Package frame and package structure

Abstract

The present invention discloses a packaging frame and packaging structure, wherein the packaging frame comprises a frame body, a base island located on the frame body, a plurality of supporting feet connecting the base island and the frame body, and a plurality of separately arranged pins arranged on the frame body and located at the periphery of the base island. The frame body is provided with a plurality of metal conductive sheets, which are separately arranged from the base island and the pins, and all or part of the pins are electrically connected to the metal conductive sheets respectively to achieve short circuit between all or part of the pins. The packaging frame of the present invention can achieve short circuit between any two or more pins through the built-in metal conductive sheets, thus avoiding the need to redesign and manufacture different wafers, and also eliminating redundant bonding wires during packaging, greatly reducing development and manufacturing costs, and improving the flexibility of chip design and manufacturing. At the same time, it also reduces the chance of conflicts in packaging routing design rules, reduces problems such as short circuit between bonding wires and leads being knocked down by plastic packaging materials, and improves product yield and reliability.

Description

Technical Field

[0001] The present invention belongs to the technical field of packaging frames, and in particular relates to a packaging frame and a packaging structure. Background Art

[0002] Packaging is an important part of integrated circuit manufacturing. First, packaging is a bridge connecting the internal circuit of the chip and the external circuit; second, it can protect the chip from the influence of the external environment; finally, packaging can increase the spacing between the connection points. Traditional packaging uses frame packaging, placing the IC chip on a designed frame, fixing it on the base island of the frame with conductive or insulating materials, connecting the chip electrodes and frame pins through bonding wires (metal wires: gold wire, silver alloy wire, palladium copper wire and aluminum wire; the wire diameter is determined by the product current and the chip PAD size), and then wrapping the chip and frame with packaging material, and then curing at high temperature, and finally separating each single packaged chip.

[0003] Each chip package may have special requirements, such as special requirements for the arc length and arc height of the lead. Some chips also need special short-circuiting, and the short-circuiting is done through the package. In this case, two or more pads (PADs) on the chip will be directly connected through leads, or two or more pins (PINs) on the frame will be connected through leads. However, no matter which method is used, there will be problems with cross-wires, and even violations of design rules. In addition, problems such as low package quality or reliability failure will occur during mass production.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a packaging frame and a packaging structure. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a packaging frame and a packaging structure to solve the problem that the packaging frame requires a jumper to short-circuit two or more pins.

[0006] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0007] A packaging frame comprises a frame body, a base island located on the frame body, a plurality of supporting feet connecting the base island and the frame body, and a plurality of separately arranged pins arranged on the frame body and located at the periphery of the base island. The frame body is provided with a plurality of metal conductive sheets, which are separately arranged from the base island and the pins, and all or part of the pins are electrically connected to the metal conductive sheets respectively to achieve short circuit between all or part of the pins.

[0008] In one embodiment, the frame body is square or rectangular, the support legs are fixedly installed on the corners or sides of the frame body, one or more base islands are distributed on the frame body, and the pins are distributed on all or part of the sides of the frame body.

[0009] In one embodiment, the metal conductive sheet is located between adjacent supporting feet and between the base island and the pin; and / or the metal conductive sheet is in a strip shape or a bent shape; and / or the metal conductive sheet is a copper sheet.

[0010] In one embodiment, the packaging frame includes a first supporting leg, a second supporting leg, a third supporting leg and a fourth supporting leg, and the four supporting legs are fixedly mounted at four corners of the frame body.

[0011] In one embodiment, the packaging frame includes a first metal conductive sheet, a second metal conductive sheet, a third metal conductive sheet and a fourth metal conductive sheet in the shape of long strips. The first metal conductive sheet is located between the first supporting foot and the second supporting foot, the second metal conductive sheet is located between the second supporting foot and the third supporting foot, the third metal conductive sheet is located between the third supporting foot and the fourth supporting foot, and the fourth metal conductive sheet is located between the fourth supporting foot and the first supporting foot. All or part of the pins on the same side are electrically connected to one metal conductive sheet.

