OLED display motherboard and preparation method thereof

Abstract

The present invention provides an OLED display motherboard and a preparation method thereof. The OLED display motherboard comprises a substrate and a plurality of display units distributed on the substrate, wherein each display unit comprises a display area and a TEG test component surrounding the display area and arranged at a surface edge; the TEG test component comprises a test light-emitting area and an anode terminal and a cathode terminal electrically connected to a light-emitting device in the test light-emitting area, the test light-emitting area is located in the display area, and the anode terminal and the cathode terminal are located outside the display area; the OLED display motherboard of the present invention has the advantages that during the production process, it is not necessary to open a hole on a mask stencil, thereby improving the yield and efficiency of a vapor deposition section, and a signal generating device is used to input a positive voltage signal and a negative voltage signal to the TEG test component respectively, so as to test whether the TEG test component is operating normally; it is not necessary to open a hole on a vapor deposition mask stencil, thereby meeting the demand for real-time monitoring, thereby improving the production capacity and production efficiency of the display unit.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an OLED display motherboard and a preparation method thereof. Background Art

[0002] With the demand for OLED display panels of different sizes and types, the need to seize the market as soon as possible, and the consideration of factory capacity matching, more and more panel manufacturers are mixing OLED display panels of different sizes and types on the same motherboard for preparation and cutting in order to improve capacity and production efficiency.

[0003] like Figure 1 , Figure 2 and Figure 3 As shown, a plurality of display units are arranged on the display motherboard, such as the display unit 11. In the preparation process of the display device in the display unit, since it is necessary to monitor the efficiency and life of the light-emitting device, it is necessary to set an opening 13 on the mask screen 12 of the evaporated metal mask plate, and use a high-precision camera to monitor in real time whether there are defects in the film layer prepared by the light-emitting device. Since the width of the mask screen 12 is very small and the opening 13 is arranged in the middle, the edge 14 and the edge 15 on both sides of the mask screen 12 corresponding to the opening 13 are at great risk of deformation and bending, and are very likely to twist inward, resulting in a reduction in the area of ​​the opening 13 and a narrowing of the width, which cannot meet the requirements of the monitoring design.

[0004] In summary, it is necessary to propose an OLED display motherboard and a preparation method thereof to solve the above-mentioned technical problem that during the preparation process of the OLED display motherboard, the production efficiency and life of the light-emitting device need to be monitored in real time, and holes need to be opened in the evaporation mask stencil. The risk of deformation and bending of the metal strips at the openings is very high, resulting in the narrowing of the openings, which cannot meet the needs of real-time monitoring design. Summary of the invention

[0005] Based on the problems of the prior art, the present application provides an OLED display motherboard and a preparation method thereof, which can solve the problem in the prior art that during the preparation process of the OLED display motherboard, the production efficiency and life of the light-emitting device need to be monitored in real time, holes need to be opened in the evaporation mask screen, and the risk of deformation and bending of the metal strips at the openings is very high, resulting in the narrowing of the openings, which cannot meet the needs of the real-time monitoring design.

[0006] In order to solve the above technical problems, the technical solutions provided by the present invention are as follows:

[0007] An embodiment of the present invention provides an OLED display motherboard, which includes a substrate and a plurality of display units distributed on the substrate, each of the display units includes a display area and a TEG test component surrounding the display area and arranged at a surface edge.

[0008] The TEG test component includes a test light emitting area and a test terminal electrically connected to the test light emitting area, the test light emitting area uses display pixels in the display area, and the test terminal is located outside the display area.

[0009] According to a preferred embodiment of the present invention, the test terminal includes an anode terminal and a cathode terminal, a metal signal line is connected between the anode terminal and the end face of the light-emitting device in the test light-emitting area, and the cathode terminal is directly electrically connected to the end face of the light-emitting device.

[0010] According to a preferred embodiment of the present invention, the metal signal line is covered with a pixel definition layer or a planarization layer, and the material of the metal signal line is one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum and titanium.

[0011] According to a preferred embodiment of the present invention, the anode terminal includes a first sub-anode terminal, a second sub-anode terminal and a third sub-anode terminal arranged in sequence, and the first sub-anode terminal, the second sub-anode terminal and the third sub-anode terminal respectively input drive signals to the corresponding R / G / B light-emitting devices.

[0012] According to a preferred embodiment of the present invention, the first sub-anode terminal, the second sub-anode terminal and the third sub-anode terminal are electrically connected to the corresponding R / G / B light-emitting devices through a single metal signal line.

