnetic relay 7 is JQX-38F, the model of the integrated water pump 4 is SC-300T, the model of the cooling fan is MGA12012HB-O38, and the model of the semiconductor cooling plate 3 is TEC1-12708.

[0049] Furthermore, the preset threshold value of the temperature sensor 1 is 40°C.

[0050] like Figure 2 As shown, a semiconductor integrated heat dissipation method for use at sea includes the following steps:

[0051] Step 1: When the temperature sensor 1 detects that the internal temperature of the target device rises to a preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer 2;

[0052] Step 2: After processing the electrical signal from the temperature sensor 1, the industrial computer 2 issues an instruction to turn on the electromagnetic relay 7, and the electromagnetic relay 7 is attracted and connects the circuit between the power supply module 9 and the semiconductor cooling plate 3, the cooling fan 6, and the integrated water pump 4;

[0053] Step 3: The heat generated by the target device is transferred to a fixed position through the internal copper heat conductive sheet and the silicone sheet. A semiconductor cooling sheet 3 is fixed outside the position to transfer the heat to the outside of the target device.

[0054] Step 4: One side of the semiconductor refrigeration sheet 3 is attached to the target device, and the other side is attached to the heat dissipation head 8. The semiconductor refrigeration sheet 3 transfers the heat from the target device to the coolant through the heat dissipation head 8. Driven by the integrated water pump 4, the coolant passes through the heat dissipation radiator 5, the integrated water pump 4 and the heat dissipation head 8 in sequence through the water pipe, and continuously transfers the heat to the heat sink of the heat dissipation radiator 5. The heat sink releases the heat into the air by exchanging heat with the air.

[0055] Step 5: The heat dissipation fan 6 dissipates the heat released by the heat dissipation radiator 5;

[0056] Step 6: When the temperature sensor 1 detects that the temperature of the target device drops to a preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer 2. After processing the electrical signal from the temperature sensor 1, the industrial computer 2 issues an instruction to disconnect the relay. The relay disconnects and cuts off the circuit between the power supply module 9 and the semiconductor refrigeration plate 3, the cooling fan 6, and the integrated water pump 4, and the cooling system stops working. Specific embodiment:

[0058] The technical difficulty of the scheme of the present invention lies in how to fully transfer the heat transferred by each part to the next module, and how to intelligently and effectively control the internal temperature of the chassis within the set temperature range. For these problems, the quantity ratio between the various modules of the heat dissipation system is reasonably optimized through repeated experiments and calculations. The heat dissipation power of heat dissipation components such as semiconductor refrigeration plates, heat dissipation cold heads, heat dissipation radiators, and fans is different, so their quantity is also different, which is 4 semiconductor refrigeration plates, 2 heat dissipation cold heads, 1 heat dissipation radiator, and 2 fans. In addition, the scheme of the present invention adds a computer control module, which controls the internal air temperature of the chassis within a certain range by sensing the internal temperature of the chassis and controlling the switch of the heat dissipation system, thereby forming a closed-loop control. At the same time, the equipment working chassis in the scheme of the present invention is a special chassis, which not only uses a closed design, but also has a certain number of copper heat-conducting sheets and silicone sheets designed inside the chassis. These heat-conducting sheets conduct the heat generated by the equipment components when they are working to a fixed position of the chassis. A semiconductor heat dissipation module is fixed on the outside of the chassis at this position. This allows the heat generated by the components to be conducted to the heat dissipation system outside the chassis for heat dissipation before causing damage to the components, greatly improving the heat dissipation efficiency and protecting the safety of the equipment inside the chassis.

[0059] The working principle of the present invention is as follows: a semiconductor refrigeration sheet is attached to the target device, and the other side is attached to the cold head. When the semiconductor is energized, a temperature difference is generated between the two poles, thereby transferring heat to the cold head. The cold head is connected to the radiator through a water pipe via a water pump, so that the heat in the cold head enters the radiator through the coolant via the water pump. There are many heat sinks distributed on the radiator. When the coolant flows through the heat sink, the heat is released into the air, and then the hot air is blown away by the cooling fan. After the coolant releases the heat in the radiator, it enters the cold head and continues to take away the heat in the cold head. This cycle continues to cool down the target device. In addition, the heat dissipation system uses a temperature sensor to measure the temperature of the target device, and converts the temperature signal into an electrical signal and transmits it to the industrial computer. The industrial computer controls the electromagnetic relay to turn on or off the system, thereby forming a closed-loop control of the temperature of the target device.