[0012] In one embodiment, the packaging frame includes a first metal conductive sheet and a second metal conductive sheet in the shape of a long strip, the first metal conductive sheet is located between the first supporting foot and the second supporting foot, the second metal conductive sheet is located between the third supporting foot and the fourth supporting foot, and all or part of the pins on the same side are electrically connected to one metal conductive sheet.

[0013] In one embodiment, the packaging frame includes a first supporting leg, a second supporting leg and a third supporting leg, two supporting legs are fixedly mounted on adjacent corners of the frame body, and another supporting leg is fixedly mounted on a corner or side of the frame body.

[0014] In one embodiment, the packaging frame includes a first metal conductive sheet in the shape of a long strip, a second metal conductive sheet in the shape of a long strip or a bent strip, and a third metal conductive sheet. The first metal conductive sheet is located between the first supporting foot and the second supporting foot, the second metal conductive sheet is located between the second supporting foot and the third supporting foot, and the third metal conductive sheet is located between the third supporting foot and the first supporting foot. All or part of the pins on the same side or adjacent sides are electrically connected to a metal conductive sheet.

[0015] Another embodiment of the present invention provides a technical solution as follows:

[0016] A packaging structure comprises a circuit board, a packaging frame packaged on the circuit board, a chip packaged on a base island in the packaging frame, and leads electrically connecting the chip and the packaging frame, wherein the packaging frame is the above-mentioned packaging frame.

[0017] In one embodiment, the packaging structure is a QFP, SOP, DFN, or QFN packaging structure.

[0018] The present invention has the following beneficial effects:

[0019] The packaging frame of the present invention can achieve short circuit of any two or more pins through the built-in metal conductive sheet, avoiding problems such as short circuit with other leads and leads being knocked down by plastic packaging materials during packaging, thereby improving product yield and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the planar structure of the packaging frame in Example 1 of the present invention;

[0022] Figure 2 This is a schematic diagram of the planar structure of the packaging frame in Example 2 of the present invention;

[0023] Figure 3 This is a schematic diagram of the planar structure of the packaging frame in Embodiment 3 of the present invention;

[0024] Figure 4 This is a schematic diagram of the planar structure of the packaging frame in Embodiment 4 of the present invention;

[0025] Figure 5 This is a schematic diagram of the planar structure of the packaging frame in Embodiment 5 of the present invention;

[0026] Figure 6 This is a schematic diagram of the planar structure of the packaging frame in Example 6 of the present invention;

[0027] Figure 7 This is a schematic diagram of the planar structure of the packaging frame in Example 7 of the present invention;

[0028] Figure 8 This is a schematic diagram of the planar structure of the packaging frame in Example 8 of the present invention. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0030] The present invention discloses a packaging frame, comprising a frame body, a base island located on the frame body, a plurality of supporting feet connecting the base island and the frame body, and a plurality of separately arranged pins arranged on the frame body and located at the periphery of the base island. A plurality of metal conductive sheets are arranged on the frame body, the metal conductive sheets are separated from the base island and the pins, and all or part of the pins are electrically connected to the metal conductive sheets respectively to achieve short circuit between all or part of the pins.

[0031] The frame body is square or rectangular, the support legs are fixedly mounted on the corners or sides of the frame body, one or more base islands are distributed on the frame body, and the pins are distributed on all or part of the sides of the frame body. The metal conductive sheet is located between adjacent support legs and between the base islands and the pins, and the metal conductive sheet is in a long strip or bent shape.

[0032] The present invention is further described below in conjunction with specific embodiments.

[0033] Embodiment 1:

[0034] Ginseng Figure 1 As shown, the packaging frame in this embodiment includes a frame body 10, a base island 20 located on the frame body, a plurality of supporting feet connecting the base island and the frame body, a plurality of pins 40 arranged on the frame body and located on the periphery of the base island, and a plurality of metal conductive sheets are arranged on the frame body, and the metal conductive sheets are separated from the base island and the pins.