[0013] According to a preferred embodiment of the present invention, the test light emitting area is an array of 50×50 light emitting devices.

[0014] According to a preferred embodiment of the present invention, the cathode terminal is a whole layer of metal, and the material of the cathode terminal is one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum, titanium, aluminum or aluminum alloy.

[0015] According to a preferred embodiment of the present invention, the display units are arranged horizontally or vertically, and a non-display area is between two adjacent display units, wherein the OLED display motherboard includes two rows of the display units, the display units in the first row are arranged horizontally, and the display units in the second row are arranged vertically, and at least one TEG test component is arranged on the edge of each display unit.

[0016] According to the OLED display motherboard of the above embodiment, the present invention further provides a method for preparing an OLED display motherboard, the method comprising:

[0017] Step S1, providing an OLED display motherboard, wherein the OLED display motherboard comprises a substrate and a plurality of display units arrayed and distributed on the substrate;

[0018] Step S2, preparing a TEG test assembly around the display area and surface edge of each of the display units; wherein the TEG test assembly includes a test light-emitting area and a test terminal electrically connected to the light-emitting device of the test light-emitting area.

[0019] According to a preferred embodiment of the present invention, step S2 specifically includes:

[0020] Step S21 , selecting a portion of the display pixel area at the edge of the display unit as a test light emitting area, and preparing an anode terminal and a cathode terminal in a non-display area adjacent to the test light emitting area.

[0021] Step S22, preparing a metal signal line between the light emitting device in the test light emitting area and the anode terminal, wherein the metal signal line is covered with a pixel definition layer or a planarization layer.

[0022] Step S23, using a signal generating device to input a positive voltage signal and a negative voltage signal to the anode terminal and the cathode terminal respectively, so as to test whether the light-emitting device in the test light-emitting area emits light normally.

[0023] Beneficial effects of the present invention: An embodiment of the present invention provides an OLED display motherboard and a preparation method thereof, the OLED display motherboard comprises a substrate and a plurality of display units distributed on the substrate, each of the display units comprises a display area and a TEG test component arranged around the display area and at a surface edge; the TEG test component comprises a test light-emitting area and an anode terminal and a cathode terminal electrically connected to a light-emitting device in the test light-emitting area, the light-emitting device is located in the display area, and the anode terminal and the cathode terminal are located outside the display area; the OLED display motherboard of the present invention has the advantage that during the production process, it is not necessary to open a hole on a mask stencil, thereby improving the yield and efficiency of the evaporation section, by setting the TEG test component in the display area and at the surface edge and in the non-display area, a signal generating device is used to input a positive voltage signal and a negative voltage signal to the TEG test component respectively, so as to test whether the TEG test component is working normally, and if it is normally luminous, it is verified that there is no quality problem in the film layer prepared by the corresponding display unit, and it is not necessary to open a hole on the evaporation mask stencil, which causes a great risk of deformation and bending of the metal strip at the opening, resulting in the problem of narrowing of the opening, and can meet the needs of real-time monitoring, thereby improving the production capacity and production efficiency of the display unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic diagram of the structural preparation of an OLED display motherboard in the prior art.

[0026] Figure 2 and Figure 3 This is a schematic diagram of monitoring the deformation of the openings on the mask screen during the preparation process of the OLED display motherboard in the prior art.

[0027] Figure 4 The present invention provides a schematic diagram of the top structure of an OLED display motherboard.

[0028] Figure 5 and Figure 6 The present invention provides a schematic structural diagram of a TEG test component in an OLED display motherboard.

[0029] Figure 7 The present invention provides a schematic diagram of the film layer structure of a display unit of an OLED display motherboard. DETAILED DESCRIPTION

[0030] The following descriptions of the embodiments are made with reference to the attached diagrams to illustrate specific embodiments in which the present invention may be implemented. The directional terms mentioned in the present invention, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached diagrams. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention. In the figures, units with similar structures are represented by the same reference numerals, and the dotted lines in the figures represent those that do not exist in the structure and only illustrate the shape and position of the structure.

[0031] The present invention aims to solve the problem that in the prior art OLED display motherboard preparation process, it is necessary to monitor the production efficiency and life of the light-emitting device in real time, and holes need to be opened on the evaporation mask screen. The risk of deformation and bending of the metal strips at the openings is very high, resulting in the openings becoming narrower, and the need for real-time monitoring design cannot be met. The present invention can overcome the above technical defects.

