Heat dissipation bracket and dehumidifier

Abstract

The present invention provides a heat dissipation bracket and a dehumidifier. The heat dissipation bracket includes a chassis with a water receiving trough on it; a flow guide mechanism includes a support frame with one end fixed on the chassis and the other end extending toward the upper side of the chassis and a flow guide plate fixed on the support frame; the flow guide plate extends toward the water receiving trough and is arranged tilted downward near the end of the water receiving trough. The present invention arranges the flow guide plate and the water receiving trough on the heat dissipation bracket, so that when the semiconductor is dehumidified, the condensed water generated at the cold end is first drained to the heat sink through the flow guide plate, partially cooling the heat sink and improving the dehumidification efficiency. At the same time, combined with the design of the water receiving trough, under high humidity conditions, the effect of condensed water flowing and soaking part of the heat sink can be formed, further improving the heat dissipation of the heat sink and improving the dehumidification effect under high humidity conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of dehumidifiers, and in particular to a heat dissipation bracket and a dehumidifier. Background Art

[0002] Since the semiconductor dehumidifier has the characteristic that the greater the temperature difference between the hot and cold ends, the lower the dehumidification efficiency, in order to ensure the dehumidification efficiency of the semiconductor dehumidifier, the heat at the hot end must be quickly transferred out in time during the design to ensure that the temperature of the hot end is not too high. At present, an aluminum fin heat sink is attached to the hot end of the semiconductor, and a cooling fan is used to force cold air to flow through the heat sink to cool it. However, due to the structural limitations of the semiconductor dehumidifier, the heat dissipation effect of the part of the heat sink not covered by the fan is poor, which affects the dehumidification effect. Summary of the invention

[0003] In view of this, the present invention provides a heat dissipation bracket and a dehumidifier, which are at least used to solve the technical problem of poor heat dissipation effect of the heat sink in the prior art, specifically:

[0004] The present invention provides a heat dissipation bracket, comprising:

[0005] A chassis having a water receiving trough thereon;

[0006] The guide mechanism comprises a support frame with one end fixed on the chassis and the other end extending toward the upper part of the chassis, and a guide plate fixed on the support frame;

[0007] The guide plate extends toward the water receiving trough and is arranged inclined downward near the end of the water receiving trough.

[0008] Further optionally, a partition plate is provided on the bottom wall of the chassis, and the partition plate and the chassis on one side of the partition plate together form the water receiving trough; and the support frame is provided on the chassis on the side of the water receiving trough.

[0009] Further optionally, a water baffle is provided on the bottom wall of the chassis, and the water baffle is connected to the side walls on the same side of the two ends of the partition plate to form a water collecting portion with an opening at one end located in the water receiving trough, and the inclined lower end of the guide plate is arranged toward the opening of the water collecting portion.

[0010] Further optionally, a drainage hole is formed on the water retaining plate, and the position of the drainage hole is higher than the bottom wall of the water receiving trough.

[0011] Further optionally, an installation area is formed between the two water baffles, and support ribs are provided on the bottom wall of the water receiving trough, and the support ribs are located between the two water baffles.

[0012] Further optionally, a drainage hole is provided on the bottom wall of the water receiving trough, and the bottom wall of the water receiving trough is inclined downward in a transitional manner from the distal end of the drainage hole to the proximal end of the drainage hole.

[0013] In a second aspect, the present invention provides a dehumidifier, comprising the above-mentioned heat dissipation bracket, and also comprising a semiconductor heat sink, which is supported and mounted on the heat dissipation bracket, and the guide plate of the heat dissipation bracket receives the condensed water flowing down from the cooling plate of the semiconductor heat sink, and guides the condensed water to the lower end of the semiconductor heat sink for water cooling.

[0014] In a third aspect, the present invention provides a dehumidifier, comprising:

[0015] The above-mentioned heat dissipation bracket;

[0016] A semiconductor heat sink, the semiconductor heat sink includes a refrigeration fin, a heat sink and a cooling conduction fin, the heat sink and the cooling conduction fin are arranged on both sides of the refrigeration fin, the cooling conduction fin is located on the upper side of the guide plate, the lower part of the refrigeration fin is in sealing contact with the two water baffles, and a gap is formed between the refrigeration fin and the bottom wall of the water receiving trough for condensed water to flow to the drainage hole.

[0017] Further optionally, a water sprinkling portion is provided on the refrigeration fin, and the water sprinkling portion is located at the lower side of the cooling fin, and the condensed water flowing down from the guide plate flows onto the water sprinkling portion.

[0018] Further optionally, the water sprinkling portion includes a water sprinkling inclined surface for guiding condensed water so that the condensed water flows toward the water receiving trough.