[0035] Preferably, the frame body 10 in this embodiment is square, and the support legs are fixedly installed at the corners and sides of the frame body. The metal conductive sheet is located between adjacent support legs and between the base island and the pins; the metal conductive sheet is in a long strip or bent shape.

[0036] Specifically, the packaging frame in this embodiment includes a first supporting foot 31, a second supporting foot 32 and a third supporting foot 33. The first supporting foot 31 and the second supporting foot 32 are fixedly installed at adjacent corners on the frame body, namely the upper left corner and the upper right corner, and the third supporting foot 33 is fixedly installed on the side below the frame body.

[0037] Correspondingly, the packaging frame includes a first metal conductive sheet 51 in the shape of a long strip, a second metal conductive sheet 52 in the shape of a bent strip, and a third metal conductive sheet 53. The first metal conductive sheet 51 is located between the first supporting foot 31 and the second supporting foot 32, the second metal conductive sheet 52 is located between the second supporting foot 32 and the third supporting foot 33, and the third metal conductive sheet 53 is located between the third supporting foot 33 and the first supporting foot 31.

[0038] Preferably, the metal conductive sheets in this embodiment are described by taking copper sheets as an example.

[0039] The pins 40 in this embodiment are distributed on the four sides of the frame body, and the pins are separated from each other. Pin A and pin B on the same side need to be short-circuited. The short-circuiting of pin A and pin B cannot be achieved through wire bonding through the IC chip PAD, and the two pins can only be connected by the packaging frame.

[0040] like Figure 1 As shown, all pins in the original packaging frame are electrically connected to the metal conductive sheet, so the pins other than pin A and pin B need to be disconnected from the metal conductive sheet by etching, stamping, etc., to keep pin A and pin B electrically connected to the first metal conductive sheet 51.

[0041] Then, it can be baked and processed according to the normal framework, and then the packaging processes such as core mounting and wire bonding can be carried out according to the normal framework.

[0042] In this way, the pin A and the pin B can be short-circuited by the first metal conductive sheet 51 in the packaging frame, and there is no need to short-circuit through the lead wire when the chip is subsequently packaged. It should be understood that when only the pin A and the pin B need to be short-circuited, the second metal conductive sheet 52 and the third metal conductive sheet 53 may not be provided in this embodiment to reduce the process cost.

[0043] Embodiment 2:

[0044] Ginseng Figure 2 As shown, the packaging frame in this embodiment has substantially the same structure as the packaging frame in Embodiment 1, except that the positions of the pins A and B that need to be short-circuited in this embodiment are different.

[0045] The structures of the frame body, base island, support legs and metal conductive sheets are exactly the same and will not be described in detail here.

[0046] In this embodiment, pin A and pin B are located on adjacent sides, and the short circuit between pin A and pin B cannot be achieved through wire bonding via the IC chip PAD. The two pins can only be connected by the package frame.

[0047] like Figure 2As shown, all pins in the original packaging frame are electrically connected to the metal conductive sheet, so the pins other than pin A and pin B need to be disconnected from the metal conductive sheet by etching, stamping, etc., to keep pin A and pin B electrically connected to the third metal conductive sheet 53.

[0048] Then, it can be baked and processed according to the normal framework, and then the packaging processes such as core mounting and wire bonding can be carried out according to the normal framework.

[0049] In this way, the pin A and the pin B can be short-circuited by the third metal conductive sheet 53 in the packaging frame, and there is no need to short-circuit through the lead wire when the chip is subsequently packaged. It should be understood that when only the pin A and the pin B need to be short-circuited, the first metal conductive sheet 51 and the second metal conductive sheet 52 may not be provided in this embodiment to reduce the process cost.

[0050] Embodiment 3:

[0051] Ginseng Figure 3 As shown, the packaging frame in this embodiment has substantially the same structure as the packaging frame in Embodiment 1, except that the number and positions of the pins to be short-circuited in this embodiment are different.

[0052] The structures of the frame body, base island, support legs and metal conductive sheets are exactly the same and will not be described in detail here.