[0060] The semiconductor module includes N-type semiconductor cooling sheets and P-type semiconductor cooling sheets, the number of which can be 2-100 groups. The semiconductor cooling sheets are installed on the target device to transfer the heat of the target device to the water cooling module. The working principle of the semiconductor cooling sheet: When a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form an electric couple, a direct current is connected in this circuit, and energy transfer can be generated. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end, and the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. The amount of heat absorption and heat release is determined by the size of the current and the number of element pairs of the semiconductor materials N and P.

[0061] The water cooling module includes a heat sink, an integrated water pump, a heat sink, a water pipe, and a coolant. The heat sink is physically connected to the semiconductor module, and the water pipe is filled with coolant, which is connected to the integrated water pump and the heat sink. The water cooling module transfers the heat transferred from the semiconductor module to the air cooling module.

[0062] The working principle of the integrated water pump is to transfer the mechanical energy of the prime mover or other external energy to the liquid, so as to increase the energy of the liquid, thereby realizing the mechanical function of conveying liquid or pressurizing the liquid. The integrated water pump drives the coolant to transfer heat to the heat sink.

[0063] The working principle of the radiator: the coolant flows into the water chamber above the radiator, flows to the other end of the radiator through six flat copper tubes, then passes through the connecting chamber and another six flat copper tubes back to the water chamber below the radiator, and finally flows out of the radiator. The radiator used in this system is made of aluminum and the base is made of copper. The radiator releases the heat in the coolant into the air.

[0064] The water pipes are made of materials that are resistant to high temperatures and corrosion.

[0065] Working parameters of the coolant: working temperature -65℃~106℃, density 1.085~1.090g / ml, pH≤8.5.

[0066] The air cooling module includes two sets of cooling fans installed on the cooling radiator. The fan's operating parameters are: speed 800-2500RPM, noise 10-40dB, air volume 40-120CFM. The cooling fan removes the heat released by the cooling radiator.

[0067] The temperature sensor is installed inside the target device to measure and monitor the temperature of the target device, and converts the temperature signal into an electrical signal for transmission to the industrial control, which is connected to the industrial computer via a USB to RS232 data cable.

[0068] The electromagnetic relay is installed between the connection line of the power supply module and the electric element to control the power supply. It is mainly composed of an electromagnet, an armature, a spring and a contact. When the electromagnet is energized, the armature is sucked down to make the two contacts contact, and the working circuit is closed; when the electromagnet is powered off, it loses its magnetism, and the spring pulls up the armature to cut off the working circuit. At the same time, the electromagnetic relay has the functions of automatic adjustment, safety protection, and circuit conversion in the circuit. When the temperature of the target device is lower than 40°C, the relay is in the disconnected state, the power supply module does not supply power, and the system does not work; when the temperature of the target device exceeds 40°C, the relay is in the connected state, the power supply module supplies power, and the system works. The electromagnetic relay is located on the far left of the internal components of this system. It is installed in the center of the left side of the box, close to the front of the power supply module, and fixed to the box through a U-shaped relay fixing bracket 10 and 4 M3×10 screws.

[0069] The power supply module model is YHM-Q600S12G, which includes a set of 12V DC power supply. The power supply converts AC176~264V AC power into DC12V DC power to power the cooling plate, water pump and cooling fan. Its working parameters are: input voltage AC176~264V, input frequency 50Hz~60Hz single phase, working environment temperature -40℃~+60℃; it has overcurrent protection, overvoltage protection, overheating protection, and short circuit protection functions. It is installed in the middle of the left side of the ground of the box, and is installed on the box through 4 M4×70 bolts and M4 nuts.