[0019] The present invention arranges a guide plate and a water receiving trough on the heat dissipation bracket, so that when the semiconductor is dehumidified, condensed water generated at the cold end is first drained to the heat sink through the guide plate, partially cooling the heat sink and improving the dehumidification efficiency. At the same time, combined with the design of the water receiving trough, under high humidity conditions, the effect of condensed water flowing and soaking part of the heat sink can be formed, further improving the heat dissipation of the heat sink and improving the dehumidification effect under high humidity conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail its exemplary embodiments with reference to the accompanying drawings. The accompanying drawings described below are only some embodiments of the present disclosure, and it is clear to a person skilled in the art that other accompanying drawings can be obtained from these accompanying drawings without creative work.

[0021] Figure 1 A schematic diagram showing the structure of a heat dissipation bracket according to an embodiment of the present invention is shown;

[0022] Figure 2 A schematic diagram showing the assembly of a heat dissipation bracket, a semiconductor heat sink and a fan according to an embodiment of the present invention;

[0023] Figure 3 A schematic structural diagram of a semiconductor heat sink according to an embodiment of the present invention is shown.

[0024] In the figure:

[0025] 1. Heat dissipation bracket; 11. Chassis; 12. Guide plate; 13. Water receiving trough; 131. Drain hole; 132. Support rib; 14. Partition plate; 15. Water retaining plate; 151. Drain hole; 2. Semiconductor heat sink; 21. Refrigeration fin; 22. Cooling guide fin; 23. Heat sink; 24. Water spraying part; 3. Fan. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0028] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0029] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such a product or system. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the product or system including the elements.

[0030] The present invention arranges a guide plate and a water receiving trough on the heat dissipation bracket, so that when the semiconductor is dehumidified, the condensed water generated at the cold end is first drained to the heat sink through the guide plate, partially cooling the heat sink and improving the dehumidification efficiency. At the same time, combined with the design of the water receiving trough, under high humidity conditions, the effect of condensed water flowing and soaking part of the heat sink can be formed, further improving the heat dissipation of the heat sink and improving the dehumidification effect under high humidity conditions. The present invention is described in detail in combination with specific embodiments below:

[0031] like Figure 1 , Figure 2 , Figure 3 As shown, the present invention provides a heat dissipation bracket 1 for supporting a semiconductor heat sink 2 in a dehumidifier, comprising a chassis 11, a water receiving tank 13 is formed on the chassis 11, and the water receiving tank 13 is provided with:

[0032] The guide mechanism includes a support frame and a guide plate, one end of the support frame extends toward the upper side of the chassis and a guide plate 12 fixed on the support frame, the guide plate 12 is used to receive condensed water flowing down from the cooling plate 22 of the semiconductor heat sink 2, the guide plate 12 extends toward the water receiving tank 13, and is inclined downward near the end of the water receiving tank 13, and the guide plate 12 guides the condensed water to the lower end of the semiconductor heat sink 2 for water cooling;

[0033] The water receiving trough 13 is located below the guide plate 12 and is used to receive condensed water flowing down from the guide plate 12 . A drainage hole 131 is provided at the bottom of the water receiving trough 13 .

[0034] The guide plate 12 includes a guide slope, which is arranged on the chassis 11 in an inclined state. Preferably, a retaining edge is arranged on part of the edge of the guide slope, and the edge opening of the guide slope at the lower end forms a groove structure for the guide plate 12, thereby improving the guide effect of the guide plate 12.

[0035] like Figure 1 As shown, a partition plate 14 is provided in the chassis 11, and the partition plate 14 separates the water receiving trough 13 on the inner side of the chassis 11. Preferably, the partition plate 14 divides the chassis 11 into two parts, one part of which constitutes the water receiving trough 13, and the other part is used to install a fan or other electrical components, so as to prevent the electrical components from contacting with condensed water.

[0036] A drainage hole 131 is provided on the bottom wall of the water receiving trough 13, and the bottom wall of the water receiving trough 13 is inclined downward in a transitional manner from the distal end of the drainage hole 131 to the proximal end of the drainage hole 131, which is conducive to the condensed water flowing to the drainage hole 131. Specifically, in this embodiment, the bottom wall of the water receiving trough 13 is a tapered curved surface, which guides the water flow to the drainage hole 131, and specifically, the structure gradually decreases from the edge of the water receiving trough 13 to the center of the drainage hole 131, so that the condensed water can flow smoothly to the drainage hole 131.

[0037] Two water baffles 15 are provided on the bottom wall of the water receiving trough 13, and the two water baffles 15 are sealedly connected to the partition plate 14 and the bottom wall of the water receiving trough 13. The water baffles 15 are connected to the side walls on the same side of the two ends of the partition plate 14 to form a water collecting portion with one end open in the water receiving trough 13, and the inclined lower end of the guide plate 12 is arranged toward the opening of the water collecting portion.