[0053] In this embodiment, the pins that need to be short-circuited include pin A and pin B located on the same side, and pin C located on the adjacent side. The short-circuiting of pins A, B and C cannot be achieved through wire bonding through the IC chip PAD, and the two pins can only be connected by the packaging frame.

[0054] like Figure 3 As shown, all the pins in the original packaging frame are electrically connected to the metal conductive sheet, so the pins other than pin A, pin B and pin C need to be disconnected from the metal conductive sheet by etching, stamping, etc., to keep pin A, pin B and pin C electrically connected to the second metal conductive sheet 52.

[0055] Then, it can be baked and processed according to the normal framework, and then the packaging processes such as core mounting and wire bonding can be carried out according to the normal framework.

[0056] In this way, the pin A, the pin B and the pin C can be short-circuited in the packaging frame by the second metal conductive sheet 52, and there is no need to short-circuit through the lead wire when the chip is subsequently packaged. It should be understood that when only the pin A, the pin B and the pin C need to be short-circuited, the first metal conductive sheet 51 and the third metal conductive sheet 53 may not be provided in this embodiment to reduce the process cost.

[0057] The above three embodiments are all described using three supporting feet as an example. In other embodiments, the position of the third supporting foot 33 can be changed according to the packaging requirements. On the premise of ensuring the stability of the frame, the third supporting foot 33 can be set at any position on the corner or side. Examples will not be given one by one here.

[0058] Embodiment 4:

[0059] Ginseng Figure 4 As shown, the packaging frame in this embodiment has substantially the same structure as the packaging frame in Embodiment 1, except that in this embodiment, all pins corresponding to the same metal conductive sheet need to be short-circuited.

[0060] The structures of the frame body, base island, support legs and metal conductive sheets are exactly the same and will not be described in detail here.

[0061] like Figure 4 As shown, all pins between the first supporting pin 31 and the second supporting pin 32 are electrically connected to the first metal conductive sheet 51, all pins between the second supporting pin 32 and the third supporting pin 33 are electrically connected to the second metal conductive sheet 52, and all pins between the third supporting pin 33 and the first supporting pin 31 are electrically connected to the third metal conductive sheet 53.

[0062] Embodiment 5:

[0063] Ginseng Figure 5 As shown, the packaging frame in this embodiment includes a frame body 10, a base island 20 located on the frame body, a plurality of supporting feet connecting the base island and the frame body, a plurality of pins 40 arranged on the frame body and located on the periphery of the base island, and a plurality of metal conductive sheets are arranged on the frame body, and the metal conductive sheets are separated from the base island and the pins.

[0064] Preferably, the frame body 10 in this embodiment is square, and the support legs are fixedly installed at the corners of the frame body. The metal conductive sheet is located between adjacent support legs and between the base island and the pins; the metal conductive sheet is in the shape of a long strip.

[0065] Specifically, the packaging frame in this embodiment includes a first supporting leg 31 , a second supporting leg 32 , a third supporting leg 33 and a fourth supporting leg 34 , and the four supporting legs are all fixedly mounted at the corners of the frame body.

[0066] Correspondingly, the packaging frame includes a first metal conductive sheet 51, a second metal conductive sheet 52, a third metal conductive sheet 53 and a fourth metal conductive sheet in the shape of long strips. The first metal conductive sheet 51 is located between the first supporting foot 31 and the second supporting foot 32, the second metal conductive sheet 52 is located between the second supporting foot 32 and the third supporting foot 33, the third metal conductive sheet 53 is located between the third supporting foot 33 and the fourth supporting foot 34, and the fourth metal conductive sheet 54 is located between the fourth supporting foot 34 and the first supporting foot 31.

[0067] Preferably, the metal conductive sheets in this embodiment are described by taking copper sheets as an example.

[0068] The pins 40 in this embodiment are distributed on the four sides of the frame body, and the pins are separated from each other. All the pins on the same side need to be short-circuited. The short-circuiting of the pins cannot be achieved through wire bonding through the IC chip PAD, and the two pins can only be connected by the packaging frame.