[0032] In order to solve the above technical problems, an embodiment of the present invention provides a new type of OLED display motherboard, which includes a substrate and a plurality of display units distributed on the substrate, each of which includes a display area and a TEG test component surrounding the display area and arranged at the surface edge; the TEG test component includes a test light-emitting area and an anode terminal and a cathode terminal electrically connected to the light-emitting device of the test light-emitting area, the light-emitting device of the test light-emitting area is located in the display area, and the edge of the display unit is used to display pixels. The anode terminal and the cathode terminal are located outside the display area. The advantage of the OLED display motherboard of the present invention is that during the production process, there is no need to open holes on the mask screen, thereby improving the yield and efficiency of the evaporation section. By setting the TEG test component in the display area and at the edge of the surface and in the non-display area, a signal generating device is used to input positive voltage signals and negative voltage signals to the TEG test component respectively to test whether the TEG test component is working normally. If it is luminous normally, it is verified that there is no quality problem with the film layer prepared by the corresponding display unit. There is no need to open holes on the evaporation mask screen, which causes a very high risk of deformation and bending of the metal strip at the opening, resulting in problems such as narrowing of the opening and evaporation accuracy. The demand for real-time monitoring can be met, thereby improving the production capacity and production efficiency of the display unit.

[0033] In the test luminous area of ​​TEG of the present invention, the test luminous area is retained in the display area, and the electrode area is designed in the area directly below the mask stencil, so that the corresponding test area can be prepared for production efficiency and life testing without opening holes in the metal strips on the mask stencil. The test luminous area is required to be at least 50×50 pixels to ensure the accuracy of the measurement of the measuring equipment. The size of the anode terminal and the cathode terminal is at least greater than 3mm×3mm or other dimensions. In order to ensure the success rate of needle insertion, the larger the better, and it only needs to be smaller than the width of the metal strip on the mask stencil; this solution can be applied to the life and efficiency monitoring of W-OLED, or IJP-OLED or R, G, B-side-by-side evaporation devices or QD-OLED during production operations; the number and design of TEG test components can be changed according to various display unit layout designs, and are particularly suitable for narrow bezels, MMG and other products.

[0034] Specifically, Figure 4As shown, the present invention provides a schematic diagram of a top view structure of an OLED display motherboard 100. The OLED display motherboard 100 includes a substrate and a plurality of display units distributed on the substrate, each of the display units includes a display area and a TEG test component 110 arranged around the display area and on the surface edge. The OLED display motherboard 100 in this embodiment includes two rows of display units, the number of display units in the first row is 2, and the display units 101 and 102 are arranged horizontally; the number of display units in the second row is 3, and the display units 103, 104 and 105 are arranged vertically.

[0035] Each of the display units in this embodiment includes a display area and a TEG test component 110 that surrounds the display area and is arranged on the surface edge. The TEG test component 110 includes a test light-emitting area and a test terminal electrically connected to the light-emitting device of the test light-emitting area. The test light-emitting area is located in the display area. The test light-emitting area borrows the display pixels in the display area. The test terminal is located outside the display area. A signal generating device is used to input positive voltage signals and negative voltage signals to the TEG test component respectively to test whether the TEG test component is working normally, thereby monitoring whether the film preparation quality of the corresponding display unit meets the standards.

[0036] Figure 5 Combination Figure 4 The present invention provides a structural schematic diagram of a TEG test component 110. The TEG test component 110 includes a test light-emitting area 111 and a test terminal electrically connected to the light-emitting device of the test light-emitting area 111, the test terminal includes an anode terminal 112 and a cathode terminal 115, a metal signal line 113 is connected between the anode terminal 112 and the end face of the light-emitting device of the test light-emitting area, and the cathode terminal 115 is directly electrically connected to the end face of the light-emitting device. The metal signal line 113 is covered with a protective layer 114, and the protective layer 114 is preferably a pixel definition layer or a planarization layer. The material of the metal signal line 113 is one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum and titanium, and the material of the anode terminal 112 is also one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum and titanium. The cathode terminal 115 is a whole layer of metal, and the material of the cathode terminal 115 is one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum, titanium, aluminum or aluminum alloy.

[0037] In this embodiment, an interface S1 is formed between the test light emitting area 111, the anode terminal 112 and the cathode terminal 115. The test light emitting area 111 is located in the display area within the interface S1, and the anode terminal 112 and the cathode terminal 115 are located in the non-display area outside the interface S1.