[0038] The installation area of ​​the semiconductor heat sink 2 is formed between the two water baffles 15, and the drainage hole 131 is located between the two water baffles 15. A sealed contact can be formed between the semiconductor heat sink 2 and the water baffle 15, so that when the water level in the water receiving tank 13 is low, condensed water can only flow from the bottom of the semiconductor heat sink 2 and flow into the drainage hole 131. The setting of the water baffle 15 enables a certain amount of condensed water to be stored in the water receiving tank 13 when there is a lot of condensed water in a high humidity environment, so that the lower part of the semiconductor heat sink 2 is soaked in condensed water, further improving the heat dissipation efficiency.

[0039] Preferably, a drain hole 151 is formed on the water baffle plate 15, and the position of the drain hole 151 is higher than the bottom wall of the water receiving tank 13. When the water level in the water receiving tank 13 is high, the water can flow into the gap between the two water baffle plates 15 through the drain hole 151, and then flow into the drain hole 131, so as to prevent the water level in the water receiving tank 13 from continuously rising and overflowing. Furthermore, the drain hole 151 can be provided on both water baffle plates 15 at the same time, one can be provided on each water baffle plate 15, or multiple can be provided on each water baffle plate 15.

[0040] Preferably, a support rib 132 is provided on the bottom wall of the water receiving trough 13, and the support rib 132 is located between the two water retaining plates 15, and is used to support the semiconductor heat sink 2. The support rib 132 is provided so that there is a sufficient gap between the semiconductor heat sink 2 and the bottom wall of the water receiving trough 13 for water to flow. Furthermore, a plurality of support ribs 132 are provided around the drainage hole 131, and the support ribs 132 extend along the water flow direction, which can guide the condensed water and avoid affecting the water flow.

[0041] Preferably, in this embodiment, the heat dissipation bracket 1 further comprises a water tank installation portion, which is located at the lower side of the chassis 11 and is used to install a water tank. The drainage hole 131 of the water receiving tank 13 is connected to the water tank to receive water in the water receiving tank 13 .

[0042] Furthermore, the guide plate 12 and the chassis 11 may be formed by integral injection molding, or the guide plate 12 and the chassis 11 may be provided as separate structures and assembled by means of snaps, connectors, etc.

[0043] The present invention also provides a dehumidifier, comprising the above-mentioned heat dissipation bracket 1, such as Figure 2 As shown, it also includes:

[0044] The semiconductor heat sink 2 is arranged on the heat dissipation support 1;

[0045] The fan 3 is arranged on the heat dissipation support 1 and is used for blowing air toward the semiconductor heat dissipation fins 2 .

[0046] Preferably, the semiconductor heat sink 2 includes a refrigeration fin 21, a heat sink 23 and a cooling guide fin 22, the heat sink 23 and the cooling guide fin 22 are arranged on both sides of the refrigeration fin 21, the cooling guide fin 22 is located on the upper side of the guide plate 12, the lower part of the refrigeration fin 21 is in sealing contact with the two water retaining plates 15, and a gap is formed between the refrigeration fin 21 and the bottom wall of the water receiving groove 13 for condensed water to flow to the drainage hole 131.

[0047] like Figure 2 , Figure 3 As shown, preferably, a water sprinkling portion 24 is provided on the refrigeration fin 21 , and the water sprinkling portion 24 is located at the lower side of the cooling fin 22 , and the condensed water flowing down from the guide plate 12 flows onto the water sprinkling portion 24 .

[0048] The water spraying portion 24 includes a water spraying inclined surface, which guides the condensed water to flow to the water receiving tank 13. Specifically, the water spraying portion 24 has a structure that is narrow at the top and wide at the bottom, which increases the flow area of ​​the water flow, thereby improving the water cooling effect.

[0049] The heat dissipation support 1 of the present invention has an upper guide plate 12, which is below the cooling fin 22 and has a certain slope on its surface. A certain gap is left between the lower end of the guide plate 12 and the cooling fin 21 to form a drainage gap, which is used to guide the condensed water generated by the cooling fin 22 and automatically flows to the heat sink 23 through the inclined surface design of the guide plate 12. At the same time, the heat dissipation support 1 has a two-layer water receiving trough 13 structure design, which is used to receive the condensed water after the first-layer guide plate 12 passes through the heat sink 23. There is a low-level drainage hole 131 in the second-layer water receiving trough 13, and the drainage hole 131 is located below the heat sink 23 of the semiconductor system. This is beneficial to the further cooling of the heat sink 23 through radiation when the water flows. Through this drainage hole 131, the condensed water can be discharged to the water tank at the bottom of the semiconductor. In order to avoid the accumulation of condensed water under high humidity conditions, hydrophobic holes 151 are designed on both sides of the drainage hole 131 of the second-layer water receiving trough 13. In order to ensure the maximum capacity of the guide plate 12 to drain the condensed water, the contact area between the condensed water and the heat sink 23 must be ensured as much as possible. Therefore, the lower part of the heat sink 23 is designed to be an inclined trapezoid, which is wider at the bottom and narrower at the top, forming an inclined trapezoidal water spraying surface at the lower part of the heat sink 23.