[0070] like Figure 1 As shown, the heat dissipation system of the present invention includes a temperature sensor, an industrial computer, a semiconductor refrigeration sheet, an integrated water pump, a heat dissipation radiator, a heat dissipation fan, an electromagnetic relay, a heat dissipation cold head, a power supply, a relay fixing bracket, and a water pump fixing bracket. In this system, the semiconductor refrigeration sheet is attached to the target device, and the other side is attached to the heat dissipation cold head. After the semiconductor is energized, a temperature difference is generated between the two poles, thereby conducting heat to the heat dissipation cold head. The heat dissipation cold head is connected to the heat dissipation radiator through a water pipe via an integrated water pump, so that the heat in the heat dissipation cold head enters the heat dissipation radiator through the integrated water pump. There are many heat sinks distributed on the heat dissipation radiator. When the coolant flows through the heat sink, the heat is released into the air, and then the hot air is blown away by the heat dissipation fan. After the coolant releases heat in the heat dissipation radiator, it enters the heat dissipation cold head and continues to take away the heat in the heat dissipation cold head. This cycle continues to cool the target device. In addition, this system uses a temperature sensor to measure the temperature of the target device, and converts the temperature signal into an electrical signal and transmits it to the industrial computer. The industrial computer controls the electromagnetic relay to turn on or off the power supply, thereby forming a closed-loop control of the temperature of the target device.

[0071] The model of the industrial computer is EBOX626-853-FL, and its configuration is: CPU is N3160 1.6GHz, memory is DDR3L-1600SO-DIMM 8GB, hard disk is SATAIII 64G. The industrial computer is connected to the temperature sensor and electromagnetic relay through wires, and controls the electromagnetic relay by processing the signal from the temperature sensor. When the temperature of the target device is lower than 40℃, the industrial computer controls the electromagnetic relay to be in the off state; when the temperature of the target device exceeds 40℃, the industrial computer controls the electromagnetic relay to be in the on state.

[0072] The model of the integrated water pump is SC-300T, and its working parameters are: maximum flow rate 300L / H, maximum head 2 meters, working voltage DC12V, working current 0.3A, working temperature -10℃~+60℃, working noise 23dB, water tank capacity 150ml, power 4W. The water pump is located at the bottom of the internal components of this system. It is installed on the left side of the lower side of the box, close to the front of the power supply, fixed to the box through a U-shaped water pump fixing bracket 11 and 4 M3×10 screws, and connected to the cold head and cold row through water pipes.

[0073] The radiator model is ROG STRIX LC 240 thickened radiator, and its working parameters are: the radiator is made of aluminum and the base is made of copper. The radiator is located on the far right of the internal components of this system. It is installed in the center of the right side of the box. From the front, it is installed vertically on the box. A cooling fan is installed on it. It is installed on the box together with the cooling fan through 4 M3×100 bolts and M3 nuts, and connected to the cold head and water pump through water pipes.

[0074] The cooling fan model is MGA12012HB-O38, and its operating parameters are: speed 800~2500RPM, noise 38dB, air volume 40CFM. The cooling fan is located on the left side of the radiator, and is installed on the box together with the radiator through 4 M3×100 bolts and M3 nuts.

[0075] The semiconductor cooling chip model is TEC1-12708, and its working parameters are: temperature difference range -130℃~+90℃. The cold end of the cooling chip is attached to the target device, and the hot end is attached to the cold head, fixed by silicone grease.

[0076] The size of the heat sink is 80×120mm, and the outer surface is blue anodized and polished. Two semiconductor cooling sheets are glued on the heat sink with silicone grease, and connected to the water pump and the radiator through water pipes.

[0077] The heat dissipation system of the present invention can maintain a good working condition in a complex and highly corrosive sea surface environment. When the host machine is running at high speed and the external environment temperature is high, the heat dissipation system has an excellent cooling effect and ensures the normal operation of the host machine. According to tests, the heat dissipation system of the present invention has the advantages of low environmental pollution, high refrigeration efficiency, strong corrosion resistance and strong environmental adaptability.