[0069] like Figure 5 As shown, all pins in the package frame are electrically connected to the metal conductive sheet, and all pins on the same side are electrically connected to the corresponding metal conductive sheet.

[0070] Then, it can be baked and processed according to the normal framework, and then the packaging processes such as core mounting and wire bonding can be carried out according to the normal framework.

[0071] In this way, the pins on each side can be short-circuited in the packaging frame through four metal conductive sheets.

[0072] Embodiment 6:

[0073] Ginseng Figure 6 As shown, the packaging frame in this embodiment has roughly the same structure as the packaging frame in Example 5. The difference is that, in Example 5, only one base island is provided on the frame body, while in this embodiment, four base islands distributed in an array are provided on the frame body, so that the packaging of multiple identical or different chips can be realized.

[0074] Embodiment 7:

[0075] Ginseng Figure 7 As shown, the packaging frame in this embodiment includes a frame body 10, a base island 20 located on the frame body, a plurality of supporting feet connecting the base island and the frame body, a plurality of pins 40 arranged on the frame body and located on the periphery of the base island, and a plurality of metal conductive sheets are arranged on the frame body, and the metal conductive sheets are separated from the base island and the pins.

[0076] Preferably, the frame body 10 in this embodiment is rectangular, and the support legs are fixedly installed at the corners of the frame body. The metal conductive sheet is located between adjacent support legs and between the base island and the pins; the metal conductive sheet is in the shape of a long strip.

[0077] Specifically, the packaging frame in this embodiment includes a first supporting leg 31 , a second supporting leg 32 , a third supporting leg 33 and a fourth supporting leg 34 , and the four supporting legs are all fixedly mounted at the corners of the frame body.

[0078] Correspondingly, the packaging frame includes a first metal conductive sheet 51 and a second metal conductive sheet 52 in the shape of a long strip. The first metal conductive sheet 51 is located between the first supporting leg 31 and the second supporting leg 32 , and the second metal conductive sheet 52 is located between the third supporting leg 33 and the fourth supporting leg 34 .

[0079] In this embodiment, the pins on the two sides of the frame body are electrically connected to the first metal conductive sheet 51 and the second metal conductive sheet 52 respectively, so as to achieve short circuit of the pins on each side.

[0080] Embodiment 8:

[0081] Ginseng Figure 8 As shown, the packaging frame in this embodiment has roughly the same structure as the packaging frame in Example 7. The difference is that, while there is only one base island on the frame body in Example 7, there are four base islands distributed in a straight line on the frame body in this embodiment, so that the packaging of multiple identical or different chips can be achieved.

[0082] The number and position of the supporting feet, metal conductive sheets and base islands in the packaging frame of the present invention can be set as needed and are not limited to three or four supporting feet and metal conductive sheets. The second short-circuited pins are not limited to the same side or adjacent sides. All technical solutions that use metal conductive sheets to achieve pin short-circuiting in the packaging frame fall within the scope of protection of the present invention.

[0083] In addition, the present invention also discloses a packaging structure, including a circuit board, a packaging frame packaged on the circuit board, a chip packaged on a base island in the packaging frame, and leads electrically connecting the chip and the packaging frame.

[0084] The packaging frame is the packaging frame in the above embodiments, which is used to connect the lead wire and the circuit board; the chip is packaged on the base island in the packaging frame; the lead wire is used to connect the chip and the packaging frame, and the lead wire connects the PAD on the chip to the packaging frame. Among them, the lead wire can be a bonding wire such as a gold wire, a silver alloy wire, or a palladium copper wire.

[0085] During the plastic packaging process, the leads may be knocked down and short-circuited with adjacent leads or fall outside the plastic packaging body. However, the present invention can avoid this problem by short-circuiting the pins that need to be short-circuited through the metal conductive sheet pre-installed in the packaging frame.

[0086] The packaging structure in the present invention can be a packaging structure such as QFP, SOP, DFN, QFN, etc.