[0038] Figure 6 Combination Figure 4 , the present invention provides another structural schematic diagram of a TEG test component 110. The TEG test component 110 includes a test light-emitting area 111 and a test terminal electrically connected to the light-emitting device of the test light-emitting area 111, the test terminal includes an anode terminal and the cathode terminal 115, the anode terminal includes a first sub-anode terminal 1121, a second sub-anode terminal 1122 and a third sub-anode terminal 1123 arranged in sequence, the first sub-anode terminal 1121, the second sub-anode terminal 1122 and the third sub-anode terminal 1123 respectively input drive signals to the corresponding R / G / B light-emitting devices. The first sub-anode terminal 1121, the second sub-anode terminal 1122 and the third sub-anode terminal 1123 are all electrically connected to the corresponding light-emitting device through a metal signal line. That is, the first sub-anode terminal 1121 is electrically connected to the corresponding R light-emitting device through a metal signal line 1131, the second sub-anode terminal 1122 is electrically connected to the corresponding G light-emitting device through a metal signal line 1132, and the third sub-anode terminal 1123 is electrically connected to the corresponding B light-emitting device through a metal signal line 1133. The test light-emitting area 111 is preferably a 50×50 light-emitting device array. The first sub-anode terminal 1121, the second sub-anode terminal 1122, and the third sub-anode terminal 1123 are all covered with a protective layer 114, and the protective layer 114 is preferably a pixel definition layer or a planarization layer.

[0039] like Figure 6 As shown, the present invention provides a schematic diagram of the membrane structure of a display unit of an OLED display motherboard. The present invention takes the display unit 102 as an example to illustrate a schematic diagram of some membrane layers in the OLED display motherboard, and the other membrane layers are similar to the display unit 102 and will not be repeated here.

[0040] The display unit 102 includes a substrate 1001, an anode 1021 located on the substrate 1001, a pixel definition layer 1024 and a pixel definition layer 1025 located on the anode 1021, the pixel definition layer 1024 and the pixel definition layer 1025 are separately arranged to form a pixel opening, one pixel opening corresponds to one light-emitting device, a light-emitting material layer 1022 is deposited in the pixel opening, and a cathode 1023 is arranged on the light-emitting material layer 1022. The anode 1021, the light-emitting material layer 1022 and the cathode 1023 form a light-emitting device. The driving circuit connection method of the light-emitting device of the present invention is as follows: the substrate 1001 is preferably a glass substrate, Figure 7The glass substrate and the anode 1021 are also provided with a driving circuit layer (not shown in the figure). The driving circuit layer is preferably a thin film transistor circuit layer, including a buffer layer located on the substrate 1001, a plurality of driving thin film transistors arranged on the buffer layer, a planarization layer is provided on the plurality of driving thin film transistors, a via is provided on the planarization layer, and the anode 1021 of the light emitting device is electrically connected to the drain of the driving thin film transistor through the via. The source of the driving thin film transistor is connected to the positive electrode of the external power supply, the flexible printed circuit board is attached with the corresponding driving chip, the negative electrode of the external power supply passes through the binding area, and the corresponding electrical signal is transmitted to the power wiring layer, and finally the power wiring layer transmits the corresponding electrical signal to the cathode 1023 of the light emitting device, so as to provide the required voltage to the light emitting device.

[0041] According to the OLED display motherboard in the above embodiment, the present invention further provides a method for preparing an OLED display motherboard, the method comprising:

[0042] Step S1, providing an OLED display motherboard, wherein the OLED display motherboard comprises a substrate and a plurality of display units arrayed and distributed on the substrate.

[0043] Step S2, preparing a TEG test assembly around the display area and surface edge of each of the display units; wherein the TEG test assembly includes a test light-emitting area and a test terminal electrically connected to the light-emitting device of the test light-emitting area.

[0044] Preferably, step S2 specifically includes: step S21, selecting a portion of the display pixel area at the edge of the display unit as a test light-emitting area, and preparing an anode terminal and a cathode terminal in a non-display area adjacent to the test light-emitting area. Step S22, preparing a metal signal line between the light-emitting device in the test light-emitting area and the anode terminal, and covering the metal signal line with a pixel definition layer or a planarization layer. Step S23, using a signal generating device to input a positive voltage signal and a negative voltage signal to the anode terminal and the cathode terminal, respectively, to test whether the light-emitting device in the test light-emitting area emits light normally.