Claims

1. A semiconductor integrated heat dissipation system for offshore use, characterized in that: It includes semiconductor module, water cooling module, air cooling module, control module and power supply module; The semiconductor module cools down the target device after being powered on; the water cooling module transfers the heat in the semiconductor module to the air cooling module, and the air cooling module releases the heat into the air; The power supply module provides electrical energy to the semiconductor module, the water cooling module, and the air cooling module; The control module monitors the temperature status of the target device and adjusts the cooling system in real time; The semiconductor module includes a semiconductor cooling sheet; one side of the semiconductor cooling sheet is attached to the target device; The water cooling module includes a heat sink, an integrated water pump, a heat sink, a water pipe and a coolant; the other side of the semiconductor refrigeration sheet is attached to the heat sink; the water pipe connects the scattering cold head, the integrated water pump and the heat sink, and the three form a cycle; the coolant is injected into the water pipe, and the heat in the heat sink is transferred to the integrated water pump through the flow of the coolant in the water pipe, and the integrated water pump then transfers the coolant to the heat sink; the heat sink releases the heat in the coolant into the air; After the coolant releases heat in the radiator, it flows into the cold head to continue to take away the heat in the cold head. The air cooling module includes a heat dissipation fan; the heat dissipation fan is installed on the heat dissipation radiator to dissipate the heat released by the heat dissipation radiator into the air; The control module includes a temperature sensor, an industrial computer and an electromagnetic relay; the industrial computer is connected to the temperature sensor and the electromagnetic relay respectively; the temperature sensor is installed inside the target device, performs temperature measurement and monitoring on the target device, and converts the temperature signal into an electrical signal and transmits it to the industrial computer; the industrial computer controls the electromagnetic relay according to the electrical signal from the temperature sensor: when the temperature of the target device exceeds a preset threshold, the industrial computer controls the electromagnetic relay to turn on the power supply module and operate the cooling system; when the temperature of the target device is lower than the preset threshold, the industrial computer controls the electromagnetic relay to turn off the power supply module and shut down the cooling system.

2. A semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The number of the semiconductor refrigeration sheets is 2 to 100 groups.

3. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The air cooling module includes two groups of heat dissipation fans.

4. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The power supply module model is YHM-Q600S12G, which converts AC176~264V alternating current into DC12V direct current.

5. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The radiator model is ROG STRIX LC 240 thickened radiator, and its working parameters are: the radiator material is aluminum and the base material is copper.

6. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The working parameters of the coolant are: working temperature -65°C to 106°C, density 1.085 to 1.090 g / ml, and pH ≤ 8.

5.

7. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The model of the electromagnetic relay is JQX-38F, the model of the integrated water pump is SC-300T, the model of the cooling fan is MGA12012HB-O38, and the model of the semiconductor refrigeration chip is TEC1-12708.

8. The semiconductor integrated heat dissipation system for use at sea according to claim 1, characterized in that: The preset threshold value of the temperature sensor is 40°C.

9. A semiconductor integrated heat dissipation method for use at sea, characterized in that: The steps include: Step 1: When the temperature sensor detects that the internal temperature of the target device rises to a preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer; Step 2: After processing the electrical signal from the temperature sensor, the industrial computer issues an instruction to turn on the electromagnetic relay, which then attracts and connects the circuit between the power supply module and the semiconductor cooling plate, the cooling fan, and the integrated water pump; Step 3: The heat generated by the target device is transferred to a fixed position through the internal copper heat conductive sheet and silicone sheet. A semiconductor cooling sheet is fixed outside the position to transfer the heat to the outside of the target device. Step 4: One side of the semiconductor cooling sheet is attached to the target device, and the other side is attached to the heat sink. The semiconductor cooling sheet transfers the heat from the target device to the coolant through the heat sink. Driven by the integrated water pump, the coolant passes through the heat sink, the integrated water pump and the heat sink in turn through the water pipe, and continuously transfers the heat to the heat sink of the heat sink. The heat sink releases the heat into the air by exchanging heat with the air. Step 5: The cooling fan removes the heat released by the radiator; Step 6: When the temperature sensor detects that the temperature of the target device drops to the preset threshold, the temperature signal is converted into an electrical signal and transmitted to the industrial computer. After processing the electrical signal from the temperature sensor, the industrial computer issues an instruction to disconnect the relay. The relay disconnects and cuts off the circuit between the power supply module and the semiconductor cooling plate, cooling fan, and integrated water pump, and the cooling system stops working.

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