[0087] It can be seen from the above technical solutions that the present invention has the following advantages:

[0088] The packaging frame of the present invention can achieve short-circuiting of any two or more pins through the built-in metal conductive sheet, and can conveniently use the same chip to package different products through this frame, thereby avoiding the need to redesign and manufacture different wafers, and eliminating redundant bonding wires during packaging, greatly reducing development and manufacturing costs, and improving the flexibility of chip design and manufacturing. At the same time, it also reduces the chance of conflict in packaging routing design rules, and also reduces problems such as short-circuiting between bonding wires and leads being knocked down by plastic packaging materials, thereby improving product yield and reliability.

[0089] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0090] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A packaging frame, characterized in that: The packaging frame includes a frame body, a base island located on the frame body, a plurality of supporting feet connecting the base island and the frame body, and a plurality of separately arranged pins arranged on the frame body and located on the periphery of the base island. The frame body is provided with a plurality of metal conductive sheets, which are separated from the base island and the pins. All or part of the pins are electrically connected to the metal conductive sheets respectively to achieve short circuit between all or part of the pins.

2. The packaging frame according to claim 1, characterized in that: The frame body is square or rectangular, the support legs are fixedly installed on the corners or sides of the frame body, one or more base islands are distributed on the frame body, and the pins are distributed on all or part of the sides of the frame body.

3. The packaging frame according to claim 2, characterized in that: The metal conductive sheet is located between adjacent supporting feet and between the base island and the pin; and / or, the metal conductive sheet is in a strip shape or a bent shape; and / or, the metal conductive sheet is a copper sheet.

4. The packaging frame according to claim 2, characterized in that: The packaging frame comprises a first supporting leg, a second supporting leg, a third supporting leg and a fourth supporting leg, and the four supporting legs are fixedly installed at four corners of the frame body.

5. The packaging frame according to claim 4, characterized in that: The packaging frame includes a first metal conductive sheet, a second metal conductive sheet, a third metal conductive sheet and a fourth metal conductive sheet in the shape of long strips. The first metal conductive sheet is located between the first supporting foot and the second supporting foot, the second metal conductive sheet is located between the second supporting foot and the third supporting foot, the third metal conductive sheet is located between the third supporting foot and the fourth supporting foot, and the fourth metal conductive sheet is located between the fourth supporting foot and the first supporting foot. All or part of the pins on the same side are electrically connected to a metal conductive sheet.

6. The packaging frame according to claim 4, characterized in that: The packaging frame includes a first metal conductive sheet and a second metal conductive sheet in the shape of a long strip. The first metal conductive sheet is located between the first supporting foot and the second supporting foot, and the second metal conductive sheet is located between the third supporting foot and the fourth supporting foot. All or part of the pins on the same side are electrically connected to one metal conductive sheet.

7. The packaging frame according to claim 2, characterized in that: The packaging frame comprises a first supporting leg, a second supporting leg and a third supporting leg, two supporting legs are fixedly mounted on adjacent corners of the frame body, and another supporting leg is fixedly mounted on a corner or side of the frame body.

8. The packaging frame according to claim 7, characterized in that: The packaging frame includes a first long metal conductive sheet, a second long or bent metal conductive sheet and a third metal conductive sheet. The first metal conductive sheet is located between the first supporting foot and the second supporting foot, the second metal conductive sheet is located between the second supporting foot and the third supporting foot, and the third metal conductive sheet is located between the third supporting foot and the first supporting foot. All or part of the pins on the same side or adjacent sides are electrically connected to a metal conductive sheet.

9. A packaging structure, characterized in that: The packaging structure includes a circuit board, a packaging frame packaged on the circuit board, a chip packaged on a base island in the packaging frame, and leads electrically connecting the chip and the packaging frame. The packaging frame is the packaging frame according to any one of claims 1 to 8.

10. The packaging structure according to claim 9, characterized in that: The packaging structure is a QFP, SOP, DFN, or QFN packaging structure.

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