[0050] When the whole machine is turned on, the cooling fins 22 generate condensed water when encountering humid air. The condensed water flows to a layer of guide plate 12 of the heat dissipation bracket 1 under the action of gravity and flows to the drainage gap. Through the drainage gap, the condensed water is guided to the inclined ladder water sprinkling surface at the hot end of the heat sink 23 to form a high-efficiency water cooling effect.

[0051] When the dehumidification amount is large and water accumulates under high humidity conditions, the hydrophobic holes 151 on both sides of the second-layer water receiving groove 13 can flow water above the safe water level to the drainage holes 131. At this time, due to the asymmetric design of the central axis of the cooling fins 22 and the heat sink 23 of the semiconductor dehumidifier, a part of the lower part of the heat sink 23 is lower than the second-layer water receiving groove 13 of the heat dissipation bracket 1, so a part of the accumulated condensed water soaks this part of the heat sink 23, further improving the heat dissipation of the heat sink 23, thereby ensuring a higher dehumidification efficiency of the semiconductor dehumidifier under high humidity conditions.

[0052] The exemplary embodiments of the present disclosure are specifically shown and described above. It should be understood that the present disclosure is not limited to the detailed structures, configurations or implementations described herein; on the contrary, the present disclosure is intended to cover various modifications and equivalent configurations included in the spirit and scope of the appended claims.

Claims

1. A dehumidifier, characterized in that: include: A semiconductor heat sink, the semiconductor heat sink comprising a refrigeration fin, a heat sink and a cooling conduction fin, the heat sink and the cooling conduction fin being respectively arranged on both sides of the refrigeration fin; A heat dissipation bracket, the heat dissipation bracket comprising: A bottom plate having a water receiving trough, wherein a drainage hole is provided on the bottom wall of the water receiving trough; The guide mechanism comprises a support frame with one end fixed on the chassis and the other end extending toward the upper side of the chassis and a guide plate fixed on the support frame, wherein the cooling plate is located on the upper side of the guide plate, and the guide plate extends toward the water receiving trough and is arranged to be inclined downward near the end of the water receiving trough; A partition plate is arranged on the bottom wall of the chassis, the partition plate and the chassis on one side of the partition plate together form the water receiving trough, and the support frame is arranged on the chassis on the side of the water receiving trough; Two water baffles are arranged on the bottom wall of the chassis, and the two water baffles are connected to the side walls on the same side of the two ends of the partition plate to form a water collecting portion with one end opening in the water receiving groove, and the guide plate is arranged with its inclined lower end facing the opening of the water collecting portion, and the drainage hole is located between the two water baffles; A drainage hole is formed on the water retaining plate, and the position of the drainage hole is higher than the bottom wall of the water receiving trough; A gap is left between the lower end of the guide plate and the cooling fin to form a drainage gap for draining condensed water generated by the cooling fin and guiding the condensed water to the inclined ladder water sprinkling surface at the hot end of the heat sink through the guide plate.

2. The dehumidifier according to claim 1, characterized in that: An installation area is formed between the two water baffles. A supporting rib is arranged on the bottom wall of the water receiving trough, and the supporting rib is located between the two water baffles.

3. The dehumidifier according to claim 1, characterized in that: The bottom wall of the water receiving trough is arranged to be inclined downward in a transitional manner from the far end of the drainage hole to the near end of the drainage hole.

4. The dehumidifier according to claim 1, characterized in that: The lower part of the refrigeration fin is in sealing contact with the two water baffles, and a gap is formed between the refrigeration fin and the bottom wall of the water receiving groove for condensed water to flow to the drainage hole.

5. The dehumidifier according to claim 1, characterized in that: The refrigeration fin is provided with a water sprinkling portion, the water sprinkling portion is located at the lower side of the cooling fin, and the condensed water flowing down from the guide plate flows onto the water sprinkling portion.

6. The dehumidifier according to claim 5, characterized in that: The water sprinkling portion comprises a water sprinkling inclined surface for guiding condensed water so that the condensed water flows toward the water receiving trough.

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