[0045] Preferably, step S2 also includes: the anode terminal includes a first anode terminal, a second anode terminal and a third anode terminal arranged in sequence, and the first anode terminal, the second anode terminal and the third anode terminal respectively input drive signals to the corresponding R / G / B light-emitting devices; the first anode terminal, the second anode terminal and the third anode terminal are each electrically connected to the corresponding light-emitting device through a metal signal line.

[0046] The specific preparation method of the OLED display motherboard of the present invention is as follows: directly below the metal strip on the mask stencil outside the display area of ​​the display unit (i.e., the EL Mask stick area), an anode terminal and a cathode terminal (Mo / Ti / Cu) and a metal signal line of the anode are formed according to corresponding arrangement requirements, referring to Figure 5 . A pixel definition layer or a planarization layer is plated on the anode lead for protection. In the display area corresponding to the driving circuit layer of the display unit, a corresponding mask is used to prepare a pixel arrangement of at least 50×50 electrically connected to the anode terminal and the cathode terminal through processes such as exposure and etching. All anode terminals are overlapped with the anode leakage terminal of the display unit through metal signal lines. A metal signal line 113 is connected between the anode terminal 112 and the end face of the light-emitting device in the test light-emitting area, and the cathode terminal 115 is directly electrically connected to the end face of the light-emitting device. The above-mentioned prepared substrate is transferred to the light-emitting device layer section during the normal production process. The light-emitting device layer section does not need to replace the metal mask plate. The normal process is to evaporate or print the organic light-emitting layer, cathode and packaging layer on the entire surface. After the packaging layer is prepared, the display unit is cut and placed on a life measurement machine for testing.

[0047] The specific preparation method of the OLED display motherboard of the present invention is as follows: the anode terminal and the cathode terminal (Mo / Ti / Cu) and the metal signal line of the anode are formed according to the corresponding arrangement requirements directly below the metal strip on the mask stencil outside the display area of ​​the display unit (EL Mask stick area), and the metal signal line of the anode is formed according to the corresponding arrangement requirements. Figure 6. A pixel definition layer or a planarization layer is plated on the anode lead for protection. In the display area corresponding to the driving circuit layer of the display unit, a pixel arrangement of at least 50×50 electrically connected to the anode terminal and the cathode terminal is prepared by exposure and etching and other processes using a corresponding mask, and all anode terminals are overlapped with the anode leakage terminal of the display unit through metal signal lines. All R pixel anode leakage terminals in the test light-emitting area are overlapped with the corresponding anode terminal through metal signal lines. All G pixel anode leakage terminals in the test light-emitting area are overlapped with the corresponding anode terminal through metal signal lines. All B pixel anode leakage terminals in the test light-emitting area are overlapped with the corresponding anode terminal through metal signal lines. That is, the first sub-anode terminal 1121 is electrically connected to the corresponding R light-emitting device through a metal signal line 1131, the second sub-anode terminal 1122 is electrically connected to the corresponding G light-emitting device through a metal signal line 1132, the third sub-anode terminal 1123 is electrically connected to the corresponding B light-emitting device through a metal signal line 1133, and the cathode terminal 115 is directly electrically connected to the end surface of the light-emitting device. The above-prepared substrate is transferred to the light-emitting device layer section during the normal production process. The light-emitting device layer section does not need to replace the metal mask plate. The organic light-emitting layer, cathode and packaging layer are evaporated or printed on the whole surface in the normal process. After the packaging layer is prepared, the display unit is cut and placed on the life measurement machine for testing.

[0048] The embodiment of the present invention provides a novel OLED display motherboard and a preparation method thereof, wherein the OLED display motherboard comprises a substrate and a plurality of display units distributed on the substrate, wherein each of the display units comprises a display area and a TEG test assembly arranged around the display area and at the edge of the surface; the TEG test assembly comprises a test light-emitting area and an anode terminal and a cathode terminal electrically connected to a light-emitting device in the test light-emitting area, wherein the light-emitting device is located in the display area, and the anode terminal and the cathode terminal are located outside the display area. The OLED display motherboard of the present invention has the advantage that during the production process, it is not necessary to open a hole on a mask stencil, thereby improving the yield and efficiency of the evaporation section, and by setting the TEG test assembly in the display area and at the edge of the surface and in the non-display area, a signal generating device is used to input a positive voltage signal and a negative voltage signal to the TEG test assembly respectively to test whether the TEG test assembly is working normally, and if it is emitting light normally, it is verified that there is no quality problem in the film layer prepared by the corresponding display unit, and there is no need to open a hole on the evaporation mask stencil, which causes a great risk of deformation and bending of the metal strip at the opening, resulting in the problem of narrowing of the opening, and can meet the needs of real-time monitoring, thereby improving the production capacity and production efficiency of the display unit.

[0049] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. An OLED display motherboard, characterized in that: It comprises a substrate and a plurality of display units distributed on the substrate, each of the display units comprises a display area and a TEG test component surrounding the display area and arranged at a surface edge; The TEG test component includes a test light-emitting area and a test terminal electrically connected to the test light-emitting area, the test light-emitting area uses part of the edge of the display unit to display pixels, the test terminal is located outside the display area, the test light-emitting area is a 50×50 light-emitting device array, the test terminal is electrically connected to the light-emitting device array, the test terminal includes an anode terminal and a cathode terminal, the anode terminal and the cathode terminal are both larger than 3mm×3mm, the electrode area is designed in the area directly below the mask screen of the evaporation section during the production process of the OLED display motherboard, and the anode terminal and the cathode terminal are smaller than the metal strip width of the mask screen.

2. The OLED display motherboard according to claim 1, characterized in that: A metal signal line is connected between the anode terminal and the end surface of the light emitting device in the test light emitting area, and the cathode terminal is directly electrically connected to the end surface of the light emitting device.

3. The OLED display motherboard according to claim 2, characterized in that: The metal signal line is covered with a pixel definition layer or a planarization layer, and the material of the metal signal line is one or more combination materials of molybdenum, copper, chromium, tungsten, tantalum and titanium.

4. The OLED display motherboard according to claim 2, characterized in that: The anode terminal includes a first sub-anode terminal, a second sub-anode terminal and a third sub-anode terminal arranged in sequence, and the first sub-anode terminal, the second sub-anode terminal and the third sub-anode terminal respectively input drive signals to corresponding R / G / B light-emitting devices.

5. The OLED display motherboard according to claim 4, characterized in that: The first sub-anode terminal, the second sub-anode terminal and the third sub-anode terminal are electrically connected to the corresponding R / G / B light-emitting devices through a metal signal line.

6. The OLED display motherboard according to claim 2, characterized in that: The cathode terminal is a whole layer of metal, and the material of the cathode terminal is one or more combination materials selected from molybdenum, copper, chromium, tungsten, tantalum, titanium, aluminum or aluminum alloy.

7. The OLED display motherboard according to claim 1, characterized in that: The display units are arranged horizontally or vertically, and a non-display area is between two adjacent display units. The OLED display motherboard includes two rows of display units, the display units in the first row are arranged horizontally, and the display units in the second row are arranged vertically. At least one TEG test component is arranged on the edge of each display unit.

8. A method for preparing an OLED display motherboard, characterized in that: The method comprises: Step S1, providing an OLED display motherboard, wherein the OLED display motherboard comprises a substrate and a plurality of display units arrayed and distributed on the substrate; Step S2, preparing a TEG test assembly around the display area and surface edge of each of the display units; wherein the TEG test assembly includes a test light-emitting area and a test terminal electrically connected to the light-emitting device in the test light-emitting area, the test light-emitting area is a 50×50 light-emitting device array, the test terminal is electrically connected to the light-emitting device array, the test terminal includes an anode terminal and a cathode terminal, the anode terminal and the cathode terminal are both larger than 3mm×3mm, the electrode area is designed in the area directly below the mask screen of the evaporation section during the production process of the OLED display motherboard, and the anode terminal and the cathode terminal are smaller than the metal strip width of the mask screen.

9. The method for preparing an OLED display motherboard according to claim 8, characterized in that: Step S2 specifically includes: Step S21, selecting a portion of the display pixel area at the edge of the display unit as a test light-emitting area, and preparing an anode terminal and a cathode terminal in a non-display area adjacent to the test light-emitting area; Step S22, preparing a metal signal line between the light-emitting device in the test light-emitting area and the anode terminal, wherein the metal signal line is covered with a pixel definition layer or a planarization layer; Step S23, using a signal generating device to input a positive voltage signal and a negative voltage signal to the anode terminal and the cathode terminal respectively, so as to test whether the light-emitting device in the test light-emitting area emits light normally.

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